Microwave detection module and manufacturing method thereof

Abstract

The present invention discloses a microwave detection module and a manufacturing method thereof, wherein the microwave detection module comprises a radiation source substrate, a reference ground substrate and a shielding cover, wherein the reference ground substrate is adhered to the radiation source substrate and abutted against the shielding cover, wherein the shielding cover is welded to the radiation source substrate, then when the reference ground substrate is adhered to the radiation source substrate and abutted against the shielding cover, the shielding cover is welded and fixed to the radiation source substrate, thereby forming a stable connection state among the radiation source substrate, the reference ground substrate and the shielding cover.

Description

Technical Field

[0001] The present invention relates to the field of microwave detection, and in particular to a microwave detection module and a manufacturing method thereof. Background Art

[0002] An existing microwave detection module generally includes a radiation source substrate carrying a radiation source, a reference ground substrate carrying a reference ground, and a shielding cover, wherein the radiation source is fixed to the reference ground substrate, and a state in which the radiation source and the reference ground are spaced apart by the radiation source substrate is formed correspondingly, wherein the shielding cover is generally arranged on a side of the reference ground substrate opposite to a side carrying the reference ground, wherein the radiation source has a feeding point, wherein the side of the reference ground substrate on which the shielding cover is arranged also carries a circuit unit, wherein the radiation source is conductively connected to the circuit unit from the feeding point, wherein when the circuit unit is powered to generate an excitation signal, the excitation signal is connected to the radiation source from the feeding point, the microwave detection module is excited to radiate microwaves outwardly, and receive reflected microwaves formed by the microwaves being reflected by at least one object, and output a detection signal based on the difference in characteristic parameters between the signals corresponding to the microwaves and the reflected microwaves, and the detection signal is feedback on the movement of the object.

[0003] The structure of the existing microwave detection module plays a decisive role in the performance of the microwave detection module, and in the manufacturing process of the microwave detection module, the manufacturing process is crucial to forming the structure of the microwave detection module. In the manufacturing process of the existing microwave detection module, the radiation source substrate, the reference ground substrate and the shielding cover are usually assembled in a sequentially stacked manner. Specifically, the shielding cover and the radiation source substrate are respectively welded and fixed on opposite sides of the reference ground substrate. Therefore, the structural fixation of the existing microwave detection module depends on the welding fixation between the shielding cover and the reference ground substrate, and the welding fixation between the radiation source substrate and the reference ground substrate. In other words, there is no direct fixing relationship between the radiation source substrate and the shielding cover, that is, the structural stability and consistency of the existing microwave detection module depend on the welding fixation between the reference ground substrate and the shielding cover, and the welding fixation between the reference ground substrate and the radiation source substrate. Therefore, the existing The structural stability and consistency of some of the microwave detection modules are difficult to ensure. Among them, the stability of the connection between the radiation source substrate, the reference ground substrate and the shielding cover will have a significant impact on the performance of the microwave detection module, especially the welding fixation between the reference ground substrate and the radiation source substrate, such as the reflow soldering fixation or spot welding fixation between the reference ground substrate and the radiation source substrate, which makes it difficult to accurately control the impedance of the radiation gap formed between the spaced radiation source and the reference ground due to the high-speed diffusion of tin in liquid state. Therefore, the corresponding performance parameters of the microwave detection module such as impedance matching, bandwidth and dielectric loss are difficult to control. Therefore, the performance stability and consistency of the microwave detection module are also difficult to ensure based on the structure and manufacturing process of the existing microwave detection module.

[0004] It is worth mentioning that, since the radiation source substrate, the reference ground substrate and the shielding cover are interconnected in a sequentially stacked manner, the thickness and volume of the existing microwave detection module are limited by the thickness and size of the radiation source substrate, the reference ground substrate and the shielding cover and cannot be further thinned or made smaller, which will limit the scope of use of the microwave detection module. Moreover, since the shielding cover is welded to the side of the reference ground substrate opposite to the side bearing the reference ground, the reference ground substrate not only needs to reserve sufficient installation space for arranging the circuit unit, but also needs to reserve sufficient installation space for installing the shielding cover. Therefore, the reference ground substrate needs to be provided with a larger area and volume, which leads to the defect that the existing microwave detection module is larger in volume and requires a larger installation space when installed. In addition, it is also worth mentioning that since the shielding cover of the existing microwave detection module is arranged on the side of the reference ground substrate carrying the circuit unit, that is, the shielding cover and the reference ground are separated by the reference ground substrate, that is, the shielding cover cannot shield the edge of the reference ground substrate, then the circuit unit carried on the reference ground substrate can radiate electromagnetic interference outward from the edge of the reference ground substrate and be interfered by external electromagnetic radiation, which will be detrimental to the working stability of the microwave detection module.

[0005] Generally speaking, the connection structure and assembly process among the radiation source, the reference ground and the shielding cover of the existing microwave detection module result in the defects of the existing microwave detection module being large in size, complex in manufacturing process, time-consuming, and difficult to ensure stability and consistency. Summary of the invention

[0006] An object of the present invention is to provide a microwave detection module and a manufacturing method thereof, wherein the microwave detection module includes a radiation source substrate, a reference ground substrate adhered to the radiation source substrate, and a shielding cover, wherein on the basis of the structure that the reference ground substrate is adhered to the radiation source substrate and abutted against the shielding cover, by welding the shielding cover to the radiation source substrate, a structural relationship in which a stable connection is formed among the shielding cover, the radiation source substrate and the reference ground substrate, thereby simplifying the manufacturing process of the microwave detection module and facilitating the production of the microwave detection module.

[0007] Another object of the present invention is to provide a microwave detection module and a manufacturing method thereof, wherein the radiation source substrate is provided with two welding grooves, wherein the shielding cover is extended to form two corresponding welding arms, wherein the shielding cover and the radiation source substrate are stably connected by welding the welding arms to the corresponding welding grooves, so that a structure in which the shielding cover and the radiation source substrate are stably connected is formed by welding and fixing the radiation source substrate with the radiation source substrate, the reference ground substrate and the shielding cover on the basis of the structure in which the reference ground substrate is attached to the radiation source substrate and abutted against the shielding cover, so that a structure in which the radiation source substrate, the reference ground substrate and the shielding cover are stably connected is formed, so that the manufacturing process of the microwave detection module can be simplified while ensuring the structural stability of the microwave detection module.

[0008] Another object of the present invention is to provide a microwave detection module and a method for manufacturing the same, wherein a direct fixed relationship is formed among the radiation source substrate, the reference ground substrate and the shielding cover to ensure the stability and consistency of the microwave detection module.

[0009] Another object of the present invention is to provide a microwave detection module and a manufacturing method thereof, wherein the radiation source substrate has a first copper clad layer and a second copper clad layer respectively arranged on two opposite sides of the radiation source substrate, wherein the reference ground substrate is provided with a metal layer on a side close to the radiation source substrate, wherein the metal layer of the reference ground is conductively bonded to the second copper clad layer of the radiation source substrate so that the metal layer forms a reference ground and the second copper clad layer forms a radiation source.

[0010] Another object of the present invention is to provide a microwave detection module and a manufacturing method thereof, wherein the radiation source has a feeding point, wherein the feeding point deviates from the physical center point of the radiation source, wherein the direction from the feeding point to the physical center point of the radiation source is defined as the polarization direction of the radiation source, wherein the straight line perpendicular to the polarization direction of the radiation source where the physical center point of the radiation source is located is defined as an energy balance line, wherein the radiation source substrate is provided with two welding grooves at the side position intersecting with the energy balance line, and the welding position of the shielding cover on the radiation source substrate can ensure the stability and consistency of the microwave detection module.

[0011] Another object of the present invention is to provide a microwave detection module and a manufacturing method thereof, wherein the welding arm is formed by extending the cover of the shielding cover in the direction of the radiation source substrate, which is beneficial to increase the welding area between the shielding cover and the radiation source substrate, thereby facilitating improving the stability of the connection between the shielding cover and the radiation source substrate.

[0012] Another object of the present invention is to provide a microwave detection module and a manufacturing method thereof, wherein two mounting arms protruding from the shielding cover are extended at both ends of the reference ground substrate, wherein the shielding cover is provided with two mounting grooves, and wherein the reference ground substrate is abutted against the shielding cover in a manner that the two mounting arms protrude from the shielding cover. When the shielding cover is welded to the radiation source substrate in a manner that wraps around the side wall of the reference ground substrate, the reference ground substrate is clamped and fixed between the radiation source substrate and the shielding cover.

[0013] Another object of the present invention is to provide a microwave detection module and a manufacturing method thereof, wherein the shielding cover extends from the mounting groove to form at least one positioning column, wherein the two mounting arms of the reference ground substrate are correspondingly provided with at least one positioning hole, wherein the reference ground substrate is embedded in the positioning column of the shielding cover at the positioning hole to further improve the stability of the connection between the reference ground substrate and the shielding cover.

[0014] Another object of the present invention is to provide a microwave detection module and a method for manufacturing the same, wherein the shielding cover is welded to the radiation source substrate in a manner of wrapping the side of the reference ground substrate, so as to help reduce the thickness of the microwave detection module, thereby facilitating the miniaturization of the microwave detection module.

[0015] Another object of the present invention is to provide a microwave detection module and a method for manufacturing the same, wherein the shielding cover is welded to the radiation source substrate in a manner of wrapping the side of the reference ground substrate, so that the reference ground substrate does not need to reserve space for installing the shielding cover, which is beneficial to reducing the size of the reference ground substrate, thereby facilitating the miniaturization of the microwave detection module.

[0016] Another object of the present invention is to provide a microwave detection module and a manufacturing method thereof, wherein the shielding cover is welded to the radiation source substrate in a manner of wrapping the side of the reference ground substrate so as to shield the radiation of the reference ground substrate from its side, which is beneficial to improving the working stability of the microwave detection module.

[0017] Another object of the present invention is to provide a microwave detection module and a manufacturing method thereof, wherein the metal layer of the reference ground substrate and the second copper clad layer of the radiation source substrate are conductively bonded to form a flat structure, so as to help reduce the dielectric loss of a radiation gap of the microwave detection module and maintain the consistency of the dielectric loss of the radiation gap.

[0018] Another object of the present invention is to provide a microwave detection module and a manufacturing method thereof, wherein the metal layer of the reference ground substrate and the second copper clad layer of the radiation source substrate are fixed to each other through the structure and process of a pressing plate to form a state in which the second copper clad layer of the radiation source substrate is flatly attached to the metal layer of the reference ground substrate.

[0019] Another object of the present invention is to provide a microwave detection module and a manufacturing method thereof, wherein the radiation source substrate has a portion extending and protruding from the reference ground substrate in a direction perpendicular to the polarization direction, and the welding groove of the radiation source substrate is arranged at the portion of the radiation source substrate extending and protruding from the reference ground substrate. When the shielding cover is welded to the welding groove of the radiation source substrate, solder can be prevented from penetrating between the radiation source substrate and the reference ground substrate to avoid affecting the flatness between the radiation source substrate and the reference ground substrate.

[0020] Another object of the present invention is to provide a microwave detection module and a manufacturing method thereof, wherein the flow of solder is guided by adjusting the shape of the welding arm of the shielding cover, such as bending one end of the welding arm to be welded to the welding groove, so as to avoid the solder from penetrating between the reference ground substrate and the radiation source substrate, thereby avoiding affecting the flatness between the radiation source and the reference ground.

[0021] Another object of the present invention is to provide a microwave detection module and a manufacturing method thereof, wherein the size of the radiation source substrate in the polarization direction is set to be consistent with the size of the shielding cover so as to cover the corner gap of the reference ground substrate, thereby preventing the microwave detection module from radiating second harmonics and third harmonics outward from the corner gap of the reference ground substrate, which is beneficial to ensuring the working stability of the microwave detection module.

[0022] Another object of the present invention is to provide a microwave detection module and a manufacturing method thereof, wherein the radiation source has two soldering pads, wherein the soldering pads are covered on the corresponding soldering grooves and conductively connected to the second copper cladding layer, wherein the shielding cover is soldered to the soldering pads and conductively connected to the reference ground, which is beneficial to enhancing the electromagnetic shielding effect of a shielding space formed by the shielding cover.

[0023] Another object of the present invention is to provide a microwave detection module and a manufacturing method thereof, wherein the radiation source has a feeding point, wherein the microwave detection module further includes a circuit unit arranged on the back side of the reference ground substrate, wherein the radiation source is conductively connected to the circuit unit from the feeding point in the form of a metallized via, which is conducive to simplifying the line structure between the radiation source and the circuit unit.

[0024] Another object of the present invention is to provide a microwave detection module and a method for manufacturing the same, wherein the radiation source is grounded, and the impedance of the microwave detection module is reduced so that the quality factor (i.e., Q value) of the microwave detection module is improved, thereby facilitating improving the anti-interference capability of the microwave detection module.

[0025] Another object of the present invention is to provide a microwave detection module and a manufacturing method thereof, wherein the physical center point of the radiation source is grounded to help suppress the radiation energy of the microwave detection module in the radiation direction from the radiation source to the reference ground, that is, to help suppress the sidelobe sensing distance of the microwave beam radiated by the microwave detection module, which is correspondingly beneficial to improve the anti-interference ability of the microwave detection module.

[0026] Another object of the present invention is to provide a microwave detection module and a manufacturing method thereof, wherein the physical center point of the radiation source forms a grounding point in the form of a metallized via, so as to reduce the impedance of the microwave detection module while helping to maintain the current density distribution of the radiation source when the feeding point is fed, thereby helping to ensure the radiation gain of the microwave detection module.

[0027] Another object of the present invention is to provide a microwave detection module and a method for manufacturing the same, wherein the side edges of the radiation source along the length direction are curved, such as concavely arranged, which is beneficial for further reducing the size of the radiation source in the polarization direction and for reducing the size requirements for the reference ground in the polarization direction of the radiation source, thereby allowing the size of the microwave detection module to be reduced by reducing the size of the reference ground in the polarization direction of the radiation source.

[0028] Another object of the present invention is to provide a microwave detection module and a manufacturing method thereof, wherein the second copper clad layer of the radiation source substrate and the metal layer of the reference ground substrate are directly fixed by a bare copper process, thereby avoiding the formation of an anti-oxidation metal protective layer in the radiation gap, improving the quality factor and emission receiving rate of the microwave detection module in a working state, and facilitating improving the gain and sensitivity of the microwave detection module.

[0029] Another object of the present invention is to provide a microwave detection module and a method for manufacturing the same, wherein during the manufacturing process of the microwave detection module, the process of forming an anti-oxidation metal protective layer through a surface treatment process is saved, which is beneficial to reducing the manufacturing cost of the microwave detection module.

[0030] To achieve at least one of the above objectives, the present invention provides a microwave detection module, comprising:

[0031] a reference ground substrate, wherein the reference ground substrate carries a reference ground;

[0032] A radiation source substrate, wherein the radiation source substrate carries a radiation source, wherein the reference ground is attached to the radiation source substrate in a state where the reference ground is spaced from the radiation source by the radiation source substrate, wherein the radiation source has a feeding point, wherein the feeding point deviates from the physical center point of the radiation source, wherein the direction from the feeding point to the physical center point of the radiation source is defined as the polarization direction of the radiation source, wherein a straight line on a plane where the radiation source is located and perpendicular to the polarization direction of the radiation source is defined as an energy balance line, wherein the radiation source substrate is provided with two welding grooves at side positions passing through the energy balance line; and

[0033] A shielding cover, wherein the shielding cover is fixed to the radiation source substrate by being welded to the corresponding welding groove in a state of being abutted against the reference ground substrate. Then, when the reference ground substrate is attached to the radiation source substrate and abutted against the shielding cover, the radiation source substrate is welded and fixed to the shielding cover at the welding groove, thereby forming a stable connection relationship among the radiation source substrate, the reference ground substrate and the shielding cover.

[0034] In one embodiment of the present invention, the radiation source substrate is further provided with two welding pads, wherein the two welding pads are covered on the inner walls of the corresponding welding grooves and conductively connected to the second copper clad layer of the radiation source substrate, and the welding pads are conductively connected to the metal layer of the reference ground substrate via the second copper clad layer, so that when the radiation source substrate is welded and fixed to the shielding cover via the welding pads in the welding groove, the shielding cover is conductively connected to the reference ground and grounded, so as to enhance the electromagnetic shielding effect of a shielding space formed by the shielding cover.

[0035] In one embodiment of the present invention, the shielding cover is provided with two mounting grooves, wherein two mounting arms are extended from both ends of the reference ground substrate, wherein the two mounting arms protrude from the shielding cover at the positions of the mounting grooves, so as to form a state in which the reference ground substrate is abutted against the shielding cover in a direction perpendicular to the reference ground. When the shielding cover is welded to the radiation source substrate, the reference ground substrate is clamped and fixed between the shielding cover and the radiation source substrate.

[0036] In one embodiment of the present invention, the shielding cover has a welding arm extending from its cover at positions corresponding to the two welding grooves, wherein the shielding cover is welded to the corresponding welding pad via the welding arm when abutting against the reference ground substrate and is fixed to the radiation source substrate.

[0037] In one embodiment of the present invention, the shielding cover extends from the mounting groove to form at least one positioning column, wherein the mounting arms of the reference ground substrate are respectively provided with at least one positioning hole, wherein the mounting arms of the reference ground substrate are embedded in the positioning columns of the shielding cover in the positioning holes.

[0038] In an embodiment of the present invention, the mounting arm of the reference ground plate is provided with a plurality of welding terminals.

[0039] In one embodiment of the present invention, in the direction of the energy balance line, the size of the radiation source substrate is set to correspond to the size of the shielding cover and is larger than the size of the reference ground substrate.

[0040] In one embodiment of the present invention, one end of the welding arm welded to the welding groove is bent to guide the flow of solder.

[0041] In one embodiment of the present invention, the top cross-sectional shape of the welding groove is set to be an arc shape or a triangle shape.

[0042] In an embodiment of the present invention, the radiation source has a grounding point, wherein the grounding point is formed at the physical center of the radiation source, and wherein the radiation source is grounded by being electrically connected to the reference ground at the grounding point.

[0043] In one embodiment of the present invention, the first copper clad layer of the radiation source is conductively connected to the second copper clad layer at the grounding point in the form of a metallized via, corresponding to a state in which the radiation source is electrically connected to the reference ground at the grounding point and is grounded.

[0044] In one embodiment of the present invention, the second copper clad layer of the radiation source substrate is evenly attached to the metal layer of the reference ground substrate.

[0045] In one embodiment of the present invention, the radiation source substrate and the reference ground substrate are integrally arranged in the structure and process of a laminated plate, wherein the radiation source is grounded by being conductively connected to the reference ground at its physical center point by a metallized via.

[0046] In one embodiment of the present invention, the microwave detection module further includes a circuit unit, wherein the circuit unit is arranged on a side of the reference ground substrate opposite to the side carrying the reference ground, and is accommodated in the shielding space formed by the shielding cover, wherein the radiation originates from the feeding point and is conductively connected to the circuit unit in the form of a metallized via.

[0047] In one embodiment of the present invention, the circuit unit includes an oscillating circuit and a mixer-detection circuit, wherein the radiation originates from the feeding point being conductively connected to the oscillating circuit in the form of a metallized via, and the mixer-detection circuit is electrically connected to the oscillating circuit.

[0048] In one embodiment of the present invention, the radiation source substrate has a first side surface, a second side surface opposite to the first side surface, a first polarization plane connecting the first side surface and the second side surface, and a second polarization plane opposite to the first polarization plane, wherein the first side surface and the second side surface are two opposite surfaces of the radiation source substrate passing through the energy balance line, wherein the reference ground substrate has a third side surface, a fourth side surface opposite to the third side surface, a third polarization plane connecting the third side surface and the fourth side surface, and a fourth polarization plane opposite to the third polarization plane, wherein the first side surface, the second side surface, the first polarization plane and the second polarization plane of the radiation source substrate respectively correspond to the positions of the third side surface, the fourth side surface, the third polarization plane and the fourth polarization plane of the reference ground substrate.

[0049] In an embodiment of the present invention, the welding groove of the radiation source substrate is formed on the first side surface and the second side surface of the radiation source substrate.

[0050] In an embodiment of the present invention, the metal layer of the reference ground substrate extends to cover at least one of the third side surface, the fourth side surface, the third polarization plane, and the fourth polarization plane of the reference ground substrate.

[0051] In one embodiment of the present invention, the metal layer of the reference ground substrate extends to cover the third side surface, the fourth side surface, the third polarization plane and the fourth polarization plane of the reference ground substrate to form a metal edging, wherein the shielding cover is welded to the radiation source substrate in a state of wrapping the metal edging.

[0052] In an embodiment of the present invention, the side surfaces of the radiation source corresponding to the first side surface and the second side surface of the radiation source substrate are configured as concave surfaces.

[0053] In one embodiment of the present invention, the length of the side of the radiation source passing through the polarization direction of the radiation source is set as a parameter L1, wherein the numerical range of the parameter L1 is: λ / 5≤L1≤λ / 2, wherein λ is the wavelength of the microwaves generated by the miniaturized microwave detection device.

[0054] In one embodiment of the present invention, the parameter L1 is set to be close to 13 mm.

[0055] In one embodiment of the present invention, in the direction of the energy balance line, the size of the radiation source substrate is set to be consistent with the maximum size of the radiation source and tends to be 13 mm.

[0056] In one embodiment of the present invention, the length of the side of the radiation source passing through the energy balance line is set as a parameter L2, wherein the value range of the parameter L2 is: λ / 5≤L2≤λ / 2, wherein λ is the wavelength of the microwaves generated by the microwave detection module.

[0057] In an embodiment of the present invention, the parameter L2 is set to be close to 13 mm.

[0058] In one embodiment of the present invention, the distance from the circuit unit to the bottom inner side of the shielding cover in a direction perpendicular to the reference ground substrate is set as parameter H1, wherein the numerical range of the parameter H1 is: H1≥λ / 16, wherein λ is the wavelength of the microwave generated by the microwave detection module.

[0059] In one embodiment of the present invention, the radiation source and the reference ground have a preset distance in the polarization direction of the radiation source, wherein the preset distance is set as a parameter L4, wherein the numerical range of the parameter L4 is set to: L4≥λ / 16, wherein λ is the wavelength of the microwaves generated by the microwave detection module.

[0060] In one embodiment of the present invention, the length of the side of the reference ground in the polarization direction is set as a parameter L5, wherein the numerical range of the parameter L5 is set to: L5≥λ / 8, wherein λ is the wavelength of the microwaves generated by the microwave detection module.

[0061] In one embodiment of the present invention, the microwave detection module is configured to operate in the 5.8 GHz frequency band, and the numerical range of the parameter H1 satisfies: H1 ≥ 3.2 mm, wherein the thickness of the reference ground substrate approaches 0.5 mm, wherein the thickness of the radiation source substrate approaches 1.0 mm, and wherein the overall thickness of the microwave detection module is assumed to be parameter H2, then the numerical range of the parameter H2 satisfies: 4.0 mm ≤ H2 ≤ 8.0 mm.

[0062] In one embodiment of the present invention, the size of the radiation source substrate along the polarization direction is set to be consistent with the size of the shielding cover, wherein the size of the radiation source substrate along the polarization direction is set to be a parameter L6, wherein the parameter L6 is set to approach 16 mm.

[0063] In another aspect, the present invention also provides a method for manufacturing a microwave detection module, comprising the following steps:

[0064] (A) attaching a reference ground substrate carrying a reference ground to a radiation source substrate carrying a radiation source;

[0065] (B) contacting the reference ground plate to a shielding cover; and

[0066] (C) The shielding cover is welded to the radiation source substrate. When the reference ground substrate and the radiation source substrate are in a state of being in contact with each other and the reference ground substrate and the shielding cover are in a state of being in contact with each other, the shielding cover and the radiation source substrate are welded and fixed to each other, thereby forming a stable connection between the radiation source substrate, the reference ground substrate and the shielding cover.

[0067] In one embodiment of the present invention, the radiation source has a feeding point, wherein the feeding point deviates from the physical center point of the radiation source, wherein the direction from the feeding point to the physical center point of the radiation source is defined as the polarization direction of the radiation source, wherein the straight line perpendicular to the polarization direction of the radiation source where the physical center point of the radiation source is located is defined as an energy balance line, wherein the step (C) further includes the following steps:

[0068] (C1) two welding grooves are provided on the side of the radiation source substrate intersecting with the energy balance line; and

[0069] (C2) The shielding cover is formed with two welding arms corresponding to the welding grooves extending from its cover edge, and the welding arms of the shielding cover are welded to the corresponding welding grooves of the radiation source substrate to form a stable connection between the shielding cover and the radiation source substrate.

[0070] In one embodiment of the present invention, two mounting arms are extended from both ends of the reference ground substrate and a positioning hole is provided on each mounting arm, wherein the shielding cover is provided with two mounting grooves and at least one positioning column is extended from each mounting groove, wherein step (B) includes the step of positioning the reference ground substrate on the shielding cover by embedding the positioning hole on the positioning column.

[0071] In one embodiment of the present invention, in said step (A), the following steps are further included:

[0072] (A1) covering two opposite surfaces of the radiation source substrate with a copper layer, respectively, to form a first copper-clad layer and a second copper-clad layer, respectively, on two opposite surfaces of the radiation source substrate;

[0073] (A2) covering the reference ground substrate with a metal layer; and

[0074] (A3) The second copper clad layer of the radiation source substrate is bonded to the metal layer of the reference ground substrate, so that the first copper clad layer of the radiation source substrate forms the radiation source, and the metal layer of the reference ground substrate forms the reference ground.

[0075] In one embodiment of the present invention, the microwave detection module further includes a circuit unit, wherein the circuit unit is arranged on a side of the reference ground substrate opposite to the side bearing the metal layer, wherein in the step (A), a step is further included: (A4) conductively connecting the first copper clad layer of the radiation source substrate and the circuit unit in the form of metallized vias, thereby forming a state in which the radiation source is conductively connected to the circuit unit.

[0076] In one embodiment of the present invention, the radiation source further includes a grounding point, wherein in the step (A), a step is further included: (A5) the grounding point is conductively connected to the second copper clad layer of the radiation source substrate by means of a metallized via, and the radiation source is grounded by being conductively connected to the reference ground through the grounding point.

[0077] In one embodiment of the present invention, the step (A) further includes a step: (A6) covering the corresponding pad on the welding groove, wherein the pad is conductively connected to the second copper cladding layer and conductively connected to the reference ground, then in the step (C), the welding arm of the shielding cover is welded to the pad to form a state in which the shielding cover is conductively connected to the reference ground.

[0078] Further objects and advantages of the present invention will be fully apparent from an understanding of the following description and the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0079] Figure 1 It is a stereoscopic diagram of the microwave detection module according to a preferred embodiment of the present invention.

[0080] Figure 2 It is an exploded view of the microwave detection module according to the above preferred embodiment of the present invention.

[0081] Figure 3 It is a schematic cross-sectional view of the microwave detection module according to the above preferred embodiment of the present invention.

[0082] Figure 4 It is a top view of the microwave detection module according to the above preferred embodiment of the present invention.

[0083] Figure 5 It is a schematic diagram of assembling the microwave detection module according to the above preferred embodiment of the present invention.

[0084] Fig. 6A It is a stereoscopic diagram of a first variant implementation manner of the microwave detection module according to the above preferred embodiment of the present invention.

[0085] Figure 6B It is a top view of a first variant implementation manner of the microwave detection module according to the above preferred embodiment of the present invention.

[0086] Fig. 7A It is a stereoscopic diagram of a second variant implementation manner of the microwave detection module according to the above preferred embodiment of the present invention.

[0087] Figure 7B It is a top view of a second variant implementation manner of the microwave detection module according to the above preferred embodiment of the present invention. DETAILED DESCRIPTION

[0088] The following description is used to disclose the present invention so that those skilled in the art can implement the present invention. The preferred embodiments described below are only examples, and those skilled in the art can think of other obvious variations. The basic principles of the present invention defined in the following description can be applied to other embodiments, deformation schemes, improved schemes, equivalent schemes, and other technical solutions that do not deviate from the spirit and scope of the present invention.

[0089] Those skilled in the art should understand that, in the disclosure of the present invention, the orientation or position relationship indicated by the terms "vertical", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc. are based on the orientation or position relationship shown in the drawings, which are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation. Therefore, the above terms should not be understood as limiting the present invention.

[0090] It is to be understood that the term "one" should be understood as "at least one" or "one or more", that is, in one embodiment, the number of an element may be one, while in another embodiment, the number of the element may be multiple, and the term "one" should not be understood as a limitation on the quantity.

[0091] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or mutual communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0092] Reference to the attached drawings of the specification Figures 1 to 5 As shown, a microwave detection module 100 according to a preferred embodiment of the present invention is illustrated, wherein the microwave detection module 100 includes a radiation source substrate 10, a reference ground substrate 20 and a shielding cover 30, wherein the radiation source substrate 10 carries a radiation source 101, wherein the reference ground substrate 20 carries a reference ground 102, wherein the reference ground 102 is attached to the radiation source substrate 10 in a state of being spaced apart from the radiation source 101 by the radiation source substrate 10, wherein the radiation source 101 has a feeding point 1011, wherein the feeding point 1011 deviates from the physical center point of the radiation source 101, wherein the direction of the feeding point 1011 to the physical center point of the radiation source 101 is defined as the polarization direction of the radiation source 101, and the plane on which the radiation source 101 is located is defined as The straight line on which the physical center point of the radiation source 101 lies is an energy balance line, wherein the radiation source substrate 10 is provided with two welding grooves 13 at the side position intersecting with the energy balance line; wherein the shielding cover 30 is fixed to the radiation source substrate 10 by being welded to the corresponding welding grooves 13 in a state of abutting against the reference ground substrate 20, such as forming the welding between the radiation source substrate 10 and the shielding cover 30 in a drag welding manner, then when the reference ground substrate 20 is attached to the radiation source substrate 10 and abutted against the shielding cover 30, the radiation source substrate 10 is welded and fixed to the shielding cover 30 in the welding grooves 13, thereby forming a stable connection relationship among the radiation source substrate 10, the reference ground substrate 20 and the shielding cover 30.

[0093] Specifically, in this embodiment of the present invention, the shielding cover 30 is formed with two welding arms 31 extending from its cover edge corresponding to the welding groove 13, wherein the shielding cover 30 is welded to the radiation source substrate 10 in a state of abutting against the reference ground substrate 20 in such a manner that the welding arms 31 are welded to the corresponding welding grooves 13. Then, when the reference ground substrate 20 is attached to the radiation source substrate 10 and abutted against the shielding cover 30, the radiation source substrate 10 is welded and fixed to the corresponding welding arms 31 of the shielding cover 30 at the welding grooves 13, thereby forming a stable connection relationship among the radiation source substrate 10, the reference ground substrate 20 and the shielding cover 30.

[0094] Specifically, the radiation source substrate 10 has a first copper clad layer 11 and a second copper clad layer 12 respectively arranged on two opposite sides of the radiation source substrate 10; the reference ground substrate 20 is provided with a metal layer 21, wherein the metal layer 21 is conductively bonded to the second copper clad layer 12 of the radiation source substrate 10, so that the first copper clad layer 11 of the radiation source substrate 10 forms the radiation source 101, and the metal layer 21 of the reference ground substrate 20 forms the reference ground 102, and the reference ground 102 and the radiation source 101 are in a state of being connected with each other.

[0095] Furthermore, the shielding cover 30 is provided with two mounting grooves 301, wherein two mounting arms 23 protruding from the shielding cover 30 are correspondingly extended from both ends of the reference ground substrate 20, wherein the reference ground substrate 20 is abutted against the shielding cover 30 with the mounting arms 23 protruding from the corresponding mounting grooves 301, and when the shielding cover 30 is welded to the radiation source substrate 10, the reference ground substrate 20 is clamped and fixed between the shielding cover 30 and the radiation source substrate 10.

[0096] It can be understood that the reference ground substrate 20 is abutted against the shielding cover 30 in a manner that the two mounting arms 23 are mounted on the shielding cover 30. Then, on the basis of the connection relationship between the reference ground substrate 20 being attached to the radiation source substrate 10 and abutted against the shielding cover 30, by welding the shielding cover 30 to the radiation source substrate 10, that is, by welding and fixing the shielding cover 30 and the radiation source substrate 10, a stable connection relationship between the radiation source substrate 10, the reference ground substrate 20 and the shielding cover 30 can be formed. That is to say, the microwave detection module 100 of the present invention can form a stable connection structure between the radiation source substrate 10, the reference ground substrate 20 and the shielding cover 30 by welding the welding arms 31 of the shielding cover 30 to the corresponding welding grooves 13 on the basis that the reference ground substrate 20 is attached to the radiation source substrate 10 and abutted against the shielding cover 30, thereby simplifying the manufacturing process of the microwave detection module 100 and facilitating the production of the microwave detection module 100.

[0097] It should be understood that the reference ground substrate 20 can be supported on the shielding cover 30 in a manner that is flush with the cover edge of the shielding cover 30, or can be supported on the shielding cover 30 in a manner that is sunken below the cover edge of the shielding cover 30, and the present invention is not limited to this.

[0098] Furthermore, in this preferred embodiment of the present invention, the shielding cover 30 is respectively extended to form at least one positioning column 32 in the mounting groove 301, wherein the mounting arms 23 of the reference ground substrate 20 are respectively correspondingly provided with at least one positioning hole 230, wherein the reference ground substrate 20 is embedded in the positioning column 32 of the shielding cover 30 in the positioning hole 230, and the reference ground substrate 20 is further fixed to the shielding cover 30 to ensure the stability of the connection between the reference ground substrate 20 and the shielding cover 30.

[0099] In particular, in some embodiments of the present invention, the positioning column 32 is welded to the reference ground 102 in the positioning hole 230 to further form a reinforced fixation between the reference ground substrate 20 and the shielding cover 30 while realizing the positioning of the reference ground substrate 20 on the shielding cover 30, and the present invention is not limited to this.

[0100] It can be understood that the structural stability and consistency of the microwave detection module 100 also depend on the stable connection structure between the radiation source substrate 10, the reference ground substrate 20 and the shielding cover 30. In this preferred embodiment of the present invention, the reference ground substrate 20 is embedded in the shielding cover 30 in the positioning hole 230 and is attached to the radiation source substrate 10, wherein the radiation source substrate 10 and the reference ground substrate 20 are attached and welded to the shielding cover 30. That is to say, a direct fixed relationship is formed between the radiation source substrate 10, the reference ground substrate 20 and the shielding cover 30 of the present invention, which is conducive to ensuring the stability and consistency of the microwave detection module 100.

[0101] It is worth mentioning that the welding arm 31 of the shielding cover 30 extends from the cover of the shielding cover 30 toward the radiation source substrate 10, which is beneficial to increase the welding area between the shielding cover 30 and the radiation source substrate 10, and is beneficial to improving the stability of the connection between the shielding cover 30 and the radiation source substrate 10 while facilitating the welding operation.

[0102] It can be understood that, on the basis of the connection that the reference ground substrate 20 is attached to the radiation source substrate 10 and abutted against the shielding cover 30, by welding the welding arm 31 of the shielding cover 30 to the corresponding welding groove 13 of the radiation source substrate 10, a stable connection relationship between the radiation source substrate 10, the reference ground substrate 20 and the shielding cover 30 can be formed. In other words, through the fixation between the shielding cover 30 and the radiation source substrate 10, a stable connection structure between the radiation source substrate 10, the reference ground substrate 20 and the shielding cover 30 can be formed, so that while ensuring the stable performance of the microwave detection module 100, the manufacturing process of the microwave detection module 100 is simplified, which is conducive to the production of the microwave detection module 100.

[0103] It is worth mentioning that in the manufacturing process of the microwave detection module 100, not only the stability of the connection between the radiation source substrate 10, the reference ground substrate 20 and the shielding cover 30 will affect the performance of the microwave detection module 100, but also the flatness of the connection between the radiation source substrate 10 and the reference ground substrate 20 will have an important impact on the performance of the microwave detection module 100. In other words, the flatness of the connection between the radiation source 101 and the reference ground 102 has an important impact on the performance of the microwave detection module 100. Therefore, in order to ensure the performance of the microwave detection module 100, the second copper clad layer 12 of the radiation source substrate 10 is flatly attached to the metal layer 21 of the reference ground substrate 20.

[0104] Optionally, in some embodiments of the present invention, the radiation source substrate 10 and the reference ground substrate 20 are fixed to each other by a pressed plate structure and process so that the second copper clad layer 12 of the radiation source substrate 10 is flatly attached to the metal layer 21 of the reference ground substrate 20.

[0105] It is worth mentioning that the radiation source substrate 10 and the reference ground substrate 20 are attached to each other and formed between the radiation source 101 and the reference ground 102 to form a radiation gap 103. It can be understood that the metal layer 21 of the reference ground substrate 20 and the second copper clad layer 12 of the radiation source substrate 10 are conductively attached to each other and form a flat structure, so as to reduce the dielectric loss of the radiation gap 103 of the microwave detection module 100 and maintain the consistency of the dielectric loss of the radiation gap 103.

[0106] Preferably, the second copper clad layer 12 of the radiation source substrate 10 and the metal layer 21 of the reference ground substrate 20 are directly fixed by a bare copper process. In some embodiments of the present invention, the second copper clad layer 12 is directly fixed to the metal layer 21 by electric welding. In some embodiments of the present invention, the second copper clad layer 12 is flatly arranged on the metal layer 21 of the reference ground substrate 20 by mechanical fixing of a mechanical clamping structure.

[0107] In other words, the second copper-clad layer 12 of the radiation source substrate 10 and the metal layer 21 of the reference ground substrate 20 are attached and fixed in a direct contact manner without a surface treatment process step for forming an anti-oxidation metal protective layer, wherein the second copper-clad layer 12 of the radiation source substrate 10 and the metal layer 21 of the reference ground substrate 20 based on the bare copper state have good flatness and conductivity, which is conducive to reducing and stably maintaining the thickness of the radiation gap 103, and the dielectric loss of the medium in the radiation gap 103 can be reduced and stably maintained, which is further conducive to reducing the dielectric loss of the radiation gap 103 and maintaining the consistency of the dielectric loss of the radiation gap 103, that is, it is conducive to maintaining the consistency of the impedance matching of the microwave detection module 100. Moreover, in this way, the quality factor of the microwave detection module 100 in the working state is effectively improved, specifically, the anti-interference performance of the microwave detection module 100 is improved by narrowing the working frequency bandwidth of the microwave detection module 100.

[0108] It should be understood that during the manufacturing process of the microwave detection module 100 of the present invention, the welding of the shielding cover 30 to the radiation source substrate 10 will not affect the connection between the radiation source substrate 10 and the reference ground substrate 20, that is, the welding of the shielding cover 30 to the radiation source substrate 10 will not affect the flatness of the connection between the radiation source 101 and the reference ground 102. Specifically, in this preferred embodiment of the present invention, the radiation source substrate 10 has a portion extending and protruding from the reference ground substrate 20 in a direction perpendicular to the polarization direction, and the welding groove 13 of the radiation source substrate 10 is arranged at the portion of the radiation source substrate 10 extending and protruding from the reference ground substrate 20. Then, when the shielding cover 30 is welded to the welding groove 13 of the radiation source substrate 10, solder can be prevented from penetrating between the radiation source substrate 10 and the reference ground substrate 20, so as to avoid affecting the flatness between the radiation source 101 and the reference ground 102, thereby facilitating maintaining the consistency of the dielectric loss of the radiation gap 103 between the radiation source 101 and the reference ground 102.

[0109] In other words, in this preferred embodiment of the present invention, the side length of the radiation source substrate 10 in the polarization direction of the radiation source 101 is set to correspond to the side length of the shielding cover 30 in the polarization direction of the radiation source 101 and is larger than the side length of the reference ground substrate 20 in the polarization direction of the radiation 101. Then, the welding position between the radiation source substrate 10 and the shielding cover 30 is away from the position where the radiation source substrate 10 and the reference ground substrate 20 are in contact with each other, so as to avoid solder from penetrating between the radiation source substrate 10 and the reference ground substrate 20 and facilitate the welding of the shielding cover 30 to the radiation source substrate 10.

[0110] In addition, since the side length of the radiation source substrate 10 in the polarization direction of the radiation source 101 is set to correspond to the side length of the shielding cover 30 in the polarization direction of the radiation source 101 and is greater than the side length of the reference ground substrate 20 in the polarization direction of the radiation 101, when the welding arm 31 of the shielding cover 30 is welded to the radiation source substrate 10, the welding arm 31 can fix the position of the radiation source substrate 10 to ensure the structural stability of the microwave detection module 100.

[0111] It is worth mentioning that in some embodiments of the present invention, the present invention can also guide the flow of solder by adjusting the shape of the welding arm 31 of the shielding cover 30, such as bending the end of the welding arm 31 welded to the welding groove 13, so as to avoid the solder from penetrating between the radiation source substrate 10 and the reference ground substrate 20, thereby avoiding affecting the flatness between the radiation source 101 and the reference ground 102. In other words, in one embodiment of the present invention, the end of the welding arm 31 of the shielding cover 30 welded to the welding groove 13 is bent to facilitate guiding the flow of solder.

[0112] It should be understood that in some embodiments of the present invention, the shielding cover 30, the reference ground substrate 20 and the radiation source substrate 10 can also be welded to form a structure in which the shielding cover 30, the reference ground substrate 20 and the radiation source substrate 10 are fixedly connected. Specifically, the side lengths of the reference ground substrate 20 and the radiation source substrate 10 in the polarization direction of the radiation source 101 are kept consistent, that is, the widths of the radiation source substrate 10 and the reference ground substrate 20 are kept consistent, wherein the reference ground substrate 20 is welded to the inner wall of the shielding cover 30, wherein the shielding cover 30 extends to form the welding arm 31 which is welded to the radiation source substrate 10, thereby forming a state in which the shielding cover 30 is welded to the reference ground substrate 20 and the radiation source substrate 10. Alternatively, it can be understood that by welding the shielding cover 30, the reference ground substrate 20 and the corresponding surfaces of the radiation source substrate 10 at one point, a stable structure of the microwave detection module 100 is formed, which can simplify the manufacturing process of the microwave detection module 100 and facilitate the production of the microwave detection module 100. Therefore, it can be understood that the present invention can also form a structure in which the inner side surface of the shielding cover 30, the side surface of the reference ground substrate 20 and the side surface of the radiation source substrate 10 are fixedly connected by welding three surfaces at one point, which is also conducive to simplifying the manufacturing process of the microwave detection module 100.

[0113] Furthermore, the microwave detection module 100 includes a circuit unit 40, wherein the circuit unit 40 is arranged on a side of the reference ground substrate 20 opposite to the side bearing the reference ground 102, and is accommodated in a shielded space 302 formed by the shielding cover 30, wherein the radiation source 101 is conductively connected to the circuit unit 40 at the feeding point 1011, wherein when the circuit unit 40 is powered, the feeding point 1011 is fed, wherein the radiation source 101 is excited to radiate microwaves outwardly, wherein the microwave detection module 100 receives a reflected wave formed by the microwave being reflected by at least one object, and outputs a detection signal based on characteristic parameters such as frequency parameters or phase parameters between the signals corresponding to the microwave and the reflected wave, and the detection signal is feedback of the movement of the object.

[0114] It is worth mentioning that the feeding point 1011 of the radiation source 101 forms a conductive connection with the circuit unit 40 in the form of a metallized via, which is conducive to simplifying the circuit structure between the radiation source 101 and the circuit unit 40.

[0115] Furthermore, the circuit unit 40 includes an oscillation circuit 41 and a mixer-detection circuit 42, wherein the radiation source 101 is conductively connected to the oscillation circuit 41 at the feeding point 1011 in the form of a metallized via, wherein the mixer-detection circuit 42 is electrically connected to the oscillation circuit 41, wherein when the oscillation circuit 41 is powered, the oscillation circuit 41 outputs an excitation signal, wherein the excitation signal feeds the radiation source 101 from the feeding point 1011, wherein the radiation source 101 and the reference ground 102 interact with each other to radiate microwaves outwardly, wherein the microwave detection module 100 receives the reflected wave formed by the reflection of the microwave, wherein the mixer-detection circuit 42 outputs the detection signal based on the frequency difference between the microwave and the reflected wave, then based on the principle of the Doppler effect, the detection signal is feedback of the movement of the object.

[0116] In particular, in this preferred embodiment of the present invention, the shielding cover 30 is welded to the radiation source substrate 10 in a state of wrapping the side of the reference ground substrate 20, and the shielding space 302 is formed on the side of the reference ground substrate 20 where the circuit unit 40 is provided, and the circuit unit 40 is accommodated in the shielding space 302 to allow the circuit unit 40 to operate in the shielding space 302 without being interfered with by the outside world.

[0117] It is worth mentioning that Figure 2 and Figure 3As shown, the two mounting arms 23 of the reference ground substrate 20 are conductively connected to the oscillating circuit 41 of the circuit unit 40 and have at least three welding terminals 231 to allow the oscillating circuit 41 of the microwave detection module 100 to be electrically connected to an external circuit. It should be understood that in some embodiments of the present invention, the mounting arm 23 may have four or more welding terminals 231, and the present invention does not limit the number of the welding terminals 231. In addition, the number of the welding terminals 231 of the two mounting arms 23 may be the same or different, and the present invention does not limit this.

[0118] It can be understood that, when the welding terminal 231 is arranged in the length direction of the reference ground 102, the welding terminal 231 can be equivalent to the reference ground 102 and reduce the size requirement of the reference ground 102 in the length direction of the reference ground 102, which is beneficial to reducing the size of the reference ground 102 in the length direction of the reference ground 102, thereby helping to reduce the size of the microwave detection module 100.

[0119] Further, the radiation source substrate 10 has a first side surface 14, a second side surface 15 opposite to the first side surface 14, a first polarization plane 16 connecting the first side surface 14 and the second side surface 15, and a second polarization plane 17 opposite to the first polarization plane 16, wherein the reference ground substrate 20 has a third side surface 201, a fourth side surface 202 opposite to the third side surface 201, a third polarization plane 203 connecting the third side surface 201 and the fourth side surface 202, and a fourth polarization plane 204 opposite to the third polarization plane 203, wherein the first side surface 14, the second side surface 15, the first polarization plane 16 and the second polarization plane 17 of the radiation source substrate 10 respectively correspond to the positions of the third side surface 201, the fourth side surface 202, the third polarization plane 203 and the fourth polarization plane 204 of the reference ground substrate 20.

[0120] It is worth mentioning that the welding groove 13 of the radiation source substrate 10 is formed on the first side surface 14 and the second side surface 15 of the radiation source substrate 10 .

[0121] In addition, it is worth mentioning that the metal layer 21 of the reference ground substrate 20 extends to cover at least one side of the third side surface 201 , the fourth side surface 202 , the third polarization plane 203 , and the fourth polarization plane 204 of the reference ground substrate 20 .

[0122] Preferably, in this preferred embodiment of the present invention, the metal layer 21 of the reference ground substrate 20 extends to cover the third side surface 201, the fourth side surface 202, the third polarization plane 203 and the fourth polarization plane 204 of the reference ground substrate 20 to form a metal edging 22 on the reference ground substrate 20, wherein the shielding cover 30 is preferably welded to the radiation source substrate 10 in a state of being wrapped around the metal edging 22 of the reference ground substrate 20, so as to be able to shield the board edge radiation of the reference ground substrate 20, which is beneficial to improve the working stability of the microwave detection module 100.

[0123] It can be understood that, when the shielding cover 30 is welded to the radiation source substrate 10 in a manner of wrapping the metal edging 22 of the reference ground substrate 20, there is no need to reserve space on the reference ground substrate 20 for installing the shielding cover 30, which is beneficial to reducing the size of the reference ground substrate 20, thereby facilitating the miniaturization of the microwave detection module 100.

[0124] It is also worth mentioning that the shielding cover 30 is welded to the radiation source substrate 10 in a manner of wrapping the metal edging 22 of the reference ground substrate 20, and the reference ground substrate 20 is in a state of being sunken to the cover edge of the shielding cover 30 and abutted against the shielding cover 30, which is conducive to reducing the thickness of the microwave detection module 100, thereby facilitating the miniaturization of the microwave detection module 100. Therefore, in some embodiments of the present invention, the thickness of the microwave detection module 100 can be adjusted by adjusting the sinking distance of the reference ground substrate 20 from the shielding cover 30, while ensuring the detection performance of the microwave detection module 100, which is conducive to making the microwave detection module 100 thinner and smaller, thereby facilitating the expansion of the use range of the microwave detection module 100.

[0125] In addition, it is worth mentioning that the shielding cover 30 wraps and shields the metal edging 22 of the reference ground substrate 20 to shield the radiation of the edge of the reference ground substrate 20 , which is beneficial to improving the working stability of the microwave detection module 100 .

[0126] It should be understood that, since the reference ground substrate 20 is clamped and fixed between the shielding cover 30 and the radiation source substrate 10 in a manner of being abutted against the shielding cover 30, the metal cladding 22 of the reference ground substrate 20 and the shielding cover 30 do not affect the stability of the connection between the reference ground substrate 20 and the shielding cover 30 even if there is no connection relationship. However, in some embodiments of the present invention, in order to further improve the stability of the connection between the reference ground substrate 20 and the shielding cover 30, the shielding cover 30 can be further fixedly connected to the reference ground substrate 20 in a manner of welding its inner wall to the metal cladding 22 of the reference ground substrate 20. Optionally, the inner wall of the shielding cover 30 can also be attached to the metal cladding 22 of the reference ground substrate 20 and the shielding cover 30 can be stably fixed to the reference ground substrate 20 by damping the contact surface of the two. The present invention does not limit the way in which the shielding cover 30 and the metal cladding 22 of the reference ground substrate 20 are connected.

[0127] In particular, the present invention further provides a miniaturized microwave detection module 100 in another aspect. In this preferred embodiment of the present invention, the two side surfaces of the radiation source 101 corresponding to the first side surface 14 and the second side surface 15 of the radiation source substrate 10 are set as concave surfaces, and the two side surfaces of the radiation source 101 corresponding to the first polarization plane 16 and the second polarization plane 17 of the radiation source substrate 10 are set as planes. Then, the part of the reference ground 102 corresponding to the concave part of the radiation source 101 can be coupled with the concave surface of the radiation source 101 and can reduce the size requirement of the reference ground 102 in the width direction of the radiation source 101, so as to help reduce the size of the reference ground 102 and the reference ground substrate 20 in the width direction of the radiation source 101, thereby helping to reduce the size of the microwave detection module 100.

[0128] It should be understood that in some embodiments of the present invention, the side shapes of the radiation source 101 corresponding to the first side 14 and the second side 15 of the radiation source substrate 10 can be set to other shapes, such as a plane shape, a toothed shape, etc., that is, the shape of the radiation source 101 can be set to a double waist shape, a square shape, a circular shape, an irregular shape, etc., that is, the specific implementation methods of the radiation source substrate 10 and the radiation source 101 are diverse, and cannot become a limitation on the content and scope of the microwave detection module 100 described in the present invention.

[0129] It is worth mentioning that Figure 4As shown, the direction from the feeding point 1011 of the radiation source 101 to the physical center point of the radiation source 101 is defined as the polarization direction of the radiation source 101, and the length of the side of the radiation source 101 passing through the polarization direction of the radiation source 101 is set as a parameter L1, wherein the value range of the parameter L1 is: λ / 5≤L1≤λ / 2, wherein λ is the wavelength of the microwave generated by the microwave detection module 100. Preferably, the parameter L1 is set to be close to λ / 4 to ensure that the microwave detection module 100 can have good working performance.

[0130] It is worth mentioning that, based on the errors in industrial production and the range of the working frequency band, in the above and following descriptions of the present invention, the understanding of "tends to" should be clearly understood as having an error range of ±10%. For example, the description that the parameter L1 is preferably set to tend to λ / 4 as mentioned above should be understood as: the parameter L1 is preferably set to be in the range of 0.225λ to 0.0275λ, that is, in the description of the present invention, "tends to" is defined as a description with a clear error range of ±10%.

[0131] It can be understood that the welding terminal 231 is arranged in the polarization direction of the radiation source 101, which not only facilitates the microwave detection module 100 to output and output signals, but also can equivalently increase the area of ​​the reference ground 102, so as to facilitate the microwave detection module 100 to be miniaturized and ensure that the microwave detection module 100 can have good working performance.

[0132] Further, the length of the side of the radiation source 101 in the direction perpendicular to the polarization direction of the radiation source 101 is set as a parameter L2, wherein the value range of the parameter L2 is: λ / 5≤L2≤λ / 2, wherein λ is the wavelength of the microwave generated by the microwave detection module 100. Preferably, the parameter L2 is set to be close to λ / 4, such as when the microwave detection module 100 is set to work in the 5.8 GHz frequency band, the parameter L2 is preferably set to be close to 13 mm, so as to ensure that the microwave detection module 100 can have good working performance.

[0133] It is worth mentioning that the distance from the circuit unit 40 to the bottom inner side of the shielding cover 30 is set as parameter H1, that is, the parameter corresponding to the inner space height of the shielding cover 30 is the parameter H1, and the numerical range of the parameter H1 is set to: H1≥λ / 16, where λ is the wavelength of the microwave generated by the microwave detection module 100. In other words, when the reference ground substrate 20 is supported on the shielding cover 30 in a manner of being sunken to the cover edge of the shielding cover 30, it is necessary to satisfy: the distance from the circuit unit 40 disposed on the back of the reference ground substrate 20 to the bottom inner side of the shielding cover 30 corresponds to the numerical range of the parameter H1 that satisfies: H1≥λ / 16, so as to reduce the repeated reflection of the microwave radiated by the microwave detection module 100 in the shielding space 302 formed by the shielding cover 30, thereby ensuring the stability of the operation of the microwave detection module 100.

[0134] It can be understood that the overall thickness of the microwave detection module 100 includes the thickness of the shielding cover 30, the distance from the circuit unit 40 to the bottom inner side of the shielding cover 30, the thickness of the reference ground substrate 20 and the thickness of the radiation source substrate 10. In one embodiment of the present invention, the microwave detection module 100 is configured to operate in the 5.8 GHz frequency band, and the numerical range of the parameter H1 satisfies: H1 ≥ 3.2 mm, wherein the thickness of the reference ground substrate 20 tends to 0.5 mm, wherein the thickness of the radiation source substrate 10 tends to 1.0 mm, wherein the overall thickness of the microwave detection module 100 is assumed to be parameter H2, and the numerical range of the parameter H2 satisfies: 4.0 mm ≤ H2 ≤ 8.0 mm.

[0135] It is worth mentioning that the thickness of the radiation source substrate 10 ranges from 0.4 mm to 1.2 mm, and the thickness of the reference ground substrate 20 ranges from 0.25 mm to 1.0 mm, which is not limited in the present invention.

[0136] In particular, in order to ensure that the 5.8 GHz microwave detection module 100 has a stable structure and good working performance, the thickness of the shielding cover 30 of the microwave detection module 100 is preferably set to 0.25 mm, wherein the parameter corresponding to the inner space height of the shielding cover 30 is set to be greater than or equal to 3.2 mm, that is, the numerical range of the parameter H1 satisfies: H1 ≥ 3.2 mm, wherein the thickness of the reference ground substrate 20 is preferably set to 0.5 mm, so as to take into account the structural stability of the microwave detection module 100 and reduce the microwave radiation path of the microwave detection module 100; wherein the thickness of the radiation source substrate 10 is preferably set to 1.0 mm, so that the microwave detection module 100 can have a better radiation angle and reduce the loss of the microwave detection module 100, therefore, correspondingly, the parameter H2 corresponding to the overall thickness of the microwave detection module 100 is preferably set to 5 mm.

[0137] It is worth mentioning that when the two side surfaces of the radiation source 101 corresponding to the first side surface 14 and the second side surface 15 of the radiation source substrate 10 are set as concave surfaces, the side length of the side of the concave surface of the radiation source 101 is set to a parameter L3, wherein the parameter L3 is set to be greater than or equal to the parameter L2.

[0138] In addition, it is worth mentioning that the radiation source 101 and the reference ground 102 have a preset distance in the polarization direction of the radiation source 101, wherein the preset distance is set to a parameter L4, wherein the numerical range of the parameter L4 is set to: L4≥λ / 16, wherein λ is the wavelength of the microwaves generated by the microwave detection module 100.

[0139] Furthermore, the length of the side of the reference ground 102 in the polarization direction is assumed to be a parameter L5, wherein the value range of the parameter L5 is set to: L5≥λ / 8, wherein λ is the wavelength of the microwave generated by the microwave detection module 100 .

[0140] It can be understood that, in order to ensure the uniformity of the radiation area and the sensing distance in the radiation direction of the reference ground 102, preferably, the parameter L4 is set to 4.5 mm, and the parameter L5 is set to 9 mm.

[0141] It is worth mentioning that in the actual production process of the microwave detection module 100 of the present invention, due to the process problem of the circuit board, the corners of the reference ground substrate 20 are drilled to form corner gaps. Therefore, in a variant embodiment of the present invention, Fig. 6A and Figure 6BAs shown, in order to prevent the microwave detection module 100 from radiating microwaves outward from the corner gap, the size of the radiation source substrate 10 is set to be consistent with the size of the shielding cover 30 along the polarization direction, so that the radiation source substrate 10 can cover the corner gap of the reference ground substrate 20, so that the circuit unit 40 arranged on the reference ground substrate 20 can be completely shielded in the shielding space 302 formed by the shielding cover 30, thereby preventing the detection module 100 from radiating second harmonics and third harmonics outward from the corner gap, which is beneficial to ensure the working stability of the microwave detection module 100.

[0142] In particular, in one embodiment of the present invention, the microwave detection module 100 is configured to operate in the 5.8 GHz frequency band. In the direction of the energy balance line, the size of the radiation source substrate 10 is set to be consistent with the maximum size of the radiation source 101 corresponding to the parameter L1 and preferably tends to 13 mm, wherein the size of the radiation source substrate 10 along the polarization direction is set to be a parameter L6, wherein the parameter L6 is preferably set to 16 mm.

[0143] Furthermore, the radiation source substrate 10 is further provided with two soldering pads 1013, wherein the soldering pads 1013 are covered on the corresponding soldering grooves 13 and are conductively connected to the second copper cladding layer 12, and the soldering pads 1013 are conductively connected to the reference ground 102 via the second copper cladding layer 12, wherein the shielding cover 30 is welded to the soldering pads 1013 and conductively connected to the reference ground 102, which is beneficial to enhancing the electromagnetic shielding effect of the shielding space 302 formed by the shielding cover 30.

[0144] It can be understood that, when the welding groove 13 is formed on the energy balance line of the radiation source 101, when the shielding cover 30 is welded to the welding pad 1013, the connection between the shielding cover 30 and the radiation source substrate 10 will not affect the operation of the radiation source 101, which is beneficial to ensure the stability and consistency of the microwave detection module 100.

[0145] It should be understood that the specific number and shape of the welding grooves 13 are not limited. Preferably, in this preferred embodiment of the present invention, the inner wall of the welding groove 13 is set to a curved surface, that is, the top cross-sectional shape of the welding groove 13 is set to a circular arc shape, and the shape of the welding pad 1013 is set to be consistent with the shape of the welding groove 13, which is conducive to increasing the welding area on the basis of a certain welding spot size, so as to obtain a stronger welding strength and a smaller welding spot size when the welding pad 1013 and the metal layer 21 of the reference ground substrate 20 are welded by spot welding. In addition, it is conducive to obtaining a stronger welding strength and a smaller welding spot size when the welding arm 31 of the shielding cover 30 is welded to the welding pad 1013 by spot welding.

[0146] It is worth mentioning that the welding groove 13 and the welding pad 1013 can be implemented in other shapes. For example, in a modified embodiment of the above preferred embodiment of the present invention, Fig. 7A and Figure 7B As shown, the welding groove 13 is set to a triangular prism shape, that is, the top cross-sectional shape of the welding groove 13 is a triangle shape, which is beneficial to suppressing the microwave radiation of the microwave detection module 100 along the radiation source 101 toward the welding groove 13, and correspondingly suppressing the energy of the side lobe of the microwave beam radiated by the microwave detection module 100, thereby helping to improve the anti-interference ability of the microwave detection module 100.

[0147] Optionally, the present invention may use a laser welding process to spot weld the pad 1013 and the metal layer 21 of the reference ground substrate 20. Due to the high efficiency of the laser welding process, the process steps of welding and fixing the second copper clad layer 12 of the radiation source substrate 10 to the metal layer 21 of the reference ground substrate 20 are shortened, which is conducive to shortening the cycle of manufacturing the microwave detection module 100, so as to further help maintain the first copper clad layer 11 and the second copper clad layer 12 of the radiation source substrate 10 of the bare copper process and the metal layer 21 of the reference ground substrate 20 from being oxidized during the manufacturing cycle of the microwave detection module 100. In addition, due to the consistency and stability of the laser welding process, the laser welding process is used to spot weld the pad 1013 and the metal layer 21 of the reference ground substrate 20, which is conducive to maintaining the second copper clad layer 12 of the radiation source substrate 10 and the metal layer 21 of the reference ground substrate 20 to maintain stable and consistent conductive fixation.

[0148] Furthermore, the radiation source 101 also has a grounding point 1012, wherein the grounding point 1012 is formed at the physical center point of the radiation source 101 and is conductively connected to the second copper clad layer 12 of the radiation source substrate 10 in the form of a metallized via. The grounding point 1012 is conductively connected to the reference ground 102 via the second copper clad layer 12 and is grounded, so as to reduce the impedance of the microwave detection module 100, thereby improving the quality factor (i.e., Q value) of the microwave detection module 100, which is beneficial to improving the anti-interference ability of the microwave detection module 100.

[0149] It can be understood that since the grounding point 1012 of the radiation source 101 is formed at the physical center point of the radiation source 101, the physical center point of the radiation source 101 is grounded to help suppress the radiation energy of the microwave detection module 100 in the radiation direction from the radiation source 101 to the reference ground 102, that is, it is helpful to suppress the sidelobe sensing distance of the microwave beam radiated by the microwave detection module 100, which is correspondingly beneficial to improve the anti-interference ability of the microwave detection module 100.

[0150] In addition, the physical center point of the radiation source 101 forms the grounding point 1012 in the form of a metallized via, so as to reduce the impedance of the microwave detection module 100 while helping to maintain the current density distribution of the radiation source 101 when being fed at the feeding point 1011, thereby helping to ensure the radiation gain of the microwave detection module 100.

[0151] It is worth mentioning that in some embodiments of the present invention, the grounding point 1012 of the radiation source 101 may also be electrically connected to the ground potential of the oscillation circuit 41 by means of a metallized via and grounded, and the present invention is not limited to this.

[0152] like Figure 5 As shown, the present invention also provides a method for manufacturing the microwave detection module 100 on another aspect. Specifically, the present invention also provides a method for manufacturing the microwave detection module 100 by a process of welding two sides at one point, comprising the following steps:

[0153] (A) A reference ground substrate 20 carrying a reference ground 102 is attached to a radiation source substrate 10 carrying a radiation source 101;

[0154] (B) placing the reference ground substrate 20 against a shielding cover 30; and

[0155] (C) The shielding cover 30 is welded to the radiation source substrate 10. When the reference ground substrate 20 and the radiation source substrate 10 are in a state of being in contact with each other and the reference ground substrate 20 and the shielding cover 30 are in a state of being in contact with each other, the shielding cover 30 and the radiation source substrate 10 are welded and fixed to each other, thereby forming a stable connection between the radiation source substrate 10, the reference ground substrate 20 and the shielding cover 30.

[0156] It is worth mentioning that the radiation source 101 has a feeding point 1011, wherein the feeding point 1011 deviates from the physical center point of the radiation source 101, wherein the direction from the feeding point 1011 to the physical center point of the radiation source 101 is defined as the polarization direction of the radiation source 101, wherein the straight line perpendicular to the polarization direction of the radiation source 101, where the physical center point of the radiation source 101 is located, is defined as an energy balance line, wherein the step (C) further includes the following steps:

[0157] (C1) two welding grooves 13 are provided on the side of the radiation source substrate 10 intersecting with the energy balance line; and

[0158] (C2) The shielding cover 30 has two welding arms 31 extending from its cover edge and corresponding to the welding grooves 13. The welding arms 31 of the shielding cover 30 are welded to the corresponding welding grooves 13 of the radiation source substrate 10 to form a stable connection between the shielding cover 30 and the radiation source substrate 10.

[0159] In particular, in order to further enhance the stability of the connection between the reference ground substrate 20 and the shielding cover 30, two mounting arms 23 are extended from both ends of the reference ground substrate 20 and a positioning hole 230 is provided on each mounting arm 23, wherein the shielding cover 30 is provided with two mounting grooves 301 and at least one positioning column 32 is extended from each mounting groove 301, wherein step (B) includes the step of positioning the reference ground substrate 10 on the shielding cover 30 by embedding the positioning hole 230 in the positioning column 32.

[0160] Furthermore, in said step (A), the following steps are further included:

[0161] (A1) Covering two opposite surfaces of the radiation source substrate 10 with a copper layer, respectively, to form a first copper-clad layer 11 and a second copper-clad layer 12 on two opposite surfaces of the radiation source substrate 10;

[0162] (A2) covering the reference ground substrate 20 with a metal layer 21; and

[0163] (A3) The second copper clad layer 12 of the radiation source substrate 10 is adhered to the metal layer 21 of the reference ground substrate 20, so that the first copper clad layer 11 of the radiation source substrate 10 forms the radiation source 101, and the metal layer 21 of the reference ground substrate 20 forms the reference ground 102.

[0164] Furthermore, since the microwave detection module 100 includes the circuit unit 40 and the circuit unit 40 is arranged on the side of the reference ground substrate 20 opposite to the side bearing the metal layer 21, the step (A) further includes a step: (A4) conductively connecting the first copper clad layer 11 of the radiation source substrate 10 and the circuit unit 40 in the form of metallized vias, thereby forming a state in which the radiation source 101 is conductively connected to the circuit unit 40.

[0165] In particular, the radiation source 101 further includes the grounding point 1012, wherein the step (A) further includes a step: (A5) forming a state in which the grounding point 1012 is conductively connected to the second copper clad layer 12 of the radiation source substrate 10 by means of a metallized via, and the radiation source 101 is conductively connected to the reference ground 102 at the grounding point 1012 and is grounded.

[0166] Furthermore, the step (A) further includes a step: (A6) covering the corresponding pad 1013 on the welding groove 13, wherein the pad 1013 is conductively connected to the second copper cladding layer 12 and conductively connected to the reference ground 102, then in the step (B), the welding arm 31 of the shielding cover 30 is welded to the pad 1013 to form a state in which the shielding cover 30 is conductively connected to the reference ground 102.

[0167] It should be understood that, in some embodiments of the present invention, the shielding cover 30 may also be welded to the reference ground substrate 20 and the radiation source substrate 10 at the same time, and the present invention is not limited to this, that is, in the step (B), it may further include the step of: welding the shielding cover 30 to the reference ground substrate 20 and the radiation source substrate 10.

[0168] It can be understood that the microwave detection module 100 of the present invention has a small size and is therefore suitable for various application scenarios, such as being applied to electrical equipment such as lamps, air conditioners, curtains, televisions, etc. to achieve intelligent control of electrical equipment. The present invention does not limit the application of the microwave detection module 100.

[0169] It can also be understood that, based on the reference ground substrate 20 being attached to the radiation source substrate 10 and being abutted against the shielding cover 30, the shielding cover 30 is welded and fixed to the radiation source substrate 10 to form a stable connection relationship between the radiation source substrate 10, the reference ground substrate 20 and the shielding cover 30, thereby simplifying the manufacturing process of the microwave detection module 100, shortening the production cycle of the microwave detection module 100, and correspondingly reducing the production cost of the microwave detection module 100. In addition, while simplifying the manufacturing process of the microwave detection module 100, the stability and consistency of the microwave detection module 100 can also be guaranteed.

[0170] It should be understood by those skilled in the art that the embodiments of the present invention described above and shown in the accompanying drawings are only examples and do not limit the present invention. The purpose of the present invention has been fully and effectively achieved. The functional and structural principles of the present invention have been demonstrated and explained in the embodiments, and the embodiments of the present invention may be deformed or modified in any way without departing from the principles.

Claims

1. A microwave detection module, characterized in that: include: a reference ground substrate, wherein the reference ground substrate carries a reference ground; A radiation source substrate, wherein the radiation source substrate carries a radiation source, wherein the reference ground is attached to the radiation source substrate in a state where the reference ground is spaced from the radiation source by the radiation source substrate, wherein the radiation source has a feeding point, wherein the feeding point deviates from the physical center point of the radiation source, wherein the direction from the feeding point to the physical center point of the radiation source is defined as the polarization direction of the radiation source, wherein a straight line on a plane where the radiation source is located and perpendicular to the polarization direction of the radiation source is defined as an energy balance line, wherein the radiation source substrate is provided with two welding grooves at side positions passing through the energy balance line; and A shielding cover, wherein the shielding cover is fixed to the radiation source substrate by being welded to the corresponding welding groove in a state of being abutted against the reference ground substrate. Then, when the reference ground substrate is attached to the radiation source substrate and abutted against the shielding cover, the radiation source substrate is welded and fixed to the shielding cover at the welding groove, thereby forming a stable connection relationship among the radiation source substrate, the reference ground substrate and the shielding cover.

2. The microwave detection module according to claim 1, wherein the radiation source substrate has a first copper clad layer and a second copper clad layer respectively arranged on two opposite sides of the radiation source substrate, wherein the reference ground substrate is provided with a metal layer, wherein the metal layer is conductively bonded to the second copper clad layer of the radiation source substrate so that the first copper clad layer of the radiation source substrate forms the radiation source, and the metal layer of the reference ground substrate forms the reference ground.

3. The microwave detection module according to claim 2, wherein the radiation source substrate is further provided with two soldering pads, wherein the two soldering pads are covered on the inner walls of the corresponding welding grooves and conductively connected to the second copper clad layer of the radiation source substrate, and the soldering pads are conductively connected to the metal layer of the reference ground substrate via the second copper clad layer, so that when the radiation source substrate is welded and fixed to the shielding cover via the soldering pads in the welding groove, the shielding cover is conductively connected to the reference ground and grounded, so as to enhance the electromagnetic shielding effect of a shielding space formed by the shielding cover.

4. The microwave detection module according to claim 3, wherein the shielding cover is provided with two mounting grooves, wherein two mounting arms are extended from both ends of the reference ground substrate, wherein the two mounting arms protrude from the shielding cover at the positions of the mounting grooves to form a state in which the reference ground substrate is abutted against the shielding cover in a direction perpendicular to the reference ground, and when the shielding cover is welded to the radiation source substrate, the reference ground substrate is clamped and fixed between the shielding cover and the radiation source substrate.

5. The microwave detection module according to claim 4, wherein the shielding cover has a welding arm extending from its cover at positions corresponding to the two welding grooves, wherein the shielding cover is welded to the corresponding welding pad via the welding arm in a state of abutting against the reference ground substrate and is fixed to the radiation source substrate.

6. The microwave detection module according to claim 5, wherein the shielding cover extends from the mounting groove to form at least one positioning column, wherein the mounting arms of the reference ground substrate are respectively provided with at least one positioning hole, wherein the mounting arms of the reference ground substrate are embedded in the positioning columns of the shielding cover in the positioning holes. 7 . The microwave detection module according to claim 6 , wherein the mounting arm of the reference ground plate is provided with a plurality of welding terminals. 8 . The microwave detection module according to claim 7 , wherein in the direction of the energy balance line, the size of the radiation source substrate is set to correspond to the size of the shielding cover and is larger than the size of the reference ground substrate. 9 . The microwave detection module according to claim 8 , wherein one end of the welding arm welded to the welding groove is bent to guide the flow of solder. 10 . The microwave detection module according to claim 9 , wherein a top cross-sectional shape of the welding groove is set to be an arc shape or a triangle shape.

11. The microwave detection module according to any one of claims 2 to 10, wherein the radiation source has a grounding point, wherein the grounding point is formed at the physical center of the radiation source, and wherein the radiation source is grounded because the grounding point is electrically connected to the reference ground.

12. The microwave detection module according to claim 11, wherein the first copper clad layer of the radiation source is conductively connected to the second copper clad layer at the grounding point in the form of a metallized via, corresponding to a state in which the radiation source is electrically connected to the reference ground from the grounding point and is grounded. 13 . The microwave detection module according to claim 3 , wherein the second copper clad layer of the radiation source substrate is evenly attached to the metal layer of the reference ground substrate.

14. The microwave detection module according to claim 13, wherein the radiation source substrate and the reference ground substrate are fixed to each other by a pressed plate structure and process so that the second copper clad layer of the radiation source substrate is flatly attached to the metal layer of the reference ground substrate.

15. The microwave detection module according to claim 13, wherein the microwave detection module further comprises a circuit unit, wherein the circuit unit is arranged on a side of the reference ground substrate opposite to a side bearing the reference ground, and is accommodated in the shielding space formed by the shielding cover, wherein the radiation originates from the feeding point and is conductively connected to the circuit unit in the form of a metallized via.

16. The microwave detection module according to claim 15, wherein the circuit unit comprises an oscillating circuit and a mixer-detection circuit, wherein the radiation originates from the feeding point being conductively connected to the oscillating circuit in the form of a metallized via, and wherein the mixer-detection circuit is electrically connected to the oscillating circuit.

17. The microwave detection module according to claim 15, wherein the radiation source substrate has a first side surface, a second side surface opposite to the first side surface, a first polarization plane connecting the first side surface and the second side surface, and a second polarization plane opposite to the first polarization plane, wherein the first side surface and the second side surface are two opposite surfaces of the radiation source substrate passing through the energy balance line, wherein the reference ground substrate has a third side surface, a fourth side surface opposite to the third side surface, a third polarization plane connecting the third side surface and the fourth side surface, and a fourth polarization plane opposite to the third polarization plane, wherein the first side surface, the second side surface, the first polarization plane and the second polarization plane of the radiation source substrate respectively correspond to the positions of the third side surface, the fourth side surface, the third polarization plane and the fourth polarization plane of the reference ground substrate. 18 . The microwave detection module according to claim 17 , wherein the welding groove of the radiation source substrate is formed on the first side surface and the second side surface of the radiation source substrate. 19 . The microwave detection module according to claim 18 , wherein the metal layer of the reference ground substrate extends to cover at least one of the third side surface, the fourth side surface, the third polarization plane, and the fourth polarization plane of the reference ground substrate.

20. The microwave detection module according to claim 19, wherein the metal layer of the reference ground substrate extends to cover the third side surface, the fourth side surface, the third polarization plane and the fourth polarization plane of the reference ground substrate to form a metal edging, wherein the shielding cover is welded to the radiation source substrate in a state of wrapping the metal edging. 21 . The microwave detection module according to claim 18 , wherein the side surfaces of the radiation source corresponding to the first side surface and the second side surface of the radiation source substrate are configured as concave surfaces.

22. The microwave detection module according to claim 21, wherein the length of the side of the radiation source passing through the polarization direction of the radiation source is set as a parameter L1, wherein the numerical range of the parameter L1 is: λ / 5≤L1≤λ / 2, wherein λ is the wavelength of the microwave generated by the microwave detection module.

23. The microwave detection module according to claim 22, wherein the parameter L1 is set to be close to 13 mm. 24 . The microwave detection module according to claim 23 , wherein in the direction of the energy balance line, the size of the radiation source substrate is set to be consistent with the maximum size of the radiation source and tends to be 13 mm.

25. The microwave detection module according to claim 22, wherein the length of the side of the radiation source passing through the energy balance line is set as a parameter L2, wherein the numerical range of the parameter L2 is: λ / 5≤L2≤λ / 2, wherein λ is the wavelength of the microwave generated by the microwave detection module.

26. The microwave detection module according to claim 25, wherein the parameter L2 is set to be close to 13 mm.

27. The microwave detection module according to claim 25, wherein in a direction perpendicular to the reference ground substrate, the distance from the circuit unit to the bottom inner side surface of the shielding cover is set as parameter H1, wherein the numerical range of the parameter H1 is: H1≥λ / 16, wherein λ is the wavelength of the microwave generated by the microwave detection module.

28. The microwave detection module according to claim 27, wherein the radiation source and the reference ground have a preset distance in the polarization direction of the radiation source, wherein the preset distance is set to a parameter L4, wherein the numerical range of the parameter L4 is set to: L4≥λ / 16, wherein λ is the wavelength of the microwaves generated by the microwave detection module.

29. The microwave detection module according to claim 28, wherein the length of the side of the reference ground in the polarization direction is set as a parameter L5, wherein the numerical range of the parameter L5 is set to: L5≥λ / 8, wherein λ is the wavelength of the microwave generated by the microwave detection module.

30. According to the microwave detection module of claim 27, wherein the microwave detection module is configured to operate in a 5.8 GHz frequency band, the numerical range of the parameter H1 satisfies: H1 ≥ 3.2 mm, wherein the thickness of the reference ground substrate approaches 0.5 mm, wherein the thickness of the radiation source substrate approaches 1.0 mm, wherein the overall thickness of the microwave detection module is assumed to be parameter H2, then the numerical range of the parameter H2 satisfies: 4.0 mm ≤ H2 ≤ 8.0 mm.

31. The microwave detection module according to claim 30, wherein along the polarization direction, the size of the radiation source substrate is set to be consistent with the size of the shielding cover, wherein the size of the radiation source substrate along the polarization direction is set to be a parameter L6, wherein the parameter L6 is set to approach 16 mm.

32. A method for manufacturing a microwave detection module, characterized in that: The following steps are involved: (A) attaching a reference ground substrate carrying a reference ground to a radiation source substrate carrying a radiation source; (B) contacting the reference ground plate to a shielding cover; and (C) Welding the shielding cover to the radiation source substrate, then in a state where the reference ground substrate and the radiation source substrate are in contact with each other, the shielding cover and the radiation source substrate are welded and fixed to form a stable connection between the radiation source substrate, the reference ground substrate and the shielding cover, wherein the radiation source has a feeding point, wherein the feeding point deviates from the physical center point of the radiation source, wherein the direction from the feeding point to the physical center point of the radiation source is defined as the polarization direction of the radiation source, wherein the straight line perpendicular to the polarization direction of the radiation source, where the physical center point of the radiation source is located, is defined as an energy balance line, wherein the step (C) further includes the following steps: (C1) two welding grooves are provided on the side of the radiation source substrate intersecting with the energy balance line; and (C2) The shielding cover is formed with two welding arms corresponding to the welding grooves extending from its cover edge, and the welding arms of the shielding cover are welded to the corresponding welding grooves of the radiation source substrate to form a stable connection between the shielding cover and the radiation source substrate.

33. The method according to claim 32, wherein two mounting arms are extended from both ends of the reference ground substrate and a positioning hole is provided on each mounting arm, wherein the shielding cover is provided with two mounting grooves and at least one positioning column is extended from each mounting groove, wherein step (B) includes the step of positioning the reference ground substrate on the shielding cover by embedding the positioning hole in the positioning column.

34. The method according to claim 32 or 33, wherein in the step (A), further comprising the following steps: (A1) covering two opposite surfaces of the radiation source substrate with a copper layer, respectively, to form a first copper-clad layer and a second copper-clad layer, respectively, on two opposite surfaces of the radiation source substrate; (A2) covering the reference ground substrate with a metal layer; and (A3) The second copper clad layer of the radiation source substrate is bonded to the metal layer of the reference ground substrate, so that the first copper clad layer of the radiation source substrate forms the radiation source, and the metal layer of the reference ground substrate forms the reference ground.

35. The method according to claim 34, wherein the microwave detection module further comprises a circuit unit, wherein the circuit unit is arranged on a side of the reference ground substrate opposite to the side bearing the metal layer, wherein in the step (A), a step is further included: (A4) conductively connecting the first copper clad layer of the radiation source substrate and the circuit unit in the form of metallized vias, thereby forming a state in which the radiation source is conductively connected to the circuit unit.

36. The method according to claim 35, wherein the radiation source further includes a grounding point, wherein in the step (A), a step is further included: (A5) forming a state in which the grounding point is conductively connected to the second copper clad layer of the radiation source substrate by means of a metallized via, and the radiation source is grounded by being conductively connected to the reference ground by the grounding point.

37. The method according to claim 36, wherein the step (A) further comprises a step: (A6) covering the corresponding pad on the welding groove, wherein the pad is conductively connected to the second copper cladding layer and conductively connected to the reference ground, then in the step (C), the welding arm of the shielding cover is welded to the pad to form a state in which the shielding cover is conductively connected to the reference ground.

Images