A method for processing flexible-rigid boards and an opening device used therefor

Abstract

The invention provides a method for processing a hard and soft board and a cover opening device used therein, wherein the processing method comprises the following steps: cutting and baking, drilling holes in a soft board, black holes, electroplating of a soft board, inner layer images, etching, browning of a soft board, CVL coating, laminating, pressing, shooting, and edge removal, pressing a hard board and a soft board by means of a non-flowing PP adhesive, and performing window opening on the non-flowing PP adhesive layer at a preset corresponding position, drilling holes in a hard board, electroplating of a hard board, outer layer images, etching, and inspection, solder mask, gold plating, cover removal, UV molding of a soft board, inspection, and packaging; an effective window opening process and corresponding cutting can be performed, and subsequent cleaning is convenient; the cover opening device comprises a first conveying platform, an open cover structure, and a second conveying platform which are sequentially arranged, and a laser cutting machine for cutting a circuit board to a predetermined depth is additionally installed on the first conveying platform; the open cover mechanism completes the separation of the hard board after cutting by vibration and strong blowing, thereby realizing automatic cleaning, reducing manpower consumption, and improving production efficiency.

Description

Technical Field

[0001] The present invention relates to the field of flexible-rigid board processing, and more specifically, to a flexible-rigid board processing method and an opening device used therefor. Background Art

[0002] With the development trend of thinning, integration, and multi-functionality of consumer electronic products, the requirements for the manufacturing process of printed circuit boards are getting higher and higher. The birth and development of FPC and PCB have given rise to a new product, the flexible-rigid printed circuit board. The flexible-rigid printed circuit board is a combination of a flexible circuit board and a rigid circuit board, which are combined together through processes such as lamination according to relevant process requirements to form a circuit board with the characteristics of FPC and PCB. It has the advantages of flexibility, three-dimensional wiring, shape change according to space limitations, reducing the use of connectors during the assembly of electronic products, greatly increasing reliability, reducing product volume, significantly reducing weight, and faster signal transmission.

[0003] In the production process of flexible-rigid printed circuit boards, opening the cover is an important process, and its purpose is to cut off the upper and lower rigid boards of the flexible board part in the flexible-rigid printed circuit board to expose the middle flexible board. At present, the opening method is mainly laser cutting plus manual cleaning, which consumes a lot of manpower and material resources and has low production efficiency. Summary of the Invention

[0004] In order to overcome the defects of the prior art, the technical problem to be solved by the present invention is to provide a flexible-rigid board processing method and an opening device used therefor. In the processing method, an effective windowing process and corresponding cutting can be carried out, which is convenient for subsequent rigid board cleaning, and the cut rigid boards can be automatically cleaned, reducing manpower consumption and improving production efficiency.

[0005] To achieve this purpose, the present invention adopts the following technical solutions:

[0006] The present invention provides a flexible-rigid board processing method, including the following steps:

[0007] S1. Blanking and baking: Select a flexible copper foil substrate and perform blanking on a blanking machine according to a preset size. After blanking, place it in an oven for baking and then cool naturally.

[0008] S2. Drilling the flexible board: Drill holes according to preset hole positions.

[0009] S3. Black hole: Form a conductive film on the inner wall of the drilled hole.

[0010] S4. Electroplating the flexible board: Place the board in an electroplating tank for electroplating.

[0011] S5. Inner layer image and etching: Use the principle of graphic transfer to make the inner layer circuit.

[0012] S6. Brownize the flexible board, roughen the copper surface and the wire surface;

[0013] S7. Cover with CVL film, and use a double-sided laminating machine for laminating;

[0014] S8. Stack the boards, press, punch holes, and trim the edges. Press the rigid board and the flexible board with non-flowing PP glue, and open windows in the non-flowing PP glue layer at preset corresponding positions, and perform conventional processes such as punching holes and trimming the edges;

[0015] S9. Drill holes in the rigid board at the corresponding positions;

[0016] S10. Electroplate the rigid board, and place the board in an electroplating tank for electroplating;

[0017] S11. Outer layer image, etching, inspection. Use an exposure machine to transfer the required circuit image to the board surface through a negative film, and make the required image circuit through developing, chemical etching, and film removal. Make the outer layer circuit using the graphic transfer principle, and then use AOI equipment for circuit maintenance;

[0018] S12. Solder mask, make an image through screen printing ink, exposure, and developing;

[0019] S13. Immersion gold, use ultrasonic waves in combination with ammonia water for cleaning to remove metal impurities on the board surface;

[0020] S14. Cut and open the cover at a fixed depth at the corresponding window opening part using an opening device; S15. UV forming of the flexible board, and form the rigid-flex board through UV hot pressing;

[0021] S16. Detect, package, and store in the warehouse.

[0022] Further, in step S1, the empty baking temperature of the oven is 85°C to 89°C, and the duration is 12 minutes.

[0023] Further, the rigid board uses a core substrate.

[0024] A cover opening device used in a method for processing soft and hard boards, comprising a first conveyor platform, a second conveyor platform, and a cover opening mechanism arranged between the first conveyor platform and the second conveyor platform, wherein a laser cutting machine for cutting the circuit board to a certain depth is installed on the first conveyor platform; the cover opening mechanism comprises a rotating roller movably mounted by two relatively supporting frames, and the rotating roller is connected to a driving motor through a chain sprocket assembly; a plurality of slots are arranged on the outer wall of the roller body of the rotating roller, and the slots extend along the length direction of the rotating roller, and the plurality of slots are distributed in a circular array around the axis of the rotating roller, and the slots are used to receive the circuit board sent out by the first conveyor platform, and each of the supporting frames is provided with a plurality of slots. Vibration motors are installed on both; a protective cover is arranged above the rotating roller through a supporting column, two air boxes are fixedly arranged on the outer wall of the protective cover, the two air boxes are connected through a first pipe, the first pipe is connected to the high-pressure air pump through the air outlet of the second pipe, and a solenoid valve is installed at one end of the second pipe close to the first pipe; air nozzles are installed on the inner wall of the protective cover corresponding to the two air boxes, the air nozzles are in a long strip structure, and the length is adapted to the length of the card slots, and when the rotating roller is in a stopped state, the two air nozzles correspond to the positions of two of the card slots; an infrared sensor for detecting the passing circuit board is installed above the output end of the first conveying platform.

[0025] Furthermore, a receiving tray is placed below the rotating roller, and the receiving tray is placed between the two supporting brackets.

[0026] Furthermore, the slot opening width is greater than the slot bottom width.

[0027] Furthermore, the protective cover is made of transparent acrylic.

[0028] The beneficial effects of the present invention are:

[0029] The present invention provides a method for processing a soft and hard board and a cover opening device used therein. In the processing method, an effective window opening process and corresponding cutting can be performed, so as to facilitate the subsequent cleaning of the hard board. The cover opening device comprises a first conveying platform, a second conveying platform, a laser cutting machine and a cover opening structure, so as to facilitate the conveyance of the circuit board. When passing through the laser cutting machine, the window opening part corresponding to the circuit board can be laser cut, so that the corresponding part of the hard board is cut and separated. After the cutting, the circuit board is transferred to the rotating roller and enters the card slot. Then the rotating roller drives the circuit board to rotate one card position, so that the next card slot is transferred to the position corresponding to the first conveying platform. The cooperation of the high-pressure air pump, the first pipeline, the second pipeline, the air box and the air nozzle can spray strong wind on the circuit board moved into place. The vibration motor can also drive the entire rotating roller and the circuit board on the rotating roller to vibrate, and can also accelerate the separation of the hard board, so as to realize the automatic cleaning of the cut hard board, reduce manpower consumption and improve production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 It is a schematic structural diagram of an opening device provided in a specific embodiment of the present invention;

[0031] Figure 2 It is a schematic structural diagram of the cooperation between the rotating roller and the protective cover provided in a specific embodiment of the present invention.

[0032] In the figure:

[0033] 100, the first conveying table; 200, the second conveying table; 300, the opening structure; 310, the supporting bracket; 320, the rotating roller; 321, the clamping groove; 330, the driving motor; 340, the vibration motor; 350, the protective cover; 361, the air box; 362, the first pipeline; 363, the second pipeline; 364, the solenoid valve; 365, the air nozzle; 370, the high-pressure air pump; 380, the receiving tray; 400, the laser cutting machine; 500, the infrared sensor. Specific Embodiment

[0034] The technical solution of the present invention will be further described below in conjunction with the drawings and through specific embodiments.

[0035] A flexible and rigid board processing method is disclosed in a specific embodiment of the present invention, including the following steps:

[0036] S1. Blanking and baking, selecting a flexible copper foil substrate, blanking on a blanking machine according to a preset size, placing it in an oven for baking after blanking, and then naturally cooling;

[0037] S2. Drilling the flexible board, drilling holes according to the preset hole positions;

[0038] S3. Black hole, forming a conductive film on the inner wall of the drilled hole;

[0039] S4. Electroplating the flexible board, placing the board in an electroplating tank for electroplating;

[0040] S5. Inner layer image and etching, making the inner layer circuit by using the principle of graphic transfer;

[0041] S6. Brownification of the flexible board, roughening the copper surface and the wire surface;

[0042] S7. CVL film laminating, using a double-sided laminating machine for film laminating;

[0043] S8. Stacking, pressing, punching, and trimming, pressing the rigid board and the flexible board with non-flowing PP glue, and making windows in the non-flowing PP glue layer at preset corresponding positions, and performing conventional treatments such as punching and trimming;

[0044] S9. Drilling the rigid board, drilling holes at the corresponding positions of the rigid board;

[0045] S10. Hard board electroplating: Place the board in the electroplating tank for electroplating.

[0046] S11. Outer layer image, etching, inspection: Use an exposure machine to transfer the required circuit image onto the board surface through a negative film. Then, develop, chemically etch, and strip the film to create the required image circuit. Make the outer layer circuit using the graphic transfer principle, and then use an AOI device to inspect the circuit.

[0047] S12. Solder mask: Create an image by screen printing ink, exposure, and development.

[0048] S13. Gold plating: Clean the board surface using ultrasonic waves in combination with ammonia water to remove metal impurities.

[0049] S14. Punching and uncovering: Use an uncovering device to perform depth-controlled cutting and uncovering at the corresponding window areas.

[0050] S15. Flexible board UV forming: Thermally form the rigid-flex board through UV pressing.

[0051] S16. Inspection, packaging, warehousing.

[0052] This processing and production method can perform effective windowing operations and corresponding cutting, facilitate subsequent hard board cleaning, reduce human participation, and improve production efficiency.

[0053] Further, in step S1, the empty baking temperature of the oven is 85°C - 89°C, and the duration is 12 minutes.

[0054] Further, use a core substrate for the hard board.

[0055] Such as Figures 1 to 2As shown, the present invention also provides a cover opening device for a soft and hard board processing method, comprising a first conveying platform 100, a second conveying platform 200, and a cover opening mechanism 300 arranged between the first conveying platform 100 and the second conveying platform 200, the first conveying platform 100 is additionally equipped with a laser cutting machine 400 for circuit board fixed depth cutting; the cover opening mechanism 300 comprises a rotating roller 320 movably mounted through two relatively supporting frames 310, the rotating roller 320 is connected to the driving motor 330 through a chain sprocket assembly; the outer wall of the roller body of the rotating roller 320 is provided with a plurality of card slots 321, the card slots 321 extend along the length direction of the rotating roller 320, and the plurality of card slots 321 are distributed in a circular array around the axis of the rotating roller 320, the card slots 321 are used to receive the circuit board sent out by the first conveying platform 100, and each of the supporting frames 310 A vibration motor 340 is installed on each of the two rotating rollers 320; a protective cover 350 is mounted above the rotating roller 320 through a supporting column, and two air boxes 361 are fixedly mounted on the outer wall of the protective cover 350, and the two air boxes 361 are connected through a first pipe 362, and the first pipe 362 is connected to the high-pressure air pump 370 through the air outlet of the second pipe 363, and a solenoid valve 364 is installed at one end of the second pipe 363 close to the first pipe 362; an air nozzle 365 is installed on the inner wall of the protective cover 350 corresponding to the two air boxes 361, and the air nozzle 365 is in a long strip structure, and the length is adapted to the length of the card slot 321, and when the rotating roller 320 is in a stopped state, the two air nozzles 365 correspond to the positions of two of the card slots 321; an infrared sensor 500 for detecting the passing circuit board is installed above the output end of the first conveying platform 100.

[0056] The above-mentioned opening device includes the cooperation of the first conveying platform 100, the second conveying platform 200, the laser cutting machine 400, and the opening structure 300, which can facilitate the transportation of the circuit board. When passing through the laser cutting machine 400, the window opening part corresponding to the circuit board can be laser cut, so that the corresponding part of the hard board is cut and separated; the circuit board after cutting is transferred to the rotating roller 320 and enters the card slot 321, and then the rotating roller 320 drives the circuit board to rotate one card position, so that the next card slot 321 is transferred to the position corresponding to the first conveying platform 100, and the high-pressure air pump 370, the first pipeline 362, the second pipeline 363, the air box 361, and the air nozzle 365 cooperate to blow strong wind to the circuit board moved into place, and the vibration motor 340 can also drive the entire rotating roller 320 and the circuit board on the rotating roller 320 to vibrate, and can also accelerate the separation of the hard board, so as to realize the automatic cleaning of the cut hard board, reduce manpower consumption, and improve production efficiency.

[0057] Further, a receiving tray 380 is placed below the rotating roller 320, and the receiving tray 380 is disposed between the two supporting brackets 310; this structural design facilitates the receiving of the separated hard board sheets for unified processing.

[0058] Further, the width of the notch of the card slot 321 is greater than the width of the bottom of the slot, which facilitates the smooth entry of the circuit board into the card slot 321.

[0059] Further, the protective cover 350 is made of transparent acrylic, which facilitates viewing the movement trajectory of the internal circuit board, timely discovering problems and handling them.

[0060] The present invention is described by way of preferred embodiments. Those skilled in the art will appreciate that various changes or equivalent replacements can be made to these features and embodiments without departing from the spirit and scope of the present invention. The present invention is not limited by the specific embodiments disclosed herein, and other embodiments falling within the scope of the claims of this application belong to the scope of protection of the present invention.

Claims

1. A cover opening device, characterized in that: The invention comprises a first conveying platform (100), a second conveying platform (200), and a cover opening mechanism (300) arranged between the first conveying platform (100) and the second conveying platform (200); a laser cutting machine (400) for cutting a circuit board to a certain depth is installed on the first conveying platform (100); before cutting and opening the cover, an ultrasonic wave is used in combination with ammonia water to clean the board to remove metal impurities on the board surface; The cover opening mechanism (300) comprises a rotating roller (320) movably mounted via two opposing support frames (310), the rotating roller (320) being transmission-connected to a driving motor (330) via a chain sprocket assembly; a plurality of slots (321) are provided on the outer wall of the roller body of the rotating roller (320), the slots (321) extending along the length direction of the rotating roller (320), the plurality of slots (321) being distributed in a circular array around the axis of the rotating roller (320), the slots (321) being used to receive the circuit board delivered by the first conveying platform (100), and a vibration motor (340) being installed on each of the support frames (310); A protective cover (350) is mounted above the rotating roller (320) via a support column. Two air boxes (361) are fixedly mounted on the outer wall of the protective cover (350). The two air boxes (361) are connected via a first pipe (362). The first pipe (362) is connected to a high-pressure air pump (370) via an air outlet of a second pipe (363). An electromagnetic valve (364) is mounted at one end of the second pipe (363) close to the first pipe (362). Air nozzles (365) are mounted on the inner wall of the protective cover (350) corresponding to the two air boxes (361). The air nozzles (365) are in a long strip-shaped structure and have a length that matches the length of the card slots (321). When the rotating roller (320) is in a stopped state, the two air nozzles (365) correspond to the positions of two of the card slots (321). An infrared sensor (500) for detecting a circuit board passing through is mounted above the output end of the first conveying platform (100).

2. A cover opening device according to claim 1, characterized in that: A receiving tray (380) is placed below the rotating roller (320), and the receiving tray (380) is placed between the two supporting frames (310).

3. A cover opening device according to claim 2, characterized in that: The slot opening width of the locking slot (321) is greater than the slot bottom width.

4. A cover opening device according to claim 3, characterized in that: The protective cover (350) is made of transparent acrylic.

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