An LED chip pad printing device with a customizable arrangement scheme

Abstract

The present invention provides an LED chip pad printing device with a customizable arrangement scheme, which includes a pad printing platform and an addressing adsorption control device; an initial fixing station and a target fixing station are arranged on the pad printing platform, an LED chip carrier is arranged on the initial fixing station, and a target carrier is arranged on the target fixing station; the addressing adsorption control device includes an adsorption mechanism, a CCD optical positioning and centering device, and a wafer scanning block coordinate positioning system. The addressing adsorption control device controls the adsorption mechanism to transfer the LED chips on the LED chip carrier to the target carrier in a required arrangement array by means of magnetism according to the required arrangement array. The present invention is an LED chip pad printing device with a customizable arrangement scheme, which has the beneficial effects of easy operation and the ability to customize the pad printing scheme according to the chip arrangement requirements of the target carrier.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and more particularly, to an LED chip pad printing device with a customizable arrangement scheme. Background Art

[0002] Miniature LEDs (MiniLED or MicroLED) are a display technology that, after thinning, miniaturizing, and matrixifying the traditional LED structure, uses PCB, flexible FPC, BT, and CMOS / TFT integrated circuit processes to fabricate a driving circuit to achieve address control and individual driving of each pixel point in the LED light source. Due to the fact that various indicators of MiniLED technology, such as brightness, contrast, response time, viewing angle, and resolution, are superior to those of LCD and OLED technologies, combined with the advantages of self-luminescence, simple structure, small size, and energy conservation, it has received extensive attention.

[0003] After the MiniLED chips are fabricated, they need to be transferred to a driving circuit board to form an LED array, which is called mass transfer. Since MiniLED chips are too small and the quantity is huge, existing automated transfer devices directly adsorb and transfer single LED chips to the driving circuit board for die bonding using vacuum adsorption needles or first adsorb them to a transfer tape. Their arrangement methods are limited and single, and users often cannot perform mass transfer according to the different LED chip arrangement requirements on different driving circuits.

[0004] In view of this, the inventors of the present application have invented an LED chip pad printing device with a customizable arrangement scheme that is easy to operate and can customize the transfer scheme according to the chip layout requirements of the driving circuit, thereby realizing die bonding, sorting, and arrangement of LED chips. Summary of the Invention

[0005] The purpose of the present invention is to provide an LED chip pad printing device with a customizable arrangement scheme that is easy to operate and can customize the transfer scheme according to the chip layout requirements of the driving circuit.

[0006] To achieve the above purpose, the present invention adopts the following technical solutions:

[0007] An LED chip pad printing device with a customizable arrangement scheme includes a pad printing platform and an addressable adsorption control device; an initial fixing station and a target fixing station are provided on the pad printing platform, an LED chip carrier is provided on the initial fixing station, and a target carrier is provided on the target fixing station; the addressable adsorption control device includes an adsorption mechanism, a CCD optical positioning and centering device, and a wafer scanning block coordinate positioning system. The addressable adsorption control device controls the adsorption mechanism to transfer the LED chips on the LED chip carrier to the target carrier in the required arrangement array by magnetizing according to the required arrangement array.

[0008] As a further improvement, the adsorption mechanism includes an adsorption plate and an IC control chip group circuit board. The conductive coil board is evenly provided with adsorption holes arranged at the chip unit pitch. The adsorption holes are arranged in one-to-one correspondence with the LED chips. Conductive coils are arranged in each of the adsorption holes. The IC control chip group circuit board includes a magnetic conductor extending into each of the conductive coils and at least one IC control chip. Each IC control chip controls the energization and de-energization of at least one conductive coil to adsorb or release the corresponding LED chip.

[0009] As a further improvement, the adsorption mechanism includes a magnetic conductor array template and a conductive coil board. The conductive coil board is evenly provided with adsorption holes arranged at the chip unit pitch. Conductive coils are arranged in each of the adsorption holes. The conductive coils in the adsorption holes are connected in series. The magnetic conductor array template is provided with a plurality of magnetic conductors arranged according to the required array. The conductive coil board is arranged above the LED chip carrier in a liftable manner and the adsorption holes are arranged in one-to-one correspondence with the LED chips. The magnetic conductor array template is arranged above the conductive coil board in a liftable manner and the magnetic conductors are arranged corresponding to the adsorption holes.

[0010] As a further improvement, the adsorption mechanism includes a magnetic conductor array template and a conductive coil board. The conductive coil board is evenly provided with a plurality of adsorption holes arranged at the chip unit pitch. Conductive coils are arranged on the outer side wall of the conductive coil board. The magnetic conductor array template is provided with a plurality of magnetic conductors arranged according to the required array. The conductive coil board is arranged above the LED chip carrier in a liftable manner and the adsorption holes are arranged in one-to-one correspondence with the LED chips. The magnetic conductor array template is arranged above the conductive coil board in a liftable manner and the magnetic conductors are arranged corresponding to the adsorption holes.

[0011] As a further improvement, the adsorption mechanism includes a conductive coil array template and a magnetic conductor board. A plurality of vertically movable magnetic conductors are evenly arranged on the magnetic conductor board at the chip unit pitch. The conductive coil array template is provided with a plurality of serially connected adsorption holes arranged according to the required array. Conductive coils are arranged in each of the adsorption holes. The magnetic conductor board is arranged above the conductive coil array template in a liftable manner and the magnetic conductors are arranged in one-to-one correspondence with the adsorption holes. The conductive coil array template is arranged above the LED chip carrier in a liftable manner and the adsorption holes are arranged corresponding to the LED chips.

[0012] As a further improvement, the adsorption mechanism includes a conductive coil array template and a magnetizable plate. A number of magnetizable bodies that can move up and down are evenly arranged on the magnetizable plate at the chip unit pitch. The conductive coil array template is provided with a number of adsorption holes arranged according to the required array. A conductive coil is arranged on the outer side wall of the conductive coil array template. The magnetizable plate is arranged above the conductive coil array template in a liftable manner and the magnetizable bodies are arranged corresponding to the adsorption holes. The conductive coil array template is arranged above the LED chip carrier in a liftable manner and the adsorption holes are arranged corresponding to the LED chips.

[0013] As a further improvement, the adsorption mechanism includes a conductive coil array template and a magnetizable plate. A number of magnetizable bodies that can move up and down are evenly arranged on the magnetizable plate at the chip unit pitch. The conductive coil array template is provided with a number of adsorption holes arranged according to the required array. The magnetizable plate is arranged above the conductive coil array template in a liftable manner and the magnetizable bodies are arranged corresponding to the adsorption holes. The conductive coil array template is arranged above the LED chip carrier in a liftable manner and the adsorption holes are arranged corresponding to the LED chips.

[0014] As a further improvement, if the width of the LED chip is defined as d, the diameter range of the magnetizable body is 0.25d to 4d.

[0015] As a further improvement, a detachable tape carrier is arranged below the adsorption mechanism. The detachable tape carrier is used to install a transfer tape. The distance range between the transfer tape and the lower surface of the adsorption mechanism is 0 to 100 μm.

[0016] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0017] 1. The LED chip pad printing device with a customizable arrangement scheme of the present invention adopts a structure of a conductive coil board combined with an IC control chip group circuit board. It can effectively control the conductive coils of the adsorption holes at any position by multiple IC control chips for continuous array control or spaced array control or customizable array control to make the corresponding magnetizable bodies magnetic, so as to achieve the effect of customizing and transferring a huge amount of LED chips on the LED chip carrier to the target carrier according to the required array. The overall structure is ingenious and the function is easy to implement. It overcomes the disadvantages that the traditional transfer device can only realize single-chip transfer of LED chips, the transfer method is single, and it cannot automatically transfer LED chips with different arrangement requirements, resulting in the fact that some LED chip arrangements with different requirements can only be sorted and installed manually, with a large labor cost.

[0018] 2. The LED chip pad printing device with a customizable arrangement scheme of the present invention can effectively achieve the adsorption of LED chips with different arrangement arrays by replacing the magnet conductor array module with magnet conductors of different arrangement arrays and combining the structure of series-connected adsorption holes (while energizing all conductive coils), without the need to separately control the on-off of the conductive coils in each adsorption hole through an IC control chip. The overall structure is simpler and more ingenious, and the cost is lower.

[0019] 3. The LED chip pad printing device with a customizable arrangement scheme of the present invention effectively achieves the adsorption of LED chips with different arrangement arrays by replacing the adsorption hole array module with adsorption holes of different arrangement arrays and combining the structure of a magnet conductor plate with a movable magnet conductor up and down, without the need to separately control the on-off of the conductive coils in each adsorption hole through an IC control chip. It only needs to ensure that the conductive coils in the adsorption holes conduct electricity simultaneously. The overall structure is simpler and more ingenious, and the cost is lower. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention, and therefore should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can be obtained based on these drawings without creative efforts.

[0021] Figure 1 It is a schematic structural diagram of an LED chip pad printing device with a customizable arrangement scheme in Embodiment 1 of the present invention;

[0022] Figure 2 It is a schematic structural diagram of the adsorption mechanism in Embodiment 1 of the present invention;

[0023] Figure 3 It is a schematic structural diagram of an LED chip pad printing device with a customizable arrangement scheme in Embodiments 2 to 5 of the present invention;

[0024] Figure 4 It is a schematic structural diagram of an LED chip pad printing device with a customizable arrangement scheme in Embodiments 2 to 5 of the present invention;

[0025] Figure 5 It is a schematic structural diagram of the adsorption mechanism in Embodiment 2 of the present invention;

[0026] Figure 6 It is a schematic structural diagram of the adsorption mechanism in Embodiment 3 of the present invention;

[0027] Figure 7 It is a schematic structural diagram of the adsorption mechanism in Embodiment 4 of the present invention;

[0028] Figure 8 It is a schematic structural diagram when the adsorption mechanisms are combined in Embodiment 4 of the present invention;

[0029] Figure 9 It is a schematic structural diagram of the adsorption mechanism in Embodiment 5 of the present invention.

[0030] Description of main component symbols

[0031] 100, pad printing device; 1, pad printing platform; 11, LED chip carrier; 12, target carrier;

[0032] 2, addressing adsorption control device; 21, adsorption mechanism; 211, adsorption plate; 212, IC control chip group IC control chip group circuit board; 2121, magnetic conductor; 2122, IC control chip;

[0033] 221, magnetic conductor array template; 222, conductive coil board;

[0034] 231, magnetic conductor board; 232, conductive coil array template. Detailed implementation manners

[0035] To make the objectives, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some but not all of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts fall within the protection scope of the present invention. Therefore, the following detailed description of the embodiments of the present invention provided in the drawings is not intended to limit the scope of the claimed present invention, but merely represents selected embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts fall within the protection scope of the present invention.

[0036] In the present invention, unless otherwise clearly defined and limited, the terms "installed", "connected", "connected", "fixed" and other terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication of two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0037] In the present invention, unless otherwise clearly defined and limited, the first feature being "on" or "under" the second feature may include direct contact between the first and second features, or may include the first and second features not being in direct contact but being in contact through additional features therebetween. Moreover, the first feature being "above", "over" and "on top of" the second feature includes the first feature being directly above and obliquely above the second feature, or merely indicating that the horizontal height of the first feature is higher than that of the second feature. The first feature being "under", "beneath" and "underneath" the second feature includes the first feature being directly below and obliquely below the second feature, or merely indicating that the horizontal height of the first feature is less than that of the second feature.

[0038] Embodiment 1

[0039] Please refer to Figures 1 to 2 , in an embodiment, a pad printing device 100 for an LED chip with a customizable arrangement scheme includes a pad printing platform 1 and an addressing adsorption control device 2; an initial fixing station and a target fixing station are provided on the pad printing platform 1, an LED chip carrier 11 is provided on the initial fixing station, and a target carrier 12 is provided on the target fixing station; the addressing adsorption control device 2 includes an adsorption mechanism 21, a CCD optical positioning and centering device and a wafer scanning block coordinate positioning system, and the addressing adsorption control device 2 controls the adsorption mechanism 21 to magnetize with a required arrangement array to transfer the LED chips on the LED chip carrier 11 to the target carrier 12 according to the required arrangement array.

[0040] The LED chip carrier 11 is customized, that is, the size and shape of the LED chip carrier 11 can be customized according to customer requirements, and can be carriers of different sizes such as 4 inches, 6 inches, 8 inches, etc. to adapt to different application scenarios and different requirements; a region for placing the LED chips to be adsorbed is provided in the center of the LED chip carrier 11. At the beginning of the operation, after the adsorption mechanism 21 and the LED chip carrier 11 are centered by the CCD optical positioning and centering device to find the center position of the LED chip carrier 11, the wafer scanning block coordinate positioning system performs wafer scanning to determine the coordinates of each LED chip and position and assign values. Finally, the magnetic conductor 2121 at the corresponding position of the required arrangement array is precisely controlled to magnetize through coordinate identification to achieve customized massive adsorption. The addressing adsorption control device 2 can move horizontally and vertically above the pad printing platform 1 through a guide rail structure. In addition, the addressing adsorption control device 2 can also be a manipulator structure and transfer by flipping.

[0041] Please refer to Figure 2, the adsorption mechanism 21 includes an adsorption plate 211 and an IC control chip group circuit board 212. The adsorption plate 211 is evenly provided with adsorption holes arranged at the chip unit pitch. The adsorption holes are arranged in one-to-one correspondence with the LED chips. Conductive coils are arranged in each adsorption hole. The IC control chip group circuit board 212 includes a magnetic conductor 2121 extending into the conductive coils and at least one IC control chip 2122. The magnetic conductor 2121 is vertically and fixedly arranged below the IC control chip group circuit board 212. Each IC control chip 2122 controls the energization and de-energization of at least one conductive coil to adsorb or release the corresponding LED chip, that is, each IC control chip 2122 can control the energization and de-energization of multiple conductive coils. With multiple IC control chips 2122, the energization and de-energization of the conductive coils at any position on the entire adsorption plate 211 can be controlled. The principle of the IC control chip group circuit board 212 can refer to the circuit structure after removing the LED lights in the existing Micro LED display screen, and the IC control chip 2122 is connected to the conductive coil, which will not be elaborated here.

[0042] Specifically, a threaded groove is provided inside the adsorption hole. The threaded groove is used to fix and wind the conductive coil. A wire passing hole is provided on one side of each adsorption hole. One end of each conductive coil is connected to the IC control chip 2122, then winds and fixes through the threaded groove above the adsorption hole and returns from the bottom to the upper part through the wire passing hole to be connected to the same IC control chip 2122, and so on. Multiple conductive coils (not shown in the figure) can be connected to each IC control chip 2122.

[0043] By adopting the structure of the adsorption plate 211 combined with the IC control chip group circuit board 212, the energization of the conductive coils of the adsorption holes at any position can be effectively controlled continuously in an array, or at intervals in an array, or customarily in an array by multiple IC control chips 2122 to make the corresponding magnetic conductor 2121 magnetic, so as to achieve the effect of customarily transferring a huge amount of LED chips on the LED chip carrier 11 to the target carrier 12 in the required arranged array. The overall structure is ingenious and the function is easy to implement, overcoming the shortcomings that the traditional transfer device can only achieve single-chip transfer of LED chips, the transfer method is single, and it cannot automatically transfer LED chips with different arrangement requirements, resulting in the need for manual sorting and installation for some LED chip arrangements with different requirements, and the labor cost is high.

[0044] Please refer to Figures 1 to 2 , define the width of the LED chip as d, then the diameter range of the magnetic conductor 2121 is 0.25d to 4d. Preferably, the diameter of the magnetic conductor 2121 is 0.75 to 1.25d. Such a size setting can not only ensure that the magnetic conductor 2121 has enough magnetic force to adsorb the LED chip, but also prevent the magnetic conductor 2121 from being inconvenient to penetrate into the adsorption hole due to too large size.

[0045] Furthermore, a removable tape carrier (not shown in the figure) is provided below the adsorption mechanism 21. The removable tape carrier is used to install the transfer tape. The removable tape carrier can be provided with a clamp on the sliding arm of the pad printing platform 1 and can be removably fixed by fasteners such as bolts. The removable tape carrier includes a fixing ring and a slot ring. The slot ring is provided with a circular ring groove that matches the fixing ring. First, the transfer tape is laid on the fixing ring, and then the slot ring is buckled onto the fixing ring to press the transfer tape. Finally, the removable tape carrier with the transfer tape is fixed to the clamp of the pad printing platform 1. When replacement is required, it can be removed from the clamp and the fixing ring and the slot ring can be separated. When such a structure is adopted, the distance range between the transfer tape and the lower surface of the adsorption mechanism is 0~100um, and at this time, the magnetic conductor 2121 can completely enter the adsorption hole and be flush with the lower surface of the adsorption hole, and the LED chip is adsorbed onto the transfer tape in the required array through the air, and then the adsorption mechanism 21 moves with the transfer tape and the LED chip to the target carrier 12. When the target carrier 12 is the driver circuit board that is ultimately to be installed, the transfer tape is not required. When the target carrier 12 is only a placement carrier, the subsequent user can directly transfer the transfer tape carrying the LED chip and manually install it on the driver circuit board. The structure of the transfer tape can effectively realize the mass production of LED chips carrying the required array, thereby improving the overall production efficiency.

[0046] In addition, a transfer tape can be directly adhered to the lower surface of the adsorption mechanism 21, and the distance between the transfer tape and the lower end of the magnet 2121 after it completely enters the adsorption hole is in the range of 0 to 100um. Maintaining such a distance setting can ensure that the suction force of the magnet 2121 can suck up the LED chip through the transfer tape; the magnet 2121 can reliably use magnetic force to adsorb the LED chips in the desired array onto the transfer tape.

[0047] In this embodiment, the size of the adsorption hole is not limited and can be selected according to the specific size of the mini LED or Micro LED device. The diameter of the adsorption hole ranges from 0.5 μm to 300 μm, and the conductive coils in each adsorption hole are controlled by the IC control chip 2122 in a partitioned manner. In this embodiment, the conductive coil in each adsorption hole can be controlled individually by the IC control chip 2122, or the IC control chip 2122 can be used to uniformly control the conductive coils in multiple adsorption holes. The IC control chip 2122 drives and controls the conductive coils in the adsorption hole to turn on and off, thereby realizing the absorption, transfer, and release of a single core particle or a group of core particles.

[0048] Example 2

[0049] Please refer toFigure 3 , Figure 4 and Figure 5 , the difference between Example 2 and Example 1 is that the adsorption mechanism 21 includes a magnetizable body array template 221 and a conductive coil board 222. The conductive coil board 222 is evenly provided with adsorption holes arranged at the chip unit pitch. Conductive coils are arranged in the adsorption holes. The conductive coils in the adsorption holes are connected in series. The magnetizable body array template 221 is provided with a number of magnetizable bodies 2121 arranged according to the required array. The conductive coil board 222 is arranged above the LED chip carrier 11 in a liftable manner, and the adsorption holes are arranged in one-to-one correspondence with the LED chips. The magnetizable body array template 221 is arranged above the conductive coil board 222 in a liftable manner, and the magnetizable bodies 2121 are arranged in correspondence with the adsorption holes.

[0050] Specifically, a threaded groove is formed on the inner side of the adsorption hole. The threaded groove is used to fix the wound conductive coil. A wire passing hole is formed on one side of each adsorption hole. One end of each conductive coil is connected to the positive electrode of the power supply, and then is wound and fixed through the threaded groove from above the adsorption hole and returns from the bottom to the upper part through the wire passing hole to be connected to one end of the conductive coil of the next adsorption hole, and so on, and finally is connected to the negative electrode of the power supply (not shown in the figure).

[0051] Please refer to Figures 3 to 5 , different from the need for the conductive coil board 222 and the IC control chip group circuit board 212 in Example 1 to be closely used (to avoid the disconnection between the IC control chip 2122 and the conductive coil), the magnetizable body array template 221 and the conductive coil board 222 are cooperated through an interlocking clamping structure. The magnetizable body array template 221 can realize the vertical lifting movement above the conductive coil board 222 through a guide rail mechanism. At the same time, clamps can be arranged on the sliding arms of the magnetizable body array template 221 and the conductive coil board 222, and detachable fixation can be carried out through fasteners such as bolts. In this embodiment, when it is necessary to adsorb LED chips with different required array arrangements, directly replace the magnetizable body array template 221 with the magnetizable bodies 2121 of the required array arrangement.

[0052] By replacing the magnetizable body 2121 array module with different array arrangements of magnetizable bodies 2121 combined with the structure of the series-connected adsorption holes (while energizing all the conductive coils), the adsorption of LED chips with different array arrangements can be quickly realized without the need to separately control the on-off of the conductive coils in each adsorption hole through the IC control chip 2122. The overall structure is simpler and more ingenious, and the cost is lower.

[0053] Example 3

[0054] Please refer to Figure 6, the difference between Embodiment 3 and Embodiment 2 is that the adsorption mechanism 21 includes a magnetizable body array template 221 and a conductive coil plate 222. The conductive coil plate 222 is evenly provided with a plurality of adsorption holes arranged at the chip unit pitch. A conductive coil is provided on the outer side wall of the conductive coil plate 222. The magnetizable body array template 221 is provided with a plurality of magnetizable bodies 2121 arranged in an array as required. The conductive coil plate 222 is liftably arranged above the LED chip carrier 11 and the adsorption holes are arranged in one-to-one correspondence with the LED chips. The magnetizable body array template 221 is liftably arranged above the conductive coil plate 222 and the magnetizable bodies 2121 are arranged in correspondence with the adsorption holes.

[0055] Specifically, a threaded groove is provided on the outer side of the conductive coil plate 222 for fixedly winding the conductive coil. One end of the conductive coil is connected to the positive pole of the power supply, and the other end is directly connected to the negative pole of the power supply (not shown in the figure).

[0056] Compared with the structure in which a conductive coil is provided in each adsorption hole, the overall structure of arranging a large conductive coil on the outer side wall of the conductive coil plate 222 is simpler and the cost is lower.

[0057] Embodiment 4

[0058] Please refer to Figure 3 , Figure 4 , Figure 7 and Figure 8 , the difference between Embodiment 4 and Embodiment 2 is that the adsorption mechanism 21 includes a conductive coil array template 232 and a magnetizable body plate 231. The magnetizable body plate 231 is evenly provided with a plurality of magnetizable bodies 2121 that can move up and down arranged at the chip unit pitch. The conductive coil array template 232 is provided with a plurality of serially connected adsorption holes arranged in an array as required. Conductive coils are provided in the adsorption holes. The magnetizable body plate 231 is liftably arranged above the conductive coil array template 232 and the magnetizable bodies 2121 are arranged in one-to-one correspondence with the adsorption holes. The conductive coil array template 232 is liftably arranged above the LED chip carrier 11 and the adsorption holes are arranged in correspondence with the LED chips.

[0059] Meanwhile, different from the need for the conductive coil board 222 and the IC control chip group circuit board 212 to be closely attached in Embodiment 1 (to avoid the disconnection between the IC control chip 2122 and the conductive coil), the magnetic conductor plate 231 and the conductive coil array template 232 are cooperated through an interlocking clamping structure. The magnetic conductor plate 231 can perform a vertical lifting movement above the conductive coil array template 232 through a guide rail mechanism. At the same time, both the magnetic conductor plate 231 and the conductive coil array template 232 can be provided with clamps on the sliding arm and be detachably fixed through fasteners such as bolts. In this embodiment, when it is necessary to adsorb LED chips with different required array arrangements, directly replace the conductive coil array template 232 with the adsorption holes of the required array arrangement.

[0060] Specifically, please refer to Figure 7 and Figure 8 , a plurality of sliding limit grooves for the magnetic conductor 2121 to slide up and down are provided in the magnetic conductor plate 231. The sliding limit grooves include a first groove portion and a second groove portion that are connected. The first groove portion is arranged close to the conductive coil array template 232 and the diameter of the first groove portion is smaller than that of the second groove portion. A limit portion is provided on the magnetic conductor 2121. The limit portion can move up and down in the second groove portion and cannot pass through the first groove portion. When in use, when the magnetic conductor plate 231 is lifted above the conductive coil array template 232, the magnetic conductor 2121 that conforms to the array arrangement penetrates into the conductive coil array template 232 and extends to the adsorption holes to realize the adsorption effect on the LED chips. The magnetic conductor 2121 that does not conform to the array arrangement cannot penetrate into the conductive coil array template 232. At the same time, under the reaction force of the conductive coil array template 232, the magnetic conductor 2121 is pushed up, and at this time, the limit portion moves upward in the second groove portion.

[0061] In addition, a threaded groove is opened inside the adsorption hole. The threaded groove is used to fix the wound conductive coil. A wire passing hole is opened on one side of each adsorption hole. One end of each conductive coil is connected to the positive electrode of the power supply, and then is wound and fixed through the threaded groove above the adsorption hole and returns from the bottom to the upper part through the wire passing hole to be connected to one end of the conductive coil of the next adsorption hole, and so on, and finally is connected to the negative electrode of the power supply (not shown in the figure).

[0062] By replacing the adsorption hole array module with adsorption holes of different array arrangements and combining the magnetic conductor plate 231 with the movable magnetic conductor 2121 up and down, the adsorption of LED chips with different array arrangements can be quickly realized. There is no need to separately control the on-off of the conductive coils in each adsorption hole through the IC control chip 2122. It only needs to ensure that the conductive coils in the adsorption holes are conductive at the same time. The overall structure is simpler and more ingenious, and the cost is lower.

[0063] Embodiment 5

[0064] Please refer to Figure 9 In Embodiment 5, it is different from Embodiment 4 in that the adsorption mechanism 21 includes a conductive coil array template 232 and a magnetic conductor plate 231. A number of movable magnetic conductors 2121 are evenly arranged on the magnetic conductor plate 231 at the chip unit pitch. The conductive coil array template 232 is provided with a number of adsorption holes arranged according to the required array. A conductive coil is arranged on the outer side wall of the conductive coil array template 232. The magnetic conductor plate 231 is arranged above the conductive coil array template 232 in a liftable manner, and the magnetic conductors 2121 are arranged corresponding to the adsorption holes. The conductive coil array template 232 is arranged above the LED chip carrier 11 in a liftable manner, and the adsorption holes are arranged corresponding to the LED chips.

[0065] Specifically, a thread groove is provided on the outer side of the conductive coil array template 232 for fixing and winding the conductive coil. One end of the conductive coil is connected to the positive pole of the power supply, and the other end is directly connected to the negative pole of the power supply (not shown in the figure).

[0066] Compared with the structure in which a conductive coil is provided in each adsorption hole, the overall structure is simpler and the cost is lower by arranging a large conductive coil on the outer side wall of the conductive coil array template 232.

[0067] Embodiment 6

[0068] In Embodiment 6, it is different from Embodiment 4 in that the adsorption mechanism 21 includes a conductive coil array template 232 and a magnetic conductor plate 231. A number of movable magnetic conductors 2121 are evenly arranged on the magnetic conductor plate 231 at the chip unit pitch. The magnetic conductor plate 231 and the magnetic conductors 2121 are permanent magnets. The conductive coil array template 232 is provided with a number of adsorption holes arranged according to the required array. The magnetic conductor plate 231 is arranged above the conductive coil array template 232 in a liftable manner, and the magnetic conductors 2121 are arranged corresponding to the adsorption holes. The conductive coil array template 232 is arranged above the LED chip carrier 11 in a liftable manner, and the adsorption holes are arranged corresponding to the LED chips.

[0069] The structure in which the magnetic conductor plate 231 and the magnetic conductors 2121 are permanent magnets can make the overall structure simpler. Without arranging a conductive coil in the adsorption hole, the magnetic conductors 2121 can be magnetized by themselves, and combined with the conductive coil array template 232, the adsorption of the required array of LED chips can be quickly realized.

[0070] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. An LED chip pad printing device with a customizable arrangement scheme, characterized in that: It includes a pad printing platform (1) and an addressing adsorption control device (2); an initial fixing station and a target fixing station are provided on the pad printing platform (1), an LED chip carrier (11) is provided on the initial fixing station, and a target carrier (12) is provided on the target fixing station; the addressing adsorption control device (2) includes an adsorption mechanism (21), a CCD optical positioning and centering device, and a wafer scanning block coordinate positioning system. The addressing adsorption control device (2) controls the adsorption mechanism (21) to magnetize according to the required arrangement array, so as to transfer the LED chips on the LED chip carrier (11) to the target carrier (12) according to the required arrangement array. At the beginning of the operation, first, the adsorption mechanism (21) and the LED chip carrier (11) are centered by the CCD optical positioning and centering device to find the center position of the LED chip carrier (11). Then, the wafer scanning block coordinate positioning system performs wafer scanning to determine the coordinates of each LED chip and assigns positions. Finally, the magnetic conductor (2121) at the corresponding position of the required arrangement array is precisely controlled by coordinate identification to achieve custom massive adsorption. Among them, the adsorption mechanism (21) includes an adsorption plate (211) and an IC control chip group circuit board (212). The conductive coil board (222) is evenly provided with adsorption holes arranged at the chip unit pitch. The adsorption holes are arranged in one-to-one correspondence with the LED chips. Conductive coils are arranged in each adsorption hole. The IC control chip group circuit board (212) includes a magnetic conductor (2121) extending into the conductive coil and at least one IC control chip (2122). Each IC control chip (2122) controls at least one conductive coil to be energized or de-energized to adsorb or release the corresponding LED chip. Alternatively, the adsorption mechanism (21) includes a magnetic conductor array template (221) and a conductive coil board (222). The conductive coil board (222) is evenly provided with adsorption holes arranged at the chip unit pitch. Conductive coils are arranged in each adsorption hole. The conductive coils in the adsorption holes are connected in series. The magnetic conductor array template (221) is provided with a plurality of magnetic conductors (2121) according to the required arrangement array. The conductive coil board (222) is arranged above the LED chip carrier (11) in a liftable manner, and the adsorption holes are arranged in one-to-one correspondence with the LED chips. The magnetic conductor array template (221) is arranged above the conductive coil board (222) in a liftable manner, and the magnetic conductors (2121) are arranged in correspondence with the adsorption holes. Alternatively, the adsorption mechanism (21) includes a magnetically conductive body array template (221) and a conductive coil board (222). The conductive coil board (222) is evenly provided with a plurality of adsorption holes arranged at the chip unit pitch. A conductive coil is provided on the outer side wall of the conductive coil board (222). The magnetically conductive body array template (221) is provided with a plurality of magnetically conductive bodies (2121) arranged in a required array. The conductive coil board (222) is arranged above the LED chip carrier (11) in a liftable manner, and the adsorption holes are arranged in one-to-one correspondence with the LED chips. The magnetically conductive body array template (221) is arranged above the conductive coil board (222) in a liftable manner, and the magnetically conductive bodies (2121) are arranged in correspondence with the adsorption holes. Alternatively, the adsorption mechanism (21) includes a conductive coil array template (232) and a magnetically conductive body board (231). The magnetically conductive body board (231) is evenly provided with a plurality of magnetically conductive bodies (2121) that can move up and down at the chip unit pitch. The conductive coil array template (232) is provided with a plurality of serially connected adsorption holes arranged in a required array. Conductive coils are arranged in the adsorption holes. The magnetically conductive body board (231) is arranged above the conductive coil array template (232) in a liftable manner, and the magnetically conductive bodies (2121) are arranged in one-to-one correspondence with the adsorption holes. The conductive coil array template (232) is arranged above the LED chip carrier (11) in a liftable manner, and the adsorption holes are arranged in correspondence with the LED chips. Alternatively, the adsorption mechanism (21) includes a conductive coil array template (232) and a magnetically conductive body board (231). The magnetically conductive body board (231) is evenly provided with a plurality of magnetically conductive bodies (2121) that can move up and down at the chip unit pitch. The conductive coil array template (232) is provided with a plurality of adsorption holes arranged in a required array. A conductive coil is provided on the outer side wall of the conductive coil array template (232). The magnetically conductive body board (231) is arranged above the conductive coil array template (232) in a liftable manner, and the magnetically conductive bodies (2121) are arranged in correspondence with the adsorption holes. The conductive coil array template (232) is arranged above the LED chip carrier (11) in a liftable manner, and the adsorption holes are arranged in correspondence with the LED chips. Alternatively, the adsorption mechanism (21) includes a conductive coil array template (232) and a magnetically conductive body board (231). The magnetically conductive body board (231) is evenly provided with a plurality of magnetically conductive bodies (2121) that can move up and down at the chip unit pitch. The magnetically conductive body board (231) and the magnetically conductive bodies (2121) are permanent magnets. The conductive coil array template (232) is provided with a plurality of adsorption holes arranged in a required array. The magnetically conductive body board (231) is arranged above the conductive coil array template (232) in a liftable manner, and the magnetically conductive bodies (2121) are arranged in correspondence with the adsorption holes. The conductive coil array template (232) is arranged above the LED chip carrier (11) in a liftable manner, and the adsorption holes are arranged in correspondence with the LED chips. Among them, the width of the LED chip is defined as d, and the diameter range of the magnetic conductor (2121) is 0.25d to 4d; Among them, a detachable tape carrier is arranged below the adsorption mechanism (21). The detachable tape carrier is used for installing a transfer tape, and the distance range between the transfer tape and the lower surface of the adsorption mechanism (21) is 0 to 100 um.

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