Processing path display device

Abstract

The present invention provides a processing path display device. The processing path display device (20) includes a display unit (25) that displays the processing path based on the coordinate value of the laser processing head (8) calculated by the laser processing head coordinate calculation unit (22) and the display format set by the first display format setting unit (24a) and the second display format setting unit (24b). At least one of the display color of the first data and the shade of the display color is changed according to the first data acquired by the first data acquisition unit (23a), and at least one of the display color of the second data and the shade of the display color is changed according to the second data acquired by the second data acquisition unit (23b).

Description

Technical Field

[0001] The invention relates to a processing path display device for displaying a processing path of laser processing. Background Art

[0002] When a workpiece (hereinafter simply referred to as a "workpiece") is processed, such as cut, by a laser processing machine, a laser processing head is moved along a desired processing path on the workpiece. In addition, it is well known to display the processing path on a display unit.

[0003] Japanese Patent No. 6506341 discloses that when displaying a processing path, "at least one of the display color of the laser light and the shade of the display color is changed according to the laser output value acquired by the laser output acquisition unit." Summary of the invention

[0004] According to Japanese Patent No. 6506341, when a processing defect occurs, by referring to the display color in the processing path or the shade of the display color, it is possible to determine the position where the laser output is too large or too small.

[0005] However, in actual laser processing, processing defects may occur on the workpiece due to various factors other than the magnitude of the laser output.

[0006] Therefore, a processing path display device that can easily identify the relationship between the processing path and various data related to laser processing is desired.

[0007] According to a first aspect of the present disclosure, there is provided a processing path display device for displaying a processing path in a laser processing machine, wherein the laser processing machine performs laser processing on the workpiece using a laser beam output from the laser processing head while relatively moving a laser processing head and the workpiece via at least one driving axis, the processing path display device comprising: a position information acquisition unit for acquiring position information of each specified control cycle of the at least one driving axis; a laser processing head coordinate calculation unit for calculating coordinate values ​​of the laser processing head based on the position information of the at least one driving axis and information on the mechanical structure of the laser processing machine; a first data acquisition unit for acquiring first data related to the laser processing; a second data acquisition unit for acquiring second data related to the laser processing; and a first display format setting unit for setting the coordinate values ​​of the first data as the coordinate value of the first data. a display form setting unit for setting at least one of the display color of the first data and the shade of the display color as the display form of the second data; a second display form setting unit for setting at least one of the display color of the second data and the shade of the display color as the display form of the second data; and a display unit for displaying the processing path based on the coordinate value of the laser processing head calculated by the laser processing head coordinate calculation unit and the display form set by the first display form setting unit and the second display form setting unit, wherein at least one of the display color of the first data and the shade of the display color is changed according to the first data acquired by the first data acquisition unit, and at least one of the display color of the second data and the shade of the display color is changed according to the second data acquired by the second data acquisition unit.

[0008] In the first aspect, the processing path is displayed after the display formats of the first data and the second data related to laser processing are set according to their respective values. Therefore, the relationship between the processing path and the first data and the second data can be easily recognized.

[0009] The objects, features and advantages of the present invention will become more apparent from the following description of the embodiments in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 This is a functional block diagram of the machining path display device according to the first embodiment.

[0011] Figure 2 This is a flowchart showing the operation of the machining path display device according to the first embodiment.

[0012] Figure 3 It is a figure which shows an example of a processing path.

[0013] Figure 4 is another example of a processing path. Figure 3 Same picture.

[0014] Figure 5 This is a functional block diagram of the machining path display device according to the second embodiment.

[0015] Figure 6 It is a diagram showing still another example of the processing path. DETAILED DESCRIPTION

[0016] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In all the drawings, corresponding components are denoted by common reference numerals.

[0017] Figure 1 is a functional block diagram of the processing path display device based on the first embodiment. Figure 1 As shown, the processing path display device 20 is connected to the laser processing machine 1 via the numerical control device 16 .

[0018] The laser processing machine 1 includes a laser oscillator 2. A laser power sensor 6 for detecting an actual value of an output of an oscillating laser is disposed on the laser oscillator 2. Furthermore, a reflected light acquisition unit 7 for detecting an actual value of reflected light reflected from a workpiece W described later is disposed on a laser processing head 8 of the laser processing machine 1. The reflected light acquisition unit 7 may be a laser power sensor different from the laser power sensor 6.

[0019] The laser output from the laser processing head 8 processes the workpiece W placed on the movable table 9, such as cutting. The movable table 9 can move in the XY plane. The driving axes of the movable table 9 in the X direction and the Y direction are respectively connected to motors, such as servo motors M1 to M2. Position detectors E1 to E2, such as encoders, are respectively arranged on these servo motors M1 to M2 to detect the actual position of the driving axis in each prescribed control cycle. In addition, a gap measuring unit 5, such as a camera, is arranged to measure the distance (gap amount G) between the workpiece W and the front end of the laser processing head 8, and the gap measuring unit 5 is connected to the numerical control device 16.

[0020] In addition, the movable table 9 can be moved in at least one direction, and is provided with a number of drive shafts and motors corresponding to the direction in which it can move. In addition, the following structure can also be adopted: the table on which the workpiece W is mounted is fixed, and the laser processing head 8 is moved in the XY plane by the servo motors M1 and M2.

[0021] The numerical control device 16 includes a processing program 17 for processing the workpiece W using a laser, and controls the laser processing machine 1 according to the processing program 17. The processing program 17 is set to include information on the movement of each drive axis. This information can be appropriately converted and acquired as position information in the position information acquisition unit 21 described later.

[0022] The machining path display device 20 is a digital computer having a CPU, a memory, etc. connected to each other via a bus, etc. The machining path display device 20 includes a position information acquisition unit 21, which acquires position information of at least one driving axis of the movable table 9 for each predetermined control cycle. The position information is obtained based on the machining program 17 or obtained by position detectors E1 and E2 installed on the servo motors M1 and M2 that drive at least one driving axis.

[0023] Furthermore, the processing path display device 20 includes a laser processing head coordinate calculation unit 22, which calculates the coordinate value of the laser processing head 8 according to the position information of at least one driving axis and the information of the mechanical structure of the laser processing machine 1. The processing path display device 20 also includes: a first data acquisition unit 23a, which acquires first data related to laser processing; and a second data acquisition unit 23b, which acquires second data related to laser processing, and the second data is different from the first data.

[0024] The first data acquired by the first data acquisition unit 23a is at least one of the laser output command value of the laser processing head 8 obtained according to the processing program 17 and the actual value of the laser output of the laser processing head 8 obtained using the laser power sensor 6, the actual value of the reflected light obtained using the reflected light acquisition unit 7, or the gap amount G obtained using the gap measurement unit 5. The second data acquired by the second data acquisition unit 23b is also the same as the first data. In addition, the information on the mechanical structure of the laser processing machine 1 mainly refers to the size of the laser processing machine 1.

[0025] When the first data acquisition unit 23a to the second data acquisition unit 23b respectively acquire at least one of the laser output command value of the laser processing head 8 obtained according to the processing program 17 and the actual value of the laser output of the laser processing head 8 obtained using the laser power sensor 6, these first data acquisition units 23a to the second data acquisition units 23b can also be respectively referred to as laser output acquisition units.

[0026] Furthermore, the processing path display device 20 includes: a first display format setting unit 24a, which sets the display format of the first data according to the value of the first data acquired by the first data acquisition unit 23a; and a second display format setting unit 24b, which sets the display format of the second data according to the value of the second data acquired by the second data acquisition unit 23b. Furthermore, the processing path display device 20 includes a display unit 25, which displays the processing path of the laser processing based on the coordinate value of the laser processing head 8 calculated by the laser processing head coordinate calculation unit 22 and the display format set by the first display format setting unit 24a and the second display format setting unit 24b.

[0027] The CPU of the processing path display device 20 functions as a position information acquisition unit 21, a laser processing head coordinate calculation unit 22, a first data acquisition unit 23a, a second data acquisition unit 23b, a first display format setting unit 24a, and a second display format setting unit 24b. In addition, the display unit 25 may be a liquid crystal display, a CRT, or the like.

[0028] Figure 2 1 is a flowchart showing the operation of the machining path display device according to the first embodiment. The following description will be continued assuming that the first data acquisition unit 23 a is the laser power sensor 6 and the second data acquisition unit 23 b is the gap measurement unit 5 .

[0029] First, in Figure 1 In step S1, the position information acquisition unit 21 acquires the position information of each driving axis of the movable table 9 per unit time. The position information may be the position command of each driving axis obtained according to the machining program 17 and / or the actual position of each driving axis detected by the position detectors E1 and E2. For simplicity, the following description assumes that the position information is the position command.

[0030] Next, in step S12, the coordinate calculation unit 22 calculates the coordinates of the laser processing head 8 per unit time based on the position information. When the position information is obtained according to the processing program 17, the coordinates of the laser processing head 8 constitute the command processing path of the laser. In addition, when the position information is obtained by the position detectors E1 and E2, the coordinates of the laser processing head 8 constitute the actual processing path of the laser.

[0031] Next, in step S13a, the first data acquisition unit 23a (laser power sensor 6) acquires first data (actual laser output value) per unit time, and in step S13b, the second data acquisition unit 23b (gap measurement unit 5) acquires second data (gap amount G) per unit time.

[0032] Then, in step S14a, the first display format setting unit 24a sets the display format of the processing path based on the first data obtained in step S13a.

[0033] Here, Figure 3 is a diagram showing an example of a processing path. Figure 3 In FIG. 1 , processing paths A and B composed of a plurality of line segments extending in the X direction and the Y direction are shown juxtaposed with each other. Figure 3The processing path A shown in the figure is composed of line segments A1 to A4, and the processing path B is composed of line segments B1 to B4. Line segments A1, A3 and line segments B1, B3 extend only in the X direction, and line segments A2, A4 and line segments B2, B4 extend only in the Y direction. In addition, line segments A1 to A4 and line segments B1 to B4 may each have components in both the X direction and the Y direction.

[0034] in addition, Figure 3 The arrows shown indicate the direction of travel of the laser processing head 8. Figure 4 , Figure 6 The same is true in .

[0035] exist Figure 3 Tables T1 and T2 are shown at the lower left. Table T1 shows the color shades of the processing path A determined according to the size of the actual laser output value. It is assumed that Table T1 is prepared in advance in the first display format setting unit 24a. Specifically, in Table T1, the laser output value is divided into a plurality of levels, for example, 6 levels. Moreover, the minimum level (~300W) of the laser output value is set to the lightest color, for example, white, and the maximum level (2700W~) of the laser output value is set to the darkest color, for example, black. Moreover, for the levels between them, the color shades are gradually darkened from the lightest color level toward the darkest color level.

[0036] Table T2 shows the color depth of the processing path B determined according to the gap amount G. As described above, in Table T2, the gap amount G is divided into a plurality of levels, for example, 6 levels. Furthermore, the largest level of the gap amount G is set to the lightest color, for example, white, and the smallest level of the gap amount G is set to the darkest color, for example, black.

[0037] In step S14a, the first display mode setting unit 24a sets the color depth of the coordinate value of each control cycle of the laser processing head 8 according to the size of the actual value of the laser output. And in step S14b, the second display mode setting unit 24b sets the color depth of the coordinate value of each control cycle of the laser processing head 8 according to the gap amount G. Figure 3 In the example, the first display mode setting unit 24a and the second display mode setting unit 24b set the shading to change between white and black.

[0038] In an embodiment not shown in the figure, the display mode setting units 24a and 24b may also change the color tone between more colors. For example, the minimum level of the actual laser output value or the gap amount G is set to blue, the maximum level of the actual laser output value or the gap amount G is set to yellow, and the intermediate level between them is set to red. In addition, the color tone may be gradually changed between the blue level and the red level and between the red level and the yellow level.

[0039] Refer again Figure 2 In step S15, the display unit 25 displays the processing path A and the processing path B based on the coordinate values ​​of the laser processing head 8, the first display format, and the second display format. Figure 3 As shown, processing path A and processing path B are displayed after the laser display form, such as color depth, is set according to the actual value of laser output and gap amount G. Due to this structure, it can be seen that the operator can intuitively recognize the relationship between the processing path and the laser output and gap amount G.

[0040] For example, in Figure 3 In FIG. 1 , it can be understood that the laser output is reduced at the corner of the processing path A, that is, at the connecting portion of each line segment A1 to A4. Figure 3 In the figure, line segment A2 is shorter than other line segments A1, A3, and A4. As a result, line segment A2 does not have the lightest color level with the maximum laser output value. In other words, since the distance of line segment A2 is short, it can be understood that the highest laser output cannot be presented at line segment A2.

[0041] In addition, the surface of the workpiece W to be laser processed is not always smooth, and there is a case where the surface is wavy. In this case, when laser processing is performed along the processing paths A and B, the laser processing head 8 collides with the workpiece W, thereby damaging the laser processing head 8 or causing processing defects on the workpiece W.

[0042] In this regard, Figure 3 In the embodiment of the present invention, the gap amount G between the laser processing head 8 and the workpiece W can be identified in a manner associated with the processing path B. For example, referring to a portion B11 of the line segment B1 of the processing path B, it can be understood that the workpiece W is undulating in a state where the gap amount G is small at this position. Therefore, in the case where the laser processing head 8 collides with the workpiece W, it can be easily understood that the collision position of the laser processing head 8 is the portion B11. Therefore, for the next workpiece, the collision between the laser processing head 8 and the workpiece W can be avoided by partially raising the position of the laser processing head 8 relative to the workpiece W or smoothing the workpiece W in advance.

[0043] For this purpose, a servo motor M3 and an encoder E3 (not shown) mounted on the servo motor M3 may be provided to drive the movable table 9 in the Z direction. In this case, the collision between the laser processing head 8 and the workpiece W can be avoided by partially lowering the movable table 9.

[0044] Figure 4 is another example of a processing path. Figure 3In this case, the first data acquisition unit 23 a is the laser power sensor 6 , and the second data acquisition unit 23 b is the reflected light acquisition unit 7 . Figure 4 Table T3 shows the color depth of the processing path C determined according to the magnitude of the reflected light. As described above, in Table T3, the magnitude of the reflected light is divided into a plurality of levels, for example, 6 levels. Furthermore, the smallest level of the reflected light is set to the lightest color, for example, white, and the largest level of the reflected light is set to the darkest color, for example, black. Figure 4 Process and reference of processing paths A and C Figure 2 The description is the same, so the re-description is omitted.

[0045] For example, when laser processing is performed, there is a case where the reflected light reflected by the laser on the workpiece W enters the laser processing head 8, thereby damaging the laser processing head 8 and the laser oscillator 2. However, the size of the reflected light varies not only according to the processing paths A, B, and the actual value of the laser output, but also according to the shape of the laser processing head 8 and the type of the workpiece W, so the operator is generally unable to predict the size of the reflected light. Therefore, the reflected light may change significantly in a place where the operator does not expect. In addition, if the laser processing head 8 and the laser oscillator 2 are damaged by the reflected light, the result is that processing defects may occur on the workpiece W.

[0046] In this regard, Figure 4 In the embodiment, the reflected light can be identified in a manner associated with the processing path C. For example, referring to a portion C31 of the line segment C3 and a portion C41 of the line segment C4 of the processing path C, it can be understood that when the laser processing head 8 rotates in the clockwise direction, the reflected light locally increases. Therefore, in the case where the laser processing head 8 and the laser oscillator 2 are damaged by the reflected light, it can be easily understood that the position where the laser processing head 8 is damaged is the portion C31 and C41. Therefore, for the next workpiece W, by locally reducing the laser output at the portion C31 and C41, etc., it is possible to avoid damage to the laser processing head 8 and the laser oscillator 2.

[0047] Figure 5 It is a functional block diagram of the processing path display device based on the second embodiment. Figure 5The processing path display device 20 shown is configured to be connected to the laser processing machine 1 via the numerical control device 16. The processing path display device 20 includes a third data acquisition unit 23c in addition to the first data acquisition unit 23a and the second data acquisition unit 23b. The third data acquired by the third data acquisition unit 23c may be the same as the first data and the second data described above. Furthermore, the processing path display device 20 includes a third display form setting unit 24c in addition to the first display form setting unit 24a and the second display form setting unit 24b. The CPU of the processing path display device 20 functions as the third data acquisition unit 23c and the third display form setting unit 24c.

[0048] and, Figure 6 2 is a diagram showing another example of a processing path. In this case, the first data acquisition unit 23a is the laser power sensor 6, the second data acquisition unit 23b is the gap measurement unit 5, and the third data acquisition unit 23c is the reflected light acquisition unit 7. Figure 6 Process and reference of processing paths A, B, C Figure 2 The description is the same, so the re-description is omitted.

[0049] exist Figure 6 It can be understood that the laser output is extremely small at A31, a part of the line segment A3 of the processing path A. In addition, similarly to the above, at B11, a part of the line segment B1 of the processing path B, the workpiece W is undulating with a small gap amount G. Furthermore, at C31, a part of the line segment C3 of the processing path C and C41, a part of the line segment C4, the reflected light is locally increased.

[0050] Therefore, when the workpiece W is poorly processed, it can be immediately determined that the cause of the poor processing is the laser output, the reflected light, or the size of the gap based on the location where the poor processing occurred. That is, in the second embodiment, three amounts of information are included through the processing paths A, B, and C, so the operator can more clearly and quickly determine the cause of the poor processing. In addition, it is within the scope of the present invention to have more data acquisition units and display format setting units.

[0051] In addition, as described above, the laser output acquisition unit (first data acquisition unit 23a to third data acquisition unit 23c) acquires the laser output command value or the laser output actual value. Therefore, the display unit 25 displays the processing path A using a display format determined according to the laser output command value, or displays the processing path A using a display format determined according to the laser output actual value. Therefore, the relationship between the laser output command value or the laser output actual value and the processing path A can be easily identified. In addition, it can also be set that the laser output acquisition unit acquires the deviation between the laser output command value and the laser output actual value, and displays it together with the processing path in the same way as described above.

[0052] Furthermore, when the position information is obtained as the position command obtained according to the processing program 17, the relationship between the laser output and the processing path composed of the command position can be easily recognized. Similarly, when the position information is obtained as the actual position obtained by the position detectors E1 and E2, the relationship between the laser output and the processing path composed of the actual position can be easily recognized.

[0053] The method disclosed herein

[0054] According to a first embodiment, a processing path display device (20) is provided for displaying a processing path of a laser processing machine (1), wherein the laser processing machine performs laser processing on the processing object using a laser beam output from the laser processing head while relatively moving a laser processing head (8) and a processing object (W) via at least one driving axis. The processing path display device comprises: a position information acquisition unit (21) for acquiring position information of each specified control cycle of the at least one driving axis; a laser processing head coordinate calculation unit (22) for calculating the coordinate value of the laser processing head based on the position information of the at least one driving axis and information on the mechanical structure of the laser processing machine; a first data acquisition unit (23a) for acquiring first data related to the laser processing; a second data acquisition unit (23b) for acquiring second data related to the laser processing; a first display format setting unit (23c) for acquiring a plurality of display modes; and a plurality of display modes for setting the display mode. 4a), which sets at least one of the display color of the first data and the shade of the display color as the display form of the first data; a second display form setting unit (24b), which sets at least one of the display color of the second data and the shade of the display color as the display form of the second data; and a display unit (25), which displays the processing path based on the coordinate value of the laser processing head calculated by the laser processing head coordinate calculation unit and the display form set by the first display form setting unit and the second display form setting unit, wherein at least one of the display color of the first data and the shade of the display color is changed according to the first data acquired by the first data acquisition unit, and at least one of the display color of the second data and the shade of the display color is changed according to the second data acquired by the second data acquisition unit.

[0055] According to the second method, in the first method, the first data acquisition unit is a laser output acquisition unit (6) for acquiring a laser output value of the laser output from the laser processing head, and the second data acquisition unit is a reflected light acquisition unit (7) for acquiring reflected light reflected back by the laser on the workpiece.

[0056] According to the third embodiment, in the first embodiment, the first data acquisition unit is a laser output acquisition unit (6) that acquires the laser output value of the laser output from the laser processing head, and the second data acquisition unit is a gap measurement unit (5) that measures the gap between the laser processing head and the workpiece.

[0057] According to the fourth embodiment, in the first embodiment, the processing path display device further comprises: a third data acquisition unit (23c), which acquires third data related to the laser processing; and a third display format setting unit (24c), which sets at least one of the display color of the third data and the shade of the display color as the display format of the third data, wherein the display unit displays the processing path based on the coordinate value of the laser processing head and the display format set by the first display format setting unit, the second display format setting unit and the third display format setting unit, and at least one of the display color of the third data and the shade of the display color is changed according to the third data acquired by the third data acquisition unit.

[0058] According to the fifth method, in the fourth method, the first data acquisition unit is a laser output acquisition unit (6) for acquiring a laser output value of the laser output from the laser processing head, the second data acquisition unit is a reflected light acquisition unit (7) for acquiring reflected light reflected back from the laser on the workpiece, and the third data acquisition unit is a gap measurement unit (5) for measuring a gap between the laser processing head and the workpiece.

[0059] According to the sixth method, in any one of the second, third, and fifth methods, the laser output value acquired by the laser output acquisition unit is the laser output command value of the laser processing head calculated according to the processing program, the actual laser output value of the laser processing head calculated using a laser power sensor, or the deviation between the laser output command value and the actual laser output value.

[0060] According to the seventh method, in any one of the first to sixth methods, the position information acquired by the position information acquisition unit is position information obtained based on a processing program for processing the workpiece using the laser, or position information obtained by a position detector for detecting the actual position of the at least one drive axis.

[0061] Effect of method

[0062] In the first aspect, the processing path is displayed after the display formats of the first data and the second data related to laser processing are set according to their respective values. Therefore, the relationship between the processing path and the first data and the second data can be easily recognized.

[0063] In the second method, the position of the laser processing head when the reflected light may damage the laser processing head or the laser oscillator can be easily grasped. Therefore, for the next workpiece, the laser processing head or the laser oscillator can be prevented from being damaged by partially reducing the laser output.

[0064] In the third embodiment, the position of the laser processing head when it may collide with the workpiece can be easily grasped. Therefore, for the next workpiece, the position of the laser processing head is locally raised relative to the workpiece or the workpiece is smoothed in advance, thereby avoiding the collision between the laser processing head and the workpiece.

[0065] In the fourth aspect, the processing path is displayed after the display format of the third data is set according to the value of the third data related to the laser processing, so that the relationship between the processing path and the third data can be recognized. Therefore, when a processing defect occurs on the workpiece, it can be immediately determined which of the first to third data is the cause of the processing defect.

[0066] In the fifth aspect, when a machining defect occurs on a workpiece, in addition to being able to immediately determine the location where the machining defect occurs, it is also possible to immediately determine whether the cause of the machining defect is the laser output, reflected light, or the size of the gap.

[0067] In the sixth aspect, the relationship between the laser output command value or the laser output actual value and the processing path can be easily recognized.

[0068] In the seventh mode, the position information obtained from the machining program is the position command, and the position information obtained by the position detector is the actual position. The relationship between the laser output and the machining path composed of the command position and the relationship between the laser output and the machining path composed of the actual position can be easily identified.

[0069] Although the embodiments of the present invention have been described above, it will be apparent to those skilled in the art that various modifications and changes can be made without departing from the scope of the disclosure of the above claims.

Claims

1. A processing path display device for displaying a plurality of processing paths arranged side by side in a laser processing machine, wherein the laser processing machine performs laser processing on the workpiece using a laser beam output from the laser processing head while relatively moving a laser processing head and the workpiece via respective drive axes, wherein the number of the drive axes corresponds to the number of movable directions for processing the workpiece, the processing path display device comprising: a position information acquisition unit configured to acquire position information of each of the drive shafts in each predetermined control cycle; a laser processing head coordinate calculation unit, which calculates the coordinate value of the laser processing head per unit time according to the information of the mechanical structure of the laser processing machine and the acquired position information of each driving axis; a first data acquisition section that acquires the first data per unit time related to the laser processing, wherein the first data per unit time is a laser output value of the laser output from the laser processing head; a second data acquisition unit that acquires the second data per unit time related to the laser processing, wherein the second data per unit time is data different from the first data per unit time, and wherein the second data per unit time is at least one of an amount of a gap between the laser processing head and the workpiece and reflected light reflected by the laser on the workpiece; a first display form setting unit for setting at least one of a display color of the first data per unit time and a shade of the display color as a display form of the first data per unit time for each of the prescribed control cycles of the plurality of processing paths, wherein the shade of the display color of the plurality of processing paths along each of the prescribed control cycles corresponds to a magnitude level of the first data per unit time from the laser processing head; a second display form setting unit for setting at least one of a display color of the second data per unit time and a shade of the display color as a display form of the second data per unit time for each of the prescribed control cycles of the plurality of processing paths, wherein the shade of the display color of the second data along the plurality of processing paths for each of the prescribed control cycles corresponds to a size level of the second data per unit time; as well as a display unit that displays the juxtaposed processing paths for each of the prescribed control cycles for the first data per unit time and the second data per unit time based on the coordinate values ​​of the laser processing head calculated by the laser processing head coordinate calculation unit, and displays the display forms corresponding to the first data per unit time and the second data per unit time, respectively; wherein at least one of a display color of the first data per unit time and a shade of the display color of the first data per unit time is changed according to the size level of the first data per unit time acquired by the first data acquisition unit, and at least one of a display color of the second data per unit time and a shade of the display color of the second data per unit time is changed according to the size level of the second data per unit time acquired by the second data acquisition unit, The display form of each of the plurality of processing paths for each of the predetermined control cycles provides a visual relationship between the laser output of the first data per unit time and at least one of the gap amount and the reflected light of the second data per unit time.

2. The processing path display device according to claim 1, wherein: The processing path display device also has: a third data acquisition unit that acquires the third data per unit time related to the laser processing; and a third display form setting unit, which sets at least one of a display color of the third data per unit time and a shade of the display color as a display form of the third data per unit time, wherein the shade of the display color of the third data per unit time along the plurality of processing paths in each of the prescribed control cycles corresponds to a size level of the third data per unit time, wherein the display unit displays the plurality of processing paths for each of the prescribed control cycles based on the coordinate value of the laser processing head, the display form of the first data per unit time, the display form of the second data per unit time, and the display form of the third data per unit time; and At least one of a display color of the third data per unit time and a shade of the display color is changed based on the third data per unit time acquired by the third data acquisition unit.

3. The processing path display device according to claim 2, wherein: The second data per unit time acquired by the second data acquisition unit is reflected light of the laser beam reflected from the workpiece. The third data per unit time acquired by the third data acquisition unit is the amount of gap between the laser processing head and the workpiece.

4. The processing path display device according to claim 1, wherein: The laser output value acquired by the first data acquisition unit is the laser output command value of the laser processing head obtained according to the processing program, the actual laser output value of the laser processing head obtained using a laser power sensor, or the deviation between the laser output command value and the actual laser output value.

5. The processing path display device according to claim 1, wherein: The position information acquired by the position information acquisition unit is position information obtained based on a processing program for processing the workpiece using the laser, or position information obtained by a position detector for detecting an actual position of each drive shaft.

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