Patching equipment for solid wax

Abstract

The present invention discloses a patch device for solid wax, comprising: a wax dripping device for dripping wax onto the back of a wafer; a wax throwing device for melting the wax on the wafer and throwing the wax on the wafer; a pre-patch device for pre-positioning the wafer after throwing the wax on a bearing workpiece; a pressing device for pressurizing the wafer and the bearing workpiece so that the wafer adheres to the bearing workpiece, the pressing device comprising a third bearing platform and a press module arranged above the third bearing platform, the third bearing platform being used to carry the bearing workpiece pre-attached with the wafer, the press module being used to pressurize the wafer on the bearing workpiece, a third heating mechanism and a cooling mechanism being arranged on the third bearing platform, the third heating mechanism being used to heat the wax between the bearing workpiece and the wafer, and the cooling mechanism being used to cool the wax between the bearing workpiece and the wafer. This scheme has the advantages of saving solid wax, eliminating consumables such as wax absorbing paper, improving production efficiency, and reducing installation space.

Description

Technical Field

[0001] The invention relates to the field of optoelectronic technology, in particular to a patch device for solid wax. Background Art

[0002] The manufacturing process of LED chips requires a grinding and thinning process of the wafer, which can facilitate subsequent chip cutting, packaging and bonding, and improve the heat dissipation performance of the chip during use. Before the wafer thinning process, the wafer needs to be adhered to a specific workpiece surface for carrying. The side of the wafer that does not need to be ground is adhered to the carrying workpiece, and the side of the wafer that needs to be ground and thinned (also called the back of the wafer) is exposed. In the LED chip manufacturing process, this process of adhering the wafer is called the SMT process.

[0003] With the rapid development of the LED chip industry, in order to meet the growing demand for production capacity, automatic placement machines have also been vigorously developed. Solid wax has become more and more widely used in the placement process of chips due to its good adhesion properties.

[0004] The method commonly used by existing chip mounters for chip mounting is: first drip melted wax onto the support workpiece, then position the chip on the support workpiece, and then pressurize and cool the chip and the support workpiece to solidify the wax between the two to fix the chip on the support workpiece. However, when the existing chip mounter uses solid wax to mount the chip, due to the slightly poor fluidity of the solid wax, there will be problems such as uneven wax content between the chip and the support workpiece, and poor flatness of the chip after adhesion. In addition, in order to ensure that there is wax on the contact surface between the chip and the support workpiece, excessive wax is usually dripped onto the support workpiece, and then wax absorbing paper is used to absorb the excess wax on the support workpiece while the chip and the support workpiece are pressed and attached. Therefore, the use of solid wax and consumables such as wax absorbing paper will increase, which is not conducive to the control of production costs. Summary of the invention

[0005] In order to overcome the defects in the prior art, an embodiment of the present invention provides a patch device for solid wax, which is used to solve at least one of the above problems.

[0006] The present application embodiment discloses: a chip bonding device for solid wax, used to adhere a wafer to a supporting workpiece, comprising:

[0007] A wax dripping device, used for dripping wax onto the back side of the wafer;

[0008] A wax-spinning device, used for melting the wax on the wafer and performing wax-spinning on the wafer;

[0009] A pre-mounting device, used for pre-positioning the wafer after waxing on the supporting workpiece;

[0010] A pressing device is used to pressurize the chip and the supporting workpiece so that the chip adheres to the supporting workpiece. The pressing device includes a third supporting platform and a press module arranged above the third supporting platform. The third supporting platform is used to support the supporting workpiece with the chip pre-attached thereto. The press module is used to pressurize the chip on the supporting workpiece. A third heating mechanism and a cooling mechanism are provided on the third supporting platform. The third heating mechanism is used to heat the wax between the supporting workpiece and the chip, and the cooling mechanism is used to cool the wax between the supporting workpiece and the chip.

[0011] Specifically, the cooling mechanism includes a plurality of water tanks arranged inside the third supporting platform and located below the third heating mechanism, and a pipeline for water inlet and / or water outlet connected to the third supporting platform and communicating with the plurality of water tanks.

[0012] Specifically, the multiple water tanks are interconnected.

[0013] Specifically, the press module includes a plurality of press heads and a plurality of cylinders corresponding one-to-one to the plurality of press heads, and the plurality of press heads correspond one-to-one to the plurality of wafers on the supporting workpiece.

[0014] Specifically, the pressure head includes a metal body and silica gel disposed below the body for contacting the wafer.

[0015] Specifically, the press module presses the chip for 5 to 6 minutes, the third heating mechanism is used to heat the wax between the support workpiece and the chip within the first 2 to 3 minutes of the press module press process, and the cooling mechanism is used to cool the wax between the support workpiece and the chip within the last 2 to 3 minutes of the press module press process.

[0016] Specifically, the pre-mounting device includes a first chip picking mechanism, a second supporting platform for supporting the supporting workpiece, a third driving mechanism and a fourth driving mechanism. The first chip picking mechanism is used to take out the chip after wax throwing from the wax throwing device and place the chip on the supporting workpiece. The second supporting platform includes a movable module and a fixed module with clearance fit. The movable module is provided with a suction hole for sucking the supporting workpiece. The third driving mechanism is used to drive the movable module to rise and fall. The fourth driving mechanism can drive the movable module to rotate after the movable module rises so that the supporting workpiece can carry multiple chips at the same time. The fixed module is provided with a second heating mechanism.

[0017] Specifically, it is characterized in that the first chip picking mechanism includes a flip arm, a fifth driving mechanism that drives the flip arm to move between the wax-spinning device and the second supporting platform, a sixth driving mechanism that drives the flip arm to flip, and a first picking unit arranged at the free end of the flip arm to pick up the chip.

[0018] Specifically, the chip placement device further includes a second chip taking mechanism, which is used to take out the chip after waxing off from the waxing device and transfer the chip to a position corresponding to the first pickup unit.

[0019] Specifically, the patch equipment includes two pre-patterning devices and two pressing devices, the second patch picking mechanism includes a guide rail and a second picking unit that reciprocates along the guide rail, the two pre-patterning devices are distributed on both sides of the guide rail along the long axis direction of the guide rail, and the two pressing devices and the two pre-patterning devices correspond one to one.

[0020] The present invention has at least the following beneficial effects:

[0021] 1. Compared with the traditional SMT equipment that drips wax on the supporting workpiece, the SMT equipment of this embodiment melts the solid wax and then drips it on the back of the chip and performs a wax-spinning treatment on the chip, so that the wax on the back of the chip is evenly distributed, ensuring that the chip after pressing has a good flatness relative to the supporting workpiece, so that in the subsequent grinding process using the surface of the supporting workpiece as a reference, the grinding amount at various places on the back of the chip can be uniform.

[0022] 2. After the wax is thrown off by the wax throwing device, the wax content on the back of the wafer is uniform and small, so there will be no phenomenon of excess wax flowing around during the pressing step, and consumables such as wax absorbing paper can be saved.

[0023] 3. The patch equipment of this embodiment has the advantages of improving production efficiency, reducing installation space, etc., which is conducive to reducing production costs.

[0024] In order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are specifically cited below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0026] Figure 1is a schematic structural diagram of a patch device according to an embodiment of the present invention;

[0027] Figure 2 yes Figure 1 A partial enlarged view of the middle A;

[0028] Figure 3 is a schematic structural diagram of the wax dripping device described in an embodiment of the present invention;

[0029] Figure 4 is a three-dimensional diagram of the wax-spinning device described in an embodiment of the present invention;

[0030] Figure 5 is a top view of the wax-spinning device described in an embodiment of the present invention;

[0031] Figure 6 is a side view of the wax-spinning device described in an embodiment of the present invention;

[0032] Figure 7 is a structural schematic diagram of the first film taking mechanism in an embodiment of the present invention;

[0033] Figure 8 is a schematic structural diagram of the second carrying platform in an embodiment of the present invention;

[0034] Fig. 9 is a three-dimensional diagram of the third carrying platform described in the embodiment of the present invention;

[0035] Fig.10 is a front view of the third carrying platform described in the embodiment of the present invention;

[0036] Fig.11 yes Fig.10 Sectional view at the middle BB;

[0037] Fig.12 yes Fig.10 Sectional view at CC;

[0038] Fig.13 It is a schematic diagram of the structure of the press module described in an embodiment of the present invention.

[0039] Reference numerals in the above drawings:

[0040] 10. Wafer; 100. Carrying workpiece;

[0041] 1. wax dripping device; 11. wax box; 12. drip nozzle; 13. first heating mechanism; 14. bracket;

[0042] 2. wax throwing device; 21. first bearing platform; 22. first driving mechanism; 23. second driving mechanism; 24. protective cover; 25. wax collecting box;

[0043] 31. First film taking mechanism; 311. Turning arm; 312. Fifth driving mechanism; 313. Sixth driving mechanism; 314. First picking unit;

[0044] 32. Second carrying platform; 321. Movable module; 322. Fixed module; 323. Second heating mechanism;

[0045] 33. The third driving mechanism;

[0046] 34. Fourth driving mechanism;

[0047] 35. Seventh driving mechanism;

[0048] 36. Ejector rod;

[0049] 41. third bearing platform; 411. upper plate; 412. lower plate;

[0050] 42. Press module; 421. Press head; 422. Cylinder;

[0051] 43. The third heating mechanism;

[0052] 441, water tank; 442, pipe; 443, water inlet and outlet;

[0053] 51. guide rail; 52. second picking unit;

[0054] 6. Disk retrieval device. DETAILED DESCRIPTION

[0055] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0056] like Figure 1 As shown, the chip bonding equipment in this embodiment is used to adhere the wafer 10 to the supporting workpiece 100. The material of the wafer 10 can be sapphire, gallium arsenide and silicon carbide, and the supporting workpiece 100 can be a ceramic disk. The chip bonding equipment includes:

[0057] The wax dripping device 1 is used for dripping wax onto the back side of the wafer 10 . The wax in this embodiment refers to solid wax.

[0058] The wax-spinning device 2 is used to melt the solid wax dripped on the wafer 10 and to spin the wax on the wafer 10 so that the melted wax can be evenly coated on the back side of the wafer 10 .

[0059] The pre-mounting device is used to pre-position the wafer 10 after the wax is thrown off on the carrier workpiece 100. Specifically, the pre-mounting device can make the wafer 10 initially adhere to the carrier workpiece 100. At this time, the adhesive force between the wafer 10 and the carrier workpiece 100 is still relatively small.

[0060] The pressing device is used to pressurize the chip 10 and the supporting workpiece 100 so that the chip 10 adheres to the supporting workpiece 100. At this time, the adhesive force between the chip 10 and the supporting workpiece 100 after being pressed by the pressing device can ensure that the chip 10 will not fall off the supporting workpiece 100 during the subsequent grinding process of the chip 10.

[0061] With the above structure, the patch device in this embodiment has the following advantages:

[0062] 1. Compared with the conventional SMT equipment that drips wax onto the carrier workpiece 100, the SMT equipment of this embodiment drips solid wax onto the back of the wafer 10 and performs a wax-spinning treatment on the wafer 10, so that the wax on the back of the wafer 10 is evenly distributed, ensuring that the wafer 10 after being pressed has a good flatness relative to the carrier workpiece 100, so that in the subsequent grinding process using the surface of the carrier workpiece 100 as a reference, the grinding amount at various locations on the back of the wafer 10 can be even.

[0063] 2. After the wax is spun off by the wax spun off device 2, the wax content on the back of the wafer 10 is uniform and small, so there will be no phenomenon of excess wax flowing around during the pressing step, and consumables such as wax absorbing paper can be saved.

[0064] Specifically, Figure 3 As shown, the wax dripping device 1 may include a wax box 11, a drip nozzle 12 connected to the wax box 11, and a first heating mechanism 13 disposed on the wax box 11 for heating the wax box 11. More specifically, the first heating mechanism 13 is mainly used to heat the wax box 11 near the drip nozzle 12, so that the solid wax stored in the wax box 11 can be melted into liquid and dripped onto the wafer 10.

[0065] Specifically, Figures 4 to 6As shown, the wax-spinning device 2 may include a first carrier 21 for carrying the wafer 10, a first driving mechanism 22 for driving the first carrier 21 to rise and fall, a second driving mechanism 23 for driving the first carrier 21 to rotate, and a protective cover 24 arranged around the first carrier 21. The first carrier 21 is provided with a suction hole (not shown in the figure) for sucking the wafer 10 to fix the wafer 10, and the first carrier 21 is correspondingly arranged below the drip nozzle 12 of the wax-dropping device 1. The protective cover 24 may also be provided with a second heating mechanism 323 for keeping the wax on the wafer 10 warm. The first driving mechanism 22 drives the first carrier 21 to rise and fall so as to take and place the wafer 10; the second driving mechanism 23 drives the first carrier 21 to rotate so that the wax on the wafer 10 can be evenly distributed on the back of the wafer 10 under the action of centrifugal force. Specifically, the first carrier 21 rotates at a speed of 100 rpm for 2 to 3 seconds at the beginning so that the wax is evenly distributed on the back of the wafer 10. Then, the first carrier 21 rotates at a speed of 3000 rpm for 4 to 5 seconds to complete the wax-swinging action, thereby avoiding the use of consumables such as wax-absorbing paper in the subsequent process; the protective cover 24 can prevent the wax from splashing around when the wax is swayed. Preferably, a wax collecting box 25 for collecting the wax dripping from the inner wall of the protective cover 24 can also be provided below the protective cover 24. The wax dripping device 1 can also be provided with a bracket 14 for installing the wax box 11, and the wax box 11 can also move along the bracket 14 so that the wax box 11 and the drip nozzle 12 can be misaligned with the wax-swinging device 2, which is convenient for the installation, maintenance and repair of the wax box 11, the drip nozzle 12 and the wax-swinging device 2.

[0066] Specific, combined Figure 1 and Figure 8 As shown, the pre-mounting device includes a first wafer taking mechanism 31, a second carrier platform 32 for supporting the workpiece 100, a third driving mechanism 33 and a fourth driving mechanism 34. The first wafer taking mechanism 31 is used to take out the wafer 10 after the wax is removed from the wax removal device 2 and place the wafer 10 on the workpiece 100. The second carrier platform 32 includes a movable module 321 and a fixed module 322 with clearance fit. The movable module 321 is provided with a plurality of suction holes (not shown in the figure) for sucking the workpiece 100 to fix it. Preferably, the movable module 321 can be circular, and the entire circumference of the movable module 321 is clearance fit with the fixed module 322. The third driving mechanism 33 is used to drive the movable module 321 to rise and fall, and the fourth driving mechanism 34 can drive the movable module 321 to rotate after the movable module 321 rises so that the workpiece 100 can carry multiple wafers 10 at the same time, so as to improve the working efficiency of the mounting device. The fixed module 322 is provided with a second heating mechanism 323 for heating the workpiece 100 and the wafer 10 thereon.

[0067] By adopting the above scheme, the movable module 321 of the second carrier 32 in this embodiment can be raised and lowered in the vertical direction. When the carrier workpiece 100 is to receive the current wafer 10, the movable module 321 can be lowered to make its own end face flush with the end face of the fixed module 322. When the carrier workpiece 100 is to receive the next wafer 10, the movable module 321 can be raised and rotated to align the blank part (the part where the wafer 10 is not yet attached) on the carrier workpiece 100 with the first wafer taking mechanism 31, and then the movable module 321 is lowered to be flush with the fixed module 322 to prepare for receiving the wafer 10. In this way, the carrier workpiece 100 on it can be driven to rotate by the rotation of the movable module 321 of the second carrier 32. The space required for the rotation of the movable module 321 is small, and the movable module 321 is rotated after it is raised, so as to avoid interference with the fixed module 322. The second heating mechanism 323 can keep the wax on the back of the wafer 10 in a melted state to increase the adhesion between the wafer 10 and the supporting workpiece 100 and prevent the wafer 10 from warping and detaching from the surface of the supporting workpiece 100 .

[0068] Further, refer to Figure 8 As shown, the pre-mounting device may further include a seventh driving mechanism 35 and a plurality of ejector pins 36, and the plurality of ejector pins 36 may be evenly distributed along the circumference. When the movable module 321 of the second carrier 32 is about to rise, the plurality of ejector pins 36 may penetrate the fixed module 322 of the second carrier 32 under the drive of the seventh driving mechanism 35 to eject the bearing workpiece 100 upward. Since the area of ​​the bearing workpiece 100 is usually relatively large, the use of the ejector pins 36 to assist in ejection can ensure that the movable module 321 can smoothly drive the bearing workpiece 100 to rise.

[0069] Specifically, Figure 7 As shown, the first chip picking mechanism 31 includes a flip arm 311, a fifth driving mechanism 312 for driving the flip arm 311 to move between the wax-spinning device 2 and the second supporting platform 32, a sixth driving mechanism 313 for driving the flip arm 311 to flip, and a first picking unit 314 arranged at the free end of the flip arm 311 to pick up the chip 10. The first pickup unit 314 may be provided with a suction hole (not shown in the figure) for sucking the wafer 10. When the flip arm 311 moves to a position corresponding to the wax-spinning device 2, the end of the first pickup unit 314 away from the flip arm 311 sucks the wafer 10 from the bottom of the wafer 10 (that is, the side of the wafer 10 not coated with wax). When the flip arm 311 moves to a position corresponding to the second supporting platform 32, the sixth driving mechanism 313 drives the flip arm 311 to drive the first pickup unit 314 to rotate above the supporting workpiece 100. At this time, the back side of the wafer 10 coated with wax on the first pickup unit 314 faces the supporting workpiece 100, and the sixth driving mechanism 313 further drives the flip arm 311 to make the wafer 10 adhere to the supporting workpiece 100.

[0070] Specifically, Figure 1 and 9 As shown, the pressing device may include a third carrier 41 and a press module 42 arranged above the third carrier 41. The third carrier 41 is used to carry the carrier workpiece 100 with the wafer 10 pre-attached thereto, and the pressing module is used to pressurize the wafer 10 on the carrier workpiece 100. A third heating mechanism 43 and a cooling mechanism are provided on the third carrier 41. In the traditional process, the wax heating and pressing process on the back of the wafer 10 are separated into two different processes. During the process of transferring from the heating process to the pressing process, the wafer 10 is prone to warping. By adopting the scheme in this embodiment, the heating and pressurized cooling process of the wafer 10 can be carried out in the same device at the same station, so that the wafer 10 can be prevented from warping.

[0071] Further, see Figures 9 to 12 As shown, the cooling mechanism includes a plurality of water troughs 441 arranged inside the third supporting platform 41 and located below the third heating mechanism 43, and a pipe 442 for water inlet and / or water outlet connected to the third supporting platform 41 and communicated with the plurality of water troughs 441. When the wax on the back of the chip 10 needs to be cooled, water can be introduced into the water trough 441 through the pipe 442 connected to the cooling water source. When the wax on the back of the chip 10 needs to be heated, the water in the water trough 441 can be sucked away through the pipe 442.

[0072] Furthermore, referring to Figures 9 to 12As shown, the third bearing platform 41 may include an upper plate 411 and a lower plate 412 connected in correspondence with each other, the front of the upper plate 411 is used to support the workpiece 100, the back of the upper plate 411 is in contact with the front of the lower plate 412, the pipeline 442 may be connected to the lower plate 412, and the lower plate 412 may be provided with a water inlet and outlet hole 443 for connecting the pipeline 442 and the water tank 441. A plurality of water tanks 441 and a third heating mechanism 43 may be arranged on the upper plate 411, wherein the third heating mechanism 43 is arranged on the two side surfaces of the upper plate 411 and close to the front surface of the upper plate 411, and a plurality of water tanks 441 are arranged on the back surface of the upper plate 411, the water tanks 441 can penetrate the back surface of the upper plate 411 and are recessed toward the front surface of the upper plate 411, and the water tanks 441 do not penetrate the two side surfaces and the front surface of the upper plate 411. In order to improve the efficiency of water inlet and outlet, the cooling mechanism may include two pipelines 442 , and therefore, the lower plate 412 is also correspondingly provided with two water inlet and outlet holes 443 . Preferably, each water trough 441 can be annular, and the diameters of the multiple annular water troughs 441 are different but their axes coincide, and the multiple water troughs 441 can be interconnected to improve water flow efficiency; two water inlet and outlet holes 443 can pass through a side surface of the lower plate 412 to extend toward the interior of the lower plate 412, and when one of the water inlet and outlet holes 443 extends to a position corresponding to the innermost water trough 441, the water inlet and outlet hole 443 turns to extend upward to pass through the front of the lower plate 412, and when the other water inlet and outlet hole 443 extends to a position corresponding to the outermost water trough 441, the water inlet and outlet hole 443 turns to extend upward to pass through the front of the lower plate 412, that is, one end of the two water inlet and outlet holes 443 passes through the side surface of the lower plate 412 to be connected with the pipeline 442, and the other end passes through the front of the lower plate 412 to be connected with the water trough 441.

[0073] By adopting the above scheme, the multiple annular water grooves 441 in this embodiment are coaxially arranged on the back side of the upper plate 411, and the multiple water grooves 441 are interconnected, which can increase the area and water flow rate of the water groove 441, that is, the cooling speed can be increased. Since the opening direction of the water groove 441 is downward, the water in the water groove 441 can also be quickly absorbed without affecting the heating of the product, which is beneficial to improving production efficiency.

[0074] Specifically, Fig.13As shown, the press module 42 may include a plurality of press heads 421 and a plurality of cylinders 422, and the plurality of cylinders 422 and the plurality of press heads 421 are connected one by one. The number of press heads 421 is the same as the number of wafers 10 on the bearing workpiece 100, that is, each wafer 10 is pressed by a press head 421, so that the force uniformity of each wafer 10 can be improved and the pressing effect can be improved. The press head 421 may include a main body and a silicone rubber arranged under the main body for contacting the wafer 10, and the silicone rubber can prevent the surface of the wafer 10 from being crushed or scratched. Preferably, the main body can be made of metal, for example, aluminum. The press module 42 presses the wafer 10 for 5 to 6 minutes, and the third heating mechanism 43 is used to heat the wax between the bearing workpiece 100 and the wafer 10 within the first 2 to 3 minutes of the press module 42 pressurization process, and the cooling mechanism is used to cool the wax between the bearing workpiece 100 and the wafer 10 within the last 2 to 3 minutes of the press module 42 pressurization process. By adopting the above scheme, keeping the wax heated during the pressurization process can improve the fluidity of the wax and ensure that the wax on the back of the wafer 10 is uniform, while keeping the wafer 10 pressurized during the cooling process can prevent the wafer 10 from warping.

[0075] Specifically, Figure 1 and 2 As shown, the chip mounting device in this embodiment may further include a second chip picking mechanism, which is used to take out the chip 10 after waxing off from the waxing device 2 and transfer the chip 10 to a position corresponding to the first pickup unit 314 of the first chip picking mechanism 31. Further, the second chip picking mechanism may include a guide rail 51 and a second pickup unit 52 that can move along the guide rail 51. After the second pickup unit 52 takes the chip 10 from the waxing device 2 and moves it to a preset position, the first pickup unit 314 absorbs the chip 10 from the second pickup unit 52. Therefore, the second pickup unit 52 may include a U-shaped bearing portion, and both sides of the U-shaped bearing portion are used to carry the chip 10. The first pickup unit 314 can penetrate upward from the middle of the U-shape to absorb the chip 10.

[0076] like Figure 1 As shown, the patch device in this embodiment may include two pre-patch devices and two pressing devices, the two pre-patch devices are distributed on both sides of the guide rail 51 along the long axis direction of the guide rail 51, and the two pressing devices correspond to the two pre-patch devices one by one. Preferably, the two pre-patch devices and the two pressing devices are arranged on the same side of the wax throwing device 2 along the feeding direction. The patch device may also include a tray removal device 6 for removing the pressed wafer 10 and the workpiece 100 from the two pressing devices, and the tray removal device 6 is arranged between the two pressing devices, which can not only improve production efficiency, but also reduce equipment investment and installation space.

[0077] Specifically, the first drive mechanism 22, the second drive mechanism 23, the third drive mechanism 33, the fourth drive mechanism 34, the fifth drive mechanism 312, the sixth drive mechanism 313 and the seventh drive mechanism 35 may all include motors for providing driving force for the driven object, and when necessary, may also include guide members that cooperate with the motors to guide the driven object.

[0078] The present invention uses specific embodiments to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea. At the same time, for those skilled in the art, according to the idea of ​​the present invention, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as a limitation on the present invention.

Claims

1. A chip bonding device for solid wax, used to adhere a chip to a supporting workpiece, characterized in that: include: A wax dripping device, used for dripping wax onto the back side of the wafer; A wax-spinning device is used to melt the wax on the wafer and spin the wax on the wafer; the wax-spinning device includes a first carrier for carrying the wafer, a first driving mechanism for driving the first carrier to rise and fall, a second driving mechanism for driving the first carrier to rotate, and a protective cover arranged around the first carrier, wherein the protective cover is provided with a second heating mechanism for keeping the wax on the wafer warm; A pre-mounting device, the pre-mounting device comprises a first wafer taking mechanism, a second bearing platform for carrying the bearing workpiece, a third driving mechanism and a fourth driving mechanism, the first wafer taking mechanism is used to take out the wafer after waxing off from the waxing device and place the wafer on the bearing workpiece, the second bearing platform comprises a movable module and a fixed module with clearance fit, the movable module is provided with a suction hole for sucking the bearing workpiece, the third driving mechanism is used to drive the movable module to rise and fall, the fourth driving mechanism can drive the movable module to rotate after the movable module rises so that the bearing workpiece can carry multiple wafers at the same time, and the fixed module is provided with a second heating mechanism; A pressing device is used to pressurize the chip and the supporting workpiece so that the chip adheres to the supporting workpiece. The pressing device includes a third supporting platform and a press module arranged above the third supporting platform. The third supporting platform is used to support the supporting workpiece with the chip pre-attached thereto. The press module is used to pressurize the chip on the supporting workpiece for 5 to 6 minutes. A third heating mechanism and a cooling mechanism are provided on the third supporting platform. The third heating mechanism is used to heat the wax between the supporting workpiece and the chip within the first 2 to 3 minutes of the pressurization process of the press module, and the cooling mechanism is used to cool the wax between the supporting workpiece and the chip within the last 2 to 3 minutes of the pressurization process of the press module; the cooling mechanism includes a plurality of water tanks arranged inside the third supporting platform and below the third heating mechanism, and a pipeline for water inlet and / or outlet connected to the third supporting platform and communicated with the plurality of water tanks.

2. The patch device according to claim 1, characterized in that: The multiple water tanks are connected to each other.

3. The patch device according to claim 1, characterized in that: The press module comprises a plurality of press heads and a plurality of cylinders corresponding to the plurality of press heads one by one, and the plurality of press heads correspond to the plurality of wafers on the supporting workpiece one by one.

4. The patch device according to claim 3, characterized in that: The pressure head includes a metal body and silica gel arranged below the body for contacting the wafer.

5. The patch device according to claim 1, characterized in that: The first wafer picking mechanism includes a flip arm, a fifth driving mechanism for driving the flip arm to move between the wax-spinning device and the second supporting platform, a sixth driving mechanism for driving the flip arm to flip, and a first picking unit arranged at the free end of the flip arm to pick up the wafer.

6. The patch device according to claim 5, characterized in that: The chip placement device also includes a second chip taking mechanism, which is used to take out the chip after waxing off from the wax-spinning device and transfer the chip to a position corresponding to the first pickup unit.

7. The patch device according to claim 6, characterized in that: The patch equipment includes two pre-patterning devices and two pressing devices, the second patch picking mechanism includes a guide rail and a second picking unit that reciprocates along the guide rail, the two pre-patterning devices are distributed on both sides of the guide rail along the long axis direction of the guide rail, and the two pressing devices correspond to the two pre-patterning devices one by one.

8. The patch device according to claim 1, characterized in that: The material of the wafer is sapphire, gallium arsenide or silicon carbide.

9. The patch device according to claim 1, characterized in that: The material of the bearing workpiece is ceramic.

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