A diamond grinding and polishing processing device and processing method

Abstract

The present invention discloses a diamond grinding and polishing processing device and a processing method, belonging to the technical field of grinding and polishing production. It includes a corresponding upper clamping disc and a polishing disc, as well as a humidity control module connected and communicated between the upper clamping disc and the polishing disc; wherein, a hydraulic lifting device is provided at the top of the upper clamping disc, and the hydraulic lifting device is controlled by a single-chip microcomputer system to drive the upper clamping disc to be liftable; the polishing disc is a transparent polishing disc made of nano-polycrystalline diamond material, and the polishing disc is fixed on the base of a polishing machine provided with a power device; the humidity control module sprays gas during the diamond grinding process through the ventilation holes provided around the upper clamping disc with nitrogen mixed with humidity to change the humidity environment of the grinding processing interface. This device is simple and highly flexible. It can change the surface or point to be ground by rotating the steel ball carrying the diamond, with a high degree of freedom. The bonding method does not damage the diamond, and the grinding points can be flexibly bonded and selected, improving the practicability and repeatability.

Description

Technical Field

[0001] The present invention relates to the technical field of industrial grinding and polishing production, and particularly relates to a diamond grinding and polishing processing device and a processing method. Background Art

[0002] The diamond grinding and polishing technology has been developed for centuries. The most common method is to use a cast iron grinding disc in combination with lubricating oil (polishing agent) and diamond powder for grinding and polishing.

[0003] With the development of the material science synthesis technology, it has been possible to artificially synthesize a material harder than diamond, namely nanocrystalline diamond. And with the exploration of the processing and application of diamond-like materials, it is found that diamond is sensitive to the humidity environment atmosphere, especially during the friction process, and it is impossible to directly observe the polishing situation. However, by using a high-quality and transparent polishing disc, the polishing quality of the diamond crystal plane can be observed.

[0004] At present, the methods and equipment for grinding and polishing diamond are inefficient and unstable. At the same time, in the current chemical polishing, chemical polishing agents and the like are used, and there are defects in the chemical components such as phosphoric acid, nitric acid, acetic acid and other components that are not friendly to the environment.

[0005] In view of the above-mentioned existing technical situation, it is necessary to develop an efficient diamond grinding and polishing device and process. Summary of the Invention

[0006] Therefore, the present invention provides a diamond grinding and polishing processing device and a processing method to solve the diamond grinding and polishing problems mentioned in the above background art.

[0007] In order to achieve the above object, the present invention provides the following technical solutions:

[0008] A diamond grinding and polishing processing device includes a corresponding upper clamping disc and a polishing disc, and a humidity control module communicated between the upper clamping disc and the polishing disc; wherein,

[0009] A hydraulic lifting device is provided at the top of the upper clamping disc, and the hydraulic lifting device is controlled by a single-chip microcomputer system to drive the upper clamping disc to be liftable;

[0010] The polishing disc is a transparent polishing disc made of nanocrystalline diamond material, and the polishing disc is fixed on the polishing machine base provided with a power device;

[0011] The humidity control module sprays gas through the vent holes provided around the upper clamping disc with nitrogen mixed with humidity during the diamond grinding process to change the humidity environment of the grinding processing interface.

[0012] On the basis of the above solution, the present invention can also be improved as follows:

[0013] Further, the polishing disc is a transparent diamond grinding disc directly synthesized from onion carbon nanoparticles (with a diameter of 20 - 50 nm) under the environment of 18 - 25 GPa and 1850 - 2000 °C;

[0014] And a round hole fixed to the power rod of the power device is provided in the middle of the polishing disc.

[0015] Further, a downloading sample stage is fixed to the bottom end of the polishing disc. A straight groove is provided in the circular base of the downloading sample stage, and a hole is provided in the center of the straight groove. The power rod passes through the hole from the circular base and is matched with the polishing disc;

[0016] In-situ micro-cameras are respectively arranged at both ends of the straight groove.

[0017] Further, hemispherical grooves are provided on the upper clamping disc, and six vent holes through which humidity-containing gas can pass are respectively and evenly provided around each hemispherical groove.

[0018] Further, the diamond carrier corresponding to the upper clamping disc is a steel ball. The steel ball is polished to form a flat circular surface on the surface. The diamond to be polished is fixed through the flat circular surface. The end face of the diamond structure axisymmetric to the crystal plane of the diamond to be polished is selected, and the other end face of the diamond is bonded to the flat circular surface ground on the steel ball with glue, and other adhesives are used to perform wrapped bonding around the diamond (except for the crystal plane to be processed). The steel ball is fixed in the hemispherical groove of the upper clamping disc by electromagnetic adsorption method.

[0019] Further, the humidity control module includes a nitrogen gas tank and a cavity for deionized water;

[0020] The dry nitrogen gas transmitted by the nitrogen gas tank is introduced into the cavity with deionized water to form humidity gas.

[0021] Further, the humidity control module further includes a humidity mixing chamber;

[0022] Humidity control is achieved by introducing dry nitrogen gas into the cavity with deionized water and then into the humidity mixing chamber and directly into the humidity mixing chamber. The two gas streams are mixed in the humidity mixing chamber, and the humidity is displayed on the hygrometer and humidity display in the humidity mixing chamber. When the required humidity is reached, the gas is introduced into the intake pipe connected to the vent hole, and the gas is ejected from the vent hole to change the humidity at the polishing processing interface, thereby affecting the polishing interface grinding environment.

[0023] A processing method for a diamond grinding and polishing processing device specifically includes the following steps:

[0024] Wrap and bond the diamond to be polished as required, and install it on the corresponding plane of the steel ball;

[0025] Adjust the positions of the grinding upper clamping chuck, polishing disc and downloading sample stage;

[0026] Adjust the humidity between the diamond to be ground and the polishing disc to control the grinding and polishing quality;

[0027] Through humidity control, utilize the different humidity sensitivities of the diamond polishing disc to control the hydrolysis reaction of the grinding interface, thereby achieving the control of the grinding quality of the diamond.

[0028] The present invention has the following advantages:

[0029] 1. The device is simple and highly flexible. The surface or point to be ground can be changed by rotating the steel ball carrying the diamond, with a high degree of freedom. The bonding method does not damage the diamond, and the grinding points can be flexibly bonded and selected, improving the practicability and repeatability.

[0030] 2. Control the hydraulic lifting and the applied pressure through the single-chip microcomputer to ensure the stability of the device operation and improve the usability.

[0031] 3. Replace the polishing liquid with humidity, greatly reducing the impact on the environment, and achieving high-efficiency polishing through scientific theory, improving the scientific theory and the utilization rate of chemical polishing.

[0032] 4. Use a new nano-polycrystalline diamond sheet as the polishing disc, improving the utilization rate of the grinding and polishing disc and the grinding efficiency, and ensuring the grinding quality of higher-grade diamonds. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. The structures, ratios, sizes, etc. shown in this specification are only used to cooperate with the content disclosed in the specification for those familiar with this technology to understand and read. Any modification of the structure, change in the ratio relationship or adjustment of the size, without affecting the effects that the present invention can produce and the purposes that can be achieved, should still fall within the scope that can be covered by the technical content disclosed in the present invention.

[0034] Figure 1 It is a schematic diagram of the overall structure of the embodiment of the present invention;

[0035] Figure 2 It is a schematic diagram of the bonding state of the diamond in the embodiment of the present invention;

[0036] Figure 3 It is a schematic diagram of the position structure of the in-situ microscope camera in the embodiment of the present invention;

[0037] Figure 4-1 It is one of the schematic diagrams of the structure of the upper clamping chuck in the embodiment of the present invention;

[0038] Figure 4-2 It is the second structural schematic diagram of the upper clamping chuck in the embodiment of the present invention;

[0039] Figure 5 It is the layout structural schematic diagram of the humidity mixing chamber in the embodiment of the present invention;

[0040] Figure 6 It is the structural schematic diagram of the humidity vent hole in the embodiment of the present invention.

[0041] In the attached drawings, the list of components represented by each reference numeral is as follows:

[0042] 1 - upper clamping chuck, 2 - lower sample stage, 3 - hydraulic lifting device, 4 - intake pipe, 5 - lower object stage, 6 - tachometer, 7 - hydraulic lifting meter, 8 - power button, 9 - glass cover, 10 - fastening screw hole, 11 - in-situ microscopic camera, 12 - vent hole, 13 - hemispherical groove, 14 - nitrogen tank, 15 - cavity with deionized water, 16 - hygrometer and humidity display. Specific embodiments

[0043] The following specific embodiments illustrate the implementation manners of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present invention.

[0044] As Figure 1-6 shown, the embodiment of the present invention provides a diamond grinding and polishing processing device, including an upper clamping chuck 1, a lower sample stage 2, a polishing disc, and a humidity control module. Among them, the upper clamping chuck 1 is controlled to rise and fall by a single-chip microcomputer device; the polishing disc is a transparent polishing disc made of nano-polycrystalline diamond material, and the circular hole in the center of the polishing disc is fixed on the polishing machine base with a power device; the humidity control module is to spray gas through the vent holes 12 around the upper clamping chuck 1 with nitrogen mixed with humidity during the diamond grinding process to change the humidity environment of the grinding processing interface. The vent holes 12 are used to spray nitrogen containing humidity, thereby changing the physical and chemical effects of the friction interface. The specific settings are as follows:

[0045] The polishing disc is a transparent diamond grinding disc directly synthesized from onion carbon nanoparticles (diameter 20 - 50 nm) under the environment of 18 - 25 GPa and 1850 - 2000 °C, and the polishing disc is fixedly connected to the power rod of the lower object stage 5 through the circular hole in the middle by a pin connection with the power shaft.

[0046] Specifically, the polishing disc is fixedly arranged on the downloading sample stage 2. A straight groove passing through the center of the circle is formed in the circular base of the downloading sample stage 2. The power shaft is at the center of the circular base. One in-situ microscope camera 11 is placed at each end of the straight groove. When the polishing disc is grinding and processing, the in-situ microscope camera 11 can directly observe the grinding and processing condition of the diamond surface through the transparent polishing disc.

[0047] Reference Figure 4-1 , 2 , a number of hemispherical grooves 13 are formed in the upper clamping disc 1, and six air vents 12 through which humidity-containing gas can pass are evenly formed around each hemispherical groove 13.

[0048] The diamond carrier corresponding to the upper clamping disc 1 is a steel ball. The steel ball is polished to form a circular plane on the surface that is larger than the size of the diamond crystal plane to be polished. The diamond to be polished is fixed through the plane circle. The other end surface of the diamond crystal plane to be polished, which is axisymmetric to the diamond structure, is selected. In the first step, the other end surface of the diamond is bonded to the circular plane ground on the steel ball with glue. In the second step, other adhesives are used to fix and bond the periphery of the diamond (except the crystal plane to be processed) again. Finally, the bottom of the steel ball is fixed in the hemispherical groove 13 by means of electromagnetic adsorption through the hemispherical groove 13 on the upper clamping disc 1.

[0049] A hydraulic lifting device 3 is arranged at the top of the upper clamping disc 1. The hydraulic lifting device 3 is controlled by a single-chip microcomputer system to enable the upper clamping disc 1 to lift, so as to realize the loading and unloading of the grinding sample through lifting, and improve the contact quality between the diamond surface on the upper clamping disc 1 and the polishing disc.

[0050] The humidity control module includes a nitrogen gas tank 14, a cavity 15 of deionized water and a humidity mixing chamber. The humidity gas is formed by the dry nitrogen gas transmitted from the nitrogen gas tank 14 passing through the cavity 15 containing deionized water. Humidity control is achieved by the dry nitrogen gas passing through the cavity 15 containing deionized water and entering the humidity mixing chamber and directly entering the humidity mixing chamber. The two gas streams are mixed in the humidity mixing chamber. The humidity is displayed on the hygrometer and humidity display 16 in the humidity mixing chamber. When the required humidity is reached, the gas is introduced into the air inlet pipe 4 connected to the air vents 12. The gas is ejected from the air vents 12 to change the humidity at the grinding and processing interface and affect the grinding environment of the polishing interface. Since the diamond material is sensitive to the humidity atmosphere environment, different amounts of water molecules will form carbon-hydrogen bonds of different qualities on the diamond surface. Therefore, this characteristic can be utilized in grinding and polishing to perform a chemical sensitivity to the grinding process. Different humidity values result in different wear amounts and surface qualities of the ground diamond. Thus, the grinding and polishing quality is controlled by controlling the humidity between the diamond and the grinding disc.

[0051] To avoid the influence of external gas flow during the grinding process, a glass cover 9 is provided around the grinding and polishing equipment (the upper clamping disk 1 and the polishing disk).

[0052] On the polishing machine base, there are also respectively provided a tachometer 6 connected to the power device and a hydraulic lift gauge 7 connected to the hydraulic lift device 3, so as to more intuitively observe the rotation speed of the polishing disk through the tachometer 6 and more intuitively observe the lifting situation of the upper clamping disk 1 through the hydraulic lift gauge 7.

[0053] On the polishing machine base, there is also provided a power button 8 electrically connected to the power supply.

[0054] On the upper clamping disk 1, there are also provided fastening screw holes 10 that cooperate with external bolts for stably installing the upper clamping disk 1 at the output end of the hydraulic lift device 3.

[0055] A processing method for a diamond grinding and polishing processing device specifically includes the following steps:

[0056] Wrap and bond the diamond to be ground as required and install it on the corresponding plane of the steel ball;

[0057] Adjust the positions of the grinding upper clamping disk, the polishing disk and the downloading sample table;

[0058] Adjust the humidity between the diamond to be ground and the polishing disk to control the grinding and polishing quality; through humidity control, utilize the different humidity sensitivities of the diamond polishing disk to control the hydrolysis reaction at the grinding interface, thereby realizing the control of the grinding quality of the diamond.

[0059] For those of ordinary skill in the art, according to the teachings of the present invention, without departing from the principles and spirit of the present invention, the changes, modifications, substitutions and variations made to the embodiments still fall within the protection scope of the present invention.

Claims

1. A processing method for a diamond grinding and polishing processing device, which is realized by using a diamond grinding and polishing processing device. The diamond grinding and polishing processing device includes a corresponding upper clamping disc and a polishing disc, and a humidity control module communicated between the upper clamping disc and the polishing disc. Among them, A hydraulic lifting device is provided at the top of the upper clamping disc, and the hydraulic lifting device is controlled by a single-chip microcomputer system to drive the upper clamping disc to be liftable. The polishing disc is a transparent polishing disc made of nano-polycrystalline diamond material, and the polishing disc is fixed on the base of a polishing machine provided with a power device. The humidity control module sprays gas during the diamond grinding process through the ventilation holes provided around the upper clamping disc with nitrogen mixed with humidity to change the humidity environment of the grinding processing interface. The diamond carrier corresponding to the upper clamping disc is a steel ball. The steel ball is polished to form a circular plane on the surface. The diamond to be polished is fixed through the circular plane. Select the end face of the diamond crystal plane that is axisymmetric with the diamond structure, and bond the other end face of the diamond to the circular plane ground on the steel ball with glue, and use other adhesives to wrap and bond the non-processing crystal plane of the diamond. The steel ball is fixed in the hemispherical groove of the upper clamping disc by electromagnetic adsorption method. The processing method of the diamond grinding and polishing processing device is characterized in that it specifically includes the following steps: Wrap and bond the diamond to be ground as required and install it on the corresponding plane of the steel ball. Adjust the positions of the grinding upper clamping disc, the polishing disc and the downloading sample table. Adjust the humidity between the diamond to be ground and the polishing disc to control the grinding and polishing quality. Through humidity control, utilize the different humidity sensitivities of the diamond polishing disc to control the hydrolysis reaction of the grinding interface, so as to realize the control of the grinding quality of the diamond.

2. The processing method of a diamond grinding and polishing processing device according to claim 1, characterized in that, The polishing disc is a transparent diamond grinding disc directly synthesized from onion carbon nanoparticles with a diameter of 20 - 50 nm under the environment of 18 - 25 GPa and 1850 - 2000 °C. And a round hole fixed to the power rod of the power device is provided in the middle of the polishing disc.

3. The processing method of a diamond grinding and polishing processing device according to claim 2, characterized in that, A downloading sample table is fixed at the bottom of the polishing disc. A straight groove is provided in the circular base of the downloading sample table, and a hole is provided in the center of the straight groove. The power rod passes through the hole from the circular base and is matched with the polishing disc. In-situ micro-cameras are respectively provided at both ends of the straight groove.

4. The processing method of a diamond grinding and polishing processing device according to claim 1, characterized in that, Hemispherical grooves are provided on the upper clamping disc, and six ventilation holes for introducing humidity-containing gas are respectively and evenly provided around each hemispherical groove.

5. The processing method of a diamond grinding and polishing processing device according to claim 1, characterized in that, The humidity control module includes a nitrogen gas tank and a cavity for deionized water. The dry nitrogen gas transmitted by the nitrogen gas tank is introduced into the cavity with deionized water to form humidity gas.

6. The processing method of a diamond grinding and polishing processing device according to claim 1, characterized in that, The humidity control module further includes a humidity mixing chamber. Humidity control is achieved by introducing dry nitrogen gas into the cavity with deionized water and directly into the humidity mixing chamber respectively. The two gas streams are mixed in the humidity mixing chamber, and the humidity is displayed on the hygrometer and humidity display in the humidity mixing chamber. When the required humidity is reached, it is introduced into the intake pipe communicated with the ventilation holes, and the gas is ejected from the ventilation holes to change the humidity at the grinding processing interface and affect the grinding environment of the polishing interface.

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