A composite microwave load

Abstract

The present invention discloses a composite microwave load, comprising a metal substrate, a cooling liquid and a microwave absorbing material arranged on the metal substrate, wherein the cooling liquid is arranged inside the metal substrate and cools the metal substrate, and further comprising a non-metallic sealing sleeve; the non-metallic sealing sleeve is arranged on the metal substrate, and a sealing area is formed between the non-metallic sealing sleeve and the microwave absorbing material; the sealing area is connected to the inside of the metal substrate, and the cooling liquid flows inside the metal substrate and in the sealing area and directly contacts the microwave absorbing material. The composite microwave load of the present invention uses a non-metal to seal a specific area containing a microwave absorbing material on the basis of a dry load, and then dissipates heat from the microwave absorbing material by filling the sealing area with flowing cooling liquid, so that the maximum power carrying capacity of the load is greatly improved.

Description

Technical Field

[0001] The invention relates to the field of microwave technology, and in particular to a composite microwave load. Background Art

[0002] Microwave loads are widely used in the microwave field. Currently, microwave loads are divided into dry loads and water loads. Figure 1 As shown, the dry load uses solid microwave absorbing materials to absorb microwaves, which has a smaller standing wave coefficient, but has relatively poor power carrying capacity, especially when using absorbing materials with very low thermal conductivity such as ferrite; while the water load generally uses water as the microwave absorbing material, which has relatively higher power capacity, but has a larger standing wave coefficient. Therefore, it is difficult to find a suitable microwave load in an ultra-high power microwave system that requires a lower standing wave coefficient. Summary of the invention

[0003] The technical problem to be solved by the present invention is that the prior art lacks an ultra-high power microwave load with a low standing wave coefficient. The purpose is to provide a composite microwave load to solve the above problem.

[0004] The present invention is achieved through the following technical solutions:

[0005] A composite microwave load comprises a metal substrate, a cooling liquid and a microwave absorbing material arranged on the metal substrate, wherein the cooling liquid is arranged inside the metal substrate and cools the metal substrate, and further comprises a non-metallic sealing sleeve; the non-metallic sealing sleeve is arranged on the metal substrate, and a sealing area is formed between the non-metallic sealing sleeve and the microwave absorbing material; the sealing area is connected to the inside of the metal substrate, and the cooling liquid flows inside the metal substrate and in the sealing area and directly contacts the microwave absorbing material.

[0006] When the present invention is applied, a design scheme of a microwave load is proposed, the area containing the microwave absorbing material is sealed with a non-metallic material, and then the sealed area is filled with a coolant, so that the coolant and the microwave absorbing material are fully in contact to exchange heat, thereby increasing the maximum load power of the load. The non-metallic sealing sleeve is connected to the metal substrate for sealing (to prevent the coolant from leaking out), and the sealed area formed by the non-metallic sealing sleeve and the metal substrate is used as a coolant flow channel, so that the coolant can fill the sealed area and completely cover the microwave absorbing material. When the microwave load is working, the microwave absorbing material will generate heat, and when the coolant flows, the heat generated by the microwave absorbing material can be quickly taken away. Under the same power, the temperature of the microwave absorbing material will be greatly reduced.

[0007] Different from the microwave load design in the prior art, in the present invention, the coolant is not only dissipated inside the metal substrate, but is directly in contact with the microwave absorbing material, which can greatly increase the heat dissipation efficiency of the microwave absorbing material itself, thereby increasing the maximum power of the microwave load, and the structure is simple and easy to implement. Although there are technologies for dissipating heat from metal substrates in the prior art, the applicant found in his creative work that the indirect heat dissipation of microwave absorbing materials through metal substrates is itself inefficient, so the technical solution of the present application is used for heat dissipation.

[0008] The present invention uses non-metal to seal a specific area containing microwave absorbing material on the basis of dry load, and then fills the sealed area with flowing cooling liquid to dissipate heat from the microwave absorbing material, thereby greatly improving the maximum power carrying capacity of the load.

[0009] Furthermore, the non-metallic sealing sleeve may be made of non-metallic materials such as Teflon, ceramic, quartz or sapphire to implement the present invention.

[0010] Furthermore, the coolant is water.

[0011] When the present invention is used, the coolant itself can be water, various oils or other liquids that can be used for heat dissipation; however, it can be preferably water. When the coolant is water, water can be used as both a coolant and a microwave absorbing material. By adjusting the parameters, the carrying power of the present invention can be maximized while satisfying the standing wave coefficient.

[0012] Furthermore, when the microwave load is a partially sealed waveguide load, both ends of the non-metallic sealing sleeve are arranged on the metal substrate, and the microwave absorbing material and the sealing area are located between the non-metallic sealing sleeve and the metal substrate.

[0013] Furthermore, when the microwave load is a partially sealed coaxial load, the metal substrate includes a coaxial outer conductor and a coaxial inner conductor; one end of the non-metallic sealing sleeve is arranged on the coaxial outer conductor, and the other end of the non-metallic sealing sleeve is arranged on the coaxial inner conductor or the coaxial outer conductor; the microwave absorbing material and the sealing area are located between the non-metallic sealing sleeve and the coaxial outer conductor.

[0014] Furthermore, when the microwave load is an integrally sealed waveguide load, the outer edges of the non-metallic sealing sleeve are all arranged on the metal substrate; and the non-metallic sealing sleeve completely covers the entire waveguide opening.

[0015] Furthermore, when the microwave load is an integrally sealed coaxial load, the metal substrate includes a coaxial outer conductor and a coaxial inner conductor; the non-metallic sealing sleeve is arranged between the coaxial outer conductor and the coaxial inner conductor; the outer edge of the non-metallic sealing sleeve is arranged on the coaxial outer conductor, and the inner edge of the non-metallic sealing sleeve is arranged on the coaxial inner conductor; the non-metallic sealing sleeve completely covers the entire waveguide opening.

[0016] Compared with the prior art, the present invention has the following advantages and beneficial effects:

[0017] The composite microwave load of the present invention uses non-metal to seal a specific area containing microwave absorbing material on the basis of a dry load, and then fills the sealed area with flowing cooling liquid to dissipate heat from the microwave absorbing material, thereby greatly improving the maximum power carrying capacity of the load. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The drawings described herein are used to provide a further understanding of the embodiments of the present invention, constitute a part of this application, and do not constitute a limitation of the embodiments of the present invention. In the drawings:

[0019] Figure 1 It is a schematic diagram of the dry load structure of the prior art;

[0020] Figure 2 This is a schematic cross-sectional diagram of a composite load according to an embodiment of the present invention;

[0021] Figure 3 A schematic diagram of a waveguide load with a partially sealed tapered surface according to an embodiment of the present invention;

[0022] Figure 4 A schematic diagram of partially sealing waveguide loads of various cross sections according to an embodiment of the present invention;

[0023] Figure 5 It is a schematic diagram of a partially sealed coaxial load without a conical surface according to an embodiment of the present invention;

[0024] Figure 6 It is a schematic diagram of the coaxial load of a part of the sealing tapered surface in an embodiment of the present invention;

[0025] Figure 7 It is a schematic diagram of a waveguide load without a tapered surface that is integrally sealed according to an embodiment of the present invention;

[0026] Figure 8 This is a schematic diagram of a waveguide load with an integrally sealed tapered surface according to an embodiment of the present invention;

[0027] Fig. 9 A schematic diagram of a waveguide load with various cross sections that is integrally sealed according to an embodiment of the present invention;

[0028] Fig.10This is a schematic diagram of a coaxial load without a conical surface in an integral seal according to an embodiment of the present invention;

[0029] Fig.11 This is a schematic diagram of the coaxial load of the integral seal with a conical surface according to an embodiment of the present invention;

[0030] Fig.12 This is a schematic diagram of an overall electromagnetic simulation model of a microwave load according to an embodiment of the present invention;

[0031] Fig.13 This is a graph of the S11 gain before improvement in the embodiment of the present invention;

[0032] Fig.14 This is an enlarged view of the local structure of the embodiment of the present invention before improvement;

[0033] Fig.15 It is an enlarged view of the improved local structure of the embodiment of the present invention;

[0034] Fig.16 This is a graph of the S11 gain after improvement in an embodiment of the present invention;

[0035] Fig.17 Improved front load temperature distribution diagram for embodiments of the present invention;

[0036] Fig.18 This is the load temperature distribution diagram after improvement according to the embodiment of the present invention.

[0037] Marks and corresponding parts names in the attached drawings:

[0038] 1-metal substrate, 2-microwave absorbing material, 3-cooling liquid, 4-non-metallic sealing sleeve, 5-sealing area. DETAILED DESCRIPTION

[0039] In order to make the objectives, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with embodiments and drawings. The exemplary embodiments of the present invention and their description are only used to explain the present invention and are not intended to limit the present invention.

[0040] Example

[0041] like Figure 2As shown, the present invention is a composite microwave load, comprising a metal substrate 1, a cooling liquid 3 and a microwave absorbing material 2 arranged on the metal substrate 1, wherein the cooling liquid 3 is arranged inside the metal substrate 1 and cools the metal substrate 1, and is characterized in that it also comprises a non-metallic sealing sleeve 4; the non-metallic sealing sleeve 4 is arranged on the metal substrate 1, and a sealing area 5 is formed between the non-metallic sealing sleeve 4 and the microwave absorbing material 2; the sealing area 5 is connected to the inside of the metal substrate 1, and the cooling liquid 3 flows inside the metal substrate 1 and in the sealing area 5 and directly contacts the microwave absorbing material 2.

[0042] When this embodiment is implemented, a design scheme of a microwave load is proposed, in which a region containing a microwave absorbing material is sealed with a non-metallic material, and then the sealed region is filled with a coolant, so that the coolant and the microwave absorbing material are in full contact to exchange heat, thereby increasing the maximum load power of the load. A non-metallic sealing sleeve is connected to a metal substrate for sealing (to prevent the coolant from leaking out), and the sealed region formed by the non-metallic sealing sleeve and the metal substrate is used as a coolant flow channel, so that the coolant can fill the sealed region and completely cover the microwave absorbing material. When the microwave load is working, the microwave absorbing material will generate heat, and when the coolant flows, the heat generated by the microwave absorbing material can be quickly taken away. At the same power, the temperature of the microwave absorbing material will be greatly reduced.

[0043] Different from the microwave load design in the prior art, in the present invention, the coolant is not only dissipated inside the metal substrate, but is directly in contact with the microwave absorbing material, which can greatly increase the heat dissipation efficiency of the microwave absorbing material itself, thereby increasing the maximum power of the microwave load, and the structure is simple and easy to implement. Although there are technologies for dissipating heat from metal substrates in the prior art, the applicant found in his creative work that the indirect heat dissipation of microwave absorbing materials through metal substrates is itself inefficient, so the technical solution of the present application is used for heat dissipation.

[0044] The present invention uses non-metal to seal a specific area containing microwave absorbing material on the basis of dry load, and then fills the sealed area with flowing cooling liquid to dissipate heat from the microwave absorbing material, thereby greatly improving the maximum power carrying capacity of the load.

[0045] In order to further illustrate the working process of this embodiment, the non-metallic sealing sleeve 4 is made of Teflon, ceramic, quartz or sapphire.

[0046] In order to further illustrate the working process of this embodiment, the coolant 3 is water.

[0047] like Figure 2 and Figure 3As shown, in order to further illustrate the working process of this embodiment, when the microwave load is a partially sealed waveguide load, both ends of the non-metallic sealing sleeve 4 are arranged on the metal substrate 1, and the microwave absorbing material 2 and the sealing area 5 are located between the non-metallic sealing sleeve 4 and the metal substrate 1.

[0048] Figure 2 As one implementation of the present invention, it is applied to a partially sealed waveguide load without a cone surface, from Figure 2 It can be seen that the original cooling liquid can directly contact the microwave absorbing material 2, and flow in the original cavity and the sealing area 5 to achieve heat dissipation.

[0049] Figure 3 As another implementation of the present invention, the waveguide load applied to the partially sealed tapered surface is Figure 3 It can be seen from the figure that the present invention can be well adapted to waveguide loads with tapered surfaces.

[0050] like Figure 4 As shown, from left to right are rectangular cross-section waveguide, elliptical cross-section waveguide and circular cross-section waveguide. Figure 4 It can be seen from the figure that the present invention can be applied to various partially sealed waveguide loads and has strong adaptability.

[0051] like Figure 5 and Figure 6 As shown, in order to further illustrate the working process of this embodiment, when the microwave load is a partially sealed coaxial load, the metal substrate 1 includes a coaxial outer conductor and a coaxial inner conductor; one end of the non-metallic sealing sleeve 4 is arranged on the coaxial outer conductor, and the other end of the non-metallic sealing sleeve 4 is arranged on the coaxial inner conductor or the outer conductor; the microwave absorbing material 2 and the sealing area 5 are located between the non-metallic sealing sleeve 4 and the coaxial outer conductor.

[0052] Figure 5 As another implementation of the present invention, it is applied to a partially sealed coaxial load without a cone surface, in which the metal substrate 1 itself includes a coaxial inner conductor. Figure 5 It can be seen that the present application can be well adapted to partially sealed coaxial loads without a conical surface.

[0053] Figure 6 As another implementation of the present invention, it is applied to a partially sealed coaxial load with a conical surface, in which the metal substrate 1 itself includes a coaxial inner conductor. Figure 5 It can be seen that the present application can be well adapted to the coaxial load of a partial sealing tapered surface.

[0054] like Figure 7 and Figure 8As shown, in order to further illustrate the working process of this embodiment, when the microwave load is an integrally sealed waveguide load, the outer edges of the non-metallic sealing sleeve 4 are all arranged on the metal substrate 1; the non-metallic sealing sleeve 4 completely covers the entire waveguide opening.

[0055] like Fig. 9 As shown, from left to right are rectangular cross-section waveguide, elliptical cross-section waveguide and circular cross-section waveguide. Figure 4 It can be seen from the figure that the present invention can be applied to various integrally sealed waveguide loads and has strong adaptability.

[0056] like Fig.10 and Fig.11 As shown, in order to further illustrate the working process of this embodiment, when the microwave load is an integrally sealed coaxial load, the metal substrate 1 includes a coaxial outer conductor and a coaxial inner conductor; the non-metallic sealing sleeve 4 is arranged between the coaxial outer conductor and the coaxial inner conductor; the outer edge of the non-metallic sealing sleeve 4 is arranged on the coaxial outer conductor, and the inner edge of the non-metallic sealing sleeve 4 is arranged on the coaxial inner conductor; the non-metallic sealing sleeve 4 completely covers the entire waveguide opening.

[0057] To further illustrate the working process of this embodiment, Figures 12 to 18 As shown in the figure, a 300kW dry load is taken as an example. The load uses ferrite as the absorption material and is divided into four identical absorption units. The operating frequency is 500MHz. Fig.12 The overall electromagnetic simulation model of the load has an S11 of -64dB. Fig.13 .

[0058] Based on this load, a ceramic sealing sleeve is used and transformer oil is used as the coolant. The overall structure remains unchanged, and the local changes are as follows Fig.14 and Fig.15 The composite load also achieves -57dB at 500MHz. Fig.16 .

[0059] According to the electromagnetic simulation results, the absorption power of each absorption unit is different. During the thermal simulation, we calculated the temperature distribution of the maximum power module. The cooling medium was pure water and the coolant flow rate was 60L / min. The calculation results are compared in Fig.17 and Fig.18 :

[0060] The maximum operating temperature of the original load reached 181.36°C, with a temperature rise of 161.36°C. The maximum operating temperature of the composite load was 100.05°C, with a temperature rise of 80.05°C. The temperature has been significantly improved.

[0061] It can be seen that in this embodiment, by using a composite load, the temperature rise of the load during operation can be reduced to about 1 / 2 of the old structure at the same power (taking the absorption material with a thermal conductivity lower than 30W / m*K as an example, the lower the thermal conductivity of the material, the more obvious the effect). At the same temperature of the microwave absorption material, the maximum load-bearing power of the load can be doubled.

[0062] The specific implementation methods described above further illustrate the objectives, technical solutions and beneficial effects of the present invention in detail. It should be understood that the above description is only a specific implementation method of the present invention and is not intended to limit the scope of protection of the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A composite microwave load, comprising a metal substrate (1), a cooling liquid (3) and a microwave absorbing material (2) arranged on the metal substrate (1), wherein the cooling liquid (3) is arranged inside the metal substrate (1) and cools the metal substrate (1), characterized in that: The invention also comprises a non-metallic sealing sleeve (4); the non-metallic sealing sleeve (4) is arranged on the metal substrate (1), and a sealing area (5) is formed between the non-metallic sealing sleeve (4) and the microwave absorbing material (2); the sealing area (5) is connected to the inside of the metal substrate (1), and the cooling liquid (3) flows inside the metal substrate (1) and in the sealing area (5) and directly contacts the microwave absorbing material (2); The non-metallic sealing sleeve (4) is made of Teflon, ceramic, quartz or sapphire; The cooling liquid (3) is water.

2. A composite microwave load according to claim 1, characterized in that: When the microwave load is a partially sealed waveguide load, both ends of the non-metallic sealing sleeve (4) are arranged on the metal substrate (1), and the microwave absorbing material (2) and the sealing area (5) are located between the non-metallic sealing sleeve (4) and the metal substrate (1).

3. A composite microwave load according to claim 1, characterized in that: When the microwave load is a partially sealed coaxial load, the metal substrate (1) comprises a coaxial outer conductor and a coaxial inner conductor; one end of the non-metallic sealing sleeve (4) is arranged on the coaxial outer conductor, and the other end of the non-metallic sealing sleeve (4) is arranged on the coaxial inner conductor or the coaxial outer conductor; and the microwave absorbing material (2) and the sealing area (5) are located between the non-metallic sealing sleeve (4) and the coaxial outer conductor.

4. A composite microwave load according to claim 1, characterized in that: When the microwave load is an integrally sealed waveguide load, the outer edges of the non-metallic sealing sleeve (4) are all arranged on the metal substrate (1); and the non-metallic sealing sleeve (4) completely covers the entire waveguide opening.

5. The composite microwave load according to claim 1, characterized in that: When the microwave load is an integrally sealed coaxial load, the metal substrate (1) comprises a coaxial outer conductor and a coaxial inner conductor; the non-metallic sealing sleeve (4) is arranged between the coaxial outer conductor and the coaxial inner conductor; the outer edge of the non-metallic sealing sleeve (4) is arranged on the coaxial outer conductor, and the inner edge of the non-metallic sealing sleeve (4) is arranged on the coaxial inner conductor; and the non-metallic sealing sleeve (4) completely covers the entire waveguide opening.

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