Display module, method for manufacturing display module and laser processing method

Abstract

A display module, a method for manufacturing the display module, and a laser processing method are provided. The method for manufacturing the display module includes the following steps: preparing a display module including a plurality of layers and forming a through hole in the display module. The step of forming the through hole includes the following steps: performing a first irradiation process of irradiating a first laser beam along a first boundary defining the through hole; after the first irradiation process, performing a second irradiation process of irradiating a second laser beam along a second boundary; and after the second irradiation process, performing a third irradiation process of irradiating a third laser beam along a third boundary. The time interval between the first irradiation process and the second irradiation process may be different from the time interval between the second irradiation process and the third irradiation process.

Description

[0001] This application claims priority to and all benefits derived therefrom from Korean Patent Application No. 10-2019-0042588, filed on Apr. 11, 2019, the contents of which are incorporated herein by reference in their entirety. Technical Field

[0002] The disclosure relates here to a display module with increased reliability, a method for producing the display module, and a laser processing method. Background Art

[0003] The display device may include various electronic components such as a display panel for displaying an image, an input sensing member for sensing an external input, and an electronic module. The electronic components may be electrically connected to each other through various arranged signal lines. The display panel may include a light-emitting element for generating an image. The input sensing member may include a sensing electrode for sensing an external input. The electronic module may include a camera, an infrared sensor, and / or a proximity sensor. The electronic module may be arranged below the display panel. Summary of the invention

[0004] The disclosure may provide a display module with improved reliability, a method for manufacturing the display module, and a laser processing method.

[0005] In an exemplary embodiment of the inventive concept, a method for manufacturing a display module includes the following steps: preparing a display module including a plurality of layers and forming a through hole in the display module. The step of forming the through hole includes the following steps: performing a first irradiation process of irradiating a first laser beam along a first boundary defining the through hole; after the step of performing the first irradiation process, performing a second irradiation process of irradiating a second laser beam along a second boundary; and after the step of performing the second irradiation process, performing a third irradiation process of irradiating a third laser beam along a third boundary. A time interval between the first irradiation process and the second irradiation process is different from a time interval between the second irradiation process and the third irradiation process.

[0006] In exemplary embodiments, a start point of the first irradiation process, a start point of the second irradiation process, and a start point of the third irradiation process may be different from each other.

[0007] In an exemplary embodiment, a first laser beam may be irradiated to a portion of a first boundary in a first irradiation process, and a second laser beam may be irradiated to a portion of a second boundary in a second irradiation process, and the portion of the first boundary may be identical to the portion of the second boundary.

[0008] In exemplary embodiments, a moving direction of the first laser beam in the first irradiation process may be different from a moving direction of the second laser beam in the second irradiation process.

[0009] In an exemplary embodiment, the display module may include: a base layer; a circuit layer disposed on the base layer; an emission layer disposed on the circuit layer; an encapsulation layer disposed on the emission layer; an input sensing layer disposed on the encapsulation layer; and an anti-reflection layer disposed on the input sensing layer.

[0010] In exemplary embodiments, the second irradiation process may irradiate the second laser beam to the anti-reflection layer, and the third irradiation process may irradiate the third laser beam to the anti-reflection layer.

[0011] In an exemplary embodiment, performing the first irradiation process may include forming a first recess of the base layer defining a sidewall portion of the through hole, and performing the second irradiation process may include forming a second recess of the sidewall portion.

[0012] In an exemplary embodiment, the first recess may be spaced apart from the second recess.

[0013] In exemplary embodiments, a time interval between the first irradiation process and the second irradiation process may be 0 seconds or more, and a time interval between the second irradiation process and the third irradiation process may be greater than a time interval between the first irradiation process and the second irradiation process.

[0014] In exemplary embodiments, a second laser beam may be irradiated to a layer having a lowest thermal deformation temperature among the plurality of layers in a second irradiation process, and a third laser beam may be irradiated to a layer having a lowest thermal deformation temperature among the plurality of layers in a third irradiation process.

[0015] In an exemplary embodiment, the first irradiation process may be performed a plurality of times, and a first time interval between an xth first irradiation process and an x+1th first irradiation process among the first irradiation processes may be 0 seconds or more. Here, x is a natural number.

[0016] In an exemplary embodiment, the second irradiation process may be performed a plurality of times, and a second time interval between a yth second irradiation process and a y+1th second irradiation process in the second irradiation process may be greater than 0 seconds. Here, y is a natural number.

[0017] In an exemplary embodiment, in the first irradiation process, a first time interval may be provided every m irradiation processes of the first laser beam, and in the second irradiation process, a second time interval may be provided every n irradiation processes of the second laser beam, and “m” may be greater than “n.” Here, m and n are natural numbers.

[0018] In an exemplary embodiment, the second time interval may be provided immediately after each second irradiation process.

[0019] In an exemplary embodiment, the first boundary, the second boundary, and the third boundary may be identical to each other.

[0020] In an exemplary embodiment, in a plan view, the third boundary may be surrounded by the second boundary.

[0021] In an exemplary embodiment, the power of the second laser beam may be lower than the power of the third laser beam.

[0022] In an exemplary embodiment, an irradiation speed of the second laser beam may be faster than an irradiation speed of the third laser beam.

[0023] In an exemplary embodiment of the inventive concept, a laser processing method includes forming a through hole in a processing object including a first layer and a second layer, the thermal deformation temperature of the second layer being higher than the thermal deformation temperature of the first layer. The step of forming the through hole includes the following steps: performing a first irradiation process of irradiating a first laser beam to the first layer along a first boundary; after the step of performing the first irradiation process, performing a second irradiation process of irradiating a second laser beam to the first layer along a second boundary; and performing a third irradiation process of irradiating a third laser beam to the second layer along the second boundary. A time interval between the first irradiation process and the second irradiation process is different from a time interval between the second irradiation process and the third irradiation process.

[0024] In an exemplary embodiment, in a plan view, the second boundary may be surrounded by the first boundary.

[0025] In an exemplary embodiment, the power of the first laser beam may be lower than the power of the second laser beam, and the power of the second laser beam may be equal to the power of the third laser beam.

[0026] In an exemplary embodiment, the irradiation speed of the first laser beam may be faster than the irradiation speed of the second laser beam, and the irradiation speed of the second laser beam may be equal to the irradiation speed of the third laser beam.

[0027] In an exemplary embodiment, the third irradiation process of irradiating the third laser beam may be performed a plurality of times, and a first time interval between the third irradiation processes may be 0 seconds or more.

[0028] In exemplary embodiments, a time interval between the first irradiation process and the second irradiation process may be greater than the first time interval.

[0029] In an exemplary embodiment, the second irradiation process of irradiating the second laser beam may be performed a plurality of times, and a second time interval between the second irradiation processes may be greater than the first time interval.

[0030] In an exemplary embodiment of the inventive concept, a display module includes: a base layer, the base layer defining a through hole; a circuit layer disposed on the base layer; an emission layer disposed on the circuit layer; an encapsulation layer disposed on the emission layer; and an anti-reflection layer disposed on the encapsulation layer. Two or more recesses may be defined in a sidewall portion defining the through hole. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] The accompanying drawings are included to provide a further understanding of the inventive concept and are incorporated in and constitute a part of this specification. The accompanying drawings illustrate exemplary embodiments of the inventive concept and together with the description serve to explain the principles of the inventive concept. In the drawings:

[0032] Figure 1A is a perspective view showing an exemplary embodiment of a display device according to the inventive concept;

[0033] Figure 1B is an exploded perspective view showing an exemplary embodiment of a display device according to the inventive concept;

[0034] Figure 2 is along Figure 1B A cross-sectional view taken along line II′;

[0035] Figure 3 is an enlarged bottom plan view showing an exemplary embodiment of a portion of a display module before forming a through hole according to the inventive concept;

[0036] Figure 4 During the first cutting process Figure 3 A sectional view taken along line II-II′;

[0037] Figure 5A is a diagram illustrating an exemplary embodiment of a laser processing method during a first cutting process according to the inventive concept;

[0038] Figure 5B is a diagram illustrating an exemplary embodiment of a laser processing method during a first cutting process according to the inventive concept;

[0039] Figure 6 During the second cutting process Figure 3 A sectional view taken along line II-II′;

[0040] Fig. 7A is a diagram illustrating an exemplary embodiment of a laser processing method during a second cutting process according to the inventive concept;

[0041] Figure 7B is a diagram illustrating an exemplary embodiment of a laser processing method during a second cutting process according to the inventive concept;

[0042] Fig. 8A is a diagram showing a portion of another exemplary embodiment of a laser processing method according to the inventive concept;

[0043] Figure 8B is a diagram showing another part of an exemplary embodiment of a laser processing method according to the inventive concept;

[0044] Figure 8C is a diagram showing still another part of an exemplary embodiment of a laser processing method according to the inventive concept;

[0045] Fig.8D is a diagram showing still another part of an exemplary embodiment of a laser processing method according to the inventive concept;

[0046] Fig. 9 is an enlarged bottom plan view showing an exemplary embodiment of a portion of a display module according to the inventive concept;

[0047] Fig. 10A is a diagram showing a portion of still another exemplary embodiment of a laser processing method according to the inventive concept;

[0048] Fig. 10B is a diagram showing another part of an exemplary embodiment of a laser processing method according to the inventive concept;

[0049] Fig. 10C is a diagram showing still another part of an exemplary embodiment of a laser processing method according to the inventive concept;

[0050] Fig. 10D is a diagram illustrating still another part of an exemplary embodiment of a laser processing method according to the inventive concept; and

[0051] FIG. 11A to FIG. 11D is a diagram illustrating still another exemplary embodiment of a laser processing method according to the inventive concept. DETAILED DESCRIPTION

[0052] The inventive concept will now be more fully described below with reference to the accompanying drawings in which various exemplary embodiments are shown. However, the inventive concept can be implemented in many different forms and should not be construed as being limited to the exemplary embodiments set forth herein. Instead, these exemplary embodiments are provided so that this disclosure will be thorough and complete and will fully convey the scope of the inventive concept to those skilled in the art. The same reference numerals represent the same elements throughout.

[0053] It will be understood that when an element such as a layer, region, or substrate is referred to as being "on" another element, the element can be directly on the other element, or intervening elements may be present. In contrast, the term "directly" means that there are no intervening elements. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0054] The terms used herein are only for the purpose of describing specific exemplary embodiments and are not intended to be limiting. As used herein, unless the context clearly indicates otherwise, the singular forms of "one", "one (kind / person)" and "the (described)" are intended to include plural forms, including "at least one (kind / person)". "Or" means "and / or". As used herein, the term "and / or" includes any combination and all combinations of one or more of the relevant listed items. It will also be understood that when the term "includes" and / or its variations or "comprising" and / or its variations are used in this specification, it is explained that there are stated features, regions, wholes, steps, operations, elements and / or components, but it is not excluded that there are or add one or more other features, regions, wholes, steps, operations, elements, components and / or their groups.

[0055] For ease of description, spatially relative terms such as "under", "below", "below", "above", "above", etc. may be used herein to describe the relationship between an element or feature as shown in the figure and another (additional) element or feature. It will be understood that, in addition to the orientation depicted in the figure, the spatially relative terms are intended to include different orientations of the device in use or operation. For example, if the device in the figure is turned over, the element described as "below" or "below" other elements or features will then be positioned as "above" the other elements or features. Therefore, the exemplary term "below" can include both above and below orientations. The device can be positioned otherwise (rotated 90 degrees or at other orientations), and the spatially relative descriptors used herein are interpreted accordingly.

[0056] It will be understood that, although the terms first, second, etc. can be used here to describe various elements, components, regions, layers and / or parts, these elements, components, regions, layers and / or parts should not be limited by these terms. These terms are only used to distinguish an element, component, region, layer or part from another element, component, region, layer or part. Therefore, without departing from the teachings here, the first element, first component, first region, first layer or first part discussed below can be named as the second element, second component, second region, second layer or second part.

[0057] As used herein, "about" or "approximately" is inclusive of the stated value and means: within an acceptable range of variation for the particular value as determined by one of ordinary skill in the art, taking into account the measurements referred to and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system).

[0058] Exemplary embodiments are described herein with reference to cross-sectional views and / or plan views that are ideal exemplary illustrations. In the accompanying drawings, the thickness of layers and regions are exaggerated for clarity. Therefore, variations in the shapes of the illustrations caused by, for example, manufacturing techniques and / or tolerances are to be expected. Therefore, the exemplary embodiments should not be interpreted as being limited to the shapes of the regions shown here, but will include deviations in shapes caused by, for example, manufacturing. For example, an etched region shown as a rectangle will typically have rounded or curved features. Therefore, the regions shown in the accompanying drawings are schematic in nature, and their shapes are not intended to illustrate the actual shape of regions of the device, and are not intended to limit the scope of the exemplary embodiments.

[0059] Hereinafter, exemplary embodiments of the inventive concept will be described in detail with reference to the accompanying drawings.

[0060] Figure 1A is a perspective view illustrating an exemplary embodiment of a display device according to the inventive concept. Figure 1B is an exploded perspective view showing an exemplary embodiment of a display device according to the inventive concept. Figure 1A and Figure 1B To describe exemplary embodiments of the inventive concept.

[0061] The display device EA can be activated by an electrical signal. The display device EA can be implemented as various exemplary embodiments. For example, the display device EA may include, for example, a tablet computer, a notebook computer, a personal computer, a television, or a smart phone. In the following, a smart phone is shown as an example of the display device EA.

[0062] like Figure 1A As shown in the figure, the display device EA can display an image IM toward a third direction DR3 on a display surface FS that is parallel to the first direction DR1 and the second direction DR2. Here, the first direction DR1, the second direction DR2, and the third direction DR3 are perpendicular to each other, and respectively follow the directions of corresponding arrows as shown in the figure. The display surface FS on which the image IM is displayed may correspond to the front surface of the display device EA, and may correspond to the front surface of the window 100. Hereinafter, the display surface FS and the front surface of the display device EA and the front surface of the window 100 will be represented by the same figure marks. The image IM may include a dynamic image and a static image. Figure 1A , a time display frame and application icons are shown as examples of the image IM.

[0063] Hereinafter, the front surface (or top surface) and the rear surface (or bottom surface) of each member may be defined based on the direction (e.g., the third direction DR3) on which the image IM is displayed. The front surface and the rear surface may be opposite to each other in the third direction DR3, and the normal direction of each of the front surface and the rear surface may be parallel to the third direction DR3. However, the directions indicated by the first direction DR1, the second direction DR2, and the third direction DR3 may be relative concepts and may be changed to other directions.

[0064] The display apparatus EA may include a window 100, a display module 200, a driving circuit unit 300, a case 400, and an electronic module 500. In an exemplary embodiment, the window 100 and the case 400 may be combined with each other to form the exterior of the display apparatus EA.

[0065] The window 100 may include an optically transparent insulating material. For example, the window 100 may include glass or plastic. The window 100 may have a single-layer structure or a multi-layer structure. For example, the window 100 may include a plurality of plastic films bonded to each other by an adhesive, or may include a glass substrate and a plastic film bonded to each other by an adhesive.

[0066] When viewed in a plan view, the window 100 may include a transmissive area TA and a frame area BZA. The sentence "when viewed in a plan view" or "in a plan view" used herein refers to the sentence "when viewed in a direction opposite to the third direction DR3". In addition, the term "thickness direction" refers to the third direction DR3.

[0067] The transmission area TA may be optically transparent. The light transmittance of the frame area BZA may be lower than the light transmittance of the transmission area TA. The frame area BZA may define the shape of the transmission area TA. In a plan view, the frame area BZA may be adjacent to the transmission area TA and may surround the transmission area TA.

[0068] The bezel area BZA may have a predetermined color. The bezel area BZA may cover the peripheral area NAA of the display module 200 to prevent the peripheral area NAA from being visible to the outside. However, the inventive concept is not limited thereto. In another exemplary embodiment of the inventive concept, the bezel area BZA may be omitted in the window 100.

[0069] In an exemplary embodiment, the sensor areas SA1 and SA2 may be areas overlapping with the electronic module 500. The electronic module 500 will be described in detail later. The display device EA may receive an external signal required by the electronic module 500 through the sensor areas SA1 and SA2, and / or may provide a signal output from the electronic module 500 to the outside through the sensor areas SA1 and SA2. According to the inventive concept, the sensor areas SA1 and SA2 may be defined to overlap with the transmission area TA. Therefore, the additional area for the sensor areas SA1 and SA2 outside the transmission area TA may be omitted. Therefore, the area (or size) of the frame area BZA may be reduced.

[0070] exist Figure 1B In FIG. 1 , two sensor areas SA1 and SA2 are shown as examples. However, the inventive concept is not limited thereto. In some exemplary embodiments, the number of sensor areas may be three or more, or one of the sensor areas SA1 and SA2 may be omitted and a single sensor area may be defined. Figure 1B In the embodiment, the sensor areas SA1 and SA2 are defined at the upper left of the transmission area TA. Alternatively, the sensor areas SA1 and SA2 may be defined at one of other various positions of the transmission area TA, such as the upper right, the middle, the lower left, and the lower right. In a certain exemplary embodiment, the first sensor area SA1 may be defined at the upper left of the transmission area TA, and the second sensor area SA2 may be defined at the upper right of the transmission area TA.

[0071] The display module 200 may be disposed below the window 100. The term "below" as used herein refers to a direction opposite to a direction in which the display module 200 provides an image (i.e., a direction opposite to the third direction DR3). The display module 200 may display an image IM and may sense an external input TC. The display module 200 may include a front surface IS including an active area AA and a peripheral area NAA. The active area AA may be an area activated by an electrical signal.

[0072] In an exemplary embodiment, the active area AA may be an area in which the image IM is displayed, and may also be an area in which the external input TC is sensed. The transmissive area TA may overlap at least the active area AA. For example, the transmissive area TA may overlap the entire active area AA or at least a portion of the active area AA. Therefore, the user may view the image IM through the transmissive area TA, and / or may provide the external input TC through the transmissive area TA.

[0073] The peripheral area NAA may be covered by the frame area BZA. The peripheral area NAA may be adjacent to the active area AA. When viewed in a plan view, the peripheral area NAA may surround the active area AA. A driving circuit and / or a driving line for driving the active area AA may be provided in the peripheral area NAA.

[0074] In an exemplary embodiment, the display module 200 can be assembled in a flat state with the active area AA and the peripheral area NAA facing the window 100. However, the inventive concept is not limited thereto. In another exemplary embodiment, a portion of the peripheral area NAA may be bent. In this case, a portion of the peripheral area NAA may face the rear surface of the display device EA, and thus the area (or size) of the border area BZA in the front surface of the display device EA may be reduced. In yet another exemplary embodiment, the display module 200 may be assembled in a state where a portion of the active area AA is also bent. In yet another exemplary embodiment, the peripheral area NAA may be omitted in the display module 200.

[0075] The display module 200 may include a display panel 210 and an input sensing layer 220 .

[0076] The display panel 210 may be a component that substantially generates an image IM. The image IM generated from the display panel 210 may be displayed on the front surface IS of the display module 200 and may be visible to a user through the transmissive area TA.

[0077] The input sensing layer 220 may sense external input TC applied from the outside. For example, the input sensing layer 220 may sense external input TC provided to the window 100. The external input TC may be an input of a user. The input of the user may include at least one of various external inputs such as a part of the user's body (e.g., a finger), light, heat, a pen, and pressure. Figure 1A In the exemplary embodiment of the present invention, the user's hand applied to the display surface FS is shown as an example of the external input TC. However, the inventive concept is not limited thereto. In other words, the external input TC may be provided in various forms as described above. In some exemplary embodiments, the display device EA may also sense the external input TC applied to the side surface and / or the rear surface of the display device EA according to the structure of the display device EA.

[0078] The driving circuit unit 300 may be electrically connected to the display panel 210 and the input sensing layer 220. The driving circuit unit 300 may include a main circuit board MB, a first flexible film CF1, and a second flexible film CF2.

[0079] The first flexible film CF1 may be electrically connected to the display panel 210. The first flexible film CF1 may connect the display panel 210 and the main circuit board MB. The first flexible film CF1 may be connected to a pad (also referred to as a "pad" or "pad") (display pad) of the display panel 210. The pad is disposed in the peripheral area NAA. The first flexible film CF1 may provide an electrical signal for driving the display panel 210 to the display panel 210. The electrical signal may be generated in the first flexible film CF1, or may be generated in the main circuit board MB.

[0080] The second flexible film CF2 may be electrically connected to the input sensing layer 220. The second flexible film CF2 may connect the input sensing layer 220 and the main circuit board MB. The second flexible film CF2 may be connected to a pad (sensing pad) of the input sensing layer 220. The pad is provided in the peripheral area NAA. The second flexible film CF2 may provide an electrical signal for driving the input sensing layer 220 to the input sensing layer 220. The electrical signal may be generated in the second flexible film CF2, or may be generated in the main circuit board MB.

[0081] The main circuit board MB may include various types of driving circuits for driving the display module 200 and / or a connector for supplying power. The first flexible film CF1 and the second flexible film CF2 may be connected to the main circuit board MB. According to an exemplary embodiment of the inventive concept, the display module 200 may be easily controlled by one main circuit board MB. However, the inventive concept is not limited thereto. In other exemplary embodiments, the display panel 210 and the input sensing layer 220 of the display module 200 may be connected to different main circuit boards, or one of the first flexible film CF1 and the second flexible film CF2 may not be connected to the main circuit board MB.

[0082] In an exemplary embodiment, a portion of the display module 200 corresponding to the sensor areas SA1 and SA2 may have a transmittance higher than a transmittance of a portion of the active area AA not overlapping the sensor areas SA1 and SA2. For example, a portion of the display panel 210 corresponding to the sensor areas SA1 and SA2 and a portion of the input sensing layer 220 corresponding to the sensor areas SA1 and SA2 may be removed. Therefore, the electronic module 500 overlapping the sensor areas SA1 and SA2 may easily transmit and / or receive signals through the sensor areas SA1 and SA2.

[0083] Figure 1BAn example is shown in which predetermined holes MH1 and MH2 (hereinafter, referred to as through holes MH1 and MH2) are defined in the area of ​​the display module 200 corresponding to the sensor areas SA1 and SA2. The through holes MH1 and MH2 may be defined in the active area AA and may penetrate the display module 200. The through holes MH1 and MH2 may penetrate the display panel 210 and the input sensing layer 220. In other words, the through holes MH1 and MH2 may be formed by removing a portion of the display panel 210 overlapping the sensor areas SA1 and SA2 and a portion of the input sensing layer 220 overlapping the sensor areas SA1 and SA2. Since the through holes MH1 and MH2 are defined in the active area AA, the sensor areas SA1 and SA2 may be disposed in the transmissive area TA.

[0084] The electronic module 500 may include a first electronic module 501 and a second electronic module 502. When viewed in a plan view, the first electronic module 501 and the second electronic module 502 may overlap with the through holes MH1 and MH2 and overlap with the sensor areas SA1 and SA2. The first electronic module 501 and the second electronic module 502 may be disposed below the display module 200. At least portions of the first electronic module 501 and the second electronic module 502 may be accommodated in the through holes MH1 and MH2. The first electronic module 501 and the second electronic module 502 may receive an external input TC transmitted through the sensor areas SA1 and SA2, and / or may provide an output signal through the sensor areas SA1 and SA2.

[0085] The case 400 may be coupled to the window 100. The case 400 and the window 100 may be coupled to each other to provide an inner space. The display module 200 and the electronic module 500 may be accommodated in the inner space.

[0086] The case 400 may be formed of a material having relatively high rigidity. For example, the case 400 may include a plurality of frames and / or plates made of glass, plastic, metal, or a combination thereof. The case 400 may stably protect the components of the display device EA housed in the internal space from external impacts.

[0087] Figure 2 is along Figure 1B A cross-sectional view taken along line II′.

[0088] Reference Figure 2 In addition to the display panel 210 and the input sensing layer 220 described above, the display module 200 may further include an anti-reflection layer RPL, a first protective film PL1, and a second protective film PL2. However, the inventive concept is not limited thereto. In another exemplary embodiment, the first protective film PL1 and the second protective film PL2 may be omitted.

[0089] The display panel 210 may include a base layer BS, a circuit layer ML, an emission layer EL, and an encapsulation layer ECL.

[0090] The base layer BS may include a flexible material. For example, the base layer BS may be a plastic substrate. In an exemplary embodiment, the plastic substrate may include at least one of acrylic resin, methacrylic resin, polyisoprene, vinyl resin, epoxy resin, polyurethane resin, cellulose resin, siloxane resin, polyimide resin, polyamide resin, and perylene resin. For example, the base layer BS may include a single layer formed of a polyimide resin. However, the inventive concept is not limited thereto. In another exemplary embodiment, the base layer BS may be a stacked structure including a plurality of insulating layers.

[0091] The circuit layer ML may be disposed on the base layer BS. The circuit layer ML may include a plurality of insulating layers, a plurality of conductive layers, and a semiconductor layer.

[0092] The emission layer EL may be disposed on the circuit layer ML. The emission layer EL may include a display element. For example, the emission layer EL of the organic light emitting display panel may include an organic light emitting material as a display element. The emission layer EL of the quantum dot light emitting display panel may include quantum dots and / or quantum rods as display elements.

[0093] The encapsulation layer ECL may encapsulate the emission layer EL. In some exemplary embodiments, the encapsulation layer ECL may include a plurality of inorganic layers and at least one organic layer disposed between the inorganic layers.

[0094] The first protection film PL1 may be disposed under the display panel 210. The first protection film PL1 may be adhered to the rear surface of the display panel 210 to protect the display panel 210. The first protection film PL1 may be, for example, a polyimide film or a polyethylene terephthalate ("PET") film.

[0095] The input sensing layer 220 may be disposed on the display panel 210. The input sensing layer 220 may have a multi-layer structure of a panel type or a layer type. The panel type input sensing layer 220 may be bonded to the display panel 210 by an optically transparent adhesive member disposed between the input sensing layer 220 and the display panel 210. The layer type input sensing layer 220 may be directly disposed on a base surface provided by the display panel 210, and the base surface may be a top surface of the encapsulation layer ECL.

[0096] The input sensing layer 220 may include a sensing electrode, a signal line connected to the sensing electrode, and at least one insulating layer. The input sensing layer 220 may sense the external input TC by, for example, a capacitive sensing method. However, the inventive concept is not limited to the capacitive sensing method of the input sensing layer 220. In other exemplary embodiments, the input sensing layer 220 may sense the external input TC by an electromagnetic induction method or a pressure sensing method.

[0097] The anti-reflection layer RPL may be disposed on the input sensing layer 220. The anti-reflection layer RPL may reduce the reflection from the window 100 (see Figure 1A )’s reflectivity of external light incident from the upper part.

[0098] The anti-reflection layer RPL according to an exemplary embodiment of the inventive concept may include a retarder and a polarizer. The retarder may be a film type or a liquid crystal coating type, and may include a λ / 2 retarder and / or a λ / 4 retarder. The polarizer may also be a film type or a liquid crystal coating type. The film type may include a stretchable synthetic resin film, and the liquid crystal coating type may include arranged liquid crystals. The retarder and the polarizer may also include a protective film. The retarder and the polarizer may be defined as a base layer of the anti-reflection layer RPL, or the protective film may be defined as a base layer of the anti-reflection layer RPL.

[0099] The anti-reflection layer RPL according to an exemplary embodiment of the inventive concept may include a color filter. The color filter may be arranged in a predetermined form. The arrangement of the color filter may be determined in consideration of the luminous color of the pixel included in the display panel 210. The anti-reflection layer RPL may further include a black matrix adjacent to the color filter.

[0100] The anti-reflection layer RPL according to an exemplary embodiment of the inventive concept may include a destructive interference structure. For example, the destructive interference structure may include a first reflective layer and a second reflective layer disposed on different layers from each other. The first reflected light reflected from the first reflective layer and the second reflected light reflected from the second reflective layer may destructively interfere with each other, thereby reducing the reflectivity of external light.

[0101] The second protection film PL2 may be disposed on the anti-reflection layer RPL. In an exemplary embodiment, when the display module 200 is coupled to the window 100 (see Figure 1A ), the second protective film PL2 may be removed. Alternatively, the second protective film PL2 may remain in the final product. In this case, the second protective film PL2 may be a transparent protective film.

[0102] The through hole MH1 may be formed by removing a portion of the display module 200 corresponding to the first sensor area SA1. A structure for blocking a permeation path of external moisture and / or oxygen may be provided around the through hole MH1. In addition, the emission layer EL may be spaced apart from the through hole MH1. Therefore, even if the through hole MH1 is defined or formed, the emission layer EL may be covered by the encapsulation layer ECL.

[0103] Figure 3 is an enlarged bottom plan view illustrating an exemplary embodiment of a portion of a display module before forming a through hole according to the inventive concept. Figure 4 During the first cutting process Figure 3 In the following, reference will be made to Figure 3 and Figure 4 To describe exemplary embodiments of the inventive concept.

[0104] A through hole MH1 penetrating the display module 200 from the lowermost surface to the uppermost surface of the display module 200 may be formed using a laser patterning process (see Figure 1B ). The display module 200 may be a processing object (ie, an object to be processed).

[0105] Define the through hole MH1 (see Figure 1B ) is shown in the rear surface of the display module 200. The boundary BD may be circular in shape. The boundary BD may correspond to the first sensor area SA1. The laser beam may be irradiated corresponding to the boundary BD. Figure 3 , a circular boundary BD is shown as an example. However, the inventive concept is not limited thereto. For example, the processed shape may be one of various shapes such as a polygonal shape and a closed loop shape including at least one curvature portion.

[0106] The laser beam LZ1 may be irradiated in the third direction DR3 to the display module 200. In this specification, irradiating the laser beam LZ1 to the boundary BD may be defined as an irradiation process.

[0107] The power, processing speed and frequency of the laser beam LZ1 used in the laser patterning process can be changed differently according to the type of the processing object and / or the patterning depth. For example, the power of the laser beam LZ1 can be selected in the range of 0.5 watts (W) to 30W, the processing speed of the laser beam LZ1 can be selected in the range of 50 millimeters per second (mm / s) to 6,000 mm / s, and the frequency of the laser beam LZ1 can be selected in the range of 100 kilohertz (kHz) to 20,000 kHz. However, the power, processing speed and frequency of the laser beam LZ1 according to the inventive concept are not limited to the range. In addition, the power and processing speed of the laser beam LZ1 can be changed according to the layer irradiated by the laser beam LZ1.

[0108] Figure 5A is a diagram illustrating an exemplary embodiment of a laser processing method during a first cutting process according to the inventive concept. Figure 5B is a diagram showing an exemplary embodiment of a laser processing method during a first cutting process according to the inventive concept. Figure 4 , Figure 5A and Figure 5B To describe exemplary embodiments of the inventive concept.

[0109] A display module 200 including a plurality of layers may be prepared. The plurality of layers may include a first protective film PL1, a display panel 210, an input sensing layer 220, an anti-reflection layer RPL, and a second protective film PL2. The through hole MH1 (see Figure 1B ) is formed in the display module 200.

[0110] Figure 5A and Figure 5B 2 is a diagram showing a first cutting process for forming the through hole MH1. For example, the first cutting process may include at least one irradiation process of irradiating a laser beam LZ1 (hereinafter, referred to as the first laser beam LZ1). Portions of the first protection film PL1, the display panel 210, and the input sensing layer 220 corresponding to the boundary BD may be cut during the first cutting process.

[0111] The first cutting process may include one irradiation process, or may include a plurality of irradiation processes. In an exemplary embodiment, the first cutting process may include a first irradiation process LI1 and a second irradiation process LI2. The second irradiation process LI2 may be performed after the first irradiation process LI1.

[0112] exist Figure 5A FIG. 4 shows a path LZ1 - 1 of the first laser beam LZ1 in the first irradiation process LI1 . Figure 5B Path LZ1 - 2 of the first laser beam LZ1 in the second irradiation process LI2 is shown in FIG.

[0113] In the first irradiation process LI1, the starting point SP1 and the end point EP1 of the path LZ1-1 may be identical to each other. In addition, in the second irradiation process LI2, the starting point SP2 and the end point EP2 of the path LZ1-2 may be identical to each other. In other words, in each of the first irradiation process LI1 and the second irradiation process LI2, the first laser beam LZ1 may be irradiated to the entire portion of the boundary BD. In addition, the end point EP1 of the path LZ1-1 may be identical to the starting point SP2 of the path LZ1-2. For example, in the first irradiation process LI1, the first laser beam LZ1 may be irradiated along the first boundary, and in the second irradiation process LI2, the first laser beam LZ1 may be irradiated along the first boundary. The first boundary may correspond to the boundary BD.

[0114] In an exemplary embodiment, the first irradiation process LI1 and the second irradiation process LI2 may be performed continuously. Therefore, the first time interval between the end time of the first irradiation process LI1 and the start time of the second irradiation process LI2 may be 0 seconds. However, the inventive concept is not limited thereto. In another exemplary embodiment, the first time interval may be greater than 0 seconds. For example, the first time interval may range from 0 seconds to 1 second. However, the range of the first time interval is not limited thereto.

[0115] In some exemplary embodiments, when the first time interval is greater than 0 seconds, the first time interval may be provided immediately after each irradiation process, or the first time interval may be provided immediately after a plurality of irradiation processes. For example, when the first cutting process includes ten irradiation processes, the time intervals between some irradiation processes may be different from the time intervals between other irradiation processes. For example, the time interval between the first irradiation process to the fifth irradiation process and the time interval between the sixth irradiation process to the tenth irradiation process may be 0 seconds, and the time interval between the fifth irradiation process and the sixth irradiation process may be greater than 0 seconds.

[0116] The diameter of the boundary BD may be 5 mm or less. Because the diameter of the boundary BD is small, the heat may not be fully diffused around the starting point immediately after the first laser beam LZ1 is irradiated once. In this case, when the first laser beam LZ1 is repeatedly irradiated to the boundary BD without a time interval between the irradiation processes, heat accumulates in the display module 200. Therefore, the area (or size) of the heat-affected zone may increase, and / or bubbles may be generated between the layers of the display module 200 due to thermal deformation. However, according to an exemplary embodiment of the inventive concept, a time interval may be set between the irradiation processes to ensure the time provided for the heat diffusion to the processing object. As a result, the area of ​​the heat-affected zone can be prevented from increasing, so that the occurrence of defects can be minimized and the reliability of the product can be improved.

[0117] Figure 6 During the second cutting process Figure 3 A cross-sectional view taken along line II-II′. Fig. 7A is a diagram illustrating an exemplary embodiment of a laser processing method during a second cutting process according to the inventive concept. Figure 7B is a diagram showing an exemplary embodiment of a laser processing method during a second cutting process according to the inventive concept. Figure 4 , Figure 5A , Figure 5B , Figure 6 , Fig. 7A and Figure 7B To describe embodiments of the inventive concept.

[0118] The time interval described above can be adjusted according to the properties of the layers included in the processing object. For example, the display module 200 may include multiple layers. The thermal deformation temperatures of the multiple layers may be different from each other. When the temperature rises, since the thermal deformation temperature of the layer is relatively low, deformation due to heat will occur rapidly.

[0119] The laser beam LZ2 (hereinafter, referred to as the second laser beam LZ2) may be irradiated to the display module 200. The second laser beam LZ2 may be irradiated to the anti-reflection layer RPL. The anti-reflection layer RPL of the display module 200 may have a heat deformation temperature lower than that of the base layer BS, the circuit layer ML, the emission layer EL, the encapsulation layer ECL, and the input sensing layer 220. For example, the anti-reflection layer RPL may be formed by dyeing a polyvinyl alcohol ("PVA") film with an iodine compound. The heat deformation temperature of the PVA film may be lower than that of the other layers.

[0120] The irradiation process of irradiating the second laser beam LZ2 to the anti-reflection layer RPL may be referred to as a second cutting process. The second cutting process may include a third irradiation process LI3 and a fourth irradiation process LI4. The fourth irradiation process LI4 may be performed after the third irradiation process LI3.

[0121] exist Fig. 7A FIG. 4 shows a path LZ2-1 of the second laser beam LZ2 in the third irradiation process LI3. Figure 7B Schematic diagram showing a path LZ2 - 2 of the second laser beam LZ2 in the fourth irradiation process LI4 .

[0122] In the third irradiation process LI3, the starting point SP3 and the end point EP3 of the path LZ2-1 may be identical to each other. In addition, in the fourth irradiation process LI4, the starting point SP4 and the end point EP4 of the path LZ2-2 may be identical to each other. For example, in the third irradiation process LI3, the second laser beam LZ2 may be irradiated along the second boundary, and in the fourth irradiation process LI4, the second laser beam LZ2 may be irradiated along the third boundary. The second boundary and the third boundary may correspond to the boundary BD.

[0123] In an exemplary embodiment, the second time interval between the end time of the third irradiation process LI3 and the start time of the fourth irradiation process LI4 may be greater than 0 seconds. In an exemplary embodiment, the second time interval may be greater than 0 seconds. Figure 5A and Figure 5B The first time interval described is large. For example, the second time interval may range from 1 millisecond (msec) to 10 seconds. However, the range of the second time interval is not limited thereto. As the second time interval increases, the time in which the heat diffuses may increase. Therefore, as the second time interval increases, the increase in the area of ​​the heat affected zone may be reduced. In an exemplary embodiment, the second time interval may be provided immediately after each irradiation process.

[0124] According to an exemplary embodiment of the inventive concept, the time interval between the irradiation processes of the laser processing method can be adjusted according to the thermal deformation temperature of the target layer to be processed. For example, when a through hole is formed in a layer with a relatively high thermal deformation temperature, the time interval can be 0 seconds or can be omitted. On the contrary, when a through hole is formed in a layer with a relatively low thermal deformation temperature, the time interval can be greater than 0 seconds or can be greater than the time interval of other layers with relatively high thermal deformation temperatures. Therefore, thermal damage to the processing object can be minimized or prevented by adjusting the time interval (e.g., the delay time before the start time of the next irradiation process).

[0125] In an exemplary embodiment, in the second cutting process, a second time interval may be provided at every n irradiation processes of the second laser beam LZ2, with reference to Figure 5A and Figure 5B In the first cutting process described, the first time interval may be provided for every m irradiation processes of the first laser beam LZ1. Here, "n" and "m" are natural numbers, and "n" may be smaller than "m". Therefore, when the laser beam is irradiated to a layer having a relatively low thermal deformation temperature (e.g., the second cutting process), the time interval between the irradiation processes may be provided more frequently than the time interval between the irradiation processes when the laser beam is irradiated to a layer having a relatively high thermal deformation temperature (e.g., the first cutting process).

[0126] The second laser beam LZ2 may be irradiated to a layer whose thermal deformation temperature is lower than that of the layer irradiated by the first laser beam LZ1. The power and irradiation speed of the second laser beam LZ2 may be equal to or different from the power and irradiation speed of the first laser beam LZ1. For example, the power of the second laser beam LZ2 may be weaker than that of the first laser beam LZ1. The irradiation speed of the second laser beam LZ2 may be faster than that of the first laser beam LZ1. Therefore, the degree of thermal deformation of the layer irradiated by the second laser beam LZ2 may be reduced.

[0127] In an exemplary embodiment, the first laser beam LZ1 and the second laser beam LZ2 may be irradiated along the same boundary BD However, the inventive concept is not limited thereto.

[0128] exist Figure 4 and Figure 6 In the embodiment of the present invention, the cutting process may be performed from the rear surface of the display module 200. For example, the cutting process may be performed in a direction from the first protective film PL1 toward the second protective film PL2 (e.g., a third direction DR3). However, the inventive concept is not limited thereto. In another exemplary embodiment, the cutting process may be performed from the top surface (or front surface) of the display module 200. In this case, the cutting process may be performed in a direction from the second protective film PL2 toward the first protective film PL1 (e.g., a direction opposite to the third direction DR3).

[0129] In yet another exemplary embodiment, the cutting process may be performed on some components (e.g., layers) of the display module 200 in a direction from the first protection film PL1 toward the second protection film PL2, and the cutting process may be performed on other components of the display module 200 in a direction from the second protection film PL2 toward the first protection film PL1. Figure 6 In the process, a cutting process from the first protective film PL1 to the input sensing layer 220 can be performed in a direction from the first protective film PL1 toward the second protective film PL2, and a cutting process from the second protective film PL2 to the anti-reflection layer RPL can be performed in a direction from the second protective film PL2 toward the first protective film PL1.

[0130] Fig. 8A is a diagram illustrating a portion of another exemplary embodiment of a laser processing method according to the inventive concept. Figure 8B is a diagram illustrating another portion of an exemplary embodiment of a laser processing method according to the inventive concept. Figure 8C is a diagram illustrating still another part of an exemplary embodiment of a laser processing method according to the inventive concept. Fig.8D is a diagram illustrating still another part of an exemplary embodiment of a laser processing method according to the inventive concept.

[0131] In detail, Fig. 8A shows a path LZa of the laser beam irradiated in the first irradiation process LI1a, Figure 8B shows a path LZb of the laser beam irradiated in the second irradiation process LI2a, Figure 8C shows a path LZc of the laser beam irradiated in the third irradiation process LI3a, Fig.8D FIG. 4 shows a path LZd of the laser beam irradiated in the fourth irradiation process LI4a. Figure 4 The first laser beam LZ1 described and reference Figure 6The described second laser beam LZ2 can be applied to the laser beam.

[0132] The first irradiation process LI1a, the second irradiation process LI2a, ​​the third irradiation process LI3a, and the fourth irradiation process LI4a may be repeated in sequence. According to an exemplary embodiment of the inventive concept, the first starting point SPa of the first irradiation process LI1a, the second starting point SPb of the second irradiation process LI2a, ​​the third starting point SPc of the third irradiation process LI3a, and the fourth starting point SPd of the fourth irradiation process LI4a may be different from each other. In addition, the first end point EPa of the first irradiation process LI1a, the second end point EPb of the second irradiation process LI2a, ​​the third end point EPc of the third irradiation process LI3a, and the fourth end point EPd of the fourth irradiation process LI4a may be different from each other.

[0133] If the first starting point SPa, the second starting point SPb, the third starting point SPc, and the fourth starting point SPd are identical to each other, the heat-affected zone will be concentrated in a specific area. Therefore, the area of ​​the heat-affected zone will be uneven. This will increase the defective rate of the product compared to the case where the heat-affected zone is evenly distributed. According to an exemplary embodiment of the inventive concept, the position of the irradiation starting point of the laser beam can be changed. For example, the second starting point SPb can be spaced 90 degrees from the first starting point SPa along the path of the laser beam relative to the center of the circular path of the laser beam. The third starting point SPc can be spaced 90 degrees from the second starting point SPb along the path of the laser beam. The fourth starting point SPd can be spaced 90 degrees from the third starting point SPc along the path of the laser beam. The position of the irradiation starting point of the laser beam can be changed with each irradiation process to prevent heat from being concentrated in a specific area, thereby reducing the unevenness of the area of ​​the heat-affected zone or minimizing the unevenness of the area of ​​the heat-affected zone. As a result, the defective rate can be reduced, thereby improving the reliability of the product.

[0134] exist FIG. 8A to FIG. 8D In the embodiment, the adjacent starting points are spaced apart from each other by 90 degrees relative to the center of the circular path of the laser beam. However, the inventive concept is not limited thereto. In other exemplary embodiments, the adjacent starting points may be spaced apart from each other by 180 degrees, or may be spaced apart from each other by 30 degrees.

[0135] Furthermore, if the positions of the first to fourth starting points are identical to each other, the portion corresponding to the position of the starting point may not be completely cut. If the uncut portion is physically removed, the display module 200 may be damaged. However, according to an exemplary embodiment of the inventive concept, FIG. 8A to FIG. 8D As shown in , the positions of the first starting point SPa, the second starting point SPb, the third starting point SPc, and the fourth starting point SPd may be different from each other, and thus the possibility of occurrence of an uncut portion may be reduced.

[0136] Fig. 9 is an enlarged bottom plan view illustrating an exemplary embodiment of a portion of a display module according to the inventive concept.

[0137] Fig. 9 The base layer BS and the circuit layer ML (see Figure 2 ) is a plan view of a surface in contact with the substrate layer BS. The sidewall portion SW of the base layer BS may define the through hole MH1. The first recess CCa, the second recess CCb, the third recess CCc, and the fourth recess CCd may be defined in the sidewall portion SW.

[0138] The side wall portion SW may be formed to be aligned with the boundary BD described above (see Figure 3 The first concave portion CCa, the second concave portion CCb, the third concave portion CCc, and the fourth concave portion CCd may be regions recessed from the side wall portion SW.

[0139] The first concave portion CCa can be seen by referring to Fig. 8A The second concave portion CCb can be formed by the first irradiation process LI1a described above. Figure 8B The third concave portion CCc can be formed by the second irradiation process LI2a described above. Figure 8C The fourth concave portion CCd can be formed by the third irradiation process LI3a described above. Fig.8D The fourth irradiation process LI4a described is formed.

[0140] The position of the first recess CCa may correspond to the position of the first starting point SPa and the first end point EPa, the position of the second recess CCb may correspond to the position of the second starting point SPb and the second end point EPb, the position of the third recess CCc may correspond to the position of the third starting point SPc and the third end point EPc, and the position of the fourth recess CCd may correspond to the position of the fourth starting point SPd and the fourth end point EPd. The portion of the side wall portion SW corresponding to the position of the starting point and the end point described above may be etched more than the other portions of the side wall portion SW. Therefore, the recesses CCa, CCb, CCc, and CCd may be formed in the regions corresponding to the positions of the starting point and the end point.

[0141] Fig. 10A is a diagram illustrating a portion of still another exemplary embodiment of a laser processing method according to the inventive concept. Fig. 10B is a diagram illustrating another portion of an exemplary embodiment of a laser processing method according to the inventive concept. Fig. 10C is a diagram illustrating still another part of an exemplary embodiment of a laser processing method according to the inventive concept. Fig. 10D is a diagram illustrating still another part of an exemplary embodiment of a laser processing method according to the inventive concept.

[0142] In detail, Fig. 10A shows a path LZa1 of the laser beam irradiated in the first irradiation process LI1b, Fig. 10B shows a path LZb1 of the laser beam irradiated in the second irradiation process LI2b, Fig. 10C shows a path LZc1 of the laser beam irradiated in the third irradiation process LI3b, Fig. 10D A path LZd1 of a laser beam irradiated in the fourth irradiation process LI4b is shown. The first irradiation process LI1b, the second irradiation process LI2b, the third irradiation process LI3b, and the fourth irradiation process LI4b may be sequentially repeated.

[0143] In each of the first irradiation process LI1b, the second irradiation process LI2b, the third irradiation process LI3b, and the fourth irradiation process LI4b, the laser beam may be irradiated to only a portion of the boundary BD. For example, when the boundary BD has a circular shape, the laser beam may be irradiated to an area corresponding to a semicircle in each of the first irradiation process LI1b, the second irradiation process LI2b, the third irradiation process LI3b, and the fourth irradiation process LI4b.

[0144] In the first irradiation process LI1b, the first end point EPa1 may be spaced 180 degrees apart from the first start point SPa1 along the path of the laser beam relative to the center of the circular path. In the second irradiation process LI2b, the second start point SPb1 may be the same as the first end point EPa1. In the second irradiation process LI2b, the second end point EPb1 may be the same as the first start point SPa1.

[0145] In an exemplary embodiment, the moving direction of the laser beam irradiated in the first irradiation process LI1b may be different from the moving direction of the laser beam irradiated in the second irradiation process LI2b. For example, the moving direction of the laser beam irradiated in the first irradiation process LI1b may be clockwise, and the moving direction of the laser beam irradiated in the second irradiation process LI2b may be counterclockwise. Therefore, the laser beam may be irradiated to the same portion of the boundary BD in the first irradiation process LI1b and the second irradiation process LI2b.

[0146] In the third irradiation process LI3b and the fourth irradiation process LI4b, the laser beam may be irradiated to the rest of the boundary BD. The third starting point SPc1 of the path LZc1 of the laser beam in the third irradiation process LI3b may be the same as the first starting point SPa1. The third end point EPc1 of the path LZc1 of the laser beam in the third irradiation process LI3b may be the same as the first end point EPa1. However, the moving direction of the laser beam irradiated in the first irradiation process LI1b may be a clockwise direction, while the moving direction of the laser beam irradiated in the third irradiation process LI3b may be a counterclockwise direction. Therefore, the laser beams of the first irradiation process LI1b and the third irradiation process LI3b may be irradiated to different areas. The fourth starting point SPd1 of the path LZd1 of the laser beam in the fourth irradiation process LI4b may be the same as the third end point EPc1. The fourth end point EPd1 of the path LZd1 of the laser beam in the fourth irradiation process LI4b may be the same as the third starting point SPc1. However, the moving direction of the laser beam irradiated in the third irradiation process LI3b may be counterclockwise, and the moving direction of the laser beam irradiated in the fourth irradiation process LI4b may be clockwise. Therefore, the laser beam may be irradiated to the same portion of the boundary BD in the third irradiation process LI3b and the fourth irradiation process LI4b. FIG. 10A to FIG. 10D The through hole MH1 formed by the laser processing method shown in Figure 1B ) is defined in a side wall portion of the PCB. Two recesses (eg, a first starting point SPa1 and a first end point EPa1) are defined in the side wall portion of the PCB.

[0147] FIG. 11A to FIG. 11D is a diagram illustrating still another exemplary embodiment of a laser processing method according to the inventive concept.

[0148] Reference Fig.11A and Fig. 11B , the processing object PO (i.e., the object to be processed) may include a first layer FL and a second layer SL. The thermal deformation temperature of the first layer FL may be lower than the thermal deformation temperature of the second layer SL. In this case, at the same temperature, the possibility that the first layer FL will be deformed may be higher than the possibility that the second layer SL will be deformed.

[0149] Reference Fig. 11B , the first laser beam LZ1a may be irradiated to the first layer FL along the first boundary BD1. This is referred to as a first irradiation process.

[0150] Reference Fig. 11C, the second laser beam LZ2a may be irradiated to the first layer FL along the second boundary BD2. This is referred to as a second irradiation process. The power of the second laser beam LZ2a may be stronger than the power of the first laser beam LZ1a. The irradiation speed of the first laser beam LZ1a in the first irradiation process may be faster than the irradiation speed of the second laser beam LZ2a in the second irradiation process.

[0151] Fig. 11C A first heat-affected zone Haz1 generated by a first laser beam LZ1a and a second heat-affected zone Haz2 generated by a second laser beam LZ2a are shown. The area of ​​the second heat-affected zone Haz2 may be larger than the area of ​​the first heat-affected zone Haz1. According to an exemplary embodiment of the inventive concept, the first boundary BD1 may surround the second boundary BD2. The second boundary BD2 may be closer to the area to be removed from the processing object PO than the first boundary BD1. Therefore, the second heat-affected zone Haz2 having a relatively large area may be removed from the processing object PO.

[0152] You can refer to FIG. 11A to FIG. 11C The first laser beam LZ1a and the second laser beam LZ2a described above are irradiated to the anti-reflection layer RPL (see Figure 6 ).For example, Fig. 7A The third irradiation process LI3 shown in FIG. Fig. 11B The process described, Figure 7B The fourth irradiation process LI4 shown in FIG. Fig. 11C However, according to Fig. 11B and Fig. 11C , the path of the second laser beam LZ2 in the third irradiation process LI3 may correspond to the first boundary BD1, and the path of the second laser beam LZ2 in the fourth irradiation process LI4 may correspond to the second boundary BD2. In this case, the first boundary BD1 may be referred to as the second boundary, and the second boundary BD2 may be referred to as the third boundary.

[0153] Reference Fig.11D , the third laser beam LZ3a may be irradiated to the second layer SL along the second boundary BD2. This is referred to as a third irradiation process. The power of the third laser beam LZ3a may be equal to the power of the second laser beam LZ2a. However, the inventive concept is not limited thereto. In addition, the irradiation speed of the third laser beam LZ3a in the third irradiation process may be equal to the irradiation speed of the second laser beam LZ2a in the second irradiation process. However, the inventive concept is not limited thereto.

[0154] In an exemplary embodiment, a time interval between the first irradiation process and the second irradiation process may be greater than a time interval between the second irradiation process and the third irradiation process. Therefore, a time in which heat provided in the first layer FL is diffused may be ensured.

[0155] In an exemplary embodiment, the third irradiation process may be performed multiple times. In this case, the first time interval between the third irradiation processes may be 0 seconds or greater. For example, when the first time interval is 0 seconds, the third irradiation process may be performed continuously. In addition, the second time interval between the first irradiation process and the second irradiation process may be greater than the first time interval. In an exemplary embodiment, the second irradiation process may be performed multiple times. In this case, the time interval between the second irradiation processes may be greater than the first time interval.

[0156] According to some exemplary embodiments of the inventive concept, by adjusting the time interval between the first irradiation process to the third irradiation process, the time during which the heat provided to the processing object diffuses can be ensured. As a result, the area of ​​the heat-affected zone can be prevented from increasing, thereby minimizing the occurrence of defects and improving the reliability of the product.

[0157] According to some exemplary embodiments of the inventive concept, a time interval may be provided between the irradiation processes of the laser beam to ensure the time for the heat provided in the processing object to diffuse. As a result, the area of ​​the heat-affected zone can be prevented from increasing, thereby minimizing the occurrence of defects. In addition, the position of the irradiation starting point of the laser beam may be changed. The position of the irradiation starting point of the laser beam may be changed to prevent the heat from being concentrated in a specific area, thereby reducing the unevenness of the area of ​​the heat-affected zone or minimizing the unevenness of the area of ​​the heat-affected zone. In other words, the phenomenon of uneven distribution of the heat-affected zone may be reduced.

[0158] Although the inventive concept has been described with reference to exemplary embodiments, it will be apparent to those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the inventive concept. Therefore, it should be understood that the above exemplary embodiments are not restrictive, but illustrative. Therefore, the scope of the inventive concept will be determined by the broadest permissible interpretation of the claims and their equivalents, and should not be limited or restricted by the foregoing description.

Claims

1. A method for manufacturing a display module, the method comprising the following steps: preparing a display module including a plurality of layers; as well as forming a through hole in the display module, The step of forming the through hole includes the following steps: performing a first irradiation process of irradiating a first laser beam along a first boundary defining the through hole; after performing the first irradiation process, performing a second irradiation process of irradiating a second laser beam along a second boundary; and after performing the second irradiation process, performing a third irradiation process of irradiating a third laser beam along a third boundary. wherein the time interval between the first irradiation process and the second irradiation process is shorter than the time interval between the second irradiation process and the third irradiation process, The second laser beam is irradiated to the layer having the lowest thermal deformation temperature among the multiple layers in the second irradiation process, and the third laser beam is irradiated to the layer having the lowest thermal deformation temperature among the multiple layers in the third irradiation process.

2. The method according to claim 1, wherein: A starting point of the first irradiation process, a starting point of the second irradiation process, and a starting point of the third irradiation process are different from each other.

3. The method according to claim 2, wherein: The first laser beam is irradiated to a portion of the first boundary in the first irradiation process, the second laser beam is irradiated to a portion of the second boundary in the second irradiation process, and the portion of the first boundary is identical to the portion of the second boundary.

4. The method according to claim 3, wherein: A moving direction of the first laser beam in the first irradiation process is different from a moving direction of the second laser beam in the second irradiation process.

5. The method according to claim 1, wherein: The display module comprises: Base layer; A circuit layer, disposed on the substrate layer; An emission layer, disposed on the circuit layer; An encapsulation layer, disposed on the emission layer; an input sensing layer, disposed on the packaging layer; and The anti-reflection layer is disposed on the input sensing layer.

6. The method according to claim 5, wherein: The second irradiation process irradiates the second laser beam to the anti-reflection layer, and the third irradiation process irradiates the third laser beam to the anti-reflection layer.

7. The method according to claim 5, wherein: The step of performing the first irradiation process includes forming a first recess of the base layer defining a sidewall portion of the through hole, and the step of performing the second irradiation process includes forming a second recess of the sidewall portion.

8. The method according to claim 7, wherein: The first recess is spaced apart from the second recess.

9. The method according to claim 1, wherein: The time interval between the first irradiation process and the second irradiation process is 0 seconds or more.

10. The method according to claim 1, wherein: The first irradiation process is performed a plurality of times, and a first time interval between an xth first irradiation process and an x+1th first irradiation process in the first irradiation process is 0 seconds or more, and wherein x is a natural number.

11. The method according to claim 10, wherein: The second irradiation process is performed multiple times, and a second time interval between a yth second irradiation process and a y+1th second irradiation process in the second irradiation process is greater than 0 seconds, and y is a natural number.

12. The method according to claim 11, wherein: In the first irradiation process, the first time interval is provided at every m irradiation processes of the first laser beam, and in the second irradiation process, the second time interval is provided at every n irradiation processes of the second laser beam, where m and n are natural numbers and m is greater than n.

13. The method according to claim 11, wherein: The second time interval is provided immediately after each of the second irradiation processes.

14. The method according to claim 1, wherein: The first boundary, the second boundary, and the third boundary are identical to each other.

15. A method for manufacturing a display module, the method comprising the following steps: preparing a display module including a plurality of layers; as well as forming a through hole in the display module, The step of forming the through hole includes the following steps: performing a first irradiation process of irradiating a first laser beam along a first boundary defining the through hole; after performing the first irradiation process, performing a second irradiation process of irradiating a second laser beam along a second boundary; and after performing the second irradiation process, performing a third irradiation process of irradiating a third laser beam along a third boundary. wherein the time interval between the first irradiation process and the second irradiation process is different from the time interval between the second irradiation process and the third irradiation process, Wherein, in a plan view, the third boundary is surrounded by the first boundary.

16. The method according to claim 15, wherein: The power of the first laser beam is lower than the power of the third laser beam.

17. The method according to claim 15, wherein: An irradiation speed of the first laser beam is faster than an irradiation speed of the third laser beam.

18. The method according to claim 15, wherein: The first laser beam is irradiated to a layer having a lowest thermal deformation temperature among the plurality of layers in the first irradiation process, and the second laser beam is irradiated to the layer having the lowest thermal deformation temperature among the plurality of layers in the second irradiation process.

19. A laser processing method, the laser processing method comprising forming a through hole in a processing object including a first layer and a second layer, the second layer having a higher thermal deformation temperature than the first layer, in, The step of forming the through hole comprises the following steps: performing a first irradiation process of irradiating a first laser beam to the first layer along a first boundary; After the step of performing the first irradiation process, performing a second irradiation process of irradiating a second laser beam to the first layer along a second boundary; and performing a third irradiation process of irradiating a third laser beam to the second layer along the second boundary, The time interval between the first irradiation process and the second irradiation process is greater than the time interval between the second irradiation process and the third irradiation process.

20. The laser processing method according to claim 19, wherein: In a plan view, the second boundary is surrounded by the first boundary.

21. The laser processing method according to claim 19, wherein: The power of the first laser beam is lower than the power of the second laser beam, and the power of the second laser beam is equal to the power of the third laser beam.

22. The laser processing method according to claim 19, wherein: An irradiation speed of the first laser beam is faster than an irradiation speed of the second laser beam, and the irradiation speed of the second laser beam is equal to an irradiation speed of the third laser beam.

23. The laser processing method according to claim 19, wherein: The third irradiation process of irradiating the third laser beam is performed a plurality of times, and a first time interval between the third irradiation processes is 0 seconds or more.

24. The laser processing method according to claim 23, wherein: The time interval between the first irradiation process and the second irradiation process is greater than the first time interval.

25. The laser processing method according to claim 23, wherein: The second irradiation process of irradiating the second laser beam is performed a plurality of times, and a second time interval between the second irradiation processes is greater than the first time interval.

26. A display module, comprising: a base layer defining a through hole; A circuit layer, disposed on the substrate layer; An emission layer, disposed on the circuit layer; An encapsulation layer, disposed on the emission layer; as well as an anti-reflection layer, disposed on the encapsulation layer, wherein the display module is manufactured by the method according to claim 1, and Wherein, two or more recesses are defined in a side wall portion defining the through hole.

Images