Semiconductor module manufacturing methods and assembly fixture kits

Abstract

A fixture for manufacturing a semiconductor module is provided. A manufacturing method is provided for manufacturing a semiconductor module having a semiconductor chip, comprising the steps of: placing a plurality of circuit boards on a mounting tray; placing a plurality of first independent fixtures on a first tray fixture; placing the plurality of first independent fixtures on the plurality of circuit boards by placing the first tray fixtures on the mounting tray; and mounting the semiconductor chip on each of the plurality of circuit boards by determining a position in a parallel direction parallel to the mounting surface of the semiconductor chip using the plurality of first independent fixtures.

Description

Technical Field

[0001] This invention relates to a method for manufacturing semiconductor modules and an assembly fixture kit. Background Technology

[0002] Previously, manufacturing methods using fixtures for assembling semiconductor modules were known (see, for example, Patent Documents 1-3).

[0003] Patent Document 1: Japanese Patent Application Publication No. 2015-170731

[0004] Patent Document 2: Japanese Patent Application Publication No. 2006-093574

[0005] Patent Document 3: Japanese Patent Application Publication No. 2005-109416 Summary of the Invention

[0006] Technical issues

[0007] However, in conventional manufacturing methods, there is a problem of increased cycle time for mounting semiconductor cells when the number of units taken increases.

[0008] Technical solution

[0009] In a first aspect of the present invention, a manufacturing method is provided, which is a method for manufacturing a semiconductor module having a semiconductor chip, comprising the following steps: placing a plurality of circuit boards on a mounting tray; placing a plurality of first independent fixtures on a first tray fixture; placing the plurality of first independent fixtures on the plurality of circuit boards by placing the first tray fixtures on the mounting tray; and mounting the semiconductor chip on each of the plurality of circuit boards by determining a position in a parallel direction parallel to the mounting surface of the semiconductor chip using the plurality of first independent fixtures.

[0010] The positions of multiple first independent fixtures in the parallel direction can be determined by the first tray fixture.

[0011] In the step of mounting a semiconductor chip, the position of multiple first independent fixtures in the vertical direction perpendicular to the mounting surface of the semiconductor chip can be determined by multiple circuit boards.

[0012] The manufacturing method described above may further include the following steps: placing a second tray fixture containing a plurality of second independent fixtures on a first tray fixture; and determining the position in the parallel direction by the plurality of second independent fixtures, and mounting the metal wiring board on each of the plurality of semiconductor chips.

[0013] The positions of multiple second independent fixtures in the parallel direction can be determined by the second tray fixture.

[0014] In the step of mounting the metal wiring board, the position of the multiple second independent fixtures in the vertical direction perpendicular to the mounting surface of the semiconductor chip can be determined by the multiple first independent fixtures.

[0015] In a second aspect of the present invention, an assembly fixture kit is provided, which is an assembly fixture kit for a semiconductor module having a semiconductor chip, comprising: a mounting tray; a first tray fixture, the position of the first tray fixture in a parallel direction parallel to the mounting surface of the semiconductor chip is determined by the mounting tray; and a plurality of first independent fixtures, the position of the plurality of first independent fixtures in a parallel direction is determined by the first tray fixture.

[0016] The assembly fixture assembly may further include: a second tray fixture, the position of which in the parallel direction is determined by the first tray fixture; and a plurality of second independent fixtures, the positions of which in the parallel direction are determined by the second tray fixture.

[0017] The first tray fixture may have multiple pins for positioning. The carrying tray and the second tray fixture may have multiple recesses for receiving the multiple pins.

[0018] Multiple first independent fixtures may have tilting portions for guiding semiconductor chips.

[0019] It should be noted that the above description of the invention does not list all the features of the invention. Furthermore, sub-combinations of these feature groups can also constitute inventions. Attached Figure Description

[0020] Figure 1A This is a diagram showing an example of the upper surface of a semiconductor module 300.

[0021] Figure 1B An example of an enlarged view of the upper surface of semiconductor cell 200 is shown.

[0022] Figure 1C An example of the AA cross-section of the semiconductor cell 200 is shown.

[0023] Figure 2 This is a diagram used to illustrate the assembly jig kit 100.

[0024] Figure 3 An example of a flowchart for manufacturing semiconductor module 300 is shown.

[0025] Figure 4 An example top view of the tray 10 for carrying is shown.

[0026] Figure 5A An example of a top view of the first independent fixture 25 is shown.

[0027] Figure 5B An example of a top view of the first tray fixture 20 is shown.

[0028] Figure 5C This shows a state in which multiple first independent fixtures 25 are placed on a first tray fixture 20.

[0029] Figure 5D This is an example of a top view during the assembly of semiconductor unit 200.

[0030] Figure 5E This is an example of a top view during the assembly of semiconductor unit 200.

[0031] Figure 6A An example of a top view of the second independent fixture 35 is shown.

[0032] Figure 6B An example of a top view of the second tray fixture 30 is shown.

[0033] Figure 6C This shows a state in which multiple second independent fixtures 35 are placed on a second tray fixture 30.

[0034] Figure 6D This is an example of a top view during the assembly of semiconductor unit 200.

[0035] Figure 7 This is an enlarged view of the cross-section of the semiconductor unit 200 during assembly.

[0036] Figure 8A An example of the configuration of the comparative assembly fixture kit 500 is shown.

[0037] Figure 8B An example of the configuration of the comparative assembly fixture kit 500 is shown.

[0038] Symbol Explanation

[0039] 10…Placing tray, 11…Placing portion, 12…Recess, 20…First tray fixture, 21…Placing portion, 22…Pin, 23…Opening, 24…Inclined portion, 25…First independent fixture, 26…Opening, 27…Contact surface, 28…Edge, 29…Protrusion, 30…Second tray fixture, 31…Placing portion, 32…Recess, 33…Opening, 34…Inclined portion, 35…Second independent fixture, 36…Opening, 37…Contact surface, 38…Inclined portion, 39…Inclined portion, 100…Assembly fixture kit, 200…Semiconductor unit, 210…Semiconductor chip, 212…Placing surface, 220…Circuit board, 221…Conductor 222…Insulating board, 223…Conductive board, 230…Metal wiring board, 231…Joint, 232…Feet, 233…Connector, 234…Feet, 235…Joint, 236…Solder, 237…Solder, 238…Solder, 240…Heat sink, 300…Semiconductor module, 310…Casing, 311…Side wall, 312…Side wall, 313…Main terminal, 320…Heat sink, 510…Placing tray, 520…First independent fixture, 530…Second independent fixture, 540…First independent fixture, 550…First separation fixture, 560…Second separation fixture, 500…Assembly fixture kit Detailed Implementation

[0040] The present invention will now be described through embodiments thereof, but these embodiments do not limit the invention as defined in the claims. Furthermore, not all combinations of the features described in the embodiments are necessarily required for the solution of the invention.

[0041] Figure 1A This is a diagram showing an example of the upper surface of the semiconductor module 300. Figure 1A When viewed from above, the long side of the rectangular box 310 is designated as the X-axis, and the short side as the Y-axis. The Z-axis, X-axis, and Y-axis form a right-handed system.

[0042] In this specification, the direction parallel to the mounting surface 212 of the semiconductor chip 210 (described later) is referred to as the parallel direction. The parallel direction is a direction within the XY plane. Conversely, the direction perpendicular to the mounting surface 212 of the semiconductor chip 210 is referred to as the perpendicular direction. The perpendicular direction is the Z-axis direction.

[0043] Semiconductor module 300 includes semiconductor units 200, housing 310, and heat sink 320. In this example, semiconductor module 300 has three semiconductor units 200.

[0044] The housing 310 is a resin terminal housing. The housing 310 has two side walls 311 parallel to the X-axis and two side walls 312 parallel to the Y-axis. The two side walls 311 and two side walls 312 define an area for housing the semiconductor unit 200 and are arranged to surround the semiconductor unit 200 when viewed from above.

[0045] A heat sink 320 is disposed on the lower surface side of the semiconductor module 300. The heat sink 320 may be a plate-shaped metal plate having a plane parallel to the XY plane. For example, the material of the heat sink 320 may be a metal material including aluminum or copper. The heat sink 320 is disposed overlapping with sidewalls 311 and 312 when viewed from above. When viewed from above, the upper surface of the heat sink 320 is partially exposed in the rectangular area divided by the two sidewalls 311 and 312.

[0046] The semiconductor unit 200 is mounted on the exposed upper surface of the heat sink 320. The semiconductor unit 200 is fixed to the upper surface of the heat sink 320 by bonding materials such as solder. As a result, the heat generated in the semiconductor unit 200 is conducted to the heat sink 320.

[0047] It should be noted that the housing 310 has main terminals 313. Main terminals 313 are, for example, U-phase terminals for driving the U-phase in the three-phase inverter circuit, V-phase terminals for driving the V-phase in the three-phase inverter circuit, and W-phase terminals for driving the W-phase in the three-phase inverter circuit. Additionally, main terminals 313 are, for example, power supply terminals for supplying power to the three-phase inverter circuit.

[0048] Figure 1B An example of an enlarged view of the upper surface of a semiconductor cell 200 is shown. The semiconductor cell 200 is a structure comprising one or more semiconductor chips 210, a circuit board 220, and a conductive metal wiring board 230. The semiconductor cell 200 may also include a heat sink 240. In this example, the semiconductor cell 200 comprises four semiconductor chips 210. In the semiconductor cell 200, two groups of semiconductor chips 210, conductive board 221, and metal wiring board 230, arranged in pairs, can be electrically connected in a manner that constitutes a half-bridge circuit.

[0049] Semiconductor chip 210 is a vertically oriented power semiconductor device such as a transistor and a diode. Semiconductor chip 210 can be a MOSFET (Metal Oxide Semiconductor Field Effect Transistor), an Insulated Gate Bipolar Transistor (IGBT), or an RC-IGBT formed by integrating an IGBT and a freewheeling diode (FWD) onto a single chip. Besides silicon, semiconductor chip 210 can also be formed using semiconductor substrates such as silicon carbide and gallium nitride.

[0050] The circuit board 220 can be, for example, a DCB (Direct Copper Bonding) substrate or an AMB (Active Metal Brazing) substrate. The circuit board 220 has a conductive plate 221 and an insulating plate 222. The insulating plate 222 is formed using ceramic materials such as alumina (Al2O3), aluminum nitride (AlN), or silicon nitride (Si3N4). The conductive plate 221 is a conductive wiring pattern disposed above the insulating plate 222. For example, the material of the conductive plate 221 is a metallic material such as copper or a copper alloy.

[0051] The metal wiring board 230 is electrically connected to the semiconductor chip 210. In this example, the metal wiring board 230 wires the collector and emitter of the semiconductor chip 210. The metal wiring board 230 can be connected to the electrodes of the semiconductor chip 210 via solder. The metal wiring board 230 can be connected to an external connection terminal for external connection to the semiconductor module 300. The metal wiring board 230 includes a bonding portion 231, a connecting portion 233, and a bonding portion 235. The metal wiring board 230 can be a conductive connecting member formed from a metal plate by stamping or the like. The metal plate can be a copper or copper alloy plate. The metal wiring board 230 can have a nickel or other plating on its surface. The cross-section (ZX cross-section) of the metal wiring board 230 can have a rectangular portion.

[0052] The bonding portion 231 is solder-bonded to the semiconductor chip 210. The connecting portion 233 connects the bonding portion 231 to the bonding portion 235. The bonding portion 235 is solder-bonded to the conductive plate 221. The size of the solder bonding surface (i.e., the area in the XY plane) of the bonding portion 231 is different from the size of the solder bonding surface of the bonding portion 235. In this example, the bonding surface of the bonding portion 231 is larger than the bonding surface of the bonding portion 235.

[0053] The joint portion 231 is offset relative to the connecting portion 233 along the Y direction. The joint portion 235 is also offset relative to the connecting portion 233 along the Y direction. The joint portions 231 and 235 are located on opposite sides of the connecting portion 233 in the Y direction. Viewed from above, the joint portion 231 has two edges closer to the connecting portion 233 and two edges farther away, and the joint portion 235 has two edges closer to the connecting portion 233 and two edges farther away. Viewed from above, the four edges closer to the connecting portion 233 intersect the outline of the connecting portion 233, and the four edges farther away are separated from the outline of the connecting portion 233 in the X and Y directions. In at least one metal wiring board, the joint portion 231 has portions extending relative to the connecting portion 233 in the positive X and positive Y directions, and the joint portion 235 has portions extending relative to the connecting portion 233 in the negative X and negative Y directions. That is, steps are formed between the joint 231 and the connecting part 233, and between the joint 235 and the connecting part 233. By setting the fixture for placing the metal wiring board 230 to a shape corresponding to the steps of the metal wiring board 230, the placement of the metal wiring board 230 using the fixture becomes easier.

[0054] A heat sink 240 is disposed on the circuit board 220. The heat sink 240 dissipates heat generated in the semiconductor unit 200 by diffusing heat. For example, the material of the heat sink 240 is a metallic material such as copper or copper alloy.

[0055] Figure 1C An example of the AA cross-section of the semiconductor cell 200 is shown. The AA cross-section is a cross-section that includes the junction portion 231, the connecting portion 233, and the junction portion 235. The metal wiring board 230 includes the junction portion 231, the lead portion 232, the connecting portion 233, the lead portion 234, and the junction portion 235.

[0056] The foot 232 is connected to the joint 231. The foot 232 extends from the joint 231 in a direction separate from the upper surface of the semiconductor chip 210. The foot 232 is a portion formed by bending at any angle from the joint 231. In this example, the foot 232 extends in a direction perpendicular to the upper surface of the semiconductor chip 210 (i.e., the Z-axis direction).

[0057] The foot 234 is connected to the joint 235. The foot 234 extends from the joint 235 in a direction separate from the upper surface of the conductive plate 221. The foot 234 is a portion formed by bending at any angle from the joint 235. In this example, the foot 234 extends in a direction perpendicular to the upper surface of the conductive plate 221 (i.e., the Z-axis direction). The length of the foot 234 in the Z-axis direction can, for example, be longer than the foot 232 by an amount equivalent to the thickness of the semiconductor chip 210 and the solder 237.

[0058] The junction 231 is soldered to the semiconductor chip 210 via solder 237. The semiconductor chip 210 is soldered to the conductive plate 221 via solder 236. The junction 235 is soldered to the conductive plate 221 via solder 238. The size of the mating surface of the junction 231 is different from that of the junction 235, and the height of the junction 231 in the Z-axis direction is different from that of the junction 235. Therefore, if the solder is melted during reflow assembly, it is sometimes difficult to stably position the metal wiring board 230. Therefore, a fixture is used to position the metal wiring board 230 and fix its position during reflow.

[0059] Figure 2 This is a diagram illustrating the assembly fixture kit 100. The assembly fixture kit 100 includes: a carrying tray 10, a first tray fixture 20, a plurality of first independent fixtures 25, a second tray fixture 30, and a plurality of second independent fixtures 35.

[0060] Assembly fixture kit 100 is used to assemble multiple semiconductor units 200. In this example, assembly fixture kit 100 is used to assemble sixteen semiconductor units 200 at once. The number of semiconductor units 200 is not limited to this.

[0061] The mounting tray 10 positions the circuit board 220. Multiple circuit boards 220 are mounted on the mounting tray 10. The positions of the multiple circuit boards 220 in the parallel direction are determined by the mounting tray 10. The mounting tray 10 has a recess 12 for alignment with the first tray fixture 20.

[0062] The first tray fixture 20 positions a plurality of first individual fixtures 25 in a manner corresponding to a plurality of circuit boards 220. Sixteen first individual fixtures 25 are mounted on the first tray fixture 20. The first tray fixture 20 has a plurality of positioning pins 22. The pins 22 are inserted into recesses 12 provided in the mounting tray 10. Thus, the position of the first tray fixture 20 in the parallel direction relative to the mounting tray 10 is determined. In this example, the first tray fixture 20 has three pins 22 on one side, but the number of pins 22 is not limited to this.

[0063] The plurality of first independent fixtures 25 are positioning fixtures used to mount components of the semiconductor unit 200 onto the circuit board 220. The plurality of first independent fixtures 25 are placed on a first tray fixture 20. The positions of the plurality of first independent fixtures 25 in the parallel direction are determined by the first tray fixture 20.

[0064] The second tray fixture 30 positions the plurality of second independent fixtures 35 in a manner corresponding to the plurality of first independent fixtures 25. The position of the second tray fixture 30 in the parallel direction is determined by the first tray fixture 20. Sixteen second independent fixtures 35 are mounted on the second tray fixture 30. The second tray fixture 30 has a recess 32 for receiving pins 22. The pins 22 are inserted into the recesses 32 provided in the second tray fixture 30. Thus, the position of the second tray fixture 30 in the parallel direction relative to the first tray fixture 20 is determined. At the end of the pin 22, a tapered portion may be provided for easy insertion into the recesses 12, 32.

[0065] The plurality of second independent fixtures 35 are positioning fixtures used to mount components of the semiconductor unit 200 onto the circuit board 220. The plurality of second independent fixtures 35 are placed on a second tray fixture 30. The positions of the plurality of second independent fixtures 35 in the parallel direction are determined by the second tray fixture 30.

[0066] The materials of the jig and the tray in the assembly jig kit 100 can be the same or different. The material of the assembly jig kit 100 is selected based on factors such as ease of processing, cost, and thermal conductivity. In this example, the assembly jig kit 100 is made of carbon, but it can also be made of other materials such as ceramic.

[0067] The assembly fixture kit 100 assembles the semiconductor unit 200 by overlapping the mounting tray 10, the first tray fixture 20, and the second tray fixture 30 in a parallel direction. The first tray fixture 20 is aligned with the mounting tray 10 and the second tray fixture 30 by using pins 22.

[0068] Here, the assembly fixture kit 100 can be operated manually or automatically by an automated device. In manual operation, since the first tray fixture 20 and the second tray fixture 30 can be placed together, the fixture placement time does not increase even if the number of semiconductor units 200 is increased. On the other hand, in automatic operation, since a robotic arm is used to operate the first tray fixture 20 and the second tray fixture 30, fixture breakage is less likely compared to using a robotic arm to operate the first independent fixture 25 and the second independent fixture 35.

[0069] Figure 3 An example flowchart for manufacturing a semiconductor module 300 is shown. In this example, the semiconductor module 300 is manufactured through steps S100 to S114. A first independent fixture 25, a semiconductor chip 210, a second independent fixture 35, and a metal wiring board 230 are sequentially placed on a mounting tray 10.

[0070] In step S100, multiple circuit boards 220 are placed on the placement tray 10. The multiple circuit boards 220 can be placed individually or together.

[0071] In step S102, a plurality of first independent fixtures 25 are placed on the first tray fixture 20. The plurality of first independent fixtures 25 may also be placed on the first tray fixture 20 before step S100. Alternatively, a step of preparing a fixture assembly formed by placing the plurality of first independent fixtures 25 on the first tray fixture 20 may be provided to replace step S102. Furthermore, once the plurality of first independent fixtures 25 are placed on the first tray fixture 20, they can be directly used when assembling other semiconductor units 200.

[0072] In step S104, a plurality of first independent fixtures 25 are placed on a plurality of circuit boards 220 by placing the first tray fixture 20 on the placement tray 10. Thus, a plurality of first independent fixtures 25 are placed together on a plurality of circuit boards 220.

[0073] In step S106, the semiconductor chip 210 is mounted on each of the plurality of circuit boards 220 by determining the position in the parallel direction using a plurality of first independent fixtures 25. The semiconductor chip 210 can be mounted individually or together. In step S106, the position of the first independent fixtures 25 in the vertical direction is determined by the circuit board 220. It should be noted that, in addition to the semiconductor chip 210, other components such as solder for the semiconductor chip 210, solder for the metal wiring board 230, and copper blocks can also be mounted.

[0074] In step S108, a plurality of second independent fixtures 35 are placed on the second tray fixture 30. The plurality of second independent fixtures 35 need only be placed on the second tray fixture 30 before step S110. Furthermore, once the plurality of second independent fixtures 35 are placed on the second tray fixture 30, they can be used directly when assembling other semiconductor units 200.

[0075] In step S110, by placing the second tray fixture 30 onto the first tray fixture 20, a plurality of second independent fixtures 35 are placed onto a plurality of first independent fixtures 25. Thus, a plurality of second independent fixtures 35 are placed together on a plurality of first independent fixtures 25.

[0076] In step S112, the position in the parallel direction is determined by a plurality of second independent fixtures 35, and the metal wiring board 230 is mounted on each of the plurality of circuit boards 220. The metal wiring board 230 can be mounted individually or together. In step S112, the position in the vertical direction of the second independent fixtures 35 is determined by the first independent fixture 25. It should be noted that, in addition to the metal wiring board 230, other components such as solder for the metal wiring board 230 can also be mounted.

[0077] In step S114, the semiconductor unit 200 is packaged. For example, multiple semiconductor units 200 are housed in a housing 310. The semiconductor module 300 is manufactured through these steps.

[0078] Figure 4 An example top view of a loading tray 10 is shown. The loading tray 10 has a plurality of loading portions 11. The loading tray 10 in this example is made of carbon, but is not limited thereto.

[0079] Multiple mounting portions 11 have recesses for positioning the circuit board 220. The mounting portions 11 are positioned in such a way that the position of the circuit board 220 does not shift during the assembly and reflow of the semiconductor cell 200. The mounting portions 11 can have structures other than recesses as long as they can position the circuit board 220. In this example, the mounting portions 11 have shapes corresponding to the sixteen circuit boards 220. The shape of the mounting portions 11 can be similar to the shape of the circuit board 220. As shown, it can be a shape with two corners of a rectangle chamfered. Chamfering can prevent errors during assembly. The shape of the mounting portions 11 can be any shape as long as it can accommodate the circuit board 220 and position the four sides of the circuit board 220, for example, it can be a rectangle without chamfering.

[0080] Figure 5A An example top view of a first independent fixture 25 is shown. The first independent fixture 25 in this example is made of carbon, but is not limited to this. The first independent fixture 25 has one or more openings 26 and a plurality of protrusions 29.

[0081] The opening 26 is used to position components for assembling the semiconductor cell 200. In one example, the opening 26 is arranged in a manner that follows the shape of the semiconductor chip 210, the solder for the semiconductor chip 210, the solder for the metal wiring board 230, and the heat sink 240. For example, by setting the corners of the pattern of the opening 26 to follow the shape of the corners of the semiconductor chip 210, the position of the semiconductor chip 210 in the parallel direction can be determined. The shape of the opening 26 can be any shape corresponding to the components for assembling the semiconductor cell 200, and is not limited to this example.

[0082] Multiple protrusions 29 are provided at the ends of the opening 26. These protrusions 29 guide the semiconductor chip 210, etc., to a predetermined position in the parallel direction. By providing multiple protrusions 29, the expansion area of ​​the molten solder during reflow can be defined between adjacent protrusions 29. The cross-section of the multiple protrusions 29 may include inclined portions for guiding the semiconductor chip 210, etc., to the predetermined position. The inclined portions will be described later.

[0083] Figure 5B An example of a top view of a first tray fixture 20 is shown. The first tray fixture 20 has a plurality of mounting portions 21. In this example, the first tray fixture 20 has sixteen mounting portions 21, equal to the number of circuit boards 220 mounted on the mounting tray 10. Openings 23 for mounting components such as semiconductor chips 210 onto the circuit board 220 are provided in each of the mounting portions 21. The material of the first tray fixture 20 in this example is carbon, but it is not limited to this.

[0084] Figure 5C This illustrates a state in which multiple first independent fixtures 25 are placed on a first tray fixture 20. In this example, sixteen first independent fixtures 25 are placed on the placement section 21 of the first tray fixture 20.

[0085] The position of the first independent fixture 25 in the parallel direction is determined by the first tray fixture 20. The first independent fixture 25 is positioned in a manner that follows the shape of the mounting portion 21. The first independent fixture 25 can be inserted into the opening 23. In this example, the first independent fixture 25 is mounted along the opening 23 provided in the mounting portion 21.

[0086] Figure 5D This is an example of a top view during the assembly of the semiconductor unit 200. Here, the semiconductor chip 210 and the heat sink 240 are mounted on the circuit board 220 using the first independent fixture 25. Solder is provided below the semiconductor chip 210. The solder for the semiconductor chip 210 can be mounted using the first independent fixture 25.

[0087] Solder 236 is mounted for mounting the metal wiring board 230. The solder 236 in this example is mounted using the first independent fixture 25.

[0088] The first independent fixture 25 has sides 28a, 28b, 28c, and 28d for positioning. The solder 236 is positioned within a rectangular area formed by sides 28a to 28d in this example. Relative to the semiconductor chip 210, the closer side 28a intersects with the farther side 28b, and the farther side 28c intersects with the closer side 28d when viewed from above. In this example, the first independent fixture 25 is positioned using four sides 28a to 28d, but it is not limited to this. In this example, no protrusions 29 are provided on sides 28a to 28d, but protrusions 29 may also be provided. Additionally, inclined portions for guiding the metal wiring board 230 to a predetermined position may be provided on sides 28a to 28d.

[0089] Figure 5E This is an example of a top view during the assembly of semiconductor cell 200. For example... Figure 5E As shown, the first independent fixture 25 may not have a protrusion 29 at the end of the opening 26. Viewed from above, the three sides of the opening 26 may be linear. Inclined portions for guiding the semiconductor chip 210 to a predetermined position may be provided on each of the three sides. The contact between the first independent fixture 25 and the semiconductor chip 210 may be a point contact using the protrusion 29, or an edge contact using the edges. The contact between the first independent fixture 25 and the semiconductor chip 210 may also be a combination of point contact and edge contact.

[0090] Figure 6A An example top view of a second independent fixture 35 is shown. The material of the second independent fixture 35 in this example is carbon, but it is not limited to this. The second independent fixture 35 has one or more openings 36.

[0091] The opening 36 is used to position components for assembling the semiconductor cell 200. In one example, the opening 36 is arranged in a manner that follows the shape of the metal wiring board 230 and / or the solder used on the metal wiring board 230. For example, by setting the corners of the pattern of the opening 36 to follow the shape of the corners of the metal wiring board 230, the position of the metal wiring board 230 in the parallel direction can be determined. That is, the shape of the metal wiring board 230 preferably includes corners and other shapes that facilitate positioning alignment, so as to facilitate determining the position in the parallel direction.

[0092] In this example, the opening 36 has a shape that corresponds to the four metal wiring boards 230 with a single opening. The shape of the opening 36 can be any shape that corresponds to the components used to assemble the semiconductor cell 200, and is not limited to this example.

[0093] Figure 6BAn example of a top view of a second tray fixture 30 is shown. The second tray fixture 30 has a plurality of mounting portions 31. In this example, the second tray fixture 30 has sixteen mounting portions 31, equal to the number of circuit boards 220 mounted on the mounting tray 10. Openings 33 are provided in each of the mounting portions 31 for mounting components such as metal wiring boards 230 onto the circuit boards 220. The material of the second tray fixture 30 in this example is carbon, but it is not limited to this.

[0094] Figure 6C This illustrates a state in which multiple second independent fixtures 35 are placed on a second tray fixture 30. In this example, sixteen second independent fixtures 35 are placed on the mounting section 31 of the second tray fixture 30.

[0095] The position of the second independent fixture 35 in the parallel direction is determined by the second tray fixture 30. The second independent fixture 35 is positioned in a manner that follows the shape of the mounting portion 31. The second independent fixture 35 can be inserted into the opening 33. In this example, the second independent fixture 35 is mounted along the opening 33 provided in the mounting portion 31.

[0096] Figure 6D This is an example of a top view during the assembly of the semiconductor unit 200. Here, the metal wiring board 230 is mounted on the circuit board 220 using a second independent fixture 35. In this example, the four joints 231 of the metal wiring board 230 are positioned using the second independent fixture 35. In addition to edges 28a to 28d, the metal wiring board 230 is also positioned by the corner between edges 28d and 28e. On the metal wiring board 230, the two edges closest to the joints 235 can be positioned by edges 28a and 28d, and the two edges furthest away can be positioned by edges 28b and 28c. It should be noted that the solder for mounting the metal wiring board 230 can be mounted using the second independent fixture 35.

[0097] As described above, since the assembly fixture kit 100 has a first tray fixture 20 that carries multiple first independent fixtures 25, the number of actions required to carry the first independent fixtures 25 is reduced. Sixteen semiconductor units 200 can be handled in a single action of carrying the first tray fixture 20.

[0098] Similarly, since the assembly fixture kit 100 has a second tray fixture 30 that carries multiple second independent fixtures 35, the number of actions required to place the second independent fixtures 35 is reduced. Sixteen semiconductor units 200 can be handled in a single action of carrying the second tray fixture 30.

[0099] Figure 7This is an enlarged cross-sectional view of the semiconductor unit 200 during assembly. The circuit board 220 includes a conductive plate 221, an insulating plate 222, and a conductive plate 223.

[0100] The insulating plate 222 is arranged such that it is sandwiched between the conductive plates 221 and 223 above and below. A first independent fixture 25 and a second independent fixture 35 are provided on the circuit board 220.

[0101] The contact surface 27 is the surface on which the first independent fixture 25 contacts the circuit board 220 when the first independent fixture 25 is placed on the circuit board 220. That is, the position of the first independent fixture 25 in the vertical direction is determined by the circuit board 220.

[0102] The contact surface 37 is the surface on which the first independent fixture 25 and the second independent fixture 35 contact each other when the second independent fixture 35 is placed on the first independent fixture 25. That is, the position of the second independent fixture 35 in the vertical direction is determined by the first independent fixture 25.

[0103] The mounting surface 212 is the upper surface of the circuit board 220 on which the semiconductor chip 210 is mounted. The mounting surface 212 can be disposed on the upper surface of the circuit board 220. The semiconductor chip 210 can be mounted on the mounting surface 212 by means of solder.

[0104] The gap G1 is a vertical distance between the first tray fixture 20 and the first independent fixture 25 when the first independent fixture 25 is mounted on the circuit board 220. By providing the gap G1, interference between the first tray fixture 20 and the first independent fixture 25 can be suppressed even if the circuit board 220 or the first independent fixture 25 is deformed. It should be noted that before mounting the first independent fixture 25 onto the circuit board 220, the first independent fixture 25 is mounted on the first tray fixture 20 without providing the gap G1.

[0105] Gap G2 is a vertical spacing between the first independent fixture 25 and the second tray fixture 30, provided when the first independent fixture 25 and the second independent fixture 35 are mounted on the circuit board 220. By providing gap G2, interference between the first independent fixture 25 and the second tray fixture 30 can be suppressed even if the circuit board 220 or the first independent fixture 25 is deformed. To provide gap G2, the mounting tray 10, the first tray fixture 20, the first independent fixture 25, the second tray fixture 30, and the circuit board 220 are adjusted to each other in terms of thickness and other shapes. It should be noted that the thickness t of the end of the first independent fixture 25 is determined in a way that gaps G1 and G2 can be obtained.

[0106] The gap G3 is a vertical distance between the second tray fixture 30 and the second independent fixture 35, provided when the first independent fixture 25 and the second independent fixture 35 are mounted on the circuit board 220. By providing the gap G3, interference between the second tray fixture 30 and the second independent fixture 35 can be suppressed even if the circuit board 220, the first independent fixture 25, and the second independent fixture 35 are deformed. It should be noted that before mounting the second independent fixture 35 onto the first independent fixture 25, the second independent fixture 35 is mounted on the second tray fixture 30 without the gap G3 provided.

[0107] The positioning interval P1 represents the directional interval for positioning the first independent fixture 25 by the first pallet fixture 20. By setting the positioning interval P1, the first independent fixture 25 is guided to an appropriate position in the parallel direction when the first pallet fixture 20 is placed on the placement tray 10. In one example, the positioning interval P1 is greater than 0.05 mm and less than 0.2 mm. For example, the positioning interval P1 is 0.1 mm.

[0108] The positioning interval P2 represents the directional spacing used to position the semiconductor chip 210 via the first independent fixture 25. By setting the positioning interval P2, the semiconductor chip 210 is guided to an appropriate position in the parallel direction when it is placed on the circuit board 220. In one example, the positioning interval P2 is greater than 0.05 mm and less than 0.2 mm. For example, the positioning interval P2 is 0.1 mm.

[0109] The positioning interval P3 represents the directional interval used to position the second independent fixture 35 via the second pallet fixture 30. By setting the positioning interval P3, the second independent fixture 35 is guided to an appropriate position in the parallel direction when the second pallet fixture 30 is placed on the first pallet fixture 20. In one example, the positioning interval P3 is greater than 0.05 mm and less than 0.2 mm. For example, the positioning interval P3 is 0.1 mm.

[0110] The inclined portion 24 is a portion formed by tilting the inner wall of the first tray fixture 20. By providing the inclined portion 24, positioning of the first independent fixture 25 becomes easier. The angle and length of the inclined portion 24 can be appropriately adjusted according to the shape of the first independent fixture 25, etc. In addition, the angle and length of the inclined portion 24 can also be adjusted according to the positioning interval P1.

[0111] The inclined portion 34 is a portion formed by the inclination of the inner wall of the second tray fixture 30. By providing the inclined portion 34, the positioning of the second independent fixture 35 becomes easier. The angle and length of the inclined portion 34 can be appropriately adjusted according to the shape of the second independent fixture 35, etc. In addition, the angle and length of the inclined portion 34 can also be adjusted according to the positioning interval P3.

[0112] The inclined portion 38 is a portion formed by tilting the inner wall of the first independent fixture 25. By providing the inclined portion 38, the positioning of components mounted on the circuit board 220 becomes easier. The angle and length of the inclined portion 38 can be appropriately adjusted according to the shape of the mounted component, etc. In addition, the angle and length of the inclined portion 38 can also be adjusted according to the positioning interval P2. The inclined portion 38 can be provided on the protrusion 29 of the first independent fixture 25.

[0113] The inclined portion 39 is a portion formed by tilting the inner wall of the mounting portion 11 on the mounting tray 10. By providing the inclined portion 39, it is easier to mount the circuit board 220 onto the mounting portion 11 and to insert the first independent fixture 25 into the mounting portion 11. The angle and length of the inclined portion 39 can be appropriately adjusted according to the shape of the mounted component, etc.

[0114] The position of the first independent fixture 25 in the parallel direction is determined with the first tray fixture 20 as a reference. That is, the position of the first independent fixture 25 in the parallel direction is not affected by other components such as the circuit board 220. Therefore, the position of the first independent fixture 25 can be aligned without being affected by the deviation of each individual component.

[0115] The position of the second independent fixture 35 in the parallel direction is determined using the second tray fixture 30 as a reference. That is, the position of the second independent fixture 35 in the parallel direction is not affected by the first independent fixture 25. Therefore, the position of the second independent fixture 35 can be aligned without being affected by the deviation of each individual fixture.

[0116] Figure 8A An example of the configuration of a comparative assembly fixture kit 500 is shown. Semiconductor units are omitted in this example. The assembly fixture kit 500 includes a carrying tray 510, a first independent fixture 520, and a second independent fixture 530.

[0117] Multiple semiconductor units are placed on the mounting tray 510. In this example, the mounting tray 510 is used to assemble sixteen semiconductor units at the same time. For example, multiple circuit boards are placed on the mounting tray 510.

[0118] The first independent fixture 520 is provided corresponding to each semiconductor unit. That is, sixteen first independent fixtures 520 are individually mounted for each mounting tray 510. Therefore, for each mounting tray 510, the action of mounting the first independent fixture 520 needs to be repeated sixteen times.

[0119] The second independent fixture 530 is provided corresponding to each semiconductor unit. That is, sixteen second independent fixtures 530 are individually mounted for each mounting tray 510. Therefore, for each mounting tray 510, the action of mounting the second independent fixture 530 needs to be repeated sixteen times.

[0120] For example, when the number of semiconductor cells picked up increases, the total time (T) for mounting the fixture increases. The total time (T) is expressed using the following formula.

[0121] T = α × 2 × t

[0122] α is the number of semiconductor cells taken. t is the time spent placing a fixture.

[0123] In manual loading, the time *t* spent loading a single fixture increases, thus further increasing the total time *T*. Furthermore, in automated loading, there is a possibility of fixture breakage due to the robotic arm, which also incurs time for position correction using a camera. Additionally, there are costs associated with importing equipment such as cameras and systems.

[0124] Figure 8B An example of the configuration of a comparative assembly fixture kit 500 is shown. In this example, the semiconductor unit is omitted. The assembly fixture kit 500 of this example includes a carrying tray 510, a first independent fixture 540, a first separation fixture 550, and a second separation fixture 560.

[0125] Multiple semiconductor units are placed on the mounting tray 510. In this example, the mounting tray 510 is used to assemble sixteen semiconductor units at the same time. For example, multiple circuit boards are placed on the mounting tray 510.

[0126] The first independent fixture 540 is provided corresponding to each semiconductor unit. That is, sixteen first independent fixtures 540 are individually mounted for each mounting tray 510. Therefore, for each mounting tray 510, the action of mounting the first independent fixture 540 needs to be repeated sixteen times.

[0127] The first separation fixture 550 has a separation structure for a single semiconductor unit. In this example, the first separation fixture 550 is divided into four. Therefore, the first separation fixture 550 needs to repeat the placement operation four times for a single semiconductor unit. In addition, since there are sixteen first separation fixtures 550 for a single placement tray 510, the entire process requires sixty-four placement operations.

[0128] The second separation fixture 560 has a separation structure for each semiconductor unit. In this example, the second separation fixture 560 is divided into four. Therefore, the second separation fixture 560 needs to repeat the placement operation four times for each semiconductor unit. In addition, since there are sixteen second separation fixtures 560 for each placement tray 510, the entire process requires sixty-four placement operations.

[0129] The present invention has been described above using embodiments, but the technical scope of the present invention is not limited to the scope described in the above embodiments. It will be apparent to those skilled in the art that various modifications or improvements can be made to the above embodiments. As can be seen from the claims, methods obtained by such modifications or improvements can also be included within the technical scope of the present invention.

[0130] It should be noted that the execution order of actions, processes, steps, and stages in the apparatus, system, program, and method shown in the claims, specification, and drawings can be implemented in any order unless specifically stated as "earlier than" or "before," and as long as the results of previous processes are not used in subsequent processes. Even if the flow of actions in the claims, specification, and drawings is described using terms such as "firstly" or "next" for convenience, it does not mean that they must be implemented in that order.

Claims

1. A manufacturing method, characterized in that, It is a method for manufacturing a semiconductor module with semiconductor chips, comprising the following steps: Multiple circuit boards are placed on a mounting tray; Multiple first independent fixtures are placed on a first tray fixture; By placing the first tray fixture on the mounting tray, the plurality of first individual fixtures are placed on the plurality of circuit boards; as well as The semiconductor chip is mounted on each of the plurality of circuit substrates by determining its position in a parallel direction parallel to the mounting surface of the semiconductor chip using the plurality of first independent fixtures. The plurality of circuit boards are positioned by a plurality of mounting portions disposed on the mounting tray.

2. The manufacturing method according to claim 1, characterized in that, The positions of the plurality of first independent fixtures in the parallel direction are determined by the first tray fixture.

3. The manufacturing method according to claim 1 or 2, characterized in that, In the step of mounting the semiconductor chip, the position of the plurality of first independent fixtures in the vertical direction perpendicular to the mounting surface of the semiconductor chip is determined by the plurality of circuit boards.

4. The manufacturing method according to claim 1 or 2, characterized in that, The manufacturing method further includes the following steps: A second tray fixture containing multiple second independent fixtures is placed on the first tray fixture; and The position in the parallel direction is determined by the plurality of second independent fixtures, and the metal wiring board is mounted on each of the plurality of semiconductor chips.

5. The manufacturing method according to claim 4, characterized in that, The positions of the plurality of second independent fixtures in the parallel direction are determined by the second tray fixture.

6. The manufacturing method according to claim 4, characterized in that, In the step of mounting the metal wiring board, the position of the plurality of second independent fixtures in the vertical direction perpendicular to the mounting surface of the semiconductor chip is determined by the plurality of first independent fixtures.

7. An assembly jig kit, characterized in that, It is an assembly fixture kit for a semiconductor module having a semiconductor chip, the assembly fixture kit comprising: A tray for holding multiple circuit boards; The position of the first tray fixture in the parallel direction parallel to the mounting surface of the semiconductor chip is determined by the mounting tray. as well as A plurality of first independent fixtures are mounted on a first tray fixture for mounting the semiconductor chip on each of the plurality of circuit substrates, the positions of the plurality of first independent fixtures in the parallel direction being determined by the first tray fixture.

8. The assembly fixture kit according to claim 7, characterized in that, The assembly fixture kit also includes: The second pallet fixture, the position of the second pallet fixture in the parallel direction is determined by the first pallet fixture; and A plurality of second independent fixtures are mounted on a second tray fixture for mounting a metal wiring board on each of the plurality of semiconductor chips, the positions of the plurality of second independent fixtures in the parallel direction being determined by the second tray fixture.

9. The assembly fixture kit according to claim 8, characterized in that, The first pallet fixture has multiple pins for positioning. The loading tray and the second tray fixture have multiple recesses for receiving the plurality of pins.

10. The assembly fixture kit according to any one of claims 7 to 9, characterized in that, The plurality of first independent fixtures have tilting portions for guiding the semiconductor chips.

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