Substrate placement part and substrate processing device including the substrate placement part

Abstract

The present invention relates to a substrate placement portion and a substrate processing device including the substrate placement portion, wherein the substrate placement portion includes an inner area of ​​a quadrilateral shape whose sides are formed along a first direction and a second direction intersecting the first direction on a plane, and an outer area surrounding the inner area. The substrate placement portion includes: an inner heating line arranged in the inner area and including an outermost heating line arranged closest to the outer area and an adjacent heating line arranged adjacent to the outermost heating line; and an outer heating line arranged in the outer area. The outermost heating line protrudes in the direction of the corner of the quadrilateral shape at the corner portion of the quadrilateral shape in the inner area, thereby forming a corner protrusion at the corner portion that reduces the distance between the outermost heating line and the outer heating line.

Description

Technical Field

[0001] The present invention relates to a substrate placement part and a substrate processing device comprising the substrate placement part, and in particular to a substrate placement part capable of uniformly heating a substrate and a substrate processing device comprising the substrate placement part. Background Art

[0002] Generally, semiconductor memory elements, liquid crystal display devices, organic light-emitting devices, and the like are manufactured by performing semiconductor processes multiple times on a substrate to stack structures having a desired shape.

[0003] The semiconductor manufacturing process includes a process of depositing a predetermined thin film on a substrate, a photolithography process of exposing a selected area of ​​the thin film, an etching process of removing the thin film in the selected area, etc. The substrate processing process for manufacturing such a semiconductor is performed in a substrate processing apparatus including a process chamber that creates an optimal environment for the corresponding process.

[0004] The process chamber is equipped with a substrate to be processed and a substrate placement portion for placing the substrate, and a process gas containing a source substance is sprayed toward the substrate. Deposition, etching, etc. are performed on the substrate by the source substance contained in the process gas.

[0005] In addition, the substrate seating portion may be heated for performing a substrate treatment process, however, non-uniform heating may occur, and thus improvement is required. Summary of the invention

[0006] Accordingly, the technical problem of the present invention is proposed based on the above problem, and an object of the present invention is to provide a substrate seating portion that can uniformly heat a substrate.

[0007] Another object of the present invention is to provide a substrate processing device including the substrate seating portion.

[0008] According to an embodiment of the present invention for achieving the above-mentioned purpose, a substrate placement portion includes an inner area of ​​a quadrilateral shape whose sides are formed along a first direction and a second direction intersecting the first direction on a plane, and an outer area surrounding the inner area. The substrate placement portion includes: an inner heating line arranged in the inner area and including an outermost heating line arranged closest to the outer area and an adjacent heating line arranged adjacent to the outermost heating line; and an outer heating line arranged in the outer area. The outermost heating line protrudes in the direction of the corner of the quadrilateral shape at the corner portion of the quadrilateral shape in the inner area, thereby forming a corner protrusion at the corner portion that reduces the distance between the outermost heating line and the outer heating line.

[0009] In one embodiment of the present invention, a first distance between the corner protrusion of the outermost heating wire and the outer heating wire may be less than or equal to a second distance between the corner protrusion of the outermost heating wire and the adjacent heating wire.

[0010] In one embodiment of the present invention, the first distance between the corner protrusion of the outermost heating wire and the outer heating wire may be less than 1.2 times the third distance between the outermost heating wire and the outer heating wire along the first direction or the second direction.

[0011] In one embodiment of the present invention, the inner area can be divided into a first inner area to a fourth inner area. The inner heating wire can include a first inner heating wire to a fourth inner heating wire respectively arranged in the first inner area to the fourth inner area. The first inner heating wire to the fourth inner heating wire can heat the first inner area to the fourth inner area respectively and independently.

[0012] In one embodiment of the present invention, the inner heating line may include a plurality of horizontal portions extending along the first direction and a plurality of vertical portions extending along the second direction.

[0013] In one embodiment of the present invention, the inner heating line may be uniformly formed throughout the inner region.

[0014] In one embodiment of the present invention, in the inner region, a distance between adjacent portions of the inner heating line along the first direction or the second direction may be in a range of 100 mm to 140 mm.

[0015] In an embodiment of the present invention, the substrate may be arranged in the inner region, and may be arranged so as not to overlap with the outer heating wires.

[0016] In one embodiment of the present invention, the outer heating wire may form a circle along the outer area.

[0017] In one embodiment of the present invention, the outer heating line may not be formed in the inner area.

[0018] In one embodiment of the present invention, a heat insulating portion surrounding the outer periphery of the outer area may be further included.

[0019] According to an embodiment of the present invention for achieving the above-mentioned purpose, a substrate processing device includes: a substrate placement part, including an inner area of ​​a quadrilateral shape whose sides are formed along a first direction and a second direction intersecting the first direction on a plane and an outer area surrounding the inner area; a process chamber, accommodating the substrate placement part; and a lifting device, combined with the substrate placement part to move the position of the substrate placement part in the process chamber. The substrate placement part includes: an inner heating line, arranged in the inner area, and including an outermost heating line arranged closest to the outer area and an adjacent heating line arranged adjacent to the outermost heating line; and an outer heating line, arranged in the outer area. The outermost heating line protrudes in the corner part of the quadrilateral shape in the inner area in the direction of the corner of the quadrilateral shape, so that a corner protrusion is formed at the corner part to reduce the distance between the outermost heating line and the outer heating line.

[0020] According to an embodiment of the present invention, the substrate placement part includes: an inner heating line arranged in the inner area, including an outermost heating line arranged closest to the outer area and an adjacent heating line arranged adjacent to the outermost heating line; and an outer heating line arranged in the outer area. The outermost heating line protrudes in the corner direction of the quadrilateral shape at the corner part of the quadrilateral shape in the inner area, so that a corner protrusion that reduces the distance between the outermost heating line and the outer heating line is formed at the corner part. Accordingly, the temperature at the corner part can be prevented from being excessively reduced.

[0021] Furthermore, the inner heating wire and the outer heating wire are arranged so as not to be too close to each other, thereby preventing a local temperature rise.

[0022] Also, the substrate seating portion may further include a heat insulating portion surrounding an outer edge of the outer region, thereby preventing heat loss at the outer region.

[0023] However, the effects of the present invention are not limited to the above effects, and various extensions can be made within the scope not departing from the idea and scope of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 FIG. 1 is a diagram showing a substrate processing apparatus according to an embodiment of the present invention.

[0025] Figure 2 It is shown Figure 1 A plan view of each area of ​​a substrate placement portion.

[0026] Figure 3 It is shown Figure 2 FIG. 1 is a diagram showing an arrangement of a heating portion within a substrate seating portion.

[0027] Figure 4 It is shown in detail Figure 3 A partial enlarged view of part A.

[0028] Figure 5 It is shown in detail Figure 3 A partial enlarged view of part B.

[0029] Figure 6 FIG. 1 is a plan view showing a substrate seating portion of a substrate processing apparatus according to an embodiment of the present invention.

[0030] Figure 7 is along Figure 6 A cross-sectional view taken along line I-I'.

[0031] Figure 8a : is a diagram schematically showing the arrangement of a heating section in a substrate seating section according to a comparative example.

[0032] Figure 8b It is shown that in the use of Figure 8a A three-dimensional graph of temperature deviation according to position in the case where the substrate setting portion of the comparative example heats the substrate.

[0033] Fig. 9 1 is a three-dimensional graph showing temperature deviation according to positions in a case where a substrate is heated using a substrate seating portion of a substrate processing apparatus according to an embodiment of the present invention.

[0034] Explanation of symbols

[0035] 10: Substrate 100: Process chamber

[0036] 200: substrate placement part 210: lifting device

[0037] 220: Outer area 230: Inner area

[0038] 700: Heating part 710: Inner heating wire

[0039] 720: External heating wire 800: Power supply unit

[0040] 710a, 710b, 710c, 710d: first inner heating line to fourth inner heating line

[0041] 720a, 720b, 720c, 720d: first outer heating line to fourth outer heating line

[0042] 710ac, 710bc, 710cc, 710dc: first corner protrusion to fourth corner protrusion DETAILED DESCRIPTION

[0043] Hereinafter, preferred embodiments of the present invention will be described in more detail with reference to the accompanying drawings.

[0044] Figure 1 FIG. 1 is a diagram showing a substrate processing apparatus according to an embodiment of the present invention.

[0045] Figure 1 FIG. 1 is a diagram showing a substrate processing apparatus equipped with a substrate seating portion according to an embodiment.

[0046] Reference Figure 1 The substrate processing apparatus may include: a process chamber 100 equipped with a reaction space; and a substrate seating portion 200 provided in the process chamber 100 to support at least one substrate 10 .

[0047] Furthermore, the substrate processing apparatus may include: a gas distribution device 300, which is disposed at the other side of the process chamber 100 opposite to the substrate seating portion 200 and sprays a process gas; and a gas supply portion 400, which is disposed at the outer side of the process chamber 100 and supplies the process gas to the gas distribution device 300. Furthermore, the substrate processing apparatus may further include an exhaust portion 500 for exhausting the inside of the process chamber 100.

[0048] The process chamber 100 may be configured in a barrel shape having a space inside for deposition of the substrate 10. The process chamber 100 may be configured in various shapes according to the shape of the substrate 10.

[0049] In such a process chamber 100 , the substrate seating portion 200 and the gas distribution device 300 may be disposed opposite to each other. For example, the substrate seating portion 200 may be disposed at the lower side of the process chamber 100 , and the gas distribution device 300 may be disposed at the upper side of the process chamber 100 .

[0050] Furthermore, the process chamber 100 may be provided with a substrate inlet 110 for introducing and withdrawing the substrate 10. Furthermore, the process chamber 100 may be provided with a gas inlet 120 connected to the gas supply unit 400 for supplying process gas into the process chamber 100.

[0051] Furthermore, in order to adjust the internal pressure of the process chamber 100 or to exhaust process gas and / or foreign matter inside the process chamber 100 , the process chamber 100 may be equipped with an exhaust port 130 , and the exhaust port 130 may be connected to the exhaust part 500 .

[0052] For example, the substrate entrance and exit 110 can be configured on a side surface of the process chamber 100 to a size that allows the substrate 10 to enter and exit, the gas inlet 120 can be configured to pass through the upper wall of the process chamber 100, and the exhaust port 130 can be configured to pass through the side wall or lower wall of the process chamber 100 at a position lower than the substrate placement part 200.

[0053] The substrate seating portion 200 is disposed inside the process chamber 100 and seats at least one substrate 10 entering the process chamber 100. The substrate seating portion 200 may be disposed at a position opposite to the gas distribution device 300.

[0054] The substrate seating portion 200 may be formed as a quadrangular plate.

[0055] For example, the substrate seating portion 200 may be disposed at a lower side of the process chamber 100 , and the gas distribution device 300 may be disposed at an upper side of the process chamber 100 .

[0056] A lifting device 210 may be provided at the bottom of the substrate placement part 200 to move the substrate placement part 200 up and down. The lifting device 210 is configured to support at least one region of the substrate placement part 200, for example, to support the central portion of the substrate placement part 200, and if the substrate 10 is placed on the substrate placement part 200, the substrate placement part 200 is moved to be close to the gas distribution device 300.

[0057] Furthermore, a heating unit 700 may be installed on the substrate seating unit 200. The heating unit 700 may generate heat at a predetermined temperature to heat the substrate 10, thereby facilitating thin film deposition and etching processes on the substrate 10. Figures 2 to 5 The structure and arrangement of the heating unit 700 are described in detail below.

[0058] The gas distribution device 300 is disposed at an upper side of the process chamber 100 to spray a process gas toward the substrate 10 mounted on the substrate mounting portion 200 .

[0059] In addition, the gas distribution device 300 may include an upper plate 310 , a spray head 320 , and a side wall plate 330 . The upper plate 310 may form the gas inlet 120 similarly to the upper wall of the process chamber 100 and be connected to the gas supply part 400 .

[0060] The spray head 320 may be provided at a predetermined distance from the upper plate 310 in the up-down direction and may be formed with a plurality of spray holes. The side wall plate 330 may be provided to close a space between the upper plate 310 and the spray head 320 .

[0061] The gas supply unit 400 may include a gas supply source 410 for supplying a plurality of process gases respectively, and a gas supply pipe 420 for supplying the process gas from the gas supply source 410 to the inside of the process chamber 100. The process gas may include a thin film deposition gas, an etching gas, and the like.

[0062] The exhaust unit 500 may include an exhaust device 510 and an exhaust pipe 520 connected to the exhaust port 130 of the process chamber 100. The exhaust device 510 may be a vacuum pump, etc., and thus may be configured to vacuum the inside of the process chamber 100 to a pressure close to vacuum, for example, to a pressure below 0.1 mTorr.

[0063] In addition, the substrate processing apparatus may further include an RF power supply unit 600 including an RF power supply 620 and an impedance matching box (IMB) 610. The RF power supply unit 600 may generate plasma to the process gas by using the upper plate 310 of the gas distribution device 300 as a plasma electrode.

[0064] To this end, a radio frequency power source 620 for supplying radio frequency power is connected to the upper plate 310 , and an impedance matching box 610 for matching impedance so as to apply maximum power may be provided between the upper plate 310 and the radio frequency power source 620 .

[0065] The substrate processing apparatus may further include a power supply unit 800. The power supply unit 800 may supply power for causing the heating unit 700 to generate heat to the heating unit 700.

[0066] Figure 2 It is shown Figure 1 A plan view of each area of ​​a substrate placement portion.

[0067] Reference Figure 2 In order to achieve uniform heating in the entire area of ​​the substrate seating part 200, it is necessary to properly arrange the heating part 700. Therefore, in order to arrange the heating part 700, it is necessary to divide the substrate seating part 200 into a plurality of areas.

[0068] like Figure 2As shown in the figure, as an embodiment, the substrate seating portion 200 may be formed in a quadrilateral plate shape and may be divided into an inner area 230 and an outer area 220. Here, "divided" means dividing the area, and does not mean that the substrate seating portion 200 is separated into a plurality of parts so that each part is separated from each other.

[0069] The inner region 230 may be in a quadrilateral shape with sides formed along a first direction D1 and a second direction D2 intersecting the first direction D1 on a plane. The outer region 220 may surround the inner region 230 .

[0070] The inner region 230 may be divided into a plurality of regions that are symmetrical to each other with respect to the center of the substrate seating portion 200. In this case, the inner region 230 may be divided into four or more quadrants.

[0071] For example, the inner area 230 can be divided into four quadrilaterals. Figure 2 As shown, the inner region 230 can be divided into a first inner region 230 - 1 , a second inner region 230 - 2 , a third inner region 230 - 3 , and a fourth inner region 230 - 4 .

[0072] The first to fourth inner regions 230 - 1 to 230 - 4 may be arranged symmetrically with respect to the center of the substrate seating portion 200 . At this time, the lifting device 210 may be arranged adjacent to the center of the substrate seating portion 200 and coupled to the substrate seating portion 200 .

[0073] Similarly, the outer region 220 can be divided into a plurality of regions symmetrical to each other with respect to the center of the substrate seating portion 200. In this case, the outer region 220 can be divided into four or more quadrants. For example, the outer region 220 can be further divided into a total of four regions.

[0074] That is, Figure 2 As shown in the figure, the outer area 220 can be divided into a first outer area 220-1, a second outer area 220-2, a third outer area 220-3 and a fourth outer area 220-4. Figure 2 As shown, the first outer region 220 - 1 to the fourth outer region 220 - 4 respectively include corner portions of the substrate seating portion 200 , and the corner portions may be configured in a curved shape.

[0075] Figure 3 It is shown Figure 2 FIG. 1 is a diagram showing an arrangement of a heating portion within a substrate seating portion.

[0076] Reference Figure 2 and Figure 3The heating unit 700 may be provided in plurality to heat the inner area 230 and the outer area 220 of the substrate seating portion 200 independently and separately.

[0077] Due to this structure, the heating part 700 may heat the entire area of ​​the substrate seating part 200 at a uniform temperature or with an extremely fine temperature difference.

[0078] In the case where the substrate seating portion 200 is heated unevenly, the substrate 10 arranged on the substrate seating portion 200 may also be heated unevenly, and when a substrate manufacturing process is performed under the uneven heating state, it may cause defects in the substrate finished product or may cause the component characteristics of the substrate finished product to be reduced.

[0079] Due to the above reasons, the substrate seating portion 200 needs to be heated in a uniform temperature in the entire region. The specific structure of the heating portion 700 for uniformly heating the substrate seating portion 200 will be described below.

[0080] The heating unit 700 may include an inner heating wire 710 disposed in the inner region 230 of the substrate seating unit 200 and an outer heating wire 720 disposed in the outer region 220. For example, the inner heating wire or the outer heating wire may be configured as an electric heating wire of a resistance heating method.

[0081] The heating portion 700 may be disposed inside the substrate seating portion 200 .

[0082] like Figure 3 As shown, the inner heating wires 710 may be arranged in a number and position corresponding to the divided inner regions 230 to independently heat each of the divided inner regions 230 .

[0083] For example, the inner heating wires 710 may be arranged in a number corresponding to the inner regions 230 of the four divided substrate seating portions 200. That is, the inner heating wires 710 may be divided into a first inner heating wire 710a, a second inner heating wire 710b, a third inner heating wire 710c, and a fourth inner heating wire 710d.

[0084] The first to fourth inner heating wires 710a to 710d can independently heat the first to fourth inner regions 230-1 to 230-4. That is, the first to fourth inner heating wires 710a to 710d can be independently connected to an external power source (not shown), and can independently receive power from a control device (not shown) that controls the external power source to heat the first to fourth inner regions 230-1 to 230-4.

[0085] The first inner heating wire 710a to the fourth inner heating wire 710d may be arranged to form a substantially spiral pattern in each region. This is because in the embodiment, the inner region 230 is configured as a quadrilateral, and the inner heating wire 710 is configured in the form of an electric heating wire, so the electric heating wire needs to be arranged in a suitable shape that can uniformly heat the entire quadrilateral. For example, the first inner heating wire 710a to the fourth inner heating wire 710d may include a plurality of horizontal portions extending along the first direction D1 and a plurality of vertical portions extending along the second direction D2.

[0086] The first to fourth inner heating lines 710 a to 710 d may be arranged in a left-right symmetrical and up-down symmetrical shape with respect to the center of the substrate seating portion 200 .

[0087] The inner heating wires 710 are disposed in the inner region 230 , and may include outermost heating wires that are disposed most adjacent to the outer region 220 .

[0088] The outermost heating wire protrudes from the corner portion of the quadrilateral shape of the inner area 230 toward the corner direction of the quadrilateral shape, so that a corner protrusion that reduces the distance between the outermost heating wire and the outer heating wire can be formed at the corner portion.

[0089] Specifically, the first inner heating line 710a may form a first corner protrusion 710ac at the left lower corner portion of the first inner area 230-1. The second inner heating line 710b may form a second corner protrusion 710bc at the left upper corner portion of the second inner area 230-2. The third inner heating line 710c may form a third corner protrusion 710cc at the right upper corner portion of the third inner area 230-3. The fourth inner heating line 710d may form a fourth corner protrusion 710dc at the right lower corner portion of the fourth inner area 230-4.

[0090] The corner protrusions 710ac, 710bc, 710cc, and 710dc may be disposed closer to the outer heating line 720 than a point where virtual extension lines connecting the vertical portion and the horizontal portion of each of the corner protrusions meet.

[0091] Accordingly, in the inner region 230 , the distance between adjacent portions of the inner heating line 710 along the first direction D1 or the second direction D2 may range from 100 mm to 140 mm, and the inner heating line 710 may be uniformly formed throughout the inner region 230 .

[0092] like Figure 3 As shown, the outer heating wires 720 may be arranged in a number and position corresponding to the divided outer regions 220 to independently heat each of the divided outer regions 220 .

[0093] For example, the outer heating wires 720 may be arranged to correspond to the outer regions 220 of the four divided substrate seating parts 200. That is, the outer heating wires 720 may be divided into first, second, third, and fourth outer heating wires 720a, 720b, 720c, and 720d.

[0094] The first to fourth outer heating lines 720 a to 720 d may independently heat the first to fourth outer regions 220 - 1 to 220 - 4 .

[0095] That is, the first outer heating wire 720a to the fourth outer heating wire 720d are independently connected to the external power source (refer to Figure 1 The first outer area 220-1 to the fourth outer area 220-4 can be heated by the control device that controls the external power supply and receiving power independently.

[0096] In addition, the external power source and the control device may be electrically connected to the inner heating wire 710 and the outer heating wire 720 independently and respectively, and may be provided in plurality if necessary.

[0097] The outer heating wire 720 of the outer region 220 may be arranged to be located at the periphery of the substrate 10 so as not to overlap with the substrate 10. That is, the end of the substrate 10 is arranged corresponding to the boundary between the inner region 230 and the outer region 220 indicated by the double-dashed line in the drawing, and therefore, the outer heating wire 720 may be arranged to not overlap with the substrate 10.

[0098] That is, the outer heating line 720 is arranged not to be formed in the inner area, and the outer heating line 720 may form a circle along the outer area.

[0099] Figure 4 It is shown in detail Figure 3 A partial enlarged view of part A.

[0100] Reference Figures 2 to 4 The third inner heating line 710c may include: an outermost heating line 710c_1 arranged to be closest to the third outer region 220-3; and an adjacent heating line 710c_2 arranged to be adjacent to the outermost heating line 710c_1.

[0101] A portion of the outermost heating wire 710c_1 forms the third corner protrusion 710cc, and a first distance d1 between the third corner protrusion 710cc and the third outer heating wire 720c may be less than or equal to a second distance d2 between the third corner protrusion 710cc of the outermost heating wire 710c_1 and the adjacent heating wire 710c_2. In this case, the first distance d1 may be set to be less than 170 mm, thereby preventing the temperature at the corner portion from decreasing.

[0102] In the case where the heating wires are uniformly arranged in a usual manner corresponding to the substrate placement portion 200 of the quadrilateral shape, the heating wires may be arranged in a spiral shape of the quadrilateral shape. In this case, at the corners of the quadrilateral shape, the spacing between the heating wires becomes longer than other parts (for example, due to the diagonal direction of the quadrilateral, it is about 1.4 times longer than other parts), and accordingly, there may be a problem that the temperature at the corners is lower than that at other parts. (See Figure 8a Part A)

[0103] Accordingly, in this embodiment, the first distance d1 between the corner protrusion 710cc of the outermost heating wire 710c_1 and the third outer heating wire 720c can be set to be less than 1.2 times the third distance d3 between the outermost heating wire 710c_1 and the adjacent third outer heating wire 720c along the first direction D1 or the second direction D2, thereby preventing the temperature at the corner portion from being excessively reduced.

[0104] in addition, Figure 4 The upper right corner of the substrate seating portion 200 is illustrated and described in the figure, however, heating wires are arranged in other corners of the substrate seating portion 200 similarly to the above, and the description thereof is omitted.

[0105] Figure 5 It is shown in detail Figure 3 A partial enlarged view of part B.

[0106] Reference Figure 2 , Figure 3 and Figure 5 , illustrating the arrangement relationship between the outer heating wire 720 and the inner heating wire 710 at the central right portion of the substrate seating portion 200 .

[0107] When the heating wires are uniformly arranged in a usual manner corresponding to the quadrilateral-shaped substrate seating portion 200, the inner heating wires and the outer heating wires are densely arranged at the intersection of the third inner region 230-3, the fourth inner region 230-4, the third outer region 220-3, and the fourth outer region 220-4, which may cause excessive heating. (See Figure 8a Part B)

[0108] In this embodiment, in the portion where the third outer heating line 720c and the fourth outer heating line 720d are arranged to be connected to the third inner area 230-3 and the fourth inner area 230-4, the third outer heating line 720c and the fourth outer heating line 720d may be arranged not to be located in the third inner area 230-3 and the fourth inner area 230-4.

[0109] That is, at the central side portions of the substrate seating portion 200 where the inner heating wire 710 and the outer heating wire 720 are arranged close to each other, the inner heating wire 710 and the outer heating wire 720 are arranged to avoid being too close (d4), thereby preventing excessive heating of the central side portions.

[0110] For example, the fourth distance d4 between the third outer heating line 720c and the third inner heating line 710c may not show a large difference compared to the fifth distance d5 between adjacent portions of the third inner heating line 710c. This is because, in the case where the third outer heating line 720c extends to the third inner region 230-3, the fourth distance d4 becomes excessively small and overheating may occur.

[0111] In addition, at the intersection of the first inner region 230-1, the second inner region 230-2, the first outer region 220-1 and the second outer region 220-2, the first outer heating wire 720a and the second outer heating wire 720b are arranged similarly to the above description, thereby preventing excessive heating.

[0112] Figure 6 FIG. 1 is a plan view showing a substrate seating portion of a substrate processing apparatus according to an embodiment of the present invention. Figure 7 is along Figure 6 A cross-sectional view taken along the line II'.

[0113] Reference Figure 6 and Figure 7 , except that the substrate seating portion further includes a heat insulating portion IN surrounding the outer area where the outer heating wire is arranged, Figures 2 to 5Therefore, repeated description is omitted.

[0114] When the substrate seating portion 200 is locally heated unevenly at different temperatures, the edge portion of the substrate seating portion 200, i.e., the corner portion, may have a significantly lower temperature than the central portion.

[0115] That is, the edge or corner portion of the substrate seating portion 200 is close to the process chamber (refer to Figure 1 100) is arranged on the outer wall, so heat loss caused by external gas may occur, and the corner part has a larger surface area than the central part due to its shape characteristics, so heat loss may occur.

[0116] In this embodiment, a heat insulating portion IN is further included around the outer periphery of the outer region, thereby preventing heat loss in the outer region. The heat insulating portion IN may be made of, for example, aluminum oxide (Al 2 O 3 ) ceramic plate and can be easily constructed.

[0117] Figure 8a : is a diagram schematically showing the arrangement of a heating section in a substrate seating section according to a comparative example. Figure 8b It is shown that in the use of Figure 8a A three-dimensional graph of temperature deviation according to position in the case where the substrate setting portion of the comparative example heats the substrate.

[0118] Figure 8a The arrangement of the heating wires shown in FIG. 1 shows a case where the heating wires are arranged in a quadrilateral spiral shape in each region of the quadrilateral substrate seating portion.

[0119] In this case, the problem is that since the heating wires are formed in a predetermined quadrilateral shape, the distance between the heating wires is relatively large at each corner portion, thereby causing more heat loss at the corner portion, resulting in a problem of temperature drop. Figure 8a Part A)

[0120] And, for Figure 8a In the arrangement of the heating wires shown in the figure, the problem of excessive temperature rise was confirmed in the central two side parts formed by the outer heating wires extending to the inner area. ( Figure 8a Part B)

[0121] Fig. 9 1 is a three-dimensional graph showing temperature deviation according to positions in a case where a substrate is heated using a substrate seating portion of a substrate processing apparatus according to an embodiment of the present invention.

[0122] Reference Fig. 9 It was confirmed that when the substrate is heated by the substrate setting portion according to the present embodiment, the substrate is heated more efficiently than when the substrate is heated by the substrate setting portion according to the present embodiment. Figure 8a By arranging the substrate placement portion of the heating portion, the temperature deviation is reduced from 9°C to 5°C under the same conditions.

[0123] According to an embodiment of the present invention, the substrate placement part includes: inner heating wires arranged in the inner area, including the outermost heating wire arranged most adjacent to the outer area and an adjacent heating wire arranged adjacent to the outermost heating wire; and outer heating wires arranged in the outer area. The outermost heating wires protrude in the corner direction of the quadrilateral shape at the corner portion of the quadrilateral shape in the inner area, thereby forming a corner protrusion at the corner portion that reduces the distance between the outermost heating wire and the outer heating wire. Accordingly, the temperature at the corner portion can be prevented from being excessively reduced.

[0124] Furthermore, the inner heating wire and the outer heating wire are arranged so as not to be too close to each other, thereby preventing a local temperature rise.

[0125] Also, the substrate seating portion may further include a heat insulating portion surrounding an outer periphery of the outer region, thereby preventing heat loss at the outer region.

[0126] Possibility of industrial application

[0127] The present invention can be applied to an organic light-emitting display device and various electronic devices including the organic light-emitting display device. For example, the present invention can be applied to a substrate processing device used in a process of manufacturing a mobile phone, a smart phone, a video phone, a smart tablet computer, a smart watch, a tablet computer, a car navigation system, a television, a computer monitor, a notebook computer, a head-mounted display, etc.

[0128] Although the present invention has been described above with reference to exemplary embodiments, anyone with ordinary knowledge in the relevant technical field will understand that the present invention may be modified and altered in many ways without departing from the scope of the concept and field of the present invention as described in the claims.

Claims

1. A substrate placement portion, comprising an inner area of ​​a quadrilateral shape having sides formed along a first direction and a second direction intersecting the first direction on a plane, and an outer area surrounding the inner area, in, The substrate placement portion includes: Inner heating wires are arranged in the inner region and include outermost heating wires arranged closest to the outer region and adjacent heating wires arranged adjacent to the outermost heating wires; and An outer heating wire is arranged in the outer area, The outermost heating wire protrudes outward along the corner direction of the quadrilateral at the inner area at the corner portion of the quadrilateral, thereby forming a corner protrusion that reduces the distance between the outermost heating wire and the outer heating wire.

2. The substrate seating portion according to claim 1, wherein: A first distance between the corner protrusion of the outermost heating wire and the outer heating wire is less than or equal to a second distance between the corner protrusion of the outermost heating wire and the adjacent heating wire.

3. The substrate seating portion according to claim 1, wherein: A first distance between the corner protrusion of the outermost heating line and the outer heating line is less than 1.2 times a third distance between the outermost heating line and the outer heating line along the first direction or the second direction.

4. The substrate seating portion according to claim 1, wherein: The inner area is divided into a first inner area to a fourth inner area, The inner heating wires include first to fourth inner heating wires respectively arranged in the first to fourth inner regions, The first to fourth inner heating lines independently heat the first to fourth inner regions, respectively.

5. The substrate seating portion according to claim 1, wherein: The inner heating line includes a plurality of horizontal portions extending along the first direction and a plurality of vertical portions extending along the second direction.

6. The substrate seating portion according to claim 1, wherein: The inner heating line is uniformly formed throughout the inner region.

7. The substrate seating portion according to claim 1, wherein: In the inner region, a distance between adjacent portions of the inner heating line in the first direction or the second direction has a range of 100 mm to 140 mm.

8. The substrate seating portion according to claim 1, wherein: The outer heating line is not formed in the inner area.

9. The substrate seating portion according to claim 1, wherein: Also included is a thermal insulation portion surrounding the outer periphery of the outer region.

10. A substrate processing device, comprising: The substrate placement portion includes an inner area of ​​a quadrilateral having sides formed along a first direction and a second direction intersecting the first direction on a plane and an outer area surrounding the inner area; A process chamber, accommodating the substrate placement portion; as well as a lifting device, combined with the substrate placement part to move the substrate placement part to a position in the process chamber, Wherein, the substrate placement portion comprises: Inner heating wires are arranged in the inner region and include outermost heating wires arranged closest to the outer region and adjacent heating wires arranged adjacent to the outermost heating wires; and An outer heating wire is arranged in the outer area, The outermost heating wire protrudes outward along the corner direction of the quadrilateral at the inner area at the corner portion of the quadrilateral, thereby forming a corner protrusion that reduces the distance between the outermost heating wire and the outer heating wire.

Images