Test probe, apparatus and applications thereof

Abstract

The application discloses a test probe, equipment and application thereof, and the test probe comprises at least two independent conductive layers, at least one insulating layer, and at least an insulating layer arranged between the independent conductive layers; the conductive layers and the insulating layers are arranged in a nested or laminated mode, and the first layer is a conductive layer or an insulating layer, and the last layer is a conductive layer or an insulating layer. The test probe can eliminate the contact resistance between a test object and the test probe, the resistance of the test probe itself, the feeder resistance and other external background resistances, has higher measurement accuracy, can identify the resistance value of the test object and subtle changes of the resistance value, greatly improves the reliability of the measurement result, provides a judgment for production or research and development, and greatly improves the production and research and development efficiency.

Description

Technical Field

[0001] This invention relates to the field of testing technology, specifically to a test probe, its equipment, and its applications. In particular, it relates to a test probe, its equipment, and its applications for testing the resistance or resistivity or other properties that need to be measured in battery electrodes, conductive thin layers (such as copper and aluminum foil and various metals and alloys), and non-conductive thin layers (such as polymer thin layers). Background Technology

[0002] Lithium-ion batteries are widely used due to their advantages such as high volumetric and gravimetric energy ratios, high voltage, low self-discharge rate, no memory effect, and long cycle life. Market competition is fierce, and major companies have continuously conducted research and development on lithium-ion batteries, especially in improving electrode materials. The resistance of lithium-ion battery electrodes is a crucial factor affecting the internal resistance, voltage, and self-discharge rate of the battery. Improving the resistance of lithium-ion battery electrodes is of great significance for increasing battery energy. To effectively measure the resistance of lithium-ion battery electrodes and the characteristics of related materials, it is essential to accurately and effectively measure their common resistance characteristics.

[0003] Although the importance of measuring the resistance of related materials and films in the lithium battery industry and similar industries has begun to be recognized, there are very few devices on the market that can be used to test the resistance or resistivity of battery electrodes, conductive thin layers (such as copper and aluminum foil and various metals and alloys), and non-conductive thin layers (such as polymer thin layers). However, such devices all use the two-probe testing method.

[0004] Meanwhile, CN204903649U discloses a secondary battery electrode resistance tester, which includes a base, an electrode fixing clamp, a pressure applying device, a pressure sensor, a height gauge, and a ohmmeter. The electrode fixing clamp is installed on the base to hold and fix the secondary battery electrode to be tested. The pressure applying device is installed above the base to apply variable pressure to the secondary battery electrode. The pressure sensor is installed on the pressure applying device to detect the pressure value of the secondary battery electrode. The height gauge and the ohmmeter measure the thickness change and resistance value of the secondary battery electrode under different pressures, respectively. The base includes a mounting plate, on which an electrode pressing head is mounted. The pressure applying device is installed above the mounting plate via a pressure applying device bracket, and includes an electrode pressing head, etc. The ohmmeter is connected to the electrode pressing head and the electrode pressing head respectively to measure the resistance value of the secondary battery electrode in real time. CN207528818U also discloses a resistance testing device, which includes a first test terminal and a second test terminal. Although the resistance testing instruments disclosed in CN204903649U and CN207528818U can solve some of the key problems in testing the resistance of diaphragms, they both use a two-probe testing method. However, the resistance value measured by the two-probe testing method is not only the resistance of the test object itself, but also includes the contact resistance between the test object and the test probe, as well as the resistance of the test probe itself, the resistance of the feed line, and other noise resistances. The resistance measurement error is in the milliohm range (usually at least 0.5 milliohms or more). Depending on the resistance of the test sample, the error may be 0.5%-100%, or even more than 100%.

[0005] Therefore, two-probe testing is no longer sufficient to detect minute changes in circuit resistance, making it impossible to accurately determine the low resistance value of the test object. This is especially true for materials such as battery electrodes, conductive thin layers (e.g., copper and aluminum foil, various metals and alloys), and non-conductive thin layers (e.g., polymer thin layers), where resistance errors become significant, making accurate circuit measurements impossible. Consequently, resistance values ​​obtained under these conditions can only meet the needs of horizontal comparison in R&D activities, limiting further analysis and utilization of the test object's resistance value. This hinders production and R&D support and negatively impacts R&D efficiency. Therefore, the development of resistance test probes and equipment capable of eliminating external background resistance such as contact resistance between the test object and the test probe, the resistance of the test probe itself, and feeder resistance is urgently needed. Similarly, for other similar tests requiring precise measurements, the necessary test probes and equipment also urgently require solutions. Summary of the Invention

[0006] The purpose of this invention is to overcome the shortcomings of existing technologies and provide a test probe, its device, and its application. It eliminates external background resistance such as the contact resistance between the test object and the test probe, the resistance of the test probe itself, and the feeder resistance, resulting in higher measurement accuracy. It can identify the resistance value of the test object and its subtle changes, greatly improving the reliability of the measurement results and providing valuable judgment for production or R&D, significantly enhancing production and R&D efficiency. It can also achieve accurate measurements in other performance testing areas.

[0007] To achieve the above objectives, the present invention adopts the following technical solution:

[0008] A test probe includes at least two independent conductive layers, at least one insulating layer, and an insulating layer between at least the independent conductive layers.

[0009] Preferably, each conductive layer is adjacent to each insulating layer. More preferably, each conductive layer and each insulating layer are nested or stacked. The nesting can be a closed-loop nesting, a non-closed-loop nesting, or any other nesting form that enables independent conduction of the corresponding conductive parts after the two test probes make contact vertically, such as a current loop, a voltage loop, or any other loop that enables independent conduction of the corresponding upper and lower parts. The stacked arrangement of adjacent layers can be stacked in the same direction or in different directions, i.e., adjacent in any direction, or any other adjacent arrangement that enables independent conduction of the corresponding conductive parts after the two test probes make contact vertically. When each conductive layer and each insulating layer are nested or stacked, it is not limited to the layers being adjacent in the same direction; the directions and shapes of the layers can be different, as long as the adjacent arrangement enables independent conduction of the corresponding conductive parts after the two test probes make contact vertically. More preferably, the two test probes are mirror images of each other when they make contact vertically.

[0010] Preferably, when the conductive layers and insulating layers are nested or stacked, the first layer is a conductive layer or an insulating layer, and the last layer is a conductive layer or an insulating layer.

[0011] Preferably, from the cross-section of the test probe, the shape of each conductive layer is independently selected from a standard circle, ellipse, irregular circle, polygon, or irregular shape, and the shape of each insulating layer is independently selected from a standard circle, ellipse, irregular circle, polygon, or irregular shape. The shapes of each insulating layer, each conductive layer, and each insulating layer and each conductive layer may be the same or different, as long as there is an insulating layer between the conductive layers.

[0012] Preferably, the resistivity of each conductive layer is 1×10⁻⁶. -08 -1×10 -5Ω·m. More preferably, the resistivity of each conductive layer is 1×10⁻⁶ Ω·m. -08 -1×10 -6 Ω·m. More preferably, the probe is made of a highly conductive material, such as copper, gold, silver, or aluminum. Each conductive layer can be a single material, such as a metallic material (e.g., copper, gold, silver, aluminum); an oxide material; a metal-containing material; an alloy material; or a composite material. For example, each conductive layer material can be nickel, platinum, palladium, silver, chromium, aluminum, titanium, gold, copper, or a combination of the above materials. Alternatively, it can be indium tin oxide, zinc aluminum oxide, zinc gallium oxide, indium zinc oxide, etc.

[0013] Preferably, the surface hardness of each test probe is greater than or equal to 50 HV. More preferably, the surface hardness of the test probe can also refer to the surface hardness of the electrical layer portion, excluding the insulating layer portion.

[0014] Preferably, the surface roughness of each test probe is less than or equal to 100 μm. More preferably, the surface roughness of each test probe is greater than 0.1 μm and less than 10 μm. Even more preferably, the surface roughness of each test probe is greater than 1 μm and less than 5 μm. The surface roughness of the test probe specifically refers to the surface roughness of the end cross-section of each test probe, where the end cross-section mainly refers to the interface between the test probe and the test object. The end cross-section of the test probe is a horizontal plane or any other inclined plane. The end cross-section of the insulating layer can be on the same plane as the end cross-sections of the conductive layers, or it can be higher than the end cross-sections of the conductive layers. When two probes are used in mirror image, the corresponding conductive layers are in contact with each other, and the insulating layers can be in contact with each other on the contact surfaces of the contact layers or they may not be in contact.

[0015] Preferably, the resistivity of each insulating layer is not less than 10. 5 Ω·m. The insulating layer is selected from air, insulating gases, plastics, ceramics, glass, resins, rubber, POM, PTFE, insulating oxides, and other insulating materials with other insulating properties. Each insulating layer can be a single material, a mixture of materials, or a composite material. Insulating oxides include silicon oxide, titanium oxide, silicon nitride, and aluminum oxide.

[0016] Preferably, the thickness of each insulating layer is 0.001-500 mm. More preferably, the thickness of the insulating layer is 0.1-10 mm.

[0017] The insulating layer is a composite structure, and / or the conductive layer is a composite structure. The conductive layer composite structure has various resistivities of 1×10⁻⁶. -08 -1×10 -5 Materials with a resistivity of Ω·m are horizontally or normally stacked, and the insulating layer composite structure has various resistivity not less than 10 Ω·m.5 Materials of Ω·m are stacked horizontally or normally.

[0018] The present invention also provides a testing device including the above-described test probe.

[0019] Preferably, there are at least two test probes, and after the upper and lower parts of each test probe are in contact, the corresponding conductive parts can achieve independent conduction, such as a current loop, a voltage loop, or any other loop that enables independent conduction of the corresponding upper and lower parts. More preferably, when the upper and lower parts of each test probe are in contact, the test probes are mirror images of each other.

[0020] Preferably, after the test probes make contact vertically, their end sections make contact, and the contact surfaces are on the same plane. More preferably, the contact surface is a horizontal plane; the conductive parts only need to achieve contact, such as point contact, line contact, or circular contact; even more preferably, they make a mating contact at the end sections. The end section of the test probe is a horizontal plane or any other inclined plane. The end section of the insulating layer can be on the same plane as the end sections of each conductive layer, or it can be higher than the end sections of each conductive layer, but it cannot protrude beyond the contact surface when two test probes are in contact. When two probes are used mirror images, the corresponding conductive layers contact each other, and the insulating layers can contact each other on the contact surfaces of the contact layers or not contact each other.

[0021] Preferably, it also includes a test lead connected to the test probe. This test lead enables accurate resistance measurement.

[0022] This invention also provides an application of a test probe or test device in testing, such as testing the resistance or resistivity of battery electrodes, conductive thin layers (such as copper and aluminum foil and various metals and alloys), and non-conductive thin layers (such as polymer thin layers); it can also be used to test other properties that require accurate measurement. The test probe is selected from the aforementioned test probes, and the test device is selected from the aforementioned test devices. This test probe and its test device offer higher measurement accuracy for resistance, resistivity, or other properties requiring accurate measurement.

[0023] Compared with the prior art, the present invention has the following beneficial effects:

[0024] 1. By establishing at least two independent conductive layers, with an insulating layer between them, various independent electrical circuits can be established using the same test probe. These include current circuits, voltage circuits, and other circuits as needed, enabling highly accurate testing. For example, when testing resistance, establishing both current and voltage circuits simultaneously with the test probe helps eliminate external background resistance such as contact resistance between the test object and the probe, the probe's own resistance, and feeder resistance, significantly improving measurement accuracy and allowing the identification of the resistance value and subtle changes in the test object. This also greatly enhances the reliability of measurement results, providing valuable insights for production or R&D, and significantly improving production and R&D efficiency. For test objects with resistances between 1 milliohm and 100 milliohms, the test probe or its testing equipment of this invention can reduce the test error to within 0.5%; compared to existing technologies, the error reduction is 0.5%-100%, or even more than 100%. This not only significantly improves the accuracy of resistance measurement and the authenticity of resistance data, but is particularly beneficial for low-resistance samples. It also enables precise measurement in other performance tests.

[0025] 2. A special test probe structure is adopted, such as each conductive layer and each insulating layer being nested or stacked. When each conductive layer and each insulating layer are nested or stacked, the first layer is a conductive layer or an insulating layer, and the last layer is a conductive layer or an insulating layer. From the cross-section of the test probe, the shape of each conductive layer is independently selected from a standard circle, ellipse, irregular circle, polygon, or irregular shape, and the shape of each insulating layer is independently selected from a standard circle, ellipse, irregular circle, or polygon.

[0026] 3. A special test probe is used, and the resistivity of each conductive layer is 1×10⁻⁶. -08 -1×10 -5 Ω·m, the surface hardness of the test probe is greater than or equal to 50 HV, the surface roughness of the test probe is less than or equal to 100 μm, and the resistivity of each insulating layer is not less than 10 Ω·m. 5 Ω·m, and the thickness of each insulating layer is 0.001-500mm. Attached Figure Description

[0027] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 A three-dimensional structural schematic diagram of a specific embodiment of the test probe provided by the present invention;

[0029] Figure 2 A top view schematic diagram of a specific embodiment of the test probe provided by the present invention;

[0030] Figure 3 This is a front view schematic diagram of a specific embodiment of the test probe provided by the present invention;

[0031] Figure 4 A three-dimensional structural schematic diagram of a specific modified embodiment of the test probe provided by the present invention;

[0032] Figure 5 A three-dimensional structural schematic diagram of another specific embodiment of the test probe provided by the present invention;

[0033] Figure 6 A three-dimensional structural schematic diagram of yet another specific embodiment of the test probe provided by the present invention;

[0034] Figure 7 A three-dimensional structural schematic diagram of another specific embodiment of the test probe provided by the present invention;

[0035] Figure 8 A top view schematic diagram of another specific embodiment of the test probe provided by the present invention;

[0036] Figure 9 A front view schematic diagram of another specific embodiment of the test probe provided by the present invention;

[0037] Figure 10 A three-dimensional structural schematic diagram of yet another specific embodiment of the test probe provided by the present invention;

[0038] Figure 11 A top view schematic diagram of yet another specific embodiment of the test probe provided by the present invention;

[0039] Figure 12 This is a front view schematic diagram of yet another specific embodiment of the test probe provided by the present invention;

[0040] Figure 13 A three-dimensional structural schematic diagram of another specific embodiment of the test probe provided by the present invention;

[0041] Figure 14 A top view schematic diagram of another specific embodiment of the test probe provided by the present invention;

[0042] Figure 15 This is a front view schematic diagram of another specific embodiment of the test probe provided by the present invention;

[0043] Figure 16A three-dimensional structural schematic diagram of yet another specific embodiment of the test probe provided by the present invention;

[0044] Figure 17 A top view schematic diagram of yet another specific embodiment of the test probe provided by the present invention;

[0045] Figure 18 A right-side view of yet another specific embodiment of the test probe provided by the present invention;

[0046] Figure 19 A three-dimensional structural schematic diagram of another specific embodiment of the test probe provided by the present invention;

[0047] Figure 20 A top view schematic diagram of yet another specific embodiment of the test probe provided by the present invention;

[0048] Figure 21 This is a front view schematic diagram of another specific embodiment of the test probe provided by the present invention;

[0049] Figure 22 This is a three-dimensional structural diagram of a specific implementation of a commonly used test probe in the industry.

[0050] Figure 23 This is a three-dimensional structural diagram of another specific implementation of a commonly used test probe in the industry.

[0051] Figure 24 This is a three-dimensional schematic diagram of a specific embodiment of the test probe provided by the present invention applied to a test device.

[0052] in, Figures 1 to 24 The annotations in the accompanying drawings are explained as follows:

[0053] First conductive layer 1, first insulating layer 2, second conductive layer 3, second insulating layer 4, first test probe 100, second test probe 200. Detailed Implementation

[0054] To make the objectives, technical solutions, and advantages of the present invention clearer, the invention will be further described in detail below with reference to the embodiments. However, the scope of protection of the invention is not limited to the scope expressed in the embodiments.

[0055] In the description of this invention, it should be understood that the terms "vertical", "horizontal", "inner", "outer", "upper", "lower", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only shown for the convenience of describing this invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be understood as a limitation of this invention.

[0056] In the description of this invention, unless otherwise specified and limited, it should be noted that the terms "connection," "provided with," and "installed" should be interpreted broadly. For example, they can refer to mechanical or electrical connections, or connections within two components. They can be direct connections or connections through an intermediate medium. Those skilled in the art can understand the specific meaning of these terms according to the specific circumstances. Installation can be detachable or fixed. Detachable installation facilitates maintenance and extends the service life of the equipment. Detachable installation can be achieved using screws, clips, or other suitable methods. The quantity of certain structural components can be adjusted according to actual needs without affecting the realization of their function.

[0057] Example 1

[0058] Please refer to Figures 1 to 3 , Figure 1 A three-dimensional structural schematic diagram of a specific embodiment of the test probe provided by the present invention; Figure 2 A top view schematic diagram of a specific embodiment of the test probe provided by the present invention; Figure 3 This is a front view schematic diagram of a specific embodiment of the test probe provided by the present invention. In this embodiment, the conductive layer and the insulating layer are nested together. It should be noted that, in the present invention, the conductive layer and the insulating layer can be nested or stacked. The nesting can be a closed ring nest (e.g., Figure 1-9 As shown), it can also be a non-closed, non-circular nested structure (such as...). Figure 21 As shown in the diagram, or other nested arrangements that enable independent vertical conduction of the corresponding conductive parts after the two test probes make vertical contact. Adjacent layers can be stacked in the same direction or in different directions; that is, they can be adjacent in any direction, or other adjacent arrangements that enable independent vertical conduction of the corresponding conductive parts after the two test probes make vertical contact. When the conductive layers and insulating layers are nested or stacked, it is not limited to the layers being adjacent in the same direction. The directions of the layers can be different, and their shapes can also be different, as long as they can achieve an adjacent arrangement that enables independent vertical conduction of the corresponding conductive parts after the two test probes make vertical contact.

[0059] like Figures 1 to 3 As shown, the present invention provides a test probe, including a first conductive layer 1, a first insulating layer 2, and a second conductive layer 3. From the cross-section of the test probe, the outer peripheries of the first conductive layer 1, the first insulating layer 2, and the second conductive layer 3 are all circular. The first insulating layer 2 is nested on the first conductive layer 1, and the second conductive layer 3 is nested on the first insulating layer 2.

[0060] It should be noted that in this invention, the insulating layer is not limited to one; there can be more than one, such as... Figure 4 and Figure 5 As shown; furthermore, the conductive layer is not limited to two, and there can be more than two, and the same applies to the insulating layer; when the conductive layer and the insulating layer are nested or stacked, the first layer is not limited to a conductive layer, and can also be an insulating layer; the last layer is not limited to a conductive layer, and can also be an insulating layer. For example, the first conductive layer 1 can also be nested on an insulating layer, and / or another insulating layer can also be nested on a second conductive layer 3. From the cross-section of the test probe, the shape of each conductive layer, especially its outer periphery, is not limited to a standard circle, and can also be independently selected from a standard circle, ellipse, irregular circle, polygon, or irregular shape; the shape of each insulating layer, especially its outer periphery, is not limited to a standard circle, and can also be independently selected from a standard circle, ellipse, irregular circle, polygon, or irregular shape; the shapes of each insulating layer, each conductive layer, and each insulating layer and each conductive layer can be the same or different, as long as an insulating layer is provided.

[0061] The resistivity of the first conductive layer 1 and the second conductive layer 3 is 1.75 × 10⁻⁶. -8 The surface hardness is 50 HV, and the surface roughness is 100 μm. The first insulating layer 2 is made of plastic with a resistivity of 10 Ω·m. 15 The resistivity is Ω·m and the thickness is 10 μm. The end cross-section of the test probe is horizontal. However, the properties of the materials in this invention are not limited to this; the resistivity of the first conductive layer 1 and the second conductive layer 3 can also be 1 × 10⁻⁶. -08 -1×10 -5 The resistivity is Ω·m, and the material is a good conductor, such as copper, gold, silver, aluminum, or alloys. The surface hardness of the test probe can be greater than or equal to 50 HV, and the surface hardness of the test probe can refer only to the surface hardness of the conductive layer, excluding the insulating layer. The surface roughness of the test probe end section can be less than 100 micrometers, and is more preferably 0.1 to 10 micrometers. More preferably, the surface roughness of each of the test probes is greater than 1 and less than 5 micrometers. The end section of the test probe can also be any other inclined plane. The end section of the insulating layer can be on the same plane as the end sections of each conductive layer, or it can be higher than the end sections of each conductive layer. When two of the probes are used in mirror image, the corresponding conductive layers are in contact with each other, and the insulating layers can be in contact with each other on the contact surfaces of the contact layers or they can not be in contact with each other. The resistivity of each insulating layer can be greater than or equal to 10. 5 Ω·m. The insulating layer is selected from air, other insulating gases, plastics, ceramics, glass, resins, rubber, POM, PTFE, and other insulating materials that can perform other insulating functions; in addition, the insulating layer may also be a mixed material or a composite structure, and / or the conductive layer may also be a composite structure or an alloy structure.

[0062] The thickness of the insulating layer can also be 0.001-500 mm. More preferably, the thickness of the insulating layer is 0.1-10 mm.

[0063] Example 2

[0064] Please refer to Figure 4 , Figure 4 This is a three-dimensional structural schematic diagram of a modified embodiment of the test probe provided by the present invention. The difference from Embodiment 1 is that, viewed from the cross-section of the test probe, the first conductive layer 1 is nested and covers the second insulating layer 4, and the outer periphery of the second insulating layer 4 is circular. Everything else is the same.

[0065] Example 3

[0066] Please refer to Figure 5 , Figure 5 This is a three-dimensional structural schematic diagram of another specific embodiment of the test probe provided by the present invention. The difference from Embodiment 1 is that, viewed from the cross-section of the test probe, the second insulating layer 4 is nested and covers the second conductive layer 3, and the outer periphery of the second insulating layer 4 is circular. Everything else is the same.

[0067] Example 4

[0068] Please refer to Figure 6 , Figure 6 This is a three-dimensional structural schematic diagram of another specific embodiment of the test probe provided by the present invention. The difference from Embodiment 1 is that, viewed from the cross-section of the test probe, the outer peripheries of the first conductive layer 1, the first insulating layer 2, and the second conductive layer 3 are all semi-circular. Everything else is the same.

[0069] Example 5

[0070] Please refer to Figures 7 to 9 , Figure 7 A three-dimensional structural schematic diagram of another specific embodiment of the test probe provided by the present invention; Figure 8 A top view schematic diagram of another specific embodiment of the test probe provided by the present invention; Figure 9 This is a front view schematic diagram of another specific embodiment of the test probe provided by the present invention.

[0071] The difference from Example 1 is that, viewed from the cross-section of the test probe, the outer periphery of the first conductive layer 1 is square, the outer periphery of the first insulating layer 2 is square, and the second conductive layer 3 is nested and covers the first insulating layer 2, with a circular outer periphery. The resistivity of the first conductive layer 1 and the second conductive layer 3 is 1.75 × 10⁻⁶. -8 Ω·m; the first insulating layer 2 is made of ceramic with a resistivity of 10 Ω·m. 12The probe has an Ω·m diameter and a thickness of 0.1 μm; the surface hardness of the test probe is 120 HV, the surface roughness is 10 μm, and the end cross-section is horizontal. Everything else is the same.

[0072] Example 6

[0073] Please refer to Figures 10 to 12 , Figure 10 A three-dimensional structural schematic diagram of yet another specific embodiment of the test probe provided by the present invention; Figure 11 A top view schematic diagram of yet another specific embodiment of the test probe provided by the present invention; Figure 12 This is a front view schematic diagram of yet another specific embodiment of the test probe provided by the present invention.

[0074] The difference from Example 1 is that, viewed from the cross-section of the test probe, the outer periphery of the first conductive layer 1, the first insulating layer 2, and the second conductive layer 3 are all square, and the resistivity of the first conductive layer 1 and the second conductive layer 3 is 6.5 × 10⁻⁶. -8 Ω·m; The first insulating layer 2 is made of glass with a resistivity of 10 Ω·m. 12 The probe has an Ω·m diameter and a thickness of 200 μm; the surface hardness of the test probe is 800 HV, the surface roughness is 1 μm, and the end cross-section is horizontal. Everything else is the same.

[0075] Example 7

[0076] Please refer to Figures 13 to 15 , Figure 13 A three-dimensional structural schematic diagram of another specific embodiment of the test probe provided by the present invention; Figure 14 A top view schematic diagram of another specific embodiment of the test probe provided by the present invention; Figure 15 This is a front view schematic diagram of another specific embodiment of the test probe provided by the present invention.

[0077] The difference from Example 1 is that, viewed from the cross-section of the test probe, the second conductive layer 3 is nested and covers the first insulating layer 2, and the outer perimeter of the second conductive layer 3 is square. The resistivity of the first conductive layer 1 and the second conductive layer 3 is 5.5 × 10⁻⁶. -8 Ω·m; The first insulating layer 2 is made of rubber with a resistivity of 10 Ω·m. 15 The probe has a thickness of 0.01 μm and an Ω·m diameter; the surface hardness is 1000 HV, the surface roughness is 80 μm, and the end section is horizontal. Everything else is the same.

[0078] Example 8

[0079] Please refer to Figures 16 to 18 , Figure 16 A three-dimensional structural schematic diagram of yet another specific embodiment of the test probe provided by the present invention; Figure 17A top view schematic diagram of yet another specific embodiment of the test probe provided by the present invention; Figure 18 This is a right-side view of yet another specific embodiment of the test probe provided by the present invention.

[0080] The difference from Example 1 is that the conductive and insulating layers are stacked, with the first insulating layer 2 stacked on top of the first conductive layer 1, and the second conductive layer 3 stacked on top of the first insulating layer 2. From the cross-section of the test probe, the outer peripheries of the first conductive layer 1, the first insulating layer 2, and the second conductive layer 3 are all square. The resistivity of the first conductive layer 1 and the second conductive layer 3 is 6.5 × 10⁻⁶. -8 Ω·m; The first insulating layer 2 is made of POM with a resistivity of 10 Ω·m. 9 The probe has an Ω·m diameter and a thickness of 0.1 μm; the surface hardness of the test probe is 800 HV, the surface roughness is 0.4 μm, and the end section is horizontal. Everything else is the same.

[0081] Example 9

[0082] Please refer to Figures 19 to 20 , Figure 19 A three-dimensional structural schematic diagram of another specific embodiment of the test probe provided by the present invention; Figure 20 This is a top view schematic diagram of another specific embodiment of the test probe provided by the present invention.

[0083] The difference from Example 8 is that the conductive layer and the insulating layer are stacked, with the first insulating layer 2 stacked on the first conductive layer 1 and the second conductive layer 3 stacked on the first insulating layer 2; from the cross-section of the test probe, the outer periphery of both the first conductive layer 1 and the second conductive layer 3 is fan-shaped, and the first insulating layer 2 is made of PTFE. The first insulating layer 2 is made of plastic with a resistivity of 10. 12 The probe has an Ω·m diameter and a thickness of 400 μm; the surface hardness of the test probe is 600 HV, the surface roughness is 50 μm, and the end section is horizontal. Everything else is the same.

[0084] Example 10

[0085] Please refer to Figure 21 , Figure 21 This is a front view schematic diagram of another specific embodiment of the test probe provided by the present invention.

[0086] The difference from Embodiment 8 is that the first insulating layer 2 is adjacent to one side of the first conductive layer 1, and the second conductive layer 3 is adjacent to the other side of the first insulating layer 2. The outer peripheries of the first conductive layer 1, the first insulating layer 2, and the second conductive layer 3 are partially annular with different sizes. The first insulating layer 2 is made of insulating gas air, and everything else is the same.

[0087] Comparative Example 1

[0088] Please refer to Figure 22 , Figure 22 This is a three-dimensional structural diagram of a specific implementation of a commonly used test probe in the industry.

[0089] like Figure 22 As shown, the difference from Example 1 is that the test probe is a single, non-segmented assembly structure, with all materials being conductive layers, and its cross-section is circular.

[0090] Comparative Example 2

[0091] Please refer to Figure 23 , Figure 23 This is a three-dimensional structural diagram of another specific implementation of a commonly used test probe in the industry.

[0092] like Figure 23 As shown, the difference from Example 5 is that the test probe is an integral, non-segmented assembly structure, and the material is entirely conductive. From its cross-section, it is square.

[0093] Example 11

[0094] Please refer to Figure 24 , Figure 24 This is a three-dimensional schematic diagram of a specific embodiment of the test probe provided by the present invention applied to a test device.

[0095] like Figure 24 As shown, this invention provides two test probes for use in a testing device for high-accuracy resistance testing. It relates to the testing of resistance or resistivity of battery electrodes, conductive thin layers (such as copper and aluminum foil and various metals and alloys), and non-conductive thin layers (such as polymer thin layers). The resistance or resistivity measurement accuracy of this test probe and its testing device is significantly improved.

[0096] After the first test probe 100 and the second test probe 200 make contact from top to bottom, the contact surface is horizontal. When the test object is placed between the first test probe 100 and the second test probe 200 and made in contact, the corresponding conductive parts of the first test probe 100 and the second test probe 200 achieve independent vertical conduction, completing the connection of the current loop and the voltage loop, so that the test object can be measured with high accuracy.

[0097] It should be noted that, in this invention, the test probes used in the testing equipment are preferably mirror images of each other, meaning that the two test probes are mirror images of each other when they are in contact vertically. Furthermore, after the test probes are in contact vertically, their end sections not only contact each other, but this contact is not limited to a complete mating contact; the conductive parts only need to make contact, such as point contact, line contact, or circular contact. The contact surface is not limited to a horizontal plane; it can also be any inclined plane. Additionally, the end section of the insulating layer can be on the same plane as the end sections of each conductive layer, or it can be higher than the end sections of each conductive layer, but it cannot protrude beyond the contact surface when the two test probes are in contact. That is, the end section of the insulating layer does not contact the test object but can isolate adjacent conductive layers. When the two probes are used mirror images of each other, the corresponding conductive layers contact each other, and the insulating layers can contact each other on the contact surfaces of the contact layers or not contact each other. Furthermore, the testing equipment can use two or more test probes, not limited to two, and the corresponding conductive parts of each test probe can achieve independent vertical conduction after vertical contact.

[0098] The test probes described in Examples 1-10 and Comparative Examples 1-2 were applied to the test equipment described in CN207528818U to perform resistance tests on the same electrode. The same electrode was divided into 10 portions of appropriate size. The test results are as follows. Among them, the electrode composition information is detailed in Table 1, the electrode design information is detailed in Table 2, and the test results are detailed in Table 3.

[0099] Table 1 Electrode Composition Information

[0100]

[0101] Table 2 Electrode Design Information

[0102]

[0103] Table 3 Test Results

[0104]

[0105]

[0106] As can be seen from the test results in Table 3, the resistance testing equipment using the test probe provided by this invention, when measuring electrodes, shows that Example 1 has a 9.8% higher resistance measurement accuracy compared to Comparative Example 1. When applied to materials at the milliohm level, the accuracy is further improved by 9.8% compared to conventional measuring equipment. This significantly improves not only the accuracy of resistance measurement but also the authenticity of resistance data, particularly beneficial for the application of low-resistance materials. Example 8 shows a 9.8% higher resistance measurement accuracy compared to Comparative Example 2. Similarly, when applied to materials at the milliohm level, the accuracy is further improved by 9.8% compared to conventional measuring equipment, which is beneficial for the research and development and application of low-resistance materials. The test probe and equipment of this invention can identify the resistance value and subtle changes of the test object in the measurement of low-resistance test objects, greatly improving the reliability of the measurement results, providing powerful judgment for production or research and development, and greatly improving production and research and development efficiency.

[0107] This invention, by establishing at least two independent conductive layers with an insulating layer between them, enables the creation of various independent electrical circuits using a single test probe. These circuits can include current circuits, voltage circuits, and other circuits as needed, achieving high-accuracy testing. The above embodiments primarily introduce the application of various test probes or testing equipment in resistance testing, demonstrating a significant improvement in the accuracy of resistance measurements. However, this invention is not limited to accurate resistance measurement; it can also be used for other performance tests, such as thickness. These different performance tests can be performed simultaneously or independently, depending on the specific requirements.

[0108] Furthermore, the structures of the insulating layer and conductive layer of the present invention are not limited to the above embodiments; the insulating layer may also be a composite structure, and / or the conductive layer may be a composite structure. The conductive layer composite structure has various resistivities of 1×10⁻⁶. -08 -1×10 -5 Materials with a resistivity of Ω·m are horizontally or normally stacked, and the insulating layer composite structure has various resistivity not less than 10 Ω·m. 5 Materials of Ω·m are stacked horizontally or normally.

[0109] It should be noted that all testing equipment provided in this invention has been described in detail to make the objectives, technical solutions, and advantages of this invention clearer. However, the result components included in the testing equipment are not limited to the above embodiments. They can be modified or altered based on the teachings of the above embodiments, and such modifications and alterations should also fall within the protection scope of the claims of this invention.

[0110] Based on the disclosure and teachings of the foregoing specification, those skilled in the art can make changes and modifications to the above embodiments. Therefore, the present invention is not limited to the specific embodiments disclosed and described above, and some modifications and changes to the invention should also fall within the protection scope of the claims of the present invention. Furthermore, although some specific terms are used in this specification, these terms are only for convenience of explanation and do not constitute any limitation on the present invention.

Claims

1. A testing device for testing the resistance of low-resistance battery electrode plates, characterized in that, The testing equipment includes at least two test probes, and after each test probe makes contact with the upper and lower parts, the corresponding conductive parts achieve independent vertical conduction. The test probe is used to measure resistance or resistivity. Each test probe includes at least two independent conductive layers and at least one insulating layer, with an insulating layer between at least the independent conductive layers. The surface hardness of the test probe is greater than or equal to 50 HV. The resistivity of each conductive layer is 1 × 10⁻⁶. -08 -1×10 -5 Ω·m; the surface roughness of the test probe is less than or equal to 100 μm; the resistivity of each insulating layer is greater than or equal to 10 Ω·m. 5 Ω·m; the independent conductive layers in the end face of at least one end of the test probe are on the same surface.

2. The testing equipment as described in claim 1, characterized in that, The conductive layers and the insulating layers are nested or stacked together.

3. The testing equipment as described in claim 2, characterized in that, When the conductive layers and insulating layers are nested or stacked, the first layer is a conductive layer or an insulating layer, and the last layer is a conductive layer or an insulating layer.

4. The testing equipment as described in any one of claims 1-3, characterized in that, From the cross-section of the test probe, the shape of each conductive layer is independently selected from a standard circle, ellipse, irregular circle, polygon, or irregular shape, and the shape of each insulating layer is independently selected from a standard circle, ellipse, irregular circle, polygon, or irregular shape.

5. The testing equipment as described in claim 4, characterized in that, The thickness of each insulating layer is 0.001-500mm.

6. The testing equipment as described in claim 4, characterized in that, The insulating layer is a composite structure, and / or the conductive layer is a composite structure.

7. The testing equipment as described in claim 4, characterized in that, After the test probes are in contact from top to bottom, their end sections are in contact, and the contact surfaces are on the same surface.

8. The testing equipment as described in claim 4, characterized in that, It also includes test leads that connect to the test probe.

9. The application of the testing equipment for testing the resistance of low-resistance battery electrode as described in claim 4 or any one of claims 5-8 in the testing process.

Images