Substrate processing device and method

Abstract

An apparatus for processing a substrate includes: a housing having a processing space therein; a plate supporting the substrate in the housing; a heating unit having a heating wire disposed inside the plate and heating the substrate; a main temperature sensor directly measuring the temperature of the plate; and an auxiliary temperature sensor measuring the temperature of the heating wire.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] Priority is claimed under 35 U.S.C. §119 to Korean Patent Application No. 10-2019-0063000 filed on May 29, 2019 in the Korean Intellectual Property Office, the entire contents of which are hereby incorporated herein by reference. Technical Field

[0003] Embodiments of the inventive concepts described herein relate to an apparatus and method for processing a substrate, and more particularly, to a substrate processing apparatus and method for detecting abnormality in a heating wire. Background Art

[0004] Various processes such as photolithography, etching, deposition, ion implantation, cleaning, etc. are performed to manufacture semiconductor elements. Among these processes, a photolithography process for forming a pattern plays an important role in realizing high-density integration of semiconductor elements.

[0005] The photolithography process includes a coating process, an exposure process, and a development process, and a baking process is performed before and after the exposure process. The baking process is a process of heat-treating the substrate. When the substrate is placed on a heating plate, the substrate is heat-treated by a heating unit provided in the heating plate.

[0006] Generally, the heating unit is implemented with a heating wire. The heating wire used for the heating unit is composed of a metal material, a compound thereof, a plating layer, etc. In order to perform heat treatment on the substrate, the heating wire is continuously heated and cooled. The repetition of heating and cooling causes repeated expansion and contraction of the metal material constituting the heating wire and gradual changes in the characteristics of the heating wire. As a result, due to the change in the characteristics of the heating wire, the uncertainty of temperature control for substrate processing requiring precision increases. Summary of the invention

[0007] Embodiments of the inventive concept provide a substrate processing apparatus and method for easily detecting abnormality in a heating wire.

[0008] According to an exemplary embodiment, an apparatus for processing a substrate includes: a housing having a processing space therein; a plate supporting the substrate in the housing; a heating unit having a heating wire disposed inside the plate and heating the substrate; a main temperature sensor directly measuring a temperature of the plate and an auxiliary temperature sensor measuring a temperature of the heating wire.

[0009] The apparatus may further include an abnormality detection unit which detects abnormality in the heating wire based on the temperature measured by the main temperature sensor and the temperature measured by the auxiliary temperature sensor.

[0010] The abnormality detecting unit may determine that the abnormality in the heating wire is detected when a temperature change characteristic of a temperature measured by the auxiliary temperature sensor relative to a temperature measured by the main temperature sensor exceeds a preset range.

[0011] The abnormality detecting unit may determine that an abnormality in the heating wire is detected when an average value of the temperatures measured by the auxiliary temperature sensors exceeds a preset range.

[0012] The abnormality detecting unit may determine that an abnormality in the heating wire is detected when a standard deviation of the temperature measured by the auxiliary temperature sensor exceeds a preset range.

[0013] The abnormality detection unit may detect at least one of deformation of the heating wire, poor insulation of the heating wire, and introduction of noise based on temperature change characteristics of temperature measured by the auxiliary temperature sensor relative to temperature measured by the main temperature sensor.

[0014] The heating wire may include a plurality of heating wires located in a plurality of regions of the board. The main temperature sensor may include a plurality of temperature sensors located in the plurality of regions of the board, respectively. The auxiliary temperature sensor may measure the temperature of each of the plurality of heating wires located in the plurality of regions of the board.

[0015] When the difference between an average value of the temperature measured by the auxiliary temperature sensor in a first area among multiple areas of the plate and an average value of the temperature measured by the auxiliary temperature sensor in the remaining areas of the multiple areas except the first area is greater than a preset value, the abnormality detection unit can determine that an abnormality in the heating wire is detected in the first area.

[0016] When the difference between the standard deviation of the temperature measured by the auxiliary temperature sensor in a first area among multiple areas of the plate and the standard deviation of the temperature measured by the auxiliary temperature sensor in the remaining areas of the multiple areas except the first area is greater than a preset value, the abnormality detection unit can determine that an abnormality in the heating wire is detected in the first area.

[0017] The abnormality detection unit may predict a fault in the heating wire by collecting temperature change characteristics of a temperature measured by the auxiliary temperature sensor with respect to a temperature measured by the main temperature sensor over a predetermined period of time.

[0018] The heating unit may include a heating wire and a power source applying current to the heating wire, and the auxiliary temperature sensor may measure the temperature of the heating wire by using the current flowing through the heating wire and a voltage of the power source.

[0019] According to an exemplary embodiment, a method for processing a substrate includes: directly measuring a temperature of a plate supporting the substrate; measuring a temperature of a heating wire disposed inside the plate and heating the substrate; and detecting an abnormality in the heating wire based on the temperature of the plate and the temperature of the heating wire.

[0020] The detecting of the abnormality in the heating wire may include determining that the abnormality in the heating wire is detected when a temperature variation characteristic of the heating wire relative to the temperature of the plate exceeds a preset range.

[0021] Determining that the abnormality in the heating wire is detected may include determining that the abnormality in the heating wire is detected when an average value of the temperature of the heating wire exceeds a preset range.

[0022] Determining that the abnormality in the heating wire is detected may include determining that the abnormality in the heating wire is detected when a standard deviation of the temperature of the heating wire exceeds a preset range.

[0023] Determining that the abnormality in the heating wire is detected may include detecting at least one of deformation of the heating wire, insulation difference of the heating wire, and introduction of noise based on temperature change characteristics of the heating wire relative to the temperature of the plate.

[0024] The heating wire may include a plurality of heating wires respectively located in a plurality of regions of the board. The measuring of the temperature of the heating wire may include measuring the temperature of each of the plurality of heating wires located in the plurality of regions of the board. Detecting an abnormality in the heating wire may include determining that an abnormality in the heating wire is detected in a first region among the plurality of regions of the board when a difference between an average value of the temperature of the heating wire in a first region among the plurality of regions of the board and an average value of the temperature of the heating wire in the remaining regions among the plurality of regions except the first region is greater than a preset value.

[0025] The heating wire may include a plurality of heating wires respectively located in a plurality of regions of the plate. The measuring of the temperature of the heating wire may include measuring the temperature of each of the plurality of heating wires located in the plurality of regions of the plate. Detecting an abnormality in the heating wire may include determining that an abnormality in the heating wire is detected in a first region among the plurality of regions of the plate when a difference between a standard deviation of the temperature of the heating wire in a first region among the plurality of regions of the plate and a standard deviation of the temperature of the heating wire in the remaining regions among the plurality of regions except the first region is greater than a preset value.

[0026] The method may further include predicting a fault in the heating wire by collecting temperature variation characteristics of the heating wire relative to the temperature of the plate over a preset period of time. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The above and other objects and features will become apparent from the following description with reference to the accompanying drawings, wherein like reference numerals refer to like parts throughout the various drawings unless otherwise specified, and wherein:

[0028] Figure 1 is a top view showing a substrate processing apparatus;

[0029] Figure 2 It shows the time when viewed from the AA direction. Figure 1 A view of a substrate processing apparatus;

[0030] Figure 3 It shows the time when viewed from the BB direction. Figure 1 A view of a substrate processing apparatus;

[0031] Figure 4 It shows the situation when viewed from the CC direction. Figure 1 A view of a substrate processing apparatus;

[0032] Figure 5 is a plan view showing a baking unit according to an embodiment of the present inventive concept;

[0033] Figure 6 is a cross-sectional view showing a substrate processing apparatus according to an embodiment of the inventive concept;

[0034] Figure 7 is a view showing an arrangement of a heating wire and a temperature sensor on a board according to an embodiment of the present inventive concept;

[0035] Figures 8 to 11 is a view illustrating temperature variation characteristics of a heating wire according to an embodiment of the present inventive concept; and

[0036] Fig.12 is a flowchart illustrating a substrate processing method according to an embodiment of the inventive concept. DETAILED DESCRIPTION

[0037] Hereinafter, embodiments of the inventive concept will be described in more detail with reference to the accompanying drawings. Various modifications and variations may be made to the embodiments of the inventive concept, and the scope of the inventive concept should not be interpreted as being limited to the embodiments set forth herein. These embodiments are provided to make the inventive concept thorough and complete, and will fully convey the scope of the inventive concept to those skilled in the art. Therefore, in the accompanying drawings, the shapes of the components are magnified for clarity of illustration.

[0038] The device of this embodiment can be used to perform a photolithography process on a substrate such as a semiconductor wafer or a flat panel display panel. In particular, the device of this embodiment can be connected to a stepper and can be used to perform a coating process and a developing process on a substrate. In the following description, a wafer will be exemplarily used as a substrate.

[0039] Figures 1 to 4 is a schematic diagram illustrating a substrate processing apparatus according to an embodiment of the inventive concept.

[0040] refer to Figures 1 to 4 , the substrate processing apparatus 1 includes a loading port 100, an indexing module 200, a first buffer module 300, a coating and developing module 400, a second buffer module 500, a pre-exposure / post-exposure processing module 600, and an interface module 700. The loading port 100, the indexing module 200, the first buffer module 300, the coating and developing module 400, the second buffer module 500, the pre-exposure / post-exposure processing module 600, and the interface module 700 are sequentially arranged in a column in one direction.

[0041] Hereinafter, the direction in which the load port 100, the index module 200, the first buffer module 300, the coating and developing module 400, the second buffer module 500, the pre-exposure / post-exposure processing module 600, and the interface module 700 are arranged is referred to as a first direction 12. A direction perpendicular to the first direction 12 when viewed from above is referred to as a second direction 14, and a direction perpendicular to the first direction 12 and the second direction 14 is referred to as a third direction 16.

[0042] The substrate W moves in a state of being accommodated in the cassette 20. The cassette 20 has a structure capable of being sealed from the outside. For example, a front open unified pod (FOUP) each having a door at the front may be used as the cassette 20.

[0043] Hereinafter, the load port 100 , the index module 200 , the first buffer module 300 , the coating and developing module 400 , the second buffer module 500 , the pre-exposure / post-exposure processing module 600 , and the interface module 700 will be described in detail.

[0044] The load port 100 has a mounting stage 120 on which the cassette 20 containing the substrate W therein is placed. The mounting stages 120 are arranged in a row along the second direction 14 . Figure 1 In the embodiment, four mounting tables 120 are provided.

[0045] The indexing module 200 transfers the substrate W between the cassette 20 placed on the mounting table 120 of the loading port 100 and the first buffer module 300. The indexing module 200 has a frame 210, an indexing robot 220, and a guide rail 230. The frame 210 has a substantially rectangular parallelepiped shape with an empty space inside, and is arranged between the loading port 100 and the first buffer module 300. The height of the frame 210 of the indexing module 200 may be less than the height of the frame 310 of the first buffer module 300, which will be described below. The indexing robot 220 and the guide rail 230 are arranged in the frame 210. The indexing robot 220 has a structure capable of four-axis driving, so that the hand 221 that directly processes the substrate W can be moved in the first direction 12, the second direction 14, and the third direction 16 and is rotatable. The indexing robot 220 has a hand 221, an arm 222, a support rod 223, and a base 224. The hand 221 is fixed to the arm 222. The arm 222 is arranged in a telescopic and rotatable structure. The support rod 223 is arranged so that its length direction is parallel to the third direction 16. The arm 222 is connected to the support rod 223 so that it can move along the support rod 223. The support rod 223 is fixedly connected to the base 224. The guide rail 230 is arranged so that its length direction is parallel to the second direction 14. The base 224 is connected to the guide rail 230 so that it can move linearly along the guide rail 230. In addition, although not shown, a door opener for opening / closing the door of the box 20 is also provided in the frame 210.

[0046] The first buffer module 300 has a frame 310, a first buffer 320, a second buffer 330, a cooling chamber 350, and a first buffer manipulator 360. The frame 310 has a rectangular parallelepiped shape with an empty space inside, and is disposed between the indexing module 200 and the coating and developing module 400. The first buffer 320, the second buffer 330, the cooling chamber 350, and the first buffer manipulator 360 are located in the frame 310. The cooling chamber 350, the second buffer 330, and the first buffer 320 are sequentially arranged from bottom to top along the third direction 16. The first buffer 320 is located at a height corresponding to the coating module 401 of the coating and developing module 400 to be described below, and the second buffer 330 and the cooling chamber 350 are located at a height corresponding to the developing module 402 of the coating and developing module 400, which will be described below. The first buffer manipulator 360 is located at a position separated by a predetermined distance from the second buffer 330, the cooling chamber 350, and the first buffer 320 in the second direction 14.

[0047] The first buffer 320 and the second buffer 330 temporarily store a plurality of substrates W, respectively. The second buffer 330 has a housing 331 and a plurality of supports 332. The supports 332 are disposed in the housing 331 and are spaced apart from each other along the third direction 16. One substrate W is placed on each support 332. The housing 331 has an opening (not shown) facing the direction in which the indexing robot 220, the first buffer robot 360, and the developing robot 482 are respectively disposed, so that the indexing robot 220, the first buffer robot 360, and the developing robot 482 of the developing module 402 described below load the substrate W onto the support 332 or unload the substrate W from the support 332. The first buffer 320 has a structure substantially the same as that of the second buffer 330. However, the housing 321 of the first buffer 320 has an opening facing the direction in which the first buffer robot 360 and the coating machine robot 432 located in the coating module 401 are respectively disposed. The number of supports 332 provided in the first buffer 320 may be the same as or different from the number of supports 332 provided in the second buffer 330. According to one embodiment, the number of supports 332 provided in the second buffer 330 may be greater than the number of supports 322 provided in the first buffer 320.

[0048] The first buffer robot 360 transfers the substrate W between the first buffer 320 and the second buffer 330. The first buffer robot 360 has a hand 361, an arm 362, and a support rod 363. The hand 361 is fixed to the arm 362. The arm 362 has a retractable structure and enables the hand 361 to move along the second direction 14. The arm 362 is connected to the support rod 363 so as to be able to move linearly in the third direction 16 along the support rod 363. The support rod 363 has a length extending from a position corresponding to the second buffer 330 to a position corresponding to the first buffer 320. The support rod 363 may further extend upward or downward. The first buffer robot 360 may be set so that the hand 361 simply performs 2-axis driving only along the second direction 14 and the third direction 16.

[0049] The cooling chamber 350 cools the substrate W. The cooling chamber 350 has a housing 351 and a cooling plate 352. The cooling plate 352 has an upper surface on which the substrate W is placed and a cooling unit 353 that cools the substrate 353. The cooling unit 353 may use various methods such as cooling by cooling water, cooling using a thermoelectric element, etc. In addition, the cooling chamber 350 may include a lifting pin assembly (not shown) that positions the substrate W on the cooling plate 352. The housing 351 has an opening (not shown) facing the direction in which the indexing robot 220 and the developer robot 482 are respectively provided, so that the indexing robot 220 and the developer robot 482 provided in the developing module 402 load the substrate W onto the cooling plate 352 or unload the substrate W from the cooling plate 352. In addition, the cooling chamber 350 may include a door (not shown) that opens or closes the above-mentioned opening.

[0050] The coating and developing module 400 performs a process of coating the substrate W with a photoresist before the exposure process, and performs a developing process on the substrate W after the exposure process. The coating and developing module 400 has a substantially rectangular parallelepiped shape. The coating and developing module 400 has a coating module 401 and a developing module 402. The coating module 401 and the developing module 402 can be arranged on different floors so as to be separated from each other. According to one embodiment, the coating module 401 is located above the developing module 402.

[0051] The coating module 401 performs a process of coating the substrate W with a photosensitive material such as a photoresist, and performs a heat treatment process such as heating or cooling on the substrate W before and after the photoresist coating process. The coating module 401 has a photoresist coating chamber 410, a baking unit 420, and a transfer chamber 430. The photoresist coating chamber 410, the baking unit 420, and the transfer chamber 430 are sequentially arranged along the second direction 14. Therefore, the photoresist coating chamber 410 and the baking unit 420 are spaced apart from each other in the second direction 14, with the transfer chamber 430 therebetween. The photoresist coating chamber 410 is arranged along the first direction 12 and the third direction 16. The accompanying drawings show an example in which six photoresist coating chambers 410 are arranged. The baking units 420 are arranged along the first direction 12 and the third direction 16. The accompanying drawings show an example in which six baking units 420 are arranged. However, a greater number of baking units 420 may be provided.

[0052] The transfer chamber 430 is placed side by side with the first buffer 320 of the first buffer module 300 in the first direction 12. The coater robot 432 and the guide rail 433 are located in the transfer chamber 430. The transfer chamber 430 has a substantially rectangular shape. The coater robot 432 transfers the substrate W between the baking unit 420, the photoresist coating chamber 400, the first buffer 320 of the first buffer module 300, and the first cooling chamber 520 of the second buffer module 500 to be described below. The guide rail 433 is arranged so that its length direction is parallel to the first direction 12. The guide rail 433 guides the coater robot 432 to move linearly in the first direction 12. The coater robot 432 has a hand 434, an arm 435, a support rod 436, and a base 437. The hand 434 is fixed to the arm 435. The arm 435 has a retractable structure and enables the hand 434 to move in the horizontal direction. The support rod 436 is arranged so that its length direction is parallel to the third direction 16. The arm 435 is coupled to the support rod 436 so as to be linearly movable in the third direction 16 along the support rod 436. The support rod 436 is fixedly coupled to the base 437, and the base 437 is coupled to the guide rail 433 so as to be movable along the guide rail 433.

[0053] The photoresist coating chambers 410 all have the same structure. However, the types of photoresists used in the respective photoresist coating chambers 410 may be different from each other. For example, a chemically amplified resist may be used as a photoresist. Each photoresist coating chamber 410 coats the substrate W with a photoresist. The photoresist coating chamber 410 has a housing 411, a support plate 412, and a nozzle 413. The housing 411 has a cup shape with an open top. The support plate 412 is located in the housing 411 and supports the substrate W. The support plate 412 is configured to be rotatable. The nozzle 413 distributes the photoresist to the substrate W placed on the support plate 412. The nozzle 413 may have a circular tubular shape, and the photoresist may be distributed to the center of the substrate W. Optionally, the length of the nozzle 413 may correspond to the diameter of the substrate W, and the distribution port of the nozzle 413 may have a slit shape. In addition, the photoresist coating chamber 410 may further include a nozzle 414 for dispensing a cleaning solution such as deionized water to clean the surface of the substrate W coated with the photoresist.

[0054] The baking unit 420 may perform a heat treatment on the substrate W. For example, the baking unit 420 performs a pre-baking process of removing organic matter or moisture on the surface of the substrate W by heating the substrate W to a predetermined temperature before coating the substrate W with a photoresist, or performs a soft-baking process after coating the substrate W with the photoresist. In addition, the baking unit 420 performs a cooling process of cooling the substrate W after the heating process.

[0055] Figure 5is a plan view illustrating a baking unit according to an embodiment of the present inventive concept. Figure 6 is shown for Figure 5 sectional view of a substrate processing apparatus performing a heating process in a baking unit.

[0056] Reference Figure 5 and Figure 6 , the baking unit 420 may include a processing chamber 423 , a cooling plate 422 , and a substrate processing apparatus 800 .

[0057] The processing chamber 423 has a heat treatment space 424 therein. The processing chamber 423 may have a rectangular parallelepiped shape. The cooling plate 422 may cool the substrate W heated by the substrate processing device 800. The cooling plate 422 may be located in the heat treatment space 424. The cooling plate 422 may have a circular plate shape. A cooling device such as cooling water or a thermoelectric element is provided inside the cooling plate 422. For example, the cooling plate 422 may cool the heated substrate W to room temperature.

[0058] The substrate processing apparatus 800 processes a substrate W. The substrate processing apparatus 800 may include a housing 860 , a plate 810 , a heating unit 830 , an external gas supply unit 840 , a main temperature sensor 850 , an auxiliary temperature sensor 880 , and an abnormality detection unit 890 .

[0059] The housing 860 has a processing space 802 for performing a heating process on the substrate W. The housing 860 includes a lower body 862, an upper body 864, and an actuator (not shown).

[0060] The lower body 862 may have the shape of a container that is open at the top. The plate 810 and the heating unit 830 are located in the lower body 862. The lower body 862 includes double insulation covers 862a and 862b to prevent thermal deformation of the device around the plate 810. The double insulation covers 862a and 862b minimize the exposure of the device around the plate 810 to the high temperature heat generated by the heating unit 830. The double insulation covers 862a and 862b include a primary insulation cover 862a and a secondary insulation cover 862b. The primary insulation cover 862a and the secondary insulation cover 862b are spaced apart from each other.

[0061] The upper body 864 has the shape of a container with an opening at the bottom. The upper body 864 is combined with the lower body 862 to form a processing space 802 inside. The diameter of the upper body 864 is greater than the diameter of the lower body 862. The upper body 864 is located above the lower body 862. The upper body 864 can be moved in the vertical direction by an actuator. The upper body 864 can be moved vertically to an elevated position and a lowered position. Here, the elevated position is a position where the upper body 864 is separated from the lower body 862, and the lowered position is a position where the upper body 864 contacts the lower body 862. In the lowered position, the gap between the upper body 864 and the lower body 862 is blocked. Therefore, when the upper body 864 moves to the lowered position, the processing space 802 is formed by the upper body 864, the lower body 862 and the plate 810.

[0062] Although not shown, a sealing member for preventing external air from being introduced into the processing space 802 may be included in the housing 860. For example, the sealing member may seal a gap between the lower body 862 and the upper body 864.

[0063] The plate 810 is located in the processing space 802. The plate 810 has a circular plate shape. The upper surface of the plate 810 is used as a support area on which the substrate W is placed. The plate 810 is formed with a plurality of pin holes 812 in its upper surface. For example, three pin holes 812 may be provided. The pin holes 812 are positioned to be spaced apart from each other along the circumferential direction of the plate 810. The pin holes 812 are positioned to be spaced apart from each other at a constant interval. Lifting pins (not shown) are respectively provided in the pin holes 812. The lifting pins are movable in the vertical direction by a driving member (not shown).

[0064] The heating unit 830 heats the substrate W placed on the plate 810 to a preset temperature. The heating unit 830 may include a plurality of heating wires 831 and a power source 833 disposed in different regions of the plate 810. The heating unit 830 may perform heat treatment on respective regions of the substrate W by using the heating wires 831.

[0065] The main temperature sensor 850 directly measures the temperature of the board 810. The main temperature sensor 850 may include a temperature sensor disposed inside or on the board 810. In addition, the main temperature sensor 850 may include a plurality of temperature sensors located in a plurality of regions of the board 810.

[0066] The auxiliary temperature sensor 880 measures the temperature of each heating wire 831. Specifically, the auxiliary temperature sensor 880 may measure the temperature of the heating wire 831 by using the current flowing through the heating wire 831 and the voltage of the power source 833.

[0067] The abnormality detection unit 890 detects an abnormality in the heating wire 831 based on the temperature of the board 810 measured by the main temperature sensor 850 and the temperature of the heating wire 831 measured by the auxiliary temperature sensor 880. Specifically, when the temperature change characteristic of the heating wire 831 measured by the auxiliary temperature sensor 880 relative to the temperature of the board 810 measured by the main temperature sensor 850 exceeds a preset range, the abnormality detection unit 890 may determine that the abnormality in the heating wire 831 is detected. For example, when the average value of the temperature of the heating wire 831 measured by the auxiliary temperature sensor 880 exceeds a preset range, the abnormality detection unit 890 may determine that the abnormality in the heating wire 831 is detected. That is, when the heating wire 831 has a preset normal temperature range of 100 degrees Celsius to 120 degrees Celsius and the average value of the temperature of the heating wire 831 measured by the auxiliary temperature sensor 880 is lower than 100 degrees Celsius or higher than 120 degrees Celsius, the abnormality detection unit 890 may determine that the abnormality in the heating wire 831 is detected. In another example, when the standard deviation of the temperature of the heating wire 831 measured by the auxiliary temperature sensor 880 exceeds a preset range, the abnormality detection unit 890 may determine that an abnormality in the heating wire 831 is detected. The abnormality detection unit 890 may detect at least one of deformation of the heating wire 831, poor insulation of the heating wire 831, and introduction of noise based on the temperature change characteristics of the temperature measured by the auxiliary temperature sensor 880 relative to the temperature measured by the main temperature sensor 850. That is, the abnormality detection unit 890 may detect whether there is an abnormality in the heating wire 831 based on the temperature change characteristics of the temperature measured by the auxiliary temperature sensor 880 relative to the temperature measured by the main temperature sensor 850. In addition, the abnormality detection unit 890 may specifically detect what abnormality the heating wire 831 has based on the temperature change characteristics.

[0068] Reference Figure 7, the board 810 according to an embodiment of the inventive concept may be divided into a plurality of regions (e.g., four regions), and the heating wires 831 may be respectively located in the regions of the board 810. In addition, the main temperature sensor 850 may include a plurality of temperature sensors respectively located in the regions of the board 810, and the plurality of temperature sensors may respectively measure the temperatures of the regions of the board 810. The auxiliary temperature sensor 880 may respectively measure the temperatures of the heating wires 831 located in the regions of the board 810. That is, the main temperature sensor 850 and the auxiliary temperature sensor 880 may measure the temperatures of the regions of the board 810 and the temperatures of the heating wires 831 disposed in the regions of the board 810. The abnormality detection unit 890 may compare the temperatures of the heating wires 831 in a specific region among the regions of the board 810 with the temperatures of the heating wires 831 in the remaining regions to detect abnormalities in the heating wires 831. For example, when the difference between the average value of the temperature of the heating wire 831 measured by the auxiliary temperature sensor 880 in the first area A1 among the areas of the board 810 and the average value of the temperature of the heating wire 831 measured by the auxiliary temperature sensor 880 in the remaining areas of the board 810 other than the first area A1 is greater than a preset value, the abnormality detection unit 890 may determine that the abnormality in the heating wire 831 in the first area A1 is detected. In another example, when the difference between the standard deviation of the temperature of the heating wire 831 measured by the auxiliary temperature sensor 880 in the first area A1 among the areas of the board 810 and the standard deviation of the temperature of the heating wire 831 measured by the auxiliary temperature sensor 880 in the remaining areas of the board 810 other than the first area A1 is greater than a preset value, the abnormality detection unit 890 may determine that the abnormality in the heating wire 831 in the first area A1 is detected. In addition, the abnormality detection unit 890 may predict a failure of each heating wire 831 by collecting temperature change characteristics of the temperature of the heating wire 831 measured by the auxiliary temperature sensor 880 relative to the temperature of the plate 810 measured by the main temperature sensor 850 within a predetermined period of time. For example, the abnormality detection unit 890 may collect the temperature change characteristics within a predetermined period of time, and when the abnormality detection in the heating wire 831 exceeds a predetermined range or exceeds a predetermined number of times in the collected temperature change characteristics, the abnormality detection unit 890 may determine that a failure in the heating wire 831 is predicted. Hereinafter, reference will be made to Figures 8 to 11 A method of detecting an abnormality in the heating wire 831 by using a temperature variation characteristic of a temperature measured by the auxiliary temperature sensor 880 with respect to a temperature measured by the main temperature sensor 850 is described in detail.

[0069] Reference Figure 8, the temperature of the plate 810 measured by the main temperature sensor 850 during the heat treatment of the substrate has the highest frequency at a specific temperature t, and as the temperature of the plate 810 decreases or increases relative to the specific temperature t, the measurement frequency of the corresponding temperature gradually decreases. The temperature of the heating wire 831 measured by the auxiliary temperature sensor 880 has the same characteristics as the temperature of the plate 810. That is, the characteristics of the temperature of the heating wire 831 measured by the auxiliary temperature sensor 880 and the characteristics of the temperature of the plate 810 measured by the main temperature sensor 850 are proportional to each other. However, when there is an abnormality in the heating wire 831 due to repeated contraction and expansion of the heating wire 831, the temperature characteristics of the heating wire 831 relative to the temperature of the plate 810 may be changed, and the abnormality detection unit 890 of the present invention may detect the abnormality in the heating wire 831 by using the characteristics of the temperature of the heating wire 831 relative to the temperature of the plate 810. Referring to Fig. 9 , the temperature variation characteristics of the heating wire 831 are Figure 8 The temperature variation of the plate 810 shown corresponds to that in a normal state, it is within a predetermined range (e.g., Fig. 9 However, if the temperature characteristic of the heating wire 831 measured by the auxiliary temperature sensor 880 is outside the preset range, the abnormality detection unit 890 may determine that an abnormality in the heating wire 831 is detected. For example, when the average value of the temperature of the heating wire 831 measured by the auxiliary temperature sensor 880 exceeds a predetermined range, the abnormality detection unit 890 may determine that an abnormality in the heating wire 831 is detected. Fig. 9 In the case where the preset range in corresponds to a range of 100 degrees Celsius to 120 degrees Celsius, when the average value of the temperature of the heating wire 831 measured by the auxiliary temperature sensor 880 is lower than 100 degrees Celsius or higher than 120 degrees Celsius, the abnormality detection unit 890 may determine that an abnormality in the heating wire 831 is detected. Fig.10 As shown in FIG. 8 , the auxiliary temperature sensor 880 can measure the temperature of multiple heating wires (heating wire 1, heating wire 2, heating wire 3, and heating wire 4) located in multiple areas of the plate 810, and when each heating wire (e.g. Fig.10 When the average value of the temperature of the heating wire 4 in the auxiliary temperature sensor 880 exceeds a preset range, the abnormality detection unit 890 may determine that an abnormality is detected in the corresponding heating wire (e.g., the heating wire 4). In another example, when the standard deviation of the temperature of each heating wire 831 measured by the auxiliary temperature sensor 880 exceeds a preset range, the abnormality detection unit 890 may determine that an abnormality is detected in the heating wire 831.

[0070] Meanwhile, the abnormality detection unit 890 may detect at least one of deformation of the heating wire 831, poor insulation of the heating wire 831, and introduction of noise based on the temperature variation characteristics of the temperature of the heating wire 831 measured by the auxiliary temperature sensor 880 relative to the temperature of the plate 810 measured by the main temperature sensor 850. Fig.11 , as Figure 8 The temperature characteristics of the board 810 measured by the main temperature sensor 850 are provided as shown in Fig.11 When the temperature characteristics of the heating wire 831 measured by the auxiliary temperature sensor 880 (the average value decreases and the standard deviation increases) are provided as shown in (a), the abnormality detection unit 890 can determine that noise is introduced into the signal for controlling the heating wire 831 or the heating wire 831 is deformed. Fig.11 When the temperature characteristic (average value decreases) of the heating wire 831 measured by the auxiliary temperature sensor 880 is provided as shown in (b), the abnormality detection unit 890 can determine that deformation of the heating wire 831 or poor insulation of the heating wire 831 has occurred. Fig.11 When the temperature characteristics of the heating wire 831 measured by the auxiliary temperature sensor 880 are provided as shown in (c), the abnormality detection unit 890 can determine that poor insulation of the heating wire 831 occurs or noise is introduced into the signal for controlling the heating wire 831. That is, based on the temperature change characteristics of the temperature measured by the auxiliary temperature sensor 880 relative to the temperature measured by the main temperature sensor 850, the present inventive concept can detect the type of specific abnormality in the heating wire 831 (deformation, poor insulation, or introduction of noise).

[0071] Fig.12 is a flowchart illustrating a substrate processing method according to an embodiment of the inventive concept.

[0072] Reference Fig.12 , directly measure the temperature of the plate supporting the substrate (S1210). Specifically, the temperature of the plate can be measured by a plurality of temperature sensors disposed in a plurality of regions of the plate.

[0073] The temperature of a heating line disposed inside the board and heating the substrate is measured (S1220). The temperature of each of the plurality of heating lines located in a plurality of regions of the board may be measured.

[0074] An abnormality in the heating wire is detected based on the temperature of the plate and the temperature of the heating wire (S1230). Specifically, when the temperature variation characteristic of the heating wire relative to the temperature of the plate exceeds a preset range, it can be determined that the abnormality in the heating wire is detected. For example, when the average value of the temperature of the heating wire exceeds a predetermined range, it can be determined that the abnormality in the heating wire is detected. In another example, when the standard deviation of the temperature of the heating wire exceeds a preset range, it can be determined that the abnormality in the heating wire is detected. Here, the abnormality in the heating wire may include at least one of the deformation of the heating wire, the poor insulation of the heating wire, and the introduction of noise. In addition, when a plurality of heating wires are arranged in a plurality of regions of the plate and the difference between the temperature average value of the heating wire in the first region of the plurality of regions of the plate and the temperature average value of the heating wire in the remaining regions except the first region in the plurality of regions is greater than a preset value, it can be determined that the abnormality in the heating wire in the first region is detected. In addition, when the difference between the standard deviation of the temperature of the heating wire in the first region of the plurality of regions of the plate and the standard deviation of the temperature of the heating wire in the remaining regions except the first region in the plurality of regions is greater than a preset value, it can be determined that the abnormality in the heating wire in the first region is detected. In addition, a fault in the heating wire can be predicted by collecting the temperature variation characteristics of the heating wire relative to the temperature of the plate within a predetermined time period.

[0075] As described above, according to various embodiments of the inventive concept, an abnormality in the heating wire may be easily detected by using the temperature of the plate and the temperature of the heating wire.

[0076] The effects of the present inventive concept are not limited to the above-mentioned effects, and any other effects not mentioned herein can be clearly understood by those skilled in the art to which the present inventive concept belongs from this specification and the accompanying drawings.

[0077] Although the embodiments of the inventive concept have been described above, it should be understood that these embodiments are provided to help understand the inventive concept and are not intended to limit the scope of the inventive concept, and various modifications and equivalent forms can be implemented without departing from the spirit and scope of the inventive concept. Therefore, the spirit and scope of the inventive concept should be determined by the technical idea of ​​the claims, and it should be understood that the spirit and scope of the inventive concept are not limited to the literal description of the claims, but actually extend to the equivalent category of technical value.

[0078] Although the present invention has been described with reference to exemplary embodiments, it is apparent to those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the present invention. Therefore, it should be understood that the above embodiments are not restrictive but illustrative.

Claims

1. An apparatus for processing a substrate, the apparatus comprising: a housing having a processing space therein; a plate configured to support the substrate in the housing; a heating unit having a heating wire disposed inside the plate and configured to heat the substrate; a primary temperature sensor configured to directly measure the temperature of the plate; and an auxiliary temperature sensor configured to measure the temperature of the heating wire, The apparatus further includes an abnormality detection unit configured to detect an abnormality in the heating wire based on a temperature measured by the main temperature sensor and a temperature measured by the auxiliary temperature sensor, wherein the abnormality detection unit determines that an abnormality in the heating wire is detected when a temperature variation characteristic of the temperature measured by the auxiliary temperature sensor to the temperature measured by the main temperature sensor exceeds a preset range, The heating unit includes a heating wire and a power source configured to apply a current to the heating wire, wherein the auxiliary temperature sensor measures a temperature of the heating wire by using the current flowing through the heating wire and a voltage of the power source.

2. The device according to claim 1, wherein: The abnormality detecting unit determines that an abnormality in the heating wire is detected when an average value of the temperature measured by the auxiliary temperature sensor exceeds a preset range.

3. The device according to claim 1, wherein: The abnormality detecting unit determines that an abnormality in the heating wire is detected when a standard deviation of the temperature measured by the auxiliary temperature sensor exceeds a preset range.

4. The device according to claim 1, wherein: The abnormality detection unit detects at least one of deformation of the heating wire, insulation difference of the heating wire, and introduction of noise based on temperature change characteristics of a temperature measured by the auxiliary temperature sensor to a temperature measured by the main temperature sensor.

5. The device according to claim 1, wherein: The heating wire comprises a plurality of heating wires respectively located in a plurality of regions of the plate, wherein the main temperature sensor comprises a plurality of temperature sensors respectively located in a plurality of regions of the plate, and Wherein the auxiliary temperature sensor measures the temperature of each of a plurality of heating wires located in a plurality of regions of the plate.

6. The device according to claim 5, wherein: When the difference between an average value of temperatures measured by the auxiliary temperature sensor in a first area among multiple areas of the plate and an average value of temperatures measured by the auxiliary temperature sensor in the remaining areas of the multiple areas except the first area is greater than a preset value, the abnormality detection unit determines that an abnormality in the heating wire is detected in the first area.

7. The device according to claim 5, wherein: When the difference between the standard deviation of the temperature measured by the auxiliary temperature sensor in a first area among multiple areas of the plate and the standard deviation of the temperature measured by the auxiliary temperature sensor in the remaining areas of the multiple areas except the first area is greater than a preset value, the abnormality detection unit determines that an abnormality in the heating wire is detected in the first area.

8. The device according to claim 1, wherein: The abnormality detection unit predicts a failure in the heating wire by collecting temperature change characteristics of a temperature measured by the auxiliary temperature sensor to a temperature measured by the main temperature sensor over a predetermined period of time.

9. A method for processing a substrate, the method comprising: directly measuring a temperature of a plate configured to support the substrate; measuring a temperature of a heating wire disposed inside the plate and configured to heat the substrate; and detecting an abnormality in the heating wire based on the temperature of the plate and the temperature of the heating wire, Wherein detecting the abnormality in the heating wire comprises: when a temperature variation characteristic of the heating wire to the temperature of the plate exceeds a preset range, determining that the abnormality in the heating wire is detected.

10. The method according to claim 9, wherein: Determining that an abnormality in the heating wire is detected includes: When an average value of the temperature of the heating wire exceeds a preset range, it is determined that an abnormality in the heating wire is detected.

11. The method according to claim 9, wherein: Determining that an abnormality in the heating wire is detected includes: When a standard deviation of the temperature of the heating wire exceeds a preset range, it is determined that an abnormality in the heating wire is detected.

12. The method according to claim 9, wherein: Determining that an abnormality in the heating wire is detected includes: At least one of deformation of the heater wire, insulation difference of the heater wire, and introduction of noise is detected based on a temperature change characteristic of the heater wire to the temperature of the plate.

13. The method according to claim 9, wherein: The heating wire comprises a plurality of heating wires respectively located in a plurality of regions of the plate, Wherein, the measurement of the temperature of the heating wire includes: measuring the temperature of each of a plurality of heating wires located in a plurality of regions of the plate, and Wherein, the detection of abnormality in the heating wire comprises: When the difference between an average value of the temperature of the heating wire in a first area among multiple areas of the plate and an average value of the temperature of the heating wire in the remaining areas among the multiple areas except the first area is greater than a preset value, it is determined that an abnormality in the heating wire is detected in the first area.

14. The method according to claim 9, wherein: The heating wire comprises a plurality of heating wires respectively located in a plurality of regions of the plate, Wherein, the measurement of the temperature of the heating wire includes: measuring the temperature of each of a plurality of heating wires located in a plurality of regions of the plate, and Wherein, the detection of abnormality in the heating wire comprises: When the difference between the standard deviation of the temperature of the heating wire in a first area among the multiple areas of the plate and the standard deviation of the temperature of the heating wire in the remaining areas of the multiple areas except the first area is greater than a preset value, it is determined that an abnormality in the heating wire is detected in the first area.

15. The method according to claim 9, further comprising: A failure in the heater wire is predicted by collecting temperature variation characteristics of the heater wire to the temperature of the plate over a predetermined period of time.

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