Silicon wafer assembly mechanism

Abstract

The present invention provides a silicon wafer aligning mechanism, which comprises a silicon wafer loading device for stacking silicon wafers, a conveying device for transporting the silicon wafer loading device along the X direction, a pair of X-direction positioning devices for aligning silicon wafers from the X direction, and a pair of Y-direction positioning devices for aligning silicon wafers from the Y direction. The conveying device has an aligning station. When the silicon wafer loading device is conveyed to the aligning station, the pair of X-direction positioning devices align the silicon wafers from the front and back sides respectively, and the pair of Y-direction positioning devices align the silicon wafers from the left and right sides respectively. The mechanism has two sets of X-direction positioning devices and two Y-direction positioning devices, and can align silicon wafers from four directions. The aligning step is a step before sintering the silicon wafers. After aligning the stacked silicon wafers, it can prevent the silicon wafers from being sintered unevenly, which affects the photoelectric conversion efficiency of the silicon wafers.

Description

Technical Field

[0001] The invention relates to the field of silicon wafer processing, and in particular to a silicon wafer assembly mechanism. Background Art

[0002] Silicon wafers are the carriers of solar cells. The quality of silicon wafers directly determines the conversion efficiency of solar cells. Solar cells require a large area of ​​PN junction to realize the conversion of light energy to electrical energy, and the diffusion furnace is a special equipment for manufacturing PN junctions of solar cells. The tubular diffusion furnace is mainly composed of four parts: the upper and lower parts of the quartz boat, the exhaust chamber, the furnace body and the gas cabinet. Diffusion generally uses a liquid source of phosphorus oxychloride as a diffusion source. Put the P-type silicon wafer in the quartz container of the tubular diffusion furnace, use nitrogen to bring phosphorus oxychloride into the quartz container at a high temperature of 850-900 degrees Celsius, and react with phosphorus oxychloride and silicon wafers to obtain phosphorus atoms. After a certain period of time, phosphorus atoms enter the surface layer of the silicon wafer from all sides, and penetrate and diffuse into the silicon wafer through the gaps between silicon atoms, forming the interface between N-type semiconductor and P-type semiconductor, that is, PN junction.

[0003] In the prior art, in the entire production process of solar cells, diffusion, coating and sintering are the three most important processes. Usually silicon wafers are stacked in a jig and placed in a sintering furnace for sintering. If the silicon wafers are not stacked neatly, the sintering effect will be affected, thereby affecting the quality of the silicon wafers. Summary of the invention

[0004] The technical problem to be solved by the present invention is to provide a silicon wafer assembly mechanism.

[0005] In order to solve the above technical problems, the present invention provides a silicon wafer whole-piece mechanism, which includes a silicon wafer loading device for stacking silicon wafers, a conveying device for transporting the silicon wafer loading device along the X direction, a pair of X-direction positioning devices for whole-piece silicon wafers from the X direction, and a pair of Y-direction positioning devices for whole-piece silicon wafers from the Y direction. The conveying device is provided with a whole-piece station. When the silicon wafer loading device is conveyed to the whole-piece station, the pair of X-direction positioning devices respectively whole-piece silicon wafers from the front and back sides, and the pair of Y-direction positioning devices respectively whole-piece silicon wafers from the left and right sides.

[0006] Preferably, the silicon wafer assembly mechanism further comprises a pair of base positioning devices capable of positioning the silicon wafer loading device on the wafer assembly station.

[0007] Preferably, the X-axis positioning device is installed on the upper side of the conveying device, and the X-axis positioning device includes a first fixed plate fixed on the frame, a first cylinder installed on the first fixed plate, a second cylinder driven by the first cylinder along the Z direction, and a first push plate driven by the second cylinder along the X direction. The first push plates of the two X-axis positioning devices respectively move the silicon wafer from the front and back sides.

[0008] Preferably, the pair of Y-direction positioning devices are respectively a first Y-direction positioning device and a second Y-direction positioning device, which are respectively installed on the left and right sides of the whole-wafer workstation; the first Y-direction positioning device includes a second fixed seat fixedly installed on the conveying device, a second mounting frame installed on the second fixed seat, a fifth cylinder installed on the second mounting frame, and a third push plate driven by the fifth cylinder along the Y direction; the second Y-direction positioning device includes a first fixed seat installed on the conveying device, a first mounting frame installed on the first fixed seat, the first mounting frame includes an upper mounting plate and a lower mounting plate, a fourth cylinder is installed on the upper mounting plate, and a third cylinder is installed on the lower mounting plate; the second Y-direction positioning device also includes a second push plate driven by the fourth cylinder along the Y direction; the second push plate and the third push plate can respectively whole-wafer the silicon wafer from the left and right sides.

[0009] Preferably, the second Y-direction positioning device further comprises a first limit block driven by the third cylinder along the Y-direction.

[0010] Preferably, the silicon wafer loading device comprises a base, a carrier plate mounted on the base for stacking silicon wafers, and a plurality of fences arranged around the carrier plate and fixed on the base.

[0011] Preferably, the conveying device includes two side panels arranged in the left-right direction, and the side panels are respectively installed with synchronously moving conveyor belts. The tops of the side panels are respectively installed with top panels, and the height of the top panels is greater than the height of the conveyor belts. When the silicon wafer loading device is transported on the conveyor belt, the base is located between the two top panels, and the first fixed seat of the first Y-axis positioning device and the second fixed seat of the second Y-axis positioning device are respectively installed on the outer walls of the two side panels.

[0012] Preferably, the pair of base positioning devices are respectively a first base positioning device and a second base positioning device, the first base positioning device includes a third fixed seat installed on the conveying device, a sixth cylinder installed on the third fixed seat, a seventh cylinder driven by the sixth cylinder along the Y direction, and a first base blocking member that can be lifted and lowered under the drive of the seventh cylinder; the second base positioning device includes a fourth fixed seat installed on the conveying device, an eighth cylinder installed on the fourth fixed seat, and a second base blocking member that can be lifted and lowered under the drive of the eighth cylinder.

[0013] Preferably, a first bottom plate and a second bottom plate are installed between the bottoms of the two side plates of the conveying device along the front-to-back direction, the first base positioning device is installed on the second bottom plate, and the second base positioning device is installed on the first bottom plate, and a support plate is installed on the inner sides of the two side plates respectively, and the support plate is arranged on the lower side of the upper belt surface of the conveyor belt, for supporting the upper belt surface of the conveyor belt, and a fixing bar arranged along the front-to-back direction is also installed on the inner side of one of the side plates of the conveying device, and a first sensor and a second sensor are respectively arranged on the fixing bar along the front-to-back direction, and the first sensor and the second sensor are used to detect the position of the silicon wafer loading device, and when the silicon wafer loading device is transferred to the whole wafer workstation, the conveyor belt is controlled to stop working.

[0014] The silicon wafer assembly mechanism of the present invention has the following beneficial effects:

[0015] 1. The mechanism has two sets of X-axis positioning devices and two Y-axis positioning devices, which can be used to straighten the silicon wafers from four directions. The straightening step is the step before sintering the silicon wafers. After straightening the stacked silicon wafers, it can prevent uneven sintering of the silicon wafers and affect the photoelectric conversion efficiency of the silicon wafers.

[0016] 2. The mechanism has a pair of base positioning devices and a first limit block controlled by a third cylinder, which positions the silicon wafer loading device from the front and back directions and the left and right directions respectively. This process can make the position of the entire wafer station more accurate, thereby making the entire wafer process more precise.

[0017] 3. The second Y-axis positioning device of the present application is equipped with a first limit block, which cooperates with the top plate on the opposite side to limit the silicon wafer loading device from the left and right sides. Since the position of the top plate in the left and right directions remains unchanged, the silicon wafer loading device can be accurately positioned in the left and right directions by being pushed by the first limit block. The silicon wafer whole-piece mechanism of the present application, through the design of the height difference between the side plate, the top plate and the positioning device, only uses the positioning device on one side to complete the left and right direction positioning.

[0018] 4. The first cylinder is installed on the X-axis positioning device to control the up and down movement of the first push plate, which can avoid the silicon wafer loading device in transit. When the wafer needs to be whole, the first push plate is controlled to move downward to whole the silicon wafer from the front and back directions.

[0019] 5. The first base positioning device and the second base positioning device of the present application are respectively provided with a first base stopper and a second base stopper, which can move up and down under the drive of the cylinder, and can avoid the silicon wafer loading device in transit, and the first base stopper is driven by the sixth cylinder to further position the silicon wafer loading device. Among them, the position of the second base stopper in the X direction remains unchanged, so the silicon wafer loading device can be accurately positioned in the front and rear directions after being pushed by the first base stopper.

[0020] 6. Each edge of the carrier in the present application has two recessed areas. When the silicon wafer is placed on the carrier, the edge of the silicon wafer is located in the recessed area. Each edge of the silicon wafer is flattened by two blocking bars, which are inserted into the corresponding recessed areas to flatten the silicon wafer, thereby preventing the silicon wafer from twisting during the flattening process, and achieving a better flattening effect. In addition, since the edge of the silicon wafer is located within the edge of the carrier, the silicon wafer can be prevented from being offset due to collision during transportation. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a three-dimensional structural schematic diagram of the silicon wafer assembly mechanism of the present application;

[0022] Figure 2 It is a three-dimensional structural schematic diagram of the silicon wafer assembly mechanism of the present application;

[0023] Figure 3 It is a structural schematic diagram of the X-axis positioning device of the present application;

[0024] Figure 4 It is a structural schematic diagram of the second Y-axis positioning device of the present application;

[0025] Figure 5 It is a schematic structural diagram of the first Y-axis positioning device of the present application;

[0026] Figure 6 is a structural schematic diagram of the first base positioning device of the present application;

[0027] Figure 7 is a structural schematic diagram of the second base positioning device of the present application;

[0028] Figure 8 It is a structural schematic diagram of the silicon wafer loading device of the present application;

[0029] Fig. 9 It is a schematic diagram of the structure of the conveying device of the present application;

[0030] Fig.10 It is a schematic diagram of the top view of the silicon wafer assembly mechanism of the present application.

[0031] Wherein: 1. conveying device; 2. silicon wafer loading device; 31. first Y-direction positioning device; 32. second Y-direction positioning device; 4. X-direction positioning device; 5. first base positioning device; 6. second base positioning device;

[0032] 11. Top plate; 12. Side plate; 13. Conveyor belt; 14. Support plate; 15. First bottom plate; 16. Second bottom plate; 17. Fixing bar; 18. First sensor; 19. Second sensor;

[0033] 21. Base; 22. Carrier plate; 23. Fence; 221. Recessed area.

[0034] 311, second mounting frame; 313, fifth cylinder; 314, third push plate; 3141, third stop bar; 315, second fixing seat;

[0035] 321, first mounting frame; 322, third cylinder; 323, fourth cylinder; 324, second push plate; 325, first fixing seat; 326, first limiting block; 3241, second stop bar;

[0036] 41. first fixed plate; 42. first cylinder; 43. second cylinder; 44. first push plate; 441. first stop bar;

[0037] 51. third fixing seat; 52. sixth cylinder; 53. seventh cylinder; 54. first base stopper;

[0038] 61. Fourth fixing seat; 62. Eighth cylinder; 63. Second base blocking member. DETAILED DESCRIPTION

[0039] The present invention is further described below in conjunction with the accompanying drawings and specific embodiments so that those skilled in the art can better understand the present invention and implement it, but the embodiments are not intended to limit the present invention.

[0040] like Figure 1 and 2 As shown, the silicon wafer unifying mechanism of the present application includes a silicon wafer loading device 2 for stacking silicon wafers, a conveying device 1 for transporting the silicon wafer loading device 2 along the X direction, a pair of X-direction positioning devices 4 for unifying the silicon wafer from the X direction, and a pair of Y-direction positioning devices for unifying the silicon wafer from the Y direction.

[0041] The conveying device 1 has a wafer-forming station. When the silicon wafer loading device 2 is conveyed to the wafer-forming station, the pair of X-direction positioning devices 4 respectively form the silicon wafer from the front and back sides, and the pair of Y-direction positioning devices respectively form the silicon wafer from the left and right sides.

[0042] The silicon wafer assembly mechanism further comprises a pair of base positioning devices capable of positioning the silicon wafer loading device 2 on the wafer assembly station.

[0043] like Figure 3 As shown, the X-direction positioning device 4 is installed on the upper side of the conveying device 1, and the X-direction positioning device 4 includes a first fixing plate 41 fixed on the frame, a first cylinder 42 installed on the first fixing plate 41, a second cylinder 43 driven along the Z direction by the first cylinder 42, and a first push plate 44 driven along the X direction by the second cylinder 43. The first push plates 44 of the two X-direction positioning devices 4 respectively carry out whole wafers from the front and back sides.

[0044] The pair of Y-axis positioning devices are a first Y-axis positioning device 31 and a second Y-axis positioning device 32, which are respectively installed on the left and right sides of the whole workstation.

[0045] like Figure 5 As shown, the first Y-direction positioning device 31 includes a second fixed seat 315 fixedly mounted on the conveying device 1, a second mounting frame 311 mounted on the second fixed seat 315, a fifth cylinder 313 mounted on the second mounting frame 311, and a third push plate 314 driven by the fifth cylinder 313 along the Y-direction.

[0046] like Figure 4 As shown, the second Y-direction positioning device 32 includes a first fixed seat 325 installed on the conveying device 1, a first mounting frame 321 installed on the first fixed seat 325, and the first mounting frame 321 includes an upper mounting plate and a lower mounting plate. The upper mounting plate is mounted with a fourth cylinder 323, and the lower mounting plate is mounted with a third cylinder 322. The second Y-direction positioning device 32 also includes a second push plate 324 driven along the Y direction by the fourth cylinder 323 and a first limit block 326 driven along the Y direction by the third cylinder 322. The second push plate 324 and the third push plate 314 respectively carry out whole wafers from the left and right sides.

[0047] like Figure 8 As shown, the silicon wafer loading device 2 of the present application includes a base 21, a carrier 22 installed on the base 21 for stacking silicon wafers, and a plurality of fences 23 arranged around the carrier 22 and fixed on the base 21, wherein the fences 23 are used to prevent the silicon wafers from falling from the carrier 22.

[0048] The conveyor device 1 comprises two side panels 12 arranged in a left-right direction, and synchronously moving conveyor belts 13 are respectively installed on the side panels 12. Top panels 11 are respectively installed on the tops of the side panels 12, and the height of the top panels 11 is greater than the height of the conveyor belt 13. When the wafer loading device 2 is transported on the conveyor belt 13, the base 21 is located between the two top panels 11. The first fixing seat 325 of the first Y-direction positioning device 31 and the second fixing seat 315 of the second Y-direction positioning device 32 are respectively installed on the outer walls of the two side panels 12.

[0049] The pair of base positioning devices are respectively a first base positioning device 5 and a second base positioning device 6 .

[0050] like Figure 6 As shown, the first base positioning device 5 includes a third fixed seat 51 installed on the conveying device 1, a sixth cylinder 52 installed on the third fixed seat 51, a seventh cylinder 53 driven by the sixth cylinder 52 along the Y direction, and a first base blocking member 54 that can be raised and lowered under the drive of the seventh cylinder 53.

[0051] like Figure 7 As shown, the second base positioning device 6 includes a fourth fixed seat 61 installed on the conveying device 1, an eighth cylinder 62 installed on the fourth fixed seat 61, and a second base blocking member 63 that can be raised and lowered under the drive of the eighth cylinder 62.

[0052] The working process of the silicon wafer assembly mechanism of this application is as follows:

[0053] (i) Positioning of the silicon wafer loading device 2 in the X direction: When the silicon wafer loading device 2 moves on the conveyor belt 13, the first base blocking portion of the first base positioning device 5 and the second base blocking portion of the second base positioning device 6 are located at the lower side of the conveyor belt 13. When the silicon wafer loading device 2 is conveyed to the whole wafer workstation by the conveying device 1, the conveyor belt 13 stops transmitting, and the seventh cylinder 53 of the first base positioning device 5 located on the front side of the silicon wafer loading device 2 drives the first base stopper 54 to rise, and the eighth cylinder of the second base positioning device 6 located on the rear side of the silicon wafer loading device 2 drives the second base stopper 63 to rise until the base of the silicon wafer loading device 2 is between the first base stopper 54 and the second base stopper 63, and then, the sixth cylinder 52 drives the seventh cylinder 53 to move toward the silicon wafer loading device 2 along the X direction, so that the first base stopper 54 pushes the base of the silicon wafer loading device 2 until the base of the silicon wafer loading device 2 touches the second base stopper 63, at which time, the silicon wafer loading device 2 is limited between the first base stopper 54 and the second base stopper 63 in the X direction.

[0054] (ii) Positioning of the silicon wafer loading device 2 in the Y direction: the third cylinder 322 of the second Y-direction positioning device 32 drives the first limit block 326 to move along the Y direction, so that the first limit block 326 pushes the base of the silicon wafer loading device 2 until the other side of the base of the silicon wafer loading device 2 touches the top plate 11. At this time, the silicon wafer loading device 2 is limited in the Y direction between the first limit block 326 and the top plate 11.

[0055] (III) Whole wafer in X direction: When the wafer loading device 2 moves on the conveyor belt 13, the first push plate 44 of the X direction positioning device 4 is located on the upper side of the wafer loading device 2, and the wafer loading device 2 can pass through the lower part of the X direction positioning device 4. After the wafer loading device 2 is transferred to the whole wafer station, a pair of X direction positioning devices 4 are respectively located at the front and rear sides of the wafer loading device 2. After the wafer loading device 2 completes the positioning in X direction and Y direction, the first cylinder 42 controls the second cylinder 43 to move downward until the wafer loading device 2 is located between the two first push plates 44. The second cylinder 43 controls the first push plate 44 to move relatively along the X direction, and the whole wafer in X direction is completed.

[0056] (IV) Whole-piece silicon wafer in Y direction: The fifth cylinder 313 of the first Y-direction positioning device 31 and the fourth cylinder 323 of the second Y-direction positioning device 32 respectively drive the third push plate 314 and the second push plate 324 to move toward each other along the Y direction, thereby completing the whole-piece silicon wafer in Y direction.

[0057] (V) The wafer loading device 2 is moved to the next workstation after the wafer is fully completed: (1) The fifth cylinder 313 of the first Y-axis positioning device 31 and the fourth cylinder 323 of the second Y-axis positioning device 32 respectively drive the third push plate 314 and the second push plate 324 to withdraw to their original positions along the Y-axis, and the third cylinder 322 of the second Y-axis positioning device 32 controls the first limit block 326 to withdraw to its original position; (2) The second cylinder 43 of the X-axis positioning device 4 drives the first push plate 44 to withdraw to its original position, and the first cylinder 42 drives the second cylinder 43 to rise to the upper side of the wafer loading device 2; (3) The sixth cylinder 52 of the first base positioning device 5 drives the seventh cylinder 53 to return to its original position, and the seventh cylinder 53 of the first base positioning device 5 and the eighth cylinder 62 of the second base positioning device 6 respectively drive the first base stopper 54 and the second base stopper 63 to descend to the lower side of the wafer loading device 2, and the conveyor belt 13 is restarted to move the wafer loading device 2 to the next workstation.

[0058] In a preferred embodiment, the carrier 22 is a rectangular structure, and each edge of the carrier 22 has two recessed areas 221. When the silicon wafer is placed on the carrier 22, the edge of the silicon wafer is located in the recessed area 221. The first push plate 44 of the X-axis positioning device 4 is provided with two first baffles 441 extending in the vertical direction and parallel to each other, the third push plate 314 of the first Y-axis positioning device 31 is provided with two third baffles extending in the vertical direction and parallel to each other, and the second push plate 324 of the second Y-axis positioning device 32 is provided with two second baffles 3241 extending in the vertical direction and parallel to each other. In step (iii), the first baffles 441 of the two first push plates 44 are respectively inserted into the corresponding recessed areas 221 to flatten the silicon wafer. In step (iv), the second baffles 3241 on the second push plate 324 and the third baffles 3141 on the third push plate 314 are respectively inserted into the corresponding recessed areas 221 to flatten the silicon wafer. Since the edge of the silicon wafer is smaller than the edge of the carrier 22, the silicon wafer can be prevented from deflecting due to collision during transportation. At the same time, each edge of the silicon wafer is straightened by two baffles, which can prevent the silicon wafer from twisting during the straightening process, and the straightening effect is better.

[0059] In another preferred embodiment, a first bottom plate 15 and a second bottom plate 16 are installed between the bottoms of the two side plates 12 of the conveyor 1 along the front-to-back direction, the first base positioning device 5 is installed on the second base plate 16, and the second base positioning device 6 is installed on the first bottom plate 15. A support plate 14 is installed on the inner side of the two side plates 12, respectively. The support plate 14 is arranged on the lower side of the upper belt surface of the conveyor belt 13, and is used to support the upper belt surface of the conveyor belt 13. A fixing bar 17 is also installed on the inner side of one of the side plates 12 of the conveyor 1 along the front-to-back direction, and a first sensor 18 and a second sensor 19 are respectively arranged on the fixing bar 17 along the front-to-back direction. The first sensor 18 and the second sensor 19 are used to detect the position of the silicon wafer loading device 2. When the silicon wafer loading device 2 is transferred to the whole wafer station, the conveyor belt 13 is controlled to stop working.

[0060] In the present application, the X direction is the running direction of the silicon wafer loading device 2 on the conveying device 1, that is, the front-to-back direction; the Y direction in the present application refers to the direction perpendicular to the X direction on the horizontal plane, that is, the left-right direction; the Z direction in the present application refers to the up-down direction.

[0061] The above-described embodiments are only preferred embodiments for fully illustrating the present invention, and the protection scope of the present invention is not limited thereto. Equivalent substitutions or changes made by those skilled in the art based on the present invention are within the protection scope of the present invention. The protection scope of the present invention shall be subject to the claims.

Claims

1. A silicon wafer assembly mechanism, characterized in that: The silicon wafer assembling mechanism comprises a silicon wafer loading device for stacking silicon wafers, a conveying device for transporting the silicon wafer loading device along the X direction, a pair of X-direction positioning devices for assembling the silicon wafer from the X direction, and a pair of Y-direction positioning devices for assembling the silicon wafer from the Y direction. The conveying device has an assembly station. When the silicon wafer loading device is conveyed to the assembly station, the pair of X-direction positioning devices assemble the silicon wafer from the front and back sides respectively, and the pair of Y-direction positioning devices assemble the silicon wafer from the left and right sides respectively. The X-direction positioning device is installed on the upper side of the conveying device, and the X-direction positioning device includes a first fixing plate fixed on the frame, a first cylinder installed on the first fixing plate, a second cylinder driven by the first cylinder along the Z direction, and a first push plate driven by the second cylinder along the X direction. The first push plates of the two X-direction positioning devices respectively carry out whole wafers from the front and rear sides; The pair of Y-direction positioning devices are respectively a first Y-direction positioning device and a second Y-direction positioning device, which are respectively installed on the left and right sides of the whole-wafer workstation, the first Y-direction positioning device comprises a second fixed seat fixedly installed on the conveying device, a second mounting frame installed on the second fixed seat, a fifth cylinder installed on the second mounting frame, and a third push plate driven by the fifth cylinder along the Y direction, the second Y-direction positioning device comprises a first fixed seat installed on the conveying device, a first mounting frame installed on the first fixed seat, the first mounting frame comprises an upper mounting plate and a lower mounting plate, a fourth cylinder is installed on the upper mounting plate, and a third cylinder is installed on the lower mounting plate, the second Y-direction positioning device also comprises a second push plate driven by the fourth cylinder along the Y direction, and the second push plate and the third push plate can respectively carry out whole-wafer operation on the silicon wafer from the left and right sides; The second Y-direction positioning device further comprises a first limit block driven by the third cylinder along the Y direction; The silicon wafer loading device includes a base, a carrier plate mounted on the base for stacking silicon wafers, and a plurality of fences fixed on the base and arranged around the carrier plate; The conveying device includes two side panels arranged in the left and right directions, and the side panels are respectively installed with synchronously moving conveyor belts. The tops of the side panels are respectively installed with top panels, and the height of the top panels is greater than the height of the conveyor belts. When the silicon wafer loading device is transported on the conveyor belt, the base is located between the two top panels, and the first fixed seat of the first Y-direction positioning device and the second fixed seat of the second Y-direction positioning device are respectively installed on the outer walls of the two side panels.

2. The silicon wafer assembly mechanism according to claim 1, characterized in that: The silicon wafer assembly mechanism also includes a pair of base positioning devices capable of positioning the silicon wafer loading device on the wafer assembly station.

3. The silicon wafer assembly mechanism according to claim 2, characterized in that: The pair of base positioning devices are respectively a first base positioning device and a second base positioning device. The first base positioning device includes a third fixed seat installed on the conveying device, a sixth cylinder installed on the third fixed seat, a seventh cylinder driven by the sixth cylinder along the Y direction, and a first base blocking member that can be lifted and lowered under the drive of the seventh cylinder; the second base positioning device includes a fourth fixed seat installed on the conveying device, an eighth cylinder installed on the fourth fixed seat, and a second base blocking member that can be lifted and lowered under the drive of the eighth cylinder.

4. The silicon wafer assembly mechanism according to claim 3, characterized in that: A first bottom plate and a second bottom plate are installed between the bottoms of the two side plates of the conveying device along the front-to-back direction, the first base positioning device is installed on the second bottom plate, and the second base positioning device is installed on the first bottom plate. A support plate is installed on the inner sides of the two side plates respectively, and the support plate is arranged on the lower side of the upper belt surface of the conveyor belt, for supporting the upper belt surface of the conveyor belt. A fixing strip arranged along the front-to-back direction is also installed on the inner side of one of the side plates of the conveying device, and a first sensor and a second sensor are respectively arranged on the fixing strip along the front-to-back direction, and the first sensor and the second sensor are used to detect the position of the silicon wafer loading device, and when the silicon wafer loading device is transferred to the whole wafer workstation, the conveyor belt is controlled to stop working.

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