Single-wafer wet processing equipment

Abstract

The present disclosure provides a single-wafer wet processing apparatus, comprising: a rotating stage for placing a wafer; a liquid supply device for applying a plurality of process liquids to the wafer; a liquid recovery device including a plurality of recovery rings, wherein each of the recovery rings is used to collect a corresponding one of the process liquids and the gas-liquid mixture entrained therein; and a plurality of gas recovery devices respectively connected to the plurality of recovery rings of the liquid recovery device for discharging the collected gas-liquid mixture.

Description

Technical Field

[0001] The present disclosure relates to a wet processing apparatus, and more particularly to a single-wafer wet processing apparatus. Background Art

[0002] In the process of semiconductor wafers, multiple processing steps need to be performed on the device formation surface of the semiconductor wafer, including wet processing procedures such as etching and cleaning. As the process complexity of semiconductor wafers increases, a single-wafer wet processing machine has been developed, in which a rotating table corresponding to multiple liquid recovery modules is adopted, so that the single-wafer wet processing machine can apply a variety of different chemical liquids to the wafer on the rotating table, and collect the chemical liquids through the corresponding recovery modules. By applying different chemical liquids, various metal layers or other material thin film layers on the semiconductor wafer can be cleaned and etched. That is to say, a variety of different chemical liquids are used in the single-wafer wet processing machine, which makes the functional requirements of the collection device for collecting chemical liquids and the entrained gas-liquid mixture extremely strict.

[0003] However, the existing single-wafer wet processing machine adopts a design in which multiple liquid recovery modules are commonly connected to a gas recovery device. That is to say, although the existing single-wafer wet processing machine can collect different chemical liquids through multiple liquid recovery modules, it cannot separately and independently collect different gas-liquid mixtures entrained by different chemical liquids. The design of the above single gas recovery device will cause different gas-liquid mixtures to be mixed together in the gas recovery device. Since different gas-liquid mixtures contain (such as acids, alkalis, solvents, etc.) chemical liquids with different properties, if they are mixed together, it is easy to produce additional chemical reactions, thereby causing harm to personnel or the machine, and also increasing the difficulty of processing and recovering gases. Moreover, if the mixed mixture flows back into the multiple liquid recovery modules, it will cause cross-contamination between the chemical liquids collected by the liquid recovery modules and the mixture.

[0004] In view of this, it is necessary to provide a single-wafer wet processing apparatus to solve the problems existing in the prior art. Summary of the Invention

[0005] To solve the above problems of the prior art, the purpose of the present disclosure is to provide a single-wafer wet processing apparatus, which can independently recover the gas-liquid mixtures entrained by different process liquids to avoid mixing different gas-liquid mixtures together.

[0006] To achieve the above object, the present disclosure provides a single-wafer wet processing apparatus, comprising: a rotating table for placing a wafer; a liquid supply device disposed above the rotating table for applying various process liquids to the wafer; a liquid recovery device disposed around the rotating table and movable relative to the rotating table in a vertical direction, wherein the liquid recovery device includes a plurality of recovery rings stacked along the vertical direction, and each of the recovery rings is for collecting a corresponding one of the process liquids and the entrained gas-liquid mixture; and a plurality of gas recovery devices respectively connected to the plurality of recovery rings of the liquid recovery device, wherein each of the gas recovery devices includes: a bellows including a first connection port and a second connection port, wherein the first connection port is connected to a corresponding recovery ring such that the gas-liquid mixture in the recovery ring enters the interior of the bellows through the first connection port; and an exhaust pipe connected to the second connection port of the bellows for discharging the collected gas-liquid mixture.

[0007] In one preferred embodiment of the present disclosure, the bellows of each of the gas recovery devices further includes: an upper surface, a lower surface, a side surface, and a cavity, the upper surface and the lower surface are oppositely disposed, and the side surface is located between the upper surface and the lower surface, and the cavity is formed by connecting the upper surface, the lower surface, and the side surface to each other, wherein the first connection port is disposed on the side surface, and the second connection port is disposed on the upper surface.

[0008] In one preferred embodiment of the present disclosure, the bellows of each of the gas recovery devices further includes: a drain port disposed on the lower surface such that the condensed liquid generated by the gas-liquid mixture passing through the bellows is discharged through the drain port.

[0009] In one preferred embodiment of the present disclosure, each of the recovery rings of the liquid recovery device includes: a liquid receiving port aligned with the rotating table; a partition plate disposed inside the recovery ring to partition an inner ring space and an outer ring space, wherein the inner ring space is for receiving the process liquid and the entrained gas-liquid mixture entering from the liquid receiving port, and the partition plate blocks the process liquid from flowing from the inner ring space to the outer ring space, and a plurality of through holes are formed on the partition plate for allowing the gas-liquid mixture in the inner ring space to enter the outer ring space through the plurality of through holes; and a liquid collection port communicating with the inner ring space for allowing the process liquid to be discharged from the liquid collection port; and a plurality of gas recovery devices respectively connected to the plurality of recovery rings of the liquid recovery device for discharging the collected gas-liquid mixture.

[0010] In one preferred embodiment of the present disclosure, each of the recovery rings further includes: an annular upper cover; an annular bottom plate disposed corresponding to the annular upper cover; an outer ring wall connected to the outer peripheral edge of the annular upper cover and the outer peripheral edge of the annular bottom plate; a gas channel port disposed on the outer ring wall and connected to one of the corresponding gas recovery devices, wherein the partition plate is disposed between the annular upper cover and the annular bottom plate, and the liquid receiving port is located between the inner peripheral edge of the annular upper cover and the inner peripheral edge of the annular bottom plate.

[0011] In one preferred embodiment of the present disclosure, the bellows of each of the gas recovery devices further includes a viewing window, and the interior of the bellows can be seen through the viewing window; and the single-wafer wet processing equipment further includes a plurality of water pipelines, and the bellows of each of the gas recovery devices is connected to one of the water pipelines, and clean water is transmitted to the bellows through the water pipeline to clean the interior of the bellows.

[0012] The present disclosure also provides a single-wafer wet processing equipment, including: a rotating table for placing wafers; a liquid supply device disposed above the rotating table for applying various process liquids to the wafers; a liquid recovery device disposed around the rotating table and movable relative to the rotating table in a vertical direction, wherein the liquid recovery device includes a plurality of recovery rings stacked along the vertical direction, and each of the recovery rings includes: a liquid receiving port aligned with the rotating table for receiving one of the corresponding process liquids and the gas-liquid mixture entrained therein; a partition plate disposed inside the recovery ring to separate an inner ring space and an outer ring space, wherein the inner ring space is used to receive the process liquid and the gas-liquid mixture entrained therein entering from the liquid receiving port, and the partition plate blocks the process liquid from flowing from the inner ring space to the outer ring space, and a plurality of through holes are formed on the partition plate for allowing the gas-liquid mixture in the inner ring space to enter the outer ring space through the plurality of through holes; and a liquid collection port communicating with the inner ring space for allowing the process liquid to be discharged from the liquid collection port; and a plurality of gas recovery devices respectively connected to the plurality of recovery rings of the liquid recovery device for discharging the collected gas-liquid mixture.

[0013] In one preferred embodiment of the present disclosure, each of the recovery rings further includes: an annular upper cover; an annular bottom plate disposed corresponding to the annular upper cover; an outer ring wall connected to the outer peripheral edge of the annular upper cover and the outer peripheral edge of the annular bottom plate; a gas channel port disposed on the outer ring wall and connected to one of the corresponding gas recovery devices, wherein the partition plate is disposed between the annular upper cover and the annular bottom plate, and the liquid receiving port is located between the inner peripheral edge of the annular upper cover and the inner peripheral edge of the annular bottom plate.

[0014] In one of the preferred embodiments of the present disclosure, each of the gas recovery devices includes: a bellows including a first connection port and a second connection port, wherein the first connection port is connected to the corresponding recovery ring so that the gas-liquid mixture in the recovery ring enters the interior of the bellows through the first connection port; and an exhaust pipe connected to the second connection port of the bellows for discharging the collected gas-liquid mixture.

[0015] In one of the preferred embodiments of the present disclosure, the bellows of each of the gas recovery devices further includes: an upper surface, a lower surface, a side surface, and a cavity. The upper surface and the lower surface are oppositely arranged, and the side surface is located between the upper surface and the lower surface. The cavity is formed by connecting the upper surface, the lower surface, and the side surface to each other. The first connection port is provided on the side surface, and the second connection port is provided on the upper surface.

[0016] In one of the preferred embodiments of the present disclosure, the bellows of each of the gas recovery devices further includes a liquid discharge port provided on the lower surface so that the condensed liquid generated by the gas-liquid mixture passing through the bellows is discharged through the liquid discharge port.

[0017] In one of the preferred embodiments of the present disclosure, the bellows of each of the gas recovery devices further includes a viewing window through which the interior of the bellows can be seen. The single-wafer wet processing equipment further includes a plurality of water pipelines, and the bellows of each of the gas recovery devices is connected to one of the water pipelines, and clean water is transmitted to the bellows through the water pipeline to clean the interior of the bellows.

[0018] Compared with the prior art, the present disclosure provides gas recovery devices having the same number as the recovery rings, and each recovery ring is correspondingly connected to one gas recovery device. With this design, the process gases from different recovery rings can be independently evacuated by different gas recovery devices, so as to avoid the mixing of different gas-liquid mixtures entrained by different process liquids, thereby preventing additional chemical reactions and damage to the single-wafer wet processing equipment or personnel. Moreover, the complexity of processing the recovered gas is reduced. Furthermore, the contamination of the wafer or other processing chambers caused by the reflux of the mixed exhaust gas to the turntable or the recovery ring can be avoided. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 A perspective schematic diagram of a single-wafer wet processing equipment showing a preferred embodiment of the present disclosure;

[0020] Figure 2 Showing Figure 1 A partially enlarged sectional view of the single-wafer wet processing equipment;

[0021] Figure 3 Display Figure 1 Partial schematic view of the recovery loop of a single-wafer wet processing apparatus and a gas recovery device;

[0022] Figure 4 Display Figure 3 Exploded view of parts of the recovery loop; and

[0023] Figure 5 Display Figure 1 Another partial sectional enlarged view of the single-wafer wet processing apparatus. Detailed Description of the Preferred Embodiment

[0024] To make the above and other objects, features, and advantages of the present disclosure more apparent and understandable, the preferred embodiments of the present disclosure will be specifically described below in conjunction with the accompanying drawings as follows.

[0025] Please refer to Figure 1 , which shows a perspective schematic view of a single-wafer wet processing apparatus 1 according to a preferred embodiment of the present disclosure. The single-wafer wet processing apparatus 1 includes a turntable 10, a liquid supply device (not shown in the figure), a liquid recovery device 20, a plurality of gas recovery devices 30, and a lifting device 40. In this embodiment, the number of gas recovery devices 30 is four, but the present disclosure is not limited thereto. The turntable 10 is used to place a single wafer (not shown in the figure). In this embodiment, the top of the turntable 10 includes a vacuum chuck, and the wafer can be fixed to the top of the turntable 10 by the suction force applied by the vacuum chuck. The turntable 10 is configured with a driving mechanism for driving the turntable 10 to rotate about an axis. In other embodiments, other methods can also be used to fix the wafer on the turntable, such as using a clamping device. Furthermore, the liquid supply device is disposed above the turntable 10 for applying various process liquids to the wafer. Specifically, the liquid supply device includes a nozzle and a plurality of liquid transfer pipelines, wherein the nozzle is arranged to be aligned with the top of the turntable 10, and one end of each of the plurality of liquid transfer pipelines is connected to the nozzle, and the other end is respectively connected to the supply ends of different process liquids. With this design, the liquid supply device can be controlled according to process requirements to apply the corresponding process liquid to the wafer on the turntable 10 for performing operations such as etching or cleaning on the wafer.

[0026] As shown in Figure 1As shown, the liquid recovery device 20 is disposed around the turntable 10 to collect the process liquid ejected from the wafer surface on the turntable 10 due to centrifugal force and discharge the process liquid. A plurality of gas recovery devices 30 are correspondingly connected to the liquid recovery device 20 to discharge the collected gas-liquid mixture. The specific structures of the liquid recovery device 20 and the gas recovery device 30 in this embodiment will be described in detail later. The lifting device 40 is connected to the liquid recovery device 20 to control the liquid recovery device 20 to move up and down relative to the turntable 10 along a vertical direction. And, since a plurality of gas recovery devices 30 are connected to the liquid recovery device 20, when the liquid recovery device 20 moves up and down, the plurality of gas recovery devices 30 will rise or fall together accordingly.

[0027] Please refer to Figure 1 and Figure 2 , Figure 2 showing Figure 1 a partially enlarged sectional view of the single-wafer wet processing apparatus 1. The liquid recovery device 20 includes a plurality of recovery rings 21-24 stacked along the vertical direction. Each of the recovery rings 21-24 is used to collect a corresponding one of the process liquids and the gas-liquid mixture entrained therein. Through the control of the lifting device 40, the plurality of recovery rings 21-24 are moved synchronously together, so that a specified one of the recovery rings 21-24 can be moved to be aligned with the turntable 10, where alignment means that the liquid receiving port of one of the recovery rings 21-24 is adjacent to the wafer on the turntable 10, so that when the liquid supply device applies the process liquid to the wafer on the turntable 10 and the turntable 10 rotates, the process liquid ejected from the wafer surface on the turntable 10 due to centrifugal force can be collected by one of the adjacent recovery rings 21-24. That is to say, the single-wafer wet processing apparatus 1 disclosed herein is a cleaning and etching apparatus with a mobile liquid recovery device 20, which can keep the wafer on the turntable 10 horizontally fixed without moving up and down. When performing a single-wafer spin cleaning or etching process, according to the steps to be executed, the specified recovery ring is controlled to move to be aligned with the turntable 10, and then a specific process liquid is sprayed from the liquid supply device above the wafer onto the wafer surface, and the turntable 10 drives the wafer to rotate to collect this specific process liquid and the gas-liquid mixture entrained therein.

[0028] Please refer to Figure 2 and Figure 3 , where Figure 3 showing Figure 1 a partial schematic view of the recovery ring 21 of the single-wafer wet processing apparatus 1 and the gas recovery device 30. Figure 3 The recovery ring 21 located on the first layer and the gas recovery device 30 connected thereto are taken as an example for illustration. It should be understood that the structures of the remaining recovery rings 22-24 are substantially the same as the structure of the recovery ring 21 on the first layer. As Figure 2As shown, the recovery ring 21 includes an annular upper cover 201, an annular bottom plate 202, an outer ring wall 203, and a liquid receiving port 204. Also, as Figure 3 shown, the recovery ring 21 further includes a partition plate 205, a gas passage port 206, and a liquid collection port 207. The annular bottom plate 202 of the recovery ring 21 is correspondingly arranged with the annular upper cover 201. In this embodiment, the plurality of recovery rings 21 to 24 are stacked along the vertical direction, and the annular bottom plate 202 of the upper recovery ring serves as the annular upper cover 201 of the lower recovery ring, thereby maximizing the space inside each recovery ring, saving the materials used for the liquid recovery device 20, and effectively reducing the overall volume of the liquid recovery device 20. The outer ring wall 203 of the recovery ring 21 is connected to the outer peripheral edge of the annular upper cover 201 and the outer peripheral edge of the annular bottom plate 202. The annular upper cover 201, the annular bottom plate 202, and the outer ring wall 203 are connected to each other and define the internal space of the recovery ring 21. The liquid receiving port 204 of the recovery ring 21 is located between the inner peripheral edge of the annular upper cover 201 and the inner peripheral edge of the annular bottom plate 202. When the designated recovery ring 21 moves to align with the rotating table 10, the liquid receiving port 204 of the designated recovery ring 21 will align with the rotating table 10, so that the recovery ring 21 can receive the corresponding process liquid and the gas-liquid mixture entrained therein through the liquid receiving port 204.

[0029] As Figure 3 shown, the partition plate 205 of the recovery ring 21 is arranged inside the recovery ring 21 to divide the internal space of the recovery ring 21 into an inner ring space 208 and an outer ring space 209. The inner ring space 208 is used to receive the process liquid and the gas-liquid mixture entrained therein entering from the liquid receiving port 204, and the partition plate 205 can prevent the process liquid from flowing from the inner ring space 208 to the outer ring space 209. A plurality of through holes 2051 are formed on the partition plate 205, so that the gas-liquid mixture in the inner ring space 208 can enter the outer ring space 209 through the plurality of through holes 2051. In this embodiment, 28 through holes 2051 are formed on the partition plate 205, but it is not limited thereto. Preferably, the aperture of the through holes 2051 of the partition plate 205 is about 5 to 10 mm, so as to ensure that on the one hand, the gas-liquid mixture entrained in the process liquid can be sufficiently pumped from the inner ring space 208 to the outer ring space 209, and on the other hand, the process liquid can be blocked in the inner ring space 208.

[0030] As Figure 3As shown, the gas passage opening 206 of the recovery ring 21 is provided on the outer ring wall 203, and the gas passage opening 206 is connected to the corresponding gas recovery device 30. In this way, the gas-liquid mixture collected by the recovery ring 21 can be transmitted to the gas recovery device 30 through the gas passage opening 206 after entering the outer ring space 209. The liquid collection port 207 of the recovery ring 21 is communicated with the inner ring space 208 for discharging the process liquid from the liquid collection port 207. Specifically, the liquid collection port 207 is located at the lowest point of the horizontal position of the recovery ring 21, so that the process liquid collected by the recovery ring 21 flows to the liquid collection port 207 due to gravity. And, the liquid collection port 207 of the recovery ring 21 is connected to the corresponding recovery pipe, and then the collected process liquid is discharged or recovered. For example, as Figure 2 shown, the recovery ring 22 located on the second layer is connected to the recovery pipe 50 inside the single-wafer wet processing equipment 1, and the process liquid collected by the recovery ring 22 is discharged through the path 51. Optionally, the recovery pipe 50 can be connected to the circulation system to recycle the processed process liquid back to the liquid supply device of the single-wafer wet processing equipment 1 again. Preferably, the aperture of the liquid collection port 207 is about 10 to 15 mm to ensure that the impurities after etching, the collected process liquid or the crystals formed thereby can pass through.

[0031] Please refer to Figure 4 , which shows Figure 3 an exploded view of the parts of the recovery ring 21. The plate surface of the partition plate 205 is parallel to the stacking direction of the recovery ring 21. One side of the partition plate 205 is installed in the lower groove 2021 of the annular bottom plate 202, and the other side of the partition plate 205 is installed in the upper groove 2011 of the annular upper cover 201 (see Figure 5 ). Through the above installation method of the partition plate 205, the assembly and replacement of the partition plate 205 can be facilitated. Furthermore, in this embodiment, the partition plate 205 of the recovery ring 21 adopts a four-piece structure. With this design, when the through hole 2051 of one of the partition plates 205 is blocked, only the said partition plate 205 needs to be replaced, and it is not necessary to replace the entire set of partition plates 205. In other embodiments, other numbers of partition plates can be adopted, and it is not limited to this. It should be noted that the multiple through holes 2051 of the partition plate 205 are arranged in a ring at equal or approximate intervals to form an annular air extraction structure, so as to ensure that the extraction air flow of the recovery ring 21 is uniform and can fully extract the gas-liquid mixture entrained by the cleaning or etching process liquid. And, through the design of this annular air extraction structure, it can be avoided that during the etching operation of the wafer, the process liquid on the wafer is affected by the unidirectional air flow and biased to one side, resulting in uneven etching of the wafer.

[0032] As Figure 1 and Figure 2As shown, the number of gas recovery devices 30 is the same as the number of recovery rings 21-24, and each of the recovery rings 21-24 is correspondingly connected to a gas recovery device 30. With this design, the pumping operation can be independently performed on the process gases from different recovery rings 21-24 by different gas recovery devices 30, so as to avoid the mixing of different gas-liquid mixtures entrained by different process liquids, thereby preventing additional chemical reactions from occurring and causing harm to the single-wafer wet processing equipment 1 or personnel. Moreover, the complexity of processing the recovered gas is reduced. Furthermore, it is possible to prevent the mixed exhaust gas from flowing back to the turntable 10 or the recovery rings 21-24, thereby avoiding the contamination of the wafers or other processing chambers.

[0033] Please refer to Figure 5 , which shows Figure 1 Another enlarged partial cross-sectional view of the single-wafer wet processing equipment 1. Figure 5 The recovery ring 21 located on the first layer and the gas recovery device 30 connected thereto are taken as an example for illustration. It should be understood that the structures of the remaining recovery rings 22-24 and the remaining gas recovery devices 30 are substantially the same as those of the recovery ring 21 and the gas recovery device 30 on the first layer. The gas recovery device 30 applies a negative pressure to the recovery ring 21, so that an air flow like path 61 will be generated inside the recovery ring 21 and the gas recovery device 30. Specifically, the gas-liquid mixture collected by the recovery ring 21 will be pumped from the inner ring space 208 through the through hole 2051 of the partition plate 205 to the outer ring space 209. And the gas-liquid mixture in the outer ring space 209 will be transmitted to the inside of the gas recovery device 30 through the gas passage opening 206 on the outer ring wall 203.

[0034] As Figure 5As shown, the gas recovery device 30 includes a bellows 31 and an exhaust pipe 32. The bellows 31 includes an upper surface 301, a lower surface 302, a side surface 303, a cavity 304, a first connection port 305, a second connection port 306, and a liquid discharge port 307. The upper surface 301 of the bellows 31 is disposed opposite to the lower surface 302, and the side surface 303 is located between the upper surface 301 and the lower surface 302. The upper surface 301, the lower surface 302, and the side surface 303 are interconnected to form the cavity 304. The first connection port 305 is formed on the side surface 303 of the bellows 31, the second connection port 306 is formed on the upper surface 301, and the liquid discharge port 307 is formed on the lower surface 302. The first connection port 305 of the bellows 31 is connected to the gas passage port 206 of the recovery ring 21, so that the gas-liquid mixture in the recovery ring 21 enters the interior of the cavity 304 of the bellows 31 through the first connection port 305. The exhaust pipe 32 is connected to the second connection port 306 of the bellows 31 for discharging the collected gas-liquid mixture. Furthermore, when the gas-liquid mixture passes through the bellows 31, part of the gas will condense into liquid. To avoid liquid accumulation in the cavity 304 of the bellows 31, the condensed liquid can be discharged through the liquid discharge port 307 located on the lower surface 302 of the bellows 31 along the path 62 to keep the interior of the bellows 31 clean.

[0035] In addition, as Figure 3 shown, the single-wafer wet processing equipment 1 further includes a plurality of water pipelines 70, and the bellows 31 of each gas recovery device 30 is connected to a water pipeline 70. Also, the bellows 31 of each gas recovery device 30 further includes a viewing window 80. Therefore, when a person sees crystallization or foreign matter accumulation inside the bellows 31 through the viewing window 80, the interior of the bellows can be cleaned through the water pipeline 70. Specifically, a small amount of clean water is transmitted into the interior of the bellows 31 through the water pipeline 70, so that the crystallization or foreign matter is discharged from the liquid discharge port 307 of the bellows 31 along the path 62 (as Figure 5 shown).

[0036] In summary, the present disclosure provides gas recovery devices in the same number as the recovery rings, and each recovery ring is correspondingly connected to a gas recovery device. With this design, the process gases from different recovery rings can be independently evacuated through different gas recovery devices, so as to avoid mixing of different gas-liquid mixtures entrained by different process liquids, thereby preventing additional chemical reactions and causing harm to the single-wafer wet processing equipment or personnel, and also reducing the complexity of processing the recovered gas. Furthermore, it is also possible to prevent the mixed waste gas from flowing back to the turntable or the recovery ring, thereby avoiding contamination of the wafer or other processing chambers.

[0037] The above are only the preferred embodiments of the present disclosure. It should be noted that for those skilled in the art, without departing from the principle of the present disclosure, several improvements and refinements can be made, and these improvements and refinements should also be regarded as the protection scope of the present disclosure.

Claims

1. A single-wafer wet processing apparatus, characterized in that, Comprising: A rotating table for placing a wafer; A liquid supply device disposed above the rotating table for applying various process liquids to the wafer; A liquid recovery device disposed around the rotating table and capable of moving relative to the rotating table in a vertical direction, wherein the liquid recovery device includes a plurality of recovery rings stacked along the vertical direction, and each recovery ring is used to collect a corresponding one of the process liquids and the gas-liquid mixture entrained therein; and A plurality of gas recovery devices respectively connected to the plurality of recovery rings of the liquid recovery device, wherein each gas recovery device includes: A bellows including a first connection port and a second connection port, wherein the first connection port is connected to the corresponding recovery ring such that the gas-liquid mixture in the recovery ring enters the interior of the bellows through the first connection port; And An exhaust pipe connected to the second connection port of the bellows for discharging the collected gas-liquid mixture; Wherein each recovery ring of the liquid recovery device includes: A liquid receiving port aligned with the rotating table; A partition plate disposed inside the recovery ring to partition an inner ring space and an outer ring space, wherein the inner ring space is used to receive the process liquid and the gas-liquid mixture entrained therein that enter through the liquid receiving port, and the partition plate blocks the process liquid from flowing from the inner ring space to the outer ring space, and a plurality of through holes are formed in the partition plate for allowing the gas-liquid mixture in the inner ring space to enter the outer ring space through the plurality of through holes; And A liquid collection port communicating with the inner ring space for allowing the process liquid to be discharged from the liquid collection port; And A plurality of gas recovery devices respectively connected to the plurality of recovery rings of the liquid recovery device for discharging the collected gas-liquid mixture.

2. The single-wafer wet processing equipment according to claim 1, wherein The bellows of each gas recovery device further includes: an upper surface, a lower surface, a side surface, and a cavity, the upper surface and the lower surface are oppositely disposed, and the side surface is located between the upper surface and the lower surface, and the cavity is formed by connecting the upper surface, the lower surface, and the side surface to each other, wherein the first connection port is disposed on the side surface, and the second connection port is disposed on the upper surface.

3. The single-wafer wet processing equipment according to claim 2, wherein, The bellows of each gas recovery device further includes a drain port disposed on the lower surface such that the condensed liquid generated by the gas-liquid mixture passing through the bellows is discharged through the drain port.

4. The single-wafer wet processing equipment according to claim 1, wherein, Each recovery ring further includes: An annular upper cover; An annular bottom plate corresponding to the annular upper cover; An outer ring wall connected to the outer peripheral edge of the annular upper cover and the outer peripheral edge of the annular bottom plate; A gas channel port disposed on the outer ring wall and connected to one of the corresponding gas recovery devices, wherein the partition plate is disposed between the annular upper cover and the annular bottom plate, and the liquid receiving port is located between the inner peripheral edges of the annular upper cover and the annular bottom plate.

5. The single-wafer wet processing equipment according to claim 1, characterized in that, The bellows of each gas recovery device further includes a viewing window, and the interior of the bellows can be seen through the viewing window; and The single-wafer wet processing equipment further includes a plurality of water pipelines, and the bellows of each of the gas recovery devices is connected to one of the water pipelines, and clean water is transmitted to the bellows through the water pipeline to clean the interior of the bellows.

6. A single-wafer wet processing apparatus, characterized in that, Comprising: A rotating table for placing a wafer; A liquid supply device disposed above the rotating table for applying various process liquids to the wafer; A liquid recovery device disposed around the rotating table and capable of moving relative to the rotating table in a vertical direction. The liquid recovery device includes a plurality of recovery rings stacked along the vertical direction. Each of the recovery rings includes: A liquid receiving port aligned with the rotating table for receiving one of the corresponding process liquids and the gas-liquid mixture entrained therein; A partition plate disposed inside the recovery ring to partition an inner ring space and an outer ring space. The inner ring space is used to receive the process liquid and the gas-liquid mixture entrained therein entering from the liquid receiving port, and the partition plate blocks the process liquid from flowing from the inner ring space to the outer ring space. A plurality of through holes are formed in the partition plate for allowing the gas-liquid mixture in the inner ring space to enter the outer ring space through the plurality of through holes; And A liquid collection port communicating with the inner ring space for discharging the process liquid from the liquid collection port; And A plurality of gas recovery devices respectively connected to the plurality of recovery rings of the liquid recovery device for discharging the collected gas-liquid mixture.

7. The single-wafer wet processing equipment according to claim 6, wherein Each of the recovery rings further includes: An annular upper cover; An annular bottom plate corresponding to the annular upper cover; An outer ring wall connecting the outer peripheral edge of the annular upper cover and the outer peripheral edge of the annular bottom plate; A gas channel port disposed on the outer ring wall and connected to one of the corresponding gas recovery devices. The partition plate is disposed between the annular upper cover and the annular bottom plate, and the liquid receiving port is located between the inner peripheral edge of the annular upper cover and the inner peripheral edge of the annular bottom plate.

8. The single-wafer wet processing equipment according to claim 6, wherein Each of the gas recovery devices includes: A bellows including a first connection port and a second connection port. The first connection port is connected to the corresponding recovery ring, so that the gas-liquid mixture in the recovery ring enters the interior of the bellows through the first connection port; And An exhaust pipe connected to the second connection port of the bellows for discharging the collected gas-liquid mixture.

9. The single-wafer wet processing equipment according to claim 8, wherein, The bellows of each of the gas recovery devices further includes: an upper surface, a lower surface, a side surface, and a cavity. The upper surface and the lower surface are oppositely disposed, and the side surface is located between the upper surface and the lower surface. The cavity is formed by connecting the upper surface, the lower surface, and the side surface to each other. The first connection port is disposed on the side surface, and the second connection port is disposed on the upper surface.

10. The single-wafer wet processing equipment according to claim 9, characterized in that, The bellows of each of the gas recovery devices further includes: a liquid discharge port disposed on the lower surface, so that the condensed liquid generated by the gas-liquid mixture passing through the bellows is discharged through the liquid discharge port.

11. The single-wafer wet processing equipment according to claim 8, characterized in that, The bellows of each of the gas recovery devices further includes a viewing window, and the interior of the bellows can be seen through the viewing window; and The single-wafer wet processing equipment further includes a plurality of water pipelines, and the bellows of each of the gas recovery devices is connected to one of the water pipelines, and clean water is transmitted to the bellows through the water pipeline to clean the interior of the bellows.

Images