Capillary structure of temperature averaging plate and temperature averaging plate

Abstract

The present invention provides a capillary structure of a temperature averaging plate and the temperature averaging plate. The capillary structure of the temperature averaging plate comprises: a sintered body having a plurality of through holes and a plurality of extension parts extending integrally from one side of the sintered body and arranged in an interval or non-interval arrangement to support the sintered body; the temperature averaging plate comprises a first plate body and a second plate body which are correspondingly covered; wherein the second plate body has a heating zone and a first capillary structure, the sintered body is correspondingly arranged in the heating zone and is framed (stacked) with the first capillary structure, and a distance is generated between the sintered body and the first capillary structure through the extension part.

Description

Technical Field

[0001] The present invention relates to a capillary structure of a temperature averaging board and the temperature averaging board, and in particular to a capillary structure of a temperature averaging board and the temperature averaging board which can improve the thermal impedance caused by the over-thick or multi-layered capillary structure. Background Art

[0002] A temperature vapor chamber is a heat conducting element commonly used for heat conduction. The temperature vapor chamber has a vacuum airtight chamber inside, and a capillary structure is set on the wall of the vacuum airtight chamber and filled with working liquid to conduct heat through vapor-liquid circulation.

[0003] The outer side of the temperature equalizer plate is in contact with at least one heat source for heat conduction, and the heat of the heat source is absorbed by the side and then directly conducted to the vacuum airtight chamber (evaporation area) inside the temperature equalizer plate, and the working liquid evaporates and diffuses to the other side (condensation area) for condensation and then refluxes for continuous circulation. The side of the airtight chamber corresponding to the heat source must be rich in sufficient working liquid to prevent dry burning. The water content of the evaporation area needs to be increased. The prior art increases the thickness of the capillary structure or uses multiple layers of capillary structures overlapped with each other, so that the water content of the working liquid in the evaporation area can be increased, thereby preventing dry burning.

[0004] However, although the thickened capillary structure and the capillary structure used in the multi-layer stacking arrangement can greatly increase the water content in the evaporation area, it also causes the mesh and / or pores of the overly thick or multi-layered capillary structure to be blocked or narrowed due to the thickening or compression of the multiple thickened or layered capillary structures, so that when the working liquid is heated and evaporates in the evaporation area, thermal impedance is formed. Although the multiple thickened or multi-layered capillary structure can have a water content of

[0005] A large amount of working fluid contains water, but the multiple thickened and / or multi-layered capillary structures form vapor blockage, which makes it impossible for the working liquid in the evaporation area to diffuse after evaporation, thereby locking the heat in the evaporation area, and stopping the vapor-liquid circulation. The temperature equalizer will no longer provide heat conduction, so how to improve the existing deficiencies is the primary goal of people in this field. Summary of the invention

[0006] Therefore, in order to effectively solve the above-mentioned problems, the main purpose of the present invention is to provide a capillary structure of a temperature vaporizer that can not only increase the water content of the evaporation area of ​​the temperature vaporizer, but also solve the problem of thermal impedance after the multi-layer capillary structure is stacked, and a temperature vaporizer having such a capillary structure.

[0007] To achieve the above object, the technical solution adopted by the present invention is:

[0008] A capillary structure of a temperature equalizing plate, characterized by comprising:

[0009] A sintered body has a plurality of through holes and a plurality of extension parts formed by integrally extending from one side of the body. The plurality of extension parts are arranged at intervals and support the sintered body.

[0010] The capillary structure of the temperature homogenizing plate is characterized in that the plurality of through holes of the sintered body penetrates two sides of the sintered body, and a channel is formed between every two adjacent extension parts along the horizontal direction.

[0011] The capillary structure of the temperature equalizing plate, wherein the sintered body and the extension portion are integrally formed by sintering powder.

[0012] The capillary structure of the temperature equalizing plate is characterized in that a side of the sintered body opposite to the extension portion is extended to form a plurality of supporting portions, and the plurality of extending portions, the plurality of supporting portions and the plurality of through holes are staggered.

[0013] A temperature homogenizing plate, characterized by comprising:

[0014] A first plate having a first side and a second side;

[0015] A second plate body having a third side and a fourth side, wherein the first plate body and the second plate body are correspondingly covered to define an airtight chamber filled with a working liquid, and the third side has a first capillary structure and a heating area;

[0016] A sintered body has a plurality of through holes and a plurality of extensions formed by integrally extending from one side of the body. The plurality of extensions are arranged at intervals and support the sintered body. The sintered body and the first capillary structure are stacked, and a distance is formed between the sintered body and the first capillary structure.

[0017] The temperature equalizing plate, wherein the first capillary structure is any one of a grid body, a fiber body, a woven body, a groove, and a sintered powder.

[0018] The temperature homogenizing plate, wherein the heated area is formed by the third side of the second plate body convexly extending toward the fourth side and forming a concave shape on the third side, the first capillary structure is arranged on the surface of the concave shape, and the extension portion of the sintered body is connected to the first capillary structure.

[0019] The temperature homogenizing plate further comprises a plurality of support columns, which penetrate the sintered body, and the two ends of the plurality of support columns are connected to the second side of the first plate body and the third side of the second plate body.

[0020] The temperature homogenizing plate, wherein a channel is formed between every two adjacent extension portions.

[0021] The temperature equalizing plate, wherein the side of the sintered body opposite to the aforementioned extension portion extends to form a plurality of supporting portions, the plurality of extension portions, the plurality of supporting portions and the plurality of through holes are staggered, and the plurality of supporting portions are connected to the second side of the aforementioned first plate body.

[0022] The present invention generates a distance between the sintered body and the first capillary structure through the extension portion, thereby preventing the occurrence of thermal impedance of the evaporation region when the capillary structures are stacked (stacked). BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 is a three-dimensional diagram of a first embodiment of the capillary structure of a temperature homogenizing plate of the present invention;

[0024] Figure 2 is a three-dimensional diagram of a second embodiment of the capillary structure of the temperature equalizing plate of the present invention;

[0025] Figure 3 is a three-dimensional exploded view of a first embodiment of a temperature homogenizing plate of the present invention;

[0026] Figure 4 is a combined cross-sectional view of a first embodiment of a temperature homogenizing plate of the present invention;

[0027] Figure 5 is a combined cross-sectional view of a second embodiment of a temperature homogenizing plate of the present invention;

[0028] Figure 6 is a combined cross-sectional view of a third embodiment of a temperature vapor chamber of the present invention;

[0029] Figure 7 It is a combined cross-sectional view of a fourth embodiment of a temperature vapor chamber of the present invention.

[0030] Explanation of the accompanying drawings: sintered body 1; first side plane 1a; second side surface 1b; through hole 11; extension portion 12; channel 13; support portion 14; temperature uniform plate 2; first plate body 21; first side 211; second side 212; second plate body 22; third side 221; fourth side 222; airtight chamber 23; heated area 24; spacing 25; working liquid 3; first capillary structure 4; heat source 5; support column 6. DETAILED DESCRIPTION

[0031] The above-mentioned objects and the structural and functional characteristics of the present invention will be described based on the preferred embodiments shown in the accompanying drawings.

[0032] See also Figure 1 , is a three-dimensional diagram of a first embodiment of the capillary structure of a temperature equalizing plate of the present invention. As shown in the figure, the capillary structure of the temperature equalizing plate comprises: a sintered body 1;

[0033] The sintered body 1 has a plurality of through holes 11 and a plurality of extension portions 12 and a first side plane 1a and a second side surface 1b. The first and second side surfaces 1a, 1b are respectively arranged on the upper and lower sides of the sintered body 1. The plurality of extension portions 12 are formed by extending from one side of the sintered body 1 (the second side surface 1b is selected in this embodiment), and the plurality of extension portions 12 can be arranged in an interval or non-interval arrangement and support the sintered body 1. A channel 13 is formed between every two adjacent extension portions 12. The plurality of through holes 11 of the sintered body 1 penetrates the two sides (the first and second side surfaces 1a, 1b) of the sintered body 1, and the plurality of through holes 11 can provide the working fluid after evaporation and vaporization for diffusion or provide a supporting structure (such as a column, a ring) for penetration. The sintered body 1 and the extension portion 12 are integrally formed by powder sintering.

[0034] See also Figure 2 , is a stereoscopic diagram of a second embodiment of the capillary structure of the temperature equalizing plate of the present invention. As shown in the figure, this embodiment has some structures identical to those of the aforementioned first embodiment and will not be described in detail here. The difference between this embodiment and the aforementioned first embodiment is that a side (first side surface 1a) of the sintered body opposite to the aforementioned extension portion extends to form a plurality of support portions 14, and the plurality of extension portions 12, the plurality of support portions 14, and the plurality of through holes 11 are staggered.

[0035] See also Figure 3 , Figure 4 , is a three-dimensional exploded and combined cross-sectional view of the first embodiment of the temperature equalizing plate of the present invention. As shown in the figure, the temperature equalizing plate 2 comprises: a first plate body 21, a second plate body 22, and a sintered body 1;

[0036] The first plate body 21 has a first side 211 and a second side 212, and the first and second sides 211, 212 are respectively arranged on the upper and lower sides of the first plate body 21; the second plate body 22 has a third side 221 and a fourth side 222, and the third and fourth sides are respectively arranged on the upper and lower sides of the second plate body 22, so that the first and second plates 21, 22 are correspondingly covered to jointly define an airtight chamber 23 and filled with a working liquid 3, and the third side 221 is provided with a first capillary structure 4 and a heated area 24, and the first capillary structure 4 can be extended and arranged on the third side 221 of the second plate body 22.

[0037] A heat source 5 is disposed corresponding to the fourth side 222 of the second plate 22 , and the third side 221 of the second plate 22 corresponding to the position of the heat source 5 is where the heating area 24 is disposed.

[0038] The sintered body 1 is disposed on the heated area 24 , and is stacked and connected with the first capillary structure 4 through the plurality of extension portions 12 . A distance 25 is formed between the sintered body 1 and the first capillary structure 4 through the plurality of extension portions 12 .

[0039] The first capillary structure 4 is any one of a grid body, a fiber body, a braided body, a groove, and a sintered powder. The first capillary structure 4 can also be the same sintered powder as the sintered body 1 .

[0040] See also Figure 5 , is a combined cross-sectional view of a second embodiment of the temperature equalizing plate of the present invention. As shown in the figure, this embodiment has the same partial structure as the aforementioned first embodiment and will not be described here in detail. The difference between this embodiment and the aforementioned first embodiment is that it has a plurality of support columns 6, and the plurality of support columns 6 penetrate the sintered body 1, and the two ends of the plurality of support columns 6 are connected to the second side 212 of the first plate body 21 and the third side 221 of the second plate body 22.

[0041] See also Figure 6 , is a combined cross-sectional view of the third embodiment of the temperature equalizing plate of the present invention. As shown in the figure, this embodiment has the same partial structure as the aforementioned first embodiment and will not be described again here. The difference between this embodiment and the aforementioned first embodiment is that the heating zone 24 of the second plate body 22 is formed by the third side 221 of the second plate body 22 protruding toward the fourth side 222, and a concave area is formed on the third side 221. The first capillary structure 4 is arranged on the surface of the concave area, and the sintered body 1 is framed (stacked) on the first capillary structure 4.

[0042] See also Figure 7 , is a combined cross-sectional view of the fourth embodiment of the multi-layer capillary structure of the temperature equalizing plate of the present invention. As shown in the figure, part of the structure of this embodiment is the same as that of the aforementioned first embodiment and will not be described here in detail. However, the difference between this embodiment and the aforementioned first embodiment is that the side of the sintered body 1 opposite to the aforementioned extension portion 12 is extended to form a plurality of support portions 14, and the plurality of support portions 14 are connected to the second side 212 of the aforementioned first plate body 21. The plurality of extension portions 12, the plurality of support portions 14 and the plurality of through holes 11 are staggered, and the plurality of support portions 14 can replace the support column 6 of the aforementioned embodiment to prevent the first and second plate bodies 21, 22 from collapsing and / or thermal expansion.

[0043] The main purpose of the present invention is to improve the defects of thermal impedance caused by increasing the content of working liquid in the heated zone of the existing heat spreader, thereby increasing the thickness of the capillary structure or arranging it in a frame (stacked) manner. The present invention uses a sintered frame to provide the working liquid content in the heated zone of the heat spreader, and prevents the thermal impedance caused by the frame (stacked) arrangement or excessive thickness of the capillary structure by creating a distance between the sintered body and the first capillary structure through the extension portion. In addition, since the sintered frame has a plurality of through holes, it can further provide a path for the vertical diffusion of the working liquid that is evaporated by heat, effectively preventing the working liquid from accumulating heat in the heated zone, thereby improving the defects of the existing heat spreader.

Claims

1. A capillary structure of a temperature equalizing plate, characterized in that: Include: A sintered body having a plurality of through holes and a plurality of extensions formed by integrally extending from one side of the body, the plurality of extensions being arranged at intervals and supporting the sintered body; the plurality of through holes of the sintered body penetrates both sides of the sintered body, and a channel is formed between every two adjacent extensions in the horizontal direction; the sintered body and the extensions are integrally formed by sintering powder; A side of the sintered body opposite to the aforementioned extension portion is extended to form a plurality of support portions, and the plurality of extension portions, the plurality of support portions and the plurality of through holes are staggered.

2. A temperature equalizing plate, characterized in that: Include: A first plate having a first side and a second side; A second plate body having a third side and a fourth side, wherein the first plate body and the second plate body are correspondingly covered to define an airtight chamber filled with a working liquid, and the third side has a first capillary structure and a heating area; A sintered body, the sintered body has a plurality of through holes and a plurality of extensions formed by integrally extending from one side of the body, the plurality of extensions are arranged at intervals and support the sintered body, the sintered body and the aforementioned first capillary structure are stacked, and a distance is formed between the sintered body and the aforementioned first capillary structure; it also has a plurality of support columns, the plurality of support columns penetrate the sintered body, the two ends of the plurality of support columns are connected to the second side of the first plate body and the third side of the second plate body; a channel is formed between every two adjacent extensions.

3. The temperature equalizing plate according to claim 2, characterized in that: The first capillary structure is any one of a grid body, a fiber body, a woven body, a groove, and a sintered powder.

4. The temperature equalizing plate according to claim 2, characterized in that: The heated area is formed by the third side of the second plate body extending toward the fourth side and forming a concave shape on the third side. The first capillary structure is arranged on the surface of the concave shape, and the extension part of the sintered body is connected to the first capillary structure.

5. The temperature equalizing plate according to claim 2, characterized in that: A side of the sintered body opposite to the aforementioned extension portion is extended to form a plurality of support portions, the plurality of extension portions, the plurality of support portions and the plurality of through holes are staggered, and the plurality of support portions are connected to the second side of the aforementioned first plate body.

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