Apparatus and method for coupling a waveguide structure to an integrated circuit package

Abstract

Aspects relate to a waveguide structure that can be coupled to an integrated circuit package. The IC package includes a plurality of posts for providing a path for carrying millimeter-wave signals, each of the posts having a first end portion for connection to the IC package and a second end portion for connection to a waveguide antenna. And a waveguide shield, which may optionally be included, provides electromagnetic isolation for the posts, and a microstrip connector, which may optionally be included, provides connection between the second end portions (of the posts) and connection to the waveguide antenna. The device further includes a plurality of bonding wires for connecting the IC package to a lead frame and for carrying signals from the circuits of the IC package to a printed circuit board on which the package is mounted to transmit radar signals through the waveguide antenna.

Description

Technical Field

[0001] Aspects of various embodiments relate to millimeter-wave integrated circuits including waveguide structures and integrated circuit (IC) packages. Background Art

[0002] Generating power sufficient to transmit weak signals of millimeter-wave (mm-wave) systems and achieving sensitivity sufficient to monitor the weak signals are limited by semiconductor constraints. To minimize power losses caused by waves radiated and detected by an antenna array coupled to a waveguide structure, various limitations of the semiconductor technology utilized in manufacturing the system must be considered. Circuits included within an IC package are coupled to waves radiated and detected by the antenna array with minimum energy loss. Performance improvements associated with increased communication bandwidth and detection resolution can be obtained by expanding system complexity from single-input single-output (SISO) to multiple-input multiple-output (MIMO) and by moving from simplex operation to full-duplex operation. High-performance MIMO systems require minimizing energy losses to antennas for all inputs and outputs and require a high degree of isolation between all inputs and outputs.

[0003] These and other problems have challenged the efficiency of mm-wave integrated circuit package implementations for various applications. Summary of the Invention

[0004] Each example embodiment relates to problems such as those presented above and / or other problems that may become apparent from the following disclosure regarding integrated circuits including waveguide structures coupled to an integrated circuit package for transmitting or receiving mm-wave signals.

[0005] In certain example embodiments, aspects of the present disclosure relate to a waveguide structure coupled to an IC package, the IC package including posts for providing a path for carrying mm-wave signals and a waveguide shield for providing electromagnetic isolation between the posts for carrying signals from different transmit or receive paths.

[0006] Each embodiment relates to a device including a waveguide structure for coupling to an integrated circuit (IC) package. The IC package includes a plurality of posts for providing a path for carrying millimeter-wave signals, each of the posts having a first end portion for connection to the IC package and a second end portion for connection to a waveguide antenna. Optionally further includes a waveguide shield and a microstrip connector, the waveguide shield for providing electromagnetic isolation of the posts, the microstrip connector for providing a connection between the second end portion and the waveguide antenna. Additionally includes bonding wires for connecting the IC package and a lead frame and for carrying signals from a circuit of the IC to a board on which the IC package is mounted to transmit radar signals through the waveguide antenna.

[0007] In additional embodiments, aspects relate to a device including a waveguide antenna and an IC package, the IC package including circuitry for sending signals from the IC package. Bonding wires are also included, the bonding wires being for connecting the IC package and a lead frame and for carrying signals from the circuitry of the IC to a board on which the package is mounted, such as a printed circuit board (PCB), for transmitting radar signals through the waveguide antenna.

[0008] The waveguide structure is for providing a low-impedance path for propagating millimeter-wave signals in a TE10 mode. Additionally, the path is for providing propagation of the millimeter-wave signals through a guided TEM-wave signal, the path having an optimized path length on which the millimeter-wave signals propagate such that attenuation caused by conduction loss and dielectric loss is minimized.

[0009] In other embodiments, the waveguide structure and the plurality of posts provide a plurality of differential signal paths. The combination of the posts and an optional waveguide shield is arranged to reduce undesired coupling between adjacent signal paths communicatively connecting the waveguide structure and the circuitry to the IC package. In various related embodiments, the IC package may include an interface at which a microstrip line is connected to the waveguide structure, the waveguide structure defining a slot providing a non-current proximity coupling to the microstrip line at the interface of the IC package, the slot being additionally defined to minimize energy loss during mm-wave energy transfer.

[0010] In other specific example embodiments, a radar system includes an integrated circuit including an IC package, a lead frame, and circuitry for transmitting signals for radar communication. A waveguide system is coupled to the IC package, the waveguide system including a conductive wall characterizing one or more apertures through which electromagnetic signals are transmitted. Posts are also included, the posts being positioned in the one or more apertures to provide mm-wave signal paths, the posts having respective first end portions connected to the IC package and second end portions for connection to a waveguide antenna. A waveguide shield for providing electromagnetic isolation of the posts is also optionally included, and a microstrip connector provides the connection between the second end portions and the connection to the waveguide antenna. Bonding wires connect the IC package and the lead frame and carry the signals from the circuitry of the IC to the board on which the package is mounted for transmission through the waveguide antenna.

[0011] In connection with more specific embodiments (which also relate to the systems and structures characterized above), additional aspects of the present disclosure relate to a radar system having a waveguide shield that includes an axial metal shield for providing impedance control of a transmission line for propagating mm-wave signals in the TE10 mode. The posts may include multiple groups of posts each consisting of two posts, and the multiple groups of posts are for presenting differential signals for transmission through the waveguide antenna. In a more specific embodiment, the waveguide structure provides signal lines for transmitting the signals carried by the circuits of the IC for emission as radar signals from the waveguide antenna.

[0012] In another specific example embodiment, aspects of the present disclosure relate to a method for transmitting or receiving signals for radar communication using a waveguide structure coupled to an integrated circuit package. The posts in the apertures of the waveguide structure provide an mm-wave signal path from respective first end portions of the posts along the posts to second end portions of the posts for connection to a waveguide antenna. A waveguide shield is for providing electromagnetic isolation of the posts. A connection between the second end portion and the waveguide antenna is provided through a microstrip connector so as to transmit the mm-wave signal, and the transmission may include propagating the mm-wave signal in the TE10 mode.

[0013] In a more specific embodiment, the waveguide shield may include multiple groups of posts, each group being surrounded by an axial metal shield for providing impedance control of a transmission line for propagating the mm-wave signals. Additionally and / or alternatively, each group of posts in the multiple groups of posts is for presenting differential signals for transmission through the waveguide antenna.

[0014] The foregoing discussion / summary is not intended to describe every embodiment or every implementation of the present disclosure. The subsequent drawings and detailed description also illustrate various embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Various example embodiments can be more fully understood when the following detailed description is considered in conjunction with the accompanying drawings, in which:

[0016] Figure 1A A waveguide structure coupled to an integrated circuit package in accordance with the present disclosure is shown;

[0017] Figure 1B A circuit included in an integrated circuit package in accordance with the present disclosure is shown;

[0018] Figure 2 An integrated circuit in accordance with the present disclosure is shown;

[0019] Figure 3 An internal view of an integrated circuit package in accordance with the present disclosure is shown;

[0020] Figure 4A shows a circuit included in an integrated circuit package in accordance with the present disclosure;

[0021] Figure 4B shows in accordance with the present disclosure Figure 4A a cross-section of the circuit shown in; and

[0022] Figure 5 presents a transmission line model of the circuit in accordance with the present disclosure.

[0023] While the various embodiments discussed herein may take modified and alternative forms, aspects of the various embodiments have been illustrated by way of example in the drawings and will be described in detail. However, it should be understood that the intention is not to limit the present disclosure to the particular embodiments described. On the contrary, the intention is to cover all modifications, equivalents, and alternatives falling within the scope of the present disclosure, including aspects defined in the claims. Additionally, as used throughout this application, the term "example" is merely illustrative and not restrictive. DETAILED DESCRIPTION

[0024] Aspects of the present disclosure are believed to be applicable to a variety of different types of devices, systems, and methods involving an IC that includes a waveguide structure for coupling to an IC package, the IC further including posts for providing a signal path for carrying mm-wave signals for transmission. In certain embodiments, it has been shown that aspects of the present disclosure are beneficial when used in the context of a telecommunications system (e.g., a 5G cellular network) and a radar system operating in the 76 - 81 GHz frequency band (e.g., a radar system found in an automobile). While not necessarily so limited, the various aspects may be understood through the following discussion of non-limiting examples of exemplary contexts.

[0025] Aspects of the present disclosure relate to efficiently transferring differential mm-wave signals from an IC package to a waveguide antenna array based on sufficiently close coupling of microstrip lines within the IC package such that waveguide coupling losses are minimized. In certain telecommunications / radar systems, minimizing such losses can be important considering that relatively low interconnect losses result in greater radiated power and improved receiver sensitivity, and in such systems, transferring differential mm-wave signals in this manner is applicable for connecting the transmitter and receiver input / output interfaces of an mm-wave IC to a waveguide-based antenna array.

[0026] Accordingly, in the following description, various specific details are set forth to describe specific examples presented herein. However, it should be apparent to those skilled in the art that one or more other examples and / or variations of these examples may be practiced without all of the specific details given below. In other instances, well-known features are not described in detail so as not to obscure the description of the examples herein. For ease of illustration, the same reference numerals may be used in different figures to refer to the same element or additional instances of the same element. Also, although aspects and features may be described in separate figures in some cases, it should be understood that the features of one figure or embodiment may be combined with the features of another figure or embodiment, even if the combination is not explicitly shown or explicitly described as a combination.

[0027] Referring again, by way of example, to an embodiment of a telecommunications / radar system, generating sufficient power to transmit signals in mm-wave communication and radar systems and sufficient sensitivity to detect the signals are limited by semiconductor constraints such as the maximum unity-gain frequency (F max ), breakdown voltage (V bd ), and minimum noise figure (NF min ). To minimize power losses due to waves radiated and detected by an antenna array included in and / or coupled to an integrated circuit (IC) package, using low-cost semiconductor technology and addressing the limitations mentioned above, the circuitry included in the IC package can be coupled with minimum energy loss to the waves radiated and detected by the antenna array (e.g., mm-wave signals) to achieve a high-performance system. Such systems can include, for example, telecommunications and radar systems. Increased communication bandwidth and detection resolution can be obtained by expanding the system complexity from single-input single-output (SISO) to multiple-input multiple-output (MIMO) and by moving from simplex operation to full-duplex operation. A high-performance MIMO system requires minimizing the energy loss to the antennas of all inputs and outputs and requires a high degree of isolation between all inputs and outputs.

[0028] Turning now to the drawings, Figure 1A and Figure 1B illustrate a waveguide structure 110 for coupling an integrated circuit (IC) package 120. A mechanical support structure 106 provides mechanical support between the waveguide structure 110 and the board 108 on which the IC package is mounted. A fan-out structure, which may include, for example, apertures and slots (see 216 and 218 of Figure 2 ), directs mm-wave signals from the board 108 on which the IC package is mounted upward through the waveguide structure 110 and into the waveguide antenna array 160.

[0029] Figure 1BShows circuit 140, which may be included in IC package 120, and the IC package 120 has a plurality of posts 142 for providing a path for carrying millimeter-wave signals. Each of the posts 142 has a first end portion 141 for connecting to the IC package 120 and a second end portion 143 for connecting to a waveguide antenna (not shown). In Figure 1B also depicted is a waveguide shield 145 for providing electromagnetic isolation for the posts 142 and a microstrip connector 146 for providing connections between the second end portions 143 and the connection to the waveguide antenna 160. A plurality of bond wires 150 are included, and the plurality of bond wires 150 are used to connect the IC package 120 and a lead frame (e.g., Figure 2 230 in) and for carrying signals from the circuit 140 of the IC package 120 to the board 108 on which the IC package is mounted to transmit radar signals through the waveguide antenna 160. The posts 142 can be solid metal, organic posts with a metal coating, or a combination thereof.

[0030] The millimeter (mm)-wave connection is achieved through the posts 142 from the active side of the IC package 120 to the microstrip connector 146 located at the top surface of the IC package 120. Each of the posts 142 includes two identical parallel conductive materials for each mm-wave signal path and is optimized to direct differential TEM-mode signals from the IC package 120 to the microstrip connector 146 located at the top surface of the IC package 120. The posts 142 can optionally be surrounded by an axial metal waveguide shield 144.

[0031] The millimeter (mm)-wave connection is achieved through the posts 142 from the active side of the IC package 120 to the microstrip connector 146 located at the top surface of the IC package 120. Each of the posts 142 includes two identical parallel conductive materials for each mm-wave signal path and is optimized to direct differential TEM-mode signals from the IC package 120 to the microstrip connector 146 located at the top surface of the IC package 120. The posts 142 can optionally be surrounded by an axial metal waveguide shield 144.

[0032] Specific embodiments include a waveguide antenna 160 and an IC package 120, and the IC package 120 further includes a circuit 140 for propagating signals from the IC package 120 through a waveguide structure 110. Also, a plurality of bond wires 150 are included, and the plurality of bond wires 150 are used to connect the IC package 120 and the lead frame 130 and for carrying signals from the circuit 140 of the IC package 120 to the board on which the IC package is mounted to be transmitted as radar and / or telecommunications signals through the waveguide antenna 160.

[0033] Figure 2Shows an integrated circuit 200 according to the present disclosure, the integrated circuit 200 including an IC package 220, a lead frame 230, and circuits 240a, 240b, 240c, ……, 240n (collectively referred to as “circuits 240”) for transmitting signals for radar communication and / or telecommunication applications. A waveguide structure 210 is coupled to the IC package 220, the waveguide structure 210 including a conductive wall 212 characterizing one or more apertures 216 through which electromagnetic signals are transmitted. A post 242 has a respective second end portion 243, the respective second end portion 243 being coupled to a microstrip connector 246, the microstrip connector 246 being positioned adjacent to one or more slots 218a, 218b, 218c, ……, 218n (collectively referred to as “one or more slots 218”) to provide an mm-wave signal path. The post 242 has a respective first end portion 241 connected to the IC package 220 and a second end portion 243 for connection to a waveguide antenna (e.g., as depicted in FIG. 1). Optionally included are waveguide shields 244, 245 for providing electromagnetic isolation of the post 242 that may or may not be required or beneficial for a given application and design, and the microstrip connector 246 provides connections between the second end portions 243 and a connection to a waveguide antenna (not shown). Bonding wires consistent with the bonding wires depicted in Figure 3 connect the IC package 220 to the lead frame 230 and carry signals from the circuits 240 of the IC package 220 to the board on which the IC package is mounted (e.g., Figure 1A 108) for transmission through a waveguide antenna (e.g., Figure 1A 160). The post 242 can be solid metal, an organic post with a metal plating, or a combination thereof.

[0034] Figure 2 The waveguide structure 210 depicted in

[0035] In other embodiments, the waveguide structure 210 and the posts 242 provide multiple different signal paths. The combination of the posts 242 and the optional waveguide shields 244, 245 is arranged to reduce the unwanted coupling between the adjacent signal paths that communicatively connect the waveguide structure 210 and the circuitry 240 to the IC package 220. In various related embodiments, the IC package 220 may include an interface at which the microstrip line 246 is connected to the waveguide structure 210. The waveguide structure 210 defines a slot 218 through which a non-current-proximity coupling to the microstrip line 246 is achieved at the interface of the IC package 220. The slot 218 is further defined to minimize the energy loss during mm-wave energy transfer. The non-current-proximity coupling between the microstrip 246 at the surface of the IC package 220 and the slot 218 in the waveguide structure 220 can be used for efficient mm-wave energy transfer, enabling the IC package 220 to be combined with different antenna types according to the application. The coupling between the IC package 220 and the selected antenna array is achieved during the assembly process of the mm-wave communication device.

[0036] As Figure 2 depicted, the conductive walls 212 of the apertures 216 of the waveguide structure 210 are curved. The size of the waveguide structure 210 is reduced to make the aperture pitch between the apertures 216 smaller, thereby allowing the overall size of the integrated circuit 200 to be minimized. Additionally, a high permittivity material near one or more slots 218 of the waveguide structure 210 provides a low impedance for propagating signals in the TE10 mode. The low impedance, as a characteristic of this material, ensures that the power radiated by one or more slots 218 is transferred into the waveguide structure 210 rather than back to the IC package 220. Additionally and / or alternatively, metal strips / patches can be inserted into the conductive walls 212 of the waveguide structure 210 to achieve a low impedance of the waveguide structure 210. The slot 218 couples the waveguide structure 210 to the microstrip connector 246 included in the IC package 220.

[0037] In a further specific example embodiment, aspects of the present disclosure relate to a method for transmitting and / or receiving signals for radar communication using a waveguide structure 210 coupled to an integrated circuit package 220. The posts 242 in the apertures 216 of the waveguide structure 220 provide mm-wave signal paths from the respective first end portions 241 of the posts along the posts 242 to the second end portions 243 of the posts for connection to the waveguide antenna 160. The waveguide shields 244, 245 are used to provide electromagnetic isolation for the posts 242. The microstrip connector 246 provides connections between the second end portions 243 and a connection to the waveguide antenna, thereby transmitting mm-wave signals. Transmitting mm-wave signals can cause the mm-wave signals to propagate in the TE10 mode.

[0038] In a more specific embodiment, the waveguide shields 244, 245 may include multiple sets of posts 242, and each set of posts 242 may optionally be surrounded by an axial metal shield 244 to provide impedance control for a transmission line for propagating mm-wave signals. Additionally, each set of posts 242 in the multiple sets of posts is used to present differential signals for transmission through the waveguide antenna 160.

[0039] Figure 3 The interior of the IC package 320 according to the present disclosure is depicted. The circuitry 340 included in the IC package 320 may transmit or receive radar and / or telecommunications signals, and the circuitry 340 may be placed anywhere within the IC package 320. Bonding wires 350 connect the IC package 320 to the QFN lead frame 330. The QFN lead frame 330 has lead frame pads 332. The non-critical low-frequency connections from the IC package 320 to the QFN lead frame 330 are achieved through the bonding wires 350 connected to the QFN lead frame pads 332. The QFN lead frame pads 332 are soldered to the board on which the IC package is mounted, such as a PCB, during the manufacturing process. Without being limited by mechanical stresses resulting from differences in the coefficients of thermal expansion of the different materials of the PCB and the bonding wires 350 (the differences being due to the flexible bonding wires 350), the IC package 320 may be enlarged.

[0040] Figure 4A Another detailed embodiment is shown that is related to the aspects described above Figure 3 and can be used in combination with those aspects. Similar to the Figure 3 mm-wave connections disclosed, in FIG. 4a, the mm-wave connection provides coupling for the active side of the integrated circuit package 420, and in the case of using a microstrip connector 446, it can be achieved through the (conductive) posts 442 in the circuitry 440 including a single channel (e.g., Figure 4A the aperture 216 of Figure 2 ), and the posts 442 may be solid metal, an organism with a metal plating, or a combination thereof. Additionally, a box-shaped waveguide shield 445 shields the stray radiation between the circuitry 440 of adjacent channels included in the IC package 420. The microstrip connector 446 is coupled to a slot in the bottom of the waveguide structure. Bonding wires 450 connect the IC package 420 to the lead frame and carry the signals from the circuitry 440 of the IC package 420 to the PCB on which the package is mounted (e.g., Figure 1A 108 of

[0041] In a more specific embodiment, aspects of the present disclosure relate to a radar system having waveguide shields 444, 445, the waveguide shields 444, 445 including an axial metal shield 444 for providing impedance control of a transmission line for propagating mm-wave signals in the TE10 mode. This axial shield is optionally used for both impedance control and shielding. The radar system includes multiple sets of posts 442, the multiple sets of posts 442 being configured to present differential signal paths for transmission by a waveguide antenna coupled to a waveguide structure. In a more specific embodiment, the waveguide structure provides signal lines for transmitting signals carried from a circuit 440 of an IC package 420 for emission as radar signals from the waveguide antenna.

[0042] Figure 4B is Figure 4A a cross-section of the circuit depicted in, which better shows a first end portion 441 for connecting the IC package 420 and a second end portion 443 of a microstrip connector for coupling to the post 442.

[0043] In a specific embodiment, Figure 4A and Figure 4B the posts 442 depicted in provide multiple different transmit and receive signal paths, and the combination of the waveguide shields 444, 445 between the respective signal paths reduces unwanted coupling between these closely spaced signal paths of the circuit 440 included in the IC package 420. The box-shaped waveguide shield 445 below the slots and / or matching structures in the waveguide antenna array guides the mm-wave energy in a desired direction along the waveguide structure to maximize the isolation between the signal paths and minimize the signal loss during transmission.

[0044] Figure 5 shows an equivalent transmission line model representing aspects of the present disclosure. In this model, the circuit 540b includes a microstrip connector 546b coupled to a slot 518a, 518b, 518c,..., 518n (collectively referred to as "one or more slots 518") in a waveguide structure 510 modeled by a transmission line having an impedance Z of The coupling from the microstrip connector 546b to the slot 518 in the waveguide structure 510 can be modeled by a transformer having a turns ratio of n f where the n f is a function of the electric field in the slot 518 and the magnetic field of the microstrip connector 546b. The desired propagating waveguide mode is depicted by transmission with the characteristic impedance of the TE10 mode. Other transmission lines represent non-propagating waveguide modes in which non-functional energy is stored. The shunt admittance Y f models the power flow into the IC package 520. Y fhaving imaginary (B f ) and real (G f ) components that model the power transmitted to and / or reflected from the IC package 520, respectively. The ratio of the power flow into the waveguide structure 510 to the power flow into the IC package 520 can be characterized by the ratio of the conductance G w to the conductance G f , where G w is the real part of the admittance looking into the waveguide structure 510. This ratio can be optimized by increasing G w using a quarter-wave plate of a high dielectric material, while G f is minimized by using a cavity that can be included in the IC package 520.

[0045] According to a specific more detailed / experimental embodiment consistent with the embodiments described above, e.g., compared to previously implemented methods that do not include each of the features mentioned above such as each of the following, the electromagnetic simulation results of the relevant transfer properties show significant performance of the system in FIG. 1: each column in the post having a first end portion for connection to the IC package and a second end portion for connection to the waveguide antenna, a waveguide shield for providing electromagnetic isolation of the post, a microstrip connector for providing a connection between the second end portion and the waveguide antenna, and / or a bonding wire for connecting the IC package and the lead frame and for carrying signals from the circuits of the IC package to the PCB on which the package is mounted to transmit radar signals through the waveguide antenna. From these electromagnetic simulation results, for an example target frequency band between 76 GHz and 81 GHz, the following is observed: less than 0.1 dB of signal power is lost due to reflection or due to energy leakage from the structure; and including material losses, less than 0.7 dB of signal power is lost. Such losses are significantly lower than those of previously implemented methods, and importantly, such losses serve to further reduce the overall link budget associated with a full-duplex radar system (e.g., less than 1.4 dB reduction when this transition is applied to the waveguide interface for both the transmitter and receiver ICs).

[0046] In certain specific embodiments, aspects of the present disclosure relate to a structure for coupling mm-wave signals from an IC package encapsulated in an improved quad flat no-lead (QFN) package to a waveguide structure that permits waveguide attachment (e.g., bonding) to the IC package in accordance with the present disclosure. As an example in a specific embodiment involving related microstructures as shown herein, this QFN package can be implemented by through-polymer via (TPV) technology, and the waveguide antenna array can be realized by a low-loss, low-cost molded interconnect device (MID) process. Such a low-loss, low-cost connection between the IC package and the waveguide structure can be sufficient to isolate the transmission signal path and the reception signal path of the transceiver IC. Additionally and / or alternatively, posts can be used to connect the IC package to the waveguide structure. A waveguide shield surrounds the posts to provide electromagnetic isolation between the posts.

[0047] Referring to the examples shown in FIGS. 1-4 and the equivalent transmission line model shown that illustrates optimized energy transfer between the transceiver IC and the waveguide antenna array, this transmission line can be used in various applications involving high-performance IC-to-waveguide antenna interfaces, including, for example, automotive radar systems operating in the 76-81 GHz band. As a non-limiting example for illustrative purposes of use Figure 3 while operating in the target band of 76-81 GHz, less than 0.1 dB of signal power is lost due to reflection and / or due to energy leakage from the (waveguide) structure, and less than 0.7 dB of signal power is lost when incorporating material losses.

[0048] Terms such as up / down, left / right, top / bottom, and above / below used herein to exemplify orientation may be used to refer to the relative position of elements as shown in the drawings. It should be understood that the use of such terms is for convenience only, and in actual use, the orientation of the disclosed structure may be different from that shown in the drawings. Therefore, the terms should not be construed in a limiting manner.

[0049] Those skilled in the art will recognize that various terms used in this specification (including the claims) have their ordinary meanings in the art, unless otherwise indicated. By way of example, this specification describes and / or illustrates aspects of the claimed disclosure that may be implemented via various circuits or circuitry, which may be illustrated as or described using terms such as the following: blocks, modules, devices, systems, units, controllers, connectors, and / or other circuit-type depictions (e.g., reference numerals 142 and 146 in FIG. 1 depict blocks / modules as described herein). Such circuits or circuitry are used with other elements to illustrate how certain embodiments may be implemented in terms of structure, steps, functions, operations, activities, etc. For example, when this specification may refer to "first [type of structure]", "second [type of structure]", etc., when [type of structure] may be replaced with terms such as ["circuit", "circuitry", and others], the adjectives "first" and "second" are not used to denote any description of the structure or to provide any substantive meaning; rather, such adjectives are used only for English antecedents to distinguish one such similarly named structure from another (e.g., "the first circuit configured to convert..." is interpreted as "the circuit configured to convert...").

[0050] Based on the foregoing discussion and illustration, those skilled in the art should readily recognize that various modifications and changes can be made to the various embodiments without strictly following the exemplary embodiments and applications illustrated and described herein. For example, the methods illustrated in the figures may involve steps performed in various orders (where one or more aspects of the embodiments herein are retained) or may involve fewer or more steps. Such modifications do not depart from the true spirit and scope of the various aspects of the present disclosure, including the aspects set forth in the claims.

Claims

1. A radar system, characterized in that, Comprising: An integrated circuit (IC), the IC comprising An IC package, A lead frame, and A circuit for transmitting signals for radar communication; A waveguide structure, the waveguide structure being coupled to the IC package and comprising A waveguide antenna, including at least one passage through which an electromagnetic signal is transmitted, each passage being defined by a conductive wall; A plurality of posts, the plurality of posts being positioned within the IC package to provide an mm-wave signal path and having a respective first end portion for connection to the IC package and a second end portion for connection to the waveguide antenna, A box-shaped waveguide shield aligned with each passage of the waveguide antenna, the waveguide shield for providing electromagnetic isolation of the plurality of posts, and A microstrip connector located inside the waveguide shield and having an end connected to the second end of the post, the microstrip connector for providing a connection between the second end portions and a connection to the waveguide antenna; Wherein the IC package includes an interface surface at which a microstrip line is connected to the waveguide structure, and the waveguide structure defines a slot through which a non-current proximity coupling with the microstrip line is provided at the interface surface of the IC package, wherein the box-shaped waveguide shield is located under the slot; And A plurality of bonding wires for connecting the IC package and the lead frame and for carrying the signals from the circuit of the IC to the board on which the IC package is mounted for transmission through the waveguide antenna.

2. The radar system according to claim 1, characterized in that, The plurality of waveguide shields include axial metal shields for providing impedance control of a transmission line for propagating the millimeter-wave signal in the TE10 mode.

3. The radar system according to claim 1, characterized in that, The posts may include a plurality of post groups each consisting of two posts for presenting differential signals for transmission through the waveguide antenna.

4. The radar system according to claim 1, characterized in that, The waveguide structure provides a signal line for transmitting the signal carried from the circuit of the IC package for emission as a radar signal from the waveguide antenna.

5. The radar system according to claim 1, characterized in that, The passage is for providing propagation of the millimeter-wave signal through a guided TEM wave signal, the passage having an optimized path length on which the millimeter-wave signal propagates such that attenuation caused by conduction loss and dielectric loss is reduced.

6. The radar system according to claim 1, characterized in that, The waveguide structure and the posts provide a plurality of differential signal paths; the combination of the posts and the waveguide shields is arranged to reduce undesired coupling between adjacent signal paths communicatively connecting the waveguide structure and the circuit to the IC package.

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