Debonding device and method

Abstract

The present invention provides a debonding device and method, the debonding device comprises an upper wafer loading assembly, a lower wafer loading assembly and a loading body; the upper wafer loading assembly comprises a clamping ring and a clamping control mechanism, the clamping ring is an open ring and is used to clamp the upper wafer, the clamping control mechanism is used to control the opening degree of the clamping ring to achieve control of the clamping degree of the upper wafer; the clamping ring and the clamping control mechanism are both installed on the loading body; the lower wafer loading assembly is used to load the lower wafer and is installed on the loading body. The debonding device of the present invention can reduce or even eliminate the occurrence of the situation that the upper wafer falls off due to being clamped too loosely or is crushed due to being clamped too tightly, thereby successfully completing the debonding process of the upper wafer and the lower wafer.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor equipment, and in particular to a debonding device and method. Background Art

[0002] In advanced wafer manufacturing processes, two wafers (or wafers and carriers) are often temporarily bonded together to complete subsequent processes. This method is called temporary bonding. The purpose of temporary bonding is to separate the two wafers into two independent wafers through different technical means after completing subsequent process steps. For larger wafer pairs, the forward separation force is huge. It is impossible to pull the entire wafer apart in opposite directions in principle and operation. Instead, the two wafers need to be separated from one side first and then gradually torn apart.

[0003] In the prior art, one method is to directly absorb the upper wafer through the deformation of the vacuum suction nozzle and use a knife to pierce the edge of the bonding layer to tear the wafer from one side to the other, but the wafer will inevitably deform in this process, which may cause permanent warping or even breakage of the wafer; another method is to use a flexible annular clamping ring to drive the upper wafer to move upward, but the annular clamping ring is manually adjusted to clamp the upper wafer. If the clamping is too tight, the upper wafer will be directly crushed, and if the clamping is too loose, the upper wafer will easily fall off during separation. Summary of the invention

[0004] The problem solved by the present invention is that the debonding device of a wafer pair in the prior art easily causes the wafer to break or fall off.

[0005] In order to solve the above problems, the present invention provides a debonding device, comprising an upper wafer loading assembly, a lower wafer loading assembly and a loading body;

[0006] The upper wafer loading assembly comprises a clamping ring and a clamping control mechanism, wherein the clamping ring is an open ring and is used to clamp the upper wafer, and the clamping control mechanism is used to control the opening degree of the clamping ring to achieve control of the clamping degree of the upper wafer; the clamping ring and the clamping control mechanism are both mounted on the loading body;

[0007] The lower wafer loading assembly is used for loading the lower wafer and is installed on the loading body.

[0008] Furthermore, the clamping control mechanism includes an opening and closing drive component for controlling the opening / closing of the clamping ring and a clamping sensor for detecting the opening degree, the opening and closing drive component is installed on the loading body, and the clamping sensor is installed on the loading body or the clamping ring.

[0009] Furthermore, the clamping control mechanism includes an arc-shaped guide rail and a guide seat slidably matched with the arc-shaped guide rail, the arc-shaped guide rail is installed on the loading body or the guide seat, and the guide seat is fixed on the opening of the clamping ring.

[0010] Further, the clamping ring includes a first ring body and a second ring body, one end of the first ring body is rotatably connected to one end of the second ring body, and the other end of the first ring body and the other end of the second ring body can move relatively close to or away from each other under the driving action of the opening and closing driving member to form a clamping space for clamping the upper wafer;

[0011] The first ring body and / or the second ring body are fixedly provided with the guide seat.

[0012] Furthermore, the first ring body and the second ring body are both semicircular ring structures.

[0013] Furthermore, the clamping ring has a clamping groove for clamping the upper wafer, and the opening of the clamping groove faces the axial direction of the clamping ring.

[0014] Furthermore, the upper wafer loading assembly comprises an upper suction cup (130) for sucking the upper wafer, and the upper suction cup is installed on the loading body and close to the central hole of the clamping ring.

[0015] Furthermore, the upper wafer loading assembly includes a pitch mechanism, which includes a pitch axis and a pitch driving component. The pitch axis is installed on the loading body and is rotatably connected to the clamping ring. The pitch driving component is installed on the loading body and its driving end is connected to the clamping ring.

[0016] Furthermore, the lower wafer loading assembly includes a lifting mechanism and a lower suction cup for adsorbing the lower wafer, the lower suction cup is installed on the lifting mechanism, and the lifting mechanism is installed on the loading body.

[0017] Furthermore, the lifting mechanism includes a pulling pressure sensor, a guide rod, a bracket and a lifting drive member for driving the bracket to lift and lower, one end of the pulling pressure sensor is connected to the lower suction cup, and the other end is connected to the bracket, the bracket is slidably connected to the guide rod, the guide rod and the lifting drive member are both installed on the loading body, and the driving end of the lifting drive member is connected to the bracket.

[0018] Furthermore, the lifting mechanism includes a translation component, which includes a bracket, a slide rail and a slide groove. The bracket is arranged between the tensile pressure sensor and the lower suction cup and is connected to the tensile pressure sensor. The slide rail is slidably connected to the slide groove. One of the slide rail and the slide groove is connected to the lower suction cup, and the other is connected to the bracket.

[0019] Furthermore, the bracket is annular, and there are multiple tension and pressure sensors, which are evenly distributed along the circumference of the bracket.

[0020] Furthermore, the surface of the adsorption area of ​​the lower suction cup has a plurality of dot-shaped protrusions, and the plurality of dot-shaped protrusions are arranged in an array.

[0021] A second aspect of the present invention provides a debonding method, which is applied to the above-mentioned debonding device, and the debonding method comprises:

[0022] Mounting the upper wafer on the clamping ring;

[0023] Determine whether the opening of the clamping ring is within a preset opening range, and if so, control the lower wafer to descend by a first displacement;

[0024] It is determined whether the bonding tension between the upper wafer and the lower wafer is within a preset tension range; if so, the lower wafer is controlled to continue to descend by a second displacement; if not, the lower wafer is controlled to ascend by a third displacement.

[0025] Furthermore, before controlling the lower wafer to descend, the steps include: controlling the upper wafer to be adsorbed on the upper suction cup, and controlling the lower wafer to be adsorbed on the lower suction cup.

[0026] After adopting the above debonding device and method, the present invention has the following beneficial effects compared with the prior art: the debonding device of the present invention clamps the upper wafer in the clamping ring through the clamping control mechanism, and keeps the opening degree of the clamping ring within an appropriate range, so as to reduce or even eliminate the occurrence of the upper wafer falling off due to being clamped too loosely or being crushed due to being clamped too tightly, thereby successfully completing the debonding process of the upper wafer and the lower wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a structural schematic diagram of a debonding device according to an embodiment of the present invention;

[0028] Figure 2 Schematic diagram of the structure of the upper wafer loading assembly in an embodiment of the present invention;

[0029] Figure 3 It is a top view schematic diagram of the clamping ring, the clamping control mechanism, and the upper suction cup in an embodiment of the present invention;

[0030] Figure 4A partial cross-sectional schematic diagram of a clamping ring in an embodiment of the present invention;

[0031] Figure 5 Schematic diagram of the structure of the lower wafer loading assembly in an embodiment of the present invention;

[0032] Figure 6 A schematic diagram of a debonding method according to an embodiment of the present invention;

[0033] Figure 7 Another schematic diagram of a debonding method according to an embodiment of the present invention;

[0034] Figure 8 A schematic diagram of another process of the debonding method according to an embodiment of the present invention;

[0035] Fig. 9 The figure is another flow chart of the debonding method according to the embodiment of the present invention.

[0036] Reference numerals:

[0037] 100 - upper wafer loading assembly; 110 - clamping ring; 120 - clamping control mechanism; 130 - upper suction cup;

[0038] 140-pitch mechanism;

[0039] 1101-first ring body; 1102-second ring body; 1103-clamping groove;

[0040] 1201- clamping sensor; 1202- arc guide rail; 1203- guide seat;

[0041] 1401-pitch axis; 1402-pitch drive member;

[0042] 200-lower wafer loading assembly; 210-lifting mechanism; 211-translation assembly; 220-lower suction cup;

[0043] 2101-tension pressure sensor; 2102-guide rod; 2103-bracket;

[0044] 2111- bracket; 2112- slide rail; 2113- slide slot;

[0045] 300- loading body;

[0046] 400-wafer loading;

[0047] 500- Wafer down. DETAILED DESCRIPTION

[0048] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0049] The embodiment of the present invention provides a debonding device, such as Figure 1-Figure 5 As shown, the debonding device includes an upper wafer loading assembly 100 , a lower wafer loading assembly 200 and a loading body 300 .

[0050] Among them, Figure 1 , Figure 2 As shown, the upper wafer loading assembly 100 includes a clamping ring 110 and a clamping control mechanism 120. Figure 3 As shown, the clamping ring 110 is an open ring and is used to clamp the upper wafer 400 . The clamping control mechanism 120 is used to control the opening degree of the clamping ring 110 to achieve control of the clamping degree of the upper wafer 400 . The clamping ring 110 and the clamping control mechanism 120 are both installed on the loading body 300 .

[0051] The lower wafer loading assembly 200 is used to load the lower wafer 500 , and the lower wafer loading assembly 200 is installed on the loading body 300 .

[0052] The wafer debonding device provided in the embodiment of the present invention has a clamping control mechanism 120 that can control the opening of the clamping ring 110 within a reasonable range. When the opening is larger and exceeds the reasonable range, it means that the clamping ring 110 clamps the upper wafer 400 too loosely, which can easily cause the upper wafer 400 to fall off. When the opening is smaller and exceeds the reasonable range, it means that the clamping ring 110 clamps the upper wafer 400 too tightly, which can easily crush the upper wafer 400. In the present embodiment, the upper wafer 400 is clamped in the clamping ring 110 by the clamping control mechanism 120, and the opening degree of the clamping ring 110 is maintained within an appropriate range, that is, the clamping control mechanism 120 enables the clamping ring 110 to maintain an appropriate clamping force on the upper wafer 400, neither too loose nor too tight, thereby reducing or even eliminating the occurrence of the upper wafer 400 falling off due to being clamped too loosely or being crushed due to being clamped too tightly, thereby successfully completing the debonding process of the upper wafer 400 and the lower wafer 500.

[0053] In the embodiment of the present invention, Figure 1-Figure 3 As shown, the clamping control mechanism 120 includes an opening and closing driving member for controlling the opening / closing of the clamping ring 110 and a clamping sensor 1201 for detecting the opening degree. The opening and closing driving member is installed on the loading body 300, and the clamping sensor is installed on the loading body 300 or the clamping ring 110.

[0054] Specifically, the opening and closing drive member (not shown in the figure) can be a linear electric cylinder, a pneumatic cylinder, a hydraulic cylinder, etc. that can provide linear motion, and can also be a connecting rod mechanism, or other transmission mechanisms, etc. This driving method is relatively common, so it will not be repeated here. Specifically, the clamping sensor 1201 can be a proximity switch, a travel switch, a distance sensor, etc., as long as it can sense the opening degree of the clamping ring 110. A variety of existing sensors can be used to achieve this, so it will not be repeated here. The opening / closing action is realized by setting an opening and closing drive member to drive the opening of the clamping ring 110, and the reasonable control of the opening degree is realized by the clamping sensor 1201 cooperating with the opening and closing drive member, which has the advantages of simple structure and easy implementation.

[0055] In addition, in the embodiment of the present invention, Figure 3 As shown, the clamping control mechanism 120 includes an arcuate guide rail 1202 and a guide seat 1203 slidably matched with the arcuate guide rail 1202 . The arcuate guide rail 1202 is installed on the loading body 300 or the guide seat 1203 . The guide seat 1203 is fixed to the opening of the clamping ring 110 .

[0056] Specifically, the arrangement of the arc guide rail 1202 and the guide seat 1203 can limit the movement trajectory of the clamping ring 110 when opening / closing, thereby ensuring movement stability and accuracy. There are multiple installation methods for the arc guide rail 1202, which can be selected according to the specific structure of the clamping ring 110.

[0057] In the embodiment of the present invention, please continue to refer to Figure 3 The clamping ring 110 includes a first ring body 1101 and a second ring body 1102, one end of the first ring body 1101 is rotatably connected to one end of the second ring body 1102, and the other end of the first ring body 1101 and the other end of the second ring body 1102 can move relatively close to or away from each other under the driving action of the opening and closing driving member to form a clamping space for clamping the upper wafer 400; the first ring body 1101 and / or the second ring body 1102 are fixedly provided with a guide seat 1203, and the first ring body 1101 and / or the second ring body 1102 are both installed on the loading body 300.

[0058] Specifically, Figure 1 , Figure 2As shown, one end of the first ring body 1101 and the second ring body 1102 can be connected by a rotating shaft, and both can rotate relative to the loading body 300. At this time, a guide seat 1203 is provided on both ring bodies, and both ends of the annular guide rail 1202 are respectively slidably connected to the guide seats 1203 on the first ring body 1101 and the second ring body 1102, and the annular guide rail 1202 is fixed to the loading body 300; or, the annular guide rail 1202 is fixed to the first ring body 1101, and the second ring body 1102 is slidably connected to the annular guide rail 1202. Of course, other methods can also be used, as long as the first ring body 1101 and the second ring body 1102 can be moved toward or in the opposite direction to realize the opening / closing of the clamping ring 110.

[0059] In the embodiment of the present invention, Figure 3 As shown, the first ring body 1101 and the second ring body 1102 are both semicircular ring structures. The first ring body 1101 and the second ring body 1102 are arranged as semicircular ring structures, which have the advantages of simple structure and easy implementation, and it is easier to achieve clamping control of the upper wafer 400.

[0060] In addition, in the embodiment of the present invention, Figure 4 As shown, the clamping ring 110 has a clamping groove 1103 for clamping the upper wafer 400, and the opening of the clamping groove 1103 faces the axial direction of the clamping ring 110. It should be noted that "facing the axial direction of the clamping ring 110" here does not mean that the opening direction is absolutely perpendicular to the axis, but refers to that the opening direction is roughly toward the axis direction, that is, the opening of the clamping groove 1103 has upper and lower edges, so as to limit the upper wafer 400 in the upper and lower directions (the axial direction of the clamping ring 110), and clamp the upper wafer 400 in the clamping groove 1103 to prevent the upper wafer 400 from falling.

[0061] In the embodiment of the present invention, Figure 1 , Figure 2 As shown, the upper wafer loading assembly 100 further includes an upper suction cup 130 for sucking the upper wafer 400, and the upper suction cup 130 is mounted on the loading body 300 and close to the central hole of the clamping ring 110. The upper suction cup 130 can support the upper wafer 400, thereby enhancing the rigidity of the upper wafer 400, reducing or even avoiding the upper wafer 400 from damaging bending or warping during the debonding process, and effectively protecting the upper wafer 400.

[0062] In addition, in the embodiment of the present invention, Figure 1 , Figure 2As shown, the upper wafer loading assembly 100 includes a pitch mechanism 140, which includes a pitch axis 1401 and a pitch driving member 1402. The pitch axis 1401 is mounted on the loading body 300 and is rotatably connected to the clamping ring 110. The pitch driving member 1402 is mounted on the loading body 300, and its driving end is connected to the clamping ring 110. Figure 1 , Figure 2 As shown, the pitch axis 1401 is arranged near the opening position of the clamping ring 110, and the pitch driving member 1402 is arranged at a position opposite to the opening position of the clamping ring 110, that is, the pitch axis 1401 and the pitch driving member 1402 are respectively arranged at the two ends of the first ring body 1101 or the second ring body 1102. Under the driving action of the pitch driving member 1402, the clamping ring 110 will swing up and down around the pitch axis 1401.

[0063] The above mainly describes in detail the upper wafer loading assembly 100 in the embodiment of the present invention, and the following mainly describes in detail the lower wafer loading assembly 200.

[0064] In the embodiment of the present invention, Figure 1 , Figure 5 As shown, the lower wafer loading assembly 200 includes a lifting mechanism 210 and a lower suction cup 220 for sucking the lower wafer 500, and the lower suction cup 220 is installed on the lifting mechanism 210, and the lifting mechanism 210 is installed on the loading body 300. The lifting mechanism 210 drives the lower suction cup 220 to rise and fall, thereby realizing the lifting and falling of the lower wafer 500, so as to complete the debonding process of the upper wafer 400 and the lower wafer 500.

[0065] Specifically, in the embodiment of the present invention, Figure 1 , Figure 5 As shown, the lifting mechanism 210 includes a pulling pressure sensor 2101, a guide rod 2102, a bracket 2103 and a lifting drive for driving the bracket 2103 to lift and lower. One end of the pulling pressure sensor 2101 is connected to the lower suction cup 220, and the other end is connected to the bracket 2103. The bracket 2103 is slidably connected to the guide rod 2102. The guide rod 2102 and the lifting drive are both installed on the loading body 300, and the driving end of the lifting drive is connected to the bracket 2103. The setting of the guide rod 2102 can limit the motion trajectory of the bracket 2103, further ensure the motion trajectory of the lower wafer 500, and realize the stable and precise movement of the lower wafer 500. The lifting drive (not shown in the figure) can be implemented in a variety of ways, such as: a linear electric cylinder, a hydraulic cylinder, a cylinder, a connecting rod mechanism or other transmission mechanism, and its implementation method is relatively common, so it will not be repeated here.

[0066] For details, please refer to Figure 1 , Figure 5The lifting mechanism 210 includes a translation assembly 211, which includes a bracket 2111, a slide rail 2112 and a slide groove 2113. The bracket 2111 is arranged between the tension pressure sensor 2101 and the lower suction cup 220, and is connected to the tension pressure sensor 2101. The slide rail 2112 is slidably connected to the slide groove 2113. The slide rail 2112 is connected to the lower suction cup 220, and the slide groove 2113 is connected to the bracket 2111. The arrangement of the translation assembly 211 can provide the lower wafer 500 with a relative movement in the horizontal direction, thereby compensating for the horizontal force component generated by the lower wafer 500 during the debonding process, and preventing the upper wafer 400 and the lower wafer 500 from being damaged due to excessive local lateral force.

[0067] It should be noted that the slide rail 2112 and the slide groove 2113 may also be arranged in other ways, for example, the slide rail 2112 may be connected to the bracket 2111, and the slide groove 2113 may be connected to the lower suction cup 220; or the slide rail 2112 and the slide groove 2113 may also be indirectly connected between the lower suction cup 220 and the bracket 2111, as long as it can compensate for the horizontal component of force generated by the lower wafer 500 during the debonding process and avoid the upper wafer 400 and the lower wafer 500 from being subjected to excessive local lateral force.

[0068] Specifically, in the embodiment of the present invention, the bracket 2103 is set to be annular, and there are 3 tension pressure sensors 2101, which are evenly distributed along the circumference of the bracket 2103. Of course, the tension pressure sensors 2101 can also be set to other numbers, such as 2, 4, 5, 6, etc. The setting of the tension pressure sensor 2101 can accurately detect the tension exerted on the lower wafer 500 during the debonding process, and realize accurate perception of the separation state of the upper wafer 400 and the lower wafer 500.

[0069] like Figure 1 , Figure 5 As shown, in the embodiment of the present invention, the surface of the adsorption area of ​​the lower suction cup 220 has a plurality of dot-shaped protrusions, and the plurality of dot-shaped protrusions are arranged in an array. Compared with the ridges in the prior art, the arrangement of the dot-shaped protrusions can reduce the contact area between the lower suction cup 220 and the lower wafer 500, thereby ensuring the maximization of the effective vacuum adsorption area.

[0070] A second aspect of an embodiment of the present invention provides a debonding method, which is applied to the above-mentioned debonding device.

[0071] The first debonding method includes the following steps: Figure 6 shown.

[0072] S602: Mount the upper wafer 400 on the clamping ring;

[0073] S604 determines whether the opening degree of the clamping ring 110 is within a preset opening degree range;

[0074] S606 If the opening degree of the clamping ring 110 is within the preset opening degree range, the lower wafer 500 is controlled to descend by a first displacement;

[0075] S608 determines whether the bonding tension between the upper wafer 400 and the lower wafer 500 is within a preset tension range;

[0076] S604: If the bonding tension between the upper wafer 400 and the lower wafer 500 is not within the preset tension range, the lower wafer 500 is controlled to rise by a third displacement;

[0077] S612: If the bonding tension between the upper wafer 400 and the lower wafer 500 is within the preset tension range, the lower wafer 500 is controlled to continue to descend by a second displacement.

[0078] In the embodiment of the present invention, the opening degree of the clamping ring 110 is controlled by the clamping control mechanism 120. When the lower wafer 500 is lowered by the first displacement, it is determined that the bonding tension between the upper wafer 400 and the lower wafer 500 is not within the preset tension range, that is, it exceeds the preset tension range, indicating that the stress deformation of the upper wafer 400 and / or the lower wafer 500 may be in a damaged state. The lower wafer 500 is controlled to rise by a third displacement to reduce the bonding tension between the upper wafer 400 and the lower wafer 500. At the same time, step S608 is executed again. When the bonding tension between the upper wafer 400 and the lower wafer 500 is within the preset tension range, it indicates that the stress deformation of both is in a safe state. The lower wafer 500 is controlled to continue to descend by the second displacement. At this time, step S608 is executed until the debonding of the upper wafer 400 and the lower wafer 500 is completed.

[0079] In summary, the lower wafer 500 repeatedly moves up and down, and the upper wafer 400 performs a pitching motion around the pitch axis 1401 under the combined action of the downward bonding force of the lower wafer 500 and the pitch driving member 1402. The lower wafer 500 is subjected to the upward bonding force, resulting in a local arched deformation, such as Figure 5 As shown; by repeatedly judging the lower wafer 500's downward displacement and the pulling force value in real time, the force deformation of the lower wafer 500 is always within a safe range, and the closed-loop control of the separation pulling force and downward displacement is achieved, which ensures that the lower wafer 500 is not damaged to the greatest extent.

[0080] In the embodiments of the present invention, see Figure 7 , the second debonding method includes the following steps.

[0081] S702: Mount the upper wafer 400 on the clamping ring;

[0082] S704 controls the lower wafer 500 to be adsorbed on the lower suction cup 220;

[0083] S706: Control the upper wafer 400 to be adsorbed on the upper suction cup 130;

[0084] S708 determines whether the opening degree of the clamping ring 110 is within a preset opening degree range;

[0085] S710 If the opening degree of the clamping ring 110 is within the preset opening degree range, the lower wafer 500 is controlled to descend by a first displacement;

[0086] S712: determining whether the bonding tension between the upper wafer 400 and the lower wafer 500 is within a preset tension range;

[0087] S714: If the bonding tension between the upper wafer 400 and the lower wafer 500 is not within the preset tension range, the lower wafer 500 is controlled to rise by a third displacement;

[0088] S716 If the bonding tension between the upper wafer 400 and the lower wafer 500 is within the preset tension range, the lower wafer 500 is controlled to continue to descend by a second displacement.

[0089] In this method, based on the first method, an adsorption step for the upper wafer 400 and the lower wafer 500 is added, that is, before the step of determining whether the opening degree of the clamping ring 110 is within the preset opening range, the method also includes the steps of: controlling the lower wafer 500 to be adsorbed on the lower suction cup 220; and controlling the upper wafer 400 to be adsorbed on the upper suction cup 130.

[0090] In the embodiments of the present invention, see Figure 8 , the third debonding method includes the following steps.

[0091] S802: Mount the upper wafer 400 on the clamping ring;

[0092] S804 determines whether the opening degree of the clamping ring 110 is within a preset opening degree range;

[0093] S806 If the opening degree of the clamping ring 110 is within the preset opening degree range, the lower wafer 500 is controlled to descend by a first displacement;

[0094] S808: determining whether the bonding tension between the upper wafer 400 and the lower wafer 500 is within a preset tension range;

[0095] S810 If the bonding tension between the upper wafer 400 and the lower wafer 500 is not within the preset tension range, controlling the lower wafer 500 to rise by a third displacement;

[0096] S812 If the opening degree of the clamping ring 110 is not within the preset opening degree range, adjust the opening degree of the clamping ring 110 to be within the preset opening degree range;

[0097] S814: If the bonding tension between the upper wafer 400 and the lower wafer 500 is within the preset tension range, the lower wafer 500 is controlled to continue to descend by a second displacement;

[0098] S816 The debonding of the upper wafer 400 and the lower wafer 500 is completed.

[0099] In this method, based on the first method mentioned above, a step is added for adjusting the clamping ring 110 to a preset opening range when the opening degree of the clamping ring 110 does not meet the preset opening range. That is, after the step of determining whether the opening degree of the clamping ring 110 is within the preset opening range, the step is also included: if the opening degree of the clamping ring 110 is not within the preset opening range, adjusting the opening degree of the clamping ring 110 to the preset opening range.

[0100] For an embodiment of the present invention, see Fig. 9 , the fourth debonding method includes the following steps.

[0101] S902: Mount the upper wafer 400 on the clamping ring.

[0102] S904: Control the lower wafer 500 to be attached to the lower suction cup 220;

[0103] S906: Control the upper wafer 400 to be attached to the upper suction cup 130;

[0104] S908 determines whether the opening degree of the clamping ring 110 is within a preset opening degree range;

[0105] S910 If the opening degree of the clamping ring 110 is within the preset opening degree range, the lower wafer 500 is controlled to descend by a first displacement;

[0106] S912: determining whether the bonding tension between the upper wafer 400 and the lower wafer 500 is within a preset tension range;

[0107] S914: If the bonding tension between the upper wafer 400 and the lower wafer 500 is not within the preset tension range, the lower wafer 500 is controlled to rise by a third displacement;

[0108] S916 If the opening degree of the clamping ring 110 is not within the preset opening degree range, adjust the opening degree of the clamping ring 110 to be within the preset opening degree range;

[0109] S918 If the bonding tension between the upper wafer 400 and the lower wafer 500 is within the preset tension range, the lower wafer 500 is controlled to continue to descend by a second displacement.

[0110] In this method, based on the third method mentioned above, an adsorption step for the upper wafer 400 and the lower wafer 500 is added, that is, before the step of judging whether the opening degree of the clamping ring 110 is within the preset opening range, it also includes the steps of: controlling the lower wafer 500 to be adsorbed on the lower suction cup 220; controlling the upper wafer 400 to be adsorbed on the upper suction cup 130.

[0111] To sum up, the debonding device and method in the embodiment of the present invention can not only control the clamping ring 100 to always be in an appropriate opening degree to ensure the appropriate clamping state of the upper wafer 400 and avoid damage to the upper wafer 400 during the debonding process, but also control the reciprocating motion of the lower wafer 500 in real time and ensure that it is always in a safe state during the reciprocating motion, thereby ensuring that the force deformation of the lower wafer 500 during the debonding process is always within a safe range, thereby avoiding damage to the lower wafer 500 during the debonding process.

[0112] Although the present invention is disclosed as above, the present invention is not limited thereto. Any person skilled in the art may make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the scope defined by the claims.

Claims

1. A debonding device, characterized in that: It comprises an upper wafer loading assembly (100), a lower wafer loading assembly (200) and a loading body (300); The upper wafer loading assembly (100) comprises a clamping ring (110) and a clamping control mechanism (120); the clamping ring (110) is an open ring and is used to clamp the upper wafer (400); the clamping control mechanism (120) comprises an opening / closing driving member for controlling the opening / closing of the clamping ring (110) and a clamping sensor (1201) for detecting the opening degree, and is used to control the opening degree of the clamping ring (110) to achieve control of the clamping degree of the upper wafer (400); the clamping ring (110) and the clamping control mechanism (120) are both mounted on the loading body (300); The lower wafer loading assembly (200) comprises a lifting mechanism (210) and a lower suction cup (220) for adsorbing the lower wafer (500); the lifting mechanism (210) comprises a translation assembly (211), a tension pressure sensor (2101), a bracket (2103) and a lifting drive member for driving the bracket (2103) to lift and lower; wherein the translation assembly (211) comprises a bracket (2111), a slide rail (2112) and a slide groove (2113); the bracket (2111) is arranged between the tension pressure sensor (2101) and the lower suction cup (220); the slide rail (2112) and the slide groove (2113) are connected to the translation assembly (2111) and the lower suction cup (220); The slide groove (2113) is slidably connected, one of the slide rail (2112) and the slide groove (2113) is connected to the lower suction cup (220), and the other is connected to the bracket (2111), and the translation assembly (211) is used to provide horizontal relative movement for the lower wafer (500) to compensate for the horizontal component force generated by the lower wafer (500) during the debonding process; the other end of the tension and pressure sensor (2101) is connected to the bracket (2103), the lifting drive member is installed on the loading body (300), and the driving end of the lifting drive member is connected to the bracket (2103).

2. The debonding device according to claim 1, characterized in that: The opening and closing driving member is mounted on the loading body (300), and the clamping sensor (1201) is mounted on the loading body (300) or the clamping ring (110).

3. The debonding device according to claim 2, characterized in that: The clamping control mechanism (120) comprises an arc-shaped guide rail (1202) and a guide seat (1203) slidably matched with the arc-shaped guide rail (1202); the arc-shaped guide rail (1202) is installed on the loading body (300) or the guide seat (1203); and the guide seat (1203) is fixed to the opening of the clamping ring (110).

4. The debonding device according to claim 3, characterized in that: The clamping ring (110) comprises a first ring body (1101) and a second ring body (1102), one end of the first ring body (1101) is rotatably connected to one end of the second ring body (1102), and the other end of the first ring body (1101) and the other end of the second ring body (1102) can move relatively close to or away from each other under the driving action of the opening and closing driving member to form a clamping space for clamping the upper wafer (400); The first ring body (1101) and / or the second ring body (1102) is fixedly provided with the guide seat (1203).

5. The debonding device according to claim 4, characterized in that: The first ring body (1101) and the second ring body (1102) are both semicircular ring structures.

6. The debonding device according to claim 5, characterized in that: The clamping ring (110) has a clamping groove (1103) for clamping the upper wafer (400), and the opening of the clamping groove (1103) faces the axial direction of the clamping ring (110).

7. The debonding device according to claim 6, characterized in that: The upper wafer loading assembly (100) comprises an upper suction cup (130) for sucking the upper wafer (400); the upper suction cup (130) is mounted on the loading body (300) and is close to the central hole of the clamping ring (110).

8. The debonding device according to claim 7, characterized in that: The upper wafer loading assembly (100) comprises a pitch mechanism (140), wherein the pitch mechanism (140) comprises a pitch axis (1401) and a pitch driving member (1402), wherein the pitch axis (1401) is mounted on the loading body (300) and is rotationally connected to the clamping ring (110); and the pitch driving member (1402) is mounted on the loading body (300), and a driving end thereof is connected to the clamping ring (110).

9. The debonding device according to claim 1, characterized in that: The lifting mechanism (210) further comprises a guide rod (2102), the bracket (2103) is slidably connected to the guide rod (2102), and the guide rod (2102) is mounted on the loading body (300).

10. The debonding device according to claim 1, characterized in that: The bracket (2103) is annular in shape, and there are a plurality of tension and pressure sensors (2101), which are evenly distributed along the circumference of the bracket (2103).

11. The debonding device according to claim 10, characterized in that: The surface of the adsorption area of ​​the lower suction cup (220) has a plurality of dot-shaped protrusions, and the plurality of dot-shaped protrusions are arranged in an array.

12. A debonding method, characterized in that: Applicable to the debonding device according to any one of claims 1 to 11, the debonding method comprising: Mounting the upper wafer on the clamping ring; Determine whether the opening of the clamping ring is within a preset opening range, and if so, control the lower wafer to descend by a first displacement; Determine whether the bonding tension between the upper wafer and the lower wafer is within a preset tension range; if so, control the lower wafer to continue to descend by a second displacement; if not, control the lower wafer to ascend by a third displacement.

13. The debonding method according to claim 12, characterized in that: Before the wafer is lowered under the control, the steps include: The upper wafer is controlled to be adsorbed on the upper suction cup, and the lower wafer is controlled to be adsorbed on the lower suction cup.

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