Semiconductor test sorting machine

Abstract

The present invention discloses a semiconductor test sorting machine, which comprises a first workbench, a second workbench, a loading mechanism, an unloading mechanism, a circulating transfer mechanism and a testing mechanism; the loading mechanism and the unloading mechanism are respectively arranged on both sides of the first workbench, and the testing mechanism is arranged on the second workbench; the circulating transfer mechanism comprises a circulating transfer conveying line and a plurality of turnover disks arranged on the circulating transfer conveying line, one end of the circulating transfer conveying line is connected to the first workbench, and the other end is connected to the second workbench, and the circulating transfer conveying line is used to drive the plurality of turnover disks thereon to circulate between the first workbench and the second workbench in a progressive movement manner; the semiconductor test sorting machine with the above structure realizes the full automatic operation of chip testing work through the setting of multiple stations such as loading, circulating conveying, testing, unloading and sorting, effectively improves the testing efficiency, and is easy to use.

Description

Technical Field

[0001] The present invention relates to the technical field of chip testing equipment, and in particular to a fully automatic semiconductor testing and sorting machine. Background Art

[0002] Chips, that is, large-scale integrated circuits, are used in various circuit structures to simplify the scale of circuits. As a precision electronic device, after the chip is processed, it needs to go through a strict testing process before it can be officially launched into the market. Although there are many kinds of automated testing equipment for testing the performance of chips, most of the current testing equipment focuses on the application of terminal testers. In fact, little attention is paid to the intermediate processes of loading and unloading. This requires workers to move the trays to the terminal tester and remove the trays after the test is completed. The entire testing process requires someone to be on duty to cooperate with the work of the terminal tester. Therefore, the current chip testing equipment can only be regarded as semi-automatic equipment. The lack of innovation in the coordination mechanism between the multiple stations in the chip testing process from loading to transportation, testing, and unloading has seriously affected the efficiency of chip testing. Summary of the invention

[0003] The purpose of the present invention is to provide a semiconductor test sorting machine to solve the deficiencies of the above-mentioned technical problems, which effectively connects the working mechanisms of multiple workstations from loading to unloading and classified storage during the chip testing process to realize fully automated operation of chip testing and analysis work.

[0004] In order to achieve the above-mentioned object, the present invention discloses a semiconductor test sorting machine, which comprises a first workbench, a second workbench, a loading mechanism, a unloading mechanism, a circulating transport mechanism and a testing mechanism;

[0005] The loading mechanism and the unloading mechanism are respectively arranged on two sides of the first workbench, and the testing mechanism is arranged on the second workbench;

[0006] The circular transfer mechanism includes a circular transfer conveyor line and a plurality of turnover plates arranged on the circular transfer conveyor line, one end of the circular transfer conveyor line is connected to the first workbench, and the other end is connected to the second workbench, and the circular transfer conveyor line is used to drive the plurality of turnover plates thereon to circulate between the first workbench and the second workbench in a progressive movement manner;

[0007] The loading mechanism is used to transfer the chips to be tested to the rotating tray, and the unloading mechanism is used to transfer the chips after testing from the rotating tray to different trays according to the test results; the testing mechanism is used to test the chips transported by the circulating transport mechanism.

[0008] Compared with the prior art, the semiconductor test sorting machine of the present invention is provided with a loading mechanism, an unloading mechanism and a circulating transfer mechanism that cooperate with the testing mechanism, and the loading mechanism, the unloading mechanism and the testing mechanism are respectively arranged on a first workbench and a second workbench separated from each other, and are connected by a circulating transfer mechanism. When the test work is carried out, on the first workbench, the chip to be tested is moved and placed on the turntable on the circulating transfer conveyor line by the loading mechanism, and then the turntable is conveyed to the testing mechanism on the second workbench in a progressive movement manner by the circulating transfer conveyor line. After the test is completed, the testing mechanism automatically moves the tested chip to the turntable on the circulating transfer conveyor line, and then the turntable is conveyed to the unloading mechanism at the first workbench by the circulating transfer conveyor line, and the tested chip in the turntable is placed in different material trays according to the test results by the unloading mechanism to complete the unloading and sorting of the chip. It can be seen that the semiconductor test sorting machine with the above structure realizes the full automatic operation of chip testing work through the setting of multiple stations such as loading, circulating conveying, testing, unloading and sorting, effectively improves the test efficiency, and is easy to use.

[0009] Preferably, the loading mechanism includes a plurality of first positioning grooves and a loading manipulator arranged on the first workbench and located on one side of the circular transfer conveyor line, and the unloading mechanism includes a plurality of second positioning grooves and an unloading manipulator arranged on the first workbench and located on the other side of the circular transfer conveyor line;

[0010] The first positioning groove is used to place a tray containing chips to be tested, and the loading robot is used to move the chips in the tray located in the first positioning groove to the turnover tray located on the circulating transfer conveyor line and will move to the second workbench; the second positioning groove is used to place an empty tray, and the unloading robot is used to move the chips in the turnover tray returned from the second workbench on the circulating transfer conveyor line to the empty tray in the second positioning groove.

[0011] Preferably, the testing mechanism includes at least one testing machine and a testing robot, wherein the testing robot is used to move the chips to be tested in the turntable to the testing machine and to move the tested chips in the testing machine to the turntable.

[0012] Preferably, the loading mechanism also includes a plurality of loading bins, a loading turnover robot and a plurality of loading lifting platforms respectively opposite to each of the first positioning grooves, and the unloading mechanism also includes a plurality of unloading bins, a unloading turnover robot and a plurality of unloading lifting platforms respectively opposite to each of the second positioning grooves, which are arranged below the first workbench; the loading bin and the unloading bin are both used to accommodate multiple material trays in a stacked manner, the loading turnover robot is used to transfer the material tray in any of the loading bins to the loading lifting platform, and the unloading turnover robot is used to transfer the material tray on the unloading lifting platform to any of the unloading bins; the loading lifting platform is used to lift the material tray into the first positioning groove by moving up and down, and the unloading lifting platform is used to transfer the material tray in the second positioning groove to below the second positioning groove by moving up and down for grabbing by the unloading turnover robot.

[0013] Preferably, the upper material bin and the lower material bin each include a base, a pedestal and a plurality of baffle rods, the plurality of baffle rods are vertically arranged at different positions on the base, and a accommodating space for accommodating the material tray is positioned between the plurality of baffle rods; the base is slidably connected to the pedestal via a pull-out structure so that the base can move in and out from under the first workbench.

[0014] Preferably, the loading and unloading turnover robot and the unloading turnover robot both include a base plate adapted to the material tray, a rotating shaft is respectively provided at the four corners of the base plate, at least one hook is provided on the rotating shaft, and the hook is used to hook the edge of the material tray. A connecting rod driving mechanism connected to the rotating shaft is also provided on the base plate, and the connecting rod driving mechanism is used to drive the four rotating shafts to rotate synchronously to hook or release the material tray.

[0015] Preferably, the circulating transfer conveyor line includes a feeding line, a return line, a front turnover mechanism and a rear turnover mechanism arranged in parallel; the feeding line is used to transfer the turnover tray from the first workbench to the second workbench, and the return line is used to transfer the turnover tray from the second workbench to the first workbench; the front turnover mechanism is arranged at one end of the feeding line and the return line close to the first workbench, and the rear turnover mechanism is arranged at one end of the feeding line and the return line close to the second workbench; the front turnover mechanism includes a first turnover platform connected to the feeding line and the return line, and a side push mechanism and a front push mechanism are arranged on the first turnover platform, and the side push mechanism is used to transfer the turnover tray to the first workbench The turnover platform is pushed from the position corresponding to the return line to the position corresponding to the feeding line, and the forward pushing mechanism is used to push the turnover plate from the first turnover platform to the feeding line; the rear turnover mechanism includes a lifting platform, a rotating table, a translation mechanism and a second turnover platform, the lifting platform is installed on the translation mechanism, the rotating table is installed on the lifting platform, the second turnover platform is connected to the rotating table, the translation mechanism is used to drive the lifting platform to move between the feeding line and the return line, so that the first turnover platform is connected to the feeding line or the return line, the rotating table is used to drive the second turnover platform to rotate in a horizontal plane, and the lifting platform is used to drive the second turnover platform to move up and down.

[0016] Preferably, the feeding line and the return line each include a guide rail group and a propulsion mechanism installed under the guide rail group, the guide rail group extends from the first workbench to the second workbench, and the turnover plate can slide back and forth on the guide rail group; the propulsion mechanism includes a push rod, a slide rail, a rotation driver and a displacement driver; a plurality of support rods extending in the same direction are arranged at intervals on the push rod, and the distance between the two support rods is equivalent to the length of the turnover plate; the push rod is slidably connected to the slide rail, the displacement driver is used to drive the push rod to slide back and forth along the slide rail, and the rotation driver is used to drive the push rod to rotate on the slide rail with the long axis of the push rod as the rotation axis, so that the support rod extends out or disengages from between the two turnover plates.

[0017] Preferably, a pre-treatment box is provided on the feeding line, and the pre-treatment box is used to heat or freeze the chips in the turntable passing through the feeding line.

[0018] Preferably, the test machine includes a support table, a receiving cavity for receiving the chip to be tested is provided on the support table, a cover plate is provided above the receiving cavity, the cover plate can slide horizontally above the receiving cavity to open or close the receiving cavity, a heating block is provided on the bottom wall of the cover plate, a lifting drive for driving the heating block to move up and down is provided on the bottom wall of the cover plate, and the heating block is used to abut against the chip to be tested at a set test temperature. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the planar structure of a semiconductor test sorting machine according to an embodiment of the present invention.

[0020] Figure 2 It is a schematic diagram of the three-dimensional structure of a chip testing and sorting machine according to an embodiment of the present invention.

[0021] Figure 3 It is a schematic diagram of the three-dimensional structure of a chip testing and sorting machine in an embodiment of the present invention, in which the robot arm has been removed.

[0022] Figure 4 Schematic diagram of the turnover mechanism for loading and unloading materials in an embodiment of the present invention.

[0023] Figure 5 It is a schematic diagram of the three-dimensional structure of the upper silo and the lower silo in the embodiment of the invention.

[0024] Figure 6 It is a schematic diagram of the three-dimensional structure of the loading turnover robot and the unloading turnover robot in the embodiment of the present invention.

[0025] Figure 7 for Figure 6 Schematic diagram of the three-dimensional structure of the central rotating shaft.

[0026] Figure 8 It is a schematic diagram of the installation structure of the circulating transfer conveyor line in an embodiment of the present invention.

[0027] Fig. 9 For installation in Figure 8 Schematic diagram of the three-dimensional structure of the front turnover mechanism.

[0028] Fig.10 For installation in Figure 8 Schematic diagram of the three-dimensional structure of the rear turnover mechanism.

[0029] Fig.11 For installation in Figure 8 Schematic diagram of the three-dimensional structure of the propulsion mechanism in the feeding line.

[0030] Fig.12 For installation in Figure 8 Schematic diagram of the three-dimensional structure of the propulsion mechanism in the return line.

[0031] Fig.13 Schematic diagram of the installation structure of the suction head in an embodiment of the present invention.

[0032] Fig.14 It is a schematic diagram of the three-dimensional structure of the testing machine in the embodiment of the present invention.

[0033] Fig.15 for Fig.14 Schematic diagram of the decomposition. DETAILED DESCRIPTION

[0034] In order to explain the technical content, structural features, achieved objectives and effects of the present invention in detail, the following is a detailed description in conjunction with the implementation methods and the accompanying drawings.

[0035] The present invention discloses a semiconductor test sorting machine, which is used to test the manufactured chips. The present invention only focuses on the process coordination between multiple stations during the chip testing process, and does not describe the testing principle itself in detail. Figures 1 to 3 As shown, the semiconductor testing and sorting machine in this embodiment includes a first workbench 1 , a second workbench 2 , a loading mechanism 10 , an unloading mechanism 11 , a circulating transport mechanism 3 and a testing mechanism 20 .

[0036] The first workbench 1 is located at the front station, the second workbench 2 is located at the rear station, the loading mechanism 10 and the unloading mechanism 11 are respectively arranged on both sides of the first workbench 1, and the testing mechanism 20 is arranged on the second workbench 2. The circular transfer mechanism 3 includes a circular transfer conveyor line 30 and a plurality of turnover plates 31 arranged on the circular transfer conveyor line 30, one end of the circular transfer conveyor line 30 is connected to the first workbench 1, and the other end is connected to the second workbench 2. The circular transfer conveyor line 30 is used to drive the plurality of turnover plates 31 thereon to circulate between the first workbench 1 and the second workbench 2 in a progressive movement manner, so as to transport the chip to be tested from the loading mechanism 10 to the testing mechanism 20, and then transport the tested chip from the testing mechanism 20 to the unloading mechanism 11. The loading mechanism 10 is used to transfer the chips to be tested to the rotating disk 31, and the unloading mechanism 11 is used to transfer the chips after the test from the rotating disk 31 to different material trays 4 according to the test results. In this embodiment, the loading mechanism 10 and the unloading mechanism 11 are respectively located on opposite sides of the circular transfer conveyor line 30 to facilitate loading and unloading. The testing mechanism 20 is used to test the chips conveyed by the circular transfer mechanism 3. It can be seen that the semiconductor test sorting machine with the above structure realizes the full automatic operation of chip testing through the setting of multiple stations such as loading, circular conveying, testing, unloading and sorting, effectively improves the test efficiency, and is easy to use.

[0037] like Figure 2 and Figure 3As shown, the loading mechanism 10 includes a plurality of first positioning grooves 100 and a loading robot 101 arranged on the first workbench 1 and located on one side of the circular transfer conveyor line 30, and the unloading mechanism 11 includes a plurality of second positioning grooves 110 and a unloading robot 111 arranged on the first workbench 1 and located on the other side of the circular transfer conveyor line 30.

[0038] The first positioning groove 100 is used to place the tray 4 with the chips to be tested, and the loading robot 101 is used to move the chips in the tray 4 in the first positioning groove 100 to the turnover plate 31 on the circular transfer conveyor line 30 that will move to the second workbench 2. The second positioning groove 110 is used to place the empty tray 4, and the unloading robot 111 is used to move the chips in the turnover plate 31 sent back from the second workbench 2 on the circular transfer conveyor line 30 to the empty tray 4 in the second positioning groove 110. During operation, the loading robot 101 takes materials from the material tray 4 in the two first positioning grooves 100 adjacent to the circulating transfer conveyor line 30, and the unloading robot 111 temporarily moves all the chips in the turntable 31 to the material tray 4 in the two second positioning grooves 110 adjacent to the circulating transfer conveyor line 30. Therefore, for the convenience of description, the two first positioning grooves 100 adjacent to the circulating transfer conveyor line 30 are defined as loading positions, and the two second positioning grooves 110 adjacent to the circulating transfer conveyor line 30 are defined as unloading positions.

[0039] like Figure 2 and Fig.13 The loading robot 101 and the unloading robot 111 in the above embodiment have the same mechanical structure, and both of them adsorb the chip by setting a row of several suction heads 5. The loading robot 101 and the unloading robot 111 share a gantry frame assumed to be above the first workbench 1. It should also be noted that due to the different spacing between the holes in the material tray 4 and the turnover plate 31 (each hole is used to place a chip), the loading robot 101 and the unloading robot 111 are both provided with a variable distance structure, which is used to change the distance between the suction heads 5 on the loading robot 101 and the unloading robot 111. For example, when the loading robot 101 wants to suck the chip from the material tray 4, the distance between the suction heads 5 is changed to correspond to the spacing of the holes in the material tray 4 through the variable diameter structure. When the loading robot 101 wants to suck the chip from the turnover plate 31, the distance between the suction heads 5 is changed to correspond to the spacing of the holes in the turnover plate 31 through the variable distance structure. The specific composition of the variable pitch structure is common knowledge in the art and will not be described in detail here.

[0040] In the present embodiment, there are two first positioning slots 100 (not limited to times), and there are ten second positioning slots 110 (not limited to times). Before the test work starts, the two first positioning slots 100 are each placed with a tray 4 full of chips to be tested, and the ten second positioning slots 110 are each placed with an empty tray 4, wherein two of the ten second positioning slots 110 can be used for unloading positions, and the rest are used for sorting positions, which can be divided into primary chip positions, secondary chip positions, tertiary chip positions, etc. according to the test results, and an NG position can also be set. When the turnover plate 31 is transported to the second workbench 2 by the circulating transfer conveyor line 30, all the chips are first placed in the empty tray 4 in the unloading position in order by the unloading robot 111. After the turnover plate 31 is removed, the chips with different test performances are placed in the empty trays 4 at different positions in order according to the test results by the unloading robot 111, so as to facilitate classified storage. In addition, if Figure 3 Since the spacing between the holes in the material tray 4 and the turnover tray 31 is different, in order to facilitate the rapid unloading of the unloading robot 111 and to cooperate with the rapid operation of the testing mechanism 20, a turntable 6 can be set on the second workbench 2 near the unloading position. The spacing of the holes in the turntable 6 is the same as that of the turnover tray 31. The unloading robot 111 can first quickly place the chips on the turnover tray 31 into the turntable 6, and no distance change is required during each transfer process. When the turnover tray 31 is unloaded, the unloading robot 111 will classify different chips from the turntable 6 and place them in empty material trays 4 at different positions.

[0041] Preferably, if Figure 2 The testing mechanism 20 includes at least one testing machine 200 and a testing manipulator 201. The testing manipulator 201 is used to move the chips to be tested in the rotating tray 31 to the testing machine 200 and to move the tested chips in the testing machine 200 to the rotating tray 31. In this embodiment, six groups of testing machines 200 are placed on both sides of the circulating conveyor 30. The six groups of testing machines 200 can work simultaneously to improve the testing efficiency.

[0042] For further information, please refer to Figure 3 and Figure 4, the loading mechanism 10 also includes a plurality of loading bins 102, a loading turnover manipulator 103, and a plurality of loading lifting platforms 104 respectively opposite to each first positioning groove 100, which are arranged below the first workbench 1. The unloading mechanism 11 also includes a plurality of unloading bins 112, an unloading turnover manipulator 113, and a plurality of unloading lifting platforms 114 respectively opposite to each second positioning groove 110, which are arranged below the first workbench 1. In this embodiment, the loading bin 102 is located on the same side of the first workbench 1 as the first positioning groove 100, and the unloading bin 112 is located on the same side of the first workbench 1 as the second positioning groove 110. Both the loading bin 102 and the unloading bin 112 are used to accommodate multiple material trays 4 in a stacked manner. The loading turnover manipulator 103 is used to transfer the material trays 4 in any loading bin 102 to the loading lifting platform 104, and the unloading turnover manipulator 113 is used to transfer the material trays 4 on the unloading lifting platform 114 to any unloading bin 112. The loading lifting platform 104 is used to lift the material tray 4 into the first positioning groove 100 by moving up and down, and the unloading lifting platform 114 is used to transfer the material tray 4 in the second positioning groove 110 to the bottom of the second positioning groove 110 by moving up and down for grabbing by the unloading turnover robot 113.

[0043] In the above embodiment, two loading lifting platforms 104 are provided, which are respectively arranged directly below the first positioning grooves 100 corresponding to the two loading positions. The loading turnover manipulator 103 moves the material trays 4 in each loading bin 102 below the loading lifting platform 104 to the loading lifting platform 104 through up and down and left and right translation movements, and then lifts the material trays 4 to the loading position for the loading manipulator 101 to grab, so that batches of material trays 4 filled with chips can be placed in each loading bin 102 to realize batch automated testing. In addition, the unloading lifting platform 114 is arranged below each second positioning groove 110 outside the unloading position. When the material tray 4 is loaded with chips, the material tray 4 is moved to the bottom of the second workbench 2 through the unloading lifting platform 114, and then the material tray 4 is transferred to each unloading bin 112 through the unloading turnover manipulator 113 to realize batch unloading.

[0044] like Figure 5As shown, the upper bin 102 and the lower bin 112 each include a base 120, a pedestal 121 and a plurality of baffles 122, the plurality of baffles 122 being vertically arranged at different positions on the base 120, and a receiving space 123 for receiving the material tray 4 being positioned between the plurality of baffles 122. The base 120 is slidably connected to the base 121 through a pull-out structure (drawer type), so that the base 120 can move in and out from under the first workbench 1, which is convenient for loading. In addition, in order to facilitate the fixing of the base 120, a limiting hole 124 is provided on the base 121 that cooperates with the base 120, and a limiting column (not shown) and a rotating handle 125 connected to the limiting column are provided on the base 120, and the limiting column can be rotated by rotating the handle 125, so that the limiting column and the limiting hole 124 are locked or released.

[0045] like Figure 6 As shown, both the loading and unloading turnover manipulator 103 and the unloading and unloading turnover manipulator 113 include a base plate 130 adapted to the material tray 4, and a rotating shaft 131 is respectively provided at the four corners of the base plate 130, and at least one hooking portion 132 is provided on the rotating shaft 131, and the hooking portion 132 is used to hook the edge of the material tray 4. The base plate 130 is also provided with a connecting rod driving mechanism 133 connected to the rotating shaft 131, and the connecting rod driving mechanism 133 is used to drive the four rotating shafts 131 to rotate synchronously to hook or release the material tray 4. In this embodiment, please refer to Figure 7 Each rotating shaft 131 is provided with an upper and lower hooking portion 132, the hooking directions of the two hooking portions 132 are opposite, and the distance between the two hooking portions 132 is the thickness of a material tray 4, so that the loading turnover robot 103 and the unloading turnover robot 113 can grab two material trays 4 at a time. The specific working principle is: when the substrate 130 is located directly above the current material tray 4 and is attached to the material tray 4, the connecting rod driving mechanism 133 drives the rotating shaft 131 to rotate. When the upper hooking portion 132 is rotated 90° (clockwise) to rotate to the bottom of the upper material tray 4, one material tray 4 can be taken out. When the lower hooking portion 132 is rotated 90° (counterclockwise) to rotate to the bottom of the second layer of material tray 4, two material trays 4 can be taken out at one time.

[0046] Furthermore, if Figure 8 As shown, the circulating transfer conveyor line 30 includes a feeding line 300, a return line 301, a front turnover mechanism 302 and a rear turnover mechanism 303 arranged in parallel.

[0047] The feeding line 300 is used to transfer the turnover plate 31 from the first workbench 1 to the second workbench 2, and the return line 301 is used to transfer the turnover plate 31 from the second workbench 2 to the first workbench 1. The front turnover mechanism 302 is arranged at one end of the feeding line 300 and the return line 301 close to the first workbench 1, and the rear turnover mechanism 303 is arranged at one end of the feeding line 300 and the return line 301 close to the second workbench 2.

[0048] Please refer to Figure 8 and Fig. 9 , the front turnover mechanism 302 includes a first turnover platform 3020 connected to the feeding line 300 and the return line 301, and a side push mechanism 3021 and a front push mechanism 3022 are provided on the first turnover platform 3020. The side push mechanism 3021 is used to push the turnover plate 31 on the first turnover platform 3020 from the position corresponding to the return line 301 to the position corresponding to the feeding line 300, and the front push mechanism 3022 is used to push the turnover plate 31 from the first turnover platform 3020 to the feeding line 300. When the material tray 4 is transported to the position corresponding to the return line 301 on the first turnover platform 3020, first, the side push mechanism 3021 is actuated to push the current material tray 4 to the position corresponding to the feeding line 300, and then the front push mechanism 3022 is actuated to push the current material tray 4 to the feeding line 300, and then participate in the cycle again.

[0049] Please refer to Figure 8 and Fig.10 , the rear turnover mechanism 303 includes a lifting platform 3030, a rotating platform 3031, a translation mechanism 3032 and a second turnover platform 3033. The lifting platform 3030 is installed on the translation mechanism 3032, the rotating platform 3031 is installed on the lifting platform 3030, the second turnover platform 3033 is connected to the rotating platform 3031, the translation mechanism 3032 is used to drive the lifting platform 3030 to move between the feeding line 300 and the return line 301, so that the first turnover platform 3020 is docked with the feeding line 300 or the return line 301, the rotating platform 3031 is used to drive the second turnover platform 3033 to rotate in a horizontal plane, and the lifting platform 3030 is used to drive the second turnover platform to move up and down. When the material tray 4 is transported by the feeding line 300 to the test machine 200 at its end position, first, the translation mechanism 3032 is actuated to make the second turnover platform 3033 face the feeding line 300, and then the lifting platform 3030 moves up and down to make the working surface of the second turnover platform 3033 flush with the feeding line 300, so that the current turnover plate 31 is transported to the second turnover platform 3033, and then the lifting platform 3030 rises to make the turnover plate 31 flush with the test machine 200, and then the rotating table 3031 rotates to adjust the direction of the current turnover plate 31 to match the test The work of the manipulator 201 is tested. After the manipulator 201 has finished picking up the material, the translation mechanism 3032 is activated again, so that the second turnover platform 3033 is translated to be aligned with the return material line 301, and then the rotating table 3031 and the lifting table 3030 are activated again, so that the height of the second turnover platform 3033 is flush with the return material line 301. At this time, the turnover disk 31 on the second turnover platform 3033 can be moved to the return material line 301 by a separately arranged pushing mechanism or the driving mechanism of the return material line 301, and the turnover disk 31 is moved to the unloading mechanism 11 through the return material line 301.

[0050] Furthermore, if Figure 8 , Fig.11 and Fig.12 The feeding line 300 and the return line 301 both include a guide rail group 40 and a propulsion mechanism 41 installed below the guide rail group 40. The guide rail group 40 extends from the first workbench 1 to the second workbench 2, and the turnover plate 31 can slide forward and backward on the guide rail group 40. The propulsion mechanism 41 includes a push rod 410, a slide rail 411, a rotation driver 412 and a displacement driver 413. A plurality of support rods 414 extending in the same direction are arranged on the push rod 410 at intervals, and the distance between the two support rods 414 is equivalent to the length of the turnover plate 31. The push rod 410 is slidably connected to the slide rail 411, the displacement driver 413 is used to drive the push rod 410 to slide forward and backward along the slide rail 411, and the rotation driver 412 is used to drive the push rod 410 to rotate on the slide rail 411 with the long axis of the push rod 410 as the rotation axis, so that the support rod 414 extends out or detaches between the two rotation plates 31. When the turntable 31 is to be pushed forward one position, the push rod 410 is first rotated by the rotary driver 412, so that the support rod 414 on the push rod 410 changes from a vertical state to a horizontal state, thereby disengaging from between the two turntables 31, and then the push rod 410 is driven to move backward one position by the displacement driver 413. Next, the rotary driver 412 rotates in the opposite direction, so that the support rod 414 on the push rod 410 changes from horizontal to vertical and is re-positioned between the two turntables 31. Then the displacement driver 413 reverses and moves the push rod 410 forward. At this time, each support rod 414 on the push rod 410 pushes the adjacent turntable 31 forward, and the action process of moving the turntable 31 backward is similar to this and will not be repeated here. It should also be noted that in this embodiment, the rotary driver 412 in the propulsion mechanism 41 on the feeding line 300 is installed at the end of the push rod 410 (such as Fig.11 ), since the propulsion mechanism 41 installed on the return line 301 is also used to push the turntable 31 on the second turntable 3033 back to the feeding line 300, the rotary driver 412 in the propulsion mechanism 41 installed on the return line 301 is located in the middle of the push rod 410 (such as Fig.12 ) is convenient for setting a support rod 414 on one end of the push rod 410 close to the second workbench 2. When the second turnover platform 3033 is docked with the return line 301, the turnover plate 31 on the second turnover platform 3033 is pushed into the guide rail group 40 on the return line 301 through a cycle of movement of the push rod 410.

[0051] Further, please refer again to Figure 1 and Figure 8In order to better test the high temperature or low temperature resistance of the chip, a pre-treatment box 304 is provided on the feeding line 300, and the pre-treatment box 304 is used to heat or freeze the chips in the turntable 31 passing through the feeding line 300. In this embodiment, by setting the pre-treatment box 304, the chip can be pre-heated or frozen before being sent to the test machine 200, which can not only better test the high temperature or low temperature resistance of the chip, but also reduce the test time of the test machine 200, and effectively improve the test efficiency.

[0052] Preferably, if Fig.14 and Fig.15 The test machine 200 includes a support platform 2000, on which a receiving cavity 2001 for receiving a chip to be tested is disposed, and above the receiving cavity 2001 is a cover plate 2002, which can slide horizontally above the receiving cavity 2001 to open or close the receiving cavity 2001, and a heating block 2003 is disposed on the bottom wall of the cover plate 2002, and a lifting driver 2004 for driving the heating block 2003 to move up and down is disposed on the bottom wall of the cover plate 2002, and the heating block 2003 is used to abut against the chip to be tested at a set test temperature.

[0053] In another preferred embodiment of the semiconductor test sorting machine of the present invention, Figure 2 and Figure 3 On one side of the first workbench 1 near the first positioning groove 100, there are also provided an open-short circuit test machine 140, an open-short circuit handling robot 141, a secondary interactive positioning platform 142 and a plurality of third positioning grooves 143. The open-short circuit test machine 140 is used to perform an open-short circuit test on the chip. The secondary interactive positioning platform 142 is used to move the chip between the loading position and the open-short circuit test machine 140 in a turnover interactive manner. The open-short circuit handling robot 141 is used to move the chip into or out of the secondary interactive positioning platform 142. The third positioning groove 143 is used to place the NG material tray 4 that does not meet the open-short circuit test results. In this embodiment, Figure 3 The secondary interactive positioning platform 142 includes a mounting groove 1420 opened on the first workbench 1, and two movable exchange platforms 1421 are arranged in the mounting groove 1420. Two rows of acupoints for placing chips are respectively arranged on the two exchange platforms 1421, one row of acupoints is used to place chips to be tested, and the other row of acupoints is used to place chips that have completed the test. The two exchange platforms 1421 can be moved alternately between the loading position and the open and short circuit test machine 140. In order to ensure that the two exchange platforms 1421 do not affect each other during the movement, the position of one of the two exchange platforms 1421 is higher than the other.

[0054] In summary, if Figures 1 to 15The semiconductor test sorting machine disclosed in the present invention is provided with a loading position, a unloading position, a turnover position and an open-short circuit test position on the first workbench 1, a test position and a turnover position are provided on the second workbench 2, and a circular moving position is provided between the first workbench 1 and the second workbench 2. Specifically, the process of chip test sorting using the semiconductor test sorting machine is as follows:

[0055] First, several trays 4 loaded with chips to be tested are placed in each upper bin 102, and several empty trays 4 are placed in the lower bin 112; then, the chips in the upper position are subjected to an open-short circuit test by means of the open-short circuit test machine 140, the open-short circuit handling robot 141 and the secondary interactive positioning platform 142 (this step can be skipped). After the open-short circuit test is completed, the chips that pass the test are placed back in the tray 4 of the upper position, and the chips that fail the test are placed in the NG tray 4; then, the loading robot 101 is used to place the chips in the upper position. The chips in the tray 4 in the loading position are moved into the turntable 31 in the feeding line 300, and the turntable 31 is transported by the feeding line 300 to the second workbench 2 and docked with the second turntable 3033. In addition, in the process of transporting the chips through the feeding line 300, the heating switch of the pretreatment box 304 can be turned on to preheat the passing chips; then, the second turntable 3033 is docked with the test machine 200 by lifting and rotating the second turntable 3033, and the test manipulator 201 is used to transfer the chips to the second workbench 2. The chip is moved into the test machine 200. After the test is completed, the chip is moved into the turntable 31 on the second turntable 3033 by the test manipulator 201. Then, the second turntable 3033 is docked with the return line 301 by lifting, rotating and translating the second turntable 3033. Then, the turntable 31 on the second turntable 3033 is moved into the return line 301 by the propulsion mechanism 41 on the return line 301, and the turntable 31 is transported to the first workbench 1 through the return line 301. at the unloading position; then, through the unloading robot 111, the chips that have been tested on the turnover disk 31 are placed into different empty trays 4 according to the test results, or are placed in the middle turntable first, and then moved from the middle turntable to different empty trays 4 after the current turnover disk 31 is moved away; when the tray 4 in the second positioning groove 110 is full, it is collected into the unloading bin 112 by the unloading lifting platform 114 and the unloading turnover robot 113; the above process is repeatedly executed, and the entire testing process does not require manual supervision, and the work efficiency is high.

[0056] The above disclosure is only the preferred embodiment of the present invention, which certainly cannot be used to limit the scope of rights of the present invention. Therefore, equivalent changes made according to the scope of the patent application of the present invention are still within the scope covered by the present invention.

Claims

1. A semiconductor test sorting machine, characterized in that: It includes a first workbench, a second workbench, a loading mechanism, a unloading mechanism, a circulating transport mechanism and a testing mechanism; The loading mechanism and the unloading mechanism are respectively arranged on two sides of the first workbench, and the testing mechanism is arranged on the second workbench; The circular transfer mechanism includes a circular transfer conveyor line and a plurality of turnover plates arranged on the circular transfer conveyor line, one end of the circular transfer conveyor line is connected to the first workbench, and the other end is connected to the second workbench, and the circular transfer conveyor line is used to drive the plurality of turnover plates thereon to circulate between the first workbench and the second workbench in a progressive movement manner; The loading mechanism is used to transfer the chip to be tested to the turnover tray, and the unloading mechanism is used to transfer the chips after the test from the turnover tray to different trays according to the test results; the testing mechanism is used to test the chips conveyed by the circulating transfer mechanism; the circulating transfer conveyor line includes a feeding line, a return line, a front turnover mechanism and a rear turnover mechanism arranged in parallel; the feeding line is used to transfer the turnover tray from the first workbench to the second workbench, and the return line is used to transfer the turnover tray from the second workbench to the first workbench; the front turnover mechanism is arranged at one end of the feeding line and the return line close to the first workbench, and the rear turnover mechanism is arranged at one end of the feeding line and the return line close to the second workbench; the front turnover mechanism includes a first turnover mechanism connected to the feeding line and the return line The platform is provided with a side push mechanism and a front push mechanism on the first turnover platform, the side push mechanism is used to push the turnover plate on the first turnover platform from the position corresponding to the return material line to the position corresponding to the feeding line, and the front push mechanism is used to push the turnover plate from the first turnover platform to the feeding line; the rear turnover mechanism includes a lifting platform, a rotating platform, a translation mechanism and a second turnover platform, the lifting platform is installed on the translation mechanism, the rotating platform is installed on the lifting platform, the second turnover platform is connected to the rotating platform, the translation mechanism is used to drive the lifting platform to move between the feeding line and the return material line, so that the first turnover platform is connected to the feeding line or the return material line, the rotating platform is used to drive the second turnover platform to rotate in a horizontal plane, and the lifting platform is used to drive the second turnover platform to move up and down; The feeding line and the return line both include a guide rail group and a propulsion mechanism installed under the guide rail group, the guide rail group extends from the first workbench to the second workbench, and the turnover plate can slide back and forth on the guide rail group; the propulsion mechanism includes a push rod, a slide rail, a rotation driver and a displacement driver; a plurality of support rods extending in the same direction are arranged at intervals on the push rod, and the distance between the two support rods is equivalent to the length of the turnover plate; the push rod is slidably connected to the slide rail, the displacement driver is used to drive the push rod to slide back and forth along the slide rail, and the rotation driver is used to drive the push rod to rotate on the slide rail with the long axis of the push rod as the rotation axis, so that the support rod extends out or disengages from between the two turnover plates.

2. The semiconductor test sorting machine according to claim 1, characterized in that: The loading mechanism includes a plurality of first positioning grooves and a loading manipulator arranged on the first workbench and located on one side of the circular transfer conveyor line, and the unloading mechanism includes a plurality of second positioning grooves and an unloading manipulator arranged on the first workbench and located on the other side of the circular transfer conveyor line; The first positioning groove is used to place a tray containing chips to be tested, and the loading robot is used to move the chips in the tray located in the first positioning groove to the turnover tray located on the circulating transfer conveyor line and will move to the second workbench; the second positioning groove is used to place an empty tray, and the unloading robot is used to move the chips in the turnover tray returned from the second workbench on the circulating transfer conveyor line to the empty tray in the second positioning groove.

3. The semiconductor test sorting machine according to claim 1, characterized in that: The testing mechanism includes at least one testing machine and a testing robot, wherein the testing robot is used to move the chips to be tested in the turntable to the testing machine and to move the chips that have been tested in the testing machine to the turntable.

4. The semiconductor test sorting machine according to claim 2, characterized in that: The loading mechanism further includes a plurality of loading bins, a loading turnover manipulator, and a plurality of loading lifting platforms respectively opposite to each of the first positioning grooves, and the unloading mechanism further includes a plurality of unloading bins, a unloading turnover manipulator, and a plurality of unloading lifting platforms respectively opposite to each of the second positioning grooves, which are arranged below the first workbench; The upper material bin and the lower material bin are both used to accommodate multiple material trays in a stacked manner, the upper material turnover manipulator is used to transfer the material trays in any of the upper material bins to the upper material lifting platform, and the lower material turnover manipulator is used to transfer the material trays on the lower material lifting platform to any of the lower material bins; The loading lifting platform is used to lift the material tray into the first positioning groove by moving up and down, and the unloading lifting platform is used to transfer the material tray in the second positioning groove to the bottom of the second positioning groove by moving up and down for grabbing by the unloading turnover robot.

5. The semiconductor test sorting machine according to claim 4, characterized in that: The upper material bin and the lower material bin each include a base, a pedestal and a plurality of baffle bars, wherein the baffle bars are vertically arranged at different positions on the base, and a accommodating space for accommodating a material tray is positioned between the baffle bars; the base is slidably connected to the pedestal via a pull-out structure so that the base can move in and out from under the first workbench.

6. The semiconductor test sorting machine according to claim 4, characterized in that: The loading and unloading turnover robot both include a base plate adapted to the material tray, a rotating shaft is respectively provided at the four corners of the base plate, at least one hook is provided on the rotating shaft, the hook is used to hook the edge of the material tray, and a connecting rod driving mechanism connected to the rotating shaft is also provided on the base plate, the connecting rod driving mechanism is used to drive the four rotating shafts to rotate synchronously to hook or release the material tray.

7. The semiconductor test sorting machine according to claim 1, characterized in that: The feeding line is provided with a pre-treatment box, and the pre-treatment box is used to heat or freeze the chips in the turntable passing through the feeding line.

8. The semiconductor test sorting machine according to claim 3, characterized in that: The testing machine includes a supporting platform, a receiving cavity for receiving the chip to be tested is arranged on the supporting platform, a cover plate is arranged above the receiving cavity, the cover plate can slide horizontally above the receiving cavity to open or close the receiving cavity, a heating block is arranged on the bottom wall of the cover plate, a lifting drive for driving the heating block to move up and down is arranged on the bottom wall of the cover plate, and the heating block is used to abut against the chip to be tested at a set test temperature.

Images