A dielectric resonance unit, a dielectric filter and a frequency selection characteristic debugging method

Abstract

The present application belongs to the technical field of dielectric filters, and particularly relates to a dielectric resonance unit, a dielectric filter and a frequency selection characteristic debugging method, which comprises: a dielectric body; and a conductive layer coated on the outer surface of the dielectric body; a blind hole is arranged on the dielectric body; at least one non-conductive area is arranged in the blind hole; the initial resonance frequency of the dielectric resonance unit in the dielectric filter is obtained, and the non-conductive area in the blind hole is filled with a conductive material according to the initial resonance frequency to change the area of ​​the conductive area in the blind hole, thereby adjusting the resonance frequency of the dielectric resonance unit to debug the frequency selection characteristic of the dielectric filter, avoiding the problem of grinding noise and environmental pollution such as metal and dielectric dust caused by mechanically grinding the conductive layer on the surface of the dielectric to debug the frequency selection characteristic of the dielectric filter, facilitating debugging, being suitable for automatic debugging production of dielectric filters, being dust-free and noise-free, clean and environmentally friendly, and improving the safety and reliability of frequency selection characteristic debugging of the dielectric filter.

Description

Technical Field

[0001] The present application belongs to the technical field of dielectric filters, and in particular relates to a dielectric resonance unit, a dielectric filter and a frequency selection characteristic debugging method. Background Art

[0002] A dielectric filter is a microwave filter that uses a dielectric resonant cavity (dielectric resonant unit) through multi-stage coupling to achieve frequency selection. At present, dielectric filters have been widely used in 5G communication systems due to their excellent performance such as low insertion loss, good power resistance and good temperature characteristics. In the process of producing dielectric filters, it is necessary to debug the dielectric filters to produce dielectric filters that meet the frequency selection characteristics required by the application. The traditional debugging method of dielectric filters is to adjust the frequency and coupling by grinding off the metal layer on the surface of the dielectric. This debugging method will generate a large amount of metal, dielectric dust and grinding noise, which will pose a threat to the production environment of the enterprise and the health of employees. In addition, the treatment of metal and dielectric dust will also pollute the environment.

[0003] Therefore, the traditional technical solutions have the problems of inconvenient mechanical debugging operation, high noise and environmental pollution during the frequency selection characteristic debugging of the dielectric filter. Summary of the invention

[0004] The purpose of the present application is to provide a dielectric resonance unit, a dielectric filter and a frequency selection characteristic debugging method, aiming to solve the problems of inconvenient mechanical debugging operation, high noise and environmental pollution in the frequency selection characteristic debugging of traditional dielectric filters.

[0005] A first aspect of an embodiment of the present application provides a dielectric resonance unit, comprising:

[0006] A dielectric body; and a conductive layer coated on the outer surface of the dielectric body;

[0007] The medium body is provided with a blind hole;

[0008] At least one non-conductive area is arranged in the blind hole.

[0009] In one of the embodiments, a first non-conductive region is disposed on the sidewall of the blind hole.

[0010] In one of the embodiments, a second non-conductive area is disposed at the bottom of the blind hole.

[0011] In one embodiment, the shape of the first non-conductive area includes but is not limited to a circle, a polygon, an arc, and a spiral.

[0012] In one embodiment, the shape of the second non-conductive area includes but is not limited to a circle, a polygon, an arc, and a spiral.

[0013] A second aspect of the embodiments of the present application provides a dielectric filter, comprising: at least one dielectric resonance unit as described in any one of the above items.

[0014] In one embodiment, the dielectric filter further comprises: a coupling window disposed on the dielectric body; and

[0015] A first signal port and a second signal port are provided on the medium body; the first signal port is used for inputting signals, and the second signal port is used for outputting signals.

[0016] A third aspect of the embodiments of the present application provides a method for debugging a frequency selection characteristic of a dielectric filter, the method for debugging a frequency selection characteristic being applied to any of the above-mentioned dielectric filters, the method for debugging a frequency selection characteristic comprising:

[0017] Acquiring an initial resonant frequency of the dielectric resonant unit in the dielectric filter;

[0018] The non-conductive area in the blind hole is filled with a conductive material according to the initial resonant frequency to adjust the resonant frequency of the dielectric resonant unit.

[0019] In one embodiment, the step of filling the non-conductive area in the blind hole with a conductive material according to the initial frequency selection characteristic includes:

[0020] comparing the initial resonant frequency with a preset reference frequency;

[0021] If the initial resonance frequency is less than the preset reference frequency, the first non-conductive area is filled with a conductive material.

[0022] In one of the embodiments, after comparing the initial resonant frequency with a preset reference frequency, the method further comprises:

[0023] If the initial resonance frequency is greater than the preset reference frequency, the second non-conductive area is filled with a conductive material.

[0024] In one of the embodiments, the conductive material includes one of conductive silver paste, conductive cloth, conductive glue, conductive powder, curable conductive liquid, and conductive paint.

[0025] Compared with the prior art, the embodiments of the present invention have the following beneficial effects: the dielectric resonance unit and the dielectric filter include a dielectric body; and a conductive layer coated on the outer surface of the dielectric body; a blind hole is provided on the dielectric body; and at least one non-conductive area is provided in the blind hole; the non-conductive area in the blind hole is filled with a conductive material to change the area of ​​the conductive layer in the blind hole, thereby adjusting the resonant frequency of the dielectric resonance unit, and then adjusting the frequency selection characteristics of the dielectric filter, thereby obtaining a dielectric filter with the required frequency selection characteristics, avoiding the problem of mechanically grinding the conductive layer on the surface of the dielectric to adjust the frequency selection characteristics of the dielectric filter, resulting in grinding noise and environmental pollution such as metal and dielectric dust, and is more suitable for automatic debugging and production of dielectric filters, is dust-free and noise-free, clean and environmentally friendly, avoids material waste, reduces the impact on the health of debugging workers, and improves the safety and reliability of debugging the frequency selection characteristics of the dielectric filter. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 A schematic diagram of the structure of a dielectric resonance unit provided in one embodiment of the present application;

[0027] Figure 2 Another structural schematic diagram of a dielectric resonance unit provided in one embodiment of the present application;

[0028] Figure 3 A schematic diagram of the structure of a dielectric filter provided in one embodiment of the present application;

[0029] Figure 4 A schematic flow chart of a method for debugging the frequency selection characteristics of a dielectric filter provided in one embodiment of the present application;

[0030] Figure 5 Another schematic flow chart of a method for debugging the frequency selection characteristics of a dielectric filter provided in one embodiment of the present application;

[0031] Figure 6 Another flowchart of a method for debugging the frequency selection characteristics of a dielectric filter provided in one embodiment of the present application is provided. DETAILED DESCRIPTION

[0032] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0033] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0034] It should be understood that the orientation or position relationship indicated by terms such as "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0035] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0036] Figure 1 A schematic structural diagram of a dielectric resonance unit provided in the first embodiment of the present application is shown. For ease of description, only the parts related to the present embodiment are shown, which are described in detail as follows:

[0037] A first aspect of the present application provides a dielectric resonance unit 100, see Figure 1 As shown, the dielectric resonance unit 100 in this embodiment includes a dielectric body and a conductive layer coated on the outer surface of the dielectric body, wherein a blind hole is provided on the dielectric body; and at least one non-conductive area 10 is provided in the blind hole.

[0038] In this embodiment, the conductive layer in the blind hole can be etched to expose the dielectric body to form non-conductive areas 10 of different shapes and numbers. It is also possible to form multiple non-conductive areas 10 by reserving a certain space area on the surface of the blind hole without coating the conductive material when coating the surface of the blind hole with a conductive layer. At least one non-conductive area can be set on the side wall of the blind hole or at the bottom of the blind hole or at the side wall and the bottom of the blind hole. When adjusting the resonant frequency of the dielectric resonance unit 100, it is not necessary to mechanically polish the conductive layer in the blind hole, but to fill the non-conductive area 10 in the blind hole with a conductive material to change the area of ​​the conductive layer in the blind hole, thereby changing the resonant frequency of the dielectric resonance unit 100, so as to achieve the purpose of adjusting the resonant frequency of the dielectric resonance unit 100.

[0039] The embodiment of the present application avoids the problems of grinding noise and environmental pollution such as metal and dielectric dust caused by mechanically grinding the conductive layer on the surface of the dielectric to adjust the resonant frequency of the dielectric resonance unit when adjusting the resonant frequency of the dielectric resonance unit. The embodiment of the present application is dust-free and noise-free, clean and environmentally friendly, avoids waste of conductive layer materials, facilitates adjustment of the resonant frequency of the dielectric resonance unit, reduces the impact on the health of workers, and improves the safety and reliability of resonant frequency debugging of the dielectric resonance unit.

[0040] In one embodiment, see Figure 2 , a first non-conductive region 200 is disposed on the sidewall of the blind hole.

[0041] In this embodiment, the conductive layer on the side wall of the blind hole can be etched to expose the dielectric body to form the first non-conductive area 200 of different shapes. The first non-conductive area 200 can also be formed by reserving a certain space area on the side wall of the blind hole without coating the conductive material when the conductive layer is coated on the surface of the blind hole. When the resonant frequency of the dielectric resonance unit 100 is adjusted, it is not necessary to mechanically polish the conductive layer in the blind hole. Instead, the first non-conductive area 200 on the side wall of the blind hole of the dielectric resonance unit 100 is filled with a conductive object to change the area of ​​the conductive layer in the blind hole, thereby changing the resonant frequency of the dielectric resonance unit 100, and then adjusting the resonant frequency of the dielectric resonance unit 100.

[0042] In one embodiment, see Figure 2 A second non-conductive area 300 is disposed at the bottom of the blind hole.

[0043] In this embodiment, the conductive layer at the bottom of the blind hole can be etched to expose the dielectric body to form a second non-conductive area 300 of different shapes. Alternatively, when the conductive layer is coated on the surface of the blind hole, a certain space area is reserved at the bottom of the blind hole without coating the conductive material to form the second non-conductive area 300. When the resonant frequency of the dielectric resonance unit 100 is adjusted, it is not necessary to mechanically polish the conductive layer of the blind hole. Instead, the first non-conductive area 200 of the side wall of the blind hole of the dielectric resonance unit 100 or the second non-conductive area 300 at the bottom of the blind hole is filled with a conductive object, thereby changing the resonant frequency of the dielectric resonance unit 100, and then adjusting the resonant frequency of the dielectric resonance unit 100.

[0044] In one embodiment, the dielectric body is made of a dielectric material, which may be ceramic or other materials.

[0045] In one embodiment, the material of the conductive layer includes at least one of gold, silver, copper and aluminum. Specifically, in this embodiment, the conductive layer can be a coating layer formed by coating a conductive material on the surface of the dielectric body. The non-conductive area, such as the first non-conductive area 200 and the second non-conductive area 300, is a non-conductive layer.

[0046] In one embodiment, the shape of the blind hole can be a cylindrical, prismatic or other shaped groove, and the first non-conductive area 200 and the second non-conductive area 300 are respectively arranged on the side wall and the bottom of the blind hole. By filling the first non-conductive area 200 or the second non-conductive area 300 with a conductive material, the resonant frequency of the dielectric resonance unit 100 can be adjusted.

[0047] In one embodiment, the shape of the first non-conductive region 200 includes but is not limited to a circular shape, a polygonal shape, an arc shape, and a spiral shape.

[0048] In a specific implementation, the first non-conductive area 200 may also include a plurality of non-contacting non-conductive areas, and the plurality of non-contacting non-conductive areas are arranged on the side walls of the blind hole. When the resonant frequency of the dielectric resonance unit 100 is adjusted, the resonant frequency can be adjusted by filling the plurality of non-contacting non-conductive areas with conductive materials.

[0049] In one embodiment, the shape of the second non-conductive region 300 includes but is not limited to a circular shape, a polygonal shape, an arc shape, and a spiral shape.

[0050] In a specific implementation, the second non-conductive area 300 may also include a plurality of non-contacting non-conductive areas, and the plurality of non-contacting non-conductive areas are arranged on the bottom of the blind hole. When the resonant frequency of the dielectric resonance unit 100 is adjusted, the resonant frequency can be adjusted by filling the plurality of non-contacting non-conductive areas with conductive materials.

[0051] Optional, see Figure 2 As shown, the first non-conductive area 200 is in an arc shape, and the second non-conductive area 300 is in a cross-shaped polygon. The first non-conductive area 200 or the second non-conductive area 300 can be filled with a conductive material, for example, the first non-conductive area 200 or the second non-conductive area 300 is filled with or coated with a conductive material, for example, the first non-conductive area 200 or the second non-conductive area 300 is sprayed or dripped with a conductive material to change the area of ​​the conductive layer in the blind hole, thereby adjusting the resonant frequency of the dielectric resonance unit 100.

[0052] A second aspect of the embodiments of the present application provides a dielectric filter, comprising: at least one dielectric resonance unit 100 as described in any one of the above items.

[0053] In a specific implementation, the dielectric filter may include a plurality of dielectric resonance units 100, or may include a dielectric resonance unit 100 and one or more dielectric resonance units without non-conductive regions, and two adjacent dielectric resonance units are connected to each other. By filling the non-conductive regions of the dielectric resonance units 100 with conductive materials, the resonant frequency of the dielectric resonance unit 100 is adjusted, thereby adjusting the frequency selection characteristics of the dielectric filter.

[0054] In one embodiment, the dielectric filter further comprises: a coupling window disposed on the dielectric body; and a first signal port and a second signal port disposed on the dielectric body; the first signal port is used for inputting signals, and the second signal port is used for outputting signals.

[0055] In a specific implementation, two adjacent dielectric resonance units are connected through a coupling window, including connecting two adjacent dielectric resonance units 100 or connecting two adjacent dielectric resonance units not provided with a non-conductive area or connecting an adjacent dielectric resonance unit 100 and a dielectric resonance unit not provided with a non-conductive area. The first signal port provided on the dielectric body can be used as a signal input port of the dielectric filter to input a signal, and the second signal port provided on the dielectric body can be used as a signal output port of the dielectric filter to output a signal. The first signal port and the second signal port are respectively provided on different dielectric resonance units. Optionally, the first signal port is provided on the first dielectric resonance unit among the multiple dielectric resonance units, and the second signal port is provided on the last dielectric resonance unit among the multiple dielectric resonance units.

[0056] In one embodiment, the conductive material includes one of conductive silver paste, conductive cloth, conductive glue, conductive powder, curable conductive liquid, and conductive paint. By filling the first non-conductive area or the second non-conductive area with conductive silver paste, conductive cloth, conductive glue, conductive powder, curable conductive liquid, or conductive paint, the area of ​​the conductive layer in the blind hole is changed, thereby changing the resonant frequency of the dielectric resonant unit, and then changing the frequency selection characteristics of the dielectric filter, so as to achieve debugging of the frequency selection characteristics of the dielectric filter.

[0057] In one embodiment, see Figure 3 As shown, the dielectric filter includes: 4 dielectric resonance units 100, namely a first dielectric resonance unit 101, a second dielectric resonance unit 102, a third dielectric resonance unit 103 and a fourth dielectric resonance unit 104. The side wall of the blind hole of the first dielectric resonance unit 101 is provided with a first non-conductive area 201, the side wall of the blind hole of the second dielectric resonance unit 102 is provided with a first non-conductive area 202, the side wall of the blind hole of the third dielectric resonance unit 103 is provided with a first non-conductive area 203, and the side wall of the blind hole of the fourth dielectric resonance unit 104 is provided with a first non-conductive area 204; the bottom of the blind hole of the first dielectric resonance unit 101 is provided with a second non-conductive area 301, the bottom of the blind hole of the second dielectric resonance unit 102 is provided with a second non-conductive area 302, the bottom of the blind hole of the third dielectric resonance unit 103 is provided with a second non-conductive area 303, and the bottom of the blind hole of the fourth dielectric resonance unit 104 is provided with a second non-conductive area 304.

[0058] Further, the dielectric filter also includes a coupling window 401, a coupling window 402, a coupling window 403 and a coupling window 404, and two adjacent dielectric resonance units are connected through the coupling window. The first signal port is arranged on the dielectric body of the first dielectric resonance unit 101, and the second signal port is arranged on the dielectric body of the fourth dielectric resonance unit 104. In the process of producing the dielectric filter, it is necessary to detect and debug the frequency selection characteristics of the dielectric filter. When debugging the frequency selection characteristics of the dielectric filter, the method of filling the first non-conductive area or the second non-conductive area of ​​the dielectric resonance unit with a conductive material instead of mechanically grinding the surface conductive layer of the dielectric body to debug the frequency selection characteristics of the dielectric filter can be implemented to adjust the frequency selection characteristics of the dielectric filter, so as to produce a dielectric filter that meets the required frequency selection characteristics. In the process of debugging the frequency selection characteristics of the produced dielectric filter, there is no dust and noise, clean and environmentally friendly, avoids the waste of conductive layer materials, is easy to debug, reduces the impact on the health of the debugging staff, and improves the safety and reliability of debugging the frequency selection characteristics of the dielectric filter.

[0059] See also Figure 4 A third aspect of an embodiment of the present application provides a method for debugging the frequency selection characteristics of a dielectric filter. The method for debugging the frequency selection characteristics is applied to any of the dielectric filters described above. The method for debugging the frequency selection characteristics includes: step S01 and step S02.

[0060] Step S01, obtaining an initial resonant frequency of a dielectric resonant unit in a dielectric filter.

[0061] In a specific implementation, the frequency selection characteristics of the produced dielectric filter can be detected by a frequency monitoring device (such as a vector network analyzer, etc.) and auxiliary software to obtain the initial resonant frequency of each dielectric resonant unit in the dielectric filter and display it. It should be understood that the initial resonant frequency is the resonant frequency of the dielectric resonant unit before the dielectric filter is debugged.

[0062] Step S02, filling the non-conductive area in the blind hole with a conductive material according to the initial resonant frequency to adjust the resonant frequency of the dielectric resonant unit.

[0063] In one embodiment, see Figure 5 , step S02, filling the non-conductive area in the blind hole with a conductive material according to the initial resonant frequency, including: step S021 and step S022.

[0064] Step S021, comparing the initial resonant frequency with a preset reference frequency;

[0065] In a specific implementation, the preset reference frequency is the target resonance frequency of the dielectric resonance unit, that is, the resonance frequency of each dielectric resonance unit in the dielectric filter required by the application.

[0066] Step S022: if the initial resonance frequency is less than the preset reference frequency, the first non-conductive area is filled with a conductive material.

[0067] In a specific implementation, if the initial resonance frequency of the dielectric resonance unit is less than the preset reference frequency, the initial resonance frequency of the dielectric resonance unit is increased by filling the first non-conductive area with a conductive material so that the initial resonance frequency is close to or equal to the preset reference frequency.

[0068] See also Figure 6 In one of the embodiments, after step S021: comparing the initial resonant frequency with the preset reference frequency, the method further includes: step S023.

[0069] Step S023: if the initial resonance frequency is greater than the preset reference frequency, the second non-conductive area is filled with a conductive material.

[0070] In a specific implementation, if the initial resonance frequency of the dielectric resonance unit is greater than the preset reference frequency, the initial resonance frequency of the dielectric resonance unit is lowered by filling the second non-conductive area with a conductive material so that the initial resonance frequency is close to or equal to the preset reference frequency.

[0071] The embodiment of the present application fills the non-conductive area in the blind hole with a conductive material to adjust the resonant frequency of the dielectric filter and thus the frequency selection characteristics of the dielectric filter. This method can effectively avoid the problem of mechanically grinding the conductive layer on the surface of the dielectric body to adjust the resonant frequency of the dielectric resonance unit, which leads to grinding noise and environmental pollution such as metal and dielectric dust. It is convenient to debug the frequency selection characteristics of the dielectric filter, is more suitable for automatic debugging and production of dielectric filters, is clean and environmentally friendly, avoids material waste, reduces the impact on the health of debugging staff, and improves the safety, reliability and practicality of debugging the frequency selection characteristics of the dielectric filter.

[0072] It should be understood that the size of the serial numbers of the steps in the above embodiments does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

[0073] The technicians in the relevant field can clearly understand that for the convenience and simplicity of description, only the division of the above-mentioned functional units and modules is used as an example for illustration. In practical applications, the above-mentioned function allocation can be completed by different functional units and modules as needed, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above. The functional units and modules in the embodiment can be integrated in a processing unit, or each unit can exist physically separately, or two or more units can be integrated in one unit. The above-mentioned integrated unit can be implemented in the form of hardware or in the form of software functional units. In addition, the specific names of the functional units and modules are only for the convenience of distinguishing each other, and are not used to limit the scope of protection of this application. The specific working process of the units and modules in the above-mentioned system can refer to the corresponding process in the aforementioned method embodiment, which will not be repeated here.

[0074] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described or recorded in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0075] Those of ordinary skill in the art will appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of this application.

[0076] The embodiments described above are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, a person skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.

Claims

1. A method for debugging the frequency selection characteristics of a dielectric filter, characterized in that: The frequency selection characteristic debugging method is applied to a dielectric filter, wherein the dielectric filter comprises at least one dielectric resonance unit, and the dielectric resonance unit comprises a dielectric body and a conductive layer coated on the outer surface of the dielectric body; The medium body is provided with a blind hole; At least one non-conductive area is provided in the blind hole; The frequency selection characteristic debugging method comprises: Acquiring an initial resonant frequency of the dielectric resonant unit in the dielectric filter; The non-conductive area in the blind hole is filled with a conductive material according to the initial resonant frequency to adjust the resonant frequency of the dielectric resonant unit.

2. The frequency selection characteristic debugging method according to claim 1, characterized in that: The dielectric filter further comprises: a coupling window arranged on the dielectric body; and a first signal port and a second signal port arranged on the dielectric body; the first signal port is used for inputting signals, and the second signal port is used for outputting signals.

3. The frequency selection characteristic debugging method according to claim 2, characterized in that: A first non-conductive area is disposed on the side wall of the blind hole.

4. The frequency selection characteristic debugging method according to claim 3, characterized in that: A second non-conductive area is arranged at the bottom of the blind hole.

5. The frequency selection characteristic debugging method according to claim 3, characterized in that: The shape of the first non-conductive area includes one of a circle, a polygon, an arc, and a spiral.

6. The frequency selection characteristic debugging method according to claim 4, characterized in that: The shape of the second non-conductive area includes one of a circle, a polygon, an arc, and a spiral.

7. The frequency selection characteristic debugging method according to any one of claims 1 to 6, characterized in that: The step of filling the non-conductive area in the blind hole with a conductive material according to the initial resonant frequency comprises: comparing the initial resonant frequency with a preset reference frequency; If the initial resonance frequency is less than the preset reference frequency, the first non-conductive area is filled with a conductive material.

8. The frequency selection characteristic debugging method according to claim 7, characterized in that: After comparing the initial resonant frequency with a preset reference frequency, the method further includes: If the initial resonance frequency is greater than the preset reference frequency, the second non-conductive area is filled with a conductive material.

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