A spherical LED chip and its manufacturing method, and a display panel

Abstract

The present invention discloses a spherical LED chip and a manufacturing method thereof, and a display panel, wherein the spherical LED chip comprises a first electrode, a second electrode surrounding the first electrode and having magnetism, and a first insulating protective layer arranged on the outside of the first electrode, wherein the first insulating protective layer and the second electrode form an LED shell for wrapping the first electrode and having a spherical outer contour. When the LED chip is transferred to the backplane by the mass transfer method of fluid assembly, the spherical LED shell is precisely attracted and positioned with the position on the backplane through the magnetic positioning of the second electrode in the fluid assembly, and the spherical shape can achieve smooth position adjustment, thereby replacing the rectangular or cylindrical LED chip and achieving mass and precise transfer.

Description

Technical Field

[0001] The present invention relates to the field of display devices, and in particular to a spherical LED chip and a manufacturing method thereof, and a display panel. Background Art

[0002] Micro-LED is a new generation of display technology. Compared with existing liquid crystal displays, it has higher photoelectric efficiency, higher brightness, higher contrast, and lower power consumption, and can also be combined with flexible panels to achieve flexible display. Compared with traditional LED chips, it has the same light-emitting principle, but the scale of a single LED chip is less than 20μm, which greatly increases the difficulty of its preparation. In the preparation process, mass transfer technology is the key. At present, mass transfer technologies mainly include electrostatic transfer, micro-printing and fluid assembly.

[0003] Mass transfer technology is to assemble a single small LED chip onto a substrate to form an LED display panel. The existing fluid assembly process is: use a brush bucket to roll on the substrate to place the LED chip in a liquid suspension, and use fluid force to make the LED chip fall into the corresponding position on the substrate. Traditional LED chips are all rectangular or cylindrical structures. Rectangular or cylindrical LED chips have straight edges or turning corners, and their direction is not easy to adjust under the action of fluid force. When they reach the substrate position, they cannot be accurately aligned, making it difficult to achieve mass and precise transfer, affecting assembly efficiency.

[0004] Therefore, the prior art still needs to be improved and developed. Summary of the invention

[0005] In view of the above-mentioned deficiencies in the prior art, the object of the present invention is to provide a spherical LED chip and a manufacturing method thereof, and a display panel, wherein the spherical LED housing is precisely attracted and positioned with respect to the position on the substrate through the magnetic positioning of the second electrode during fluid assembly, and the spherical shape can achieve smooth position adjustment, thereby replacing rectangular or cylindrical LED chips, achieving massive and precise transfer, and improving assembly efficiency.

[0006] The technical solution of the present invention is as follows:

[0007] A spherical LED chip includes a first electrode, a second electrode surrounding the first electrode and having magnetism, and a first insulating protective layer arranged on the outside of the first electrode. The first insulating protective layer and the second electrode form an LED shell for wrapping the first electrode and having a spherical outer contour.

[0008] Furthermore, the first electrode is arranged along the central axis of the spherical contour, and a second insulating protection layer is arranged between the first electrode and the second electrode.

[0009] Furthermore, on a plane perpendicular to the central axis where the first electrode is located, the orthographic projection of the second electrode is a ring.

[0010] Furthermore, the ring shape is a polygonal ring or a circular ring.

[0011] Furthermore, it also includes a first semiconductor layer, a light-emitting layer, and a second semiconductor layer which are located in the cavity of the LED housing and are arranged in sequence; the first semiconductor layer is in contact with the first electrode, and the second semiconductor layer is in contact with the second electrode.

[0012] Furthermore, the second insulating protection layer is extended and arranged between the first electrode and the light emitting layer and the second semiconductor layer.

[0013] A display panel, including a backplane, a plurality of spherical LED chips as described above arranged on the backplane, a first metal pad for connecting to a first electrode arranged on the backplane, a second metal pad for connecting to the second electrode arranged on the backplane, and the second metal has a magnetism opposite to that of the second electrode.

[0014] Furthermore, the back plate is provided with a plurality of grooves, and the grooves are used to accommodate the spherical LED chips.

[0015] Furthermore, the second electrode is arranged in different patterns according to different colors of pixels, and the second metal pad is arranged in a pattern matching the second electrode.

[0016] A method for manufacturing a spherical LED chip, comprising the steps of:

[0017] Forming an epitaxial layer on a substrate, wherein the epitaxial layer includes a first semiconductor layer, a light-emitting layer, and a second semiconductor layer stacked in sequence from bottom to top;

[0018] Etching a first hemisphere on the epitaxial layer by a dry etching process, and etching a first electrode hole;

[0019] Depositing an insulating protective layer;

[0020] Etching the insulating layer to form a second electrode position;

[0021] Plating a first electrode in the first electrode hole and plating a magnetic second electrode on the second electrode position;

[0022] The substrate is peeled off, and a second hemisphere is etched out on the side facing the substrate by a dry etching process;

[0023] An insulating protective layer is deposited on the second hemisphere.

[0024] Compared with the prior art, the present invention proposes a spherical LED chip and its manufacturing method, and a display panel, wherein the LED chip is formed into a spherical LED shell through the first insulating protective layer and the second electrode, the first electrode is wrapped, and the first electrode and the second electrode are separated to realize the power supply of the LED chip, and the LED is set to be spherical, so the light-emitting surface must be a spherical surface. The spherical LED shell as the light-emitting surface is conducive to reducing the total reflection inside the LED chip, so the light extraction efficiency can be improved. Since the LED chip is a spherical structure, a mounting position corresponding to the size of the LED chip can be set on the backplane. When the LED chip is transferred to the backplane by the mass transfer method of fluid assembly, the spherical LED shell is accurately attracted and positioned with the position on the backplane through the magnetic positioning of the second electrode in the fluid assembly, and the spherical shape can achieve smooth position adjustment, thereby replacing the rectangular or cylindrical LED chip and realizing mass and precise transfer. Since the second electrodes of LED chips of different colors are designed with magnetic electrodes with different patterns, they can be accurately aligned with the corresponding positions of the backplane during the transfer, thereby improving the transfer yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 A cross-sectional view of an embodiment of a spherical LED chip of the present invention;

[0026] Figure 2 It is a schematic diagram of an orthographic projection of a second electrode of an embodiment of a spherical LED chip of the present invention;

[0027] Figure 3 is a cross-sectional view of an embodiment of a display panel of the present invention;

[0028] Figure 4 The schematic diagram of the mass transfer method of the fluid assembly of the present invention;

[0029] Figure 5 This is a structural diagram after step S100 in a method for manufacturing a spherical LED chip of the present invention is completed;

[0030] Figure 6 This is a structural diagram after etching out the first hemisphere in a method for manufacturing a spherical LED chip of the present invention;

[0031] Figure 7 This is a structural diagram after step S200 in a method for manufacturing a spherical LED chip of the present invention is completed;

[0032] Figure 8 This is a structural diagram after step S300 in a method for manufacturing a spherical LED chip of the present invention is completed;

[0033] Fig. 9This is a structural diagram after step S400 in a method for manufacturing a spherical LED chip of the present invention is completed;

[0034] Fig.10 This is a structural diagram of a spherical LED chip after the first electrode is plated in a manufacturing method of the present invention;

[0035] Fig.11 This is a structural diagram after step S500 in a method for manufacturing a spherical LED chip of the present invention is completed;

[0036] Fig.12 This is a structural diagram after bonding is completed in step S600 in a method for manufacturing a spherical LED chip of the present invention;

[0037] Fig.13 This is a structural diagram of peeling off the substrate in step S600 of a method for manufacturing a spherical LED chip of the present invention;

[0038] Fig.14 This is a structural diagram after step S600 in a method for manufacturing a spherical LED chip of the present invention is completed;

[0039] Fig.15 This is a structural diagram after step S700 in the method for manufacturing a spherical LED chip of the present invention is completed.

[0040] The numbers in the figure are: 100, spherical LED chip; 110, first electrode; 120, second electrode; 130, first insulating protective layer; 140, second insulating protective layer; 150, first semiconductor layer; 151, light-emitting layer; 152, second semiconductor layer; 200, back plate; 210, first metal pad; 220, second metal pad; 230, groove; 300, substrate; 310, first hemisphere; 320, first electrode hole; 330, second electrode position; 340, second hemisphere; 350, adhesive material; 360, adhesive substrate; 370, insulating protective layer. DETAILED DESCRIPTION

[0041] The present invention provides a spherical LED chip and a manufacturing method thereof, and a display panel. In order to make the purpose, technical solution and effect of the present invention clearer and more specific, the present invention is further described in detail with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0042] like Figure 1As shown, a spherical LED chip includes a first electrode 110, and a second electrode 120 is surrounded on the outside of the first electrode 110. The first electrode 110 and the second electrode 120 are arranged at a distance, and the second electrode 120 is magnetic, and is used to adsorb the LED chip to the backplane during the process of fluid assembly for mass transfer. A first insulating protective layer 130 is arranged on the outside of the first electrode 110, and the first insulating protective layer 130 and the second electrode 120 form an LED shell, and the outer contour of the LED shell is spherical. The LED shell wraps the first electrode 110, that is, an inner cavity is formed in the LED shell, and the first electrode 110 is located in the inner cavity. It is easy to imagine that the outer contour of the LED shell can also be hemispherical. The LED shell also serves as the light-emitting surface of the LED chip and is used to guide light for the LED chip. It is easy to imagine that the outer contour of the LED housing is hemispherical, or the bottom surface of the first electrode is opened as a flat sphere, or the bottom surface of the first electrode and the top surface opposite to the bottom surface are both opened as flat spheres; it can also be that a flat sphere is opened on the outer contour of the LED housing and on the left and right sides of the first electrode.

[0043] The spherical LED chip in this solution is formed into a spherical LED shell through the first insulating protective layer 130 and the second electrode 120, which wraps the first electrode 110 and separates the first electrode 110 from the second electrode 120 to realize the power supply of the spherical LED chip. The LED is set to be spherical, so the light-emitting surface must be a spherical surface. The spherical LED shell as the light-emitting surface is conducive to reducing the total reflection inside the LED chip, so the light extraction efficiency can be improved. Since the LED chip is a spherical structure, a mounting position corresponding to the size of the LED chip can be set on the back panel. When the LED chip is transferred to the back panel by the mass transfer method of fluid assembly, the spherical LED shell is precisely attracted and positioned with the position on the back panel through the magnetic positioning of the second electrode 120 in the fluid assembly, and the spherical shape can achieve smooth position adjustment, thereby replacing the rectangular or cylindrical LED chip to achieve mass and precise transfer.

[0044] like Figure 1As shown, the specific structure of this embodiment is: the first electrode 110 is arranged along the central axis of the spherical profile of the LED housing, the first electrode 110 can be arranged as a cylinder, a square column or a polygonal column, the bottom of the first electrode 110 is exposed at the bottom of the spherical profile of the LED housing, a second insulating protective layer 140 is arranged between the first electrode 110 and the second electrode 120, that is, the part from the second electrode 120 to the bottom of the first electrode 110 is arranged as the second insulating protective layer 140, the second insulating protective layer 140 separates the first electrode 110 and the second electrode 120, the second insulating protective layer 140 and the second electrode 120 serve as the lower part of the spherical profile of the LED housing, the first insulating protective layer 130 serves as the upper part of the spherical profile of the LED housing, and the surface area of ​​the spherical profile of the LED housing occupied by the first insulating protective layer 130 can be adjusted according to actual design requirements. It is easy to think that the first electrode can also be arranged in a parallel direction along the central axis of the spherical profile of the LED housing, and the first electrode is offset from the central axis of the spherical profile by a distance, which can also achieve the function of this solution. On a plane perpendicular to the central axis of the first electrode 110, as Figure 2 As shown, the positive projection of the second insulating protective layer 140 is a ring, and the bottom projection of the first electrode 110 is located in the middle of the ring. In this way, the outer second electrode 120 is magnetic, so the outer surface of the LED housing is magnetic all around. In this way, when the LED chip is installed using magnetism, the first electrode 110 can always be located in the center, and the second electrode 120 can be adjusted by magnetic attraction to achieve precise positioning. The ring in this embodiment is a polygonal ring or a circular ring, such as a triangular ring ( Figure 2 a-2), quadrilateral ring ( Figure 2 a-1) or circular ( Figure 2 In a-3), it is easy to imagine that it can also be other ring shapes, such as a lace ring, etc.

[0045] like Figure 1 As shown, it also includes a first semiconductor layer 150, a light-emitting layer 151, and a second semiconductor layer 152 located in the cavity of the LED shell and arranged in sequence; from bottom to top, the second semiconductor layer 152, the light-emitting layer 151, and the first semiconductor layer 150 are arranged in sequence, the first semiconductor layer 150 is in contact with the first electrode 110, and the second semiconductor layer 152 is in contact with the second electrode 120, so that the first semiconductor is turned on through the first electrode 110, and the second semiconductor is turned on through the second electrode 120, so that under the action of the second semiconductor layer 152 and the first semiconductor layer 150, the light-emitting layer 151 is realized to emit light.

[0046] The second insulating protective layer 140 is extended and arranged between the first electrode 110 and the light-emitting layer 151, and between the first electrode 110 and the second semiconductor layer 152. Specifically, the second insulating protective layer 140 extends into the cavity of the LED housing and adheres to the outer wall surface of the first electrode 110, so that the first electrode 110 is separated from the second insulating protective layer 140, and the first electrode 110 is separated from the light-emitting layer 151; the upper surface of the first electrode 110 is exposed, so that the upper surface is connected to the first semiconductor layer 150 located above. In this way, a complete spherical LED chip 100 is formed.

[0047] like Figure 3 As shown, this embodiment also provides a display panel, including a back plate 200, on which a plurality of spherical LED chips 100 as described above are fixedly arranged, a first metal pad 210 is fixedly arranged at the mounting position of each LED chip on the back plate 200, the first metal pad 210 is used to connect with the first electrode 110 of the spherical LED chip 100, a second metal pad 220 is fixedly arranged at the mounting position of each LED chip on the back plate 200, the second metal pad 220 is used to connect with the second electrode 120, and the second metal pad 220 has a magnetic property opposite to that of the second electrode 120. The first metal pad 210 and the second metal pad 220 are extended in the back plate 200 and are used to connect with an external control circuit, and the first metal pad 210 and the second metal pad 220 are spaced apart in the back plate 200.

[0048] like Figure 4 As shown in the figure, the micro-process technology and mass transfer technology are the core processes of the Micro-LED transfer process, among which the micro-process technology is to miniaturize, array and thin-film the traditional LED crystal film. The mass transfer technology is to transfer the miniaturized and arrayed LED crystal film to the circuit board in batches. In this embodiment, it is necessary to arrange the micro spherical LED chips smaller than 100 microns in a matrix, and then use the mass transfer technology to transfer them in batches to the backplane for packaging to form a whole LED panel.

[0049] like Figure 4 As shown in b-1, in the display assembly process of the present invention, a large number of spherical LED chips 100 as described above are placed in a liquid environment to obtain a suspension. After the second metal pad 220 on the back plate 200 is powered on, the second metal pad 220 has a magnetic property opposite to that of the second electrode 120. When the suspension flows, Figure 4As shown in b-2, the second electrode 120 and the second metal pad 220 are attracted to each other by magnetic attraction, so that the spherical LED chip 100 is accurately aligned to the installation position of the back plate 200. When the second electrode 120 and the second metal pad 220 of the spherical LED chip 100 in the suspension are attracted to each other, the spherical LED chip 100 can be smoothly adjusted in the suspension due to its smooth outer surface, which is conducive to the spherical LED chip 100 automatically adjusting its position to the installation position of the back plate 200.

[0050] like Figure 3 , Figure 4 As shown, the back plate 200 is provided with a plurality of grooves 230, the grooves 230 are hemispherical grooves, and the grooves 230 are used to accommodate the spherical LED chip 100; the grooves 230 can also be one-third spherical grooves and other arc grooves for positioning the spherical LED chip 100. In this way, the spherical LED chip 100 is fixed in the grooves 230, firstly, the spherical LED chip 100 is accurately positioned on the back plate 200, and secondly, the spherical LED chip 100 is fixed more firmly. The first metal pad 210 and the second metal pad 220 are both located in the grooves 230, and the contact point between the first metal pad 210 and the first electrode 110 of the spherical LED chip 100 is located at the bottom of the groove 230, and the contact point between the second metal pad 220 and the second electrode 120 of the spherical LED chip 100 is located at the side of the groove 230, so that it is convenient to directly connect with the spherical LED chip 100.

[0051] Since the pixel is composed of three LED chips of different colors, R, G, and B, the second electrode 120 is set to different patterns according to the different colors of the pixel, such as the above-mentioned ring pattern, and the second metal pad 220 is set to a pattern matching the second electrode 120, such as a ring pattern. For example, the orthographic projection of the second electrode 120 of the spherical LED chip 100 representing red (R) on the plane perpendicular to the central axis of the first electrode 110 is a quadrilateral ring; the orthographic projection of the second electrode 120 of the spherical LED chip 100 representing green (G) on the plane perpendicular to the central axis of the first electrode 110 is a triangular ring; the orthographic projection of the second electrode 120 of the spherical LED chip 100 representing blue (B) on the plane perpendicular to the central axis of the first electrode 110 is a circular ring. By setting the second electrodes 120 of the spherical LED chips 100 of three different colors, R, G, and B, into different patterns, and setting the corresponding patterns on the second metal pads 220 of the back plate 200 for mounting the grooves 230 of three different colors, R, G, and B. When assembling by suspension transfer, since the second electrodes 120 of the three different colors of spherical LED chips 100 R, G, and B include three different electrode patterns, the overlap between the different patterns is small and the mutual adsorption force is also small. When a mismatch occurs, the mismatched spherical LED chip 100 can be separated from the back panel 200 and re-adsorbed by vibration, thereby achieving the effect of improving the yield.

[0052] It is easy to imagine that since the pixel is composed of three different colors of spherical LED chips 100, R, G, and B, the spherical LED chips 100 can be made into different sizes when transferred, and the back plate 200 is provided with grooves 230 corresponding to the sizes of the spherical LED chips 100. When assembling by suspension transfer, since the spherical LED chips 100 of the three different colors of R, G, and B are of different sizes, the transfer starts from the largest spherical LED chip 100. For example, the largest red spherical LED chip 100 is transferred first, then the second largest green spherical LED chip 100, and then the smallest blue spherical LED chip 100. Of course, the sizes of the three spherical LED chips 100 of R, G, and B can be freely set.

[0053] In the solution of the present invention, since the LED chip has a spherical structure, a hemispherical groove 230 corresponding to the size of the spherical LED chip 100 can be set on the back plate 200, which is conducive to transferring the spherical LED chip 100 to the back plate 200 through a mass transfer method of fluid assembly; in addition, since the second electrode 120 of the spherical LED chip 100 is designed with a patterned magnetic electrode, precise alignment can be performed when the LED is transferred, thereby improving the transfer yield.

[0054] The present invention also includes a method for manufacturing a spherical LED chip, comprising the steps of:

[0055] S100, forming an epitaxial layer on a substrate, wherein the epitaxial layer includes a first semiconductor layer, a light emitting layer, and a second semiconductor layer stacked in sequence from bottom to top.

[0056] like Figure 5 As shown, specifically, the substrate 300 is located at the bottom layer, and an epitaxial layer is arranged on the substrate 300, including a first semiconductor layer 150, a light emitting layer 151, and a second semiconductor layer 152 which are sequentially stacked on the substrate 300 from bottom to top to form a four-layer structure.

[0057] S200, etching a first hemisphere on the epitaxial layer through a dry etching process, and etching a first electrode hole.

[0058] like Figure 6 , Figure 7 As shown, specifically, the first hemisphere 310 includes the second semiconductor layer 152 and a portion of the light emitting layer 151, and a first electrode hole 320 is etched at the top of the first hemisphere.

[0059] S300 , depositing an insulating protective layer.

[0060] like Figure 8 As shown, specifically, the insulating protection layer 370 covers the outer surface of the first hemisphere 310 and the inner wall of the first electrode hole 320 .

[0061] S400, etching the insulating layer to form a second electrode site.

[0062] like Fig. 9 As shown, specifically, a second electrode position 330 is etched on the outer surface of the first hemisphere 310 near the lower end.

[0063] S500, plating a first electrode in the first electrode hole, and plating a magnetic second electrode on the second electrode position.

[0064] like Fig.10 , Fig.11 As shown, the first electrode 110 is plated in the first electrode hole 320 , and the magnetic second electrode 120 is plated on the second electrode position 330 .

[0065] S600, peeling off the substrate, and etching out a second hemisphere on the side facing the substrate by dry etching process.

[0066] like Fig.12 , Fig.13 , Fig.14As shown, specifically: the first semiconductor layer 150 with a base, the light emitting layer 151, and the formed first hemisphere 310 are transferred to the bonding substrate 360 ​​by means of the bonding material 350, so that the first hemisphere 310 faces downward, and then the substrate 300 is peeled off to expose the first semiconductor layer 150, and the second hemisphere 340 is etched out on the side facing the substrate 300 by a dry etching process, exposing the first semiconductor layer 150 and another part of the light emitting layer 151.

[0067] S700, depositing an insulating protective layer on the second hemisphere.

[0068] like Fig.15 As shown, specifically: an insulating protective layer 370 is deposited on the first semiconductor layer 150 and another part of the light emitting layer 151 , and finally the adhesive material 350 is peeled off, so as to form the spherical LED chip 100 .

[0069] In summary, compared with the prior art, the present invention proposes a spherical LED chip, wherein the LED chip is formed into a spherical LED shell through the first insulating protective layer and the second electrode, the first electrode is wrapped, and the first electrode and the second electrode are separated to realize the power supply of the LED chip, and the LED is set to be spherical, so the light-emitting surface must be a spherical surface. The spherical LED shell as the light-emitting surface is conducive to reducing the total reflection inside the LED chip, so the light extraction efficiency can be improved. Since the LED chip is a spherical structure, a hemispherical groove corresponding to the size of the LED chip can be set on the backplane. When the LED chip is transferred to the backplane by the mass transfer method of fluid assembly, the spherical LED shell is accurately attracted and positioned with the position on the substrate through the magnetic positioning of the second electrode in the fluid assembly, and the spherical shape can be used to achieve smooth position adjustment, thereby replacing the rectangular or cylindrical LED chip and realizing mass precision transfer. Since the second electrodes of LED chips of different colors are designed with magnetic electrodes with different patterns, they can be accurately aligned with the corresponding positions of the backplane during the transfer, thereby improving the transfer yield.

[0070] It should be understood that the application of the present invention is not limited to the above examples. For ordinary technicians in this field, improvements or changes can be made based on the above description. All these improvements and changes should fall within the scope of protection of the claims attached to the present invention.

Claims

1. A spherical LED chip, characterized in that: It includes a first electrode, a second electrode surrounding the first electrode and having magnetism, and a first insulating protective layer arranged on the outside of the first electrode. The first insulating protective layer and the second electrode form an LED shell for wrapping the first electrode and having a spherical outer contour. The LED shell forms an inner cavity, the first electrode is located in the inner cavity, and the bottom of the first electrode is exposed at the bottom of the spherical contour of the LED shell.

2. The spherical LED chip according to claim 1, characterized in that: The first electrode is arranged along the central axis of the spherical profile, and a second insulating protection layer is arranged between the first electrode and the second electrode.

3. The spherical LED chip according to claim 2, characterized in that: On a plane perpendicular to the central axis where the first electrode is located, the orthographic projection of the second electrode is a ring.

4. The spherical LED chip according to claim 3, characterized in that: The ring shape is a polygonal ring or a circular ring.

5. The spherical LED chip according to claim 2, characterized in that: It also includes a first semiconductor layer, a light-emitting layer, and a second semiconductor layer which are located in the cavity of the LED housing and are arranged in sequence; the first semiconductor layer is in contact with the first electrode, and the second semiconductor layer is in contact with the second electrode.

6. The spherical LED chip according to claim 5, characterized in that: The second insulating protection layer is extended and arranged between the first electrode, the light emitting layer and the second semiconductor layer.

7. A display panel, characterized in that: It comprises a back plate, on which are arranged several spherical LED chips as described in any one of claims 1 to 6, a first metal pad for connecting to a first electrode is arranged on the back plate, a second metal pad for connecting to the second electrode is arranged on the back plate, and the second metal pad has a magnetic property opposite to that of the second electrode.

8. The display panel according to claim 7, characterized in that: The back plate is provided with a plurality of grooves, and the grooves are used to accommodate the spherical LED chips.

9. The display panel according to claim 7, characterized in that: The second electrode is arranged in different patterns according to different colors of pixels, and the second metal pad is arranged in a pattern matching the second electrode.

10. A method for manufacturing a spherical LED chip, characterized in that: Includes steps: Forming an epitaxial layer on a substrate, wherein the epitaxial layer includes a first semiconductor layer, a light-emitting layer, and a second semiconductor layer stacked in sequence from bottom to top; Etching a first hemisphere on the epitaxial layer by a dry etching process, and etching a first electrode hole; depositing an insulating protective layer; Etching the insulating layer to form a second electrode position; Plating a first electrode in the first electrode hole and plating a magnetic second electrode on the second electrode position; The substrate is peeled off, and a second hemisphere is etched out on the side facing the substrate by a dry etching process; An insulating protective layer is deposited on the second hemisphere.

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