Wafer inspection system of full-automatic visual inspection machine

Abstract

This invention relates to a wafer inspection system for a fully automated visual inspection machine, comprising a wafer carrier and an online visual inspection mechanism. The wafer carrier includes a holder, a holder ring, a support component, and a clamping component. A slot matching the edge of the wafer is formed on the end face of the clamping component, and the slot makes point or line contact with the periphery of the wafer. The wafer inspection system also includes a first flipping mechanism for driving the holder ring to rotate freely and a second flipping mechanism for driving the holder to rotate freely around a vertically extending center. On the one hand, this invention simplifies the wafer carrier structure and achieves wafer positioning through point or line contact, resulting in a small contact area and facilitating comprehensive wafer inspection. Simultaneously, the slot's limiting protection prevents wafer detachment regardless of flipping direction. On the other hand, by rotating the wafer horizontally and the wafer carrier vertically, it meets the requirements for online wafer surface inspection at different angles.

Description

Technical Field

[0001] This invention belongs to the field of wafer visual inspection machines, and specifically relates to a wafer inspection system for a fully automatic visual inspection machine. Background Technology

[0002] A wafer is a silicon wafer used in the fabrication of silicon semiconductor integrated circuits. Because of its circular shape, it is called a wafer. Various circuit element structures can be fabricated on silicon wafers to create IC products with specific electrical functions. The raw material for wafers is silicon, while the Earth's crust has an inexhaustible supply of silicon dioxide. Silica ore is refined in an electric arc furnace, chlorinated with hydrochloric acid, and distilled to produce high-purity polycrystalline silicon with a purity of up to 99.999999999%. Wafer manufacturers then melt this polycrystalline silicon, plant seed crystals in the molten liquid, and slowly pull them out to form cylindrical single-crystal silicon rods. Because the silicon rod is gradually formed from a seed crystal with a defined crystal orientation in molten silicon, this process is called "crystal growth." After the silicon rod is cut, tumbled, sliced, chamfered, polished, laser-etched, and packaged, it becomes the basic raw material for integrated circuit factories—the silicon wafer, which is called a "wafer."

[0003] Therefore, when wafers are finished being processed, it is necessary to inspect the wafers for microscopic particles, scratches, contamination, etc. As a result, manual visual inspection machines have emerged on the market.

[0004] Currently, the inspection system of manual visual inspection machine mainly includes a wafer carrier and an online visual inspection mechanism. The wafer is adsorbed on the wafer carrier by negative pressure. The online visual inspection mechanism mainly includes a strong light that can shine on the surface of the wafer. When inspecting, the light from the strong light shines on the surface of the wafer to observe particles, scratches, contamination and other conditions on the wafer surface.

[0005] However, the above-mentioned detection system has the following drawbacks:

[0006] 1) When adsorbed under negative pressure, the contact area with the wafer is large, which is not conducive to the comprehensive inspection of the wafer;

[0007] 2) Since the high-intensity lamp has a certain illumination range, in order to achieve comprehensive wafer inspection, either the wafer carrier or the high-intensity lamp must be rotated. When the wafer carrier rotates, the positioning and adsorption also rotates, which not only creates an obstacle to inspection, but also easily causes the wafer to fall off. When the high-intensity lamp rotates, it is even more difficult to control. Summary of the Invention

[0008] The technical problem to be solved by the present invention is to provide an improved fully automated visual inspection machine wafer inspection system.

[0009] To solve the above technical problems, the present invention adopts the following technical solution:

[0010] A fully automatic visual inspection machine wafer inspection system includes a wafer carrier and an online visual inspection mechanism. The wafer carrier includes a frame, a frame ring that can rotate freely around its own radial direction and is mounted on the frame, a support member mounted on the frame ring and capable of forming a positioning area that matches the outer diameter of the wafer, and a clamping member mounted on the frame ring and capable of synchronously abutting against the periphery of the wafer. A slot matching the edge of the wafer is formed on the end face of the clamping member, and the slot makes point or line contact with the periphery of the wafer.

[0011] The wafer inspection system also includes a first flipping mechanism mounted on the stand and used to drive the stand ring to rotate freely, and a second flipping mechanism used to drive the stand to rotate freely about a center extending in the vertical direction, wherein the rotation axis of the first flipping mechanism and the rotation axis of the second flipping mechanism are intersected.

[0012] Preferably, the support component includes a plurality of support modules extending radially toward the center of the frame ring, wherein the ends of the plurality of support modules away from the frame ring form a positioning area.

[0013] Furthermore, multiple support modules are symmetrically distributed on the two frame rings about their rotation center lines. This arrangement facilitates control of rotational balance and makes rotation easier to implement.

[0014] According to a specific embodiment and preferred aspect of the invention, the clamping component includes a plurality of clamping modules extending radially toward the center of the cradle ring, and a power unit that drives the plurality of clamping modules to move synchronously to clamp or disengage the wafer, wherein slots are located on the end face of each clamping module away from the cradle ring. In this way, under synchronous abutting clamping, the clamping center coincides with the center of the wafer, thereby ensuring the accuracy and stability of the clamping, facilitating subsequent surface inspection after flipping angle adjustment.

[0015] Preferably, the frame ring is provided with a slide rail extending radially along the frame ring, and there are at least two slide rails. The power unit is arranged in a one-to-one correspondence with the slide rail, and multiple power units move synchronously.

[0016] Specifically, there are two slide rails, which are located on the same straight line, and the line connecting the two slide rails is set parallel to the rotation center line of the frame ring.

[0017] Each power unit includes a base that slides on a slide rail, an arc-shaped connecting bar for connecting the base and the ends of multiple clamping modules away from the slot, and a drive unit for the linear movement of the drive unit on the slide rail; there are two corresponding arc-shaped connecting bars, and the multiple clamping modules are symmetrically distributed on the two arc-shaped connecting bars about the rotation center line. The advantage of this arrangement is that it not only facilitates the control of rotational balance, but also makes the clamping more secure.

[0018] Preferably, the depth of the card slot is 0.1~2.0mm. In this example, the depth of the card slot is 0.5mm.

[0019] According to a specific embodiment and preferred aspect of the present invention, a C-shaped notch is formed on one side of the rack corresponding to the rotation center line to facilitate the picking and placing of wafers by the pick-and-place robot. Supporting components and clamping components are correspondingly disposed on the C-shaped rack. This notch greatly facilitates the picking and placing of wafers by the pick-and-place robot, thereby significantly increasing inspection efficiency.

[0020] In addition, the frame includes a circular frame plate and two frame arms extending upward from the inside of the frame plate. The frame rings are rotatably connected between the two frame arms via pivots, and the two frame arms can avoid the rotation of the frame rings.

[0021] Preferably, the first flipping mechanism includes a flipping motor mounted on the frame arm and a first transmission component for connecting the flipping motor to the pivot; the second flipping mechanism includes a flipping seat mounted on the visual inspection machine frame plate, a rotating shaft mounted inside the flipping seat and extending vertically, a drive motor, and a second transmission component for connecting the drive motor and the rotating shaft, wherein the upper end of the rotating shaft is fixed to the bottom of the frame plate by a connector, and the center of the rotating shaft coincides with the center of the frame plate.

[0022] Due to the implementation of the above technical solutions, the present invention has the following advantages compared with the prior art:

[0023] On the one hand, this invention simplifies the wafer carrier structure and enables wafer positioning through point or line contact, resulting in a small contact area that facilitates comprehensive wafer inspection. Furthermore, the wafer will not fall off due to the limiting protection of the slot, regardless of the rotational movement. On the other hand, by rotating the wafer horizontally and the wafer carrier vertically, this invention meets the requirements for online wafer surface inspection at different angles, ensuring the accuracy of the inspection. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the wafer inspection system of the present invention;

[0025] Figure 2 for Figure 1 Structural breakdown diagram;

[0026] Wherein: 1. Wafer carrier; 10. Carrier base; 100. Carrier tray; 101. Carrier arm; 11. Carrier ring; q. Notch; 12. Support component; 120. Support module; 13. Clamping component; 130. Clamping module; c. Slot; 131. Power unit; a. Container base; b. Arc-shaped connecting strip; d. Drive component; 14. Slide rail;

[0027] 2. Online visual inspection agency; 20. High-intensity lights;

[0028] 3. First flipping mechanism; 30. Flipping motor;

[0029] 4. Second tilting mechanism; 40. Tilting base; 41. Rotating shaft; 42. Drive motor; 43. Second transmission component; 44. Connecting component;

[0030] J. Wafer; B. Visual inspection rack board. Detailed Implementation

[0031] To make the above-mentioned objects, features, and advantages of the present invention more apparent and understandable, the present invention will be described in detail below with reference to the accompanying drawings and specific embodiments. Many specific details are set forth in the following description to provide a thorough understanding of the present invention. However, the present invention can be practiced in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0032] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0033] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0034] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0035] In this invention, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0036] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0037] like Figure 1 As shown, the fully automated visual inspection machine wafer inspection system of this embodiment includes a wafer carrier 1, an online visual inspection mechanism 2, a first flipping mechanism 3, and a second flipping mechanism 4.

[0038] Specifically, the wafer carrier 1 includes a carrier base 10, a carrier ring 11 that is rotatable on the carrier base 10, a support member 12 that is disposed on the carrier ring 11 and can form a positioning area that matches the outer diameter of the wafer J, and a clamping member 13 that is disposed on the carrier ring 11 and can simultaneously abut against the periphery of the wafer J.

[0039] In this example, the frame 10 includes a circular frame plate 100 and two frame arms 101 extending upward from the inside of the frame plate 100. The frame rings 11 are pivotally connected between the two frame arms 101, and the two frame arms 101 can avoid the rotation of the frame rings 11.

[0040] A C-shaped notch q is formed on one side of the ring 11 corresponding to the rotation center line to avoid the picking and placing of wafer J by the pick-and-place robot. The support component 12 and the clamping component 13 are respectively arranged on the C-shaped ring 11. The notch makes it very convenient for the pick-and-place robot to pick up and place wafers, thereby greatly increasing the inspection efficiency.

[0041] The support member 12 includes four support modules 120 extending radially toward the center of the frame ring 11, wherein the ends of the multiple support modules 120 away from the frame ring 11 form a positioning area.

[0042] The four support modules 120 are symmetrically distributed on the two frame rings 11 about the rotation center line of the frame ring 11. This arrangement facilitates the control of rotational balance and makes rotation easier to implement.

[0043] The clamping component 13 includes four clamping modules 130 extending radially toward the center of the retainer ring 11, and a power unit 131 that drives the multiple clamping modules 130 to move synchronously to clamp or release the wafer J.

[0044] In this example, a recessed groove c is formed at the end of each clamping module 130 away from the support ring 11. This ensures that the clamping center coincides with the center of the wafer under synchronous abutment clamping, thereby ensuring the accuracy and stability of clamping and facilitating surface inspection after subsequent flip angle adjustment.

[0045] Specifically, the slot c matches the circumferential edge of the wafer J, and the slot c and the peripheral point or line of the wafer J are in contact.

[0046] In this example, the depth of the slot is 0.5mm. At this depth, not only is the clamping stable, but the contact area is also small.

[0047] Meanwhile, a slide rail 14 extending radially along the frame ring 11 is provided on the frame ring 11. There are two slide rails 14, and the power unit 131 is arranged in a one-to-one correspondence with the slide rail 14, and the two power units 131 move synchronously.

[0048] Specifically, the two slide rails 14 are located on the same straight line, and the line connecting the two slide rails 14 is set parallel to the rotation center line of the frame ring 11.

[0049] The power unit 131 includes a base a slidably mounted on the slide rail 14, an arc-shaped connecting strip b for connecting the ends of the base a and multiple clamping modules 130 away from the slot c, and a driving component d for driving the base a to move linearly on the slide rail 14. Two arc-shaped connecting strips b are provided, and the multiple clamping modules 130 are symmetrically distributed on the two arc-shaped connecting strips b about the rotation center line. This arrangement not only facilitates control of rotational balance but also provides a more secure clamping grip.

[0050] The drive component d can be a pneumatic cylinder. Alternatively, it can be a hydraulic cylinder or an electric telescopic cylinder.

[0051] It is worth noting that the four support modules 120 and the four clamping modules 130 are set in a one-to-one correspondence, and are also symmetrically arranged about the direction perpendicular to the rotation axis of the frame ring 11 (which is also radial).

[0052] Two arc-shaped connecting strips b are also symmetrically arranged above the support ring 11. The advantage of this arrangement is that it facilitates clamping, and after clamping the wafer J, the center of the arc-shaped connecting strip b coincides with the center of the wafer J.

[0053] In this example, the online visual inspection unit 2 includes a high-intensity lamp 20 that can illuminate the wafer J, wherein the high-intensity lamp 20 is positioned above and to the side of the wafer carrier 1.

[0054] In this example, the first flipping mechanism 3 includes a flipping motor 30 mounted on the arm 101 and a first transmission component for connecting the flipping motor 30 to the pivot drive, wherein the first transmission component is a gear or a pulley.

[0055] Combination Figure 2 As shown, the second flipping mechanism 4 includes a flipping seat 40 disposed on the visual inspection machine frame plate B, a rotating shaft 41 disposed in the flipping seat 40 and extending vertically, a drive motor 42, and a second transmission member 43 for drivingly connecting the drive motor 42 and the rotating shaft, wherein the upper end of the rotating shaft 41 is fixed to the bottom of the frame plate 100 by a connector 44, and the center of the rotating shaft 41 coincides with the center of the frame plate 100.

[0056] Specifically, the second transmission component 43 is a pulley.

[0057] Meanwhile, the rotation axes of the first flipping mechanism 3 and the second flipping mechanism 4 are set perpendicularly. This allows for more comprehensive online inspection of the wafer surface at different angles, ensuring the accuracy of the inspection.

[0058] In summary, this embodiment has the following advantages:

[0059] 1. Under the premise of simplifying the wafer carrier structure, the wafer can be positioned through point or line contact mode, resulting in a small contact area, which facilitates comprehensive wafer inspection. At the same time, under the limit protection of the slot, the wafer will not fall off no matter how it is flipped.

[0060] 2. By rotating the wafer horizontally and the wafer carrier vertically, the requirements for online inspection of the wafer surface can be met at different angles, ensuring the accuracy of the inspection.

[0061] The present invention has been described in detail above, with the aim of enabling those skilled in the art to understand and implement the invention. However, this description should not be construed as limiting the scope of protection of the invention. All equivalent changes or modifications made in accordance with the spirit and essence of the invention should be included within the scope of protection of the invention.

Claims

1. A fully automated visual inspection machine wafer inspection system, comprising a wafer carrier and an online visual inspection mechanism, characterized in that: The wafer carrier includes a carrier base, a carrier ring rotatably mounted on the carrier base about its own radial direction, a support member mounted on the carrier ring and forming a positioning area matching the outer diameter of the wafer, and a clamping member mounted on the carrier ring and synchronously abutting against the periphery of the wafer. A slot matching the edge of the wafer is formed on the end face of the clamping member, and the slot makes point or line contact with the periphery of the wafer. The support member includes multiple support modules extending radially towards the center of the carrier ring, wherein the ends of the multiple support modules away from the carrier ring form positioning areas. The clamping member includes multiple clamping modules extending radially towards the center of the carrier ring and having slots formed on their end faces away from the carrier ring, and a mechanism for driving the multiple clamping modules to move synchronously to clamp the wafer. A power unit for holding or detaching a wafer; each power unit includes a base, an arc-shaped connecting strip for connecting the base and multiple clamping modules at the ends away from the slot, and a drive unit; the base includes a circular tray, two bracket arms extending upward from the inside of the tray, and a bracket ring rotatably connected between the two bracket arms by a pivot; two slide rails are provided on the bracket ring, extending radially along the bracket ring, and the line connecting the two slide rails is parallel to the rotation center line of the bracket ring; each base is slidably mounted on the slide rail, and the drive unit drives the base to move linearly on the slide rail; two arc-shaped connecting strips are provided, and multiple clamping modules are symmetrically distributed on the two arc-shaped connecting strips about the rotation center line; It also includes a first flipping mechanism mounted on the frame and used to drive the frame ring to rotate freely, and a second flipping mechanism used to drive the frame to rotate freely about a center extending in the vertical direction, wherein the rotation axis of the first flipping mechanism and the rotation axis of the second flipping mechanism are intersected.

2. The wafer inspection system of the fully automated visual inspection machine according to claim 1, characterized in that: The multiple support modules are symmetrically distributed on the two frame rings about the rotation center line of the frame ring.

3. The wafer inspection system of the fully automated visual inspection machine according to claim 1, characterized in that: The depth of the card slot is 0.1~2.0mm.

4. The wafer inspection system of the fully automated visual inspection machine according to claim 1, characterized in that: A C-shaped notch is formed on one side of the rack ring corresponding to the rotation center line to avoid the picking and placing of wafers by the pick-and-place robot. The support component and the clamping component are respectively arranged on the C-shaped rack ring.

5. The wafer inspection system of the fully automated visual inspection machine according to claim 1, characterized in that: The two arms are able to avoid the rotation of the frame ring.

6. The wafer inspection system of the fully automated visual inspection machine according to claim 1, characterized in that: The first flipping mechanism includes a flipping motor mounted on the frame arm and a first transmission component for drivingly connecting the flipping motor to the pivot; the second flipping mechanism includes a flipping seat mounted on the visual inspection machine frame plate, a rotating shaft mounted inside the flipping seat and extending vertically, a drive motor, and a second transmission component for drivingly connecting the drive motor and the rotating shaft, wherein the upper end of the rotating shaft is fixed to the bottom of the frame plate by a connector, and the center of the rotating shaft coincides with the center of the frame plate.

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