Small heat pipe combined radiator

Abstract

The present invention discloses a small heat pipe combined radiator, comprising a heat dissipation substrate, a longitudinal tube hole penetrating longitudinally along the heat dissipation substrate substrate, a transverse tube hole penetrating transversely along the heat dissipation substrate substrate, a longitudinal heat conduction tube is installed in the longitudinal tube hole, and longitudinal heat dissipation auxiliary plates are installed at both ends of the longitudinal heat conduction tube; a transverse heat conduction tube is installed in the transverse tube hole, and a transverse heat dissipation auxiliary plate is installed at one end of the transverse heat conduction tube; the longitudinal heat dissipation auxiliary plate and the transverse heat dissipation auxiliary plate are away from the heat dissipation substrate. The heat conduction tube adopts a small cross-section flat tube. In the present invention, the longitudinal heat dissipation auxiliary plate and the transverse heat dissipation auxiliary plate are connected to the heat dissipation substrate through the longitudinal heat conduction tube and the transverse heat conduction tube, and the heat conduction tube and the heat dissipation auxiliary plate both participate in heat dissipation, which not only increases the heat dissipation area, but also meets the heat dissipation needs of the small space structure, and achieves a rapid heat dissipation effect. The use of flat heat conduction tubes can meet the heat dissipation needs of complex small space structures, and is particularly suitable for the heat dissipation needs of small thin-walled electronic products.

Description

Technical Field

[0001] The invention belongs to the technical field of electronic radiators, and in particular relates to a small heat-conducting pipe combined radiator. Background Art

[0002] Electronic radiators are widely used in electronic equipment and measuring instruments. These devices generate a lot of heat when working. If this excess heat cannot be dissipated quickly, it will generate high temperature and may damage the working electronic components. The function of the radiator is to dissipate the heat generated by the components during operation to the surrounding environment, so that the temperature of the components will not be too high and can work normally.

[0003] There are several types of electronic radiators: interdigital radiators, plate radiators, and profile radiators. In recent years, large heat pipe radiators have appeared. The characteristic of heat pipes is that they can quickly transfer heat. However, for some newly developed small devices, although they are small in size, they have high power and require good heat dissipation. This requires a small radiator with good heat dissipation to meet the requirements.

[0004] From the perspective of the current widespread application, large heat pipe radiators are now widely used, but they have the problem of large size and large space occupation. This requires a small radiator with a compact structure and good heat dissipation effect. Summary of the invention

[0005] The technical problem to be solved by the present invention is to provide a small heat pipe combined radiator which is suitable for the heat dissipation of small electronic products and has good heat dissipation effect.

[0006] In order to solve the above technical problems, the present invention includes a heat dissipation substrate, whose structural characteristics are that longitudinal tube holes are provided along the heat dissipation substrate substrate body, and transverse tube holes are provided along the heat dissipation substrate substrate body. Longitudinal heat-conducting pipes are passed through the longitudinal tube holes, and longitudinal heat-dissipating auxiliary plates are provided at both ends of the longitudinal heat-conducting pipes; transverse heat-conducting pipes are passed through the transverse tube holes, and transverse heat-dissipating auxiliary plates are provided at one end of the transverse heat-conducting pipes; the longitudinal heat-dissipating auxiliary plates and the transverse heat-dissipating auxiliary plates are far away from the heat dissipation substrate.

[0007] The longitudinal tube holes and the transverse tube holes are flat holes with small cross-sections, and the longitudinal heat-conducting tubes and the transverse heat-conducting tubes are flat tubes with small cross-sections.

[0008] The longitudinal heat-conducting pipe is installed with an interference fit with the longitudinal pipe hole, and the transverse heat-conducting pipe is installed with an interference fit with the transverse pipe hole.

[0009] The outer surfaces of the longitudinal heat dissipation auxiliary plate and the transverse heat dissipation auxiliary plate are rough surfaces.

[0010] The longitudinal tube holes and the transverse tube holes are multiple and arranged in pairs, and the longitudinal heat-conducting tubes and the transverse heat-conducting tubes are also arranged in pairs, and the outer ends of each pair of adjacent longitudinal heat-conducting tubes or transverse heat-conducting tubes are connected together.

[0011] The transverse heat conducting pipe is in a curved shape.

[0012] The other end of the transverse heat conducting pipe extends out of the heat dissipation substrate base.

[0013] After adopting the above structure, since the longitudinal heat dissipation auxiliary plate and the transverse heat dissipation auxiliary plate are connected to the heat dissipation substrate through the longitudinal heat conduction pipe and the transverse heat conduction pipe, the heat conduction pipe and the heat dissipation auxiliary plate both participate in heat dissipation, which not only increases the heat dissipation area, but also meets the heat dissipation needs of small space structures and achieves a rapid heat dissipation effect. The use of flat heat conduction pipes can meet the heat dissipation needs of complex small space structures. It is particularly suitable for the heat dissipation needs of small thin-walled electronic products. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The specific embodiments of the present invention are further described in detail below in conjunction with the accompanying drawings:

[0015] Figure 1 It is a structural schematic diagram of the present invention;

[0016] Figure 2 for Figure 1 The schematic diagram of the structure from the left;

[0017] Figure 3 for Figure 1 AA section view;

[0018] Figure 4 for Figure 3 A magnified view of the D portion;

[0019] Figure 5 for Figure 3 A magnified view of part E;

[0020] Figure 6 for Figure 1 BB cross-sectional view;

[0021] Figure 7 for Figure 1 CC cross-sectional view. DETAILED DESCRIPTION

[0022] Referring to the accompanying drawings, the small heat pipe combined heat sink includes a heat dissipation substrate 1, which is in the shape of a rectangular thin plate. The heat dissipation substrate 1 is provided with an electronic component mounting surface 11 for mounting electronic components 6. A longitudinal tube hole 12 is provided along the base of the heat dissipation substrate 1, and a transverse tube hole 13 is provided along the base of the heat dissipation substrate 1. The longitudinal tube hole 12 and the transverse tube hole 13 are parallel to the mounting surface 11 of the heat dissipation substrate 1. A longitudinal heat conduction tube 2 is installed in the longitudinal tube hole 12, and longitudinal heat dissipation auxiliary plates 4 are provided at both ends of the longitudinal heat conduction tube 2. A transverse heat conduction tube 3 is installed in the transverse tube hole 13, and a transverse heat dissipation auxiliary plate 5 is provided at one end of the transverse heat conduction tube 3, and the other end extends out of the base of the heat dissipation substrate 1. The longitudinal heat dissipation auxiliary plate 4 and the transverse heat dissipation auxiliary plate 5 are both far away from the heat dissipation substrate 1. The longitudinal heat conducting tube 2 is installed with an interference fit with the longitudinal tube hole 12, and the transverse heat conducting tube 3 is installed with an interference fit with the transverse tube hole 13. The interference fit installation means that the outer surface of the longitudinal heat conducting tube 2 is installed and fixed together with the inner surface of the longitudinal tube hole 12, and the outer surface of the transverse heat conducting tube 3 is installed and fixed together with the inner surface of the transverse tube hole 13. A plurality of longitudinal tube holes 12 and transverse tube holes 13 are provided along the heat dissipation substrate 1. The longitudinal tube holes 12 and transverse tube holes 13 are arranged in pairs, and the corresponding longitudinal heat conducting tubes 2 and transverse heat conducting tubes 3 are also arranged in pairs. The outer ends of the adjacent longitudinal heat conducting tubes 2 or transverse heat conducting tubes 3 are connected together, that is, the number of the longitudinal tube holes 12 and the transverse tube holes 13 is an even number, and the number of the longitudinal heat conducting tubes 2 and the transverse heat conducting tubes 3 is also an even number. In order to meet the heat dissipation requirements of small thin-walled electronic products, the longitudinal tube holes 12 and the transverse tube holes 13 are small-section flat holes, the longitudinal heat pipes 2 and the transverse heat pipes 3 are small-section flat tubes, the cross-sectional thickness of the flat tubes can be as small as 1.2 mm, the width can be as small as 2.5 mm, and the wall thickness can be as small as 0.3 mm, and the longitudinal heat dissipation auxiliary plate 4 and the transverse heat dissipation auxiliary plate 5 are provided with small-section flat holes corresponding to the number and shape of the longitudinal heat pipes 2 and the transverse heat pipes 3, and the flat holes can be blind holes, and the small-section flat holes on the longitudinal heat dissipation auxiliary plate 4 and the transverse heat dissipation auxiliary plate 5 are installed with interference fit with the longitudinal heat pipes 2 and the transverse heat pipes 3. In order to further improve the heat dissipation effect, the outer surfaces of the longitudinal heat dissipation auxiliary plate 4 and the transverse heat dissipation auxiliary plate 5 are rough surfaces, and the rough surfaces can be corrugated heat dissipation surfaces, concave-convex heat dissipation surfaces, toothed heat dissipation surfaces or other non-planar heat dissipation surfaces. In order to meet the heat dissipation needs of a complex small space structure, the transverse heat pipe 3 can be curved. The curved shape can be bent to one side along its curved portion 33, and the curved portion 33 is close to the heat dissipation substrate 1. The transverse heat pipes 3 at both ends of the curved portion 33 are parallel in their length direction. They can also be set to other shapes as needed, such as L-shape.

[0023] The working principle of the present invention is: the electronic component 6 is installed on the mounting surface 11 of the heat dissipation substrate 1, and the heat generated during operation is directly transferred to the heat dissipation substrate 1, and then quickly transferred to the longitudinal heat dissipation auxiliary plate 4 and the transverse heat dissipation auxiliary plate 5 through a plurality of flat longitudinal heat conduction pipes 2 and transverse heat conduction pipes 3 in small spaces to be dissipated to the outside. The longitudinal heat dissipation auxiliary plate 4 and the transverse heat dissipation auxiliary plate 5 can also be matched with a metal frame and contacted together, and the heat dissipation surface shape of the longitudinal heat dissipation auxiliary plate 4 and the heat dissipation surface shape of the transverse heat dissipation auxiliary plate 5 can also be made into corresponding shapes according to the inner shape of the metal frame, so as to dissipate the heat to the metal frame and to the outside. This radiator is suitable for the heat dissipation of small electronic products, especially the heat dissipation of small thin-walled electronic products. Compared with conventional radiators, this radiator has a better heat dissipation effect and can quickly dissipate the heat energy generated by the electronic components during operation to the outside, so that the temperature of the components will not be too high and can work normally.

Claims

1. A small heat pipe combined radiator, comprising a heat dissipation substrate (1), characterized in that A longitudinal tube hole (12) is provided along the heat dissipation substrate (1) body and a transverse tube hole (13) is provided along the heat dissipation substrate (1) body. A longitudinal heat conduction tube (2) is inserted through the longitudinal tube hole (12), and longitudinal heat dissipation auxiliary plates (4) are provided at both ends of the longitudinal heat conduction tube (2). A transverse heat conduction tube (3) is inserted through the transverse tube hole (13), and a transverse heat dissipation auxiliary plate (5) is provided at one end of the transverse heat conduction tube (3). The longitudinal heat dissipation auxiliary plate (4) and the transverse heat dissipation auxiliary plate (5) are away from the heat dissipation substrate (1). The longitudinal tube hole (12) and the transverse tube hole (13) are small-section flat holes, and the longitudinal heat conduction tube (2) and the transverse heat conduction tube (3) are small-section flat tubes. The longitudinal heat conduction tube (2) is installed with the longitudinal tube hole (12) by interference fit, and the transverse heat conduction tube (3) is installed with the transverse tube hole (13) by interference fit.

2. The small heat pipe combined radiator according to claim 1 is characterized in that The outer surfaces of the longitudinal heat dissipation auxiliary plate (4) and the transverse heat dissipation auxiliary plate (5) are rough surfaces.

3. The small heat pipe combined radiator according to claim 1 is characterized in that The longitudinal tube holes (12) and the transverse tube holes (13) are multiple and arranged in pairs. The longitudinal heat conducting tubes (2) and the transverse heat conducting tubes (3) are also arranged in pairs. The outer ends of two adjacent longitudinal heat conducting tubes (2) or transverse heat conducting tubes (3) are connected together.

4. The small heat pipe combined radiator according to claim 1 is characterized in that The transverse heat conducting pipe (3) is in a curved shape.

5. The small heat pipe combined radiator according to any one of claims 1 to 4, characterized in that The other end of the transverse heat conducting pipe (3) extends out of the base of the heat dissipation substrate (1).

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