Mobile Substrate Transfer Chamber

Abstract

A substrate processing tool includes: a plurality of processing modules configured to process semiconductor substrates. Each of the plurality of processing modules is arranged at a different position within the substrate processing tool. A vacuum transfer module (VTM) includes a robot and is configured to move between a plurality of different positions corresponding to the different positions within the substrate processing tool so that the robot can access corresponding processing modules of the plurality of processing modules.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims the benefit of U.S. Provisional Application No. 62 / 631,057, filed on February 15, 2018. The entire disclosure of the above-referenced application is incorporated herein by reference. Background Art

[0003] The background description provided here is for the purpose of generally presenting the context of the present disclosure. Work by the presently designated inventors to the extent described in this background section and in aspects of the description that could not be determined as prior art at the time of filing the application is neither explicitly nor implicitly admitted to be prior art against the present disclosure.

[0004] Substrate processing systems can be used to perform deposition, etching, and / or other processing on substrates such as semiconductor wafers. During processing, the substrate is arranged on a substrate support in a processing chamber of the substrate processing system. A gas mixture containing one or more precursors is introduced into the processing chamber, and a plasma can be energized to activate a chemical reaction.

[0005] The substrate processing system may include a plurality of substrate processing tools arranged in a manufacturing chamber. Each substrate processing tool may include a plurality of processing modules. Typically, the substrate processing tool may include 4, 5 or 6 processing modules clustered around a vacuum transfer module in a radial arrangement (i.e., in a radial cluster). Summary of the invention

[0006] A substrate processing tool includes: a plurality of processing modules configured to process semiconductor substrates. Each of the plurality of processing modules is arranged at a different position within the substrate processing tool. A vacuum transfer module (VTM) includes a robot and is configured to move between a plurality of different positions corresponding to the different positions within the substrate processing tool so that the robot can access corresponding processing modules of the plurality of processing modules.

[0007] In other features, the plurality of processing modules are aligned in a first linear direction on either side of a first linear axis of the substrate processing tool, and the VTM is configured to move in the first linear direction. The VTM includes at least one opening, the at least one opening being configured to align with the plurality of processing modules on either side of the substrate processing tool. The at least one opening includes a plurality of openings, each of the plurality of openings facing a corresponding processing module in the plurality of processing modules. The VTM is configured to be rotatable to align the at least one opening with a corresponding processing module in the plurality of processing modules. The at least one opening is a gate valve. The gate valve includes a port and a vacuum seal. The substrate processing tool also includes a vacuum pump, the vacuum pump being configured to evacuate a transfer volume space between the gate valve and a corresponding processing module in the plurality of processing modules.

[0008] In other features, the VTM is configured to move in a first linear direction along a first axis of the substrate processing tool and in a second linear direction along a second axis of the substrate processing tool that is perpendicular to the first axis. The VTM is configured to be raised and lowered in a vertical direction relative to the plurality of process modules. The substrate processing tool also includes a linear actuator configured to raise and lower the VTM.

[0009] In other features, the VTM corresponds to a first VTM, and the substrate processing tool further includes a second VTM, the second VTM being configured to move between the plurality of different positions. The first VTM and the second VTM are each configured to access each of the plurality of processing modules. The first VTM is configured to access a first group of the plurality of processing modules, and the second VTM is configured to access a second group of the plurality of processing modules. The first VTM and the second VTM are each configured to sequentially access the plurality of processing modules in a clockwise or counterclockwise manner.

[0010] In other features, the second VTM is configured to be raised and lowered in a vertical direction. The second VTM is raised, and the second VTM is configured to move above and past the first VTM. A system includes the substrate processing tool and also includes a controller configured to move the VTM between the different positions.

[0011] Further scope of applicability of the present disclosure will become apparent from the detailed description, claims and drawings.The detailed description and specific examples are intended for purposes of illustration only and are not intended to limit the scope of the disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The present disclosure will be more fully understood from the detailed description and accompanying drawings, in which:

[0013] Figure 1A is a plan view of an exemplary substrate processing tool;

[0014] Figure 1B is a plan view of another exemplary substrate processing tool;

[0015] Figure 2A is a plan view of an exemplary substrate processing tool according to the present disclosure;

[0016] Figure 2B yes Figure 2A A side view of an exemplary substrate processing tool of;

[0017] Figure 3A is a plan view of another exemplary substrate processing tool according to the present disclosure;

[0018] Figure 3B yes Figure 3A A side view of an exemplary substrate processing tool of;

[0019] Figure 4A is a plan view of another exemplary substrate processing tool according to the present disclosure;

[0020] Figure 4B yes Figure 4A A side view of an exemplary substrate processing tool of;

[0021] Figure 5A is a plan view of another exemplary substrate processing tool according to the present disclosure; and

[0022] Figure 5B is a side view of an exemplary arrangement of a vacuum transfer module according to the present disclosure.

[0023] Among the drawings, reference numerals may be repeated to identify similar and / or identical elements. DETAILED DESCRIPTION

[0024] The number, location, etc. of substrate processing tools within a fabrication chamber may be limited by the size of the substrate processing tools and their respective configurations. Thus, the configuration of the substrate processing tools defines the tool footprint, spacing, and / or spacing, which further defines the tool density of the fabrication chamber. Tool density may refer to the number of substrate processing tools and / or processing modules per unit fabrication chamber area.

[0025] Various substrate processing tool configurations may be implemented to maximize substrate processing tool density. For example, in plan view, substrate manufacturing compartments in a manufacturing chamber have a square or rectangular shape, while substrate processing tools with a radial cluster arrangement have a generally circular shape. The area defined between the manufacturing chamber wall and the outer diameter of the substrate processing tool constitutes unused (and therefore wasted) space. Therefore, in a radial cluster implementation (i.e., configuration), as the number of processing modules per tool increases, the efficient use of space in the manufacturing chamber may decrease.

[0026] In addition, increasing the number of processing modules per tool in a radial cluster implementation requires larger chambers (e.g., vacuum transfer modules), larger and / or additional transfer robots, etc. For example, an equipment front end module (EFEM) of a substrate processing tool may include one or more transfer robots for transferring substrates between the EFEM and a load lock disposed between the EFEM and a vacuum transfer module (VTM). The VTM includes one or more transfer robots for transferring substrates between the EFEM and the processing modules. Increasing the number and / or range of motion of these robots may result in lower accuracy and repeatability.

[0027] In another example, the substrate processing tool can have a linear implementation. In a linear implementation, the VTM can be rectangular and multiple processing modules are arranged on each longitudinal side of the VTM. However, in a linear implementation, the substrate is transported a greater distance (e.g., relative to a radial cluster implementation) from the EFEM through the VTM and to the processing module. Therefore, a linear implementation may require, for example, multiple transfer robots, thereby increasing cost and VTM volume. Other examples may use a movable transfer robot (e.g., in a linear direction). However, a movable robot may increase particle generation, cables, vacuum lines, etc.

[0028] Systems and methods according to the principles of the present disclosure include linear implementations and a movable VTM (MVTM). The movable VTM is configured to move between components of a substrate processing tool. For example, the VTM can be moved to align the VTM with an air lock (i.e., a load lock) of an EFEM to transfer substrates to and from the EFEM, and then to align with a corresponding process module to transfer substrates to and from the process module.

[0029] Therefore, various cost and operational benefits are provided compared to existing radial cluster and linear implementations. For example, since only a single simplified manipulator can be used to access multiple processing modules, the costs, services, and particle generation associated with multiple manipulators are reduced. Since the VTM has minimal openings and associated seals compared to large VTMs, faults such as leaks are significantly easier to diagnose and repair. The overall size of the VTM is also reduced, and the reinforcement components associated with large VTMs can also be reduced to minimize deflection under vacuum. In addition, the costs associated with the manufacture and design of the VTM are independent of the processing module spacing of a particular tool. Therefore, the same VTM can be configured for use with processing modules having different corresponding spacings. Therefore, scalability and flexibility are improved. For example, if the VTM is damaged or requires repair, the VTM can be replaced with a replacement VTM with minimal work and / or minimal disassembly of the substrate processing tool. Similarly, the VTM, load lock, and slot valve of the substrate processing tool are more accessible for cleaning and regular maintenance.

[0030] In contrast to existing radial cluster implementations (which include one or more robots configured to access multiple process modules from a given location), the VTM of the present disclosure need only be configured to access a single process module at any given time. As a result, the length of the robot arm / segment (and therefore the overall footprint of the VTM and substrate processing tool) can be reduced. In addition, the height of the robot and VTM can be reduced, and the volume occupied by the support components below the VTM can be minimized, thereby facilitating access to the process modules for maintenance.

[0031] In contrast, the manipulator corresponds to the only moving part of the VTM of the present disclosure, as opposed to existing linear implementations, thereby minimizing particle generation. In addition, scalability is improved because the number of processing modules is independent of the pitch, and additional processing modules can be added to the tool without major modifications. The cost increase is limited to the cost of adding a single processing module, and maintenance and repair time is reduced because the surface area of ​​the VTM is reduced.

[0032] In one example, the VTM can be moved along a first axis (e.g., a Y-axis aligned with the longitudinal axis of the tool in a linear solid line manner) to align the VTM with the EFEM or a corresponding processing module, and moved along a second axis (e.g., an X-axis perpendicular to the Y-axis) to engage the VTM with the processing module. In this example, the VTM can include multiple openings or valves (e.g., a first valve on the side of the VTM facing the EFEM, a second valve on the second side of the VTM facing the processing module on one side of the VTM, a valve on a third side of the VTM facing the processing module on the opposite side of the VTM, etc.). In some examples, the VTM can include a fourth valve on a fourth side of the VTM opposite the EFEM.

[0033] In another example, the VTM can be configured to rotate. In this example, the VTM can include only a single valve, and the VTM can be rotated to align the valve with the EFEM, the processing modules on both sides of the VTM, and the like. In another example, the VTM can be configured to move only in the Y-axis. In this example, the valve includes a pressurized O-ring or other seal that is inflated to seal the VTM to the processing module. In another example, the VTM can move along the Y-axis in a plane above or below the corresponding valve of the processing module. In this example, the VTM can move along the Y-axis to align the VTM with the processing module, and then rise upward (or lower downward) to align the valve of the VTM with the valve of the processing module.

[0034] Figure 1A and 1B Example linear configurations 100-1 and 100-2 are shown, including respective substrate processing tools 104-1 and 104-2 having a plurality of process modules 108. Figure 1A , a substrate processing tool 104 includes a linear VTM 112 and a single robot 116 configured to transfer substrates between an EFEM 120 and a process module 108 (e.g., via a load lock 124). Although shown with six process modules 108 (e.g., three on each side of the VTM 112), the tool 104 may include fewer (e.g., four) or more (e.g., eight, ten, etc.) process modules 108. For example, the length of the VTM 112 may be extended to accommodate additional process modules 108. In some examples, the tool 104 may include one or more process modules 108 at an end 128 of the VTM 112. Thus, the robot 116 is configured to access each of the load locks 124 and the process modules 108. For example, the robot 116 may include additional and / or extended arm sections 132 to increase the range of motion of the robot 116.

[0035] In such Figure 1B In the embodiment, the VTM 112 includes a plurality of manipulators 116 (rather than Figure 1A104-2). For example, tool 104-2 includes three robots 116. Thus, in this example, each robot 116 is positioned to access a corresponding pair of processing modules 108. In some examples, VTM 112 may include one or more storage buffers 136 configured to store one or more substrates between processing stages. In some examples, storage buffers 140 may be located within VTM 112. In some examples, one or more of storage buffers 136 may be replaced by a processing module or other component.

[0036] Now refer to Figure 2A and Figure 2B , an exemplary substrate processing tool 200 is shown (in plan view and side view, respectively) in accordance with the principles of the present disclosure, including a plurality of process modules 204 in a linear configuration. The positions of the process modules 204 may be maintained in the linear configuration using a structure such as a rack or frame 206. The substrate processing tool 200 includes a movable VTM 208 and a robot configured to transfer wafers between an EFEM 216 and the process modules 204 (e.g., via a load lock 220). Although shown as having seven process modules 204 (e.g., three on each side of the tool 200 and one at an end 224 of the tool 200 opposite an end 228 corresponding to the EFEM 216), the tool 200 may include fewer (e.g., four) or more (e.g., eight, nine, ten, etc.) process modules 204.

[0037] The VTM 208 is configured to move along the Y-axis between the EFEM 216 at the end 228 of the tool 200 and the end 224 of the tool 200. In particular, the position of the VTM 208 is adjusted to align the doors / ports (e.g., gate valves) 232 and corresponding gate valves 236 on the process modules 204 and the load lock 220. As shown, the VTM 208 includes four gate valves 232. In this example, the VTM 208 is further configured to move along the X-axis. For example, the position of the VTM 208 is adjusted along the Y-axis to align the gate valves 232 on the VTM 208 with the gate valves 236 on the process modules 204 on each side of the tool 200. The position of the VTM 208 is then adjusted along the X-axis (e.g., as Figure 2A and Figure 2B The robot 212 is configured to access the load lock 220 and each process module 204 through the corresponding gate valves 232 and 236. In some examples, the robot 212 may include additional or fewer arm sections to optimize the range of motion of the robot 212.

[0038] For example, each of the gate valves 232 and 236 may include a port 240 and a vacuum seal 244. When the VTM 208 is positioned along the X-axis so that the gate valve 232 engages the gate valve 236, the corresponding vacuum seal 244 forms a seal of the volume space (i.e., the transfer volume space) between the ports 240. For example, the movement of the VTM 208 along the X-axis toward the processing module 204 causes the various vacuum seals 244 to compress against each other. In one example, the transfer volume space can then be evacuated to a desired pressure (e.g., a stable vacuum transfer pressure). For example, the transfer volume space can be connected to a vacuum pump (schematically shown at 246) that is configured to evacuate the transfer volume space to a desired pressure before opening the gate valves 232 and 236. The gate valves 232 and 236 (i.e., the corresponding ports 240) can then be opened to transfer the substrate between the VTM 208 and the processing module 204 and / or the load lock 220 using the robot 212.

[0039] In other examples, the transfer volume space between the ports 240 and / or the VTM 208 itself may not be connected to a vacuum pump. For example, when the VTM 208 engages with a load lock 220, one of the process modules 204, etc., a vacuum may be initially established within the VTM 208 because the load lock 220 and the process module 204 are maintained at a vacuum pressure. Thus, when the VTM 208 subsequently engages with one of the process modules 204, the vacuum seal 244 enables the vacuum within the VTM 208 to be maintained when the gate valves 232 and 236 are opened to transfer a substrate. Thus, even if the vacuum environment of the VTM 208 is broken during interaction with one of the process modules 204 and / or the load lock 220, the vacuum will be reestablished during the next interaction with another of the process modules 204, the load lock 220, etc.

[0040] After the substrate is transferred, the corresponding port 240 is closed and the transfer volume space can be vented to the atmosphere. The VTM 208 can be repositioned along the X-axis (e.g., away from the process module 204 and re-centered relative to the tool 200 for transportation along the Y-axis (e.g., to reach the next one of the process modules 204)). For example, the VTM 208 can be configured to store multiple substrates (e.g., on a shelf, on a buffer, etc., such as on a storage buffer 248).

[0041] In another example, the VTM 208 can be configured to move only along the Y axis. In this example, the vacuum seals 244 of the gate valves 232 and / or 236 can correspond to pressurized O-rings or other seals. Thus, rather than repositioning the VTM 208 along the X axis to seal the transfer volume, the vacuum seals 244 can be selectively pressurized (e.g., inflated) to press the vacuum seals 244 on the VTM 208 against the vacuum seals 244 on the process module 204. By way of example only, Figure 2B The inset of shows the vacuum seal 244 before inflation at 244 - 1 and after inflation at 244 - 2 .

[0042] In some examples, the area above the processing module 204 and the VTM 208 (e.g., the atmospheric area) can be filtered to prevent particle accumulation. In this way, contamination of the transfer volume space can be minimized. In one example, a single fan / filter unit can provide filtering. In other examples, multiple fan / filter units can be provided (e.g., above each transfer volume space, a corresponding fan / filter unit mounted on the VTM 208).

[0043] A controller, such as system controller 252, may be provided to control VTM 208. For example, system controller 252 may be configured to control the movement of VTM 208, the opening and closing of gate valves 232 and 236, robot 212, and the like.

[0044] The VTM 208 can be configured to move using any suitable mechanism. For example, the VTM 208 can be mounted on a platform 256 that is arranged to move along tracks (e.g., in a cross roller slide arrangement) 260 and 264 on the Y axis. A similar mechanism 268 can be mounted on the platform 256 to provide movement along the X axis.

[0045] Reference now Figure 3A and 3B, (in plan view and side view, respectively) show another exemplary substrate processing tool 300 according to the principles of the present disclosure. In this example, the VTM 208 may not be configured to move along the X-axis. Instead, the VTM 208 is configured to move up and down along the Z-axis. For example, the VTM 208 can be mounted on a mechanism 304 that is configured to raise and lower the VTM 208, such as a linear actuator (as shown), a robotic arm, etc. In this way, the VTM 208 can be moved along the Y-axis in a plane below or above the gate valve 236, and then raised (or lowered) to align the gate valve 232 with the gate valve 236. Raising or lowering the VTM 208 causes the corresponding vacuum seals 244 to contact and compress each other. Therefore, there is no need to move along the X-axis to seal the transfer volume space. In this example, the vacuum seal 244 can be such as Figure 2A and 2B Pressurized / inflatable as described in to improve sealing of the transfer volume space.

[0046] Reference now Figure 4A and Figure 4B , (in plan view and side view, respectively) show another exemplary substrate processing tool 400 according to the principles of the present disclosure. In this example, the VTM 208 may not include gate valves 232 on each side of the VTM 208. Instead, the VTM 208 may include fewer (e.g., only one) gate valves 232 and be configured to rotate to align the gate valve 232 with a selected one of the process modules 204, the load lock 220, etc. For example, the VTM 208 may be mounted on a rotating mechanism 404 configured to rotate the VTM 208. In this way, three of the four gate valves 232 may be eliminated. In this example, the VTM 208 can be moved along the X-axis, such as in Figure 2A and 2B As described in the examples above, the vacuum seal 244 may be configured to be pressurized / inflatable and the VTM 208 may be configured to be Figure 3A and 3B In some examples, the corners of VTM 208 may be angled / chamfered as shown to facilitate rotation.

[0047] The movable VTM according to the principles of the present disclosure may be implemented in other exemplary substrate processing tools in different configurations and arrangements. Figure 5AAs shown, an exemplary substrate processing tool 500 may include more than two VTMs 504. In this example, each VTM 504 may be configured to move along a first axis (e.g., on a track arranged parallel to a Y axis aligned with the longitudinal axis of the implementation of the tool) and move along a second axis (e.g., on a rail aligned parallel to an X axis perpendicular to the Y axis). In this manner, each VTM 504 may be moved to access a processing module 508 on a first side of the substrate processing tool 500 or a processing module 512 on a second side of the substrate processing tool 500. In other examples, rather than separate sets of vertical rails, the substrate processing tool 500 may include a single set of rails (rales) that are circular or elliptical. In some examples, each VTM 504 may be controlled to sequentially access processing modules 508 and 512 in a clockwise or counterclockwise direction. In another example, one of the VTMs 504 may be controlled to access only the processing modules 508 on a first side of the substrate processing tool 500, while another of the VTMs 504 may be controlled to access only the processing modules 512 on a second side of the substrate processing tool 500. In yet another example, one of the VTMs 504 may be dedicated to transporting only processed substrates, while another of the VTMs 504 may be dedicated to transporting only unprocessed substrates.

[0048] In such Figure 5B In another example shown in the side view in FIG. 5 , in a substrate processing tool including two VTMs 520 and 524, one or more of the VTMs 524 may be configured to communicate with Figure 3A and 3B The example shown similarly raises and lowers. Thus, VTM 524 can be raised above VTM 520 so that VTM 520 and 524 pass over / under each other when moving in the Y direction.

[0049] The foregoing description is merely illustrative in nature and is by no means intended to limit the present disclosure, its application or use. The broad teachings of the present disclosure can be implemented in various forms. Therefore, although the present disclosure includes specific examples, the true scope of the present disclosure should not be so limited, because when studying the drawings, the specification and the appended claims, other modifications will become apparent. It should be understood that one or more steps in the method can be performed in different orders (or simultaneously) without changing the principles of the present disclosure. In addition, although each embodiment is described above as having certain features, any one or more of those features described relative to any embodiment of the present disclosure can be implemented in the features of any other embodiment and / or combined with the features of any other embodiment, even if the combination is not explicitly described. In other words, the described embodiments are not mutually exclusive, and the replacement of one or more embodiments with each other remains within the scope of the present disclosure.

[0050] Various terms are used to describe the spatial and functional relationships between elements (e.g., between modules, between circuit elements, between semiconductor layers, etc.), including "connected," "engaged," "coupled," "adjacent," "next to," "on top of," "above," "below," and "disposed." Unless the relationship between a first and a second element is explicitly described as "direct," when such a relationship is described in the above disclosure, the relationship can be a direct relationship, in which there are no other intervening elements between the first and second elements, but can also be an indirect relationship, in which there are one or more intervening elements (spatially or functionally) between the first and second elements. As used herein, the phrase "at least one of A, B, and C" should be interpreted to mean a logical (A or B or C), using a non-exclusive logical OR, and should not be interpreted to mean "at least one of A, at least one of B, and at least one of C."

[0051] In some implementations, the controller is part of a system, which can be part of the above examples. Such a system can include a semiconductor processing device, which includes one or more processing tools, one or more chambers, one or more platforms for processing, and / or specific processing components (wafer pedestals, gas flow systems, etc.). These systems can be integrated with electronic devices for controlling their operations before, during, and after the processing of semiconductor wafers or substrates. The electronic device can be referred to as a "controller", which can control various components or subcomponents of one or more systems. Depending on the processing requirements and / or system type, the controller can be programmed to control any process disclosed herein, including the delivery of process gases, temperature settings (e.g., heating and / or cooling), pressure settings, vacuum settings, power settings, radio frequency (RF) generator settings, RF matching circuit settings, frequency settings, flow rate settings, fluid delivery settings, position and operation settings, wafer transfer in and out of tools and other transfer tools and / or load locks connected to or connected to a specific system through an interface.

[0052] In general, a controller can be defined as an electronic device having various integrated circuits, logic, memory, and / or software that receive instructions, issue instructions, control operations, enable cleaning operations, enable endpoint measurements, etc. The integrated circuit can include a chip in the form of firmware that stores program instructions, a digital signal processor (DSP), a chip defined as an application specific integrated circuit (ASIC), and / or one or more microprocessors, or a microcontroller that executes program instructions (e.g., software). The program instructions can be instructions sent to the controller in the form of various individual settings (or program files) that define operating parameters for performing a specific process on or for a semiconductor wafer or system. In some embodiments, the operating parameters can be part of a recipe defined by a process engineer to complete one or more processing steps during the manufacture of one or more (kinds of) layers, materials, metals, oxides, silicon, silicon dioxide, surfaces, circuits, and / or dies of a wafer.

[0053] In some implementations, the controller may be part of or coupled to a computer that is integrated with the system, coupled to the system, otherwise networked to the system, or a combination thereof. For example, the controller may be in the "cloud" or all or part of a wafer fab host system that may allow remote access to wafer processing. The computer may enable remote access to the system to monitor the current progress of a manufacturing operation, check the history of past manufacturing operations, check trends or performance criteria for multiple manufacturing operations, change parameters of a current process, set processing steps to follow the current process, or start a new process. In some examples, a remote computer (e.g., a server) may provide a process recipe to the system via a network (which may include a local network or the Internet). The remote computer may include a user interface that enables input or programming of parameters and / or settings, which are then sent from the remote computer to the system. In some examples, the controller receives instructions in the form of data that specify parameters for each processing step to be performed during one or more operations. It should be understood that the parameters may be specific to the type of process to be performed and the type of tool that the controller is configured to interface with or control. Thus, as described above, the controller may be distributed, for example, by including one or more discrete controllers networked together and working toward a common purpose (e.g., the processes and controls described herein). An example of a distributed controller for such a purpose is one or more integrated circuits on a chamber that communicate with one or more integrated circuits remotely (e.g., at a platform level or as part of a remote computer), which combine to control the processes performed on the chamber.

[0054] Example systems may include, but are not limited to, plasma etch chambers or modules, deposition chambers or modules, spin rinse chambers or modules, metal plating chambers or modules, cleaning chambers or modules, chamfer edge etch chambers or modules, physical vapor deposition (PVD) chambers or modules, chemical vapor deposition (CVD) chambers or modules, atomic layer deposition (ALD) chambers or modules, atomic layer etch (ALE) chambers or modules, ion implantation chambers or modules, track chambers or modules, and any other semiconductor processing system that may be associated with or used in the manufacture and / or preparation of semiconductor wafers.

[0055] As described above, depending on one or more processing steps to be performed by the tool, the controller can communicate with one or more other tool circuits or modules, other tool components, cluster tools, other tool interfaces, adjacent tools, neighboring tools, tools located throughout the factory, a host computer, another controller, or tools used in material transport to transport wafer containers to and from tool locations and / or load ports in a semiconductor manufacturing facility.

Claims

1. A substrate processing tool comprising: a plurality of processing modules configured to process a semiconductor substrate, wherein each of the plurality of processing modules is arranged at a different location within the substrate processing tool; and a vacuum transfer module (VTM) comprising a robot, wherein the VTM is a chamber defining an interior volume, the robot is disposed in the interior volume of the VTM, and the VTM is configured to maintain a vacuum within the interior volume, wherein the VTM is configured to move between a plurality of different positions corresponding to the different positions within the substrate processing tool so that the robot can access corresponding processing modules among the plurality of processing modules; and Wherein, the VTM is configured to be raised and lowered in a vertical direction relative to the plurality of processing modules.

2. The substrate processing tool of claim 1, wherein: The plurality of process modules are aligned in a first linear direction on either side of a first linear axis of the substrate processing tool, and the VTM is configured to move in the first linear direction.

3. The substrate processing tool of claim 1, wherein: The VTM includes at least one opening configured to align with the plurality of process modules on either side of the substrate processing tool.

4. The substrate processing tool of claim 3, wherein: The at least one opening includes a plurality of openings, each of the plurality of openings facing a corresponding process module of the plurality of process modules.

5. The substrate processing tool of claim 3, wherein: The at least one opening is a gate valve.

6. The substrate processing tool of claim 5, wherein: The gate valve includes a port and a vacuum seal.

7. The substrate processing tool of claim 5, further comprising a vacuum pump configured to evacuate a transfer volume between the gate valve and a corresponding process module of the plurality of process modules.

8. The substrate processing tool of claim 1, wherein: The VTM is configured to move in a first linear direction along a first axis of the substrate processing tool and in a second linear direction along a second axis of the substrate processing tool that is perpendicular to the first axis.

9. The substrate processing tool of claim 1, further comprising a linear actuator configured to raise and lower the VTM.

10. The substrate processing tool of claim 1, wherein: The VTM corresponds to the first VTM and further includes a second VTM configured to move between the plurality of different locations.

11. The substrate processing tool of claim 10, wherein: The first VTM and the second VTM are each configured to access each of the plurality of processing modules.

12. The substrate processing tool of claim 10, wherein: The first VTM is configured to access a first group of the plurality of processing modules, and the second VTM is configured to access a second group of the plurality of processing modules.

13. The substrate processing tool of claim 10, wherein: The second VTM is configured to be raised and lowered in a vertical direction.

14. The substrate processing tool of claim 13, wherein: When the second VTM is raised, the second VTM is configured to move over and past the first VTM.

15. A substrate processing tool comprising: a plurality of processing modules configured to process a semiconductor substrate, wherein each of the plurality of processing modules is arranged at a different location within the substrate processing tool; and a vacuum transfer module (VTM) comprising a robot, wherein the VTM is a chamber defining an interior volume, the robot is disposed in the interior volume of the VTM, and the VTM is configured to maintain a vacuum within the interior volume, wherein the VTM is configured to move between a plurality of different positions corresponding to the different positions within the substrate processing tool so that the robot can access corresponding processing modules among the plurality of processing modules, wherein the VTM includes at least one opening configured to align with a plurality of process modules on either side of a substrate processing tool, and Wherein, the VTM is configured to be rotatable to align the at least one opening with a corresponding process module among the plurality of process modules.

16. The substrate processing tool of claim 15, wherein the VTM corresponds to a first VTM and further comprising a second VTM configured to move between the plurality of different positions, and in, The first VTM and the second VTM are both configured to sequentially access the plurality of processing modules in a clockwise or counterclockwise manner.

17. A substrate processing system comprising the substrate processing tool of claim 1 and further comprising a controller configured to move the VTM between the different positions.

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