Base for the optical element drive mechanism

Abstract

The present invention discloses a base for an optical element drive mechanism, comprising a base plate having a central hole formed in the middle thereof to mate with an opening of a carrier. Surrounding the central hole are two mutually facing base portions, a first side portion and a second side portion, formed around the central hole. A first baffle is provided in the middle of the first side portion, forming a first central notch in the middle of the first baffle and first side notches on either side of the first baffle. A second baffle is provided in the middle of the second side portion, forming a second central notch in the middle of the second baffle and second side notches on either side of the second baffle. The second central notch mates with a second memory alloy mounting portion on the carrier, and the second side notches mate with a wire clamp of the optical element drive mechanism. The present invention can provide maximum thrust, resolving the problem of insufficient thrust.

Description

Technical Field

[0001] The present invention relates to the technical field of optical imaging equipment, and in particular to a base of an optical element driving mechanism. Background Art

[0002] With the widespread adoption of smartphones, mobile phone cameras are increasingly being used. However, current lens drive mechanisms are subject to electromagnetic interference, and auxiliary components such as ball bearings and suspension wires are complex, requiring complex assembly and low reliability. Sensors are also required to assist in actual operation. Most current memory alloy drive solutions utilize a single memory alloy, or two memory alloys positioned one above the other. Single-directional thrust is insufficient to meet current market demands. Summary of the Invention

[0003] The object of the present invention is to provide a base for an optical element driving mechanism to help solve the above-mentioned problems in the prior art.

[0004] In order to solve the above problems, according to one aspect of the present invention, a base of an optical element driving mechanism is provided, wherein the base includes a bottom plate, a central hole is formed in the middle of the bottom plate to cooperate with the cylindrical opening of the carrier of the optical element driving mechanism, two mutually facing first side portions of the base and two mutually facing second side portions of the base are formed around the central hole, the first side portion of the base cooperates with the first group of memory alloys of the optical element driving mechanism, and the second side portion of the base cooperates with the second group of memory alloys of the optical element driving mechanism.

[0005] A first baffle extending upward from the bottom plate is provided in the middle of the first side portion, a first middle notch is formed in the middle of the first baffle to cooperate with the first memory alloy mounting portion on the carrier, and first two side notches are formed on both sides of the first baffle.

[0006] A second baffle extending upward from the base plate is provided in the middle of the second side portion, a second middle notch is formed in the middle of the second baffle, and second two side notches are formed on both sides of the second baffle. The second middle notch cooperates with the second memory alloy mounting portion on the carrier, and the second two side notches cooperate with the wire clamp of the optical element driving mechanism.

[0007] In one embodiment, the inner wall of the first baffle is provided with a first step portion, which extends from the first two side notches to the first middle notch and is inclined downward from the first two side notches to the first middle notch, and the inner wall of the second baffle is provided with a second step portion, which extends from the second middle notch to the second two side notches and is inclined downward from the second middle notch to the second two side notches.

[0008] In one embodiment, the width of the first two side notches of the first side portion is smaller than the width of the first middle notch and the notches are disposed adjacent to corners of the base.

[0009] In one embodiment, the width of the second two side notches of the second side portion is greater than the width of the second middle notch and the notches are disposed adjacent to corners of the base.

[0010] In one embodiment, the inclination of the first step portion is greater than the inclination of the second step portion.

[0011] In one embodiment, a corner of the base is formed between the first side portion and the second side portion, and a wire clamp mounting portion is provided on the inner side of the corner of the base for mounting a wire clamp of the optical element driving mechanism.

[0012] In one embodiment, a boss is provided on the outer side of the wire clamp mounting portion to serve as a lower spring mounting portion, wherein the boss is formed by extending a certain distance upward from the bottom plate.

[0013] In one embodiment, the height of the boss is smaller than the height of the first baffle on the first side and smaller than the height of the second baffle on the second side. In one embodiment, a lower spring fixing column is provided on the upper surface of the boss.

[0014] In one embodiment, the base is further provided with a base-embedded metal sheet, and the base-embedded metal sheet electrically connects the external circuit with the memory alloy component of the optical element driving mechanism.

[0015] In one embodiment, the base further includes a wire clamp, which is installed on the wire clamp installation portion of the base and is connected to the metal sheet circuit embedded in the base.

[0016] The unique design of the base of the optical element driving mechanism of the present invention enables the optical element driving mechanism to be driven by two memory alloys in each direction, a total of four memory alloys, which can provide the optical element driving mechanism with maximum thrust and solve the problem of insufficient thrust of the optical element driving mechanism. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 is an exploded perspective view of a lens driving mechanism according to an embodiment of the present invention;

[0018] Figure 2 is a perspective view of a frame according to an embodiment of the present invention;

[0019] Figure 3 is a perspective view of a carrier according to an embodiment of the present invention, showing a surface of the carrier facing the base;

[0020] Figure 4 yes Figure 3 A top view of a carrier;

[0021] Figure 5 is a perspective view of a base according to an embodiment of the present invention;

[0022] Figure 6 is a perspective view of an upper spring according to an embodiment of the present invention;

[0023] Figure 7 is a perspective view of a lower spring according to an embodiment of the present invention;

[0024] Figure 8 is a top view of a base with a lower spring installed according to an embodiment of the present invention;

[0025] Figure 9A-9B is a three-dimensional diagram of a protective buckle according to an embodiment of the present invention from different viewing angles;

[0026] Figure 10 is a perspective view of a wire clamp according to one embodiment of the present invention;

[0027] Figure 11 is a perspective view of a lens driving mechanism according to an embodiment of the present invention, wherein the upper spring and the outer shell are removed;

[0028] Figure 12 A top view of a lens drive mechanism according to an embodiment of the present invention, with the housing removed;

[0029] Figure 13 is a perspective view of a lens drive mechanism according to one embodiment of the invention, with the outer casing removed;

[0030] Figure 14 yes Figure 13 A front view of the lens drive mechanism; and

[0031] Figure 15 yes Figure 13 Right side view of the lens drive mechanism. DETAILED DESCRIPTION

[0032] The preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings so that the objects, features and advantages of the present invention can be more clearly understood. It should be understood that the embodiments shown in the accompanying drawings are not intended to limit the scope of the present invention, but are only intended to illustrate the essential spirit of the technical solution of the present invention.

[0033] In the following description, for the purpose of illustrating the various disclosed embodiments, certain specific details are set forth in order to provide a thorough understanding of the various disclosed embodiments. However, those skilled in the relevant art will recognize that the embodiments may be practiced without one or more of these specific details. In other cases, well-known devices, structures, and techniques associated with this application may not be shown or described in detail to avoid unnecessarily obscuring the description of the embodiments.

[0034] Reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment. Thus, the appearances of "in one embodiment" or "in an embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any manner in one or more embodiments.

[0035] In the following description, in order to clearly show the structure and working mode of the present invention, many directional words will be used for description, but words such as "front", "back", "left", "right", "outside", "inside", "outward", "inward", "up", and "down" should be understood as convenient terms and should not be understood as restrictive terms.

[0036] Figure 1 FIG is a perspective exploded view of a lens driving mechanism 100 according to an embodiment of the present invention. Figure 1 As shown, the lens drive mechanism of the present invention generally includes a housing 10, an upper spring 20, a frame 30, a carrier 40, a protective buckle 50, a memory alloy assembly 60, a lower spring 70, a wire clamp 90, a base 80, and a base metal sheet 80B. The upper spring 20, frame 30, carrier 40, protective buckle 50, memory alloy assembly 60, lower spring 70, and wire clamp 90 are installed in the space defined by the housing 10 and the base 50. Specifically, the upper end of the carrier 40 is movably connected to the frame 30 via the upper spring 20. The first portion of the upper spring 20 is connected to the upper end of the carrier 40, and the second portion is connected to the frame 30. The base embedded metal sheet 80B is embedded in the base 80, and the lower end of the carrier 40 is movably connected to the base 80 via the lower spring 70. The memory alloy assembly 60 includes a first group of memory alloys 61 and a second group of memory alloys 62, respectively disposed on opposite sides of the carrier 40. These groups drive the carrier 40 in a direction perpendicular to the base 80 and frame 30, thereby achieving zooming. By utilizing four memory alloys, two in each direction, the drive mechanism provides maximum thrust, addressing the issue of insufficient thrust. The following describes in detail the various components of the lens drive mechanism 100 according to one embodiment of the present invention.

[0037] Figure 2 This is a perspective view of the frame 30. Figure 2 The frame 30 is described in detail. Figure 2 As shown, the frame 30 is generally formed into a rectangular or square frame structure and includes two pairs of opposing first side portions 31 and second side portions 32. Corner portions 33 are formed between the first side portions 31 and the second side portions 32. A side of each corner portion 33 facing the housing 10 forms a frame spring mounting portion 34. The frame spring mounting portion 34 generally forms a right-angled triangle block, with two right-angled sides of the right-angled triangle block connected to the inner surfaces of the first side portion 31 and the second side portion 32, respectively, and is preferably formed integrally.

[0038] The first side portion 31 of the frame cooperates with the first side portion of the base, the first side portion 41 of the carrier, and the first set of memory alloys 61. A first side drive clearance groove 311 is formed approximately in the middle of the first side portion 31, and first side wire clamp clearance grooves 312 are formed at both ends of the first side portion 31. A frame step portion is formed on the inner surface of the first side portion 31. The step portion is located near the top of the first side portion 31 and serves as a mounting portion 313 for the first set of memory alloys. The height of the first set of memory alloy mounting portions 313 gradually decreases from the middle to the ends, forming an upwardly convex arc-shaped structure. The middle of this arc is interrupted by the first side drive clearance groove 311, and the ends of the arc extend to the first side wire clamp clearance groove 312. Those skilled in the art will appreciate that the memory alloy mounting portion 313 can also be formed as an inclined surface or other similar structure that slopes from the middle to the ends.

[0039] The second side portion 32 of the frame mates with the second side portion of the carrier and the second group of memory alloys. A second side drive avoidance groove 321 is formed approximately in the middle of the second side portion 32. The second side wire clamp avoidance portions 322 are formed at both ends of the second side portion 32. The inner surface of the second side portion 32 (i.e., the surface closest to the carrier) forms a stepped portion, which forms a mounting portion 323 for the second group of memory alloys. The mounting portion 323 is a downwardly concave arc. Specifically, the arc slopes from the second side wire clamp avoidance positions 322 at both ends toward the center, forming its lowest point in the second side drive avoidance groove 321. The second group of memory alloys 62 are connected to the wire clamps at both ends and mate with the second side wire clamp avoidance portions 322. The main body of the second group of memory alloys 62 mates with the mounting portion 323 for the second group of memory alloys. This will be described in further detail below.

[0040] Continue to refer to Figure 2The height of the frame spring mounting portion 34 is higher than the height of the second frame side portion 32, and the bottom surface of the second frame side wire clamp avoidance portion 322 is coplanar with the top surface of the second frame side portion 32. In other words, the top surface of the second frame side portion 32 extends left and right to form the bottom surface of the second frame side wire clamp avoidance portion 322. Each of the four corners 33 is provided with a column 331, which is higher than the height of the first frame side portion 31, the second frame side portion 32, and the frame spring mounting portion 34. When the housing is mounted on the frame, the columns 331 provide protection for the upper spring and other components.

[0041] Figure 3 is a perspective view of the carrier 40, which shows the surface of the carrier 40 facing the base, and the following reference Figure 3 The carrier 40 is described in detail. Figure 3 As shown, a cylindrical opening 400 is formed inside the carrier 40, and the cylindrical opening 400 is used to install a lens (not shown in the figure). A first carrier side portion 41 and a second carrier side portion 42 are formed around the cylindrical opening 400. The first carrier side portion 41 corresponds to the first side portion 31 of the frame and the first side portion 81 of the base and is used to install the first group of memory alloys 61. The second carrier side portion 42 corresponds to the second side portion 32 of the frame and the second side portion 82 of the base and is used to install the second group of memory alloys 62.

[0042] The first side portion 41 of the carrier is provided with a first memory alloy mounting portion 411. In one embodiment, the first memory alloy mounting portion 411 is preferably located in the center of the first side portion 41. The first memory alloy mounting portion 411 includes a first protrusion 412 that protrudes outward from the side surface of the carrier. A wire groove 413 is provided on the surface of the first protrusion 412 facing the base to accommodate the first group of memory alloys 61. A first straight groove 414 is provided in the center of the first protrusion 412 to engage with the protective buckle 50. A first protrusion 415 is provided within the first straight groove 414 to engage with the fixing hole 53 of the protective buckle 50 to position and secure the protective buckle 50. First blocks 416 extending in the vertical direction are formed on both sides of the first straight groove 415. A first curved portion 417 is formed in the center of the first wire groove 413. The first group of memory alloys 61 is mounted within the first wire groove 413 and surrounds the first curved portion 417. The first curved portion 417 protrudes toward the base. A protective buckle fixing groove 418 is provided on the surface of the carrier 40 close to the first arc-shaped portion 417, and the protective buckle 50 is installed in the first straight groove 415. The fixing hole 53 in the middle cooperates with the first protrusion 415, and the upper and lower ends are respectively cooperated and fixed with the protective buckle fixing groove 418 and the corresponding end faces of the first protrusion 412, so that the protective buckle 50 is detachably connected to the first memory alloy mounting portion 411 and the first group of memory alloys 61 is confined in the first wire groove 413.

[0043] The two opposite first side portions 41 of the carrier 40 are each provided with a memory alloy mounting portion 411. The first memory alloy mounting portions 411 provided on the two first side portions 41 are substantially identical in structure, shape and function. When the first group of memory alloys defined in the wire grooves are energized, they cooperate to drive the carrier in a direction away from the base, i.e., toward the Figure 3 The lower side shown, that is, the direction of the housing moves along the optical axis of the lens.

[0044] Continue to refer to Figure 3 The second side portion 42 is provided with a second memory alloy mounting portion 421, the second memory alloy mounting portion 421 includes a second protruding portion 422 protruding outward from the side surface of the carrier, and the end surface of the second protruding portion 422 away from the base (ie Figure 3 The lower end surface of the protrusion shown in the figure is provided with a second wire groove 423 to accommodate the second group of memory alloy 62. The middle part of the second protrusion 422 is provided with a second straight groove 424 to cooperate with the protective buckle 50. A second protrusion 425 is provided in the second straight groove 424. The second protrusion 425 is used to cooperate with the fixing hole 53 of the protective buckle 50 to position and fix the protective buckle 50. Second blocks 426 extending in the vertical direction are formed on both sides of the second straight groove 425. A second arc portion 427 is formed in the middle of the second wire groove 423. The second arc portion 427 protrudes in a direction away from the base, that is, toward Figure 3 As shown, the second set of memory alloys 62 is installed in the wire groove 423 and is arranged around the second arc portion 427. The bottom of the second straight groove 425 near the base is provided with a snap-fit fixing portion 428, which is provided from the surface of the carrier 40 facing the base (i.e. Figure 3 The upper surface shown) is extended outward to form a protective buckle 50 installed in the second straight groove 425, wherein the fixing hole 53 of the protective buckle 50 cooperates with the second protrusion 425 and its upper and lower ends are respectively fixed with the snap fixing portion 428 and the lower end surface of the second protrusion 422, thereby detachably connecting the protective buckle 50 to the second memory alloy mounting portion 421 and confining the second group of memory alloys 62 in the second wire groove 423.

[0045] The two opposite second side portions 42 of the carrier 40 are each provided with a memory alloy mounting portion 421. The second memory alloy mounting portions 421 provided on the two second side portions 42 are substantially identical in structure, shape and function. When the second group of memory alloys defined in the wire grooves are energized, they cooperatively drive the carrier toward the base along the optical axis of the lens, i.e., toward the base. Figure 3 By driving the first group of memory alloys installed on the first side of the carrier and the second group of memory alloys installed on the second side of the carrier, the carrier can be driven to and fro along the optical axis, thereby achieving the function of optical zoom.

[0046] Continue to refer to Figure 3The surface of the carrier 40 facing the base is provided with a lower spring fixing portion 44, which is provided with a lower spring fixing column 441. The lower spring fixing portion 44 is preferably provided on the lower surface of the second side portion 42 (the surface facing the base), and preferably two lower spring fixing columns 44 are provided on the lower surface of each side portion 22. A transition side portion 43 is provided between the first side portion 41 and the second side portion 42. The first side portion 41, the second side portion 42, and the transition side portion 43 collectively form the regular hexagonal structure of the carrier 40. Notches 431 are provided on the upper and lower surfaces of the transition side portion 43. A support portion 432 is provided in the notch 431 facing the base 80, and the support portion 432 protrudes toward the base 80.

[0047] Figure 4 FIG. 4 is a top view of the carrier 40, which shows the surface of the carrier 40 away from the base 80, that is, the surface facing the housing 10. Figure 4 As shown, the surface of the carrier 80 facing away from the base 80 is provided with a plurality of carrier upper spring mounting portions 45. The carrier upper spring mounting portions 45 are provided with upper spring positioning holes 451. The upper spring positioning holes 451 align with the carrier fixing portion 211 of the upper spring 20 to position the upper spring 20 on the carrier 40. In one embodiment, the upper spring positioning holes 451 are distributed on the upper surfaces of the first side portion 41 and the second side portion 42 of the carrier 40 (i.e., the surface facing away from the base). The surface of the carrier 40 facing away from the base 80 is also provided with a clearance block 46. When the upper spring 20 is mounted on the carrier 40, the clearance block 46 is formed to protrude a certain distance from the upper surface of the carrier 40 in a direction away from the base. In one embodiment, the avoidance block 46 is disposed above the first side portion 41 and the second side portion 42 of the carrier 40. In one embodiment, an upper spring positioning hole 451 and a avoidance block 46 are respectively provided on the upper surface of the first side portion 41 and the second side portion 42. Preferably, the upper spring positioning holes 451 and the avoidance block 46 are spaced apart on the surface of the carrier 40 away from the base 80, that is, one positioning hole 451 and one avoidance block 46 are disposed around the cylindrical opening 400. Preferably, the positioning holes 451 and the avoidance block 46 are evenly spaced apart on the surface of the carrier 40 away from the base, around the cylindrical opening 400.

[0048] Figure 5 This is a three-dimensional diagram of the base 80, combined with Figure 5 The base 80 is described in detail. Figure 5As shown, the base 80 forms a rectangular structure as a whole and includes a bottom plate 80A. A central hole 800 is formed in the middle of the bottom plate 80A to cooperate with the cylindrical opening 400 of the carrier 40. Two mutually facing base first side portions 81 and two mutually facing base second side portions 82 are formed around the central hole 800. The base first side portion 81 cooperates with the carrier first side portion 41, the frame first side portion 31 and the first group of memory alloys 61, and the base second side portion 82 cooperates with the carrier second side portion 42, the frame second side portion 32 and the second group of memory alloys 62.

[0049] A first baffle 813 is provided in the middle of the first side portion 81, extending upward (i.e., toward the housing) from the base plate 80A. A first central notch 811 is formed in the middle of the first baffle 813, and first side notches 812 are formed on either side of the first baffle 813. The first central notch 811 mates with the first memory alloy mounting portion 41 on the carrier 40, thereby avoiding the first memory alloy mounting portion 411. The first side notches 812 are narrower than the first central notch 811 and are located adjacent to the corner 83. A first step 814 is provided on the inner wall of the baffle 813 near the center hole 800. The first step 814 extends from the first side notches 812 to the first central notch 811 and slopes downward from the first side notches 812 toward the first central notch 811, resulting in a higher position near the first side notches 812 and a lower position near the first central notch 811. The first group of memory alloys 61 mounted on the first memory alloy mounting portion 411 of the carrier 40 is arranged on the step portion 814 and extends on the first step portion 814. It is fixed to the base 80 at both ends by first wire clamps 91 and is connected to the circuit of the base embedded metal sheet 80B, so that current is introduced into the first group of memory alloys 61 through the base embedded metal sheet 80B to drive the carrier 40 to move along the optical axis in the direction away from the base, which will be described in detail below.

[0050] The second side portion 82 of the base 80 is similar to the first side portion 81, differing primarily in the direction and degree of inclination of the stepped portion. Specifically, a second baffle 823 is provided in the middle of the second side portion 82, extending upward from the base plate 80A (i.e., toward the housing). A second central notch 821 is formed in the middle of the second baffle 823, and second side notches 822 are formed on either side of the second baffle 823. The second central notch 821 mates with the second memory alloy mounting portion 42 on the carrier 40, thereby providing clearance for the second memory alloy mounting portion 421. The second side notches 822 are wider than the second central notch 821 and are located adjacent to the corner 83, providing clearance for the second wire clamp 92. A second step 824 is provided on the inner wall of the baffle 823 near the center hole 800. The second step 824 extends from the second side notches 822 to the second central notch 821 and slopes downward from the second central notch 821 toward the second side notches 822, resulting in a higher portion near the second central notch 821 and a lower portion near the second side notches 822. The second group of memory alloys 62, mounted on the second memory alloy mounting portion 421 of the carrier 40, is arranged on and extends over the second step 824. Both ends are secured to the base 80 via wire clamps 90 and communicate with the base's embedded metal sheet 80B. This allows current to be introduced into the second group of memory alloys 62 through the base's embedded metal sheet 80B, driving the carrier 40 to move along the optical axis toward the base. This will be described in detail below.

[0051] In one embodiment, the inclination of the first step portion 814 is greater than the inclination of the second step portion 824 .

[0052] The first and second sides of the base are connected by a base corner 83. Each base corner 83 has the same structure and function, and we will now describe one of these. A wire clamp mounting portion 831 is provided on the inside of the base corner 83. A boss 832 is provided on the outside of the wire clamp mounting portion 831 to serve as the mounting portion for the lower spring. The boss 832 extends upward from the base plate 80A a distance that is less than the height of the first stopper 811 of the first side 81 and the second stopper 821 of the second side 81. A wire clamp fixing post 833 is provided on the surface of the wire clamp mounting portion 831, and a base lower spring fixing post 834 is provided on the upper surface of the boss 832. The fixing holes 915 of the first wire clamp 91 or the fixing holes 925 of the second wire clamp 92 engage with the wire clamp fixing post 833, thereby securing the wire clamp 90 to the wire clamp mounting portion 831. In one embodiment, the wire clamp 90 can be secured to the base by methods such as heat riveting. The base fixing hole 715 of the lower spring 70 cooperates with the lower spring fixing column 834 of the base 80, thereby fixing the base connection portion of the lower spring 70 to the base 80. The base embedded metal sheet 80B is embedded in the interior of the base 80 and provides circuit connection for the memory alloy group 60.

[0053] Figure 6 This is a perspective view of the upper spring 20, see Figure 6 The upper spring 20 is described in detail. Figure 6 As shown, the upper spring 20 generally includes a first portion 21 located on the inner ring and a second portion 22 located on the outer ring. The first portion 21 and the second portion 22 are connected by an elastic strip 23, allowing a certain range of movement between the first portion 21 and the second portion 22. The first portion 21 located on the inner ring is connected to the carrier 40, and the second portion 22 located on the outer ring is connected to the frame 30, thereby movably connecting the carrier 40 and the frame 30 through the upper spring 20.

[0054] In one embodiment, the first portion 21 comprises a closed ring body 210 with upper spring carrier connecting portions 211 equidistantly disposed thereon. The upper spring carrier connecting portions 211 are provided with a plurality of connecting holes 212, thereby being secured to the upper spring positioning holes 45 of the carrier 40 by means of, for example, gluing. The second portion 22 comprises independent frame connecting portions 221 located at the four corners of the upper spring 20. The frame connecting portions 221 are provided with frame connecting holes 222. The frame connecting portions 221 of the upper spring 20 mate with the frame spring mounting portions 34 of the frame 30 and are secured to each other by, for example, gluing.

[0055] Figure 7 is a three-dimensional diagram of the lower reed 70, Figure 8 This is a top view of the base with the lower spring installed. Figure 7-Figure 8 The lower spring 70 is described in detail. Figure 7-8As shown, the lower spring 70 as a whole comprises a first portion 71 and a second portion 72, which are independent of each other. The first portion 71 includes a carrier connection portion 711 located in the middle and base connection portions 712 located at both ends. The carrier connection portion 711 and the base connection portion 712 are connected by elastic strips 713, allowing the carrier connection portion 711 and the base connection portion 712 to move relative to each other within a certain range. The carrier connection portion 711 is mounted on the lower spring connection portion 44 on the lower surface of the carrier 40. In one embodiment, the carrier connection portion 711 is provided with a carrier connection hole 714 to mate with the lower spring fixing post 441 on the carrier 40, so that the lower spring fixing post 441 extends into the carrier connection hole 714, thereby fixing the first portion 71 of the lower spring 70 to the carrier 40. The base connection portions 712 located at both ends mate with the bosses 832 on the base 80. In one embodiment, the base connection portion 712 is provided with a base fixing hole 715, which engages with a lower spring fixing post 834 on the boss 832. Inserting the lower spring fixing post 834 into the base fixing hole 715 secures the first portion 71 of the lower spring 70 to the base 80. Because the carrier connection portion 711 and the base connection portion 712 are connected by an elastic strip, the carrier 40 and the base 80 can move relative to each other.

[0056] The second portion 72 includes a carrier connection portion 721 located in the middle and base connection portions 722 located at both ends. The carrier connection portion 721 and the base connection portion 722 are connected by elastic strips 723, allowing the carrier connection portion 721 and the base connection portion 722 to move relative to each other within a certain range. The carrier connection portion 721 is mounted on the lower spring connection portion 44 on the lower surface of the carrier 40. In one embodiment, the carrier connection portion 721 is provided with a carrier connection hole 724, which cooperates with the lower spring fixing column 441 on the carrier 40. The lower spring fixing column 441 is extended into the carrier connection hole 724, thereby fixing the second portion 72 of the lower spring 70 to the carrier 40. The base connection portions 722 located at both ends cooperate with the bosses 832 on the base 80. In one embodiment, the base connection portion 722 is provided with a base fixing hole 725, which engages with a lower spring fixing post 834 on the boss 832. The lower spring fixing post 834 is inserted into the base fixing hole 725, thereby fixing the second portion 72 of the lower spring 70 to the base 80. Because the carrier connection portion 721 and the base connection portion 722 are connected by an elastic strip 723, the carrier 40 and the base 80 can move relative to each other.

[0057] In one embodiment, the second portion 72 and the first portion 71 have identical structure and shape, and together they form a rectangular structure, with the base connection portions located at the four corners and the carrier connection portions located at two opposing sides. In one embodiment, the carrier connection portions of the first and second portions 71 and 72 engage with the lower spring mounting portion 44 provided on the lower surface of the second side portion 42 of the carrier 40, and the base connection portions of the first and second portions 71 and 72 engage with the bosses 832 on the four corners of the base 80, thereby achieving a movable connection between the lower end of the carrier 40 and the base 80 via the first and second portions 71 and 72.

[0058] Figure 9A-9B 50 are three-dimensional images from different viewing angles. Figure 9A-9B As shown, the protective buckle 50 includes a protective buckle body 51, with snap portions 52 provided at both ends of the protective buckle body 51, and a mounting hole 53 provided in the middle of the protective buckle body 51. The snap portions 52 at both ends snap into the protective buckle fixing groove 418 and the end near the shell of the first memory alloy mounting portion on the carrier 40, or snap into the snap fixing portion 428 of the second memory alloy mounting portion and the end near the base of the second memory alloy mounting portion, thereby confining the memory alloy within the memory alloy mounting portion. In one embodiment, the protective buckle is a metal protective buckle, which prevents the memory alloy from falling and helps dissipate heat from the memory alloy.

[0059] Figure 10 90 is a perspective view of the wire clamp. Figure 10 As shown, the wire clamp 90 includes a first wire clamp 91 and a second wire clamp 92. The wire clamp 90 is generally mounted on the wire clamp mounting portion 831 of the corner portion 83 of the base 80. Specifically, the first wire clamp 91 is mounted on the first side portion 81 of the base 80, and the second wire clamp 92 is mounted on the second side portion 82 of the base 80. Because the first side portion 81 of the base 80 is used to mate with the first side portion 41 of the carrier 40, and the second side portion 82 of the base 80 is used to mate with the second side portion 42 of the carrier 40, the memory alloy mounting portions provided on the first side 41 and the second side 42 of the carrier 40 are different. The wire groove 413 of the first memory alloy mounting portion 411 on the first side 41 of the carrier 40 opens toward the base 80, while the wire groove 423 of the second memory alloy mounting portion 421 on the second side 42 of the carrier 40 opens away from the base 80. This results in differences between the first wire clamp 91 and the second wire clamp 92.

[0060] Specifically, with reference to Figure 11 、 Figure 14 and Figure 15, the height of the first wire clamp 91 is higher than that of the second wire clamp 92. This is because the middle portion of the first group of memory alloys 61 mounted on the first side portion 41 of the carrier 40 (i.e., the portion located on the first memory alloy mounting portion 411) is close to the base 80, while the portions close to the ends, i.e., close to the wire clamps, are away from the base 80. Therefore, when the base is located below and the housing is located above, the first memory alloys 61 mounted on the first side portion 41 of the carrier form an overall arrangement with the ends being higher and the middle being lower, so the height of the first wire clamp 91 needs to be higher.

[0061] Correspondingly, the second wire clamp 92 is installed on the second side 82 of the base 80. Since the second side 82 of the base 80 corresponds to the second side 42 of the carrier 40, the second side 42 of the carrier 40 is provided with a second memory alloy mounting portion 421. The opening of the wire groove 423 of the second memory alloy mounting portion 421 is facing away from the base 80, that is, the direction of the shell. Therefore, when the second group of memory alloys 62 is installed on the second alloy mounting portion 423, when described with the arrangement that the base is located at the bottom and the shell is located at the top, the second group of memory alloys 62 as a whole forms an arrangement with the middle being high and the two ends being low. Therefore, the height of the second wire clamps 92 at both ends of the second group of memory alloys 62 installed on the second side 42 of the carrier 40 is lower.

[0062] Return to reference Figure 10 The first wire clamp 91 includes a vertical portion 911 and a horizontal portion 912. The vertical portion 911 integrally extends upward from the horizontal portion 912 and is provided with an outwardly protruding protrusion 913. A step 914 is formed between the protrusion 913 and the outer surface of the vertical portion 911. The horizontal portion 912 extends along the inner wall of the first side portion 81 of the base 80 and is provided with a fixing hole 915. The fixing hole 915 cooperates with the wire clamp fixing column 833 on the wire clamp mounting portion 831 of the base 80 to secure the first wire clamp 91 to the base 80, such as by heat riveting. The second wire clamp 92 includes a vertical portion 921 and a horizontal portion 922. The vertical portion 921 integrally extends upward from the horizontal portion 922 and is provided with an outwardly protruding protrusion 923. A step 924 is formed between the protrusion 923 and the outer surface of the vertical portion 921. The horizontal portion 922 extends along the inner wall of the second side portion 82 of the base 80 and is provided with a fixing hole 925. The fixing hole 925 cooperates with the wire clamp fixing post 833 on the wire clamp mounting portion 831 of the base 80 to secure the second wire clamp 92 to the base 80, such as by heat riveting. It should be noted that the height of the vertical portion 911 of the first wire clamp 91 is higher than the height of the vertical portion 921 of the second wire clamp 92.

[0063] Refer to the following Figure 11-15 The assembly state of the lens driving mechanism 100 according to one embodiment of the present invention is described.

[0064] Figure 11is a perspective view of a lens driving mechanism 100 according to an embodiment of the present invention, wherein the upper spring and the outer shell are removed; Figure 12 A top view of a lens drive mechanism 100 according to an embodiment of the present invention, with the outer housing removed; Figure 13 is a perspective view of a lens driving mechanism 100 according to an embodiment of the invention, with the outer shell removed; Figure 14 yes Figure 13 A front view of the lens driving mechanism 100; and Figure 15 yes Figure 13 The right side view of the lens driving mechanism 100 is shown. Figure 11-15 As shown, the base-embedded metal sheet 80B is embedded in the base 80, and the wire clip 90 is fixed to the wire clip mounting portion 831 formed inside the corner 83 of the base 80. The first wire clip 91 is disposed along the first side 81 of the base 80 and is electrically connected to the base-embedded metal sheet 80B. The second wire clip 92 is disposed along the second side 82 of the base 80 and is electrically connected to the base-embedded metal sheet 80B. The memory alloy assembly 60 includes a first group of memory alloys 61 and a second group of memory alloys 62. The first group of memory alloys 61 is mounted on the first memory alloy mounting portion 411 disposed on the first side 41 of the carrier 40 and is secured by a protective buckle 50. The first group of memory alloys 61 is fixedly connected to the first wire clip 91 at both ends. The second group of memory alloys 62 is mounted on the second memory alloy mounting portion 421 disposed on the second side 42 of the carrier 40 and is secured by a protective buckle 50. The second group of memory alloys 62 is fixedly connected to the second wire clip 92 at both ends. The first portion 71 and the second portion 72 of the lower spring 70 are disposed on lower surfaces of the opposite second side portions 82 of the base 80 and the opposite second side portions 42 of the carrier 40 .

[0065] Specifically, refer to Figure 8 The arrangement shown, the first portion 71 of the lower spring 70 is arranged Figure 8 In the upper part shown, the second portion 72 of the lower spring 70 is arranged Figure 8 In the lower half shown, the carrier mounting portion 711 of the first portion 71 and the carrier mounting portion 721 of the second portion 72 are respectively used to connect to the lower spring mounting portion 44 arranged on the lower surface of the second side portion 42 of the carrier 40, and the base mounting portion 712 of the first portion 71 and the base mounting portion 722 of the second portion 72 are respectively connected to the lower spring mounting portion 832 on the lower bottom surface of the base 80, and the lower spring fixing column 834 is accommodated in the base fixing hole 715 of the first portion 71 and the base fixing hole 725 of the second portion 72 of the lower spring 70, so that the base 80 and the bottom surface of the carrier 40 are movably connected through the lower spring 70.

[0066] Reference Figure 12The inner ring (i.e., first portion) 21 of the upper spring 20 is fixedly connected to the upper spring mounting portion 45 on the upper surface of the carrier 40, while the outer ring (i.e., second portion) 22 of the upper spring 20 is connected to the upper spring mounting portion 34 at the corner of the frame 30, thereby movably connecting the carrier 40 and the frame 30. The first side drive clearance groove 312 of the frame 30 and the first central notch 811 of the base 80 are of equal width and cooperate to form a rectangular opening to accommodate the first memory alloy drive portion 411 on the carrier 40. The first side wire clamp clearance groove 312 of the frame 30 and the first side notches 812 of the base 80 correspond to each other and form an opening to accommodate the first wire clamp 712. Similarly, the second side drive clearance groove 322 of the frame 30 and the second central notch 821 of the base 80 are of equal width and cooperate to form a rectangular opening to accommodate the second memory alloy drive portion 421 on the carrier 40. The second side wire clamp avoidance groove 322 of the frame 30 corresponds to the second side notches 822 on the base 80 and forms an opening for avoiding the second wire clamp 722 .

[0067] Reference Figure 13-15 When the first group of memory alloys 61 on the opposite side is energized, the carrier 40 is driven to move upward relative to the base 80 and the frame 30 (i.e., in a direction away from the base 80). When the second group of memory alloys 62 on the other opposite side is energized, the carrier 40 is driven to move downward relative to the base 80 and the frame 30 (i.e., in a direction close to the base 80). Therefore, by controlling the current in the first group of memory alloys 61 and the second group of memory alloys 62, the carrier 40 can be moved in the up and down directions. When a lens is installed in the carrier 40, by controlling the current in the first group of memory alloys 61 and the second group of memory alloys 62, the carrier 40 can drive the lens to reciprocate along the optical axis, thereby realizing the zoom function.

[0068] While the preferred embodiments of the present invention have been described in detail above, it should be understood that, after reading the above teachings of the present invention, those skilled in the art may make various changes or modifications to the present invention. Such equivalents also fall within the scope of the claims appended hereto.

Claims

1. A base for an optical element driving mechanism, characterized in that: The base includes a bottom plate, a central hole is formed in the middle of the bottom plate to match the cylindrical opening of the carrier of the optical element driving mechanism, two first side portions of the base facing each other and two second side portions of the base facing each other are formed around the central hole, the first side portion of the base matches the first group of memory alloys of the optical element driving mechanism, and the second side portion of the base matches the second group of memory alloys of the optical element driving mechanism. A first baffle extending upward from the bottom plate is provided in the middle of the first side portion, a first middle notch is formed in the middle of the first baffle to cooperate with the first memory alloy mounting portion on the carrier, and first two side notches are formed on both sides of the first baffle. A second baffle extending upward from the base plate is provided in the middle of the second side portion, a second middle notch is formed in the middle of the second baffle, and second two side notches are formed on both sides of the second baffle, the second middle notch cooperates with the second memory alloy mounting portion on the carrier, and the second two side notches cooperate with the wire clamp of the optical element driving mechanism; a first step portion is provided on the inner wall of the first baffle, the first step portion extends from the first two side notches to the first middle notch and tilts downward from the first two side notches to the first middle notch, and a second step portion is provided on the inner wall of the second baffle, the second step portion extends from the second middle notch to the second two side notches and tilts downward from the second middle notch to the second two side notches; the width of the first two side notches of the first side portion is smaller than the width of the first middle notch and is arranged adjacent to the corner of the base; the width of the second two side notches of the second side portion is larger than the width of the second middle notch and is arranged adjacent to the corner of the base.

2. The base according to claim 1, wherein: The first step portion has an inclination greater than that of the second step portion.

3. The base according to claim 1, wherein: A corner of the base is formed between the first side portion and the second side portion. A wire clamp mounting portion is provided on the inner side of the corner of the base for mounting a wire clamp of the optical element driving mechanism.

4. The base according to claim 3, characterized in that A boss is provided on the outer side of the wire clamp mounting portion to serve as a lower spring mounting portion, wherein the boss is formed by extending a certain distance upward from the bottom plate.

5. The base according to claim 4, characterized in that The height of the boss is smaller than the height of the first baffle on the first side and smaller than the height of the second baffle on the second side.

6. The base according to claim 5, characterized in that A lower spring fixing column is provided on the upper surface of the boss.

7. The base according to claim 3, wherein: The base is further provided with a base embedded metal sheet, and the base embedded metal sheet electrically connects the external circuit with the memory alloy component of the optical element driving mechanism.

8. The base according to claim 7, characterized in that The base further includes a wire clamp, which is installed on a wire clamp installation portion of the base and communicates with a metal sheet circuit embedded in the base.

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