Display device and electronic device

Abstract

The present disclosure provides a display device and an electronic device, belonging to the field of display technology. The display device includes a display panel, a main circuit board, a bridge circuit board and a first shielding tape. The main circuit board is arranged on the back of the display panel; the bridge circuit board is arranged on the side of the main circuit board away from the display panel and is bound and connected to the main circuit board; the first shielding tape is arranged on the side of the main circuit board away from the display panel and exposes the bridge circuit board. The display device can improve stability.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a display device and an electronic device. Background Art

[0002] The display device generally includes a circuit board electrically connected to the display panel. The circuit board may be a combination of a main circuit board and a bridge circuit board, wherein the bridge circuit board is bound to the main circuit board and is used for electrical connection between different leads on the main circuit board. However, when the shielding tape covers the main circuit board and the bridge circuit board, the shielding tape is easily damaged, causing a short circuit between the bridge circuit board and the shielding tape, thereby reducing the stability of the display device.

[0003] The above information disclosed in the Background section is only for enhancement of understanding of the background of the present disclosure and therefore it may include information that does not constitute the prior art that is already known to one of ordinary skill in the art. Summary of the invention

[0004] The present disclosure aims to provide a display device and an electronic device to improve the stability of the display device.

[0005] In order to achieve the above-mentioned invention object, the present invention adopts the following technical solutions:

[0006] According to a first aspect of the present disclosure, there is provided a display device, comprising:

[0007] Display panel;

[0008] A main circuit board, arranged on the back of the display panel;

[0009] A bridge circuit board is disposed on a side of the main circuit board away from the display panel and is bound and connected to the main circuit board;

[0010] The first shielding tape is arranged on a side of the main circuit board away from the display panel and exposes the bridge circuit board.

[0011] In an exemplary embodiment of the present disclosure, the first shielding tape is provided with a bridging opening, and the bridging circuit board is within the bridging opening.

[0012] In an exemplary embodiment of the present disclosure, a minimum value of a distance between any point on the bridge circuit board and any point on the first shielding tape is equal to 0.3-0.8 mm.

[0013] In an exemplary embodiment of the present disclosure, the main circuit board includes at most two lead layers.

[0014] In an exemplary embodiment of the present disclosure, the bridge circuit board includes at most two lead layers.

[0015] In an exemplary embodiment of the present disclosure, the thickness of the bridge circuit board is equal to 0.8 to 1.2 times the thickness of the first shielding tape.

[0016] In an exemplary embodiment of the present disclosure, the thickness of the bridge circuit board is equal to 0.09-0.14 mm, and the thickness of the first shielding tape is equal to 0.09-0.14 mm.

[0017] In an exemplary embodiment of the present disclosure, the bridge circuit board is provided with a plurality of metallized vias; the display device further includes a second shielding tape, the second shielding tape is provided on a side of the bridge circuit board away from the display panel, and the orthographic projection of the second shielding tape on the bridge circuit board does not overlap with each of the metallized vias.

[0018] In an exemplary embodiment of the present disclosure, the second shielding tape is provided with a plurality of avoidance openings arranged one-to-one corresponding to the plurality of the metallized vias; any one of the metallized vias is located within the orthographic projection of the corresponding avoidance opening on the bridge circuit board.

[0019] In an exemplary embodiment of the present disclosure, a minimum value of a distance between any point of the metallized via and any point of an orthographic projection of the second shielding tape on the bridge circuit board is equal to 0.3-0.8 mm.

[0020] In an exemplary embodiment of the present disclosure, the orthographic projection of the second shielding tape on the bridge circuit board is located inside the bridge circuit board, and the minimum value of the distance between any point on the outer edge of the second shielding tape and any point on the edge of the bridge circuit board is equal to 0 to 0.5 mm.

[0021] In an exemplary embodiment of the present disclosure, the second shielding tape is connected to the first shielding tape as an integrated structure.

[0022] According to a second aspect of the present disclosure, an electronic device is provided, comprising the above-mentioned display device.

[0023] In the display device and electronic device provided by the present disclosure, the first shielding tape exposes the bridge circuit board, so as to avoid the bridge circuit board causing the first shielding tape to be damaged, thereby facilitating the first shielding tape to remain stable, avoiding possible, uncontrolled damage to the first shielding tape causing uncontrollable changes in its shielding performance, and avoiding such uncontrollable changes causing unpredictable changes in the electromagnetic environment in which the main circuit board and the bridge circuit board are located. In addition, since the first shielding tape exposes the bridge circuit board, the risk of short circuit between the bridge circuit board and the first shielding tape is avoided, thereby improving the stability of the bridge circuit board. This generally improves the electrical stability of the display device. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The above and other features and advantages of the present disclosure will become more apparent by describing in detail example embodiments thereof with reference to the attached drawings.

[0025] Figure 1 It is a schematic diagram of the top view structure of a display device according to an embodiment of the present disclosure.

[0026] Figure 2 It is a schematic diagram of the side structure of a display device according to an embodiment of the present disclosure.

[0027] Figure 3 It is a schematic diagram of the side structure of a display device according to an embodiment of the present disclosure.

[0028] Figure 4 It is a schematic diagram of the top view structure of a main circuit board according to an embodiment of the present invention.

[0029] Figure 5 It is a schematic diagram of the top structure of a main circuit board and a bridge circuit board according to an embodiment of the present invention.

[0030] Figure 6 It is a schematic diagram of the top structure of a first shielding tape according to an embodiment of the present disclosure.

[0031] Figure 7 It is a schematic diagram of a partial cross-sectional structure of a first shielding tape, a main circuit board and a bridge circuit board according to an embodiment of the present disclosure.

[0032] Figure 8 It is a partial top view structural schematic diagram of a first shielding tape and a bridge circuit board according to an embodiment of the present disclosure.

[0033] Fig. 9 It is a partial top view structural schematic diagram of a first shielding tape, a second shielding tape and a bridge circuit board according to an embodiment of the present disclosure.

[0034] Fig.10It is a partial cross-sectional structural schematic diagram of a first shielding tape, a second shielding tape, a main circuit board and a bridge circuit board according to an embodiment of the present disclosure.

[0035] Fig.11 It is a partial top view structural schematic diagram of a first shielding tape, a second shielding tape and a bridge circuit board according to an embodiment of the present disclosure.

[0036] The main components in the figure are described as follows:

[0037] 100, display panel; 111, back; 112, light emitting surface; 120, binding pad; 130, flip chip film; 140, driver chip; 200, main circuit board; 210, main bridge area; 211, first main pad distribution area; 212, second main pad distribution area; 220, main bridge pad; 221, first main bridge pad; 222, second main bridge pad; 300, bridge circuit board; 311, first auxiliary pad distribution area; 312, second auxiliary pad Distribution area; 320, auxiliary bridging pad; 321, first auxiliary bridging pad; 322, second auxiliary bridging pad; 330, metallized via; 331, raised structure; 400, first shielding tape; 410, bridging opening; 421, first insulating layer; 422, first conductive material layer; 423, second insulating layer; 500, second shielding tape; 510, avoidance opening; 521, third insulating layer; 522, second conductive material layer; 523, fourth insulating layer. DETAILED DESCRIPTION

[0038] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in a variety of forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that the disclosure will be more comprehensive and complete and the concepts of the example embodiments are fully conveyed to those skilled in the art. The described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, many specific details are provided to provide a full understanding of the embodiments of the present disclosure.

[0039] In the drawings, the thickness of regions and layers may be exaggerated for clarity. The same reference numerals in the drawings denote the same or similar structures, and thus their detailed description will be omitted.

[0040] The described features, structures or characteristics may be combined in one or more embodiments in any suitable manner. In the following description, many specific details are provided to provide a full understanding of the embodiments of the present disclosure. However, those skilled in the art will appreciate that the technical solutions of the present disclosure may be practiced without one or more of the specific details, or other methods, components, materials, etc. may be adopted. In other cases, known structures, materials or operations are not shown or described in detail to avoid blurring the main technical ideas of the present disclosure.

[0041] The terms "comprising" and "provided with" are used to express an open-ended inclusive meaning and mean that there may be additional elements / components / etc. in addition to the listed elements / components / etc. The terms "first" and "second" etc. are used only as labels and are not intended to limit the quantity of their objects.

[0042] The present disclosure provides a display device, such as Figure 1 As shown, the display device includes a display panel 100, a main circuit board 200 (in Figure 1 ), a bridge circuit board 300 and a first shielding tape 400. Figure 2 (the first shielding tape 400 is not shown) and Figure 3 As shown in FIG. 1 (the first shielding tape 400 is not shown), the main circuit board 200 is disposed on the back surface 111 of the display panel 100; the bridge circuit board 300 is disposed on a side of the main circuit board 200 away from the display panel 100 and is bound and connected to the main circuit board 200; Figure 7 As shown, the first shielding tape 400 is disposed on a side of the main circuit board 200 away from the display panel 100 , and exposes the bridge circuit board 300 .

[0043] In the display device provided by the present disclosure, the first shielding tape 400 exposes the bridge circuit board 300, so as to prevent the bridge circuit board 300 from causing damage to the first shielding tape 400, thereby facilitating the first shielding tape 400 to maintain a stable state, and preventing possible, uncontrolled damage to the first shielding tape 400 from causing uncontrollable changes in its shielding performance, and preventing such uncontrollable changes from causing unpredictable changes in the electromagnetic environment in which the main circuit board 200 and the bridge circuit board 300 are located. In addition, since the first shielding tape 400 exposes the bridge circuit board 300, the risk of short circuit between the bridge circuit board 300 and the first shielding tape 400 is avoided, and the stability of the bridge circuit board 300 is improved. This generally improves the electrical stability of the display device.

[0044] The structure, principle and effect of the display device provided by the present disclosure are further explained and illustrated below in conjunction with the accompanying drawings.

[0045] The display device provided in the present disclosure may be a smartphone screen, a computer monitor, a television screen, a smart watch screen or other types of devices for display, and the present disclosure does not impose any special restrictions on this. The display device may include a display panel 100, and the display panel 100 may be an OLED (organic light-emitting device, Organic Light-Emitting Device) display panel, a PLED (macromolecule organic light-emitting device, Polymer Light-Emitting Device) display panel, a Micro LED (micro light-emitting diode, Micro Light Emitting Diode) display panel, a Mini LED (mini light-emitting diode, Mini Light Emitting Diode) display panel, an LCD (liquid crystal display, Liquid Crystal Display) display panel or other types of display panels, and the present disclosure does not impose any specific restrictions on this.

[0046] Optionally, the display panel 100 may also be a touch display panel, so that the display panel 100 has both touch and display functions. Preferably, the display panel 100 may be an in-cell touch display panel, so that the thickness of the display panel 100 may be reduced.

[0047] Optionally, the display panel 100 may be an under-screen fingerprint recognition display panel, so that the display panel 100 has both fingerprint recognition and display functions. Preferably, the display panel 100 may be an in-cell under-screen fingerprint recognition display panel, so that the thickness of the display panel 100 may be reduced.

[0048] Of course, the display panel 100 may also be a display panel 100 integrated with touch and fingerprint recognition functions.

[0049] See also Figure 2 and Figure 3 The display panel 100 has a light emitting surface 112 and a back surface 111 which are arranged opposite to each other; that is, the back surface 111 of the display panel 100 refers to a surface arranged opposite to the light emitting surface 112. The light emitted by the display panel 100 is emitted outward from the light emitting surface 112, that is, the light emitted by the display panel 100 is emitted in a direction away from the back surface 111 of the main circuit board 200.

[0050] In the present disclosure, the thickness of each component, such as the thickness of the display panel 100, the main circuit board 200, the bridge circuit board 300, the first shielding tape 400 or other components, refers to the size of the component in a direction perpendicular to the back surface 111 of the display panel 100. For example, the thickness of the display panel 100 is the size of the display panel 100 in a direction perpendicular to its back surface 111, that is, the distance between the light emitting surface 112 and the backlight surface 111 of the display panel 100. For another example, the thickness of the first shielding tape 400 refers to the size of the first shielding tape 400 in a direction perpendicular to the back surface 111 of the display panel 100, that is, the distance between the surface of the first shielding tape 400 close to the display panel 100 and the surface of the first shielding tape 400 away from the display panel 100. For another example, the thickness of the bridge circuit board 300 refers to the dimension of the bridge circuit board 300 in a direction perpendicular to the back surface 111 of the display panel 100 , that is, the distance between the surface of the bridge circuit board 300 close to the display panel 100 and the surface of the bridge circuit board 300 far from the display panel 100 .

[0051] like Figure 2 and Figure 3 As shown, the display panel 100 may have a binding area, and the binding area is provided with a plurality of binding pads 120 . The binding pads 120 may be directly or indirectly electrically connected to the main circuit board 200 .

[0052] In one embodiment of the present disclosure, Figure 2 As shown, the binding pad 120 of the display panel 100 can be bound and connected to a chip packaging structure, and the main circuit board 200 is bound and connected to the chip packaging structure. In this way, the main circuit board 200 is indirectly electrically connected to the binding pad 120 of the display panel 100 through the chip packaging structure. Preferably, the chip packaging structure can be a chip on film (COF) 130.

[0053] In another embodiment of the present disclosure, Figure 3 As shown, the main circuit board 200 can be directly bonded and connected to the bonding pads 120 of the display panel 100. Preferably, the display panel 100 further includes a chip packaging area, in which a driver chip 140 can be packaged; the driver chip 140 can be electrically connected to at least part of the leads of the display area of ​​the display panel 100, and to part of the bonding pads 120. In this way, the display device can achieve COG (chip on Glass) or COP (chip on panel) packaging.

[0054] like Figure 2 and Figure 3As shown, the main circuit board 200 is disposed on the back surface 111 of the display panel 100, and is used to be directly or indirectly electrically connected to the display panel 100. Optionally, the main circuit board 200 may be a flexible circuit board.

[0055] In one embodiment of the present disclosure, the main circuit board 200 is provided with at most two lead layers, wherein any one lead layer includes a plurality of signal leads. The display panel 100 of the present disclosure avoids using a main circuit board 200 with more than three layers, so as to avoid a substantial increase in the cost and thickness of the main circuit board 200 due to an increase in the number of lead layers of the main circuit board 200, thereby reducing the cost and thickness of the display device.

[0056] Preferably, the main circuit board 200 may be provided with two lead layers. In this way, the cost of the main circuit board 200 can be avoided to be too high, and the signal lead density in each lead layer can be avoided to be too high, and the signal lead density can be avoided to be too high, thereby avoiding the crosstalk between the signal leads and the increase in impedance caused by the reduction in the width of the signal leads, thereby improving the electrical stability of the main circuit board 200.

[0057] Alternatively, if Figure 4 As shown, the main circuit board 200 is provided with a main bridge area 210, and the main bridge area 210 is provided with a main bridge pad 220 electrically connected to at least part of the signal leads in the main circuit board 200. The main bridge pad 220 is used to connect to the bridge circuit board 300, and different signal leads are connected by means of the bridge leads in the bridge circuit board 300.

[0058] Preferably, if Figure 4 As shown, the main bridge area 210 includes a first main pad distribution area 211 and a second main pad distribution area 212. The main bridge pad 220 includes a plurality of first main bridge pads 221 and a plurality of second main bridge pads 222. The first main bridge pad 221 is arranged in the first main pad distribution area 211, and any first main bridge pad 221 is electrically connected to a signal lead; the second main bridge pad 222 is arranged in the second main pad distribution area 212, and any second main bridge pad 222 is electrically connected to a signal lead.

[0059] like Figure 2 and Figure 3 As shown, the bridge circuit board 300 is disposed on a side of the main circuit board 200 away from the display panel 100, and is bound and connected to the main circuit board 200. Figure 5As shown, the bridge circuit board 300 may include an auxiliary bridge pad 320 disposed on a surface of the bridge circuit board 300 close to the main circuit board 200 and a bridge lead disposed inside the bridge circuit board 300, and the bridge lead is electrically connected to the auxiliary bridge pad 320. Optionally, in one embodiment of the present disclosure, one bridge lead may connect at least two different auxiliary bridge pads 320, so as to connect at least two different signal leads.

[0060] In one embodiment of the present disclosure, the bridge circuit board 300 includes at most two lead layers, and any one lead layer includes a plurality of bridge leads. In this way, the display panel 100 of the present disclosure avoids using a bridge circuit board 300 with more than three layers, so as to avoid a substantial increase in the cost and thickness of the bridge circuit board 300 due to an increase in the number of lead layers of the bridge circuit board 300, thereby reducing the cost and thickness of the display device.

[0061] Preferably, the bridge circuit board 300 may be provided with two lead layers. In this way, the cost of the bridge circuit board 300 can be prevented from being too high, and the density of bridge leads in each lead layer can be prevented from being too high, and the crosstalk between bridge leads caused by too high a density of bridge leads and the increase in impedance caused by the reduction in the width of the bridge leads can be prevented, thereby improving the electrical stability of the bridge circuit board 300.

[0062] Preferably, if Figure 4 and Figure 8 As shown, the surface of the bridge circuit board 300 close to the main circuit board 200 includes a first auxiliary pad distribution area 311 and a second auxiliary pad distribution area 312. The auxiliary bridge pad 320 includes a plurality of first auxiliary bridge pads 321 and a plurality of second auxiliary bridge pads 322. Among them, the first auxiliary bridge pads 321 are arranged in the first auxiliary pad distribution area 311, each first auxiliary bridge pad 321 is connected to each first main bridge pad 221 in a one-to-one correspondence, and any first auxiliary bridge pad 321 is electrically connected to a bridge lead; the second auxiliary bridge pads 322 are arranged in the second auxiliary pad distribution area 312, each second auxiliary bridge pad 322 is connected to each second main bridge pad 222 in a one-to-one correspondence, and any second auxiliary bridge pad 322 is electrically connected to a bridge lead.

[0063] Preferably, if Figure 8As shown, the bridge circuit board 300 is also provided with a metallized via 330, and the metallized via 330 is used to lead out the bridge lead so that the bridge lead is connected to the auxiliary bridge pad 320. Further preferably, the bridge circuit board 300 is provided with a plurality of connecting leads on the surface close to the main circuit board 200, each connecting lead is respectively connected to the auxiliary bridge pad 320 and the metallized via 330, and the metallized via 330 is connected to the bridge lead. In this way, the bridge lead can be connected to the auxiliary bridge pad 320 through the metallized via 330.

[0064] Exemplarily, in one embodiment of the present disclosure, the display panel 100 is a touch display panel 100. The main circuit board 200 includes two lead layers, specifically including a first main lead layer close to the display panel 100 and a second main lead layer located on a side of the first main lead layer away from the display panel 100, wherein the first main lead layer and the second main lead layer are isolated from each other by an insulating layer. The first main lead layer includes a plurality of first signal leads, some of which are used to transmit display-related signals, such as for transmitting data signals; and some of which are used to transmit touch-related signals, such as for transmitting touch detection signals. The second main lead layer includes a plurality of second signal leads, some of which are used to transmit display-related signals, such as for transmitting data signals; and some of which are used to transmit touch-related signals, such as for transmitting touch detection signals. The main circuit board 200 is provided with a main bridge area 210, which includes a first main pad distribution area 211 and a second main pad distribution area 212, wherein the first main pad distribution area 211 is provided with a plurality of first main bridge pads 221, and the second main pad distribution area 212 is provided with a plurality of second main bridge pads 222. Some of the first main bridge pads 221 are electrically connected to the first signal lead through conductive vias, and the remaining first main bridge pads 221 are electrically connected to the second signal lead through conductive vias; some of the second main bridge pads 222 are electrically connected to the first signal lead through conductive vias, and the remaining second main bridge pads 222 are electrically connected to the second signal lead through conductive vias.

[0065] In this example embodiment, the bridge circuit board 300 includes two lead layers, specifically including a first bridge lead layer close to the main circuit board 200 and a second bridge lead layer located on the side of the first bridge lead layer away from the display panel 100, wherein the first bridge lead layer and the second bridge lead layer are isolated from each other by an insulating layer. The first bridge lead layer includes a plurality of first bridge leads, and the second bridge lead layer includes a plurality of second bridge leads. The surface of the bridge circuit board 300 close to the main circuit board 200 includes a first auxiliary pad distribution area 311 and a second auxiliary pad distribution area 312, wherein the first auxiliary pad distribution area 311 is provided with a plurality of first auxiliary bridge pads 321, each first auxiliary bridge pad 321 is connected to each first main bridge pad 221 in a one-to-one correspondence, and any first auxiliary bridge pad 321 is connected to a bridge lead through a metallized via 330. The second auxiliary pad distribution area 312 is provided with a plurality of second auxiliary bridging pads 322 , each second auxiliary bridging pad 322 is connected to each second main bridging pad 222 in a one-to-one correspondence, and any second auxiliary bridging pad 322 is connected to a bridging lead through a metallized via 330 .

[0066] like Figure 7 As shown, in the display device of the present disclosure, the first shielding tape 400 is disposed on a side of the main circuit board 200 away from the display panel 100, so as to protect the main circuit board 200 and provide electromagnetic shielding for the main circuit board 200. Preferably, the orthographic projection of the first shielding tape 400 on the main circuit board 200 does not overlap with the orthographic projection of the bridge circuit board 300 on the main circuit board 200; in this way, the first shielding tape 400 completely exposes the bridge circuit board 300.

[0067] Optionally, the first shielding tape 400 may be adhered to a side of the main circuit board 200 away from the display panel 100. Figure 1 As shown, the first shielding tape 400 can also extend beyond the edge of the main circuit board 200, so that a portion of the first shielding tape 400 adheres to the back surface 111 of the display panel 100, and the other portion adheres to the surface of the main circuit board 200 away from the display panel 100. In this way, the display panel 100 can not only improve the electromagnetic shielding effect of the main circuit board 200 and thus improve the electrical stability of the main circuit board 200, but also improve the electromagnetic shielding effect of the display panel 100 and thus improve the electromagnetic stability of the display panel 100. In addition, the shielding tape can also play a fixing role, so that the main circuit board 200 can be more firmly fixed to the display panel 100.

[0068] Preferably, if Figure 1As shown, the first shielding tape 400 covers a portion of the main circuit board 200 and exposes at least a portion of the main circuit board 200. In one embodiment of the present disclosure, the main circuit board 200 includes an interface component, and the interface component is used to electrically connect the main circuit board 200 with other circuit structures, for example, to electrically connect the main circuit board 200 with a timing controller. The first shielding tape 400 can expose the interface component of the main circuit board 200.

[0069] Preferably, when the main circuit board 200 is connected to the display panel 100 via the chip-on-film 130 , the first shielding tape 400 can cover part or all of the chip-on-film 130 to improve the electromagnetic shielding effect of the chip-on-film 130 and improve the electrical stability of the chip-on-film 130 .

[0070] In one embodiment of the present disclosure, the first shielding tape 400 may be provided with a bridging notch exposing the bridge circuit board 300, and the bridge circuit board 300 may be disposed in the bridging notch. In other words, the first shielding tape 400 may not completely surround the bridge circuit board 300, so as to facilitate the attachment and alignment of the first shielding tape 400.

[0071] In another embodiment of the present disclosure, Figure 1 and Figure 6 As shown, the first shielding tape 400 is provided with a bridging opening 410, and the bridging circuit board 300 is in the bridging opening 410. In other words, the first shielding tape 400 can completely surround the bridging circuit board 300, so that the first shielding tape 400 can achieve a better shielding effect.

[0072] Optionally, the minimum value of the distance between any point on the bridge circuit board 300 and any point on the first shielding tape 400 is equal to 0.3 to 0.8 mm. That is, the spacing between the bridge circuit board 300 and the first shielding tape 400 is 0.3 to 0.8 mm. In this way, the influence of factors such as alignment deviation and lamination deviation generated when laminating the first shielding tape 400, possible deformation of the first shielding tape 400, possible size deviation and position deviation of the bridge circuit board 300, etc., which may cause the first shielding tape 400 to partially overlap with the bridge circuit board 300, ensure the separation of the first shielding tape 400 and the bridge circuit board 300, and thus avoid unexpected damage to the first shielding tape 400.

[0073] Further optionally, the minimum value of the distance between any point on the bridge circuit board 300 and any point on the first shielding tape 400 is equal to 0.5 mm. That is, the distance between the bridge circuit board 300 and the first shielding tape 400 is 0.5 mm.

[0074] For example, in one embodiment of the present disclosure, Figure 1 and Figure 6 As shown, the first shielding tape 400 is provided with a bridging opening 410, and the bridging circuit board 300 is in the bridging opening 410; the gap between the bridging circuit board 300 and the first shielding tape 400 is annular, and the width of the annular gap is 0.3-0.8 mm.

[0075] In one embodiment of the present disclosure, the orthographic projection of the bridging opening 410 of the first shielding tape 400 on the main circuit board 200 coincides with the main bridging region 210 of the main circuit board 200 .

[0076] Optionally, the thickness of the bridge circuit board 300 is equal to 0.8 to 1.2 times the thickness of the first shielding tape 400. In this way, the thickness of the bridge circuit board 300 is substantially consistent with the thickness of the first shielding tape 400, so that the back surface 111 of the display device can be relatively flat. Preferably, the thickness of the bridge circuit board 300 is the same as the thickness of the first shielding tape 400.

[0077] Optionally, the thickness of the bridge circuit board 300 is equal to 0.09-0.14 mm, and the thickness of the first shielding tape 400 is equal to 0.09-0.14 mm. In this way, the thickness of the bridge circuit board 300 is substantially consistent with the thickness of the first shielding tape 400, which can make the back side 111 of the display device relatively flat; moreover, the bridge circuit board 300 and the first shielding tape 400 both have relatively low thicknesses, which facilitates reducing the thickness of the display device.

[0078] Preferably, the thickness of the bridge circuit board 300 is 0.11-0.12 mm, and the thickness of the first shielding tape 400 is 0.11-0.12 mm.

[0079] Alternatively, if Figure 7 As shown, the first shielding tape 400 may include a first insulating layer 421, a first conductive material layer 422, and a second insulating layer 423 stacked in sequence, wherein the first insulating layer 421 is disposed on a side of the first conductive material layer 422 close to the display panel 100. Preferably, the first insulating layer 421 and the second insulating layer 423 may be insulating tapes. Preferably, the first conductive material layer 422 may be a conductive cloth.

[0080] Further optionally, the first conductive material layer 422 may be used to load a ground signal so as to provide a more stable electromagnetic shielding effect for the display device.

[0081] Alternatively, if Figure 8 to Figure 10As shown, the bridge circuit board 300 is provided with a plurality of metallized vias 330 ; the display device further includes a second shielding tape 500 , which is arranged on a side of the bridge circuit board 300 away from the display panel 100 , and the orthographic projection of the second shielding tape 500 on the bridge circuit board 300 does not overlap with each metallized via 330 .

[0082] It is understandable that if Fig.10 As shown, the position of the metallized via 330 is prone to unevenness, for example, it is easy to uncontrollably and unexpectedly generate protruding structures 331 during the preparation and binding process, and these protruding structures 331 are usually formed by the metal material in the metallized via 330. Therefore, although the bridge circuit board 300 can be provided with a protective layer covering these metallized vias 330, if the metallized vias 330 are covered with shielding tape, these shielding tapes will not only produce wrinkles, but also may be punctured by these protruding structures 331. This may cause a short circuit between the metallized via 330 and the shielding tape, thereby causing the bridge circuit board 300 to fail or reduce electrical stability.

[0083] In an optional embodiment provided by the present disclosure, Fig.10 As shown, the second shielding tape 500 does not cover each metallized via 330. Therefore, the second shielding tape 500 can, on the one hand, achieve electromagnetic shielding of the bridging circuit board 300, improve the electromagnetic shielding effect of the bridging circuit board 300 and further improve the electrical stability of the bridging circuit board 300. On the other hand, it avoids the metallized via 330 that may cause unexpected damage to the second shielding tape 500, thereby avoiding the possibility of damage to the second shielding tape 500.

[0084] Further optionally, if Fig. 9 (the bridge circuit board is shielded by the second shielding tape) and Fig.10 As shown, the second shielding tape 500 is provided with a plurality of avoidance openings 510 corresponding to the plurality of metallized vias 330; any one of the metallized vias 330 is located within the orthographic projection of the corresponding avoidance opening 510 on the bridge circuit board 300. In other words, in a top view, the second shielding tape 500 can surround each metallized via 330 without covering each metallized via 330. In this way, the area of ​​the second shielding tape 500 can be increased, and the shielding effect on the bridge circuit board 300 can be improved.

[0085] Further optionally, the minimum value of the distance between any point of the metallized via 330 and any point of the orthographic projection of the second shielding tape 500 on the bridge circuit board 300 is equal to 0.3 to 0.8 mm. In other words, the distance between the orthographic projection of the second shielding tape 500 on the bridge circuit board 300 and the metallized via 330 is 0.3 to 0.8 mm. In this way, the influence of factors such as alignment deviation and lamination deviation generated when laminating the second shielding tape 500, possible deformation of the second shielding tape 500, etc., which may cause the second shielding tape 500 to partially overlap with the metallized via 330, can be avoided, ensuring that the second shielding tape 500 does not overlap with the metallized via 330, thereby avoiding unexpected damage to the second shielding tape 500.

[0086] Preferably, the minimum value of the distance between any point of the metallized via 330 and any point of the orthographic projection of the second shielding tape 500 on the bridge circuit board 300 is equal to 0.5 mm. In other words, the distance between the orthographic projection of the second shielding tape 500 on the bridge circuit board 300 and the metallized via 330 is 0.5 mm.

[0087] In one embodiment of the present disclosure, the second shielding tape 500 is provided with a plurality of avoidance openings 510 arranged one-to-one corresponding to the plurality of metallized vias 330; any metallized via 330 is located within the orthographic projection of the corresponding avoidance opening 510 on the bridge circuit board 300. There is an annular gap between any metallized via 330 and the edge of the orthographic projection of the corresponding avoidance opening 510 on the bridge circuit board 300, and the width of the annular gap is equal to 0.3 to 0.8 mm.

[0088] Alternatively, if Fig.10 As shown, the second shielding tape 500 may include a third insulating layer 521, a second conductive material layer 522 and a fourth insulating layer 523 which are stacked in sequence, wherein the third insulating layer 521 is disposed on a side of the second conductive material layer 522 close to the main circuit board 200. Preferably, the third insulating layer 521 and the fourth insulating layer 523 may be insulating tapes. Preferably, the second conductive material layer 522 may be conductive cloth.

[0089] Further optionally, the second conductive material layer 522 may be used to load a ground signal so as to provide a more stable electromagnetic shielding effect for the display device.

[0090] In one embodiment of the present disclosure, the orthographic projection of the second shielding tape 500 on the bridge circuit board 300 is located inside the bridge circuit board 300, and the minimum value of the distance between any point on the outer edge of the second shielding tape 500 and any point on the edge of the bridge circuit board 300 is equal to 0 to 0.5 mm. In other words, the spacing between the outer edge of the second shielding tape 500 and the edge of the bridge circuit board 300 is 0 to 0.5 mm. Further, the orthographic projection of the second shielding tape 500 on the bridge circuit board 300 may have an annular gap with the edge of the bridge circuit board 300, and the width of the annular gap may be 0 to 0.5 mm.

[0091] In this way, the second shielding tape 500 can not only cover the bridge circuit board 300 with the largest possible area, but also avoid the second shielding tape 500 exceeding the edge of the bridge circuit board 300 and causing difficulty in aligning the second shielding tape 500 and the bridge circuit board 300, thereby reducing the alignment deviation during the attachment process of the second shielding tape 500, and thereby avoiding the second shielding tape 500 from overlapping the metallized via 330.

[0092] In another embodiment of the present disclosure, Fig.11 (the bridging circuit board is blocked by the second shielding tape), the second shielding tape 500 is connected to the first shielding tape 400 as an integrated structure. In other words, the display device can be provided with a shielding tape, which includes a first part and a second part connected, the first part can be used as the first shielding tape 400 described in the embodiment of the present disclosure, and the second part can be used as the second shielding tape 500 described in the embodiment of the present disclosure. Among them, the first shielding tape 400 covers at least part of the main circuit board 200 and completely exposes the bridging circuit board 300, and the second shielding tape 500 covers part of the bridging circuit board 300 but does not cover the metallized vias 330 of the bridging circuit board 300. In this way, the second shielding tape 500 and the first shielding tape 400 connected as one can achieve a better electromagnetic shielding effect, and only one bonding process is required, which simplifies the assembly process of the display device.

[0093] The present disclosure also provides an electronic device, which includes any one of the display devices described in the above display device embodiments. The electronic device may be a smart phone, a laptop computer, a tablet computer, a smart computer, or other types of electronic devices. Since the electronic device has any one of the display devices described in the above display device embodiments, it has the same beneficial effects, and the present disclosure will not be repeated here.

[0094] It should be understood that the present disclosure does not limit its application to the detailed structure and arrangement of the components proposed in this specification. The present disclosure can have other embodiments and can be implemented and executed in a variety of ways. The aforementioned variations and modifications fall within the scope of the present disclosure. It should be understood that the present disclosure disclosed and defined in this specification extends to all alternative combinations of two or more individual features mentioned or apparent in the text and / or the drawings. All these different combinations constitute multiple alternative aspects of the present disclosure. The embodiments of this specification illustrate the best mode known for implementing the present disclosure and will enable those skilled in the art to utilize the present disclosure.

Claims

1. A display device, characterized in that: include: Display panel; A main circuit board, arranged on the back of the display panel; A bridge circuit board is disposed on a side of the main circuit board away from the display panel and is bound and connected to the main circuit board; A first shielding tape is disposed on a side of the main circuit board away from the display panel and exposes the bridge circuit board; The first shielding tape is provided with a bridging opening, and the bridging circuit board is in the bridging opening; The bridge circuit board is provided with a plurality of metallized vias; the display device further comprises a second shielding tape, which is arranged on a side of the bridge circuit board away from the display panel, and the orthographic projection of the second shielding tape on the bridge circuit board does not overlap with each of the metallized vias.

2. The display device according to claim 1, characterized in that The distance between the bridge circuit board and the first shielding tape is 0.3-0.8 mm.

3. The display device according to claim 1, characterized in that The main circuit board includes at most two lead layers.

4. The display device according to claim 1, characterized in that The bridge circuit board includes at most two lead layers.

5. The display device according to claim 1, characterized in that The thickness of the bridge circuit board is 0.8 to 1.2 times the thickness of the first shielding tape.

6. The display device according to claim 1, characterized in that: The thickness of the bridge circuit board is 0.09 to 0.14 mm, and the thickness of the first shielding tape is 0.09 to 0.14 mm.

7. The display device according to claim 1, characterized in that: The second shielding tape is provided with a plurality of avoidance openings which are arranged in one-to-one correspondence with the plurality of metallized vias; any one of the metallized vias is located within the orthographic projection of the corresponding avoidance opening on the bridge circuit board.

8. The display device according to claim 7, characterized in that: The distance between the metallized via hole and the orthographic projection of the second shielding tape on the bridge circuit board is 0.3 to 0.8 mm.

9. The display device according to claim 1, characterized in that: The orthographic projection of the second shielding tape on the bridge circuit board is located inside the bridge circuit board, and the distance between the outer edge of the second shielding tape and the edge of the bridge circuit board is 0 to 0.5 mm.

10. The display device according to claim 1, characterized in that: The second shielding tape is connected to the first shielding tape to form an integrated structure.

11. An electronic device, characterized in that: A display device comprising any one of claims 1 to 10.

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