A photovoltaic module with adjustable busbar spacing

Abstract

An adjustable busbar spacing photovoltaic module is disclosed. This invention relates to photovoltaic devices, and more particularly to improvements in the structure of photovoltaic bypass diode modules. It provides an adjustable busbar spacing photovoltaic module adaptable to various photovoltaic module application scenarios and meeting different busbar connection spacing requirements. The module includes an electrode one, an electrode two, a chip, jumpers, and a package. A busbar hole one is formed on the electrode one, and a busbar hole two is formed on the electrode two. The electrode one, chip, jumpers, and electrode two are connected sequentially to form a diode circuit. The electrode one has an electrode one connection area, an electrode one package area, and an electrode one extension area penetrating the package. The chip is located on the electrode one package area, and the busbar hole one is located on the electrode one extension area. The electrode two has an electrode two arm extending into the package. This invention provides good heat dissipation and strong overcurrent capability.

Description

Technical Field

[0001] This invention relates to photovoltaic devices, and more particularly to improvements in the structure of photovoltaic bypass diode modules. Background Technology

[0002] Since the Industrial Revolution, fossil fuels have played a crucial role in economic development, driving human progress. However, due to their non-renewable nature and significant pollution, coupled with increasingly severe environmental problems and heightened environmental awareness, the development of clean energy has become increasingly urgent. Solar energy is one such important clean energy source. A key component in converting solar energy into electricity is the photovoltaic (PV) module. Its internal cells generate electricity through the photovoltaic effect under sunlight. When one cell is shaded, it stops generating electricity and instead acts as a load, consuming the energy produced by the other cells. Over time, this will inevitably lead to module burnout. To prevent damage to the entire module, a bypass diode must be connected in parallel across its terminals. When shaded, current flows through the diode in the forward direction, protecting the module.

[0003] Photovoltaic bypass diodes are installed in junction boxes to protect the modules from damage during light spot effects. When the diode starts up, the short-circuit current (Isc) of the module flows through the diode in the forward direction, causing a temperature rise. In the early days, when module power was low (200W-300W), conventional diodes were sufficient to meet the temperature rise requirements (diode junction temperature Tj≤200℃). However, to achieve grid parity as quickly as possible, major module manufacturers launched high-power modules (400-500W) to reduce the levelized cost of electricity (LCOE). High-power modules integrate various new technologies, including half-cell, shingled, and double-glass bifacial modules. Compared to traditional modules, the most significant difference is the substantial increase in short-circuit current (Isc). Combined with the need for sufficient safety margins in the design, the reported current of the junction box reaches 25A, and can even reach 30A (compared to around 15A for traditional junction boxes). Therefore, extremely high requirements are placed on the diode's temperature rise capability. Modular diodes have advantages such as strong overcurrent capability and good heat dissipation, which well meet the requirements for high current. However, the traditional module structure has always been... Figure 6 As shown, the busbar perforations (i.e., busbar hole 11 and busbar hole 2 41) are distributed on both sides of the molding compound (encapsulation body 2). The spacing A between busbar hole 11 and busbar hole 2 41 is controlled by the size of the encapsulation body 2 and cannot match the requirements of the component customer. In practical applications, the following problems exist:

[0004] 1. When the component requires a spacing of ≤10mm between the two busbars, the chip's packaging distance is insufficient and it cannot be packaged.

[0005] 2. The spacing between products with ultra-high current (above 20A) is too large, which does not meet customer requirements and makes it impossible to connect conventional photovoltaic modules;

[0006] 3. The different shapes of modules with different spacing result in huge investment in production lines and high costs.

[0007] The aforementioned busbar and perforation are explained as follows:

[0008] The busbar is an extension of the component's solder strip. Its main function is to output the electrical energy generated by the solar module and connect it to the bypass diode in the junction box to protect the module from hot spot damage.

[0009] A through-hole refers to an opening in the conductive plate (i.e., the two electrodes) of a bypass diode module, through which the busbar can be passed and soldered to connect the component to the bypass diode. Summary of the Invention

[0010] To address the above problems, this invention provides a photovoltaic module with adjustable busbar spacing that can adapt to various photovoltaic module application scenarios and meet different busbar connection spacing requirements.

[0011] The technical solution of the present invention includes a first electrode, a second electrode, a chip, a jumper wire, and a package. A first busbar is formed on the first electrode, and a second busbar is formed on the second electrode. The first electrode, the chip, the jumper wire, and the second electrode are connected in sequence to form a diode circuit. The first electrode has a first electrode connection area, a first electrode package area, and a first electrode extension area that penetrates the package. The chip is disposed on the first electrode package area, and the first busbar is formed on the first electrode extension area.

[0012] The second electrode has a second electrode arm extending into the package, and there is a gap between the second electrode arm and the protruding area of ​​the first electrode.

[0013] The length of the extended area of ​​the electrode is 2-8 times the width of the manifold.

[0014] Both the first and second manifolds are elongated slot-shaped holes, and the first and second manifolds are parallel to each other.

[0015] The package is rectangular or L-shaped.

[0016] When the package is L-shaped, the extended portion of the L-shape extends towards the second electrode arm (to shorten the cantilever support distance of the second arm).

[0017] The first electrode and the second electrode are respectively L-shaped and coupled to each other, and retain the gap.

[0018] The first electrode is convex, and the second electrode is concave. The shapes of the first electrode and the second electrode are coupled to each other, and the gap is maintained.

[0019] This invention changes the traditional symmetrical design where the photovoltaic module package body is located in the middle, placing the package body on one side of the product. This allows the two busbar perforations to be located on one side of the package body instead of on both sides. Since the protruding area of ​​electrode one has a certain length, the busbar perforation one on electrode one can be flexibly placed in different positions, thus allowing the spacing between busbar perforation one and busbar perforation two to be flexibly set, without being limited by the plastic package body.

[0020] The photovoltaic module of this invention, due to the extended area, allows for increased heat dissipation area, reduced chip junction temperature, and improved overcurrent capability, meeting the requirements for greater diode overcurrent capacity. Simultaneously, the module's size is not limited by busbar spacing, allowing for the encapsulation of multiple chips.

[0021] This invention can meet the usage requirements of different photovoltaic modules and further standardize photovoltaic module products to meet the needs of different customers; it eliminates the need to design different molds for different specifications of products, significantly saving manufacturing costs. In addition, the product of this invention has good heat dissipation and strong overcurrent capability. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the structure of the present invention.

[0023] Figure 2 This is a schematic diagram of the structure of electrode two in this invention.

[0024] Figure 3 This is a schematic diagram of the structure of electrode one in this invention.

[0025] Figure 4 This is a schematic diagram of another packaging form of the package in this invention.

[0026] Figure 5 This is a schematic diagram of the structure of the second embodiment of the present invention.

[0027] Figure 6 This is a schematic diagram illustrating the background technology of this invention.

[0028] In the diagram, 1 is electrode one, 10 is the extended area of ​​electrode one, 11 is manifold one, and 11' is variable position manifold one.

[0029] 2 is the package, 3 is the chip, 4 is electrode two, 40 is electrode two support arm, 41 is bus hole two, 5 is jumper, and 6 is gap.

[0030] In the figure, A represents the manifold spacing in the prior art, and δA represents the manifold spacing in this invention. Detailed Implementation

[0031] The present invention is as follows Figure 1-5 As shown: It includes electrode 1, electrode 4, chip 3, jumper 5, and package 2. A busbar 11 is formed on electrode 1, and a busbar 41 is formed on electrode 4. Electrode 1, chip 3, jumper 5, and electrode 4 are connected in sequence to form a diode circuit. Electrode 1 has an electrode connection area, an electrode package area, and an electrode extension area 10 that penetrates the package 2. Chip 3 is located in the electrode package area on electrode 1, and busbar 11 is formed in the electrode extension area 10. The electrode package area can be set to different sizes according to customer requirements to accommodate different numbers of chips 3 to meet the needs of high current scenarios.

[0032] Electrode 2 4 has an electrode 2 arm 40 extending into the package 2, and there is a gap 6 between the electrode 2 arm 40 and the electrode 1 extension area 10. This ensures insulation between the two. It should be noted that in photovoltaic applications, the operating voltage is generally in the range of 24-48V, and the device of this invention is placed in a junction box, which fully meets the insulation requirements between the two electrodes.

[0033] The length of the electrode extension area 10 is 2-8 times the width of the manifold 11. This allows the manifold 11 to be positioned in different locations, such as... Figure 1 The variable displacement manifold hole 11' changes the distance between it and the manifold hole 41.

[0034] Both manifold 11 and manifold 2 41 are elongated slot-shaped holes, and manifold 11 and manifold 2 41 are parallel to each other.

[0035] Package 2 is rectangular or L-shaped.

[0036] When the package 2 is L-shaped, the extended portion of the L-shape extends toward the second electrode arm 40. This shortens the cantilever support distance of the second arm and prevents it from easily bending and deforming.

[0037] Electrode 1 and electrode 4 are L-shaped and coupled to each other, with a gap 6 remaining.

[0038] Electrode 1 is convex in shape, and electrode 4 is concave in shape. The shapes of electrode 1 and electrode 2 are coupled together, while retaining the aforementioned gap 6. That is, as... Figure 5 Another embodiment is shown.

Claims

1. A kind of photovoltaic module of busbar pitch adjustable type, including pole piece one, pole piece two, chip, jumper and package, the busbar hole one is opened in the pole piece one, the busbar hole two is opened in the pole piece two, the pole piece one, chip, jumper and pole piece two are sequentially connected, constitute diode circuit, it is characterized in that, The pole piece one is provided with a pole piece one connecting area, a pole piece one packaging area and a pole piece one extending area penetrating the packaging body, the chip is arranged on the pole piece one packaging area of the pole piece one, and the bus hole one is arranged on the pole piece one extending area; The copper piece reserved in the extending area can increase the heat dissipation area and reduce the chip junction temperature; The pole piece two has a pole piece two supporting arm extending into the packaging body, and the pole piece two supporting arm and the pole piece one extending area have a gap therebetween; The length of the pole piece one extending area is 2-8 times the width of the bus hole one; the bus hole one is arranged at different positions to change the distance between the bus hole one and the bus hole two; The packaging body is L-shaped, and the L-shaped extending part extends towards the pole piece two supporting arm; so as to shorten the cantilever support distance of the supporting arm two and avoid bending deformation; The pole piece one and the pole piece two are respectively L-shaped and coupled to each other, and the gap is reserved.

2. The photovoltaic module of claim 1, wherein, The bus hole one and the bus hole two are both long slot-shaped holes, and the bus hole one and the bus hole two are parallel to each other.

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