Laser processing device, method and laser processing method for elastic mesh material

Abstract

The present invention relates to a laser processing device, method and a laser processing method for elastic mesh material. The laser processing device includes a frame, a displacement mechanism and a processing mechanism. The processing mechanism includes a laser, a guide driver and a guide. The laser, the guide driver and the guide are all installed on the displacement mechanism and can move relative to the frame under the drive of the displacement mechanism; the guide is connected to the guide driver and can rotate under the drive of the guide driver; the guide can reflect the laser emitted by the laser, and the guide reflects the laser to different positions of the product to be processed by rotation, and cuts the product to be processed. The laser processing device provided by the present invention can realize the processing requirements of the detailed structure by rotating the guide and reflecting the laser, and the rotation angle and rotation speed of the guide can be conveniently controlled by the guide driver, which greatly saves the production cost and use cost of the laser processing device.

Description

Technical Field

[0001] The present invention relates to the field of laser processing, and in particular to a laser processing device, a laser processing method and a laser processing method for elastic mesh material. Background Art

[0002] When cutting products to be processed, traditional laser processing devices generally use a displacement mechanism to move the position of the laser, so that the laser cuts a preset shape on the product to be processed. However, the displacement mechanism in this laser processing device has a large movement amount and a complex movement path. The processing of precise and fine structures requires very high movement accuracy of the displacement mechanism, resulting in high manufacturing and use costs of the laser processing device. Summary of the invention

[0003] In view of this, it is necessary to provide a laser processing device, a laser processing method and a laser processing method for elastic mesh material.

[0004] The present invention provides a laser processing device, comprising a frame, a displacement mechanism and a processing mechanism, wherein the displacement mechanism is mounted on the frame, the processing mechanism comprises a laser, a guide driving member and a guide, the laser, the guide driving member and the guide are all mounted on the displacement mechanism and can move relative to the frame under the drive of the displacement mechanism; the laser is used to emit laser light, the guide is connected to the guide driving member and can rotate under the drive of the guide driving member;

[0005] The guide can reflect the laser light emitted by the laser device, and the guide reflects the laser light to different positions of the product to be processed by rotating, and cuts the product to be processed.

[0006] In one embodiment of the present invention, the processing mechanism further includes a deflection unit, which is installed on the displacement mechanism, and the deflection unit is connected to the laser and can drive the laser to deflect, so that the laser emits laser light to different positions of the guide.

[0007] In one embodiment of the present invention, the laser deflection plane is orthogonal to the rotation plane of the guide.

[0008] In one embodiment of the present invention, the guide is a regular polygonal prism.

[0009] In one embodiment of the present invention, the laser processing device further comprises a controller, and the controller is mounted on the frame;

[0010] The controller is connected to the displacement mechanism and is capable of controlling the displacement mechanism to drive the processing mechanism to move; and / or,

[0011] The controller is connected to the laser and can control the on and off of the laser; and / or,

[0012] The controller is connected to the guide drive and can control the rotation angle and rotation speed of the guide by controlling the opening and closing of the guide drive; and / or,

[0013] The controller is connected to the deflection unit and can control the deflection angle and deflection speed of the laser through the deflection unit.

[0014] In one embodiment of the present invention, the displacement mechanism includes a translation unit and a rotation unit, both of which are installed on the frame, the translation unit can perform translational movement relative to the frame, and the rotation unit can perform rotational movement relative to the frame; the translation unit and the rotation unit are connected to each other, the processing mechanism is fixedly installed on the translation unit or the rotation unit, and the processing mechanism can move under the drive of the translation unit and / or the rotation unit; and / or,

[0015] The processing device further comprises an unwinding mechanism and a rewinding mechanism, both of which are mounted on the frame and are respectively located on both sides of the processing mechanism, the unwinding mechanism is used to release the product to be processed, and the rewinding mechanism is used to rewind the processed product; and / or,

[0016] The laser processing device further comprises a detector, which is mounted on the frame and is used to detect the tension of the product to be processed; and / or,

[0017] The laser processing device further comprises a cleaning mechanism, which is mounted on the frame and is used to clean fragments of the product to be processed after being cut by the laser.

[0018] The present invention also provides a laser processing method, wherein the laser processing device comprises a controller and a processing mechanism, wherein the processing mechanism comprises a laser, a guide and a guide driving member, wherein the guide can reflect the laser emitted by the laser onto the product to be processed, and the guide driving member is used to drive the guide to rotate, and the controller is connected to the laser and the guide driving member; the laser processing method comprises:

[0019] The controller controls the on and off of the laser. The controller controls the rotation angle and rotation speed of the guide by controlling the guide driving member, and cuts the product to be processed.

[0020] In one embodiment of the present invention, the processing mechanism further includes a deflection unit, the deflection unit is connected to the controller, and the deflection unit is used to drive the laser to deflect;

[0021] The controller in the laser processing method controls the on and off of the laser, and the controller controls the rotation angle and rotation speed of the guide by controlling the guide driving member, and the step of cutting the product to be processed includes:

[0022] The controller controls the opening and closing of the laser, the controller controls the rotation angle and rotation speed of the guide by controlling the guide driving member, and the controller controls the deflection angle and deflection speed of the laser by controlling the deflection unit, and cuts the product to be processed.

[0023] In one embodiment of the present invention, the laser processing device further includes a translation unit and a rotation unit, the translation unit and the rotation unit are connected to each other and are both connected to a controller, and the processing mechanism is installed on the translation unit or the rotation unit; the translation unit is used to drive the processing mechanism to translate, and the rotation unit is used to drive the processing mechanism to rotate;

[0024] The laser processing method further includes the following steps before the controller controls the on / off of the laser, the controller controls the rotation angle and rotation speed of the guide by controlling the guide driving member, and the step of cutting the product to be processed:

[0025] The controller controls the translation unit to drive the processing mechanism to translate, and / or the controller controls the rotation unit to drive the processing mechanism to rotate, so as to move the processing mechanism to a preset position.

[0026] The present invention also provides a method for laser processing of elastic mesh materials, wherein the laser processing device comprises a controller, a moving mechanism and a processing mechanism; the moving mechanism comprises a translation unit and a rotation unit, the translation unit and the rotation unit are connected to each other, the processing mechanism is installed on the translation unit or the rotation unit, the translation unit is used to drive the processing mechanism to translate, and the rotation unit is used to drive the processing mechanism to rotate; the processing mechanism comprises a laser, a guide and a guide driving member, the guide is a regular polygonal multi-faceted prism, and the guide can reflect the laser emitted by the laser onto the product to be processed, and the guide driving member is used to drive the guide to rotate; the controller is connected to the laser, the guide driving member, the translation unit and the rotation unit;

[0027] The laser processing method of the elastic mesh material comprises:

[0028] The controller moves the processing mechanism to an initial cutting position in a first direction by controlling the translation unit and / or the rotation unit;

[0029] The controller controls the laser to turn on, and the controller controls the guide to rotate at a constant speed by controlling the guide driving member, so as to cut a line segment in a first direction on the product to be processed to a preset length;

[0030] The controller controls the laser to turn off;

[0031] The controller moves the processing mechanism to an initial cutting position in the second direction by controlling the translation unit and / or the rotation unit;

[0032] The controller controls the laser to turn on, and the controller controls the guide to rotate at a constant speed by controlling the guide driving member, so as to cut a line segment in a second direction on the product to be processed to a preset length;

[0033] The controller controls the laser to be turned off.

[0034] The laser processing device provided by the present invention is provided with a guide driver and a guide in the processing mechanism, and the guide can rotate under the drive of the guide driver, so as to reflect the laser to different positions of the product to be processed, so as to achieve cutting at different positions. In the processing device provided by the present invention, the displacement mechanism only needs to provide a large range of movement, which reduces the demand for the movement accuracy of the displacement mechanism; when processing precise and small structures, the processing requirements for the detailed structure can be achieved by rotating the guide and reflecting the laser, and the rotation angle and rotation speed of the guide can be conveniently controlled by the guide driver, which greatly saves the production cost and use cost of the laser processing device.

[0035] The laser processing method and the elastic mesh material laser processing method provided by the present invention adopt the laser processing device provided by the present invention, which is easy to operate and the processed product has high precision. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 It is a schematic diagram of the mechanism of the laser processing device;

[0037] Figure 2 for Figure 1 A schematic diagram of the structure of a processing mechanism in the laser processing device shown;

[0038] Figure 3 A schematic diagram of the use of a laser processing device when cutting a straight line;

[0039] Figure 4 It is a schematic diagram of the use of the laser processing device when cutting a fold line;

[0040] Figure 5 It is a schematic diagram of the use of the laser processing device when it is at the cutting starting point during the curve cutting process;

[0041] Figure 6 A schematic diagram of the use of the laser processing device when it is at the cutting end point during the curve cutting process;

[0042] Figure 7 A schematic diagram of the use of a laser processing device when cutting a mesh first direction line segment;

[0043] Figure 8 The figure is a schematic diagram of the use of a laser processing device when cutting mesh second direction line segments.

[0044] Reference numerals:

[0045] 100. Laser processing device; 10. Frame; 11. Bearing part; 12. Mounting part; 20. Displacement mechanism; 21. Linear module; 22. Rotating motor; 23. Rotating table; 30. Processing mechanism; 31. Laser; 32. Guide driver; 33. Guide; 34. Mounting bracket; 341. Laser mounting part; 342. Guide mounting part; 35. Swing unit; 351. Swing driver; 41. Unwinding mechanism; 42. Rewinding mechanism; 50. Detector; 60. Cleaning mechanism. DETAILED DESCRIPTION

[0046] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0047] It should be noted that when a component is referred to as being "connected to" another component, it may be directly connected to the other component or there may be a central component. When a component is considered to be "set on" another component, it may be directly set on the other component or there may be a central component at the same time. When a component is considered to be "fixed to" another component, it may be directly fixed to the other component or there may be a central component at the same time.

[0048] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "or / and" used herein includes any and all combinations of one or more related listed items.

[0049] See also Figure 1 , Figure 1 Schematic diagram of the structure of the laser processing device 100.

[0050] The present invention provides a laser processing device 100, which is used for laser cutting. In this embodiment, the laser processing device 100 is used to cut elastic polymer materials. It can be understood that in other embodiments, the laser processing device 100 can also be used to cut other non-elastic polymer materials, metal materials, ceramic materials, wood products and other common materials.

[0051] The laser processing device 100 includes a frame 10, a displacement mechanism 20 and a processing mechanism 30. The displacement mechanism 20 is installed on the frame 10 and can drive the processing mechanism 30 to move. The processing mechanism 30 is used to cut the product to be processed.

[0052] The frame 10 includes a bearing portion 11 and a mounting portion 12, wherein the bearing portion 11 is used to bear the product to be processed, and the mounting portion 12 is used to mount the displacement mechanism 20. In this embodiment, in order to make the entire laser processing device 100 lighter, the main part of the frame 10 is constructed by a plurality of metal rods. It is understood that in other embodiments, the frame 10 may also be composed of a plurality of metal plates, or the surface of the frame 10 may be sealed with materials such as glass.

[0053] The displacement mechanism 20 includes a translation unit and a rotation unit. The translation unit can perform translational motion relative to the frame 10, and the rotation unit can perform rotational motion relative to the frame 10. In this embodiment, the rotation unit includes a rotary motor 22 and a rotary table 23. The rotary motor 22 and the rotary table 23 are both mounted on the mounting portion 12 of the frame 10, and the rotary motor 22 can drive the rotary table 23 to move; the translation unit includes a linear module 21, which is fixed on the rotary table 23 and can rotate with the rotary table 23; the processing mechanism 30 is fixed on the linear module 21 and can perform translational motion driven by the linear module 21. Through the coordinated movement of the translation unit and the rotation unit, the processing mechanism 30 can be driven to perform multi-directional translation and rotation, making the movement of the processing mechanism 30 more flexible. Among them, the linear module 21 is preferably an electric cylinder.

[0054] It is understandable that in other embodiments, only a translation unit or a rotation unit may be provided; or the translation unit may be fixedly mounted on the frame 10, the rotation unit may be capable of performing translational motion driven by the translation unit, and the processing mechanism 30 may be fixedly mounted on the rotation unit and may rotate along with the rotation unit; as long as the processing mechanism 30 may be capable of realizing rotational motion and / or translational motion driven by the displacement mechanism 20, it will be sufficient.

[0055] The processing mechanism 30 includes a laser 31, which is used to emit high-power density laser light and irradiate it onto the product to be processed, so that the product to be processed is quickly heated to the vaporization temperature and evaporates to form holes. When the laser moves on the product to be processed, a cutting line is formed, thereby cutting the product to be processed. The product cut by laser has a narrow cutting line and a smooth cut surface, and can process very precise and small structures. In addition, laser cutting is non-contact cutting, and there is no problem of tool wear, and it also avoids problems such as deformation of the product to be processed. In addition, laser cutting has the advantages of fast speed, low noise, low vibration, and no pollution.

[0056] When cutting products to be processed, traditional laser processing devices generally use a displacement mechanism to move the position of the laser, so that the laser cuts a preset shape on the product to be processed. However, the displacement mechanism in this laser processing device has a large movement amount and a complex movement path. The processing of precise and fine structures requires very high movement accuracy of the displacement mechanism, resulting in high manufacturing and use costs of the laser processing device.

[0057] Please refer again Figure 1 , and also see Figure 2 , Figure 2 for Figure 1 A schematic structural diagram of the processing mechanism 30 in the laser processing device 100 is shown.

[0058] In order to solve the above problems, in the laser processing device 100 provided in the present application, the processing mechanism 30 also includes a guide driver 32 and a guide 33. The guide driver 32 is connected to the guide 33 and can drive the guide 33 to rotate; the laser 31 emits laser to the guide 33, and the guide 33 can reflect the laser emitted by the laser 31 onto the product to be processed, and the guide 33 can reflect the laser to different positions of the product to be processed through its own rotation, thereby completing the cutting of the product to be processed.

[0059] Specifically, the processing mechanism 30 includes a mounting bracket 34, which includes a laser mounting portion 341 and a guide mounting portion 342 connected to each other, the laser mounting portion 341 is used to mount the laser 31, the guide mounting portion 342 is used to mount the guide driver 32 and the guide 33, and the guide mounting portion 342 is fixedly mounted on the linear module 21 and can drive the entire mounting bracket 34 to move with the linear module 21. Among them, the guide driver 32 is preferably a motor.

[0060] The laser processing device 100 provided by the present invention is provided with a guide driver 32 and a guide 33 in the processing mechanism 30, and the guide 33 can rotate under the drive of the guide driver 32, so as to reflect the laser to different positions of the product to be processed, so as to achieve cutting at different positions. In the processing device provided by the present invention, the displacement mechanism 20 only needs to provide a large range of movement, which reduces the demand for the movement accuracy of the displacement mechanism 20; when processing precise and small structures, the processing requirements for the detailed structure can be achieved by rotating and reflecting the laser by the guide 33, and the rotation angle and rotation speed of the guide 33 can be conveniently controlled by the guide driver 32, which greatly saves the manufacturing cost and use cost of the laser processing device 100.

[0061] In order to further increase the flexibility of the processing mechanism 30, in one embodiment, the processing mechanism 30 further includes a deflection unit 35, which is connected to the laser 31 and can drive the laser 31 to deflect, so that the laser 31 emits laser light to different positions of the guide 33. In this way, the deflection unit 35 can drive the laser 31 to deflect, and the deflection motion of the laser 31 cooperates with the rotational motion of the guide 33, so that the laser can cut a more complex pattern on the product to be processed, thereby improving the flexibility of the processing mechanism 30.

[0062] Specifically, the yaw unit 35 includes a yaw driving member 351, which is fixedly mounted on the laser mounting portion 341, and is connected to the laser 31 and can drive the laser 31 to rotate. It can be understood that when the yaw driving member 351 drives the laser 31 to rotate, the laser emitted by the laser 31 should be able to irradiate the guide 33, and after being reflected by the guide 33, it can fall on the product to be processed.

[0063] It is understandable that in other embodiments, if there is no high demand for the flexibility of the processing mechanism 30, the deflection unit 35 may not be provided.

[0064] In order to facilitate the calculation of the composite motion path of the deflection path of the laser 31 and the rotation path of the guide 33, the deflection plane of the laser 31 is orthogonal to the rotation plane of the guide 33. In this way, the deflection plane of the laser 31 and the rotation plane of the guide 33 are perpendicular to each other. When the guide 33 continuously rotates and scans, the deflection unit 35 can drive the laser 31 to deflect back and forth along the orthogonal direction of the rotation scanning of the guide 33, so that the cutting line changes from a straight line to a two-dimensional curve. The reciprocating deflection motion of the deflection unit 35 is controlled by using driving functions such as sine, symmetrical triangle wave, sawtooth wave, etc. The guide 33 can output mesh cutting lines in the shape of waves, symmetrical broken lines, asymmetrical broken lines, etc. on the product to be processed. By changing the amplitude, period, and phase of the driving function, the amplitude, frequency, and alignment of the cutting line are also changed accordingly, and more complex and diverse fancy patterns can be cut.

[0065] It should be particularly noted that the yaw plane of the laser 31 refers to a plane perpendicular to the output axis of the yaw driver 351 ; the rotation plane of the guide 33 refers to a plane perpendicular to the output axis of the guide driver 32 .

[0066] It is understandable that in other embodiments, the deflection plane of the laser 31 may be set not to be orthogonal to the rotation plane of the guide 33 according to actual working conditions.

[0067] Preferably, the guide 33 is a regular polygonal prism. The multi-faceted prism has good reflective performance, and the shape and size of each side of the regular polygonal prism are the same, and the reflected light is also uniform. The guide 33 can keep rotating at a constant speed to cut a regular shape, without the need to control the start and stop of the guide 33, which simplifies the control steps and can maintain the accuracy of the cutting path.

[0068] Please also read Figures 3 to 6 , Figure 3 It is a schematic diagram of the use of the laser processing device 100 when cutting a straight line; Figure 4 It is a schematic diagram of the use of the laser processing device 100 when cutting a fold line; Figure 5 It is a schematic diagram of the use of the laser processing device 100 when it is at the cutting starting point during the curve cutting process; Figure 6 It is a schematic diagram of the use of the laser processing device 100 when it is at the cutting end point during the curve cutting process.

[0069] In this embodiment, when it is necessary to process a mesh structure on the product to be processed, the guide 33 cooperates with the laser 31 to output mesh cutting lines at high speed and efficiently generate a densely arranged mesh array structure. When it is necessary to process other shapes such as wavy shapes and broken lines, the guide 33 is set in a positioning state, and the rotating table 23 is linked with the linear module 21 to drive the laser beam to scan and cut any shape of mesh or mesh edge in the polar coordinate system, with high degree of freedom in cutting and forming. The above two scanning modes of the present invention can be switched in real time as needed, thereby adapting to the cutting and processing of various complex elastic meshes or other patterns.

[0070] Of course, the laser processing device 100 in the present invention can also adopt the following cutting method: the guide 33 rotates with the guide driver 32 so that the laser can cut a straight line in the first direction of the product to be processed, and the laser 31 swings with the yaw driver 351 so that the laser can cut a straight line in the second direction of the product to be processed. When the yaw plane of the laser 31 is orthogonal to the rotation plane of the guide 33, the first direction and the second direction are also orthogonal. Combining the movement in two directions and simultaneously controlling the rotation angle and rotation speed of the guide driver 32 and the yaw driver 351, sinusoidal shapes, broken line shapes, etc. can be cut.

[0071] It is understandable that in other embodiments, the guide 33 can also be set as a non-regular polygonal prism according to actual working conditions, and the intensity and position of the laser reflected by the guide 33 to the product to be processed can be changed by changing the spacing between the mirror surface and the diffuse surface.

[0072] In order to enable the laser processing device 100 to form an assembly line, the product to be processed is set in a roll shape. The processing device also includes a reeling mechanism 41 and a reeling mechanism 42. The reeling mechanism 41 and the reeling mechanism 42 are both installed on the frame 10 and are respectively located on both sides of the processing mechanism 30. The reeling mechanism 41 is used to release the product to be processed, and the reeling mechanism 42 is used to reel the processed product. In this way, a processing production line can be formed. The reeling mechanism 41 continuously releases the product to be processed, and the processing mechanism 30 can continuously cut a preset shape on the product to be processed, and then the reeling mechanism 42 will cut the finished product. The entire processing line is highly efficient and easy to realize industrial production.

[0073] It is understandable that when the product to be processed is in a plate-like shape, a three-dimensional shape, or other shapes that do not require winding, the unwinding mechanism 41 and the winding mechanism 42 may not be provided.

[0074] In order to detect the tension force on the product to be processed on the bearing part 11, the laser processing device 100 also includes a detector 50, which is installed on the frame 10. The detector 50 is used to detect the tension force of the product to be processed, which can avoid the tension force of the product to be processed being too high or too low during the cutting process, resulting in a large error between the processed shape and the preset shape. In particular, when the product to be processed is an elastic polymer material, it is ensured that the elastic polymer material continues to maintain a relatively stable tension force during the processing process, which can ensure that the product after cutting is consistent with the preset shape.

[0075] Preferably, the detector 50 is arranged on a side of the bearing portion 11 relatively close to the winding mechanism 42. In this way, when the detector 50 detects that the tension is too large or too small, the winding speed of the winding mechanism 42 can be adjusted to adjust the tension of the product to be processed.

[0076] It is understandable that when the product to be processed is a material that does not require tension detection, or when the product to be processed is in the form of a plate and does not require winding, the detector 50 can be omitted.

[0077] In some working conditions, in order to clean up the debris generated by cutting, the laser processing device 100 further includes a cleaning mechanism 60, which is installed on the frame 10 and is used to clean up the debris of the product to be processed after being cut by the laser 31. In this way, when the product to be processed is cut and generates debris, the cleaning mechanism 60 can clean up the debris in time to prevent the debris from affecting the winding mechanism 42 to perform the winding work.

[0078] Specifically, the cleaning mechanism 60 includes a vacuum suction rod, which is installed on the bearing portion 11 of the frame 10 and is located on a side of the processing mechanism 30 relatively close to the winding mechanism 42. When the processing mechanism 30 is completed, the cleaning mechanism 60 can vacuum and remove the debris generated by cutting. Of course, the cleaning mechanism 60 can also be a cleaning rod that can move relative to the frame 10, and the cleaning rod can rotate and / or translate relative to the frame 10, so as to clean up the debris generated by cutting.

[0079] It is understandable that in some working conditions, no debris is generated when cutting the product to be processed. In this case, the cleaning mechanism 60 may not be provided, or the cleaning mechanism 60 may be removed from the frame 10 .

[0080] In order to make the laser processing device more integrated and intelligent, the laser processing device 100 also includes a controller (not shown), which is used to control various mechanisms in the laser processing device 100 , and the controller is installed on the frame 10 .

[0081] Specifically, the controller is connected to the displacement mechanism 20, and can control the displacement mechanism 20 to drive the processing mechanism 30 to move; specifically, the controller is connected to the translation unit and the rotation unit, and can control the movement of the translation unit and the rotation unit respectively.

[0082] The controller is connected to the laser 31 and can control the on and off of the laser 31 .

[0083] The controller is connected to the guide driving member 32 , and can control the rotation angle and rotation speed of the guide 33 by controlling the opening and closing of the guide driving member 32 .

[0084] The controller is connected to the yaw driver 351 , and can control the yaw angle and yaw speed of the laser 31 through the yaw driver 351 .

[0085] The controller is connected to the unwinding mechanism 41 and controls the unwinding speed of the unwinding mechanism 41; the controller is connected to the rewinding mechanism 42 and controls the speed of the rewinding mechanism 42; the controller is connected to the detector 50, and can adjust the rotation speed of the unwinding mechanism 41 and / or the rewinding mechanism 42 through the tensioning force of the product to be processed detected by the detector 50.

[0086] The controller is connected to the cleaning mechanism 60 and is used to control the opening and closing of the cleaning mechanism 60 .

[0087] It can be understood that the connections between the above-mentioned mechanisms and the controller are independent of each other. Without affecting the use, the control relationship between the controller and each mechanism can be changed according to the actual working conditions, as long as the mechanisms can cooperate with each other to complete the cutting operation.

[0088] The present invention also provides a laser processing method based on the laser processing device 100 .

[0089] In one embodiment, the product to be processed is a rolled material and is arranged on the unwinding mechanism 41; the laser processing method comprises the following steps:

[0090] Step S10: the unwinding mechanism 41 releases the product to be processed and connects the product to be processed to the rewinding mechanism 42, and the rewinding mechanism 42 rewinds the product to be processed.

[0091] Preferably, the laser processing device 100 includes a controller, and step S10 includes:

[0092] Step S11, the unwinding mechanism 41 releases the product to be processed and connects the product to be processed with the rewinding mechanism 42, and the rewinding mechanism 42 rewinds the product to be processed; the controller adjusts the rotation speed of the unwinding mechanism 41 and the rewinding mechanism 42 according to the cutting progress.

[0093] It can be understood that if the product to be processed is already in the correct processing position, or the product to be processed is in the form of a sheet or other shapes, this step can be omitted.

[0094] In one embodiment, the laser processing method comprises the following steps:

[0095] In step S20, the detector 50 detects the tension applied to the product to be processed, and sends the detected data to the controller, which adjusts the rotation speed of the unwinding mechanism 41 and / or the rewinding mechanism 42 according to the tension.

[0096] It can be understood that when the product to be processed is a material that does not require tension force detection, or when the product to be processed is in the form of a plate and does not require winding, this step can be omitted.

[0097] In one embodiment, the laser processing method comprises the following steps:

[0098] In step S30 , the controller moves the processing mechanism 30 to an initial cutting position of a preset shape by controlling the translation unit and / or the rotation unit.

[0099] With such configuration, the controller can mobilize the translation unit to translate the processing mechanism 30 and / or mobilize the rotation unit to rotate the processing mechanism 30 according to the preset shape and the preset initial cutting position, thereby moving the processing mechanism 30 to the preset initial cutting position.

[0100] It is understandable that if the processing mechanism 30 is already in a preset initial cutting position, or if cutting can be started from any position under special working conditions, this step can be omitted.

[0101] In one embodiment, the laser processing method includes:

[0102] Step S40: The controller controls the on and off of the laser 31. The controller controls the rotation angle and rotation speed of the guide 33 by controlling the guide driving member 32, and cuts the product to be processed.

[0103] Specifically, step S40 includes:

[0104] Step S41, after the processing mechanism 30 reaches the preset position, the controller controls the laser 31 to turn on;

[0105] Step S42: the controller controls the guide 33 to rotate by controlling the guide driving member 32, and adjusts the rotation speed and rotation angle of the guide driving member 32 according to a preset shape, and cuts the product to be processed;

[0106] Step S43: the controller controls the laser 31 to turn off.

[0107] At this time, the laser processing method includes the following steps:

[0108] Step S11, the unwinding mechanism 41 releases the product to be processed, and connects the product to be processed with the rewinding mechanism 42, and the rewinding mechanism 42 rewinds the product to be processed; the controller adjusts the rotation speed of the unwinding mechanism 41 and the rewinding mechanism 42 according to the cutting progress;

[0109] Step S20, the detector 50 detects the tension force on the product to be processed, and sends the detected data to the controller, and the controller adjusts the rotation speed of the unwinding mechanism 41 and / or the rewinding mechanism 42 according to the tension force;

[0110] Step S30: the controller moves the processing mechanism 30 to an initial cutting position of a preset shape by controlling the translation unit and / or the rotation unit;

[0111] Step S41, after the processing mechanism 30 reaches the preset position, the controller controls the laser 31 to turn on;

[0112] Step S42: the controller controls the guide 33 to rotate by controlling the guide driving member 32, and adjusts the rotation speed and rotation angle of the guide driving member 32 according to a preset shape, and cuts the product to be processed;

[0113] Step S43: the controller controls the laser 31 to turn off.

[0114] In one embodiment, when the laser processing device 100 includes the deflection unit 35, step S42 further includes:

[0115] Step S421, the controller controls the rotation of the guide 33 by controlling the guide driver 32, and adjusts the rotation speed and rotation angle of the guide driver 32 according to the preset shape. The controller controls the deflection of the laser 31 by controlling the deflection unit 35, and adjusts the deflection angle and deflection speed of the deflection unit according to the preset shape, and cuts the product to be processed.

[0116] At this time, the laser processing method includes the following steps:

[0117] Step S11, the unwinding mechanism 41 releases the product to be processed, and connects the product to be processed with the rewinding mechanism 42, and the rewinding mechanism 42 rewinds the product to be processed; the controller adjusts the rotation speed of the unwinding mechanism 41 and the rewinding mechanism 42 according to the cutting progress;

[0118] Step S20, the detector 50 detects the tension force on the product to be processed, and sends the detected data to the controller, and the controller adjusts the rotation speed of the unwinding mechanism 41 and / or the rewinding mechanism 42 according to the tension force;

[0119] Step S30: the controller moves the processing mechanism 30 to an initial cutting position of a preset shape by controlling the translation unit and / or the rotation unit;

[0120] Step S41, after the processing mechanism 30 reaches the preset position, the controller controls the laser 31 to turn on;

[0121] Step S421, the controller controls the guide 33 to rotate by controlling the guide driver 32, and adjusts the rotation speed and rotation angle of the guide driver 32 according to the preset shape, the controller controls the laser 31 to deflect by controlling the deflection unit 35, and adjusts the deflection angle and deflection speed of the deflection unit according to the preset shape, and cuts the product to be processed;

[0122] Step S43: the controller controls the laser 31 to turn off.

[0123] It can be understood that when processing complex working conditions, step S30 and step S40 can be performed alternately to cut out more complex shapes.

[0124] In one embodiment, the laser processing method further comprises the following steps:

[0125] Step S50: The controller controls the cleaning mechanism 60 to clean up the debris generated by cutting.

[0126] At this time, the laser processing method includes the following steps:

[0127] Step S11, the unwinding mechanism 41 releases the product to be processed, and connects the product to be processed with the rewinding mechanism 42, and the rewinding mechanism 42 rewinds the product to be processed; the controller adjusts the rotation speed of the unwinding mechanism 41 and the rewinding mechanism 42 according to the cutting progress;

[0128] Step S20, the detector 50 detects the tension force on the product to be processed, and sends the detected data to the controller, and the controller adjusts the rotation speed of the unwinding mechanism 41 and / or the rewinding mechanism 42 according to the tension force;

[0129] Step S30: the controller moves the processing mechanism 30 to an initial cutting position of a preset shape by controlling the translation unit and / or the rotation unit;

[0130] Step S41, after the processing mechanism 30 reaches the preset position, the controller controls the laser 31 to turn on;

[0131] Step S421, the controller controls the guide 33 to rotate by controlling the guide driver 32, and adjusts the rotation speed and rotation angle of the guide driver 32 according to the preset shape, the controller controls the laser 31 to deflect by controlling the deflection unit 35, and adjusts the deflection angle and deflection speed of the deflection unit according to the preset shape, and cuts the product to be processed;

[0132] Step S43, the controller controls the laser 31 to turn off;

[0133] Step S50: The controller controls the cleaning mechanism 60 to clean up the debris generated by cutting.

[0134] It can be understood that in some working conditions, no fragments will be generated when the product to be processed is cut, and step S50 can be omitted in this case.

[0135] The laser processing method provided by the present invention can perform a large-scale position movement through the displacement mechanism 20, and through the cooperation of the guide 33 and the laser 31, it can achieve cutting of irregular patterns, meshes, mesh edge cutting, etc. When cutting dense meshes, each mesh cutting line is realized by the rotating scanning motion of the guide 33, in conjunction with the synchronous switching instructions of the laser 31. The guide 33 outputs the entire mesh cutting line through continuous uniform rotation motion, with fast scanning speed and smooth movement. The multi-row parallel mesh cutting lines in the first direction and the second direction of the present invention are all realized through continuous line-by-line scanning motion, and the entire mesh cutting line is output, with fast scanning speed, smooth movement, and line-by-line scanning can be realized. The stepping motion of the linear module 21 controls the inter-row switching of the line-by-line scanning motion, and different mesh widths and mesh spacings can be obtained by changing the stepping amplitude. At irregular meshes or mesh edges, the scanning cutting line of the laser beam is controlled by the rotating table 23 and the linear module 21 in linkage, and the scanning cutting line is generated in the polar coordinates formed by the rotating table 23 and the linear module 21. The laser 31 is turned on at the beginning of the scan and turned off after the scan is completed. The scanning cutting line can be freely defined within the polar coordinate system, and the cutting line design has a high degree of freedom.

[0136] With the continuous improvement of the performance of polymer 3D printing equipment, especially the continuous enrichment of 3D printing materials and the rapid decline of material costs, polymer 3D printing equipment such as light curing (LCD / DLP / SLA), melt extrusion (FDM), powder sintering molding (SLS / MJET) has gradually begun to penetrate into the large-scale production of personal wearables and daily consumer goods. For example, light curing 3D printing equipment has completely replaced the traditional manual mold making process in the hearing aid industry; light curing tooth mold printing equipment has been rapidly applied in the dental orthodontic industry and is seizing the market share of traditional plastic braces; light curing 3D printing equipment and SLS powder sintering 3D printing equipment have begun to be used in sports shoe production, in order to use the forming freedom of 3D printing technology to release the benefits of advanced design solutions on sports shoe functions, wearing experience, appearance, etc. Recently, there have been public reports that many domestic and foreign manufacturers have successively released new 3D printed sports shoes, especially a domestic brand not only uses SLS equipment to make a three-dimensional lattice structure sole, but also uses FDM equipment to make an elastic shoe mesh, thus realizing the 3D printing of the entire shoe component. The elastic mesh produced by FDM equipment not only provides a light, breathable and skin-friendly wearing experience, but also has good performance in durability indicators such as elasticity and toughness, and has a significant difference in appearance from traditional woven uppers. In addition to sports shoes, the elastic mesh produced by FDM equipment also shows broad application prospects in the fields of sports protection, medical orthopedics, etc.

[0137] On the other hand, when the existing FDM equipment uses the melt extrusion process to make elastic mesh, there are still limitations such as poor quality stability, low production efficiency, and insufficient design freedom. The reason is that the melt extrusion unit of the traditional FDM equipment is for the application of hard polymer wires. The strength of the wire itself has an indispensable functional attribute for reliable feeding and drip prevention; after the use of elastic polymer wires, its good ductility leads to reduced feeding reliability, nozzle clogging, and uneven extrusion. When the elastic wire is retracted, the reduction in cross-sectional area caused by elongation makes the piston effect between the wire and the catheter fail, which leads to melt casting and wire drawing at the nozzle. When the feeding speed continues to increase, the pressure difference of the melt inside and outside the nozzle can easily cause the elastic extrudate to twist and deform at the nozzle, thereby significantly deviating from the extrusion path and causing extrusion defects. At present, there is still a lack of a forming method for the mesh forming processing of elastic polymer materials with fast forming speed, good stability, uniform thickness, flexible mesh pattern design and high processing accuracy.

[0138] Based on the above technical problems, the present invention also provides a laser processing method for elastic mesh material, comprising the following steps:

[0139] P10, the controller moves the processing mechanism 30 to an initial cutting position in the first direction by controlling the translation unit and / or the rotation unit;

[0140] P20, the controller controls the laser 31 to turn on, and the controller controls the guide 33 to rotate at a constant speed by controlling the guide driving member 32, so as to cut a line segment in the first direction on the product to be processed to a preset length;

[0141] P30, the controller controls the laser 31 to turn off;

[0142] P40, the controller moves the processing mechanism 30 to an initial cutting position in the second direction by controlling the translation unit and / or the rotation unit;

[0143] P50, the controller controls the laser 31 to turn on, and the controller controls the guide 33 to rotate at a constant speed by controlling the guide driving member 32, so as to cut the line segment in the second direction on the product to be processed to a preset length;

[0144] P60, the controller controls the laser 31 to turn off.

[0145] In the laser processing method of the present invention, the guide 33 cooperates with the driver, the displacement mechanism, and the deflection unit 35, and can efficiently output the line-by-line scanning mesh cutting line to quickly generate a densely arranged mesh structure; the rotating table 23 cooperates with the linear module 21, and can also flexibly cut irregular meshes or mesh edges of any shape; the laser processing method of the present invention has a reasonable scheme, high production efficiency, good forming effect, and is easy to promote and apply in elastic mesh production devices for various purposes.

[0146] Please also read Figures 7 and 8 , Figure 7 It is a schematic diagram of the use of the laser processing device 100 when cutting a mesh first direction line segment; Figure 8 Schematic diagram of the use of the laser processing device 100 when cutting a mesh second direction line segment. In one embodiment, the laser processing method of the elastic mesh material includes the following steps:

[0147] The unwinding mechanism 41 releases the product to be processed and connects the product to be processed with the rewinding mechanism 42, and the rewinding mechanism 42 rewinds the product to be processed; the controller adjusts the rotation speed of the unwinding mechanism 41 and the rewinding mechanism 42 according to the cutting progress;

[0148] The detector 50 detects the tension force on the product to be processed and sends the detected data to the controller, and the controller adjusts the rotation speed of the unwinding mechanism 41 and / or the rewinding mechanism 42 according to the tension force;

[0149] The controller moves the processing mechanism 30 to an initial cutting position of the first line segment of the first row by controlling the translation unit and / or the rotation unit;

[0150] The controller controls the laser 31 to turn on, and the controller controls the guide 33 to rotate at a constant speed by controlling the guide driving member 32, so as to cut the first line segment of the first column on the product to be processed to a preset length;

[0151] The controller controls the laser 31 to be turned off;

[0152] The controller controls the translation unit to move to an initial cutting position of the second line segment of the first column;

[0153] The controller controls the laser 31 to turn on, and the controller controls the guide 33 to rotate at a constant speed by controlling the guide driving member 32, so as to cut the second line segment of the first column on the product to be processed to a preset length;

[0154] The controller controls the laser 31 to be turned off;

[0155] Repeat the above three steps until the line segments of the first column are cut; (i.e. Figure 7 201 dashed line segment shown)

[0156] The controller moves the processing mechanism 30 to the initial cutting position of the first line segment of the second row by controlling the translation unit and / or the rotation unit;

[0157] Repeat the cutting steps of the first column until the line segments of the second column are cut;

[0158] Repeat the first two column cutting steps until the preset number of column segments are cut; (i.e. Figure 7 201 to 206 as shown by dashed line segment)

[0159] The controller moves the processing mechanism 30 to the first end of the first line segment of the first column by controlling the translation unit and / or the rotation unit;

[0160] The controller controls the laser 31 to turn on, and the controller controls the guide 33 to rotate at a constant speed by controlling the guide driving member 32, so as to cut the first line segment of the first row to the first end of the first line segment of the second column on the product to be processed;

[0161] The controller controls the laser 31 to be turned off;

[0162] The controller controls the translation unit to move to the first end of the first line segment of the third column;

[0163] The controller controls the laser 31 to turn on, and the controller controls the guide 33 to rotate at a constant speed by controlling the guide driving member 32, so as to cut the first end of the first line segment of the fourth column and the second line segment of the first column on the product to be processed;

[0164] The controller controls the laser 31 to be turned off;

[0165] Repeat the above three steps until the first row of line segments are cut; (i.e. Figure 8 211 line segment shown)

[0166] The controller moves the processing mechanism 30 to the second end of the first line segment of the first column by controlling the translation unit and / or the rotation unit;

[0167] The controller controls the laser 31 to turn on, and the controller controls the guide 33 to rotate at a constant speed by controlling the guide driving member 32, so as to cut the first line segment of the second row to the second end of the first line segment of the second column on the product to be processed;

[0168] The controller controls the translation unit to move to the second end of the first line segment of the third column;

[0169] The controller controls the laser 31 to turn on, and the controller controls the guide 33 to rotate at a constant speed by controlling the guide driving member 32, so as to cut the second line segment of the second row to the second end of the first line segment of the fourth column on the product to be processed;

[0170] Repeat the first two lines of cutting steps until the preset number of lines are cut; (i.e. Figure 8 211 to 216 line segments shown)

[0171] The controller controls the cleaning mechanism 60 to clean up the debris generated by cutting;

[0172] A mesh material is obtained.

[0173] The elastic mesh laser processing method of the present invention adopts a rolled sheet of elastic material as the product to be processed, and generates a mesh structure on a sheet preform by laser scanning and cutting. The obtained elastic mesh not only has uniform thickness, but also the integrated structure of the warp and weft of the mesh can ensure good tensile strength. After the laser 31 of the present invention completes a complete mesh pattern cutting process, the unwinding mechanism 41 and the winding mechanism 42 rotate synchronously, and the cut product is cleaned by the cleaning mechanism 60 and then wound up by the winding mechanism 42, and the rolled sheet of elastic material newly released by the unwinding mechanism 41 is moved to the bearing part 11 of the frame 10 for the next round of mesh pattern cutting process. The above-mentioned unwinding, cutting, cleaning and winding steps are performed sequentially until the whole roll of sheet elastic material of the unwinding mechanism 41 is cut, cleaned and wound up in sections to become a whole roll of elastic mesh finished product on the winding mechanism 42.

[0174] The elastic mesh laser processing method of the present invention can obtain an integrated mesh connection structure with a continuous transition between width and narrow. Compared with the splicing method of FDM fixed-width extrudates, not only is the mesh edge smooth, but it also has high tensile strength and strong tear resistance. After being scanned and cut by laser, the fragments in the mesh and the cut pieces at the edge of the mesh are removed by vacuum suction by the cleaning mechanism 60 when passing through the cleaning mechanism 60, thereby obtaining a finished elastic mesh product. The finished elastic mesh product of the present invention is further rolled up by the winding mechanism 42. When the elastic mesh laser processing method of the present invention works continuously, the rolled sheet elastic material on the unwinding mechanism 41 can be cut and cleaned in turn, and rolled up into a rolled elastic mesh product on the winding unit.

[0175] It can be understood that the above embodiment is only one of the laser processing methods for elastic mesh materials. In actual application, different cutting processes can be adjusted according to working conditions as long as the mesh cutting can be completed.

[0176] The technical features of the above embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0177] Those skilled in the art should recognize that the above embodiments are only used to illustrate the present invention, and are not intended to limit the present invention. As long as they are within the spirit of the present invention, appropriate changes and modifications to the above embodiments are within the scope of protection claimed by the present invention.

Claims

1. A laser processing device (100), characterized in that: The invention comprises a frame (10), a displacement mechanism (20) and a processing mechanism (30), wherein the displacement mechanism (20) is mounted on the frame (10), and the processing mechanism (30) comprises a laser (31), a guide driving member (32) and a guide (33), wherein the laser (31), the guide driving member (32) and the guide (33) are all mounted on the displacement mechanism (20) and can move relative to the frame (10) under the drive of the displacement mechanism (20); the laser (31) ) is used to emit laser light, the guide (33) is connected to the guide driving member (32) and can rotate under the drive of the guide driving member (32); the processing mechanism (30) further includes a deflection unit (35), the deflection unit (35) is installed on the displacement mechanism (20), and the deflection unit (35) is connected to the laser (31) and can drive the laser (31) to deflect, so that the laser (31) emits laser light to different positions of the guide (33); The displacement mechanism (20) comprises a translation unit and a rotation unit, the translation unit and the rotation unit are both mounted on the frame (10), the translation unit can perform translational movement relative to the frame (10), and the rotation unit can perform rotational movement relative to the frame (10); the translation unit and the rotation unit are connected to each other, the processing mechanism (30) is fixedly mounted on the translation unit or the rotation unit, and the processing mechanism (30) can move under the drive of the translation unit and / or the rotation unit; The guide (33) is capable of reflecting the laser light emitted by the laser (31), and the guide (33) reflects the laser light to different positions of the product to be processed by rotating, thereby cutting the product to be processed.

2. The laser processing device (100) according to claim 1, characterized in that: The deflection plane of the laser (31) is orthogonal to the rotation plane of the guide (33).

3. The laser processing device (100) according to claim 1 or 2, characterized in that: The guide (33) is a regular polygonal multi-faceted prism.

4. The laser processing device (100) according to claim 3, characterized in that: The laser processing device (100) further comprises a controller, wherein the controller is mounted on the frame (10); The controller is connected to the displacement mechanism (20) and is capable of controlling the displacement mechanism (20) to drive the processing mechanism (30) to move; and / or, The controller is connected to the laser (31) and is capable of controlling the on and off of the laser (31); and / or, The controller is connected to the guide drive (32) and is capable of controlling the rotation angle and rotation speed of the guide (33) by controlling the opening and closing of the guide drive (32); and / or, The controller is connected to the deflection unit (35), and is capable of controlling the deflection angle and deflection speed of the laser (31) through the deflection unit (35).

5. The laser processing device (100) according to claim 1, characterized in that: The processing device further comprises an unwinding mechanism (41) and a rewinding mechanism (42), wherein the unwinding mechanism (41) and the rewinding mechanism (42) are both mounted on the frame (10) and are respectively located on two sides of the processing mechanism (30), the unwinding mechanism (41) is used to release the product to be processed, and the rewinding mechanism (42) is used to rewind the processed product; and / or, The laser processing device (100) further comprises a detector (50), wherein the detector (50) is mounted on the frame (10), and the detector (50) is used to detect the tension of the product to be processed; and / or, The laser processing device (100) further comprises a cleaning mechanism (60), wherein the cleaning mechanism (60) is mounted on the frame (10), and the cleaning mechanism (60) is used to clean fragments of the product to be processed after being cut by the laser (31).

6. A laser processing method, characterized in that: A laser processing device (100) comprises a controller and a processing mechanism (30), wherein the processing mechanism (30) comprises a laser (31), a guide (33) and a guide driving member (32), wherein the guide (33) is capable of reflecting laser light emitted by the laser (31) onto a product to be processed, and the guide driving member (32) is used to drive the guide (33) to rotate, and the controller is connected to the laser (31) and the guide driving member (32); the laser processing method comprises: The controller controls the on and off of the laser (31), and the controller controls the rotation angle and rotation speed of the guide (33) by controlling the guide driving member (32), thereby cutting the product to be processed; The processing mechanism (30) further comprises a deflection unit (35), wherein the deflection unit (35) is connected to a controller, and the deflection unit (35) is used to drive the laser (31) to deflect; The controller in the laser processing method controls the on / off of the laser (31), the controller controls the rotation angle and rotation speed of the guide (33) by controlling the guide driving member (32), and the step of cutting the product to be processed comprises: The controller controls the opening and closing of the laser (31), the controller controls the rotation angle and rotation speed of the guide (33) by controlling the guide driving member (32), the controller controls the deflection angle and deflection speed of the laser (31) by controlling the deflection unit (35), and cuts the product to be processed; The laser processing device (100) further comprises a translation unit and a rotation unit, the translation unit and the rotation unit are connected to each other and are both connected to a controller, the processing mechanism (30) is installed on the translation unit or the rotation unit; the translation unit is used to drive the processing mechanism (30) to translate, and the rotation unit is used to drive the processing mechanism (30) to rotate; The laser processing method further comprises the following steps before the step of the controller controlling the on / off of the laser (31), the controller controlling the rotation angle and rotation speed of the guide (33) by controlling the guide driving member (32), and cutting the product to be processed: The controller controls the translation unit to drive the processing mechanism (30) to translate, and / or the controller controls the rotation unit to drive the processing mechanism (30) to rotate, thereby moving the processing mechanism (30) to a preset position.

7. A laser processing method for elastic mesh material, characterized in that: The laser processing device (100) comprises a controller, a moving mechanism and a processing mechanism (30); the moving mechanism comprises a translation unit and a rotation unit, the translation unit and the rotation unit are connected to each other, the processing mechanism (30) is installed on the translation unit or the rotation unit, the translation unit is used to drive the processing mechanism (30) to translate, and the rotation unit is used to drive the processing mechanism (30) to rotate; the processing mechanism (30) comprises a laser (31), a guide (33) and a guide driving member (32), the guide (33) is a regular polygonal multi-faceted prism, and the guide (33) can reflect the laser light emitted by the laser (31) onto a product to be processed, and the guide driving member (32) is used to drive the guide (33) to rotate; the controller is connected to the laser (31), the guide driving member (32), the translation unit and the rotation unit; The laser processing method of the elastic mesh material comprises: The controller moves the processing mechanism (30) to an initial cutting position in a first direction by controlling the translation unit and / or the rotation unit; The controller controls the laser (31) to turn on, and the controller controls the guide (33) to rotate at a constant speed by controlling the guide driving member (32), so as to cut a line segment in a first direction on the product to be processed to a preset length; The controller controls the laser (31) to turn off; The controller moves the processing mechanism (30) to an initial cutting position in a second direction by controlling the translation unit and / or the rotation unit; The controller controls the laser (31) to turn on, and the controller controls the guide (33) to rotate at a constant speed by controlling the guide driving member (32), so as to cut a line segment in a second direction on the product to be processed to a preset length; The controller controls the laser (31) to be turned off.

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