Method for processing a transport tray and an object to be processed

Abstract

Provided is a processing method of a conveyance tray and an object to be processed, capable of writing information to a recording medium when the conveyance tray is of a specific type. A conveyance tray (1) houses and conveys a plurality of device chips (204). The conveyance tray (1) has a tray main body (2) having a device support portion (6) having a front surface (6-1) that supports the plurality of device chips (204) and a frame (7) formed around the outer periphery of the device support portion (6), a recording medium (4) provided to the tray main body (2) and capable of writing or reading information through wireless communication, and an identification mark (5) that identifies whether the conveyance tray (1) is of a type capable of writing information to the recording medium (4).

Description

Technical Field

[0001] This invention relates to a transport tray for storing processed chips and a processing method for the processed workpiece. Background Technology

[0002] In the semiconductor industry, there are processes where multiple chips, obtained by cutting, are stored in a tray to transfer them to the next process (see, for example, Patent Document 1). In this case, in order to also transmit information during processing to the next process, a framework has been developed as a transfer unit with RFID (Radio Frequency Identifier) ​​tags (see, for example, Patent Document 2).

[0003] Patent Document 1: Japanese Patent Application Publication No. 2000-095291

[0004] Patent Document 2: Japanese Patent Application Publication No. 2008-040810

[0005] However, when the provider of the processing apparatus recommends using a specific transfer tray, it is desirable to allow the writing of processing information and other information onto the recording medium only when the recommended transfer tray is used, in order to manage the quality of the diced chips. Thus, in the transfer unit shown in Patent Document 2, it is desirable to write information onto the recording medium when the transfer unit is of a specific type. Summary of the Invention

[0006] The present invention was made in view of this problem and its purpose is to provide a processing method for a pallet and a workpiece, which enables the writing of information to a recording medium when the pallet is of a specific type.

[0007] To address the aforementioned issues and achieve the objective, the present invention provides a transfer tray for storing and transferring multiple chips. The transfer tray is characterized by comprising: a tray body having a device support portion and a frame; the device support portion having a front surface supporting the multiple chips; the frame being formed around the outer periphery of the device support portion; a recording medium disposed on the tray body and capable of being written to or read from via wireless communication; and an identification mark identifying whether the transfer tray is capable of being written to the recording medium.

[0008] Alternatively, the transport pallet may have an adhesive layer that is applied to the front side of the device support portion of the pallet body and has adhesive force.

[0009] The processing method of the processed object according to the present application, which houses the chips in the conveyance tray, is characterized by comprising: a processing step of processing the processed object to form a plurality of chips; a housing step of housing the plurality of chips in the conveyance tray; a discriminating step of discriminating whether the conveyance tray is of a type capable of writing to the recording medium by capturing the identification mark with a capturing unit; and a recording step of recording information in the recording medium in the processing step in a case where it is determined that the type of the conveyance tray is the type capable of writing.

[0010] In the processing method of the processed object, the conveyance tray can have an adhesive layer installed on the front surface of the device support portion of the tray main body and having an adhesive force.

[0011] The present application achieves the effect of enabling writing of information to the recording medium when the conveyance tray is of a specific type. BRIEF DESCRIPTION OF DRAWINGS

[0012] Figure 1 is a perspective view showing a structure example of the conveyance tray of Embodiment 1.

[0013] Figure 2 is a perspective view showing a structure example of a processing device using the conveyance tray of Embodiment 1.

[0014] Figure 3 is a perspective view showing Figure 2 is a perspective view showing an example of the processed object of the processing device shown in FIG. 8.

[0015] Figure 4 is a perspective view showing Figure 1 is a sectional view showing a state in which the conveyance tray shown in FIG. 9 houses device chips.

[0016] Figure 5 is a flowchart showing a flow of the processing method of the processed object of Embodiment 1.

[0017] Figure 6 is a view schematically showing Figure 5 is a view showing the discriminating step and the recording step of the processing method of the processed object shown in FIG. 12.

[0018] REFERENCE NUMERALS

[0019] 1: conveyance tray; 2: tray main body; 3: adhesive layer; 4: recording medium; 5: identification mark; 6: device support portion; 6-1: front surface; 7: frame; 120: tray capturing unit (capturing unit); 200: processed object; 204: device chip (chip); ST1: processing step; ST2: housing step; ST3: discriminating step; ST4: recording step. DETAILED DESCRIPTION

[0020] Embodiments for carrying out the present application will be explained in detail with reference to the drawings. The present application is not limited by the contents described in the following embodiments. In addition, the following described structural elements include what can be easily conceived by those skilled in the art, and what is substantially the same. In addition, the following described structures can be appropriately combined. In addition, various omissions, substitutions, or changes of the structure can be made within a range not departing from the gist of the present application.

[0021] [Embodiment 1]

[0022] A carrying tray and a processing method of a processed object according to Embodiment 1 of the present application will be explained with reference to the drawings. Figure 1 is a perspective view showing a structural example of the carrying tray according to Embodiment 1. Figure 2 is a perspective view showing a structural example of a processing apparatus using the carrying tray according to Embodiment 1. Figure 3 is a perspective view showing Figure 2 is a perspective view showing an example of a processed object which is a processing target of the processing apparatus shown in Figure 4 is a perspective view showing Figure 1 is a cross-sectional view showing a state in which the carrying tray shown in Figure 5 is a flowchart showing a flow of the processing method of the processed object according to Embodiment 1. Figure 6 is a diagram schematically showing Figure 5 is a diagram showing a discrimination step and a recording step of the processing method of the processed object shown in

[0023] The carrying tray 1 according to Embodiment 1 is used for Figure 1 the processing apparatus 210 shown in Figure 2 Figure 2 The processing apparatus 210 shown in Figure 3 is an apparatus which performs cutting processing on the processed object 200 shown in Figure 3 As the processed object 200 which is a processing target of the processing apparatus 210 according to Embodiment 1, a flat plate-shaped object having a rectangular planar shape is used. In Embodiment 1, as the processed object 200, a so-called package substrate which is constituted by sealing a plurality of semiconductor chips with resin like a CSP (Chip Size Package) or a QFN (Quad Flat Non-leaded Package) is used as shown in Figure 3

[0024] ​​Each semiconductor chip's electrode is connected to multiple bumps 202. Multiple pre-defined dividing lines 203 are formed in a grid pattern on the front surface of the workpiece 200, and semiconductor chips are mounted within the regions divided by these dividing lines 203. The workpiece 200, configured as described above, is... Figure 2 The processing apparatus 210 shown cuts the predetermined dividing line 203 to divide it into individual device chips (equivalent to the chips described in the technical solution) 204.

[0025] Next, this specification describes a processing apparatus 210 for dividing the workpiece 200 into device chips 204. The processing apparatus 210 is an apparatus that holds the workpiece 200 on a holding table 10 and performs cutting along multiple predetermined dividing lines 203. In Embodiment 1, the processing apparatus 210 is an apparatus that holds the workpiece 200 without the dicing tape attached on the holding table 10 and performs a so-called full cut on the workpiece 200 to divide it into device chips 204.

[0026] like Figure 2 As shown, the processing apparatus 210 includes: a holding table 10 that holds the workpiece 200 by means of a holding surface 11; a cutting unit 20 that is a cutting unit that divides the workpiece 200 held by the holding table 10 by means of a cutting tool 21; and a control unit 100.

[0027] The holding table 10 has a rectangular holding surface 11 for holding the workpiece 200. The holding surface 11 is provided with: a suction port (not shown) for attracting the workpiece 200 and the device chip 204; and a tool relief groove (not shown) for allowing the cutting tool 21 to retract. The suction port is located at a position overlapping with the device chip 204 and opens into the holding surface 11. The tool relief groove is located at a position corresponding to the predetermined dividing line 203 and is recessed from the holding surface 11.

[0028] The suction port of the holding table 10 is connected to a vacuum suction source (not shown), and the vacuum suction source draws through the suction port, thereby attracting and holding the workpiece 200 on the holding surface 11. In addition, the holding table 10 is configured to move freely in the X-axis direction via a machining feed unit (not shown) and rotate freely about an axis parallel to the Z-axis direction via a rotary drive source (not shown).

[0029] The cutting unit 20 cuts the workpiece 200. The cutting unit 20 has a spindle (not shown) on which a cutting tool 21 is mounted, which cuts the workpiece 200 held by the holding table 10.

[0030] The cutting tool 21 is an extremely thin cutting abrasive tool having a substantially ring shape. The cutting tool 21 is rotated by a spindle to perform cutting on the workpiece 200. The spindle is housed in a spindle housing 22. The spindle of the cutting unit 20 and the axis of the cutting tool 21 are set to be parallel to the Y-axis direction.

[0031] The cutting unit 20 is arranged to be movable in the Y-axis direction by a division feed unit, not shown, and to be movable in the Z-axis direction by a cut-in feed unit, not shown, with respect to the workpiece 200 held by the holding stage 10. The cutting unit 20 is capable of positioning the cutting tool 21 at any position of the holding surface 11 of the holding stage 10 by the division feed unit and the cut-in feed unit. The cutting unit 20 is moved in the Y-axis direction and the Z-axis direction by the division feed unit and the cut-in feed unit to cut the division predetermined line 203 of the workpiece 200 held by the holding stage 10 moved in the X-axis direction by the machining feed unit to divide the workpiece 200 into a plurality of device chips 204.

[0032] In addition, the machining device 210 has a cassette 30 that houses a plurality of workpieces 200 before machining, a carry-out unit 40 that takes out the workpieces 200 from the cassette 30, a package carrying unit 50 that carries the workpieces 200 before machining taken out from the cassette 30 to the holding stage 10, a photographing unit 60 that photographs the workpieces 200 before machining to acquire an image for alignment, a cleaning unit 70 that cleans the lower surfaces of the device chips 204 each divided, a drying unit 80 that dries the device chips 204 cleaned by the cleaning unit 70, a carrying tray placement portion 90 that places the carrying tray 1 shown in the drawing for housing the device chips 204 each divided, a carrying unit 110 that is a carrying unit, and a tray photographing unit 120 that is a photographing unit. Figure 1 In addition, the machining device 210 has a cassette 30 that houses a plurality of workpieces 200 before machining, a carry-out unit 40 that takes out the workpieces 200 from the cassette 30, a package carrying unit 50 that carries the workpieces 200 before machining taken out from the cassette 30 to the holding stage 10, a photographing unit 60 that photographs the workpieces 200 before machining to acquire an image for alignment, a cleaning unit 70 that cleans the lower surfaces of the device chips 204 each divided, a drying unit 80 that dries the device chips 204 cleaned by the cleaning unit 70, a carrying tray placement portion 90 that places the carrying tray 1 shown in the drawing for housing the device chips 204 each divided, a carrying unit 110 that is a carrying unit, and a tray photographing unit 120 that is a photographing unit.

[0033] The cassette 30 houses a plurality of workpieces 200. The cassette 30 overlaps the plurality of workpieces 200 spaced apart in the Z-axis direction. The cassette 30 has an opening 31 through which the workpieces 200 are freely taken in and out. The cassette 30 is arranged to be freely movable up and down in the Z-axis direction by a cassette elevator, not shown.

[0034] The carrying-out unit 40 has a carrying-out unit 41 that takes out one piece of the workpiece 200 before processing from the cassette 30, and a pair of rails 42 that temporarily place the workpiece 200 taken out from the cassette 30. The package carrying unit 50 suction-holds the workpiece 200 on the pair of rails 42, carries the suction-held workpiece 200 to the holding table 10, and places it on the holding surface 11 of the holding table 10. The photographing unit 60 outputs an image obtained by photographing to the control unit 100. In Embodiment 1, the photographing unit 60 is installed to the package carrying unit 50. The cleaning unit 70 is provided between the holding table 10 and the carrying tray placement portion 90. The drying unit 80 is provided between the cleaning unit 70 and the carrying tray placement portion 90.

[0035] The carrying tray placement portion 90 places the carrying tray 1 on the upper surface 91. In Embodiment 1, the carrying tray placement portion 90 is provided with two at intervals in the Y-axis direction. The upper surface 91 of the carrying tray placement portion 90 is flatly formed along the horizontal direction and is formed larger than the planar shape of the workpiece 200 and the carrying tray 1. In addition, the carrying tray placement portion 90 can further have an elevator unit capable of moving up and down in order to place the carrying tray 1 below, since the carrying tray placement portion 90 can store a plurality of carrying trays 1 stacked. In addition, in order to take out a plurality of carrying trays 1 stacked, an opening and closing door connected to the carrying tray placement portion 90 can be provided on the front surface of the device.

[0036] The carrying unit 110 carries the workpiece 200 after cutting, that is, a plurality of device chips 204, from the holding table 10 to the carrying tray 1 placed on the upper surface 91 of the carrying tray placement portion 90. As shown in FIG. 1, the carrying unit 110 has a first carrying unit 111, a second carrying unit 112, and a third carrying unit 113. Figure 1

[0037] The first carrying unit 111 carries the workpiece 200 after cutting, that is, a plurality of device chips 204, from the holding table 10 to the cleaning unit 70. The second carrying unit 112 carries the workpiece 200 after cleaning, that is, a plurality of device chips 204, from the cleaning unit 70 to the drying unit 80. The third carrying unit 113 carries the workpiece 200 after drying, that is, a plurality of device chips 204, from the drying unit 80 to the carrying tray 1 placed on the upper surface 91 of the carrying tray placement portion 90 on one side.

[0038] The tray photographing unit 120 photographs the carrying tray 1 placed on the upper surface 91 of the carrying tray placement portion 90 after storing the workpiece 200, and recognizes the identification mark (mark 1) of the carrying tray 1. Figure 4 ​The tray photographing unit 120 photographs the recognition mark 5 to acquire an image of the recognition mark 5. The tray photographing unit 120 outputs the acquired image to the control unit 100. In Embodiment 1, the tray photographing unit 120 is installed to the third conveyance unit 113.

[0039] The conveyance tray 1 placed on the upper surface 91 of the conveyance tray placement portion 90 is used to accommodate and convey a plurality of device chips 204 formed by dividing the workpiece 200 along the division predetermined line 203. As shown in FIG. 1, the conveyance tray 1 has a tray main body 2, an adhesive layer 3, a recording medium 4 (shown only in FIG. 2), and a recognition mark 5 (shown only in FIG. 3). Figure 1 and Figure 4 As shown in FIG. 1, the conveyance tray 1 has the tray main body 2, the adhesive layer 3, the recording medium 4 (shown only in FIG. 2), and the recognition mark 5 (shown only in FIG. 3). Figure 4 Figure 4

[0040] The tray main body 2 has a device support portion 6 that is a flat plate shaped in a rectangular plane shape and is composed of a recess capable of accommodating the size of the workpiece 200, and a frame 7 formed around the outer periphery of the device support portion 6.

[0041] The device support portion 6 is composed of a recess recessed from the upper surface of the conveyance tray 1, and in Embodiment 1, is shaped in a rectangular shape larger than the plane shape of the workpiece 200. The device support portion 6 has a front surface 6-1 that supports the plurality of device chips 204 through the adhesive layer 3 at the bottom. The front surface 6-1 is formed flat along the horizontal direction. The front surface 6-1 of the device support portion 6 is configured to be capable of accommodating all of the device chips 204 singulated from the workpiece 200 at one time.

[0042] The frame 7 is formed around the outer periphery of the front surface 6-1 of the device support portion 6. The adhesive layer 3 is provided on the front surface 6-1 of the device support portion 6 of the tray main body 2 and is mounted on the front surface 6-1 of the device support portion 6. The adhesive layer 3 is exposed on the device support portion 6.

[0043] The adhesive layer 3 has an adhesive force (i.e., an adhesive force) that adheres the plurality of device chips 204. In Embodiment 1, the adhesive layer 3 is disposed on the entire front surface 6-1 of the device support portion 6, and the thickness is formed constant. The adhesive layer 3 can be composed of, for example, a heat-sensitive adhesive sheet Intelimer (registered trademark) tape manufactured by NITTA Corporation.

[0044] The recording medium 4 is provided in the tray main body 2. In Embodiment 1, as shown in FIG. 2, the recording medium 4 is provided on the front surface 6-1 of the device support portion 6 of the tray main body 2. Figure 4 ​​As shown, the recording medium 4 is embedded within the tray body 2. The recording medium 4 can write information from the outside via wireless communication and can also record information written from the outside via wireless communication. The recording medium 4 can read information recorded from the outside via wireless communication. In Embodiment 1, the recording medium 4 is an RFID (Radio Frequency Identifier) ​​tag, but in this invention, it is not limited to RFID tags.

[0045] The identification mark 5 is used to identify whether the transfer pallet 1 is capable of writing information to the recording medium 4. In Embodiment 1, the identification mark 5 is provided on the frame 7. In Embodiment 1, the identification mark 5 is a mark indicating the manufacturer of the processing device 210, for example, using a registered trademark indicating the manufacturer of the processing device 210, but this is not limited to this in the present invention. The identification mark 5 may be composed of printed marks, numbers, or words, or may be composed of reliefs formed on the frame 7, notches formed on the frame 7, etc.

[0046] like Figure 4 As shown, the transport tray 1 with the above structure holds multiple device chips 204, which are monolithically formed by cutting the workpiece 200, on the adhesive layer 3 for simultaneous storage. By holding multiple device chips 204 on the transport tray 1, each device chip 204 is adhered to the adhesive layer 3, thus preventing the device chips 204 stored in the device support 6 from moving and contacting other device chips 204 during transport, preventing damage to the outer periphery of the device chips 204, or preventing the device chips 204 from flying out of the device support 6 and breaking. Furthermore, in Embodiment 1, the transport tray 1 does not form a separating portion on the device support 6 to separate the device chips 204 from each other.

[0047] The control unit 100 controls each component of the processing apparatus 210 to enable the processing apparatus 210 to perform processing actions on the workpiece 200. For example... Figure 2 As shown, the control unit 100 has a storage unit 101, a determination unit 102, and a writing unit 103.

[0048] Storage unit 101 stores the image of identification mark 5. In Embodiment 1, storage unit 101 stores the image of identification mark 5 on transport pallet 1, which is captured by pallet imaging unit 120. In addition, in Embodiment 1, storage unit 101 stores processing content information (equivalent to the information in processing step ST1 described later), which indicates the conditions under which the processing apparatus 210 processes the workpiece 200 and device chip 204.

[0049] The determination unit 102 determines whether or not the conveyance tray 1 placed on the conveyance tray placement section 90 photographed by the tray photographing unit 120 is a kind capable of writing information to the recording medium 4. In Embodiment 1, when the image of the identification mark 5 of the conveyance tray 1 placed on the conveyance tray placement section 90 photographed by the tray photographing unit 120 coincides with the image of the identification mark 5 stored in the storage unit, the determination unit 102 determines that the conveyance tray 1 placed on the conveyance tray placement section 90 is a kind capable of writing information to the recording medium 4. In addition, in Embodiment 1, the image of the identification mark 5 of the conveyance tray 1 placed on the conveyance tray placement section 90 photographed by the tray photographing unit 120 and the image of the identification mark 5 stored in the storage unit are subjected to normalized correlation, and when the correlation value is equal to or greater than a predetermined prescribed value, the determination unit 102 determines that the images coincide, thereby determining that the conveyance tray 1 placed on the conveyance tray placement section 90 is a kind capable of writing information to the recording medium 4.

[0050] In addition, in Embodiment 1, the image of the identification mark 5 of the conveyance tray 1 placed on the conveyance tray placement section 90 photographed by the tray photographing unit 120 and the image of the identification mark 5 stored in the storage unit are subjected to normalized correlation, and when the correlation value is less than a predetermined prescribed value, the determination unit 102 determines that the images do not coincide, thereby determining that the conveyance tray 1 placed on the conveyance tray placement section 90 is not a kind capable of writing information to the recording medium 4.

[0051] The writing unit 103 reads out the processing content information indicating the conditions at the time of processing the device chip 204 placed in the conveyance tray 1 placed on the conveyance tray placement section 90 from the storage unit 101 and outputs to the recording unit 104 connected to the control unit 100 when the determination unit 102 determines that the conveyance tray 1 placed on the conveyance tray placement section 90 is a kind capable of writing information to the recording medium 4.

[0052] The recording unit 104 writes the processing content information from the writing unit 103 to the recording medium 4 of the conveyance tray 1 placed on the conveyance tray placement section 90. The recording unit 104 is constituted by, for example, a known RFID tag reader or the like.

[0053] The control unit 100 is connected to a display device 105 constituted by a liquid crystal display device or the like that displays the state of the processing operation, an image, or the like, and an input device 106 used by the operator when registering the processing content information or the like. The input device 106 is constituted by an external input device 107 such as a touch panel and a keyboard provided to the display device 105.

[0054] Further, the control unit 100 is a computer having an arithmetic processing device having a microprocessor like a CPU (central processing unit), a storage device having a memory like a ROM (read only memory) or a RAM (random access memory), and an input / output interface device. The arithmetic processing device of the control unit 100 performs arithmetic processing in accordance with a computer program stored in the storage device, and outputs a control signal for controlling the processing device 210 to the above-described components of the processing device 210 via the input / output interface device.

[0055] The function of the storage unit 101 is realized by the storage device storing the processing content information and the image of the identification mark 5. The functions of the determination unit 102 and the writing unit 103 are realized by the arithmetic processing device performing arithmetic processing in accordance with a computer program stored in the storage device.

[0056] Next, the processing operation of the processing device 210 of Embodiment 1 will be described. The operator stores the workpiece 200 before cutting processing in the cassette 30, places the conveyance tray 1 on the conveyance tray placement portion 90, and operates the input device 106 to register the processing content information in the control unit 100. When the control unit 100 receives a start instruction of the processing operation from the operator, the processing device 210 starts the processing operation. In the processing operation, the control unit 100 sequentially performs the processing of the workpiece 200 in the cassette 30 Figure 5 the workpiece.

[0057] The processing method of the workpiece is a method of storing the device chip 204 in the conveyance tray 1, as shown in Figure 5 The processing method of the workpiece has a processing step ST1, a storing step ST2, a discriminating step ST3, and a recording step ST4. The processing step ST1 is a step of performing cutting processing on the workpiece 200 to form a plurality of device chips 204. In the processing step ST1, the processing device 210 takes out one workpiece 200 from the cassette 30 by the conveyance-out unit 40, and conveys the workpiece 200 from the track 42 to the holding stage 10 by the package conveyance unit 50. In the processing step ST1, the processing device 210 holds the workpiece 200 by vacuum suction on the holding surface 11 of the holding stage 10 by a vacuum suction source, moves the holding stage 10 toward the lower side of the photographing unit 60 by the processing feed unit, and performs alignment by photographing the workpiece 200 by the photographing unit 60.

[0058] In the processing step ST1, the processing device 210 cuts the division predetermined lines 203 by the cutting tool 21 according to the processing content information. After the cutting, the processing device 210 holds the device chips 204 by the first conveying unit 111 in a state where the device chips 204 are held by the holding stage 10. The processing device 210 releases the holding of the holding stage 10 and conveys the device chips 204 held by the first conveying unit 111 to the cleaning unit 70.

[0059] In the processing step ST1, the processing device 210 cuts the division predetermined lines 203 by the cutting tool 21 according to the processing content information. After the cutting, the processing device 210 holds the device chips 204 by the first conveying unit 111 in a state where the device chips 204 are held by the holding stage 10. The processing device 210 releases the holding of the holding stage 10 and conveys the device chips 204 held by the first conveying unit 111 to the cleaning unit 70.

[0060] In the processing step ST1, the processing device 210 cuts the division predetermined lines 203 by the cutting tool 21 according to the processing content information. After the cutting, the processing device 210 holds the device chips 204 by the first conveying unit 111 in a state where the device chips 204 are held by the holding stage 10. The processing device 210 releases the holding of the holding stage 10 and conveys the device chips 204 held by the first conveying unit 111 to the cleaning unit 70.

[0061] The storage step ST2 is a step of storing the plurality of device chips 204 in the conveying tray 1. In the storage step ST2, the processing device 210 holds the device chips 204 subjected to the cutting, cleaning, and drying by the third conveying unit 113 and conveys the device chips 204 to the conveying tray 1 placed on the conveying tray placement portion 90.

[0062] In the storage step ST2, the processing device 210 holds the device chips 204 held by the third conveying unit 113 and presses the device chips 204 to the adhesive layer 3 of the conveying tray 1 to adhere the device chips 204 by the adhesive layer 3. After that, the processing device 210 releases the holding of the third conveying unit 113 and proceeds to the discrimination step ST3.

[0063] The discrimination step ST3 is a step of discriminating whether the conveying tray 1 is a kind capable of writing to the recording medium 4 by photographing the identification mark 5 of the conveying tray 1 placed on the conveying tray placement portion 90 and storing the plurality of device chips 204 by the tray photographing unit 120. In the embodiment 1, in the discrimination step ST3, as described above, the processing device 210 discriminates whether the conveying tray 1 is a kind capable of writing to the recording medium 4 by photographing the identification mark 5 of the conveying tray 1 placed on the conveying tray placement portion 90 and storing the plurality of device chips 204 by the tray photographing unit 120. Figure 6As shown, the processing device 210 causes the tray imaging unit 120 to image the identification mark 5 of the conveyance tray 1 on which the plurality of device chips 204 are stored in the conveyance tray placement section 90. The processing device 210 determines, by the determination unit 102, whether the image of the identification mark 5 of the conveyance tray 1 on which the plurality of device chips 204 are stored in the conveyance tray placement section 90 imaged by the tray imaging unit 120 and the image of the identification mark 5 stored in the storage unit coincide with each other, and when the determination is made that they coincide with each other, determines that the conveyance tray 1 on which the plurality of device chips 204 are stored in the conveyance tray placement section 90 is a kind capable of writing information on the recording medium 4, and proceeds to the recording step ST4.

[0064] The recording step ST4 is a step of recording the processing content information in the recording medium 4 in the processing step ST1 when the determination unit 102 determines that the kind of the conveyance tray 1 is a kind capable of writing information on the recording medium. In the recording step ST4, the processing device 210 reads out the processing content information indicating the conditions at the time of processing the device chips 204 in the conveyance tray 1 on which the plurality of device chips 204 are stored in the conveyance tray placement section 90 from the storage unit 101 by the writing unit 103, and outputs to the recording unit 104 connected to the control unit 100. In the recording step ST4, the processing device 210 writes the processing content information from the writing unit 103 in the recording medium 4 of the conveyance tray 1 on which the plurality of device chips 204 are stored in the conveyance tray placement section 90 by the recording unit 104, and ends the processing method of the workpiece.

[0065] In addition, when the determination unit 102 determines that the image of the identification mark 5 of the conveyance tray 1 on which the plurality of device chips 204 are stored in the conveyance tray placement section 90 imaged by the tray imaging unit 120 and the image of the identification mark 5 stored in the storage unit do not coincide with each other in the determination step ST3, and determines that the conveyance tray 1 on which the plurality of device chips 204 are stored in the conveyance tray placement section 90 is not a kind capable of writing information on the recording medium 4, the processing method of the workpiece of Embodiment 1 ends.

[0066] The conveyance tray 1 on which the device chips 204 are attached to the adhesive layer 3 is conveyed to the next process by an operator or the like, and a new conveyance tray 1 is placed on the conveyance tray placement section 90 to which the conveyance tray 1 has been conveyed by an operator or the like. The device chips 204 attached to the adhesive layer 3 of the conveyance tray 1 conveyed to the next process are picked up one by one from the adhesive layer 3.

[0067] The processing device 210 performs cutting processing on the next workpiece 200, and sequentially performs cutting processing on the workpieces 200 in the cassette 30, and when cutting processing is performed on all the workpieces 200 in the cassette 30, ends the processing operation.

[0068] The conveyance tray 1 of Embodiment 1 has the identification mark 5 that identifies whether or not it is a kind capable of writing information to the recording medium 4, so by obtaining an image of the identification mark 5, it is possible to determine whether or not it is a kind capable of writing the processing content information to the recording medium 4. As a result, it has the effect that when the conveyance tray 1 is a particular kind, it is possible to write information to the recording medium 4.

[0069] In addition, the conveyance tray 1 of Embodiment 1 has the adhesive layer 3, so it is possible to suppress movement of the device chip 204 housed in the device support portion 6 during conveyance from coming into contact with other device chips 204, generation of a defect in the outer periphery of the device chip 204, or breakage of the device chip 204 from flying out of the device support portion 6.

[0070] The processing method of the object to be processed of Embodiment 1 has the steps of: a determination step ST3 of determining whether or not the conveyance tray 1 is a kind capable of writing information to the recording medium 4 by the tray imaging unit 120 imaging the identification mark 5 of the conveyance tray 1 on which a plurality of device chips 204 are housed, placed on the conveyance tray placement portion 90; and a recording step ST4 of recording the processing content information in the processing step ST1 to the recording medium 4 in the case where it is determined that the kind of the conveyance tray 1 is a kind capable of writing information, so it has the effect that when the conveyance tray 1 is a particular kind, it is possible to write information to the recording medium 4.

[0071] In addition, the present application is not limited to the above-described embodiments. That is, various modifications can be made and implemented within the scope of the gist of the present application. In addition, in Embodiment 1, the conveyance tray 1 is a tray in which a partition portion that partitions the device chips 204 from each other is not formed on the device support portion 6, but in the present application, it is not limited to a tray that is held by the adhesive layer 3 without having a partition portion, but can also be a tray in which a partition portion that partitions the device chips 204 from each other is formed on the device support portion 6.

Claims

1. A processing method of a processed object, which accommodates a chip in a conveyance tray, characterized by the conveyance tray having: a tray main body having a device support portion having a front surface that supports a plurality of chips, and a frame portion formed around an outer periphery of the device support portion; a recording medium provided to the tray main body and capable of writing or reading information by wireless communication; and an identification mark provided to the frame portion, which identifies whether the conveyance tray is of a type capable of writing to the recording medium, a control unit of a processing device stores an image of the identification mark of the conveyance tray, the processing method of the processed object has steps of: a processing step of processing a processed object to form a plurality of chips; an accommodation step of accommodating the plurality of chips in the conveyance tray; a discrimination step of discriminating whether an image of the identification mark of the conveyance tray photographed by a photographing unit coincides with the stored image of the identification mark by photographing the identification mark with the photographing unit; and a recording step of recording information in the processing step in the recording medium in a case where it is determined that the images coincide in the discrimination step.

2. The processing method of the processed object according to claim 1, characterized in that the conveyance tray has an adhesive layer mounted on the front surface of the device support portion of the tray main body and having an adhesive force.

3. The processing method of the processed object according to claim 1 or 2, characterized in that the photographing unit is mounted to a conveyance unit that conveys the plurality of chips. ​ ​

Images