Alignment device and alignment method

Abstract

The present invention aims to align a protective tape having a protective layer with high precision. The alignment device 5 used when attaching the protective tape PT to the semiconductor wafer W is provided with: a tape holder 30 which holds the protective tape PT in which a protective layer PL having an outer diameter smaller than that of the protective tape PT is laminated; and an image capturing device 50 which captures images of a plurality of places in the peripheral portion of the protective layer PL, wherein position information of the plurality of places in the peripheral portion of the protective layer PL is obtained from image data obtained by capturing images by the image capturing device 50, and a center position of the protective layer PL is obtained from each of the position information.

Description

Technical Field

[0001] The present invention relates to an alignment device and an alignment method for applying a protective tape to a semiconductor wafer with reliable accuracy. Background Art

[0002] The process of manufacturing a semiconductor chip generally includes: forming a circuit having concave and convex portions on the front surface of a semiconductor wafer (hereinafter referred to as a "wafer"); and then, in order to meet the recent demand for reducing the size of semiconductor chips, grinding the rear surface located on the opposite side of the front surface on which the circuit is formed, thereby reducing the thickness of the wafer. When the thickness of the wafer is reduced, the circuit forming portion is protected by applying a protective tape to the front surface of the wafer.

[0003] When the protective tape is applied to the front surface of the wafer, it is necessary to perform alignment of the wafer with the protective tape and perform positioning of the wafer with the protective tape. As an alignment method for the wafer, for example, in Patent Document 1, the following alignment method is disclosed, which includes detecting the peripheral edge portion of the wafer in a non-contact manner by using infrared light that passes through the protective tape but not through the wafer and performing alignment of the wafer, considering the fact that when a notch formed on the wafer for alignment of the wafer is covered with the protective tape, a prior art optical sensor using visible light cannot detect the notch because the light does not pass through the protective tape.

[0004] Prior art literature

[0005] Patent Literature

[0006] [Patent Document 1] JP 2006-73603A Summary of the invention

[0007] Technical issues

[0008] Incidentally, bump wafers having larger concave-convex portions than those in prior art circuits have become frequently used to improve the function of wafers associated with the recent increase in density of semiconductors. Then, a protective tape capable of reliably protecting the concave-convex portions of the bump wafer has appeared. The protective tape has a protective layer on the surface applied to the bump wafer, the protective layer having a diameter smaller than the diameter of the protective tape and the protective layer being configured to cover the concave-convex portions of the bump wafer, and the concave-convex portions of the bump wafer are protected by the protective layer.

[0009] However, in actual situations, a high-precision alignment method for applying a protective tape to a bump wafer has not yet been proposed, and there is a problem that the concavo-convex portion of the bump wafer cannot be sufficiently protected using a protective layer.

[0010] Furthermore, in the prior art alignment method such as in Patent Document 1, infrared light is generally used for alignment of wafers because there is a risk that wafer elements may be damaged by light having high energy such as ultraviolet light or blue light. However, in recent years, wafers having transparency such as glass, sapphire, lithium tantalate (LT), and lithium niobate (LN) have been widely used. When infrared light is used for alignment of those wafers having transparency, the infrared light passes through the wafer, and therefore there is a problem that wafer alignment cannot be performed with high precision.

[0011] The present invention is made to solve the above problems, and the present invention provides an alignment device and an alignment method for aligning a protective tape with a protective layer with high precision. In addition, the present invention provides an alignment device and an alignment method for aligning a protective tape with high precision relative to a transparent wafer.

[0012] Solution

[0013] In order to solve the above-mentioned problem, according to one embodiment of the present invention, there is provided an alignment device for applying a protective tape to a semiconductor wafer, the alignment device comprising: a rotating table configured to support the semiconductor wafer and rotate the semiconductor wafer; an irradiation device configured to irradiate the semiconductor wafer from one surface side of the semiconductor wafer with red light; and an image pickup device configured to image the semiconductor wafer on the other surface side of the semiconductor wafer, wherein the alignment device is configured to determine the center position of the semiconductor wafer by detecting the peripheral edge portion of the semiconductor wafer based on the receiving state of the red light by the image pickup device.

[0014] According to a preferred embodiment of the present invention, in the alignment device, the image pickup device is configured to image the semiconductor wafer through the mediation of an optical filter configured to transmit light in a wavelength range of red light among incident light.

[0015] Furthermore, according to a preferred embodiment of the present invention, in the alignment device, the optical filter is configured to block light having a wavelength of 600 nm or less.

[0016] Furthermore, according to a preferred embodiment of the present invention, the alignment device further comprises a stage moving mechanism, which is configured to horizontally move the rotation stage in an X direction and in a Y direction orthogonal to the X direction, wherein the alignment device is configured to determine a position shift amount by comparing a center position of the semiconductor wafer with a predetermined reference position and to perform position adjustment of the center of the semiconductor wafer by controlling the stage moving mechanism based on the position shift amount.

[0017] In order to solve the above-mentioned problem, according to another embodiment of the present invention, there is provided an alignment device for applying a protective tape to a semiconductor wafer, the alignment device comprising: a tape holder configured to hold a protective tape, the protective tape being laminated with a protective layer, the protective layer having an outer diameter smaller than an outer diameter of the protective tape; and one or more image pickup devices, the one or more image pickup devices being used to image multiple parts of a peripheral edge portion of the protective layer, wherein the alignment device is configured to: determine the position information of each of the multiple parts of the peripheral edge portion of the protective layer based on image data acquired by imaging by the image pickup device, and determine the center position of the protective layer based on the position information of each of the multiple parts.

[0018] According to a preferred embodiment of the present invention, the alignment device includes an image pickup device and further includes an image pickup device moving mechanism configured to horizontally move the image pickup device in an X direction and a Y direction orthogonal to the X direction.

[0019] Furthermore, according to a preferred embodiment of the present invention, the alignment device further comprises an irradiation device for irradiating the plurality of portions of the peripheral edge portion of the protective layer to be imaged by the image pickup device, the irradiation device being arranged on the periphery of the image pickup device.

[0020] In addition, according to a preferred embodiment of the present invention, the alignment device also includes a retaining body moving mechanism, which is configured to move the tape retaining body horizontally in the X direction and in the Y direction orthogonal to the X direction, wherein the alignment device is configured to: determine the position shift amount by comparing the center position of the protective layer with a predetermined reference position and perform position adjustment of the center of the protective tape by controlling the retaining body moving mechanism based on the position shift amount.

[0021] In order to solve the above-mentioned problem, according to one embodiment of the present invention, there is provided an alignment method for applying a protective tape to a semiconductor wafer, the alignment method comprising the following steps: rotating the semiconductor wafer; irradiating the semiconductor wafer from one surface side of the semiconductor wafer with red light; imaging the semiconductor wafer on the other surface side of the semiconductor wafer; and determining the center position of the semiconductor wafer by detecting the peripheral edge portion of the semiconductor wafer based on the receiving state of the red light.

[0022] In order to solve the above-mentioned problem, according to another embodiment of the present invention, there is provided an alignment method for applying a protective tape to a semiconductor wafer, the alignment method comprising the following steps: holding a protective tape laminated with a protective layer having an outer diameter smaller than an outer diameter of the protective tape; imaging a plurality of portions of a peripheral edge portion of the protective layer; and determining a center position of the protective layer based on the position information of each of the plurality of portions of the peripheral edge portion of the protective layer by determining position information of each of the plurality of portions based on image data acquired by the imaging.

[0023] Beneficial effects

[0024] According to the present invention, the shape of the wafer is accurately identified by using red light to detect the center of the wafer, and the center of the wafer is positioned. Therefore, regardless of the presence or absence of transparency of the wafer, the wafer can be aligned with high precision. Therefore, the protective tape can be applied to the wafer with reliable precision. In addition, red light is used for the alignment of the wafer, and the alignment can be performed without using light with high energy such as ultraviolet light or blue light. Therefore, the wafer element will not be damaged.

[0025] In addition, according to the present invention, the plurality of portions of the peripheral edge portion of the protective layer formed on the protective tape are identified to detect the center of the protective layer, and the center of the protective layer is positioned. Therefore, the protective layer can be aligned with high precision. Therefore, the protective tape can be applied to the wafer with reliable precision without the protective layer being displaced relative to the concave-convex portion position of the wafer, and therefore, the concave-convex portion of the wafer (particularly the bump wafer) can be fully protected by the protective layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 is a plan view for illustrating a schematic configuration of an application device.

[0027] Figure 2 yes Figure 1 A cross-sectional view of the tape peeling section taken along line II.

[0028] Figure 3 is a plan view of a substrate having a protective tape temporarily applied thereto.

[0029] Figure 4 yes Figure 3 A cross-sectional view taken along line II-II.

[0030] Figure 5 is an explanatory view for illustrating the step of peeling the protective tape from the substrate.

[0031] Figure 6is an explanatory view for illustrating the step of peeling the protective tape from the substrate.

[0032] Figure 7 is an explanatory view for illustrating the step of peeling the protective tape from the substrate.

[0033] Figure 8 is a front view for showing a schematic configuration of a first alignment device.

[0034] Fig. 9 is an explanatory view for illustrating an image pickup operation by the image pickup device of the first alignment device.

[0035] Fig.10 is a front view for illustrating a schematic configuration of a second alignment device.

[0036] Fig.11 is a side view for illustrating a schematic configuration of a second alignment device.

[0037] Fig.12 is an explanatory view for illustrating a step of applying a protective tape to a wafer.

[0038] Fig.13 is an explanatory view for illustrating a step of applying a protective tape to a wafer.

[0039] Fig.14 is an explanatory view for illustrating a step of applying a protective tape to a wafer.

[0040] Fig.15 is an explanatory view for illustrating a step of applying a protective tape to a wafer.

[0041] Fig.16 is an explanatory view for illustrating a step of applying a protective tape to a wafer.

[0042] Fig.17 is an explanatory view for illustrating a step of applying a protective tape to a wafer.

[0043] Fig.18 It is a bottom view of the pressing member.

[0044] Fig.19 Each is an explanatory view for showing a pressing position of a pressing member when a protective tape is applied to a wafer.

[0045] Fig. 20 It is a front view for showing the schematic configuration of the heating stage and the conveying stage.

[0046] Fig.21 Each is a partially enlarged cross-sectional view of a cutting frame placed on a heating stage with a wafer mounted thereon.

[0047] Fig. 22 is an explanatory view for illustrating a step of heating a dicing frame on which a wafer is mounted.

[0048] Fig.23 is an explanatory view for illustrating a step of heating a dicing frame on which a wafer is mounted.

[0049] Fig.24 is an explanatory view for illustrating a step of housing a heated cutting frame.

[0050] Fig.25 is an explanatory view for illustrating a step of housing a heated cutting frame.

[0051] Fig.26 is an explanatory view for illustrating a step of housing a heated cutting frame.

[0052] Fig. 27 is an explanatory view for illustrating a step of housing a heated cutting frame.

[0053] Fig.28 is an explanatory view for illustrating a step of housing a heated cutting frame.

[0054] Fig.29 is an explanatory view for illustrating a step of cutting a wafer from a heated cutting frame.

[0055] Fig.30 is an explanatory view for illustrating a step of cutting a wafer from a heated cutting frame.

[0056] Fig.31 is an explanatory view for illustrating a step of cutting a wafer from a heated cutting frame.

[0057] Fig.32 is an explanatory view for illustrating a step of housing wafers cut from a cutting frame.

[0058] Fig.33 is an explanatory view for illustrating a step of housing wafers cut from a cutting frame.

[0059] Fig.34 It is an explanatory view for illustrating a step of housing a dicing frame from which a wafer has been diced.

[0060] Fig.35 It is an explanatory view for illustrating a step of housing a dicing frame from which a wafer has been diced. DETAILED DESCRIPTION

[0061] The present invention aims to align a protective tape having a protective layer with high precision, apply the protective tape to a semiconductor wafer (hereinafter referred to as a "wafer") with reliable precision, and sufficiently protect the concavo-convex parts of the wafer (particularly a bump wafer) using the protective tape. In addition, another object of the present invention is to align various wafers with or without transparency with high precision, and apply the protective tape to the wafer with reliable precision.

[0062] In order to achieve the above-mentioned object, an alignment device for a protective tape includes: a tape holder configured to hold a protective tape laminated with a protective layer having an outer diameter smaller than that of the protective tape; one or more image pickup devices for imaging a plurality of portions of a peripheral edge portion of the protective layer; and a control device configured to determine position information of each of the plurality of portions of the peripheral edge portion of the protective layer based on image data acquired by imaging of the image pickup device, and to determine a center position of the protective layer based on the position information of each of the plurality of portions. In the following embodiments of the present invention, the features of the alignment device for a protective tape are described mainly with respect to the tape alignment section B. Furthermore, in order to achieve the above-mentioned object, an alignment device for a wafer includes: a rotating stage configured to support and rotate a wafer; an irradiation device for irradiating the wafer from one surface side of the wafer with red light; an image pickup device for imaging the wafer on the other surface side of the wafer; and a control device configured to determine the center position of the wafer by detecting the peripheral edge portion of the wafer based on the receiving state of the red light by the image pickup device. In the following embodiments of the present invention, the features of the alignment device for a wafer are described mainly with respect to the wafer alignment section D. Hereinafter, embodiments of the present invention are described with reference to the accompanying drawings, but the present invention is not limited to the embodiments described with reference to the accompanying drawings. Note that in each figure, for ease of understanding, the thickness of each of the wafer W, the dicing frame DF, the protective tape PT, the base material BM, the protective layer PL, and the pressure-sensitive adhesive layer AL is drawn in an exaggerated manner.

[0063] Figure 1It is a plan view for schematically showing the overall configuration of an application device 1 according to the present embodiment, which application device 1 includes: an alignment device 5 for the protective tape PT (hereinafter referred to as the "first alignment device 5") and an alignment device 8 for the wafer W (hereinafter referred to as the "second alignment device"). The applying device 1 includes: a tape stripping section A, which is configured to strip the protective tape PT temporarily applied to the substrate BM from the substrate BM; a tape alignment section B, which is configured to position the protective tape PT; a wafer supply section C, which is configured to accommodate a plurality of wafers W; a wafer alignment section D, which is configured to position the wafer W; a frame supply section E, which is configured to accommodate a plurality of cutting frames DF; a tape applying section F, which is configured to apply the protective tape PT to the wafer W and mount the wafer W on the cutting frame DF through the mediation of the protective tape PT; a heating section G, which is configured to heat the wafer W mounted on the cutting frame DF; and a frame accommodating section H, which is configured to accommodate the cutting frame DF after the wafer W is heated.

[0064] The application device 1 also includes: various devices configured to perform various operations in each section and transport the protective tape PT, wafer W, cutting frame DF, etc. between the sections; and a control device (not shown) configured to control the operation of the various devices and process signals and data received from the various devices. The various devices and the control device are arranged on the machine base 100. The control device can be formed by, for example, a computer including a microcomputer, a memory, and an HDD and having a processing capability given by software.

[0065] First, if Figure 1 and Figure 2 As shown in FIG. 1 , in order to peel the protective tape PT temporarily applied to the base material BM from the base material BM, the tape peeling section A includes a tape feeding mechanism 2 , a tape feeding unit 3 , and a peeling mechanism 4 .

[0066] The tape conveying mechanism 2 is configured to convey the protective tape PT temporarily applied to the base material BM to the peeling position. The tape conveying mechanism 2 includes: a supply roller 20 of the base material BM to which the protective tape PT is temporarily applied; a recovery roller 21 of the base material BM from which the protective tape PT is peeled; and a plurality of guide rollers 22 configured to guide the base material BM. The supply roller 20 is configured to support the base material BM wound into a roll shape. The recovery roller 21 is configured to wind up the base material BM. The base material BM is fed from the supply roller 20 to be conveyed by the rotation drive of the recovery roller 21.

[0067] The base material BM is, for example, a PET film or a cardboard subjected to release treatment, and is fed from a supply roller 20 to be conveyed in a belt-like shape. Figure 1 , Figure 3 and Figure 4 As shown in , a plurality of protective tapes PT, each of which is cut into a circular shape in advance, are arranged on the front surface of the base material BM at predetermined intervals along the conveying direction. In the present embodiment, the protective tape PT has an outer diameter set to be larger than the outer diameter of the wafer W. In addition, the protective tape PT has a circular protective layer PL formed on one surface, the protective layer PL having an outer diameter smaller than the outer diameter of the wafer W (for example, a diameter of about 2 mm smaller than the diameter of the wafer W), and the protective tape PT has a pressure-sensitive adhesive layer AL formed on the periphery of the protective layer PL. The protective layer PL is softened by heating to follow the concave and convex portions of the wafer W, thereby coming into close contact with the concave and convex portions of the wafer W. Therefore, when the rear surface of the wafer W is ground in a subsequent step, the wafer W is ground to be flat. In addition, when the protective layer PL is peeled off from the wafer W that has undergone a processing step, such as rear surface grinding, the protective layer PL can be completely peeled off from the wafer W without any residual adhesion. Furthermore, the peripheral portion of the protective tape PT is applied to the peripheral edge portion of the wafer W outside the circuit forming portion through the mediation of the pressure-sensitive adhesive layer AL, and when the circuit forming portion is covered with the protective layer PL, the wafer W is protected.

[0068] like Figure 1 and Figure 2 As shown in FIG. 1 , the tape conveying unit 3 includes a tape holder 30 capable of holding the protective tape PT and a holder moving mechanism 31 configured to move the tape holder 30 onto the protective tape PT conveyed to the peeling position.

[0069] The tape holder 30 is configured to hold the protective tape PT conveyed to the peeling position by the tape conveying mechanism 2 from the front surface side. In the present embodiment, the tape holder 30 holds the protective tape PT by adsorption, and the tape holder 30 is formed by a fixing member 300 having a porous adsorption member 301 fixed to the fixing member 300, for example, Figure 7 and Figure 8 The adsorption member 301 is connected to a decompression pump (not shown), such as a vacuum pump, and the adsorption member 301 can adsorb and hold the protective tape PT on the front surface of the adsorption member 301. In the present embodiment, the adsorption member 301 has an outer diameter substantially equal to (equal to or slightly larger than) the outer diameter of the protective tape PT, and holds the entire surface of the protective tape PT by adsorption.

[0070] like Figure 1 and Figure 2 As shown in the figure, the retaining body moving mechanism 31 includes: a first up-and-down moving mechanism 310, which is configured to cause the tape retaining body 30 to reciprocate in the Z direction (up-and-down direction) along the vertical direction; a reciprocating motion mechanism (hereinafter referred to as the "first reciprocating motion mechanism") 320, which is configured to cause the tape retaining body 30 to reciprocate in the X direction (front-and-back direction) along the horizontal surface; and a reciprocating motion mechanism (hereinafter referred to as the "second reciprocating motion mechanism") 330, which is configured to cause the tape retaining body 30 to reciprocate in the Y direction (left-and-right direction) along the horizontal surface and orthogonal to the X direction.

[0071] The first up-and-down moving mechanism 310 is configured to move the tape holder 30 to a peeling position (see FIG. 1 ) where the tape holder 30 holds the protective tape PT. Figure 6 ) and the separation position above the peeling position (see Figure 5 There is no particular limitation on the first up-and-down moving mechanism 310, as long as the first up-and-down moving mechanism 310 moves the tape retaining body 30 in the up-and-down direction.

[0072] like Figure 1 and Figure 2 As shown in , the first up-and-down moving mechanism 310 of the present embodiment includes: a ball screw configured to drive the tape holder 30 to reciprocate; and a guide mechanism configured to guide the reciprocating motion of the tape holder 30. The ball screw and the guide mechanism are arranged on a support frame 317. The ball screw includes a screw shaft 311, a nut member 312 and a ball (not shown), and the nut member 312 is connected to the tape holder 30 through the mediation of a connecting member 313. The ball screw uses a motor 314 as a driving source, and converts the forward and backward rotation of the motor 314 into a reciprocating linear motion along the screw shaft direction to move the tape holder 30 in the up-and-down direction. The guide mechanism includes a pair of left and right guide rails 315 extending in the up-and-down direction and a pair of left and right slides 316 slidably mounted on the corresponding guide rails 315. The pair of guide rails 315 and the pair of slides 316 are arranged to sandwich the ball screw between them. The pair of slides 316 are arranged in the vertical portion of the connecting member 313, and the pair of guide rails 315 are arranged on the support frame 317. In the guide mechanism, each of the slides 316 slides on the corresponding guide rail 315 to assist the tape holder 30 to move linearly in the Z direction (up and down direction).

[0073] like Figure 1 and Figure 2As shown in , the first reciprocating mechanism 320 is configured to reciprocate the tape holder 30 in the X direction. In the tape peeling section A, the conveying direction of the base material BM is oriented in the X direction, and the first reciprocating mechanism 320 reciprocates the tape holder 30 in the conveying direction of the base material BM, thereby placing the tape holder 30 at the peeling position. There is no particular limitation on the first reciprocating mechanism 320 as long as the first reciprocating mechanism 320 reciprocates the tape holder 30 in the X direction. The first reciprocating mechanism 320 of the present embodiment includes: a guide rail 321 formed in a horizontal portion of the connecting member 313 and extending in the X direction; and a slider 322 connected to the supporting member 32 and slidably mounted on the guide rail 321. The tape holder 30 can reciprocate in the X direction along the guide rail 321 through the mediation of the slider 322 using a driving source (not shown).

[0074] like Figure 1 and Figure 2 As shown in , the second reciprocating mechanism 330 reciprocates the tape holder 30 in the Y direction orthogonal to the X direction. In the tape peeling section A, the Y direction intersects with the conveying direction of the base material BM, and the second reciprocating mechanism 330 reciprocates the tape holder 30 in the Y direction to place the tape holder 30 at the peeling position. In addition, the second reciprocating mechanism 330 reciprocates the tape holder 30 in the Y direction to convey the tape holder 30 from the tape peeling section A to the tape alignment section B and to the tape applying section F in the stated order. There is no particular limitation on the second reciprocating mechanism 330 as long as the second reciprocating mechanism 330 reciprocates the tape holder 30 in the Y direction. The second reciprocating mechanism 330 of the present embodiment includes a pair of upper and lower guide rails 331 extending in the Y direction and a pair of upper and lower slide members 332 slidably mounted on the corresponding guide rails 331. The pair of slides 332 are arranged on a support member 333 fixed to the support frame 317, and the pair of guide rails 331 are arranged on a side plate 101 arranged upright on the machine base 100. The tape holder 30 can reciprocate in the Y direction along the guide rails 331 through the mediation of the slides 332 using a driving source (not shown).

[0075] like Figure 1 and Figure 2As shown in FIG. 1 , the peeling mechanism 4 is configured to peel the base material BM from the protective tape PT held by the tape holding body 30 of the tape feeding unit 3, and the peeling mechanism 4 includes a peeling plate 40 and a peeling plate moving mechanism 41 configured to reciprocate the peeling plate 40 in the feeding direction of the base material BM. The peeling plate 40 has a sharp edge at the distal end, and the base material BM to which the protective tape PT is temporarily applied is quickly folded by the edge at the distal end of the peeling plate 40 after passing through the area on the peeling plate 40. The peeling plate 40 is supported on a pair of left and right support plates 42. A pair of front and rear guide rollers 43 are rotatably arranged between the pair of support plates 42. The base material BM folded by the edge at the distal end of the peeling plate 40 is guided by the pair of guide rollers 43, and is taken up by the recovery roller 21 via a plurality of guide rollers 22.

[0076] like Figure 6 and Figure 7 As shown in FIG, the peeling plate moving mechanism 41 is configured to peel the base material BM from the protective tape PT held by the tape holding body 30 by moving the peeling plate 40 in the direction opposite to the conveying direction of the base material BM at the peeling position. There is no particular limitation on the peeling plate moving mechanism 41 as long as the peeling plate moving mechanism 41 reciprocates the peeling plate 40 in the conveying direction of the base material BM.

[0077] like Figure 1 and Figure 2 As shown in , the stripping plate moving mechanism 41 of the present embodiment includes a ball screw configured to drive the stripping plate 40 to reciprocate and a guide mechanism configured to guide the reciprocating motion of the stripping plate 40. The ball screw includes a screw shaft 410, a nut member 411 and a ball (not shown), and the nut member 411 is connected to a support plate 42, which is configured to support the stripping plate 40 through the mediation of a connecting member 412. The ball screw uses a motor 413 as a driving source and converts the forward and backward rotation of the motor 413 into a reciprocating linear motion in the screw shaft direction so that the stripping plate 40 reciprocates in the X direction. The guide mechanism includes a pair of left and right guide rails 414 extending in the X direction and a pair of left and right slides 415 slidably mounted on the corresponding guide rails 414. The pair of guide rails 414 and the pair of slides 415 are arranged to sandwich the stripping plate 40 therebetween. The pair of slides 415 are arranged on the corresponding support plates 42, and the pair of guide rails 414 are arranged on the pair of side plates 102. The pair of side plates 102 are uprightly arranged on the machine base 100 so as to be opposite to each other at a certain interval. In the guide mechanism, each of the slides 415 slides on the corresponding guide rail 414 to assist the peeling plate 40 to reciprocate linearly in the X direction.

[0078] In the tape peeling section A, the entire surface of the protective tape PT conveyed to the peeling position by the tape conveying mechanism 2 is held by the tape holding body 30, and in a state where the entire surface of the protective tape PT is held by the tape holding body 30, the base material BM is peeled by the peeling mechanism 4. Then, the tape holding body 30 holding the protective tape PT is conveyed to the tape aligning section B and to the tape applying section F by the holding body moving mechanism 31 in the stated order.

[0079] Next, if Figure 1 As shown in FIG. 1 , the tape alignment section B includes a first alignment device 5 to position the protective tape PT fed from the tape peeling section A while being held by the tape holding body 30. The first alignment device 5 is configured to position the protective tape PT by detecting the peripheral edge portion of the protective layer PL of the protective tape PT.

[0080] like Figure 8 As shown in the figure, the first alignment device 5 includes: an image pickup device 50, which is used to image the peripheral edge portion of the protective layer PL; an irradiation device 51, which is used to irradiate the portion of the peripheral edge portion of the protective layer PL to be imaged by the image pickup device 50; and an image pickup device moving mechanism 52, which is configured to cause the image pickup device 50 to reciprocate in the X direction along the horizontal surface and in the Y direction orthogonal to the X direction.

[0081] As the image pickup device 50, for example, a CCD camera or a C-MOS camera is used. In order to image a plurality of portions (preferably four portions) of the peripheral edge portion of the protection layer PL, a plurality of image pickup devices 50 may be arranged at a plurality of portions in a concentric shape corresponding to the peripheral edge portion of the protection layer PL. However, in the present embodiment, as Fig. 9 As shown in FIG. 1 , the plurality of portions ( Fig. 9 The image pickup device 50 (four parts in the figure) is imaged by moving the one image pickup device 50 by using an image pickup device moving mechanism 52. When the image pickup device 50 images a plurality of parts of the outer peripheral edge portion of the protection layer PL, the image pickup device 50 outputs its image data to a control device (not shown).

[0082] In addition, if Figure 8 As shown in FIG. 5 , the image pickup device 50 is supported by a vertical guide rail 54 which is uprightly arranged on a support plate 53 through the intermediary of a raising and lowering member 55. The image pickup device 50 can be raised and lowered in a manner that the raising and lowering member 55 is moved in the up-down direction (Z direction) by using a cylinder or the like.

[0083] like Figure 8 As shown in FIG. 5 , the irradiation device 51 is supported by a guide member 56 arranged upright on a support plate 53 to move upward and downward by using an appropriate driving device (not shown). The irradiation device 51 includes a light emitting portion 510, such as a light emitting diode, as a light source, and the irradiation device 51 has the light emitting portion 510 fixed in a light guide member 511. The irradiation device 51 performs annular irradiation for emitting light in an annular shape, and the irradiation device 51 has a plurality of light emitting portions 510 arranged in a circumferential shape, for example.

[0084] like Figure 8 As shown in the figure, the image pickup device moving mechanism 52 includes: a reciprocating motion mechanism (hereinafter referred to as the "third reciprocating motion mechanism") 520, which is configured to cause the image pickup device 50 to reciprocate in the X direction along the horizontal surface; and a reciprocating motion mechanism (hereinafter referred to as the "fourth reciprocating motion mechanism") 530, which is configured to cause the image pickup device 50 to reciprocate in the Y direction along the horizontal surface and orthogonal to the X direction.

[0085] There is no particular limitation on the third reciprocating mechanism 520, as long as the third reciprocating mechanism 520 reciprocates the image pickup device 50 in the X direction. The third reciprocating mechanism 520 of the present embodiment includes a ball screw configured to drive the image pickup device 50 to reciprocate in the X direction and a guide mechanism configured to guide the reciprocating motion of the image pickup device 50 in the X direction. The ball screw includes a screw shaft 521, a nut member 522 and a ball (not shown), and the nut member 522 is connected to a support plate 53, which is configured to support the image pickup device 50 through the intermediary of the connecting member 523. The ball screw uses a motor (not shown) as a driving source, and converts the forward and backward rotation of the motor into a reciprocating linear motion in the direction of the screw shaft to reciprocate the image pickup device 50 in the X direction. The guide mechanism includes a pair of left and right guide rails 524 extending in the X direction and a pair of left and right slides 525 slidably mounted on the corresponding guide rails 524. The pair of guide rails 524 and the pair of slides 525 are arranged to sandwich the ball screw therebetween. Each of the slides 525 is arranged on the connecting member 523, and each of the guide rails 524 is arranged on a support plate 526 extending in the Y direction. In the guide mechanism, each of the slides 525 slides on the corresponding guide rail 524 to assist the image pickup device 50 to reciprocate linearly in the X direction.

[0086] There is no particular limitation on the fourth reciprocating mechanism 530, as long as the fourth reciprocating mechanism 530 causes the image pickup device 50 to reciprocate in the Y direction. The fourth reciprocating mechanism 530 of the present embodiment includes a ball screw configured to drive the image pickup device 50 to reciprocate in the Y direction and a guide mechanism configured to guide the reciprocating motion of the image pickup device 50 in the Y direction. The ball screw includes a screw shaft 531, a nut member 532 and a ball (not shown), and the nut member 532 is connected to a support plate 53, which is configured to support the image pickup device 50 through the mediation of a support plate 526 and a connecting member 523. The ball screw uses a motor 533 as a driving source, and converts the forward and backward rotation of the motor 533 into a reciprocating linear motion in the direction of the screw shaft to cause the image pickup device 50 to reciprocate in the Y direction. The guide mechanism includes a pair of left and right guide rails 534 extending in the Y direction and a plurality of pairs of left and right slides 535 slidably mounted on the corresponding guide rails 534. The pair of guide rails 534 and the pair of slides 535 are arranged to sandwich the ball screw therebetween. Each of the slides 535 is arranged on a support plate 526, and each of the guide rails 534 is arranged on a support frame 536 extending in the Y direction. In the guide mechanism, each of the slides 535 slides on the corresponding guide rail 534 to assist the image pickup device 50 to reciprocate linearly in the Y direction.

[0087] In the tape alignment section B, the image pickup device 50 images a plurality of portions of the peripheral edge portion of the protective layer PL. The control device (not shown) processes the image data acquired from the image pickup device 50 to obtain position information on the plurality of portions of the peripheral edge portion of the protective layer PL, thereby calculating the center position of the protective layer PL. Then, the control device (not shown) compares the center position of the protective layer PL with a predetermined reference position of the center of the protective layer PL, and controls the retaining body moving mechanism 31 based on the position shift amount between the center position and the reference position, thereby correcting the position of the tape retaining body 30 in the X direction and the Y direction and aligning the center of the protective layer PL with the reference position. The positioned protective tape PT is conveyed to the tape application section F by the retaining body moving mechanism 31 while being retained by the tape retaining body 30.

[0088] Next, if Figure 1 As shown in FIG. 1 , the wafer supply section C includes a housing box 10 capable of housing a plurality of wafers W in a stacked state. The housing box 10 can be raised and lowered by using a raising and lowering mechanism (not shown), such as an elevator mechanism. In the wafer supply section C, the housing box 10 is raised and lowered each time a wafer W is taken out by the first wafer conveying mechanism 7, and a plurality of wafers W are continuously supplied to the first wafer conveying mechanism 7.

[0089] like Figure 1 As shown in , in the present embodiment, the first wafer conveying mechanism 7 is a robot arm, and includes a joint arm 70 and a hand 71 formed at the distal end of the arm 70. The arm 70 includes a plurality of links 72 pivotably coupled to each other, and the link 72 located at the proximal end is pivotably coupled to a shaft 73. In the present embodiment, the hand 71 is an adsorption type hand capable of holding the wafer W by adsorption. The hand 71 holds the wafer W by adsorbing the front surface of the wafer W, and the hand 71 is configured to adsorb the peripheral portion of the front surface of the wafer W in which no pattern is formed. In the first wafer conveying mechanism 7, the wafers W are continuously taken out from the wafer supply section C one by one by the hand 71, and then, the wafers W held by the hand 71 are conveyed and supplied to the wafer alignment section D and the tape application section F in the stated order by the extension and contraction and pivoting of the arm 70. As the hand 71, a non-contact hand capable of holding the wafer W in a non-contact manner can be used.

[0090] Next, if Figure 1 As shown in FIG. 1 , the wafer alignment section D includes a second alignment device 8 to position the wafer W conveyed by the first wafer conveying mechanism 7. The second alignment device 8 is configured to position the wafer W by detecting the outer peripheral edge portion of the wafer W.

[0091] like Fig.10 and Fig.11 As shown in , the second alignment device 8 includes: a rotating table 80 having a diameter smaller than that of the wafer W; a rotation drive mechanism 81, the rotation drive mechanism 81 being configured to rotate the rotating table 80; a table moving mechanism 82, the table moving mechanism 82 being configured to reciprocate the rotating table 80 in an X direction along a horizontal surface and in a Y direction orthogonal to the X direction; an irradiation device 83, the irradiation device 83 being used to irradiate the wafer W from one surface side of the wafer W (the lower side in the example shown) with red light; and an image pickup device 84, the image pickup device 84 being used to image the wafer W on the other surface side of the wafer W (the upper side in the example shown).

[0092] The rotating table 80 is configured to place and hold the wafer W on the upper surface of the rotating table 80 . In the present embodiment, the rotating table 80 is configured to hold the wafer W by adsorption. The rotating table 80 is rotatably supported by a support frame 801 through the intermediary of a rotating shaft 800 .

[0093] There is no particular limitation on the rotation drive mechanism 81 as long as the rotation drive mechanism 81 rotates the rotating table 80. The rotation drive mechanism 81 of the present embodiment includes a motor 810 serving as a drive source, a driving pulley 811 connected to the motor 810, a driven pulley 812 mounted on the rotating shaft 800, and a belt 813 stretched between the driving pulley 811 and the driven pulley 812. These components are arranged on the support frame 801.

[0094] The stage moving mechanism 82 includes a reciprocating mechanism (hereinafter referred to as the "fifth reciprocating mechanism") 820 configured to cause the rotating stage 80 to reciprocate in the X direction along the horizontal surface and a reciprocating mechanism (hereinafter referred to as the "sixth reciprocating mechanism") 830 configured to cause the rotating stage 80 to reciprocate in the Y direction along the horizontal surface and orthogonal to the X direction.

[0095] There is no particular limitation on the fifth reciprocating mechanism 820, as long as the fifth reciprocating mechanism 820 reciprocates the rotating table 80 in the X direction. The fifth reciprocating mechanism 820 of the present embodiment includes a ball screw configured to drive the rotating table 80 to reciprocate in the X direction and a guide mechanism configured to guide the reciprocating motion of the rotating table 80 in the X direction. The ball screw includes a screw shaft 821, a nut member 822 and a ball (not shown), and the nut member 822 is connected to a support frame 801 configured to support the rotating table 80. The ball screw uses a motor 823 as a drive source, and converts the forward and backward rotation of the motor 823 into a reciprocating linear motion in the direction of the screw shaft to reciprocate the rotating table 80 in the X direction. The guide mechanism includes a guide rail 824 extending in the X direction and a pair of slides 825 slidably mounted on the guide rail 824. Each of the sliders 825 is arranged on the support frame 801, and the guide rails 824 are arranged on the support base 802. In the guide mechanism, each of the sliders 825 slides on the corresponding guide rails 824 to assist the rotary table 80 to linearly reciprocate in the X direction.

[0096] There is no particular limitation on the sixth reciprocating mechanism 830, as long as the sixth reciprocating mechanism 830 reciprocates the rotating table 80 in the Y direction. The sixth reciprocating mechanism 830 of the present embodiment includes a ball screw configured to drive the rotating table 80 to reciprocate in the Y direction and a guide mechanism configured to guide the reciprocating motion of the rotating table 80 in the Y direction. The ball screw includes a screw shaft 831, a nut member 832 and a ball (not shown), and the nut member 832 is connected to a support frame 801, which is configured to support the rotating table 80 through the intermediary of a support base 802. The ball screw uses a motor 833 as a driving source, and converts the forward and backward rotation of the motor 833 into a reciprocating linear motion in the direction of the screw shaft to reciprocate the rotating table 80 in the Y direction. The guide mechanism includes a guide rail 834 extending in the Y direction and a pair of slides 835 slidably mounted on the guide rail 834. Each of the sliders 835 is arranged on the support base 802, and the guide rail 834 is arranged on the support base 803. In the guide mechanism, each of the sliders 835 slides on the corresponding guide rail 834 to assist the rotary table 80 to linearly reciprocate in the Y direction.

[0097] The irradiation device 83 is supported by the support plate 804 at a lower position of the rotating table 80. The irradiation device 83 has an outer shape formed to be larger than the outer shape of the wafer W, and the irradiation device 83 is configured to emit red light in a ring shape. Preferably, the red light to be emitted has a wavelength region of about 580nm to about 680nm, and red light with a peak wavelength of 630nm is used. By using red light with a wavelength region of about 580nm to about 680nm, the red light is blocked by the wafer W regardless of the material of the wafer W. Therefore, the peripheral edge portion of the wafer W can be accurately detected by confirming the receiving state of the red light by the image pickup device 84. The irradiation device 83 includes a light emitting portion (not shown), such as a red light emitting diode as a light source, and the irradiation device 83 has, for example, a plurality of light emitting portions arranged in a circular shape.

[0098] As the image pickup device 84, for example, a CCD camera or a C-MOS camera is used. The image pickup device 84 is arranged on the rotation axis 800 of the rotating table 80 to image the peripheral edge portion of the wafer W as a whole. The image pickup device 84 includes an optical filter 840. The optical filter 840 has a feature of transmitting only red light and not transmitting light other than light having a wavelength region of red light, and the irradiation device 83 irradiates the wafer W with red light in the visible light entering the image pickup device 84. As the optical filter 840, a filter that blocks light having a wavelength of 600nm or less can be preferably used. The image pickup device 84 is configured to image the peripheral edge portion of the wafer W and output an image signal of the peripheral edge portion of the wafer W to a control device (not shown).

[0099] In the wafer alignment section D, while the rotating stage 80 rotates the wafer W and the irradiation device 83 irradiates the wafer W with red light, the image pickup device 84 images the outer peripheral edge portion of the wafer W, and the control device (not shown) processes the image data acquired from the image pickup device 84 to detect the outer peripheral edge portion of the wafer W, thereby calculating the center position of the wafer W. Then, the control device (not shown) compares the center position of the wafer W with a predetermined reference position of the center of the wafer W, and controls the stage moving mechanism 82 based on the position shift amount relative to the reference position, thereby correcting the position of the rotating stage 80 in the X direction and the Y direction and aligning the center of the wafer W with the reference position. The positioned wafer W is conveyed to the tape application section F by the first wafer conveying mechanism 7.

[0100] Next, if Figure 1 and Figure 2 As shown in , the frame supply section E includes a housing box 11 capable of housing a plurality of cutting frames DF in a stacked state. The housing box 11 can raise and lower each of the cutting frames DF by using a raising and lowering mechanism (not shown), such as a lift mechanism. In the frame supply section E, the cutting frame DF is raised and lowered each time the cutting frame DF is taken out to the first conveying arm 9A, so that the plurality of cutting frames DF are continuously supplied to the first conveying arm 9A. Preferably, the cutting frame DF is positioned in advance by an appropriate positioning device.

[0101] like Figure 1 As shown in the figure, the first conveying arm 9A can reciprocate between the frame supply section E and the tape application section F along the guide rail 103 extending in the Y direction using a driving source (not shown). The guide rail 103 is placed on the machine base 100. The first conveying arm 9A can hold the cutting frame DF by adsorption, and the first conveying arm 9A includes a plurality of adsorption parts 90, such as adsorption pads. The first conveying arm 9A continuously takes out the cutting frames DF from the frame supply section E one by one using the adsorption parts 90, and then conveys and supplies the cutting frames DF to the tape application section F.

[0102] Next, if Figure 1 As shown in FIG. 1 , the tape applying section F includes a vacuum chamber 6 to apply the protective tape PT to the wafer W under reduced pressure and to mount the wafer W on the dicing frame DF through the intermediary of the protective tape PT. Figures 12 to 17As shown in the figure, in the vacuum chamber 6, there are arranged: an application table 60, which is configured to support the wafer W; a frame base 61, which is configured to support the cutting frame DF on which the wafer W is mounted; and a pressing member 62, which is configured to press the protective tape PT supplied from above to the wafer W by the tape holder 30.

[0103] The vacuum chamber 6 includes a lower chamber 6B fixed to the machine base 100 and an upper chamber 6A arranged to move upward and downward on the lower chamber 6B, and the upper chamber 6A and the lower chamber 6B are combined to form the vacuum chamber 6. An application stage 60 and a frame base 61 are arranged in the lower chamber 6B, and a pressing member 62 is arranged in the upper chamber 6A.

[0104] like Fig.17 As shown in FIG. 6 , the upper chamber 6A is supported by the support plate 63 to move upward and downward through the mediation of a plurality of guide members 64. In addition, the upper chamber 6A is connected to a cylinder shaft 650 of a raising and lowering cylinder 65 arranged on the support plate 63, and by the driving of the raising and lowering cylinder 65, the upper chamber 6A moves in the up-down direction between a connection position at which the upper chamber 6A is combined with the lower chamber 6B and a separation position located above the lower chamber 6B.

[0105] In addition, the upper chamber 6A is connected with a vacuum adapter 66, and the vacuum adapter 66 is connected to a decompression pump (not shown), such as a vacuum pump. When the upper chamber 6A is combined with the lower chamber 6B to form the vacuum chamber 6, the vacuum chamber 6 can enter a decompression state by exhausting air from the vacuum adapter 66. In addition, the decompression state in the vacuum chamber 6 can be canceled in a manner of introducing air through the vacuum adapter 66. The vacuum chamber 6 can also enter an inert gas atmosphere by decompressing the vacuum chamber 6 and then introducing an inert gas such as argon or nitrogen into the vacuum chamber 6.

[0106] like Figures 12 to 17 As shown in FIG. 1 , the application stage 60 has a porous adsorption member 600 formed on the upper surface of the application stage 60. The adsorption member 600 makes it connected to a decompression pump such as a vacuum pump, and thus the adsorption member 600 can adsorb and hold the wafer W on the upper surface of the adsorption member 600. The wafer W is placed on the application stage 60 by the first wafer conveying mechanism 7.

[0107] The application stage 60 can be raised and lowered in the lower chamber 6B by the raising and lowering mechanism 67 while supporting the wafer W. There is no particular limitation on the raising and lowering mechanism 67 as long as the raising and lowering mechanism 67 raises and lowers the application stage 60. Figures 12 to 17As shown in , the raising and lowering mechanism 67 of the present embodiment includes: a guide member 670, which is configured to support the application table 60 so that the application table 60 can be raised and lowered relative to the lower chamber 6B; a support plate 671, to which the guide member 670 is fixed; a ball screw, which includes a screw shaft 672, a nut member 673 and balls (not shown); a motor 674, which is configured to drive the ball screw; a driving pulley 675, which is connected to the motor 674; a driven pulley 676, which is mounted on the screw shaft 672; and a belt 677, which is stretched between the driving pulley 675 and the driven pulley 676. The support plate 671 is connected to the nut member 673, and the raising and lowering mechanism 67 converts the forward and backward rotation of the motor 674 into reciprocating linear motion in the screw shaft direction using a ball screw to raise and lower the application table 60. The application table 60 is usually positioned below the frame base 61 at a predetermined interval.

[0108] like Figures 12 to 17 As shown in FIG. 1 , the frame base 61 is positioned to surround the application stage 60 on the outside of the application stage 60. The frame base 61 has an annular shape, and the application stage 60 can pass through the opening of the frame base 61 when being raised and lowered. The cutting frame DF is placed on the frame base 61 by the first conveying arm 9A and fixed to the frame base 61 by an appropriate fixing device (not shown). In addition, the protective tape PT is placed on the cutting frame DF through the tape holder 30 to be supplied to the wafer W.

[0109] like Figures 12 to 19 As shown in the figure, in order to apply the protective tape PT to the chip W and mount the chip W on the cutting frame DF through the mediation of the protective tape PT, the pressing member 62 includes: a protective layer peripheral retainer 620, which is configured to press the peripheral portion of the protective layer PL of the protective tape PT to apply the protective tape PT to the chip W; a tape peripheral retainer 621, which is configured to press the peripheral edge portion of the protective tape PT to apply the protective tape PT to the cutting frame DF; and an elastic member 622, which is configured to support the tape peripheral retainer 621 so that the tape peripheral retainer 621 can be shifted in the up and down directions.

[0110] The protective layer peripheral retainer 620 has an annular shape, and the protective layer peripheral retainer 620 has an outer diameter set larger than the outer diameter of the protective layer PL of the protective tape PT. As the protective layer peripheral retainer 620, for example, fluororubber or a rubber material with a fluorine treatment on the surface can be used. The protective layer peripheral retainer 620 is held by a first retainer 624. The first retainer 624 is fixed to the support disc 623, and the protective layer peripheral retainer 620 is fitted in an annular concave portion formed in an annular convex portion 625 formed on the peripheral edge portion.

[0111] The tape peripheral retainer 621 has an annular shape and has an outer diameter set to be substantially equal to the outer diameter of the protective tape PT. The tape peripheral retainer 621 can be made of, for example, silicone resin. The tape peripheral retainer 621 is retained by the second retainer 626. The second retainer 626 is formed of an annular plate material, and the tape peripheral retainer 621 is fixed to an annular groove formed in the outer peripheral edge portion of the second retainer 626.

[0112] In addition, the second retainer 626 is supported by a plurality of mounting members 627 fixed to the support plate 623 by using elastic members 622, such as springs. In this way, when the tape peripheral retainer 621 presses the peripheral edge portion of the protective tape PT to apply the protective tape PT to the cutting frame DF, the pressing force of the tape peripheral retainer 621 can be formed to be constant.

[0113] The pressing member 62 can be moved upward and downward in the upper chamber 6A by the second up-and-down moving mechanism 68. There is no particular limitation on the second up-and-down moving mechanism 68, as long as the second up-and-down moving mechanism 68 moves the pressing member 62 in the up-and-down direction. The second up-and-down moving mechanism 68 of the present embodiment includes: a guide member 680, which is configured to support the pressing member 62 so that the pressing member 62 can move upward and downward relative to the upper chamber 6A; a raising and lowering plate 681, to which the guide member 680 is fixed; a raising and lowering cylinder member 682, which is arranged on the upper chamber 6A, and each of the raising and lowering cylinder members 682 has a cylinder member shaft 683 connected to the raising and lowering plate 681; and a guide mechanism, which is configured to guide the up-and-down movement of the pressing member 62, and the guide mechanism includes a plurality of guide rails 684 and a plurality of slide members 685. The guide rails 684 are arranged on the upper chamber 6A to extend in the up-down direction, and the slide members 685 are arranged on the raising and lowering plate 681 and are slidably mounted on the corresponding guide rails 684. The second up-down moving mechanism 68 is configured to drive the up-down movement of the pressing member 62 using the raising and lowering cylinder member 682 and guide the up-down movement of the pressing member 62 using the guide mechanism.

[0114] In the tape applying section F, under the reduced pressure state in the vacuum chamber 6, the concavo-convex portion in the circuit forming portion of the wafer W is covered with the protection layer PL in the following manner: the peripheral edge portion of the protection layer PL of the protection tape PT is applied to the peripheral edge portion of the wafer W through the intermediary of the pressure-sensitive adhesive layer AL by using the protection layer peripheral retainer 620 of the pressing member 62. In addition, the wafer W is mounted on the dicing frame DF through the intermediary of the protection tape PT in the following manner: the peripheral edge portion of the protection tape PT is applied to the dicing frame DF through the intermediary of the pressure-sensitive adhesive layer AL by using the tape peripheral retainer 621 of the pressing member 62 (see FIG. Fig.21 (a) The dicing frame DF on which the wafer W is mounted is transported to the heating section G by the second transport arm 9B.

[0115] like Figure 1 As shown in the figure, the second conveying arm 9B can reciprocate between the tape applying section F and the heating section G along the guide rail 103 extending in the Y direction using a driving source (not shown). The second conveying arm 9B can hold the cutting frame DF by adsorption, and the second conveying arm 9B includes a plurality of adsorption parts 90, such as adsorption pads, in the same manner as in the first conveying arm 9A. The second conveying arm 9B takes out the cutting frame DF on which the wafer W is mounted from the tape applying section F using the adsorption parts 90, and then conveys and supplies the cutting frame DF to the heating section G.

[0116] like Figure 1 As shown in the figure, the heating section G includes: a heating table 12, which is configured to heat the cutting frame DF; a reversing arm 13, which is configured to hold the cutting frame DF and vertically reverse the held cutting frame DF; and a conveying table 14, which is configured to convey the cutting frame DF to the frame accommodating section H after being heated.

[0117] like Fig. 20 As shown in FIG. 1 , the heating stage 12 enables the cutting frame DF to be placed on the upper surface of the heating stage 12 and fixed to the heating stage 12 using an appropriate fixing device (not shown). A circular convex portion 121 is formed on the central area of ​​the upper surface of the heating stage 12, and the cutting frame DF is placed on the heating stage 12 and fixed to the heating stage 12 so that the wafer W is positioned on the convex portion 121, as shown in FIG. Fig.21 The heating stage 12 includes a heater 120 , and the protective tape PT is heated by the heater 120 .

[0118] The heating table 12 is supported by a table base 122 having a space therein. The table base 122 can travel on a pair of guide rails 104, which are placed on the machine base 100 and extend in the X direction, through the intermediary of a pair of slide members 123. The heating table 12 can reciprocate in the X direction along the guide rails 104 by using, for example, a motor 124 and a ball screw 125 as a driving source.

[0119] like Figure 1 As shown in , the reversing arm 13 can hold the cutting frame DF by adsorption, and the reversing arm 13 includes a plurality of adsorption portions 130, such as adsorption pads. The reversing arm 13 is supported by a support frame 131 so as to move in the up and down directions by using a driving source (not shown). The supporting frame 131 can travel on a guide rail 105 through the mediation of a slide (not shown), which is placed on the machine base 100 and extends in the X direction, and the reversing arm 13 can reciprocate in the X direction along the guide rail 105 using a driving source (e.g., a motor and a ball screw) (not shown).

[0120] In addition, the reversing arm 13 is connected to the motor 132, and the reversing arm 13 is rotated by the driving of the motor 132. When the reversing arm 13 is inverted so that the adsorption portion 130 faces upward, the reversing arm 13 can receive the cutting frame DF conveyed by the second conveying arm 9B from the second conveying arm 9B (see Fig. 22 ). After receiving the cutting frame DF from the second conveying arm 9B, the reversing arm 13 rotates in the normal direction so that the adsorption portion 130 faces downward. In this way, the reversing arm 13 can place the cutting frame DF on the heating table 12 in a state where the protective tape PT is used as the lower surface (see Fig.23 ).

[0121] like Figure 1 and Fig. 20 As shown in , the conveying table 14 enables the cutting frame DF to be placed on the upper surface of the conveying table 14, and the conveying table 14 is configured to convey the cutting frame DF heated in the heating section G to the frame accommodating section H. The conveying table 14 is supported by a plurality of support columns 141 arranged upright on a support base 140. The conveying table 14 can travel on a pair of guide rails 106, which are placed on the machine base 100 and extend in the X direction, through the intermediary of a pair of slides 142 arranged on the support base 140, and the conveying table 14 can reciprocate in the X direction along the guide rails 106 by using, for example, a motor 143 and a ball screw 144 as a driving source. In addition, the conveying table 14 can pass through the internal space of the table base 122.

[0122] In the heating section G, the protective tape PT is heated by the heating stage 12 to, for example, 100° C. for about 1 minute to soften the protective layer PL. Fig.21 As shown in (b), the protection layer PL is embedded in the concavo-convex portion in the circuit forming portion of the wafer W to be in close contact with the concavo-convex portion. Then, the dicing frame DF is transported to the frame accommodating section H by the transport stage 14.

[0123] Next, if Figure 1 As shown in , the frame accommodating section H includes an accommodating box 15 capable of accommodating a plurality of cutting frames DF in a stacked state. The accommodating box 15 can be raised and lowered by using a raising and lowering mechanism (not shown), such as a lift mechanism. In the frame accommodating section H, the accommodating box 15 is raised and lowered each time a cutting frame DF is accommodated, so that a plurality of cutting frames DF are continuously accommodated.

[0124] In addition, if Figure 1 As shown in FIG. 1 , the frame receiving section H includes a pair of conveying rails 16 connected to the receiving box 15 and a frame pusher 17 that reciprocates along a rail 107 parallel to the conveying rails 16 .

[0125] The frame pusher 17 can travel on the guide rail 107, which is placed on the machine base 100 and extends in the X direction, through the mediation of the slide 170, and the frame pusher 17 can reciprocate in the X direction along the guide rail 107 using a drive source (e.g., a motor and a ball screw) (not shown). In addition, the frame pusher 17 is supported to move in the up and down directions by using a drive source (not shown). When the frame pusher 17 pushes the cutting frame DF on the conveying table 14 moved to the vicinity of the conveying rail 16 toward the accommodating box 15, the cutting frame DF is conveyed from the conveying rail 16 to the accommodating box 15 and is accommodated in the accommodating box 15.

[0126] Next, a method of applying the protective tape PT to the wafer W will be described.

[0127] First, before the application operation, the first wafer conveying mechanism 7 is used to transfer the wafer from the Figure 1 The wafer supply section C shown in FIG. 8 takes out the wafer W, and then transfers the wafer W to the wafer alignment section D to be placed on the rotation stage 80 .

[0128] In the wafer alignment section D, the wafer W is aligned. First, the wafer W is rotated while being supported on the rotating table 80, and in a state where the wafer W is irradiated with red light from one surface side of the wafer W by the irradiation device 83, the wafer W is imaged from the other surface side of the wafer W by the image pickup device 84. The outer peripheral edge portion of the wafer W is detected based on the receiving state of the red light by the image pickup device 84, and the center position of the wafer W is calculated. The wafer W is subjected to position adjustment to position the center of the wafer W at a predetermined reference position. Then, the positioned wafer W is conveyed from the rotating table 80 to the tape applying section F by the first wafer conveying mechanism 7, and the wafer W is placed as shown in FIG. Fig.13 6B is placed on the application table 60 and fixed to the application table 60. In this case, the center position of the wafer W placed on the application table 60 is matched with the center position of the cutting frame DF to be placed on the frame base 61 described later.

[0129] In addition, the first transport arm 9A is used to Figure 1 The frame supply section E shown in FIG. 1 takes out the cutting frame DF, and then conveys the cutting frame DF to the tape applying section F to be placed on and fixed to the frame base 61 in the lower chamber 6B, as shown in FIG. Fig.13 as shown in .

[0130] In addition, Figure 1 In the tape peeling section A shown in FIG. 1 , the protective tape PT temporarily applied to the base material BM is conveyed to the peeling position by the tape conveying mechanism 2, and the tape holding body 30 is made as shown in FIG. Figure 5 As shown in FIG. , the protective tape PT is moved to the protective tape PT conveyed to the peeling position so that the tape holding body 30 holds the protective tape PT. Then, as shown in FIG. Figure 6 and Figure 7 As shown in FIG. 1 , the peeling plate 40 is moved to peel the base material BM from the protective tape PT held by the tape holding body 30 . Thereafter, the protective tape PT peeled from the base material BM is conveyed to the tape alignment section B while being held by the tape holding body 30 .

[0131] In the tape alignment section B, the protective tape PT is aligned. First, in a state where the protective tape PT is held by the tape holder 30, multiple parts (preferably four parts) of the peripheral edge part of the protective layer PL of the protective tape PT are imaged by the image pickup device 50. The position information of the multiple parts of the peripheral edge part of the protective layer PL is calculated based on the image data obtained by the image pickup device 50, and the center position of the protective layer PL is calculated. The protective tape PT is positionally adjusted to position the center of the protective layer PL at a predetermined reference position. Then, the positioned protective tape PT is conveyed to the tape application section F while being held by the tape holder 30, as shown in FIG. Fig.12 As shown in FIG. 1 , and the protective tape PT is placed on the cutting frame DF in the lower chamber 6B, as shown in FIG. Fig.13 In this case, the center position of the cutting frame DF placed on the frame base 61 is matched with the center position of the protective layer PL of the protective tape PT placed on the cutting frame DF.

[0132] Next, in the tape applying section F, the protective tape PT is applied to the wafer W. First, when the protective tape PT is supplied above the wafer W as shown in FIG. Fig.13 As shown in FIG. 1 , the upper chamber 6A is moved downward to be combined with the lower chamber 6B to form a vacuum chamber 6, as shown in FIG. Fig.14 Then, the vacuum chamber 6 is depressurized by the vacuum adapter 66 to bring the vacuum chamber 6 into a predetermined depressurized state. At this time, the application stage 60 is raised to bring the wafer W into contact with the protective tape PT, and the pressing member 62 is moved downward to press the protective tape PT from above, as shown in FIG. Fig.15 As shown in . In this case, when the peripheral portion of the protective layer PL of the protective tape PT is pressed by the protective layer peripheral retainer 620 of the pressing member 62, the pressure-sensitive adhesive layer AL is applied to the peripheral edge portion of the wafer W. When the peripheral edge portion of the protective tape PT is pressed by the tape peripheral retainer 621 of the pressing member 62, the protective tape PT is applied to the cutting frame DF through the mediation of the pressure-sensitive adhesive layer AL. In this way, the circuit (concave and convex parts) on the front surface of the wafer W is covered with the protective layer PL, and the wafer W is mounted on the cutting frame DF through the mediation of the protective tape PT. After the vacuum chamber 6 is brought into the atmospheric pressure state, the upper chamber 6A is moved upward to release the lower chamber 6B, as shown Fig.16 As shown in FIG. 1 , the cutting frame DF on which the wafer W is mounted is transported to the heating section G by the second transport arm 9B, as shown in FIG. Fig.17 as shown in .

[0133] Next, in the heating section G, the dicing frame DF on which the wafer W is mounted is heated. Fig. 22As shown in FIG, the inverted reversing arm 13 receives the cutting frame DF from the second conveying arm 9B. Fig.23 As shown in , the cutting frame DF is vertically reversed by rotating the reversing arm 13, and the cutting frame DF is placed on the heating table 12 in a state where the protective tape PT is used as the lower surface. Then, the protective tape PT is heated by the heater 120 accommodated in the heating table 12 to soften the protective layer PL, and the protective layer PL is brought into close contact with the concavo-convex portion in the circuit forming portion of the wafer W. In this way, the application of the protective tape PT to the wafer W is completed, and the mounting of the wafer W on the cutting frame DF is also completed. Then, as Figure 24 to Figure 26 As shown in , the second conveying arm 9B is moved above the cutting frame DF, and the cutting frame DF is held by the second conveying arm 9B. Thereafter, the cutting frame DF is lifted from the heating table 12, and the conveying table 14 is moved below the second conveying arm 9B to replace the heating table 12. Then, the cutting frame DF is placed on the conveying table 14. Fig. 27 As shown in FIG. 1 , the cutting frame DF is transported to the frame receiving section H by the transport table 14 .

[0134] Finally, in the frame receiving section H, as shown in FIG. Fig.28 As shown in FIG. 1 , the dicing frame DF on which the wafer W is mounted is accommodated in the accommodation box 15 from the conveying stage 14 via the conveying rail 16 by the frame pusher 17 .

[0135] As described above, in the case of the first alignment device 5 and the alignment method for the protective tape PT having the above-described configuration, the plurality of portions of the peripheral edge portion of the protective layer PL formed on the protective tape PT are identified to detect the center of the protective layer PL, and the center of the protective layer PL is positioned. Therefore, the protective layer PL can be aligned with high precision, and the protective layer PL can be applied to the concave and convex portions of the wafer W with reliable precision without positional displacement. Therefore, the concave and convex portions of the wafer W (particularly the bump wafer) can be fully protected by the protective layer PL.

[0136] Furthermore, in the case of the second alignment device 8 and the alignment method for wafer W having the above-described configuration, the outer shape of wafer W is accurately recognized by using red light to detect the center of wafer W, and the center of wafer W is positioned. Therefore, regardless of the presence or absence of transparency of wafer W, wafer W can be aligned with high accuracy, and the protective tape PT can be applied to wafer W with reliable accuracy.

[0137] In addition, in the case of the second alignment device 8 and the alignment method for the wafer W having the above-described configuration, red light is used for the alignment of the wafer W, and the alignment can be performed without using light having high energy such as ultraviolet light or blue light. Therefore, the wafer element is not damaged.

[0138] As described above, according to one embodiment of the present invention, an alignment device and an alignment method for aligning a protective tape PT having a protective layer PL with high precision can be provided. In addition, an alignment device and an alignment method for aligning a transparent wafer W with high precision can be provided.

[0139] The embodiments of the present invention are described above. However, the present invention is not limited thereto, and various modifications can be made without departing from the spirit of the present invention.

[0140] For example, according to the above-described embodiment, in the first alignment device 5, the plurality of portions of the peripheral edge portion of the protective layer PL are imaged by moving one image pickup device 50. However, the plurality of portions of the peripheral edge portion of the protective layer PL may be imaged using two or more image pickup devices 50, or the plurality of portions of the peripheral edge portion of the protective layer PL may be imaged by arranging an image pickup device 50 for each portion of the peripheral edge portion of the protective layer PL to be imaged.

[0141] Furthermore, according to the above-described embodiment, four portions of the peripheral edge portion of the protective layer PL are imaged in the first alignment device 5. However, the number of portions to be imaged does not necessarily have to be four, but may be two to three or five or more, as long as the center of the protective layer PL can be detected.

[0142] Furthermore, according to the above-described embodiment, in the second alignment device 8, the image pickup device 84 is arranged on the rotation axis 800 of the rotation stage 80 to image the entire outer peripheral edge portion of the wafer W. However, the image pickup device 84 does not necessarily have to be arranged on the rotation axis 800 of the rotation stage 80 as long as the outer shape of the wafer W can be recognized. The entire outer peripheral edge portion of the wafer W can be detected, for example, by arranging the image pickup device 84 in the vicinity of the outer peripheral edge portion of the wafer W to continuously image portions of the outer peripheral edge portion of the rotating wafer W.

[0143] The applying device 1 including the first aligning device 5 and the second aligning device 8 is not limited to the above-described embodiment, and various modifications may be made without departing from the spirit of the present invention.

[0144] For example, in the above-mentioned embodiment, in the application device 1, the cutting frame DF heated in the heating section G is conveyed to the frame accommodating section H and accommodated in the accommodating box 15. However, the following configuration may be adopted. That is, the heated cutting frame DF is conveyed to the frame accommodating section H by the conveying table 14. Figure 1The tape cutting section I shown in FIG. 1 is formed by cutting the protective tape PT applied to the cutting frame DF, and the protective tape PT applied to the cutting frame DF is cut along the outer shape of the wafer W by using the cutter unit 18. Thereafter, the wafer W with the protective tape PT separated from the cutting frame DF is conveyed by the second wafer conveying mechanism 19 and accommodated in a wafer accommodating portion (not shown) or in an opening portion in the accommodating box 10. Now, referring to FIG. Figure 29 to Figure 35 This configuration is described in detail.

[0145] First, in Fig.25 In the embodiment, the heated cutting frame DF is taken out from the heating stage 12 by the second conveying arm 9B, and the inverted reversing arm 13 receives the cutting frame DF from the second conveying arm 9B. Thereafter, the cutting frame DF is vertically reversed by rotating the reversing arm 13, and the wafer W is used as the lower surface (see Fig.29 ) is placed on the conveyor table 14. Then, Fig.30 As shown in FIG. 1 , the cutting frame DF is conveyed to below the cutter unit 18 of the tape cutting section I by the conveying stage 14. In the present embodiment, the upper surface of the conveying stage 14 is appropriately formed into a convex shape conforming to the thickness of the wafer W.

[0146] The cutter unit 18 is configured to move in the up-down direction between a cutting position for cutting the protective tape PT and a separation position located above the cutting position by using a driving source (not shown). In addition, the cutter unit 18 includes a cutter 180, a support plate 181 configured to support the cutter 180, and a motor 182 configured to drive the cutter 180 to rotate.

[0147] In the tape cutting section I, as Fig.31 As shown in FIG. 1 , when the cutting frame DF is conveyed, the cutter unit 18 moves downward, and the cutter 180 rotates to cut the protective tape PT along the outer shape of the wafer W. Then, as shown in FIG. Fig.32 As shown in FIG. 1 , the cutter unit 18 moves upward to be retracted to the separated position, and the second wafer conveying mechanism 19 moves onto the conveying stage 14 .

[0148] In the present embodiment, the second wafer conveying mechanism 19 is configured to reciprocate in the Y direction between the tape cutting section I and the wafer alignment section D by using a driving source (not shown). In addition, the second wafer conveying mechanism 19 includes a suction hand 190 capable of holding the wafer W by, for example, suction, and a cylinder 191 configured to move the suction hand 190 in the up-down direction.

[0149] When the protective tape PT applied to the dicing frame DF is cut along the outline of the wafer W, the suction hand 190 moves downward to suction the wafer W with the protective tape PT separated from the dicing frame DF on the conveying table 14. Fig.33 As shown in FIG, after the suction hand 190 moves upward, the wafer W with the protective tape PT is conveyed to the wafer alignment section D by the suction hand 190 to be placed on the rotation table 80. Then, the wafer W with the protective tape PT placed on the rotation table 80 is conveyed by the first wafer conveying mechanism 7 and accommodated in a wafer accommodation portion (not shown) or an opening portion of the accommodation box 10.

[0150] At the same time, the cutting frame DF separated from the wafer W is transported to the frame accommodating section H by the transport stage 14. Fig.34 As shown in FIG. 1 , the cutting frame DF is received in the receiving box 15 from the conveying table 14 via the conveying guide rail 16 by the frame pusher 17, as shown in FIG. Fig.35 as shown in .

[0151] The applying device 1 having the above-described configuration may be connected to a rear surface grinding device or the like so that the wafer W mounted on the dicing frame DF or the wafer W having the protective tape PT applied thereto is directly supplied to the rear surface grinding device or the like.

[0152] Description of Reference Numerals

[0153] 5. First alignment device (alignment device for protecting tape)

[0154] 8 Second alignment device (alignment device for wafer)

[0155] 30 Tape retainer

[0156] 31. Holding body moving mechanism

[0157] 50 Image pickup device

[0158] 51 Irradiation device

[0159] 52 Image pickup device moving mechanism

[0160] 80 Rotating Table

[0161] 82 mobile units

[0162] 83 Irradiation device

[0163] 84 Image pickup device

[0164] W chip

[0165] BM substrate

[0166] PT Protective Tape

[0167] PL protective layer

[0168] DF cutting frame

Claims

1. An alignment device for applying a protective tape to a semiconductor wafer, the alignment device comprising: a rotating table configured to support the semiconductor wafer and rotate the semiconductor wafer; an irradiation device for irradiating the semiconductor wafer with red light from one surface side of the semiconductor wafer, the irradiation device having an outer shape formed larger than an outer shape of the semiconductor wafer and configured to emit red light in a ring shape; and an image pickup device for imaging the semiconductor wafer as a whole on the other surface side of the semiconductor wafer, Here, the alignment device is configured to determine the center position of the semiconductor wafer by detecting an outer peripheral edge portion of the semiconductor wafer based on a reception state of the red light by the image pickup device.

2. The alignment device according to claim 1, wherein: The image pickup device is configured to image the semiconductor wafer through the mediation of an optical filter configured to transmit light within a wavelength range of the red light among incident light.

3. The alignment device according to claim 2, wherein: The optical filter is configured to block light having a wavelength of 600 nm or less.

4. The alignment device according to any one of claims 1 to 3, further comprising a stage moving mechanism configured to horizontally move the rotating stage in an X direction and a Y direction orthogonal to the X direction, in, The alignment device is configured to determine a position shift amount by comparing the center position of the semiconductor wafer with a predetermined reference position and to perform position adjustment of the center of the semiconductor wafer by controlling the stage moving mechanism based on the position shift amount.

5. An alignment device for applying a protective tape to a semiconductor wafer, the alignment device comprising: a tape holder configured to hold the protective tape, the protective tape being laminated with a protective layer having an outer diameter smaller than that of the protective tape; an image pickup device for imaging a plurality of portions of the peripheral edge portion of the protective layer, the image pickup device being supported by a guide rail disposed on a support plate; an irradiation device for irradiating a portion of the peripheral edge portion of the protective layer to be imaged by the image pickup device, the irradiation device being supported by a guide member arranged on the support plate; as well as an image pickup device moving mechanism configured to reciprocate the image pickup device in an X direction along a horizontal surface and in a Y direction orthogonal to the X direction via the support plate to image a plurality of portions of the peripheral edge portion, Wherein, the alignment device is configured to: determine the position information of each of the multiple parts of the outer peripheral edge part of the protective layer based on the image data acquired by imaging of the image pickup device, and determine the center position of the protective layer based on the position information of each of the multiple parts. 6 . The alignment device according to claim 5 , wherein the irradiation device is arranged on a periphery of the image pickup device.

7. The alignment device according to claim 5 or 6, further comprising a holding body moving mechanism, wherein the holding body moving mechanism is configured to horizontally move the tape holding body in an X direction and a Y direction orthogonal to the X direction, in, The alignment device is configured to determine a position shift amount by comparing the center position of the protective layer with a predetermined reference position and to perform position adjustment of the center of the protective tape by controlling the holding body moving mechanism based on the position shift amount.

8. An alignment method performed to apply a protective tape to a semiconductor wafer, the alignment method comprising: rotating the semiconductor wafer; irradiating the semiconductor wafer from one surface side of the semiconductor wafer with red light emitted by an irradiation device, wherein the irradiation device has an outer shape formed larger than an outer shape of the semiconductor wafer and is configured to emit red light in a ring shape; imaging the semiconductor wafer as a whole on the other surface side of the semiconductor wafer by an image pickup device; and The center position of the semiconductor wafer is determined by detecting the outer peripheral edge portion of the semiconductor wafer based on the reception state of the red light.

9. An alignment method performed for applying a protective tape to a semiconductor wafer, the alignment method comprising the steps of: holding the protective tape, the protective tape being laminated with a protective layer, the protective layer having an outer diameter smaller than an outer diameter of the protective tape; imaging a plurality of portions of the peripheral edge portion of the protective layer using an image pickup device supported by a guide rail disposed on a support plate; as well as by determining position information of each of the plurality of portions of the outer peripheral edge portion of the protective layer based on image data acquired by imaging, and determining the center position of the protective layer based on the position information of each of the plurality of portions, The method further comprises: irradiating a portion of the outer peripheral edge portion of the protective layer to be imaged by the image pickup device with an irradiation device, the irradiation device being supported by a guide member arranged on the support plate; as well as The image pickup device is reciprocated in an X direction along a horizontal surface and in a Y direction orthogonal to the X direction via the support plate by an image pickup device moving mechanism to image a plurality of portions of the peripheral edge portion.

Images