Heat dissipation heat exchanger, semiconductor heat exchanger and semiconductor air conditioner

Abstract

The present application provides a heat dissipation heat exchanger, a semiconductor heat exchanger, and a semiconductor air conditioner. The heat dissipation heat exchanger includes a heat dissipation base body and heat dissipation fins. A heat dissipation liquid channel for liquid circulation is formed on the heat dissipation base body, and the heat dissipation fins are arranged on the heat dissipation base body. Heat dissipation fin air channels are formed on the heat dissipation fins. In this way, heat can be dissipated by air through the heat dissipation fin air channels on the heat dissipation fins, and at the same time, heat can be dissipated through the heat dissipation liquid channel on the heat dissipation base body by means of the medium water, greatly improving the heat dissipation performance of the heat dissipation heat exchanger for the semiconductor refrigeration sheet, improving the refrigeration efficiency of the semiconductor air conditioner, and solving the problem of insufficient energy in the air-cooled heat dissipation process.

Description

Technical Field

[0001] The present invention relates to the technical field of air conditioning equipment, and in particular to a heat dissipation heat exchanger, a semiconductor heat exchanger and a semiconductor air conditioner. Background Art

[0002] At present, air conditioners for kitchen environments have been launched on the market, including duct models, which are installed in the kitchen ceiling; single-sided air outlet patio models, which are flush with the ceiling gusset after installation, etc. These kitchen air conditioners have a characteristic that the engineering installation volume is relatively large, and they are suitable for kitchens that have not yet been decorated. If you want to install this type of kitchen air conditioner, you need to remove the ceiling, install the unit, and then restore the ceiling. The workload of installing the unit is greater, making the installation cost of the unit higher, which is difficult for users to accept.

[0003] Moreover, most of the existing units use refrigerant cooling. At this time, the unit has large mass components such as the compressor, which makes the overall unit bulky. Even if it is an integrated wall-mounted unit, there is a problem that the unit occupies a large space. As a result, the market feedback shows that the unit is too large and is heavy, making it inconvenient to disassemble and clean. Therefore, it is necessary to develop an air conditioner that is suitable for easy installation after kitchen decoration, has a small installation workload, is light, easy to place, and simple and convenient to maintain.

[0004] In order to solve the above problems, some semiconductor air conditioners that are easy to install and maintain have begun to appear on the market. However, the current semiconductor air conditioners have limited cooling efficiency. The reason is that during the operation of the semiconductor cooling sheet, the cooling efficiency will decrease as the temperature on the heating side increases, and how to discharge the heat in time has become a direct factor restricting the cooling efficiency. In order to transfer the heat on the heat exchanger on the semiconductor heating side, there are two heat exchange methods on the market: air cooling (using the wind field to achieve heat dissipation between air and heat exchanger) and water cooling (using the medium water flowing through the heat exchanger for heat exchange). The necessary condition for air cooling is that there must be an outdoor vent in the kitchen, so that the heat can be effectively discharged from the exhaust port to the outside; the necessary condition for water cooling is that there must be flowing water in the kitchen, and the water temperature used for heat exchange can be increased for domestic water use. The disadvantage is that when the water temperature used for heat exchange reaches a certain level, it will affect the heat exchange effect of the unit. Summary of the invention

[0005] The embodiments of the present invention provide a heat dissipation heat exchanger, a semiconductor heat exchanger and a semiconductor air conditioner to solve the technical problem of limited heat dissipation methods for semiconductor heat exchangers in the semiconductor air conditioner in the prior art.

[0006] The embodiment of the present application provides a heat dissipation heat exchanger, comprising: a heat dissipation base, on which a heat dissipation liquid channel for circulating liquid is formed; and heat dissipation fins, which are arranged on the heat dissipation base and on which heat dissipation fin air channels are formed.

[0007] In one embodiment, the heat dissipation liquid channel extends from one end of the heat dissipation base to the other end of the heat dissipation base.

[0008] In one embodiment, the heat dissipation liquid channel extends along the length direction of the heat dissipation base.

[0009] In one embodiment, a thermoelectric cooler mounting portion is formed on the heat dissipation base. The thermoelectric cooler mounting portion is used for mounting a thermoelectric cooler. The heat dissipation liquid channel includes a connecting flow channel and a surrounding flow channel. The surrounding flow channel is arranged around the thermoelectric cooler mounting portion, and the connecting flow channel communicates with the surrounding flow channel.

[0010] In one embodiment, there are multiple thermoelectric cooler mounting portions, and there are also multiple surrounding flow channels. Each surrounding flow channel is correspondingly arranged with each thermoelectric cooler mounting portion.

[0011] In one embodiment, the heat dissipation heat exchanger further includes a cover plate. The cover plate is mounted on the heat dissipation base, and the heat dissipation liquid channel is formed between the cover plate and the heat dissipation base.

[0012] In one embodiment, a mounting groove is formed on the heat dissipation base. The cover plate is mounted in the mounting groove, and the heat dissipation liquid channel is formed on the cover plate.

[0013] In one embodiment, there are multiple heat dissipation fins, and the multiple heat dissipation fins are stacked and installed.

[0014] In one embodiment, the heat dissipation heat exchanger further includes a transition support sheet. The transition support sheet is arranged between two adjacent heat dissipation fins.

[0015] In one embodiment, the heat dissipation heat exchanger further includes an inlet joint and an outlet joint. The inlet joint and the outlet joint are respectively connected to the inlet and outlet of the heat dissipation liquid channel.

[0016] The present application also provides a semiconductor heat exchanger, which includes a heat dissipation heat exchanger, a cold dissipation heat exchanger, and a thermoelectric cooler mounted between the heat dissipation heat exchanger and the cold dissipation heat exchanger. The heat dissipation heat exchanger is the above-mentioned heat dissipation heat exchanger.

[0017] In one embodiment, the cold dissipation heat exchanger includes: a cold dissipation base; cold dissipation fins arranged on the cold dissipation base, and cold dissipation fin air channels are formed on the cold dissipation fins.

[0018] In one embodiment, the heat dissipation fin air channel extends in a first direction, and the cold dissipation fin air channel extends in a second direction.

[0019] In one embodiment, the first direction and the second direction are the same or perpendicular to each other.

[0020] In one embodiment, there are multiple cold dissipation fins, and the multiple cold dissipation fins are stacked and installed.

[0021] In one embodiment, the semiconductor heat exchanger further includes a heat insulation plate disposed between the heat dissipation heat exchanger and the heat rejection heat exchanger.

[0022] In one embodiment, the heat insulation plate is provided with an avoidance hole for avoiding the semiconductor refrigeration chip.

[0023] The present application also provides a semiconductor air conditioner, including a semiconductor heat exchanger, and the semiconductor heat exchanger is the above-mentioned semiconductor heat exchanger.

[0024] In one embodiment, there are a plurality of semiconductor heat exchangers, and the heat dissipation liquid channels of the plurality of semiconductor heat exchangers are connected in parallel or in series.

[0025] In the above embodiment, it is possible to dissipate heat by air cooling through the heat dissipation fin air channels on the heat dissipation fins and also dissipate heat through the heat dissipation liquid channels on the heat dissipation matrix by means of the medium water, which greatly improves the heat dissipation performance of the heat dissipation heat exchanger for the semiconductor refrigeration chip, improves the refrigeration efficiency of the semiconductor air conditioner, and solves the problem of insufficient energy in the air cooling process. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The drawings constituting a part of the present application are used to provide a further understanding of the present invention. The schematic embodiments and descriptions thereof of the present invention are used to explain the present invention and do not constitute an improper limitation to the present invention. In the drawings:

[0027] Figure 1 is a schematic side view structure diagram of an embodiment of a heat dissipation heat exchanger according to the present invention;

[0028] Figure 2 is Figure 1 an exploded structure diagram of the heat dissipation heat exchanger;

[0029] Figure 3 is Figure 1 a front view structure diagram of the heat dissipation heat exchanger;

[0030] Figure 4 is Figure 1 a rear view structure diagram of the heat dissipation heat exchanger;

[0031] Figure 5 is Figure 4 an exploded structure diagram of the heat dissipation heat exchanger;

[0032] Figure 6 is Figure 5 a structure diagram of the cover plate of the heat dissipation heat exchanger;

[0033] Figure 7 is a three-dimensional structure diagram of Embodiment 1 of a semiconductor heat exchanger according to the present invention;

[0034] Figure 8 is Figure 7Exploded structural schematic diagram of a semiconductor heat exchanger;

[0035] Figure 9 is Figure 7 Frontal structural schematic diagram of the cooling heat exchanger of the semiconductor heat exchanger;

[0036] Figure 10 is Figure 9 Exploded structural schematic diagram of the cooling heat exchanger;

[0037] Figure 11 Stereoscopic structural schematic diagram of the second embodiment of the semiconductor heat exchanger according to the present invention;

[0038] Figure 12 Stereoscopic structural schematic diagram of the third embodiment of the semiconductor heat exchanger according to the present invention;

[0039] Figure 13 Structural schematic diagram of the series embodiment of the semiconductor heat exchanger according to the present invention;

[0040] Figure 14 Structural schematic diagram of the parallel embodiment of the semiconductor heat exchanger according to the present invention. Detailed implementation manners

[0041] To make the objectives, technical solutions and advantages of the present invention clearer and more understandable, the present invention will be further described in detail below in combination with the implementation manners and the accompanying drawings. Herein, the illustrative implementation manners of the present invention and their descriptions are used to explain the present invention, but are not used to limit the present invention.

[0042] In order to improve the heat dissipation performance of the semiconductor heat exchanger, in the technical solution of the present invention, the two heat dissipation methods of air cooling and water cooling are combined, which can not only improve the heat exchange efficiency of the unit, but also recover the heat released by the unit, and at the same time can solve the problem that air conditioners cannot be used in rooms without outdoor air outlets. Specifically, as Figure 1 、 Figure 2 and Figure 5 shown, the embodiment of the heat dissipation heat exchanger of the present invention includes a heat dissipation base body 10 and heat dissipation fins 20. A heat dissipation liquid channel 11 for liquid circulation is formed on the heat dissipation base body 10. The heat dissipation fins 20 are arranged on the heat dissipation base body 10, and heat dissipation fin air channels 21 are formed on the heat dissipation fins 20. In this way, it is possible to dissipate heat by air cooling through the heat dissipation fin air channels 21 on the heat dissipation fins 20 and at the same time dissipate heat through the heat dissipation liquid channel 11 on the heat dissipation base body 10 with the medium water, greatly improving the heat dissipation performance of the heat dissipation heat exchanger for the semiconductor cooling sheet 70, improving the refrigeration efficiency of the semiconductor air conditioner, and solving the problem of insufficient energy in the air cooling heat dissipation process.

[0043] In addition, the medium water passing through the heat dissipation liquid channel 11 can also be used for domestic water or other purposes.

[0044] As an alternative embodiment, as Figure 5 shown, the heat dissipation liquid channel 11 extends along the length direction of the heat dissipation base 10 to be applicable to the strip-shaped heat dissipation base 10, increasing the heat exchange area. As another embodiment not shown in the figure, the heat dissipation liquid channel 11 can also extend from one end of the heat dissipation base 10 to the other end of the heat dissipation base 10, and the extending manner of the heat dissipation liquid channel 11 should be adapted to the shape of the heat dissipation base 10.

[0045] As Figure 4 , Figure 5 and Figure 6 shown, in the technical solution of this embodiment, a refrigerating sheet mounting portion 12 is formed on the heat dissipation base 10, and the refrigerating sheet mounting portion 12 is used for mounting the semiconductor refrigerating sheet 70. The heat dissipation liquid channel 11 includes a communicating channel 111 and a surrounding channel 112, the surrounding channel 112 is arranged around the refrigerating sheet mounting portion 12, and the communicating channel 111 communicates with the surrounding channel 112. Through the surrounding channel 112, the heat exchange area can be increased and the influence on the insulation of the semiconductor refrigerating sheet 70 can be avoided. More preferably, there are a plurality of refrigerating sheet mounting portions 12, and there are also a plurality of surrounding channels 112, and each surrounding channel 112 is correspondingly arranged with each refrigerating sheet mounting portion 12. During use, only the heat dissipation liquid channel 11 needs to be connected to the water inlet and outlet system.

[0046] As Figure 5 and Figure 6 shown, in the technical solution of this embodiment, the heat dissipation heat exchanger further includes a cover plate 13, the cover plate 13 is mounted on the heat dissipation base 10, a mounting groove is formed on the heat dissipation base 10, the cover plate 13 is mounted in the mounting groove, and the heat dissipation liquid channel 11 is formed on the cover plate 13. Specifically, the cover plate 13 and the heat dissipation base 10 can be welded together by ultrasonic welding. The cover plate 13 is designed with ultrasonic welding melt lines, and after ultrasonic welding, a flow channel layout is formed around the refrigerating sheet mounting portion 12, and the water can uniformly and effectively take away the temperature on the heating side surface of the semiconductor refrigerating sheet during the process of flowing through the flow channel. As another alternative embodiment, the heat dissipation liquid channel 11 can also be formed between the cover plate 13 and the heat dissipation base 10. Preferably, the shape of the cover plate 13 is designed to be consistent with the contour of the mounting groove of the heat dissipation base 10, and ultrasonic welding lines are added to the cover plate 13 for ultrasonic welding to form a sealed flow channel.

[0047] As Figure 2 and Figure 3As shown, in the technical solution of this embodiment, there are two heat dissipation fins 20, and the two heat dissipation fins 20 are stacked and installed to increase the heat dissipation area. The fins are bonded and welded to the heat dissipation base 10. The fins are thin and tall, and two are designed to be stacked. In order to effectively transfer heat between the fins and strengthen the overall strength of the fins. More preferably, the heat dissipation heat exchanger further includes a transition support piece 30. The transition support piece 30 is arranged between two adjacent heat dissipation fins 20. Through the transition support piece 30, the upper heat dissipation fin 20 can be effectively supported and connected, improving the heat transfer effect. As another alternative embodiment, there can be more heat dissipation fins 20, and multiple heat dissipation fins 20 are stacked and installed to further increase the heat dissipation amount.

[0048] As Figure 2 and Figure 7 shown, in the technical solution of this embodiment, the heat dissipation heat exchanger further includes an inlet joint 41 and an outlet joint 42. The inlet joint 41 and the outlet joint 42 are respectively connected to the liquid inlet and the liquid outlet of the heat dissipation liquid channel 11. During use, the inlet joint 41 and the outlet joint 42 are respectively connected to the cold water system. Optionally, for easy and quick pipe connection, the inlet joint 41 and the outlet joint 42 are elbows, and the elbows are welded to the water inlet and outlet holes on the heat dissipation base 10.

[0049] As Figure 7 and Figure 8 shown, the present invention further provides a semiconductor heat exchanger. The semiconductor heat exchanger includes a heat dissipation heat exchanger, a cold dissipation heat exchanger, and a semiconductor refrigeration sheet 70 installed between the heat dissipation heat exchanger and the cold dissipation heat exchanger. The heat dissipation heat exchanger is the above-mentioned heat dissipation heat exchanger. During use, after the semiconductor refrigeration sheet 70 is powered on, one side will have a lower temperature and the other side will have a higher temperature. Using this characteristic of the semiconductor refrigeration sheet 70, the two sides of the semiconductor refrigeration sheet 70 are tightly attached to the radiator, so that heat or cold is transferred to the radiator. On the heat dissipation heat exchanger on one side of the semiconductor refrigeration sheet 70, the flow channel is made in the form of a cavity formed by welding a cover plate 13 and a heat dissipation base 10 for water flow, so as to realize heat exchange between the water medium and the radiator, and then take away the heat, thereby realizing water cooling. At the same time, fins are designed on the other side of the heat dissipation heat exchanger. The fins are welded. The fins adopt a multi-stage stacking method, and transition support pieces 30 are added between the fins in the stacking direction, effectively increasing the strength of the fins and effectively realizing the heat transfer between the fins.

[0050] As Figure 9 and Figure 10As shown, in the technical solution of Embodiment 1, the cooling radiator includes a cooling base 50 and cooling fins 60. The cooling fins 60 are arranged on the cooling base 50, and cooling fin air channels 61 are formed on the cooling fins 60. Preferably, both the cooling radiator and the heat dissipation radiator are made of a metal material with good thermal conductivity, preferably aluminum alloy. The heat dissipation on the heating side of the radiator has two heat dissipation methods: air cooling and water cooling, and the air cooling method is adopted on the cooling side. In the technical solution of the present invention, there are also multiple cooling fins 60, and the multiple cooling fins 60 are stacked and installed to improve the cooling efficiency of the cooling radiator.

[0051] More preferably, considering that the fins are thin and high and lack strength, the heat dissipation fins 20 and the cooling fins 60 are designed in a zigzag shape, and a radiator transition support piece is added between multiple fins. Such a design is beneficial to increasing the strength of the fins and effectively transferring heat between multiple fins, so as to increase the heat dissipation area while the strength will not decrease due to the increase in the height of the fins. At this time, the heat dissipation fin air channels 21 and the cooling fin air channels 61 are formed by the cavities formed between the fins.

[0052] In the technical solution of Embodiment 1, the heat dissipation fin air channels 21 extend in the horizontal direction, and the cooling fin air channels 61 extend in the vertical direction. As another alternative implementation manner, as Figure 11 shown, in the technical solution of Embodiment 2, both the heat dissipation fin air channels 21 and the cooling fin air channels 61 extend in the horizontal direction. As another alternative implementation manner, as Figure 12 shown, in the technical solution of Embodiment 2, both the heat dissipation fin air channels 21 and the cooling fin air channels 61 extend in the vertical direction.

[0053] As other alternative implementation manners, the heat dissipation fin air channels 21 extend in the first direction, and the cooling fin air channels 61 extend in the second direction. Optionally, the first direction and the second direction are the same or perpendicular to each other. In addition, the first direction and the second direction can also be set at an angle.

[0054] More preferably, to prevent the cold quantity short - circuit of the heat dissipation radiator and the cooling radiator, heat insulation plates are required to separate the heat dissipation radiator and the cooling radiator around the semiconductor, so the heat insulation plate 80 is added. The semiconductor radiator also includes a heat insulation plate 80, and the heat insulation plate 80 is arranged between the heat dissipation radiator and the cooling radiator. Through the heat insulation plate 80, the influence of the heat on the heat dissipation radiator on the cooling radiator can be reduced as much as possible. Preferably, an avoidance hole for avoiding the semiconductor refrigeration chip 70 is opened on the heat insulation plate 80.

[0055] Preferably, the heat dissipation base 10 and the heat dissipation fins 20 are connected by screws, and the cooling base 50 and the cooling fins 60 are also connected by screws. In addition, other components of the semiconductor radiator are also connected by screws.

[0056] The present invention also provides a semiconductor air conditioner, which includes a semiconductor heat exchanger, and the semiconductor heat exchanger is the above-mentioned semiconductor heat exchanger. The semiconductor air conditioner adopting the above-mentioned semiconductor heat exchanger can arrange the semiconductor heat exchanger components side by side in the unit, which is convenient for the overall design, and the energy of the unit can be combined and changed in multiple levels. The semiconductor air conditioner of the present invention can be used in a kitchen with an air outlet leading to the outside, or in a kitchen without an air outlet leading to the outside. At the same time, the water-cooling heat dissipation method is adopted, and the water can be used for domestic water after being heated. The overall structure of the semiconductor air conditioner is simple and easy to disassemble. The advantage over the refrigerant heat dissipation unit is that the unit structure is simple.

[0057] Preferably, a plurality of semiconductor heat exchangers are combined in an array to form an air duct, and can be self-combined to form units with multiple different energy levels. The combination is also particularly flexible.

[0058] As Figure 12 and Figure 13 shown, there are a plurality of semiconductor heat exchangers, and the heat dissipation liquid channels 11 of the plurality of semiconductor heat exchangers are connected in parallel or in series. Specifically, the connection method can be selected according to the water pressure and whether the water is recycled. The series connection method can achieve a high temperature rise of the water in a single cycle of heating, and it is possible to store the water heated on the heating side in a water tank for domestic water or other uses, or to supply water without collecting the water on the heating side. However, the heat exchange efficiency of the semiconductor heat exchanger decreases step by step. The parallel connection method can achieve a high heat exchange efficiency of the semiconductor heat exchanger, but if heat recovery is selected, the overall heat exchange effect will be affected as the temperature of the circulating water rises. Therefore, the parallel connection method is more suitable for occasions where the water medium is not recycled.

[0059] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, various changes and modifications can be made to the embodiments of the present invention. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A heat dissipation heat exchanger, characterized in that, Comprising: A heat dissipation base body (10) with a heat dissipation liquid channel (11) formed thereon for liquid circulation; Heat dissipation fins (20) arranged on the heat dissipation base body (10), and a heat dissipation fin air channel (21) is formed on the heat dissipation fins (20); A refrigeration sheet mounting portion (12) is formed on the heat dissipation base body (10), and a semiconductor refrigeration sheet (70) is mounted on the refrigeration sheet mounting portion (12). The heat dissipation liquid channel (11) includes a connecting flow channel (111) and a surrounding flow channel (112). The surrounding flow channel (112) is arranged around the refrigeration sheet mounting portion (12), and the connecting flow channel (111) communicates with the surrounding flow channel (112); The heat dissipation liquid channel (11) extends from one end of the heat dissipation base body (10) to the other end of the heat dissipation base body (10). The surrounding flow channel (112) includes a left half and a right half, and the end of the connecting flow channel (111) communicates with both the left half and the right half simultaneously; The heat dissipation liquid channel (11) extends along the length direction of the heat dissipation base body (10); There are multiple refrigeration sheet mounting portions (12), and there are also multiple surrounding flow channels (112). Each surrounding flow channel (112) is correspondingly arranged with each refrigeration sheet mounting portion (12).

2. The heat dissipation heat exchanger according to claim 1, wherein The heat dissipation heat exchanger further includes a cover plate (13). The cover plate (13) is mounted on the heat dissipation base body (10), and the heat dissipation liquid channel (11) is formed between the cover plate (13) and the heat dissipation base body (10).

3. The heat dissipation heat exchanger according to claim 2, characterized in that, An installation groove is formed on the heat dissipation base body (10), and the cover plate (13) is mounted in the installation groove. The heat dissipation liquid channel (11) is formed on the cover plate (13).

4. The heat dissipation heat exchanger according to claim 1, characterized in that, There are multiple heat dissipation fins (20), and the multiple heat dissipation fins (20) are stacked and mounted.

5. The heat dissipation heat exchanger according to claim 4, characterized in that, The heat dissipation heat exchanger further includes a transition support sheet (30), and the transition support sheet (30) is arranged between two adjacent heat dissipation fins (20).

6. The heat dissipation heat exchanger according to claim 1, wherein The heat dissipation heat exchanger further includes an inlet joint (41) and an outlet joint (42). The inlet joint (41) and the outlet joint (42) are respectively connected to the liquid inlet and the liquid outlet of the heat dissipation liquid channel (11).

7. A semiconductor heat exchanger, comprising a heat dissipation heat exchanger, a cold dissipation heat exchanger, and a semiconductor refrigeration sheet (70) installed between the heat dissipation heat exchanger and the cold dissipation heat exchanger, characterized in that, The heat dissipation heat exchanger is the heat dissipation heat exchanger according to any one of claims 1 to 6.

8. The semiconductor heat exchanger according to claim 7, characterized in that, The cold dissipation heat exchanger includes: A cold dissipation base body (50); Cold dissipation fins (60) arranged on the cold dissipation base body (50), and a cold dissipation fin air channel (61) is formed on the cold dissipation fins (60).

9. The semiconductor heat exchanger according to claim 8, wherein, The heat dissipation fin air channel (21) extends in a first direction, and the cold dissipation fin air channel (61) extends in a second direction.

10. The semiconductor heat exchanger according to claim 9, characterized in that, The first direction and the second direction are the same or perpendicular to each other.

11. The semiconductor heat exchanger according to claim 8, wherein, There are multiple cold dissipation fins (60), and the multiple cold dissipation fins (60) are stacked and mounted.

12. The semiconductor heat exchanger according to claim 7, characterized in that, The semiconductor heat exchanger further includes a heat insulation plate (80), and the heat insulation plate (80) is arranged between the heat dissipation heat exchanger and the cold dissipation heat exchanger.

13. The semiconductor heat exchanger according to claim 12, characterized in that, An avoidance hole for avoiding the semiconductor refrigeration sheet (70) is formed on the heat insulation plate (80).

14. A semiconductor air conditioner, comprising a semiconductor heat exchanger, characterized in that, The semiconductor heat exchanger is the semiconductor heat exchanger described in any one of claims 7 to 13.

15. The semiconductor air conditioner according to claim 14, characterized in that, There are a plurality of the semiconductor heat exchangers, and the heat dissipation liquid channels (11) of the plurality of semiconductor heat exchangers are connected in parallel or in series.

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