A Constant Temperature Crystal Oscillator

Abstract

The present invention discloses a constant temperature crystal oscillator, which includes a crystal component and an oscillation chip component capable of heating the crystal component. The oscillation chip component includes a ceramic base, the ceramic base has a first mounting surface and a second mounting surface, an installation support platform is provided on the edge of the first mounting surface, a heating resistor is clamped between the first mounting surface and the second mounting surface of the ceramic base, and a protective cover is fixed by welding on the upper plane of the installation support platform of the ceramic base. Both the oscillation chip component and the crystal component are accommodated in a sealed space. A heating resistor is provided between the first mounting surface and the second mounting surface. While the heating resistor heats the ceramic base, it also heats the protective cover. In the present invention, a heating resistor is provided in the ceramic base. While the heating resistor heats the ceramic base, it also heats the ceramic package and the protective cover. While the heating resistor heats the ceramic base, it also heats the protective cover. The protective cover seals and wraps the crystal component and has the function of heating and being heated, and can effectively adjust the temperature in the space.

Description

Technical Field

[0001] The present invention relates to an oscillator, and particularly to a temperature-controlled crystal oscillator. Background Art

[0002] The main feature of a temperature-controlled crystal oscillator is that through a temperature control circuit and a closed structure, the temperature of the quartz crystal is maintained constant at a specific operating temperature, so that the change in the output frequency caused by the ambient temperature change can be reduced to a minimum to achieve the stability of the oscillator output frequency.

[0003] Compared with the traditional large-sized temperature-controlled crystal oscillator, the miniaturized temperature-controlled crystal oscillator is limited by the requirements of the size and structure. It is not easy to maintain the temperature stability of its thermostat, and it is easily affected by the change of the external ambient temperature. Therefore, the applicant of the present invention has specifically developed a temperature-controlled crystal oscillator with a wrapped heating housing covering the quartz crystal package. Through the design of combining the heating resistor and the housing with the ceramic base structure, it can promote the heating of the ceramic base by the heat source and also heat the housing at the same time, so that the temperature in the closed space remains constant, reduce the heat dissipation of the heater, and help achieve the stable output of the oscillation frequency by improving various factors affecting temperature stability, thus solving the problems and deficiencies of the above-mentioned prior art. Summary of the Invention

[0004] The object of the present invention is to provide a temperature-controlled crystal oscillator for the above-mentioned defects of the prior art.

[0005] To solve the above-mentioned defects of the prior art, the technical solution provided by the present invention is: a temperature-controlled crystal oscillator, including a crystal component and an oscillation chip component capable of heating the crystal component. The oscillation chip component includes a ceramic base, the ceramic base has a first mounting surface and a second mounting surface, an installation support platform is provided on the edge of the first mounting surface, a heating resistor is clamped between the first mounting surface and the second mounting surface of the ceramic base, a protective cover is fixed on the upper plane of the installation support platform of the ceramic base by welding, the protective cover and the ceramic base are welded to form a sealed space, the oscillation chip component and the crystal component are both accommodated in the sealed space, a heating resistor is provided between the first mounting surface and the second mounting surface, and the heating resistor heats the ceramic base and also heats the protective cover at the same time.

[0006] As an improvement of the temperature-controlled crystal oscillator of the present invention, the protective cover is a metal material component.

[0007] As an improvement of the temperature-controlled crystal oscillator of the present invention, the welding part between the protective cover and the ceramic base is metallic tin.

[0008] As an improvement of the thermostatic crystal oscillator of the present invention, the crystal component is soldered on the upper plane of the installation support platform of the ceramic base through metallic tin, and while the ceramic base is heated, the cover and the crystal component are also heated simultaneously.

[0009] As an improvement of the thermostatic crystal oscillator of the present invention, an oscillation chip control circuit is installed on the second installation surface, and a temperature control circuit, an oscillation circuit and an oscillation chip are also connected to the oscillation chip control circuit. The heating resistor is connected to the temperature control circuit, and the oscillation chip is connected to the oscillation chip control circuit through wiring pins.

[0010] As an improvement of the thermostatic crystal oscillator of the present invention, the temperature control circuit includes a temperature control circuit control unit and a temperature control circuit adjustment element.

[0011] As an improvement of the thermostatic crystal oscillator of the present invention, while the cover is heated by the heating resistor, it can adjust and control the temperature in the sealed space to keep the temperature in the sealed space at a constant temperature state.

[0012] As an improvement of the thermostatic crystal oscillator of the present invention, the crystal component includes a ceramic package, a quartz wafer pasted on the ceramic package through conductive adhesive, and a metal cover covering the ceramic package to form a sealed cavity. An internal circuit is provided on the installation bottom surface of the ceramic package. The quartz wafer is located in the sealed cavity, and the quartz wafer is connected to the internal circuit through contact pins. The bottom surface of the ceramic package is soldered on the upper plane of the installation support platform of the ceramic base through metallic tin.

[0013] As an improvement of the thermostatic crystal oscillator of the present invention, the crystal component is located above the oscillation chip component, the oscillation chip corresponds to the heating resistor, and while the heating resistor heats the ceramic base, it can also heat the oscillation chip, the cover and the ceramic package.

[0014] Another solution provided by the present invention is: a packaging method for a thermostatic crystal oscillator, including the following steps:

[0015] S1) Fabricate the crystal component. Prepare a ceramic package with an installation groove, and paste the quartz wafer into the installation groove of the ceramic package through conductive adhesive; solder a metal cover on the upper plane of the ceramic package to seal the installation groove and form a sealed cavity;

[0016] S2) Fabricate the oscillation chip component; prepare a ceramic base with an installation groove, the diameter or width of the ceramic base is larger than the diameter or width of the ceramic package; an oscillation chip is arranged in the installation groove of the ceramic base; the oscillation chip is connected to the oscillation chip control circuit through wiring pins; a heating resistor is embedded in the ceramic base, and the oscillation chip control circuit is embedded on the lower end surface of the ceramic base;

[0017] S3) Assemble the crystal component and the oscillation chip component; weld the ceramic package on the crystal component to the upper plane of the mounting support platform of the ceramic base by welding; make the ceramic package and the ceramic base firmly connected together;

[0018] S4) Weld the cover; weld the cover to the upper plane of the mounting support platform of the ceramic base by soldering; seal both the crystal component and the oscillation chip component in the space; when the heating resistor heats the ceramic base, it also heats the ceramic package and the cover.

[0019] Compared with the prior art, the advantages of the present invention are as follows: A heating resistor is provided in the ceramic base. When the heating resistor heats the ceramic base, it also heats the ceramic package and the cover. The ceramic package can also receive and quickly transfer heat, so as to maintain the temperature in the space, prevent the temperature difference between the wafer and the oscillation chip, and reduce the heat loss of heat transfer between the wafer and the oscillation chip. When the heating resistor heats the ceramic base, it also heats the cover. The cover seals and wraps the crystal component and has the function of heating and receiving heat, and can effectively adjust the temperature in the space to prevent the temperature difference from affecting this product. The cover with the function of heating and receiving heat can further heat the crystal component inside, reduce the temperature difference between the wafer and the oscillation chip, and make the signal output of this product tend to be stable. The cover can further reduce the influence of the external environment on the temperature of the crystal component and the oscillation chip in the space. Description of the Drawings

[0020] Next, the present invention and its beneficial technical effects will be further described in detail according to the drawings and specific embodiments, where:

[0021] Figure 1 is a cross-sectional view of the present invention.

[0022] Names of reference numerals: 1. Crystal component; 2. Oscillation chip component; 3. Cover; 4. Space; 5. Metal tin; 11. Ceramic package; 12. Conductive adhesive; 13. Quartz wafer; 14. Sealed cavity; 15. Metal cover; 16. Internal circuit; 21. Ceramic base; 22. First mounting surface; 23. Second mounting surface; 24. Mounting support platform; 25. Heating resistor; 26. Oscillation chip; 27. Oscillation chip control circuit. Detailed Embodiments

[0023] Next, the present invention will be further described according to the drawings and specific embodiments, but the embodiments of the present invention are not limited thereto.

[0024] As Figure 1As shown in the figure, a constant temperature crystal oscillator includes a crystal component 1 and an oscillation chip component 2 capable of heating the crystal component 1. The oscillation chip component 2 includes a ceramic base 21, the ceramic base 21 has a first mounting surface 22 and a second mounting surface 23. An installation support platform 24 is provided on the edge of the first mounting surface 22. A heating resistor 25 is clamped between the first mounting surface 22 and the second mounting surface 23 of the ceramic base 21. A cover 3 is fixed on the upper plane of the installation support platform 24 of the ceramic base 21 by welding. The cover 3 and the ceramic base 21 are welded to form a sealed space 4. Both the oscillation chip component 2 and the crystal component 1 are accommodated in the sealed space 4. A heating resistor 25 is provided between the first mounting surface 22 and the second mounting surface 23. While heating the ceramic base 21, the heating resistor 25 also heats the cover 3.

[0025] Preferably, the cover 3 is a component made of metal material. The metal cover can be heated faster and transfer the heat to the crystal component in the space, so that a heating whole is formed around the crystal component to wrap the crystal component. The influence of the external environment on the crystal component is reduced.

[0026] Preferably, the welding joint between the cover 3 and the ceramic base 21 is metal tin 5 or metal silver. Metal tin or metal silver has higher activity in metals and has strong heat conduction ability, reducing heat loss.

[0027] Preferably, the crystal component 1 is welded on the upper plane of the installation support platform 24 of the ceramic base 21 by metal tin or metal silver. While heating the ceramic base 21, the cover 3 and the crystal component 1 are also heated simultaneously. By directly heating the ceramic base, the limitation of the heat transfer distance between the wafer and the oscillation chip can be solved; the influence of the external environment on the heat in the space can be reduced.

[0028] Preferably, an oscillation chip control circuit 27 is installed on the second mounting surface 23. A temperature control circuit, an oscillation circuit and an oscillation chip 26 are also connected to the oscillation chip control circuit 27. The heating resistor 25 is connected to the temperature control circuit, and the oscillation chip 26 is connected to the oscillation chip control circuit 27 through wiring pins.

[0029] Preferably, the temperature control circuit includes a temperature control circuit control unit and a temperature control circuit adjustment element. Circuit paths are formed between each circuit, and temperature information and heating instruction information can be transmitted to each other.

[0030] Preferably, while being heated by the heating resistor 25, the cover 3 can adjust and control the temperature in the sealed space 4 to keep the temperature in the sealed space 4 at a constant temperature state.

[0031] Preferably, the crystal component 1 includes a ceramic package 11, a quartz wafer 13 adhered to the ceramic package 11 by a conductive adhesive 12, and a metal cover 15 covering the ceramic package 11 to form a sealed cavity 14. An internal circuit 16 is provided on the mounting bottom surface of the ceramic package 11. The quartz wafer 13 is located in the sealed cavity 14 and is connected to the internal circuit 16 through contact pins. The bottom surface of the ceramic package 11 is soldered to the upper plane of the mounting support platform 24 of the ceramic base 21 by metal tin.

[0032] Preferably, the crystal component 1 is located above the oscillation chip component 2. The oscillation chip 28 corresponds to the heating resistor 25. While the heating resistor 25 heats the ceramic base 21, it can also heat the oscillation chip 26, the protective cover 3, and the ceramic package 11.

[0033] A packaging method for a constant temperature crystal oscillator includes the following steps:

[0034] S1) Fabricate the crystal component 1. Prepare a ceramic package 11 with a mounting groove, and adhere the quartz wafer to the mounting groove of the ceramic package through a conductive adhesive; weld a metal cover on the upper plane of the ceramic package to seal the mounting groove and form a sealed cavity;

[0035] S2) Fabricate the oscillation chip component 2; prepare a ceramic base with a mounting groove, the diameter or width of the ceramic base being larger than the diameter or width of the ceramic package; arrange the oscillation chip in the mounting groove of the ceramic base; connect the oscillation chip to the oscillation chip control circuit through wiring pins; embed a heating resistor in the ceramic base, and bury the oscillation chip control circuit in the lower end surface of the ceramic base;

[0036] S3) Assemble the crystal component 1 and the oscillation chip component 2; weld the ceramic package 11 on the crystal component to the upper plane of the mounting support platform 24 of the ceramic base 21 by welding; make the ceramic package and the ceramic base firmly connected together;

[0037] S4) Weld the protective cover 3; weld the protective cover 3 to the upper plane of the mounting support platform of the ceramic base 21 by soldering; seal both the crystal component 1 and the oscillation chip component 2 in the space 4; while the heating resistor 25 heats the ceramic base 21, it also heats the ceramic package 11 and the protective cover 3.

[0038] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and structures of the present invention. The scope of the present invention is defined by the appended claims and their equivalent scope.

Claims

1. A constant temperature crystal oscillator, comprising a crystal component and an oscillation chip component capable of heating the crystal component, characterized in that, The oscillating chip assembly includes a ceramic base. The ceramic base has a first mounting surface and a second mounting surface. An installation support platform is provided on the edge of the first mounting surface. A heating resistor is clamped between the first mounting surface and the second mounting surface of the ceramic base. A cover is fixed on the upper plane of the installation support platform of the ceramic base by welding. The cover and the ceramic base are welded to form a sealed space. The oscillating chip assembly and the crystal assembly are both accommodated in the sealed space. A heating resistor is provided between the first mounting surface and the second mounting surface. While heating the ceramic base, the heating resistor also heats the cover. The crystal assembly is welded on the upper plane of the installation support platform of the ceramic base by metallic tin. While heating the ceramic base, it also heats the cover and the crystal assembly at the same time. While being heated by the heating resistor, the cover can adjust and control the temperature in the sealed space to keep the temperature in the sealed space in a constant temperature state. The crystal assembly includes a ceramic package, a quartz wafer pasted on the ceramic package by conductive adhesive, and a metal cover covering the ceramic package to form a sealed cavity. An internal circuit is provided on the mounting bottom surface of the ceramic package. The quartz wafer is located in the sealed cavity. The quartz wafer is connected to the internal circuit through contact pins. The bottom surface of the ceramic package is welded on the upper plane of the installation support platform of the ceramic base by metallic tin.

2. The constant temperature crystal oscillator according to claim 1, wherein, The cover is a metal component.

3. The crystal oscillator with constant temperature according to claim 2, characterized in that, The welding part between the cover and the ceramic base is metallic tin.

4. The constant temperature crystal oscillator according to claim 1, characterized in that, An oscillating chip control circuit is installed on the second mounting surface. A temperature control circuit, an oscillating circuit and an oscillating chip are also connected to the oscillating chip control circuit. The heating resistor is connected to the temperature control circuit. The oscillating chip is connected to the oscillating chip control circuit through wiring pins.

5. The crystal oscillator with constant temperature according to claim 4, characterized in that, The temperature control circuit includes a temperature control circuit control unit and a temperature control circuit adjustment element.

6. The crystal oscillator with constant temperature according to claim 1, wherein The crystal assembly is located above the oscillating chip assembly. The oscillating chip corresponds to the heating resistor. While heating the ceramic base, the heating resistor can also heat the oscillating chip, the cover and the ceramic package.

7. A packaging method for a crystal oscillator with temperature compensation, which is applied to the crystal oscillator with temperature compensation described in any one of claims 1-6, and is characterized in that, Including the following steps: S1) Fabricate the crystal assembly. Prepare a ceramic package with an installation groove. The quartz wafer is pasted in the installation groove of the ceramic package by conductive adhesive. A metal cover is welded on the upper plane of the ceramic package to seal the installation groove and form a sealed cavity. S2) Fabricate the oscillating chip assembly. Prepare a ceramic base with an installation groove. The diameter or width of the ceramic base is larger than the diameter or width of the ceramic package. An oscillating chip is arranged in the installation groove of the ceramic base. The oscillating chip is connected to the oscillating chip control circuit through wiring pins. A heating resistor is buried in the ceramic base. The oscillating chip control circuit is buried in the lower end surface of the ceramic base. S3) Assemble the crystal assembly and the oscillating chip assembly. Weld the ceramic package on the crystal assembly to the upper plane of the installation support platform of the ceramic base by welding. Make the ceramic package and the ceramic base firmly connected together. S4) Cover welding; The cover is welded to the upper plane of the mounting support platform of the ceramic base by soldering; both the crystal component and the oscillator chip component are sealed in the space; while the heating resistor heats the ceramic base, it also heats the ceramic package and the cover.

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