Plate-level fan-out heat dissipation structure, preparation method thereof and electronic component

Abstract

The application discloses a preparation method of a board-level fan-out type heat dissipation structure, provides a first metal plate, a second metal plate and a third metal plate, a micro-channel outlet is made on one side of the first metal plate to form a first heat dissipation module, a plurality of micro-channels penetrating through the second metal plate along the thickness direction of the second metal plate are made on the second metal plate to form a second heat dissipation module, a micro-channel storage area inlet and a micro-channel storage area in communication with the micro-channel storage area inlet are made on one side of the third metal plate to form a third heat dissipation module; the first heat dissipation module, the third heat dissipation module and the second heat dissipation module are respectively attached and connected, and then cutting treatment is carried out to obtain the board-level fan-out type heat dissipation structure. The board-level fan-out type heat dissipation structure combines the size advantage of the board-level fan-out packaging, is made in the form of board-level alignment, is modular, can simultaneously manufacture various heat dissipation modules, and can greatly improve the manufacturing efficiency of the heat dissipation structure and realize efficient and large-batch production.

Description

Technical Field

[0001] This invention relates to the field of integrated circuit packaging technology, specifically to a method for preparing a board-level fan-out heat dissipation structure, a board-level fan-out heat dissipation structure obtained by the method, and electronic components containing the board-level fan-out heat dissipation structure. Background Technology

[0002] With the development of chip functionalization, system integration, and miniaturization, greater challenges have been placed on chip heat dissipation. Especially in stacked package structures, chip thermal management issues cannot be ignored. Generally speaking, the failure rate of electronic components increases exponentially with temperature; for every 1°C increase between 70°C and 80°C, the reliability of electronic components decreases by 5%.

[0003] The existing manufacturing process for heat dissipation structures is inefficient and costly. In order to simultaneously meet the requirements of high-efficiency heat dissipation and mass production, there is an urgent need to introduce a new high-efficiency manufacturing process. Summary of the Invention

[0004] One of the objectives of this invention is to provide a method for preparing a plate-level fan-out heat dissipation structure, which satisfies the high-efficiency heat dissipation effect of the heat dissipation structure while enabling efficient and mass production.

[0005] The second objective of this invention is to provide a board-level fan-out heat dissipation structure and electronic components incorporating the board-level fan-out heat dissipation structure, which have good heat dissipation performance.

[0006] To achieve this objective, the present invention adopts the following technical solution:

[0007] On one hand, a method for fabricating a plate-level fan-out heat dissipation structure is provided, characterized by providing a first metal plate, a second metal plate, and a third metal plate; fabricating a microchannel outlet on one side of the first metal plate to form a first heat dissipation module; fabricating a plurality of microchannels penetrating the second metal plate along the thickness direction of the second metal plate to form a second heat dissipation module; fabricating a microchannel storage area inlet and a microchannel storage area communicating with the microchannel storage area inlet on one side of the third metal plate to form a third heat dissipation module; respectively mounting and connecting the first heat dissipation module, the third heat dissipation module, and the second heat dissipation module, so that the microchannel storage area is connected to the microchannel outlet through the microchannel; and then cutting to obtain a plate-level fan-out heat dissipation structure.

[0008] As a preferred embodiment of the fabrication method for a plate-level fan-out heat dissipation structure, the fabrication method of the first heat dissipation module includes the following steps:

[0009] S10a. A first carrier plate and a first metal plate are provided, and the first metal plate is attached to the first carrier plate with bonding adhesive.

[0010] S10b: Apply a first photosensitive dry film to the first carrier plate;

[0011] S10c. Expose and develop the first photosensitive dry film to expose the microchannel outlet area to be etched.

[0012] S10d: Etch the exposed microchannel outlet area to obtain the microchannel outlet;

[0013] S10e, Remove the residual first photosensitive dry film.

[0014] As a preferred embodiment of the fabrication method for a plate-level fan-out heat dissipation structure, the fabrication method of the second heat dissipation module includes the following steps:

[0015] S20a, Provide a second carrier plate and a second metal plate, and attach the second metal plate to one side of the second carrier plate with bonding adhesive;

[0016] S20b, A second photosensitive dry film is attached to the side of the second metal plate away from the second carrier plate;

[0017] S20c, Expose and develop the second photosensitive dry film to expose the microchannel area to be etched;

[0018] S20d: Etch the exposed microchannel area to form a microchannel;

[0019] S20e, Remove any remaining second photosensitive dry film.

[0020] As a preferred embodiment of the fabrication method for a plate-level fan-out heat dissipation structure, the fabrication method of the third heat dissipation module includes the following steps:

[0021] S30a, Provide a third carrier plate and a third metal plate, and attach the third metal plate to one side of the third carrier plate with bonding adhesive;

[0022] S30b, A third photosensitive dry film is attached to the side of the third metal plate away from the third carrier plate;

[0023] S30c, Expose and develop the third photosensitive dry film to expose the entrance area of ​​the microchannel storage area to be etched.

[0024] S30d: Etch the exposed microchannel storage area inlet region to form the microchannel storage area inlet;

[0025] S30e, Remove the residual third photosensitive dry film, and attach the fourth photosensitive dry film to the third metal plate;

[0026] S30f: Expose and develop the fourth photosensitive dry film to expose the area of ​​the microchannel storage area adjacent to the entrance of the microchannel storage area.

[0027] S30g, Etch the exposed area of ​​the microchannel storage region to form a microchannel storage region connected to the inlet of the microchannel storage region;

[0028] S30h, remove the residual fourth photosensitive dry film.

[0029] As a preferred embodiment of the fabrication method of the plate-level fan-out heat dissipation structure, a laser is used to fabricate the microchannel outlet on the first metal plate, the microchannel on the second metal plate, and the microchannel storage area inlet and the microchannel storage area on the third metal plate.

[0030] In a preferred embodiment of the fabrication method for a plate-level fan-out heat dissipation structure, adjacent heat dissipation modules in the first, second, and third heat dissipation modules are mounted together using any of the following methods:

[0031] First, the three heat dissipation modules are cleaned using plasma; then, the metal plates of adjacent heat dissipation modules are connected by electrostatic adsorption. Alternatively,

[0032] First, the three heat dissipation modules are cleaned using plasma. Then, the metal plates of adjacent heat dissipation modules are connected by electrostatic adsorption, and finally, a heat-pressing process is performed. Alternatively,

[0033] First, the three heat dissipation modules are ultrasonically cleaned to remove impurities from the metal plate surface through friction. Then, the metal plates of adjacent heat dissipation modules are aligned and bonded together before undergoing hot pressing. Alternatively...

[0034] The metal plates of two adjacent heat dissipation modules are bonded together using bonding adhesive; or,

[0035] The metal plates of two adjacent heat dissipation modules are bonded together with thermal adhesive.

[0036] As a preferred embodiment of the preparation method of the plate-level fan-out heat dissipation structure, the components of the heat dissipation adhesive include graphene, silicone, silicone grease, a mixture of methyl vinyl polysiloxane, a mixture of methyl hydrogen polysiloxane, and aluminum oxide.

[0037] On the other hand, a plate-level fan-out heat dissipation structure is provided, which is fabricated using the aforementioned method. It includes a first heat dissipation module, a second heat dissipation module, and a third heat dissipation module connected sequentially from top to bottom. The first heat dissipation module includes a first metal plate and a groove-shaped microchannel outlet located on the side of the first metal plate near the second metal plate. The microchannel outlet extends to one side wall of the first metal plate. The second heat dissipation module includes a second metal plate and a plurality of microchannels located on the second metal plate. The microchannels are located below the microchannel outlet and penetrate the second metal plate along its thickness direction. The third heat dissipation module includes a third metal plate and a microchannel storage area located on the side of the third metal plate near the second metal plate, and a microchannel storage area inlet communicating with the microchannel storage area. The microchannel storage area faces the microchannels and is connected to the microchannel outlet through the microchannels. The end of the microchannel storage area inlet, away from the microchannel storage area, extends to one side wall of the third metal plate.

[0038] As a preferred embodiment of a plate-level fan-out heat dissipation structure, in the first, second, and third heat dissipation modules, the metal plates of adjacent heat dissipation modules are connected by electrostatic adsorption; or...

[0039] In the first, second, and third heat dissipation modules, the metal plates of adjacent heat dissipation modules are bonded together using bonding adhesive; or,

[0040] In the first heat dissipation module, the second heat dissipation module and the third heat dissipation module, the metal plates of two adjacent heat dissipation modules are bonded together with thermal adhesive.

[0041] In another aspect, an electronic component is provided, comprising a chip and the aforementioned board-level fan-out heat dissipation structure, wherein the chip is mounted on the side of the third heat dissipation module away from the second heat dissipation module.

[0042] The beneficial effects of this invention are as follows: The method for fabricating the board-level fan-out heat dissipation structure of this invention combines the size advantages of board-level fan-out packaging and adopts a board-level array form for fabrication. The modular board-level fan-out heat dissipation structure allows for the simultaneous fabrication of each heat dissipation module, significantly improving the fabrication efficiency and enabling high-efficiency, mass production, thus enhancing cost advantages. In this invention, the cooling fluid automatically enters the inlet of the microchannel storage area through the capillary action principle and is stored within the microchannel storage area. When the microchannel storage area is full, the cooling fluid automatically flows back into the microchannel through the capillary action principle and automatically flows out through the microchannel outlet. The inlet of the microchannel storage area can be connected to the microchannel outlet through other connecting pipes to achieve automatic circulation of the cooling fluid (the entire circulation process does not require the installation of micro-pumps or other power devices). This provides active heat dissipation for the chip located below the third metal plate, which, combined with the passive heat dissipation effect of the metal plate on the chip, effectively improves the heat dissipation effect of the chip. Attached Figure Description

[0043] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments of the present invention will be briefly described below. Obviously, the drawings described below are merely some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without any creative effort.

[0044] Figure 1 This is a flowchart of the preparation method of the first heat dissipation module according to Embodiment 1 of the present invention.

[0045] Figure 1-1 This is a cross-sectional view of the first carrier plate after bonding adhesive has been applied, as described in Embodiment 1 of the present invention.

[0046] Figure 1-2 This is a cross-sectional schematic diagram of the first metal plate attached to the first carrier plate according to Embodiment 1 of the present invention.

[0047] Figure 1-3 This is a cross-sectional schematic diagram of the first photosensitive dry film as described in Embodiment 1 of the present invention being attached to the first metal plate.

[0048] Figure 1-4 This is a cross-sectional schematic diagram of the first photosensitive dry film after exposure and development according to Embodiment 1 of the present invention.

[0049] Figure 1-5 This is a cross-sectional view of the exposed first metal plate after etching, as described in Embodiment 1 of the present invention.

[0050] Figure 2 This is a partial top view of the first heat dissipation module described in Embodiment 1 of the present invention.

[0051] Figure 3 This is a flowchart of the preparation method of the second heat dissipation module according to Embodiment 1 of the present invention.

[0052] Figure 3-1 This is a cross-sectional view of the second carrier plate after bonding adhesive has been applied, as described in Embodiment 1 of the present invention.

[0053] Figure 3-2 This is a cross-sectional schematic diagram of the second metal plate attached to the second carrier plate as described in Embodiment 1 of the present invention.

[0054] Figure 3-3 This is a cross-sectional schematic diagram of the second photosensitive dry film as described in Embodiment 1 of the present invention being attached to the second metal plate.

[0055] Figure 3-4 This is a cross-sectional schematic diagram of the second photosensitive dry film after exposure and development according to Embodiment 1 of the present invention.

[0056] Figure 3-5 This is a cross-sectional view of the exposed second metal plate after etching, as described in Embodiment 1 of the present invention.

[0057] Figure 4 This is a partial top view of the second heat dissipation module described in Embodiment 1 of the present invention.

[0058] Figure 5 This is a flowchart of the preparation method of the third heat dissipation module according to Embodiment 1 of the present invention.

[0059] Figure 5-1 This is a cross-sectional view of the third carrier plate after bonding adhesive has been applied, as described in Embodiment 1 of the present invention.

[0060] Figure 5-2 This is a cross-sectional schematic diagram of the third metal plate attached to the third carrier plate according to Embodiment 1 of the present invention.

[0061] Figure 5-3 This is a cross-sectional schematic diagram of the third photosensitive dry film as described in Embodiment 1 of the present invention being attached to a third metal plate.

[0062] Figure 5-4 This is a cross-sectional schematic diagram of the third photosensitive dry film after exposure and development according to Embodiment 1 of the present invention.

[0063] Figure 5-5 This is a cross-sectional view of the third metal plate exposed to the third photosensitive dry film after etching, as described in Embodiment 1 of the present invention.

[0064] Figure 5-6 This is a cross-sectional view of the fourth photosensitive dry film, which is attached to the third metal plate according to Embodiment 1 of the present invention, after exposure and development.

[0065] Figure 5-7This is a cross-sectional view of the third metal plate exposed to the fourth photosensitive dry film after etching, as described in Embodiment 1 of the present invention.

[0066] Figure 6 This is a partial top view of the third heat dissipation module described in Embodiment 1 of the present invention.

[0067] Figure 7-1 This is a cross-sectional view of the first heat dissipation module, the second heat dissipation module, and the third heat dissipation module as described in Embodiment 1 of the present invention.

[0068] Figure 7-2 This is a cross-sectional view of the first heat dissipation module, the second heat dissipation module, and the third heat dissipation module after they are bonded together, as described in Embodiment 1 of the present invention.

[0069] Figure 7-3 This is a cross-sectional schematic diagram of the first heat dissipation module, the second heat dissipation module, and the third heat dissipation module after bonding and cutting, as described in Embodiment 1 of the present invention.

[0070] Figure 8 This is a top view of the first heat dissipation module, the second heat dissipation module, and the third heat dissipation module after they are attached, as described in Embodiment 1 of the present invention.

[0071] Figure 9 This is a top view of the first heat dissipation module, the second heat dissipation module, and the third heat dissipation module after bonding and cutting, as described in Embodiment 1 of the present invention.

[0072] In the picture:

[0073] 11. First carrier plate; 12. First metal plate; 121. Microchannel outlet; 13. First photosensitive dry film;

[0074] 21. Second carrier plate; 22. Second metal plate; 221. Microchannel; 23. Second photosensitive dry film;

[0075] 31. Third carrier plate; 32. Third metal plate; 321. Microfluidic storage area inlet; 322. Microfluidic storage area; 33. Third photosensitive dry film; 34. Fourth photosensitive dry film. Detailed Implementation

[0076] The technical solution of the present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0077] The accompanying drawings are for illustrative purposes only and are schematic diagrams, not actual images. They should not be construed as limiting the scope of this patent. To better illustrate the embodiments of the present invention, some parts in the drawings may be omitted, enlarged, or reduced, and do not represent the actual dimensions of the product. It is understandable to those skilled in the art that some well-known structures and their descriptions may be omitted in the drawings.

[0078] In the accompanying drawings of the embodiments of the present invention, the same or similar reference numerals correspond to the same or similar components. In the description of the present invention, it should be understood that if terms such as "upper," "lower," "left," "right," "inner," and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, they are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the terms used to describe positional relationships in the drawings are only for illustrative purposes and should not be construed as limiting the present patent. For those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.

[0079] In the description of this invention, unless otherwise explicitly specified and limited, the term "connection" or similar designation indicating a connection between components should be interpreted broadly. For example, it can refer to a fixed connection, a detachable connection, or an integral part; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can refer to the internal communication between two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0080] This invention provides a method for fabricating a plate-level fan-out heat dissipation structure. The method includes providing a first metal plate, a second metal plate, and a third metal plate. A microchannel outlet is formed on one side of the third metal plate to form a first heat dissipation module. A plurality of microchannels penetrating the second metal plate along its thickness direction are formed on the second metal plate to form a second heat dissipation module. A microchannel storage area inlet and a microchannel storage area communicating with the inlet are formed on one side of the third metal plate to form a third heat dissipation module. The first heat dissipation module, the third heat dissipation module, and the second heat dissipation module are respectively mounted and connected, so that the microchannel storage area communicates with the microchannel outlet through the microchannels. The method is then cut to obtain the plate-level fan-out heat dissipation structure.

[0081] The method for fabricating the board-level fan-out heat dissipation structure of the present invention combines the size advantages of board-level fan-out packaging and adopts a board-level array form for fabrication. The modular board-level fan-out heat dissipation structure can simultaneously fabricate each heat dissipation module of the board-level fan-out heat dissipation structure, which greatly improves the manufacturing efficiency of the heat dissipation structure, realizes high-efficiency and mass production, and enhances cost advantages. In the present invention, the cooling fluid automatically enters the inlet of the microchannel storage area through the capillary action principle and is stored in the microchannel storage area. When the cooling fluid in the microchannel storage area is full, it automatically flows back into the microchannel through the capillary action principle and automatically flows out through the microchannel outlet. The inlet of the microchannel storage area can be connected to the microchannel outlet through other connecting pipes to realize the automatic circulation of the cooling fluid (the entire circulation process does not require the setting of micro pumps or other power devices). This provides active heat dissipation for the chip located under the third metal plate. Combined with the passive heat dissipation effect of the metal plate on the chip, it can effectively improve the heat dissipation effect of the chip.

[0082] The preparation method of the plate-level fan-out heat dissipation structure of the present invention will be explained in detail below through specific embodiments.

[0083] Example 1

[0084] In this embodiment, each heat dissipation module is prepared by applying a photosensitive dry film, exposing, developing, and etching.

[0085] refer to Figure 1 Fabrication of the first heat dissipation module:

[0086] S10a, such as Figure 1-1 and Figure 1-2 A first carrier plate 11 and a first metal plate 12 are provided, and the first metal plate 12 is attached to the first carrier plate 11 with bonding adhesive.

[0087] S10b, such as Figure 1-3 A first photosensitive dry film 13 is attached to the first carrier plate 11;

[0088] S10c, such as Figure 1-4 The first photosensitive dry film 13 is exposed and developed to expose the microchannel outlet area to be etched.

[0089] S10d, such as Figure 1-5 The exposed microchannel outlet area is etched to obtain microchannel outlet 121;

[0090] S10e, Remove the residual first photosensitive dry film 13 to obtain the following: Figure 2 The first heat dissipation module is shown.

[0091] refer to Figure 3 Fabrication of the second heat dissipation module:

[0092] S20a, such as Figure 3-1 and Figure 3-2 As shown, a second carrier plate 21 and a second metal plate 22 are provided, and the second metal plate 22 is attached to one side of the second carrier plate 21 with bonding adhesive.

[0093] S20b, such as Figure 3-3 A second photosensitive dry film 23 is attached to the side of the second metal plate 22 away from the second carrier plate 21;

[0094] S20c, such as Figure 3-4 The second photosensitive dry film 23 is exposed and developed to expose the microchannel area to be etched.

[0095] S20d, such as Figure 3-5 The exposed microchannel area is etched to form microchannel 221;

[0096] S20e, Remove the residual second photosensitive dry film 23 to obtain the following: Figure 4 The second heat dissipation module is shown.

[0097] refer to Figure 5 Preparation of the third heat dissipation module:

[0098] S30a, such as Figure 5-1 and Figure 5-2 A third carrier plate 31 and a third metal plate 32 are provided, and the third metal plate 32 is attached to one side of the third carrier plate 31 with bonding adhesive.

[0099] S30b, such as Figure 5-3 A third photosensitive dry film 33 is attached to the side of the third metal plate 32 away from the third carrier plate 31;

[0100] S30c, such as Figure 5-4 The third photosensitive dry film 33 is exposed and developed to expose the entrance area of ​​the microchannel storage area to be etched.

[0101] S30d, such as Figure 5-5 The exposed entrance region of the microfluidic storage area is etched to form the microfluidic storage area entrance 321.

[0102] S30e, Remove the residual third photosensitive dry film 33, and attach the fourth photosensitive dry film 34 onto the third metal plate 32;

[0103] S30f, such as Figure 5-6 The fourth photosensitive dry film 34 is exposed and developed to expose the area of ​​the microchannel storage area adjacent to the microchannel storage area inlet 321.

[0104] S30g, such as Figure 5-7 The exposed area of ​​the microchannel storage region is etched to form a microchannel storage region 322 that is connected to the inlet 321 of the microchannel storage region;

[0105] S30h, remove the residual fourth photosensitive dry film 34, and obtain as shown. Figure 6 The second heat dissipation module is shown.

[0106] The fabrication of the first heat dissipation module, the second heat dissipation module, and the third heat dissipation module can be carried out simultaneously to improve efficiency and reduce production costs.

[0107] The first metal plate 12, the second metal plate 22, and the third metal plate 32 are all made of copper, which has good thermal conductivity. The copper plates can be pressed using copper-clad laminate or copper plating, and are not limited thereto. Of course, the materials of the first metal plate 12, the second metal plate 22, and the third metal plate 32 in this embodiment are not limited to copper; they can also be other metals with thermal conductivity.

[0108] In this embodiment, the materials of the first carrier plate 11, the second carrier plate 21 and the third carrier plate 31 can be glass, SUS, Prepreg (BT), FR4, FR5, PP, EMC, PI and other materials.

[0109] In this embodiment, the positions of the microchannel outlet 121 on the first metal plate 12, the microchannel 221 on the second metal plate 22, and the microchannel storage area inlet 321 and microchannel storage area 322 on the third metal plate 32 are pre-designed. Then, the apertures are created using a photosensitive dry film application-exposure-development-etching process. The method of creating apertures using photosensitive dry film application-exposure-development-etching is a conventional technique in the art and will not be described in detail here.

[0110] In other embodiments, lasers can also be used to fabricate the microchannel outlet 121 on the first metal plate 12, the microchannel 221 on the second metal plate 22, and the microchannel storage area inlet 321 and the microchannel storage area 322 on the third metal plate 32. Laser removal of material from the metal plates is a conventional technique in the art and will not be described in detail here.

[0111] Furthermore, in this embodiment, adjacent heat dissipation modules are mounted together in the following manner:

[0112] First, the three heat dissipation modules are cleaned using plasma to remove oxides and metal debris generated during the opening process from the surface of the metal plates. Then, the metal plates of two adjacent heat dissipation modules are connected by electrostatic adsorption. This method allows adjacent metal plates to be quickly connected by electrostatic adsorption, improving the mounting efficiency of the first metal plate 12, the second metal plate 22, and the third metal plate 32.

[0113] In actual operation, such as Figures 7-1 to 7-3 The mounting process specifically includes the following steps:

[0114] (1) Clean the first heat dissipation module, the second heat dissipation module and the third heat dissipation module using plasma;

[0115] (2) Align and attach the first metal plate 12 of the first heat dissipation module to the outlet side of the microchannel 221 of the second metal plate 22 of the second heat dissipation module, and then remove the second carrier plate 21.

[0116] (3) Align and attach the third metal plate 32 of the third heat dissipation module to the inlet side of the microchannel 221 of the second metal plate 22 of the second heat dissipation module. The first heat dissipation module, the second heat dissipation module and the third heat dissipation module after attachment are as follows: Figure 8 As shown;

[0117] (4) such as Figure 7-3 As shown, the three heat dissipation modules after mounting are cut together to complete the fabrication of the board-level fan-out heat dissipation structure, resulting in the structure shown. Figure 9 The plate-level fan-out heat dissipation structure is shown.

[0118] Example 2

[0119] This embodiment is basically the same as Embodiment 1 above (the names of the same components are the same as those in the attached drawings of Embodiment 1), the difference being the mounting method of the first heat dissipation module, the second heat dissipation module, and the third heat dissipation module, which specifically includes the following steps:

[0120] First, the three heat dissipation modules are cleaned using plasma to remove oxides and metal debris generated during the opening process from the metal plate surfaces. Then, the metal plates of adjacent heat dissipation modules are connected by electrostatic adsorption. After the three metal plates are aligned and bonded by electrostatic adsorption, they undergo hot pressing. Taking a copper metal plate as an example, during the hot pressing process, copper atoms on the surface of the copper plate are activated and penetrate into the other metal plate it is bonded to. Compared with the previous embodiment, this further improves the bonding stability between the metal plates, thereby improving the structural stability of the board-level fan-out heat dissipation structure and enabling the chip to have a stable heat dissipation effect.

[0121] In actual operation, this mounting process specifically includes the following steps:

[0122] (1) Clean the first heat dissipation module, the second heat dissipation module and the third heat dissipation module using plasma;

[0123] (2) Align and attach the first metal plate 12 of the first heat dissipation module to the outlet side of the microchannel 221 of the second metal plate 22 of the second heat dissipation module, and then remove the second carrier plate 21.

[0124] (3) Align and attach the third metal plate 32 of the third heat dissipation module to the inlet side of the microchannel 221 of the second metal plate 22 of the second heat dissipation module;

[0125] (4) Perform hot pressing on the three heat dissipation modules after mounting;

[0126] (5) Cut the three heat dissipation modules after hot pressing to complete the fabrication of the board-level fan-out heat dissipation structure.

[0127] Example 3

[0128] This embodiment is basically the same as Embodiment 1 above (the names of the same components are the same as those in the attached drawings of Embodiment 1), the difference being the mounting method of the first heat dissipation module, the second heat dissipation module, and the third heat dissipation module, which specifically includes the following steps:

[0129] First, the three heat dissipation modules are ultrasonically cleaned to remove impurities from the surface of the metal plate through friction. After the three heat dissipation modules are aligned and bonded together, they are subjected to hot pressing.

[0130] In actual operation, this mounting process specifically includes the following steps:

[0131] (1) Perform ultrasonic cleaning on the first heat dissipation module, the second heat dissipation module and the third heat dissipation module;

[0132] (2) Align and attach the first metal plate 12 of the first heat dissipation module to the outlet side of the microchannel 221 of the second metal plate 22 of the second heat dissipation module, and then remove the second carrier plate 21.

[0133] (3) Align and attach the third metal plate 32 of the third heat dissipation module to the inlet side of the microchannel 221 of the second metal plate 22 of the second heat dissipation module.

[0134] (4) Perform hot pressing on the three heat dissipation modules after mounting;

[0135] (5) Cut the three heat dissipation modules after hot pressing to complete the fabrication of the board-level fan-out heat dissipation structure.

[0136] Example 4

[0137] This embodiment is basically the same as Embodiment 1 above (the names of the same components are the same as those in the attached drawings of Embodiment 1), the difference being the mounting method of the first heat dissipation module, the second heat dissipation module, and the third heat dissipation module, which specifically includes the following steps:

[0138] The metal plates of two adjacent heat dissipation modules are bonded together with bonding adhesive.

[0139] In actual operation, this mounting process specifically includes the following steps:

[0140] (1) The first metal plate 12 of the first heat dissipation module is aligned and attached to the outlet side of the microchannel 221 of the second metal plate 22 of the second heat dissipation module by bonding adhesive, and then the second carrier plate 21 is removed. The shape of the bonding adhesive is consistent with the shape of the unetched part of the first metal plate 12.

[0141] (3) The third metal plate 32 of the third heat dissipation module is attached to the inlet side of the microchannel 221 of the second metal plate 22 by bonding adhesive. The shape of the bonding adhesive is consistent with the shape of the unetched part of the third metal plate 32.

[0142] (4) Perform hot pressing on the three heat dissipation modules after mounting;

[0143] (5) Cut the three heat dissipation modules after hot pressing to complete the fabrication of the board-level fan-out heat dissipation structure.

[0144] Example 5

[0145] This embodiment is basically the same as Embodiment 4 above (the names of the same components are the same as those in the attached drawings of Embodiment 4), the difference being that the bonding adhesive is replaced with thermal adhesive, that is, the metal plates of two adjacent heat dissipation modules are bonded together with thermal adhesive. Compared with Embodiment 4, the use of thermal adhesive in this embodiment can further improve the heat dissipation effect of the board-level fan-out heat dissipation structure.

[0146] Specifically, the components of the thermal adhesive include graphene, silicone, silicone grease, a mixture of methyl vinyl polysiloxanes, a mixture of methyl hydrogen polysiloxanes, and alumina. Graphene enables the thermal adhesive to have excellent heat dissipation performance.

[0147] like Figure 7-3As shown, an embodiment of the present invention also provides a plate-level fan-out heat dissipation structure, which is prepared using the preparation method of the plate-level fan-out heat dissipation structure in any of the above embodiments. The plate-level fan-out heat dissipation structure includes a first heat dissipation module, a second heat dissipation module, and a third heat dissipation module connected sequentially from top to bottom. The first heat dissipation module includes a first metal plate 12 and a groove-shaped microchannel outlet 121 formed on the side of the first metal plate 12 near the second metal plate 22. The microchannel outlet 121 extends to one side wall of the first metal plate 12. The second heat dissipation module includes a second metal plate 22 and a plurality of microchannels 221 formed on the second metal plate 22. 21 is located below the microchannel outlet 121 and penetrates the second metal plate 22 along the thickness direction of the second metal plate 22. The third heat dissipation module includes a third metal plate 32 and a microchannel storage area 322 opened on the side of the third metal plate 32 near the second metal plate 22 and a microchannel storage area inlet 321 communicating with the microchannel storage area 322. The microchannel storage area 322 is directly opposite the microchannel 221. The microchannel storage area 322 is connected to the microchannel outlet 121 through the microchannel 221. The end of the microchannel storage area inlet 321 away from the microchannel storage area 322 extends to one side wall of the third metal plate 32.

[0148] In this invention, cooling fluid automatically enters the microchannel storage area inlet 321 through capillary action and is stored in the microchannel storage area 322. When the microchannel storage area 322 is full, the cooling fluid automatically flows back into the microchannel 221 through capillary action and automatically flows out through the microchannel outlet 121. The microchannel storage area inlet 321 can be connected to the microchannel outlet 121 through other connecting pipes to realize automatic circulation of cooling fluid (the entire circulation process does not require the installation of micro-pumps or other power devices). This provides active heat dissipation for the chip located below the first metal plate 12. Combined with the passive heat dissipation effect of the metal plate on the chip, the heat dissipation effect of the chip can be effectively improved.

[0149] In the first, second, and third heat dissipation modules, the metal plates of adjacent heat dissipation modules are connected by electrostatic adsorption. After the metal plates are cleaned with plasma to remove surface oxides and other impurities, they can be connected by electrostatic adsorption.

[0150] In other embodiments, in the first heat dissipation module, the second heat dissipation module and the third heat dissipation module, the metal plates of two adjacent heat dissipation modules are bonded together by bonding adhesive, which can eliminate the cleaning step.

[0151] Furthermore, in the first, second, and third heat dissipation modules, the metal plates of adjacent heat dissipation modules are bonded together using thermal adhesive. Compared to using bonding adhesive, using thermal adhesive can further improve the heat dissipation effect.

[0152] In this embodiment, the first metal plate 12, the second metal plate 22 and the third metal plate 32 are all copper plates.

[0153] Furthermore, there are four microchannel storage area inlets 321, which extend to the four sides of the third metal plate 32 respectively. There are also four microchannel outlets 121, which extend to the four sides of the first metal plate 12 respectively and correspond to one of the microchannel storage area inlets 321 respectively.

[0154] The depth of the microchannel storage area 322 is greater than the depth of the microchannel storage area inlet 321.

[0155] The shape of the cross-section of the microchannel 221 can be square, circular, triangular, or other structures, and there are no specific restrictions.

[0156] Embodiments of the present invention also provide an electronic component comprising a chip and the board-level fan-out heat dissipation structure described in the above embodiments, wherein the chip is mounted on the side of the third heat dissipation module away from the second heat dissipation module. The combination of active and passive heat dissipation in the board-level fan-out heat dissipation structure enables the chip to achieve excellent heat dissipation.

[0157] It should be stated that the above-described specific embodiments are merely preferred embodiments of the present invention and the technical principles employed. Those skilled in the art should understand that various modifications, equivalent substitutions, and variations can be made to the present invention. However, such variations, as long as they do not depart from the spirit of the present invention, should be within the scope of protection of the present invention. Furthermore, some terminology used in this specification and claims is not limiting, but merely for ease of description.

Claims

1. A method for fabricating a plate-level fan-out heat dissipation structure, characterized in that, A first metal plate, a second metal plate, and a third metal plate are provided. A microchannel outlet is formed on one side of the first metal plate to form a first heat dissipation module. A plurality of microchannels penetrating the second metal plate along the thickness direction of the second metal plate are formed to form a second heat dissipation module. A microchannel storage area inlet and a microchannel storage area communicating with the microchannel storage area inlet are formed on one side of the third metal plate to form a third heat dissipation module. The first heat dissipation module, the third heat dissipation module, and the second heat dissipation module are respectively mounted and connected, so that the microchannel storage area is connected to the microchannel outlet through the microchannel. Then, the plate-level fan-out heat dissipation structure is obtained by cutting. The inlet of the microchannel storage area can be connected to the outlet of the microchannel through a connecting pipe to realize the automatic circulation of cooling fluid and actively dissipate heat from the chip located under the third metal plate. The entire circulation process does not require a power device: the cooling fluid can automatically enter the inlet of the microchannel storage area of ​​the board-level fan-out type heat dissipation structure through the capillary action principle and be stored in the microchannel storage area. When the cooling fluid in the microchannel storage area is full, it will automatically flow into the microchannel again through the capillary action principle and automatically flow out through the microchannel outlet.

2. The method for preparing the plate-level fan-out heat dissipation structure according to claim 1, characterized in that, The method for manufacturing the first heat dissipation module includes the following steps: S10a. A first carrier plate and a first metal plate are provided, and the first metal plate is attached to the first carrier plate with bonding adhesive. S10b: Apply a first photosensitive dry film to the first carrier plate; S10c. Expose and develop the first photosensitive dry film to expose the microchannel outlet area to be etched. S10d: Etch the exposed microchannel outlet area to obtain the microchannel outlet; S10e, Remove the residual first photosensitive dry film.

3. The method for preparing the plate-level fan-out heat dissipation structure according to claim 1, characterized in that, The method for manufacturing the second heat dissipation module includes the following steps: S20a, Provide a second carrier plate and a second metal plate, and attach the second metal plate to one side of the second carrier plate with bonding adhesive; S20b, A second photosensitive dry film is attached to the side of the second metal plate away from the second carrier plate; S20c, Expose and develop the second photosensitive dry film to expose the microchannel area to be etched; S20d: Etch the exposed microchannel area to form a microchannel; S20e, Remove any remaining second photosensitive dry film.

4. The method for preparing the plate-level fan-out heat dissipation structure according to claim 1, characterized in that, The method for preparing the third heat dissipation module includes the following steps: S30a, Provide a third carrier plate and a third metal plate, and attach the third metal plate to one side of the third carrier plate with bonding adhesive; S30b, A third photosensitive dry film is attached to the side of the third metal plate away from the third carrier plate; S30c, Expose and develop the third photosensitive dry film to expose the entrance area of ​​the microchannel storage area to be etched. S30d: Etch the exposed microchannel storage area inlet region to form the microchannel storage area inlet; S30e, Remove the residual third photosensitive dry film, and attach the fourth photosensitive dry film to the third metal plate; S30f: Expose and develop the fourth photosensitive dry film to expose the area of ​​the microchannel storage area adjacent to the entrance of the microchannel storage area. S30g, Etch the exposed area of ​​the microchannel storage region to form a microchannel storage region connected to the inlet of the microchannel storage region; S30h, remove the residual fourth photosensitive dry film.

5. The method for preparing the plate-level fan-out heat dissipation structure according to claim 1, characterized in that, The microchannel outlet is fabricated on the first metal plate, the microchannel is fabricated on the second metal plate, and the microchannel storage area inlet and the microchannel storage area are fabricated on the third metal plate using laser.

6. The method for preparing the plate-level fan-out heat dissipation structure according to claim 1, characterized in that, In the first heat dissipation module, the second heat dissipation module, and the third heat dissipation module, adjacent heat dissipation modules are mounted together in any of the following ways: First, the three heat dissipation modules are cleaned using plasma; then, the metal plates of adjacent heat dissipation modules are connected by electrostatic adsorption. Alternatively, First, the three heat dissipation modules are cleaned using plasma. Then, the metal plates of adjacent heat dissipation modules are connected by electrostatic adsorption, and finally, a heat-pressing process is performed. Alternatively, First, the three heat dissipation modules are ultrasonically cleaned to remove impurities from the metal plate surface through friction. Then, the metal plates of adjacent heat dissipation modules are aligned and bonded together before undergoing hot pressing. Alternatively... The metal plates of two adjacent heat dissipation modules are bonded together using bonding adhesive; or, The metal plates of two adjacent heat dissipation modules are bonded together with thermal adhesive.

7. The method for preparing the plate-level fan-out heat dissipation structure according to claim 6, characterized in that, The components of the thermal adhesive include graphene, silicone, silicone grease, a mixture of methyl vinyl polysiloxanes, a mixture of methyl hydrogen polysiloxanes, and aluminum oxide.

8. A plate-level fan-out heat dissipation structure, characterized in that, The heat dissipation structure is fabricated using the method described in any one of claims 1 to 7, comprising a first heat dissipation module, a second heat dissipation module, and a third heat dissipation module connected sequentially from top to bottom. The first heat dissipation module includes a first metal plate and a microchannel outlet with a groove-shaped structure opened on the side of the first metal plate near the second metal plate. The microchannel outlet extends to one side wall of the first metal plate. The second heat dissipation module includes a second metal plate and a plurality of microchannels opened on the second metal plate. The microchannels are located below the microchannel outlet and penetrate the second metal plate along the thickness direction. The third heat dissipation module includes a third metal plate and a microchannel storage area opened on the side of the third metal plate near the second metal plate and a microchannel storage area inlet communicating with the microchannel storage area. The microchannel storage area is directly opposite the microchannels and is connected to the microchannel outlet through the microchannels. The end of the microchannel storage area inlet away from the microchannel storage area extends to one side wall of the third metal plate.

9. The plate-level fan-out heat dissipation structure according to claim 8, characterized in that, In the first, second, and third heat dissipation modules, the metal plates of adjacent heat dissipation modules are connected by electrostatic adsorption; or, In the first, second, and third heat dissipation modules, the metal plates of adjacent heat dissipation modules are bonded together using bonding adhesive; or, In the first heat dissipation module, the second heat dissipation module and the third heat dissipation module, the metal plates of two adjacent heat dissipation modules are bonded together with thermal adhesive.

10. An electronic component, characterized in that, The device includes a chip and the board-level fan-out heat dissipation structure as described in claim 8 or 9, wherein the chip is mounted on the side of the third heat dissipation module away from the second heat dissipation module.

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