A laminated jig

Abstract

The present invention relates to the technical field of jigs. The present invention discloses a laminated jig, comprising a lower jig assembly and an upper jig assembly, wherein the upper jig assembly can move up and down relative to the lower jig assembly, a product receiving groove is provided on the upper surface of the lower jig assembly, and a gap is provided between the groove wall of the product receiving groove and the bus, a bus yielding groove is provided on the lower surface of the upper jig assembly for receiving the bus, and a gap is provided between the groove wall of the bus receiving groove and the bus, the groove bottom of the product receiving groove, the lower surface of the upper jig assembly and the groove bottom of the bus yielding groove are all made of soft materials, and when the upper jig assembly is pressed on the lower jig assembly, the groove bottom of the product receiving groove forms a PET film on the lower surface of the flexible circuit board and the bus, the groove bottom of the bus yielding groove forms a PET film on the upper surface of the bus, and the lower surface of the upper jig assembly corresponding to the product receiving groove forms a PET film on the upper surface of the flexible circuit board except the bus.

Description

Technical Field

[0001] The invention belongs to the technical field of jigs, and in particular relates to a laminated jig. Background Art

[0002] With the continuous development of the new energy vehicle industry, more and more industries are being integrated into the industrial chain. As the main component of electric energy vehicles, the battery pack accounts for about 25% of the weight of the whole vehicle and accounts for about 40% of the cost of the whole vehicle. In order to achieve lightweight battery packs and reduce costs, a new process flow has been developed, that is, changing the plastic parts to PET (polyethylene terephthalate) film as a carrier plate, integrating the flexible circuit board (sampling line) and the bus into one, which is conducive to reducing the weight of the battery pack and reducing process costs. Because the new process transfers the assembly part to the flexible circuit board production industry chain, there was no mature jig for laminating the PET film for the flexible circuit board and the bus. They were all manually aligned for lamination, which was inefficient and unstable in quality, and the PET film could not completely cover the flexible circuit board and the bus. Summary of the invention

[0003] The purpose of the present invention is to provide a laminated jig for solving the above-mentioned technical problems.

[0004] To achieve the above-mentioned purpose, the technical solution adopted by the present invention is as follows: a laminating jig for laminating a PET film on a flexible circuit board with a bus, comprising a lower jig component and an upper jig component, the upper jig component being movably arranged on the lower jig component, the upper surface of the lower jig component being provided with a product receiving groove for receiving the flexible circuit board with a bus, and satisfying that there is a gap between the groove wall of the product receiving groove and the bus, the lower surface of the upper jig component being provided with a bus yielding groove for receiving the bus, and satisfying that the bus receiving groove is provided with a bus yielding groove There is a gap between the groove wall of the groove and the bus. The bottom of the product receiving groove, the lower surface of the upper jig assembly and the bottom of the bus yield groove are all made of soft materials, and when the upper jig assembly is pressed on the lower jig assembly, the bottom of the product receiving groove will cover the PET film on the lower surface of the flexible circuit board and the bus, the bottom of the bus yield groove will cover the PET film on the upper surface of the bus, and the lower surface of the upper jig assembly corresponding to the product receiving groove will cover the PET film on the upper surface of the flexible circuit board except the bus.

[0005] Furthermore, the lower jig assembly includes a first lower jig, a second lower jig and a third lower jig, which are stacked in sequence from bottom to top, the first lower jig is made of a hard material, the second lower jig is made of a soft material, and the third lower jig is provided with a first hollow area, which is enclosed together with the upper surface of the second lower jig to form a product receiving groove.

[0006] Furthermore, the first lower fixture and the third lower fixture are made of FR4 material, and the second lower fixture is made of silicone material.

[0007] Furthermore, the bottom of the bus accommodating groove is also provided with a first bus bending area yielding groove which penetrates to the bottom of the lower fixture assembly.

[0008] Furthermore, the upper jig assembly includes a first upper jig, a second upper jig and a third upper jig, which are stacked in sequence from bottom to top, the first upper jig and the third upper jig are made of soft materials, the second upper jig is made of hard materials, the first upper jig and the second upper jig are respectively provided with a second hollow area and a third hollow area, and the second hollow area, the third hollow area and the lower surface of the third upper jig are jointly enclosed to form a busbar clearance groove.

[0009] Furthermore, the first upper jig and the third upper jig are made of silicone material, and the second upper jig is made of FR4 material.

[0010] Furthermore, the bottom of the bus accommodating groove is also provided with a second bus bending area yielding groove which penetrates to the top of the upper fixture assembly.

[0011] Furthermore, it also includes a jig positioning pin, and the lower jig component and the upper jig component are respectively provided with a jig positioning hole, and the jig positioning pin can be movably inserted into the jig positioning hole.

[0012] Furthermore, it also includes a bus positioning pin, and the lower fixture assembly and the upper fixture assembly are respectively provided with bus positioning holes corresponding to the bus, and the bus positioning pin can be movably inserted into the bus positioning hole.

[0013] Furthermore, it also includes a product positioning pin. The lower fixture component and the upper fixture component are respectively provided with product positioning holes corresponding to the flexible circuit board, and the product positioning pin can be movably inserted into the product positioning hole.

[0014] Beneficial technical effects of the present invention:

[0015] The present invention can effectively improve the manufacturing quality and efficiency of the lamination process of the busbar and the flexible circuit board coated with the PET film, and the edge of the busbar can also be completely coated with the PET film. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0017] Figure 1 It is a cross-sectional view of a specific embodiment of the present invention where a product to be molded is placed;

[0018] Figure 2 It is a structural diagram of a first lower fixture of a specific embodiment of the present invention;

[0019] Figure 3 It is a structural diagram of a second lower fixture of a specific embodiment of the present invention;

[0020] Figure 4 It is a structural diagram of a third lower fixture of a specific embodiment of the present invention;

[0021] Figure 5 It is a structural diagram of a first upper fixture according to a specific embodiment of the present invention;

[0022] Figure 6 It is a structural diagram of a second upper fixture according to a specific embodiment of the present invention;

[0023] Figure 7 It is a structural diagram of the third upper fixture of a specific embodiment of the present invention. DETAILED DESCRIPTION

[0024] To further illustrate the various embodiments, the present invention provides drawings. These drawings are part of the disclosure of the present invention, which are mainly used to illustrate the embodiments and can be used in conjunction with the relevant descriptions in the specification to explain the operating principles of the embodiments. With reference to these contents, a person of ordinary skill in the art should be able to understand other possible implementations and advantages of the present invention. The components in the figures are not drawn to scale, and similar component symbols are generally used to represent similar components.

[0025] The present invention will now be further described with reference to the accompanying drawings and specific implementation methods.

[0026] like Figure 1-7 As shown, a laminating jig is used for laminating a flexible circuit board 4 having a bus bar 3 with a PET film 5, that is, for laminating the PET film 5 on the surface of the flexible circuit board 4 and the bus bar 3 to form an integrated structure.

[0027] The present invention comprises a lower jig assembly 1 and an upper jig assembly 2. The upper jig assembly 2 is movably arranged on the lower jig assembly 1. The upper surface of the lower jig assembly 1 is provided with a concave product receiving groove 14 for receiving a flexible circuit board 4 having a bus 3. The size of the product receiving groove 14 satisfies that when the flexible circuit board 4 having the bus 3 is placed therein, there is a gap between the groove wall of the product receiving groove 14 and the bus 3, so that the PET film around the edges of the product can be completely covered.

[0028] Preferably, the gap distance between the groove wall of the product containing groove 14 and the bus 3 is greater than or equal to half the thickness of the bus 3. For example, in the present embodiment, the thickness of the bus 3 is 2.5 mm and the gap distance is 1.5 mm, but it is not limited to this, so that the PET film covering the edges of the product is more complete.

[0029] The lower surface of the upper fixture assembly 2 is provided with an upwardly recessed bus-bar clearance groove 24 for accommodating the portion of the bus 3 protruding from the upper surface of the flexible circuit board 4. The size of the bus-bar clearance groove 24 is such that when the bus 3 is located therein, there is a gap between the groove wall of the bus-bar clearance groove 24 and the bus 3, thereby allowing the PET film on the edges of the product to be completely covered.

[0030] Preferably, the gap distance between the bus bar clearance groove 24 and the bus bar 3 is greater than or equal to half the thickness of the bus bar 3. For example, in this embodiment, the thickness of the bus bar 3 is 2.5 mm and the gap distance is 1.5 mm, but it is not limited to this, so that the PET film covering the edges of the product is more complete.

[0031] The sum of the depth of the bus-clearing groove 24 and the depth of the product-receiving groove 14 is equal to or slightly larger than the thickness of the bus 3, so that when the upper jig assembly 2 is pressed onto the lower jig assembly 1, the bottom of the product-receiving groove 14 covers the PET film 5 on the lower surfaces of the flexible circuit board 4 and the bus 3, and the bottom of the bus-clearing groove 24 covers the PET film 5 on the upper surface of the bus 3, and the lower surface of the upper jig assembly 2 corresponding to the product-receiving groove 14 covers the PET film 5 on the upper surface of the flexible circuit board 4 except the bus 3.

[0032] The bottom of the product receiving groove 14, the lower surface of the upper fixture assembly 2 and the bottom of the busbar yielding groove 24 are all made of soft materials, which can better cover the PET film, are particularly suitable for covering surfaces with uneven surfaces, and can protect related devices on the product surface.

[0033] Preferably, in this specific embodiment, the lower jig assembly 1 includes a first lower jig 11, a second lower jig 12 and a third lower jig 13, which are stacked in sequence from bottom to top, and the first lower jig 11 is made of a hard material and is used as a supporting plate for the entire jig, and the second lower jig 12 is made of a soft material. The third lower jig 13 is provided with a first hollow area 131, and the first hollow area 131 and the upper surface of the second lower jig 12 are jointly enclosed to form a product receiving groove 14. This structure is easy to process and manufacture and has low cost, but is not limited to this. In other embodiments, the lower jig assembly 1 can also be implemented using other structures.

[0034] In this specific embodiment, the first lower jig 11, the second lower jig 12 and the third lower jig 13 are all rectangular plate structures with simple structure and easy implementation, but it is not limited to this. In other embodiments, the shapes of the first lower jig 11, the second lower jig 12 and the third lower jig 13 can be set according to actual needs.

[0035] In this specific embodiment, the first lower fixture 11 and the third lower fixture 13 are made of FR4 (glass cloth substrate) material with thicknesses of 2.5 mm and 0.8 mm respectively, and the second lower fixture 12 is made of silicone material with a thickness of 1.6 mm. It is easy to implement, simple to process, and low in cost, but is not limited to this.

[0036] In this specific embodiment, the bottom of the product containing groove 14 is also provided with a first bus bar bending area give-way groove 141 extending through the bottom of the lower fixture assembly 1, which is used to allow the bus bar bending area to extend out from the first bus bar bending area give-way groove 141.

[0037] Preferably, in this specific embodiment, the upper jig assembly 2 includes a first upper jig 21, a second upper jig 22 and a third upper jig 23, which are stacked in sequence from bottom to top, and the first upper jig 21 and the third upper jig 23 are made of soft materials, and the second upper jig 22 is made of hard materials, which play a supporting role. The first upper jig 21 and the second upper jig 22 are respectively provided with a second hollow area 211 and a third hollow area 221, and the second hollow area 211, the third hollow area 221 and the lower surface of the third upper jig 23 are jointly enclosed to form a busbar clearance groove 24. This structure is easy to process and manufacture, and has low cost, but is not limited to this. In other embodiments, the upper jig assembly 2 can also be implemented by other structures.

[0038] In this specific embodiment, the number of the second hollow areas 211 and the third hollow areas 221 is 5 each, corresponding to 5 bus bars 3, but it is not limited to this. In other embodiments, the second hollow areas 211 and the third hollow areas 221 can be set according to the number of bus bars of the product.

[0039] In this specific embodiment, the first upper jig 21, the second upper jig 22 and the third upper jig 23 are all rectangular plate structures with simple structure and easy implementation, but are not limited to this. In other embodiments, the shapes of the first upper jig 21, the second upper jig 22 and the third upper jig 23 can be set according to actual needs.

[0040] In this specific embodiment, the first upper fixture 21 and the third upper fixture 23 are made of silicone material with thicknesses of 0.8 mm and 1.6 mm respectively, and the second upper fixture 22 is made of FR4 material with a thickness of 0.9 mm. They are easy to implement, simple to process, and low in cost, but are not limited to this.

[0041] In this specific embodiment, the bottom of the busbar clearance groove 24 is also provided with a second busbar bending area clearance groove 241 that penetrates to the top of the upper fixture assembly 2, so as to allow the busbar bending area to extend out from the second busbar bending area clearance groove 241.

[0042] In this specific embodiment, a jig positioning pin 6 is also included. The lower jig assembly 1 and the upper jig assembly 2 are respectively provided with a jig positioning hole 61. The jig positioning pin 6 can be movably penetrated into the jig positioning hole 61 and is used for positioning between the first lower jig 11, the second lower jig 12, the third lower jig 13, the first upper jig 21, the second upper jig 22 and the third upper jig 23, thereby improving the positioning efficiency and positioning accuracy.

[0043] In this specific embodiment, the number of the jig positioning pins 6 and the jig positioning holes 61 is four, which are distributed on the four corners of the lower jig component 1 and the upper jig component 2 to improve the positioning accuracy, but this is not limited to this.

[0044] In this specific embodiment, a bus positioning pin 7 is also included. The lower fixture component 1 and the upper fixture component 2 are respectively provided with a bus positioning hole 71 corresponding to the bus 3. The bus positioning pin 7 can be movably penetrated into the bus positioning hole 71 and penetrated through the positioning hole of the bus 3 to position the bus 3 and improve the positioning accuracy and efficiency.

[0045] The number and positions of the bus positioning pins 7 and the bus positioning holes 71 are specifically set according to the number and positions of the positioning holes of the bus 3 , which can be easily implemented by those skilled in the art and will not be described in detail.

[0046] In this specific embodiment, a product positioning pin 8 is also included. The lower jig assembly 1 and the upper jig assembly 2 are respectively provided with a product positioning hole 81 corresponding to the flexible circuit board 4. The product positioning pin 8 can be movably penetrated into the product positioning hole 81 and penetrated through the positioning hole of the flexible circuit board 4 to position the flexible circuit board 4 and improve the positioning accuracy and efficiency.

[0047] The number and positions of the product positioning pins 8 and the product positioning holes 81 are specifically set according to the number and positions of the positioning holes of the flexible circuit board 4 , which can be easily implemented by those skilled in the art and will not be elaborated.

[0048] When in use, the first lower jig 11, the second lower jig 12, and the third lower jig 13 are positioned in sequence through the jig positioning pins 6, and then the PET film 5, the flexible circuit board 4 with the bus 3 (bottom side facing down) and the PET film 5 are placed, and then the bus 3 and the flexible circuit board 4 are positioned through the bus positioning pins 7 and the product positioning pins 8, and then the first upper jig 21, the second upper jig 22 and the third upper jig 23 are placed in sequence, and finally the jig positioning pins 6, the product positioning pins 8 and the product positioning holes 81 are taken out and put into the laminator for pressing.

[0049] The present invention can effectively improve the manufacturing quality and efficiency of the lamination process of the busbar and the flexible circuit board coated with the PET film, and the edge of the busbar is also completely coated with the PET film.

[0050] Although the present invention has been specifically shown and described in conjunction with the preferred embodiments, it should be understood by those skilled in the art that various changes may be made to the present invention in form and details without departing from the spirit and scope of the present invention as defined by the appended claims, all of which are within the scope of protection of the present invention.

Claims

1. A laminating jig for laminating a PET film on a flexible circuit board with a busbar, characterized in that: The utility model comprises a lower jig assembly and an upper jig assembly, wherein the upper jig assembly can be movably arranged on the lower jig assembly up and down, the upper surface of the lower jig assembly is provided with a product receiving groove for receiving a flexible circuit board having a bus, and a gap is provided between the groove wall of the product receiving groove and the bus, the lower surface of the upper jig assembly is provided with a bus yielding groove for receiving the bus, and a gap is provided between the groove wall of the bus receiving groove and the bus, the groove bottom of the product receiving groove, the lower surface of the upper jig assembly and the groove bottom of the bus yielding groove are all made of soft materials, and when the upper jig assembly is pressed on the lower jig assembly, the groove bottom of the product receiving groove forms a PET film on the lower surface of the flexible circuit board and the bus, the groove bottom of the bus yielding groove forms a PET film on the upper surface of the bus, and the lower surface of the upper jig assembly corresponding to the product receiving groove forms a PET film on the upper surface of the flexible circuit board except the bus; The lower jig assembly includes a first lower jig, a second lower jig and a third lower jig, which are stacked in sequence from bottom to top, the first lower jig is made of a hard material, the second lower jig is made of a soft material, and the third lower jig is provided with a first hollow area, which is enclosed with the upper surface of the second lower jig to form a product receiving groove; The upper jig assembly includes a first upper jig, a second upper jig and a third upper jig, which are stacked in sequence from bottom to top, the first upper jig and the third upper jig are made of soft materials, the second upper jig is made of hard materials, the first upper jig and the second upper jig are respectively provided with a second hollow area and a third hollow area, and the second hollow area, the third hollow area and the lower surface of the third upper jig are jointly enclosed to form a busbar yield groove; It also includes a bus positioning pin. The lower fixture component and the upper fixture component are respectively provided with bus positioning holes corresponding to the bus. The bus positioning pin can be movably inserted into the bus positioning hole.

2. The lamination jig according to claim 1, characterized in that: The first lower fixture and the third lower fixture are made of FR4 material, and the second lower fixture is made of silicone material.

3. The lamination jig according to claim 1, characterized in that: The bottom of the busbar accommodating groove is also provided with a first busbar bending area yielding groove penetrating to the bottom of the lower fixture assembly.

4. The lamination jig according to claim 1, characterized in that: The first upper jig and the third upper jig are made of silicone material, and the second upper jig is made of FR4 material.

5. The lamination jig according to claim 1, characterized in that: The bottom of the busbar accommodating groove is also provided with a second busbar bending area yielding groove which penetrates to the top of the upper fixture assembly.

6. The lamination jig according to claim 1, characterized in that: It also includes a jig positioning pin. The lower jig component and the upper jig component are respectively provided with jig positioning holes, and the jig positioning pin can be movably inserted into the jig positioning hole.

7. The lamination jig according to claim 1, characterized in that: It also includes a product positioning pin. The lower fixture component and the upper fixture component are respectively provided with product positioning holes corresponding to the FPC circuit board, and the product positioning pin can be movably inserted into the product positioning hole.

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