Sensor equipment

Abstract

The present invention relates to a sensor device, comprising a sensor circuit board, a first sensor component for detecting a first physical variable and a second sensor component for detecting capacitance, and a processing device for processing sensor signals of the first sensor component and the second sensor component, which are assigned to the sensor circuit board, and a sensor housing, the sensor housing having a recess in which the sensor circuit board is accommodated, wherein the second sensor component includes a conductive sensor plate, the sensor plate is accommodated in the recess and the sensor plate has a contact device with an elastically constructed contact spring, wherein the contact device is constructed to couple the sensor plate to the sensor circuit board in a force-fitting and conductive manner.

Description

Technical Field

[0001] The invention relates to a sensor device such as can be used, for example, to detect the position of a working piston along a cylinder axis of a pneumatic cylinder. Background Art

[0002] Such a sensor device is known, for example, from EP 2 002 221 B1. Summary of the invention

[0003] The object of the present invention is to provide a sensor device in which a user can directly influence the processing of sensor signals in the sensor device.

[0004] This object is achieved with a sensor device of the type mentioned at the outset having the features of claim 1. According to the invention, the sensor device comprises a sensor circuit board, to which a first sensor component for detecting a first physical variable and a second sensor component for detecting a capacitance as well as a processing device for processing sensor signals of the first sensor component and the second sensor component are assigned, and a sensor housing having a recess in which the sensor circuit board is accommodated, wherein the second sensor component comprises an electrically conductive sensor plate which is accommodated in the recess and which has a contact device with an elastically designed contact spring, wherein the contact device is designed for coupling the sensor plate to the sensor circuit board in a force-fitting and electrically conductive manner.

[0005] The first sensor component for detecting the first physical variable is a sensor component that determines the application purpose for the sensor device. Exemplarily, the first sensor component can be configured to detect magnetic flux density or magnetic field strength or temperature and provide an analog or digital sensor signal to a processing device, which is a component of the sensor device. Exemplarily, the processing device is configured as a microcontroller or microprocessor and processes the sensor signal of the first sensor component, in particular depending on user presets that can be input by means of the second sensor component.

[0006] For this purpose, the sensor device comprises a second sensor component, which is designed to detect capacitance in order to be able to detect the operator's operating intention without using moving parts such as micro-switching elements, by which the operating intention can cause a change in the processing of the sensor signal of the first sensor component in the processing device. The second sensor component determines the capacitance, which is generated between the operator and the sensor plate, which is electrically conductive and is associated with the second sensor component, when the sensor device is touched by the operator. The capacitance change that occurs here is converted by the second sensor component into a sensor signal, which is provided to the processing device and implements a predeterminable change in the processing of the sensor signal of the first sensor component there. Alternatively, it can also be provided that the second sensor component is at least almost completely, in particular completely, integrated in the processing device, so that the sensor plate can be directly electrically connected to the functional area of ​​the processing device that is configured as the second sensor component and the internal provision of the sensor signal of the second sensor component is carried out within the processing device.

[0007] Inputting the operating intention based on the detection of capacitance is advantageous because for this purpose it is only necessary for the operator, one of the users, to approach the sensor device, wherein the second sensor component does not require moving parts, which in turn would cause difficulties when sealing the sensor housing. More precisely, the conductively constructed sensor plate serves as a first capacitor plate or capacitor electrode, and the user forms the second capacitor plate or capacitor electrode of the capacitor. The capacitance of the capacitor depends in particular on the distance between the user and the sensor plate, and the sensor plate and the second sensor component are coordinated with each other as follows, for example, so that when the user is close enough to the sensor device, for example when the sensor device is touched with a finger, a switching signal is provided to the processing device.

[0008] In order to achieve an advantageous electromechanical connection between the sensor board and the sensor circuit board, the sensor board is provided with a contact device, which comprises an elastically designed contact spring, by means of which the sensor board can be electrically coupled to the sensor circuit board. Furthermore, the contact spring is accommodated on the sensor board in such a way that the sensor circuit board can be arranged between the contact spring and the area of ​​the sensor board, so that a force-fitting and electrically conductive coupling of the sensor circuit board and the contact device can be ensured.

[0009] Advantageous developments of the invention are the subject matter of the dependent claims.

[0010] The sensor plate is advantageously manufactured in particular as a plane-parallel plate made of an electrically conductive material, preferably metal, in particular tin bronze. The sensor plate can thereby advantageously fulfill its function as one of the two capacitor plates of a capacitor. It is preferably provided that the sensor plate is manufactured as a sheet metal component made of a metallic raw material, in particular tin bronze, and that the largest surfaces of the sensor plates are each flat and oriented parallel to one another.

[0011] Preferably, the contact device is designed in one piece with the sensor plate, in particular as a stamped and bent part. This ensures cost-effective production of the combination of sensor plate and contact device. Difficulties in contacting between the contact device and the sensor plate are avoided by the one-piece design. Preferably, the sensor plate and the contact device molded thereon are produced, for example, from a metallic strip material in a combined stamping and bending process and are completely produced during the stamping and bending process, so that the sensor plate is then ready for assembly on the sensor circuit board.

[0012] Advantageously, the contact spring has a J-shaped outer shape in an extension direction which is oriented parallel to the largest surface of the sensor plate, in particular parallel to the longest edge of the sensor plate. This ensures favorable elastic properties for the contact spring, wherein the contact spring rests with the free, curved end region against the surface of the sensor plate in an electrically conductive manner.

[0013] In another embodiment of the present invention, it is provided that the contact device includes two contact springs oriented in a mirror-symmetrical manner relative to each other, which limit the receiving area for the sensor circuit board, which is preferably designed as a plane-parallel plate, with a curved free end area. In this case, the two contact springs oriented in a mirror-symmetrical manner relative to each other ensure an advantageous, symmetrical force transmission between the contact device and the sensor circuit board. As a result, it is possible to dispense with other measures for a prescribed orientation of the sensor board relative to the sensor circuit board. By way of example, it is provided that the curved free end areas of the contact springs have a spacing relative to each other that is selected to be smaller than the thickness of the sensor circuit board in order to ensure a sufficient elastic deformation of the contact springs when the sensor board is mounted on the sensor circuit board, by means of which a permanent electrical connection between the sensor board and the sensor circuit board is ensured.

[0014] Preferably, the first sensor assembly comprises a sensor from the following group: a magnetic field sensor, an acceleration sensor, a brightness sensor, a temperature sensor, a pressure sensor, a flow sensor. Typically, the first sensor assembly comprises a magnetic field sensor, such as a Hall sensor or a Hall sensor assembly, by means of which the value of the magnetic field strength and / or the orientation of the magnetic flux relative to the sensor device can be determined. In addition or alternatively, the sensor assembly can also be equipped with other sensors in order to determine other physical parameters.

[0015] It is suitable that the processing device is configured to change the processing of the sensor signal of the first sensor component depending on the sensor signal of the second sensor component and / or the processing device includes the second sensor component. It can be set as an example that the second sensor signal is used to promote the calibration process for the first sensor component. It is set as an example that the sensor device is arranged at the pneumatic cylinder to determine the position of the working piston of the pneumatic cylinder. For the position determination, the calibration of the sensor device can be set in the following way, that is, for example, the working piston is brought to an extreme position and then the second sensor component generates the following signal by the user's finger close to the sensor board, and the signal is interpreted as a calibration signal by the processing device. It is supplemented or alternatively set that the second sensor component is configured as a component of the processing device. Exemplarily, the processing device is configured as a microprocessor, in which the processing of the sensor signal of the first sensor component is performed. In addition, the processing device includes the following functional area, which is configured to detect capacitance, so that, for example, it can be set that the sensor board is directly electrically connected to the functional area of ​​the processing device.

[0016] By inputting the user's wishes via the second sensor arrangement, the sensor device can be adjusted more comprehensively, in particular according to a predefinable menu structure. In this case, it is provided by way of example that the sensor device has at least one display device, in particular a light-emitting diode, by means of which the user can be informed of the position at which the user is currently located within the menu structure for inputting the operator's wishes.

[0017] In another embodiment of the present invention, it is provided that the sensor circuit board includes an electrically conductive, in particular tinned, contact surface for electrically conductively abutting against the contact spring. Typically, the sensor circuit board is designed as a printed circuit (printed circuit board), in which conductor tracks are constructed at least on the surface layer, in particular in a plurality of conductor layers separated layer by layer by insulating layers, in order to electrically connect the electrical and electronic components of the processing device to each other. One of the conductor tracks forms a contact surface for electrically conductively abutting against the contact spring and is electrically connected to the processing device in a suitable manner. Preferably, it is provided that the contact surface is tinned in order to promote a material-fit connection (soldering) between the sensor board and the contact surface of the sensor circuit board during a subsequent heating process after the sensor board is mounted on the sensor circuit board.

[0018] Advantageously, the sensor plate rests with its largest surface on the end face of the sensor circuit board, which is in particular electrically insulating, and the contact spring rests on the largest surface of the sensor circuit board. Furthermore, it can be provided that the largest surface of the sensor plate and the largest surface of the sensor circuit board are oriented transversely to one another and that the sensor plate is arranged in the sensor housing adjacent to the bottom region of the recess. This facilitates a compact arrangement of the sensor circuit board and the sensor plate in the sensor housing. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] An advantageous embodiment of the present invention is shown in the accompanying drawings.

[0020] Figure 1 A perspective diagram showing a sensor device;

[0021] Figure 2 Shown as a basis Figure 1 A perspective exploded illustration of the essential components of the sensor device of a sensor housing, a sensor printed circuit board and a sensor plate attached to the sensor printed circuit board;

[0022] Figure 3 Shown according to Figure 2 A schematic top view of a sensor board;

[0023] Figure 4 Show according to Figure 2 and 3 A schematic front view of a sensor board of FIG.

[0024] Figure 5 Show according to Figure 2 , 3 and a schematic perspective illustration of a sensor board 4 . DETAILED DESCRIPTION

[0025] exist Figure 1 and 2The sensor device 1 shown in the figure is designed purely by way of example as a so-called cylinder switching element, which can be used to detect the position of a piston of a pneumatic cylinder (not shown) and which can, for example, output an electrical switching signal as soon as the piston of the pneumatic cylinder has reached a position that can be preset along a linear movement path.

[0026] By way of example, the sensor device 1 comprises a substantially cuboid sensor housing 2 which is suitable for being mounted in a groove-shaped recess of a pneumatic cylinder. In order to ensure a reliable locking of the sensor device 1 on the pneumatic cylinder, a swivel locking element 3 is rotatably supported on the sensor housing 2, which can be Figure 1 and 2 The sensor device 1 can be pivoted between a rest position (shown in FIG. 1 ) and a locking position (not shown). By pivoting the locking element 3 , a force-fitting fixation of the sensor device 1 on the pneumatic cylinder can be achieved.

[0027] In order to actuate the swivel lock 3, it is provided with a hexagonal recess 4, which enables engagement of a hexagonal wrench (not shown) for inducing a swivel movement to the swivel angle 3. For this purpose, the swivel lock 3 is accommodated on the sensor housing 2 in such a way that the section of the swivel lock 3 provided with the recess 4 is accessible from the upper side 5 of the sensor housing 2, while the locking section 6 of the swivel lock 3 can be swung out of the recess 7 in the first side 8 of the sensor housing 2. Purely by way of example, the first side 8 as well as the front end face 9 and the second side 10 are each designed to be flat. Preferably, the second side 10 is penetrated by the same recess 7 as the first side 8, so that here too, the locking section (not shown) of the swivel lock 3 can be swung out.

[0028] The rear end face 11 of the sensor housing 2 is penetrated by a recess 12 which is designed to accommodate a kink protection element 15 which is itself provided for fastening to a Figure 1 The sensor cable 16 is only schematically shown in FIG.

[0029] The sensor cable 16 is constructed in a manner not shown in greater detail from a plurality of individual twisted wires which are designed to transmit electrical signals or electrical supply energy from or to the sensor device 1 and which are connected to the sensor device 1. Figure 2 The sensor circuit board 17 shown purely schematically in FIG.

[0030] The sensor circuit board 17 is designed, for example, as a layered structure (not shown in greater detail) consisting of a glass fiber reinforced carrier layer (e.g. FR 4) and an electrically conductive layer, in particular a copper layer. The sensor circuit board 17 serves to arrange electrical and electronic components (shown only schematically) which are electrically connected to one another via conductor track structures (not shown in greater detail) of the electrically conductive layers.

[0031] By way of example, a microprocessor 18, which can also be referred to as a processing device, an assembly of a magnetic field-sensitive Hall sensor 19 designed to determine the magnitude and direction of a magnetic field, and a circuit assembly 20 designed to detect a capacitance are arranged on the sensor circuit board 17. In this case, the Hall sensor 19 forms a first sensor assembly and the circuit assembly 20 forms a second sensor assembly.

[0032] The Hall sensor 19 and the circuit assembly 20 are connected to the microprocessor 18 via electrical conductor paths, not shown in greater detail, and each provide a sensor signal to the microprocessor 18. By way of example, the Hall sensor 19 serves to detect a magnetic flux, which is provided by a permanent magnet, not shown, which itself is fastened to a piston of a pneumatic cylinder, also not shown in greater detail.

[0033] In order to achieve the output of a switching signal by the sensor device at a point in time at which the piston assumes a position that can be predefined along the movement path, the sensor device 1 is programmed. The programming can be performed by an operator (not shown) who inputs an operating request to the sensor device 1 by touching the sensor device 1, which causes the desired programming of the sensor device 1.

[0034] The circuit assembly 20, also referred to as the second sensor assembly, is used together with the conductively configured sensor plate 21 to detect an operating intention, and the circuit assembly and the sensor plate together form a capacitive sensor that enables the detection of a capacitance. For this capacitive detection, it is assumed that the sensor plate 21 serves as a first capacitor plate or capacitor electrode of a capacitor and that a user, who can touch the sensor device 1 with a finger, for example, forms a second capacitor plate or capacitor electrode, which is separated from the sensor plate 21 by the sensor housing 2 serving as a dielectric. The circuit assembly 20 is designed to determine a change in the capacitance of the capacitor and, for example, to provide a switching signal to the microprocessor 18 when a predeterminable capacitance is reached or when a predeterminable capacitance change is exceeded.

[0035] In a variant of the sensor device 1 (not shown), it is provided that the second sensor component is designed as an integrated component of the microprocessor, so that the sensor board 21 can be directly connected to the microprocessor and communicate with the sensor board 21. Figure 2Unlike the illustration of , a separate circuit arrangement 20 , in particular one composed of discrete components, is not required.

[0036] In the construction of the sensor device 1, the sensor housing 2, which is preferably made of plastic, in particular by a plastic injection molding method, serves as a dielectric for a capacitor, thereby enabling detection of an operating intention without requiring movable parts, as would be provided, for example, when using a micro-switching element for inputting an operating intention.

[0037] More precisely, the sensor board 21 is accommodated together with the sensor circuit board 17 in a recess 22 of the sensor housing 2, wherein the sensor board 21 is arranged as close as possible to the upper side 5 of the sensor housing 2 within the recess 22. By way of example, it is provided that the recess 22 has a first shaft area 23 and a second shaft area 24, each of which is designed in a square shape and a receiving section 25 is formed between the two shaft areas 23 and 24 of the recess 22. The receiving section 25 has a smaller depth than the two shaft areas 23 and 24 and is provided with a plurality of guide tongues 28 each starting from a bottom area 26 and protruding symmetrically with respect to a symmetry plane 27.

[0038] The guide tongue 28 is used to guide the sensor circuit board 17, which is arranged according to Figure 2 The sensor circuit board 17 is designed as a plane-parallel plate and has a rectangular outer shape along an extension axis 29, which is oriented parallel to the plane of symmetry 27 and thus also parallel to the longest edge 30 of the sensor housing 2. The sensor circuit board 17 is provided locally with a recess 31, which has a U-shaped cross section when projected into the plane of symmetry 27 and which is matched to the outer shape of the receiving section 25.

[0039] The sensor plate 21 rests with its largest surface 33 on the end side 32 of the sensor circuit board 17 facing the upper side 5 of the sensor housing 2. It is provided that no electrically conductive structures of the sensor circuit board 17 are provided on the end side 32 in order to avoid undesired electrical contact of the sensor plate 21. Rather, the sensor plate 21 is electrically and mechanically coupled to the sensor circuit board 17 by means of a contact device 34. By way of example, the contact area 34 is arranged according to Figure 2 The illustration includes a contact spring 35 which is J-shaped along the extension axis 29 and is arranged exemplarily in a mirror-symmetrical manner relative to the symmetry plane 27, and which rests with a free end area 36 on a contact surface 37 of the sensor circuit board 17 in order to ensure the desired electrical connection and form-fitting coupling between the sensor plate 21 and the circuit component 20.

[0040] By way of example, the sensor plate 21 is manufactured as a stamped and bent part made of a metal strip, not shown in greater detail, in particular copper bronze. The spacing 38 of the free end regions 36 of the contact springs 35 is coordinated with the geometry and material strength of the contact springs 35 and the thickness 39 of the sensor circuit board 17 in such a way that, taking into account the tolerances that occur during the production of the sensor circuit board 17 and during the production of the sensor plate 21 and the contact device 34, a minimum deformation of the contact springs 35 always occurs when the sensor plate 21 is mounted on the sensor circuit board 17. This ensures a minimum force for a friction-locking connection between the contact device 34 and the sensor circuit board 17.

[0041] Purely by way of example, it is provided that the largest surface 33 of the sensor plate 21 is of substantially rectangular design, wherein the contact device 34 is arranged in the extension of the longest edge 40 of the sensor plate 21 and is connected to the sensor plate 21 via a connecting bridge 41. The width of the connecting bridge 41 is selected to be smaller than the width 42 of the sensor plate 21 in order to ensure, on the one hand, a stable mechanical connection of the contact device 34 to the sensor plate 21 and, on the other hand, to achieve a sufficient free length for the contact spring 35.

[0042] By way of example, it is provided that the largest surface 44 of the sensor printed circuit board 17 and the largest surface 33 of the sensor plate 21 are oriented at right angles to one another.

[0043] Furthermore, it is provided by way of example that contact spring 35 extends with its J-shaped shape in the direction of longest edge 40 of sensor plate 21 and that a maximum width 43 of contact device 34 is selected to be identical to width 42 of sensor plate 21 .

[0044] Furthermore, the following steps are provided for assembling the sensor device 1: providing the sensor circuit board 17 together with the sensor cable 16 connected thereto; sliding (pushing) the contact device 34 of the sensor board 21 onto the sensor circuit board 17, so that the contact spring 35 clamps the sensor circuit board 17 with a force fit and establishes an electrical contact between the contact surface 37 and the contact spring 35; inserting the sensor circuit board 17 with the sensor board 21 and the sensor cable 16 arranged therein into the recess 22 of the sensor housing 2, wherein the sensor circuit board 17 is correctly oriented in the recess 22 by the guide tongues 28 and the sensor board 21 is brought into contact directly adjacent to the upper side 5 of the sensor housing 2. The sensor device 1 is then placed in a plastic injection molding machine so that the kink protection element 15 is molded in the plastic injection molding process and the recess 22 is completely closed with plastic, so that the sensor device 1 is then constructed to be sealed and sealed.

[0045] For the start-up of the sensor device 1, it can be provided, for example, that the sensor cable 16 is electrically connected to an input connection of an evaluation device, which is also not shown, in a manner not shown in greater detail. It can also be provided that the sensor device 1 is mounted on the cylinder housing of a pneumatic cylinder, which is also not shown. After the electrical supply has been provided via the sensor cable 16 and the piston of the pneumatic cylinder, which is not shown, has been aligned in a preferred position, the operator can, by bringing his finger close to the upper side 5 of the sensor housing 2, cause a change in the capacitance of the capacitor formed by the operator and the sensor plate 21. This change in capacitance can be detected by means of a circuit assembly 20, which in turn can provide a switching signal to the microprocessor 18, in order to execute a programmed function, for example, for evaluating the sensor signal of the Hall sensor 19.

Claims

1. A sensor device (1), comprising a sensor circuit board (17), a first sensor component (19) for detecting a first physical variable and a second sensor component (20) for detecting capacitance, and a processing device (18) for processing sensor signals of the first sensor component (19) and the second sensor component (20), which is assigned to the sensor circuit board; and A sensor housing (2) is provided, the sensor housing having a recess (22), the sensor circuit board (17) being received in the recess, wherein: The second sensor component (20) comprises an electrically conductive sensor plate (21), which is accommodated in the recess (22) and has a contact device (34) with an elastically constructed contact spring (35), wherein the contact device (34) is designed to couple the sensor plate (21) to the sensor circuit board (17) in a force-fitting and electrically conductive manner, wherein the sensor plate (21) rests with its largest surface (33) against an end side (32) of the sensor circuit board (17) and the contact spring (35) rests against the largest surface (44) of the sensor circuit board (17).

2. The sensor device according to claim 1, characterized in that The sensor plate (21) is made of conductive material.

3. The sensor device according to claim 1 or 2, characterized in that The contact device (34) is designed integrally with the sensor plate (21).

4. The sensor device according to claim 1 or 2, characterized in that The contact spring (35) has a J-shaped outer shape in an extension direction (29) which is oriented parallel to the largest surface (33) of the sensor plate (21).

5. The sensor device according to claim 4, characterized in that The contact device (34) comprises two contact springs (35) oriented in mirror-symmetrical relation to one another, which contact springs delimit a receiving area for the sensor circuit board (17) with free end areas (36) of bent design.

6. The sensor device according to claim 1 or 2, characterized in that The first sensor assembly (18) comprises at least one sensor from the following group: a magnetic field sensor, an acceleration sensor, a brightness sensor, a temperature sensor, a pressure sensor, and a flow sensor.

7. The sensor device according to claim 1 or 2, characterized in that The processing device (18) is designed to change the processing of the sensor signal of the first sensor assembly (19) as a function of the sensor signal of the second sensor assembly (20) and / or the processing device comprises the second sensor assembly.

8. The sensor device according to claim 1 or 2, characterized in that The sensor circuit board (17) comprises an electrically conductive contact surface (37) for electrically conductive contact against the contact spring (35).

9. The sensor device according to claim 1, characterized in that The largest surface (33) of the sensor plate (21) and the largest surface (44) of the sensor circuit board (17) are oriented transversely to one another and the sensor plate (21) is arranged in the sensor housing (2) adjacent to a bottom region of the recess (22).

10. The sensor device according to claim 1, characterized in that The sensor plate (21) is a plane parallel plate.

11. The sensor device according to claim 2, characterized in that The sensor plate (21) is made of metal.

12. The sensor device according to claim 11, characterized in that The sensor plate (21) is made of tin bronze.

13. The sensor device according to claim 3, characterized in that The contact device (34) is designed as a stamped and bent part.

14. The sensor device according to claim 4, characterized in that The direction of extension (29) is oriented parallel to the longest edge (40) of the sensor plate (21).

15. The sensor device according to claim 5, characterized in that The sensor circuit board (17) is configured as a plane-parallel plate.

16. The sensor device according to claim 8, characterized in that The contact surface (37) is tin-plated.

17. The sensor device according to claim 1, characterized in that The end face (32) of the sensor printed circuit board (17) is designed to be electrically insulating.

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