Multi-laser head engraving device and engraving method thereof

Through multi-laser head engraving devices and corresponding engraving methods, the problems of inefficiency and missed detection of traditional devices on high-speed production lines are solved, and fast and efficient engraving and accurate quality inspection are achieved.

CN112091439BActive Publication Date: 2025-03-21SHENZHEN EARAIN AUTOMATION EQUIP CO LTD
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Patent Information

Application Number
CN202011049358.5
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2020-09-29
Publication Date
2025-03-21
Estimated Expiration
2040-09-29

AI Technical Summary

Technical Problem

Traditional laser engraving devices are difficult to meet the speed requirements on production lines with high speed requirements, and there are problems of inefficiency and missed detection, and it is impossible to intuitively analyze the engraving quality.

Method used

Multi-laser head engraving device is adopted, including a base, a conveying track mechanism, a three-dimensional positioning mechanism, a laser, an engraving mechanism and a control module. Real-time height focus and quality detection are achieved through vacuum adsorption devices.

Benefits of technology

It improves the engraving speed and efficiency, avoids batch engraving of parts of different heights, enhances the accuracy and intuitiveness of inspection, and improves the engraving quality.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present invention relates to a multi-laser head engraving device and an engraving method, wherein the multi-laser head engraving device includes a base, a conveying track mechanism, a three-dimensional positioning mechanism, a laser, an engraving mechanism, and a control module, wherein the conveying track mechanism is fixed on the base through an opposing pulley fixing plate, the three-dimensional positioning mechanism is slidably mounted on a bracket, the laser is fixed on the bracket, the engraving mechanism is mounted on the three-dimensional positioning mechanism and performs XYZ three-dimensional movement under the action of the three-dimensional positioning mechanism, and the laser emitted by the laser falls into a substrate after multiple refractions to engrave the substrate. This device combined with the engraving method can solve the problems existing in traditional engraving equipment, improve the processing speed and efficiency of the substrate, and can also detect while engraving. When outputting the substrate, the PLC controller simultaneously outputs the engraving quality, and the quality of substrate engraving is intuitively understood.
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Description

Technical Field

[0001] The invention relates to the field of laser engraving, and in particular to a multi-laser head engraving device and an engraving method thereof. Background Art

[0002] At present, the normal operation of laser engraving devices can be divided into three stages. The first is the board placement stage. In order to ensure the consistency of engraving depth, the substrate must be placed horizontally, and it is necessary to ensure that there are no bumps on the surface of the board, and at the same time, the surface of each board must be flat; the second is the engraving process stage. If the heights of the parts on the substrate are inconsistent, it is necessary to manually measure the height of each part. If the heights are not uniform, engraving must be carried out in batches; the third is the detection stage. Traditional engraving devices usually have cameras installed on the side or front of the laser. When the engraving is completed and the substrate needs to be detected, the motor needs to be used to move the detection in the XY direction again, and the detection is also limited to the plane detection of the substrate.

[0003] Nowadays, in production lines with high speed requirements, traditional engraving equipment can hardly meet the speed requirements, and there are problems of low efficiency, missed detection during inspection, and the quality of engraving cannot be analyzed intuitively. Summary of the invention

[0004] The purpose of the present invention is to provide a multi-laser head engraving device that solves the problem that traditional engraving equipment has a slow engraving speed and needs to engrave parts of different heights in batches. Another purpose of the present invention is to provide an engraving method for a multi-laser head engraving device that can change the engraving and focusing and can calculate the final quality of the substrate.

[0005] The technical solution of the present invention is: a multi-laser head engraving device, which is special in that it includes a base, a conveying track mechanism, a three-dimensional positioning mechanism, a laser, an engraving mechanism, and a control module. The conveying track mechanism is fixed to the base through opposing pulley fixing plates, the three-dimensional positioning mechanism is slidably installed on the bracket, the laser is fixed on the bracket, the engraving mechanism is installed on the three-dimensional positioning mechanism and performs XYZ three-dimensional movement under the action of the three-dimensional positioning mechanism. The laser emitted by the laser falls into the substrate from the engraving mechanism after multiple refractions to engrave the substrate.

[0006] Preferably: the conveying track mechanism includes opposing pulley fixing plates, a plurality of pulleys fixed on the inner side of the pulley fixing plates and arranged in parallel and connected by belts, a conveying motor fixed on the outer side of the pulley fixing plates and the output shaft is key-connected with the pulley, sensors fixed on the inner side of the pulley fixing plates and located at the feed end and the discharge end respectively, a plurality of first positioning cylinders and second positioning cylinders fixed between the two pulley fixing plates, and the conveying track mechanism also includes a vacuum adsorption mechanism, and the vacuum adsorption mechanism is arranged between the first positioning cylinder and the second positioning cylinder.

[0007] Preferably, the vacuum adsorption mechanism comprises a plurality of lifting cylinders fixed on a base and a vacuum adsorption base connected to the ends of the piston rods of the lifting cylinders, and the substrate stops above the vacuum adsorption mechanism under the action of the first positioning cylinder and the second positioning cylinder.

[0008] Preferably, the base is symmetrically provided with a pair of brackets on both sides of the conveying track mechanism, the left and right brackets are respectively connected by crossbeams, a Y-axis linear slide rail is fixed on the crossbeam, the lasers are respectively fixed on the top of each bracket, and the expansion mirrors of the lasers on the same side are relatively arranged.

[0009] As a preference: the three-dimensional positioning mechanism is installed as a whole on the Y-direction linear slide rails on both sides through the Y-direction linear slider, and the three-dimensional positioning mechanism includes an X-direction beam installed between the Y-direction linear slide rails on both sides through the Y-direction linear slider, a Y-direction linear motor installed on the side of the bracket, an X-direction linear slide rail fixed on the side of the X-direction beam, an X-direction linear motor fixed above the X-direction beam, and a Z-direction lifting device slidably installed on the X-direction linear slide rail;

[0010] The Z-direction lifting device comprises a fixed seat, a Z-direction lifting rail mounted on the fixed seat, a rotating motor fixed on the fixed seat, and a linear screw connected to the output shaft of the rotating motor through a coupling. The engraving mechanism is slidably mounted on the Z-direction lifting rail through a Z-direction slider fixed on the bottom surface of the connecting plate. A nut seat is also fixed on the bottom surface of the connecting plate. A nut fixed at the center of the nut seat is sleeved on the linear screw. The engraving mechanism as a whole moves up and down along the Z-direction lifting rail under the action of the rotating motor.

[0011] Refraction columns for refracting laser light output by the laser are protruding from the side walls of the X-axis crossbeam at both ends.

[0012] Preferably, the engraving mechanism comprises a galvanometer fixed on the connecting plate, a spectrometer installed on the side of the galvanometer, a camera installed vertically above the spectrometer, a field lens installed below the galvanometer, a smoke processor fixed below the field lens, and a light source installed below the smoke processor, and a three-dimensional sensor is also installed on the side of the smoke processor;

[0013] The laser emits laser, which is refracted by the refraction column and then input into the spectrometer. The spectrometer transmits the light in a straight line to the galvanometer. After the X and Y movements in the galvanometer are reflected to the field mirror, the field mirror transmits the light through the smoke processor and then through the light source to engrave the substrate.

[0014] Preferably, the control module is a PLC controller, which is connected to the feed sensor, the discharge sensor, the camera, and the three-dimensional sensor control, and is connected to the X-axis linear motor, the Y-axis linear motor, the rotary motor, the first positioning cylinder, the second positioning cylinder, the lifting cylinder, and the laser control.

[0015] Another technical solution of the present invention is: an engraving method of a multi-laser head engraving device, which is special in that it specifically includes the following steps:

[0016] ⑴ The staff presets the engraving operation program and substrate quality calculation program into the PLC controller;

[0017] ⑵The substrate enters the track conveying mechanism from the feed end under the action of the belts on both sides;

[0018] ⑶ After the feed sensor senses the substrate entering, it transmits a signal to the PLC controller, and the PLC controller controls the second positioning cylinder to rise to block the substrate from moving toward the discharge end, and then the first positioning cylinder rises, and the first positioning cylinder and the second positioning cylinder clamp the substrate to achieve positioning of the substrate;

[0019] (4) The lifting cylinder rises, and the vacuum adsorption base rises until it contacts the bottom surface of the substrate, and the substrate is vacuum adsorbed to achieve flatness adsorption of the substrate;

[0020] ⑸ The camera takes a thumbnail scan of the substrate and transmits a signal to the PLC controller. The 3D sensor transmits a signal of the current height of the substrate to the PLC controller. The PLC controller controls the lifting cylinder to perform basic height correction on the substrate.

[0021] (6) The PLC controller reads the preset software program according to the thumbnail to control the X-axis linear motor, Y-axis linear motor, rotary motor, and laser to work. The PLC controller controls the lifting cylinder to lift according to the preset software program, thereby completing the real-time height focus of the substrate;

[0022] (6) The laser emits laser light, which is refracted by the refraction column and then input into the spectrometer. The spectrometer transmits the light in a straight line to the galvanometer. The light is reflected to the field mirror through the X and Y movements in the galvanometer. The field mirror transmits the light through the smoke processor and then through the light source to engrave the substrate. The smoke processor absorbs the smoke generated during the engraving process.

[0023] ⑺The camera moves three-dimensionally with the engraving mechanism to shoot the substrate, and outputs the image features of the substrate to the PLC controller. The PLC controller calculates the substrate quality according to the preset software and outputs it to the next process;

[0024] ⑼After the engraving program is completed, the PLC controller controls the laser to stop working, the PLC controller controls the three-dimensional positioning mechanism to reset, the first positioning cylinder, the second positioning cylinder, and the lifting cylinder to reset, and the substrate is transported to the discharge end under the action of the belts on both sides;

[0025] ⑽When the discharge sensor senses that the substrate has left the conveyor track mechanism, a new substrate enters the conveyor track mechanism from the feed end to start engraving the next substrate.

[0026] Compared with the prior art, the present invention has the following beneficial effects:

[0027] ⑴ The bottom surface of the substrate is flattened by a vacuum adsorption device to prevent the substrate from bending during the engraving process, thereby improving the engraving quality of the substrate;

[0028] (2) During engraving, the 3D sensor transmits signals to the PLC controller, which controls the lifting cylinder to focus the height of the substrate in real time, thereby improving the engraving efficiency and eliminating the need for batch engraving of different heights;

[0029] ⑶ The lasers set at the four corners work simultaneously, which has the characteristics of fast processing speed, high precision and high efficiency, and can detect while engraving, thus improving the working efficiency of the equipment engraving;

[0030] ⑷After engraving, the camera takes a picture of the substrate and transmits it to the PLC controller for calculation, effectively and intuitively detecting the quality of the engraved substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 It is a schematic diagram of the structure of a multi-laser head engraving device;

[0032] Figure 2 It is a schematic diagram of the structure of the multi-laser head engraving device in another direction;

[0033] Figure 3 It is a structural schematic diagram of the conveyor track mechanism;

[0034] Figure 4 It is a structural schematic diagram of a three-dimensional positioning mechanism;

[0035] Figure 5 It is a schematic diagram of the structure after the Z-axis lifting device and the engraving mechanism are combined;

[0036] Figure 6 It is a schematic diagram of the laser route of the laser emitting laser light;

[0037] Figure 7 It is a flowchart of the engraving process of a multi-laser head engraving device.

[0038] Main component symbols

[0039] 1 Base 11Stand 2 track conveying mechanism 21 Pulley fixing plate 22 Pulley 23 belt 24 conveyor motor 25 Feed sensor 26 discharge sensor 27First positioning cylinder 28 Second positioning cylinder 291 lifting cylinder 292 Vacuum adsorption base 3D positioning mechanism 311Y linear guide 312Y linear slider 313Y linear motor 321X beam 322X linear guide rail 323X linear motor 324 Refraction Column 331 fixed seat 332Z lifting slide rail 333 Rotating motor 334 coupling 335 linear screw 336Z slider 4 Lasers 41 digital microscope 5 Engraving mechanism 51 connection plate 52 galvanometer 53 Spectroscopic Device 54 Camera 55 scenes 56 Smoke and dust processor 57 Light Source 58 3D sensor 6 substrates DETAILED DESCRIPTION

[0040] The present invention will be further described below in conjunction with the accompanying drawings:

[0041] The preferred embodiments of the present invention are described in detail below in conjunction with the accompanying drawings so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making a clearer and more explicit definition of the protection scope of the present invention. The directional terms mentioned in the present invention, such as "up", "down", "front", "back", "left", "right", "top", "bottom", etc., are only referenced to the directions of the attached drawings. Therefore, the directional terms used are used to illustrate and understand the present invention, rather than to limit the present invention.

[0042] See also Figure 1 , Figure 2 As shown, a multi-laser head engraving device includes a base 1, a conveying track mechanism 2, a three-dimensional positioning mechanism 3, a laser 4, an engraving mechanism 5, and a control module.

[0043] See also Figure 1 , Figure 3 As shown, the conveying track mechanism 2 is fixed on the base 1 as a whole through the opposed pulley fixing plates 21, and the conveying track mechanism 2 includes the opposed pulley fixing plates 21, a plurality of pulleys 22 fixed on the inner side of the pulley fixing plates 21 and arranged in parallel and connected by a belt 23, a conveying motor 24 fixed on the outer side of the pulley fixing plates 21 and having an output shaft key-connected with the pulley 22, a feed sensor 25 fixed on the inner side of the pulley fixing plates 21 and located at the feed end, and a discharge sensor 26 located at the discharge end, a plurality of first positioning cylinders 27 and a second positioning cylinder 28 fixed between the two pulley fixing plates 21, and the conveying track mechanism 2 also includes a vacuum adsorption mechanism, which is arranged between the first positioning cylinder 27 and the second positioning cylinder 28;

[0044] The vacuum adsorption mechanism includes a plurality of lifting cylinders 291 fixed on the base 1 and a vacuum adsorption base 292 connected to the piston rod end of the lifting cylinder 291. The substrate 6 is positioned directly above the vacuum adsorption mechanism under the action of the first positioning cylinder 27 and the second positioning cylinder 28. The vacuum adsorption base 292 rises under the action of the plurality of lifting cylinders 291, contacts the substrate 6 and adsorbs the substrate 6 for flatness.

[0045] See also Figure 1 , Figure 2, Figure 4 As shown, the base 1 is symmetrically fixed with a pair of brackets 11 on both sides of the conveying track mechanism 2, and the brackets on the left and right sides are connected to each other by a crossbeam, and a Y-direction linear slide 31 is fixed on the crossbeam. The lasers 4 are respectively fixed on the top of the four brackets 11, and the expansion mirrors 41 of the lasers 4 on the same side are arranged oppositely, and the Y-direction linear slide 311 is located between the two lasers 4 on the same side;

[0046] The three-dimensional positioning mechanism 3 is installed on the Y-direction linear slide rails 311 on both sides through the Y-direction linear slider 312 as a whole. The three-dimensional positioning mechanism 3 includes an X-direction beam 321 installed between the Y-direction linear slide rails 311 on both sides through the Y-direction linear slider 312, a Y-direction linear motor 313 installed on the side of the bracket 11, an X-direction linear slide rail 322 fixed on the side of the X-direction beam 321, an X-direction linear motor 323 fixed above the X-direction beam 321, and a Z-direction lifting device 33 slidably installed on the X-direction linear slide rail 322;

[0047] The X-axis crossbeam 321 has side walls at both ends thereof protrudingly provided with refraction columns 324 for refracting the laser light output by the laser 4 at positions corresponding to the positions of the amplification mirrors 41 of the laser 4 .

[0048] See also Figure 1 , Figure 2 , Figure 5 As shown, the Z-direction lifting device 33 includes a fixed seat 331, a Z-direction lifting rail 332 installed on the fixed seat 331, a rotating motor 333 fixed on the fixed seat 331, and a linear screw 335 connected to the output shaft of the rotating motor through a coupling 334. The engraving mechanism 5 is slidably installed on the Z-direction lifting rail through a Z-direction slider 336 fixed on the bottom surface of the connecting plate 51. A nut seat is also fixed on the bottom surface of the connecting plate 51. The nut fixed at the center of the nut seat is sleeved on the linear screw 335. The engraving mechanism 5 as a whole moves up and down along the Z-direction lifting rail under the action of the rotating motor.

[0049] The engraving mechanism 5 performs XYZ three-dimensional movement under the action of the three-dimensional positioning mechanism 3 to engrave and scan the substrate;

[0050] The engraving mechanism 5 includes a galvanometer 52 fixed on a connecting plate 51, a spectrometer 53 installed on the side of the galvanometer 52, a camera 54 installed vertically above the spectrometer 53, a field lens 55 installed below the galvanometer 52, a smoke processor 56 fixed below the field lens 55, and a light source 57 installed below the smoke processor 56. A three-dimensional sensor 58 is also installed on the side of the smoke processor 56.

[0051] See also Figure 6As shown, the laser 4 emits laser light through the expansion mirror 41, which is refracted by the refraction column 324 and then input into the spectrometer 53. The spectrometer 53 transmits the light in a straight line to the galvanometer 52, and the light is reflected to the field lens 55 through the X and Y movement in the galvanometer 52. The field lens 55 transmits the light through the smoke processor 56 and then through the light source 57 to engrave the substrate 6. At the same time, the camera 54 also receives part of the laser light through the refraction of the spectrometer 53.

[0052] See also Figure 7 As shown, the engraving method of the multi-laser head engraving device specifically includes the following steps:

[0053] ⑴ The staff presets the engraving operation program and substrate quality calculation program into the PLC controller;

[0054] ⑵The substrate enters the track conveying mechanism from the feed end under the action of the belts on both sides;

[0055] ⑶ After the feed sensor senses the entry of the substrate, it transmits a signal to the PLC controller, and the PLC controller controls the second positioning cylinder to rise to block the substrate from moving toward the discharge end, and then the first positioning cylinder rises, and the substrate is clamped between the first positioning cylinder and the second positioning cylinder to achieve positioning of the substrate;

[0056] (4) The lifting cylinder rises, and the vacuum adsorption base rises until it contacts the bottom surface of the substrate, and the substrate is vacuum adsorbed to achieve flatness adsorption of the substrate;

[0057] ⑸ The camera takes a thumbnail scan of the substrate and transmits a signal to the PLC controller. The 3D sensor transmits a signal of the current height of the substrate to the PLC controller. The PLC controller controls the lifting cylinder to perform basic height correction on the substrate.

[0058] (6) The PLC controller reads the preset software program according to the thumbnail to control the X-axis linear motor, Y-axis linear motor, rotary motor, and laser to work. The PLC controller controls the lifting cylinder to lift according to the preset software program, thereby completing the real-time height focus of the substrate;

[0059] (6) The laser emits laser light, which is refracted by the refraction column and then input into the spectrometer. The spectrometer transmits the light in a straight line to the galvanometer. The light is reflected to the field mirror through the X and Y movements in the galvanometer. The field mirror transmits the light through the smoke processor and then through the light source to engrave the substrate. The smoke processor absorbs the smoke generated during the engraving process.

[0060] ⑺The camera moves three-dimensionally with the engraving mechanism to shoot the substrate, and outputs the image features of the substrate to the PLC controller. The PLC controller calculates the substrate quality according to the preset software and outputs it to the next process;

[0061] ⑼After the engraving program is completed, the PLC controller controls the laser to stop working, the PLC controller controls the three-dimensional positioning mechanism to reset, the first positioning cylinder, the second positioning cylinder, and the lifting cylinder to reset, and the substrate is transported to the discharge end under the action of the belts on both sides;

[0062] ⑽When the discharge sensor senses that the substrate has left the conveyor track mechanism, a new substrate enters the conveyor track mechanism from the feed end to start engraving the next substrate.

[0063] The above description is only a preferred embodiment of the present invention. All equivalent changes and modifications made within the scope of the claims of the present invention should fall within the scope of the claims of the present invention.

Claims

1. A multi-laser head engraving device, characterized in that: It includes a base, a conveying track mechanism, a three-dimensional positioning mechanism, a laser, an engraving mechanism, and a control module. The conveying track mechanism is fixed to the base through an opposing pulley fixing plate. The three-dimensional positioning mechanism is slidably installed on the bracket. The three-dimensional positioning mechanism includes an X-axis beam installed between the Y-axis linear slide rails on both sides through a Y-axis linear slider, a Y-axis linear motor installed on the side of the bracket, an X-axis linear slide rail fixed on the side of the X-axis beam, an X-axis linear motor fixed above the X-axis beam, and a Z-axis lifting device slidably installed on the X-axis linear slide rail; the Z-axis lifting device includes a fixed seat, a Z-axis lifting slide rail installed on the fixed seat, a rotating motor fixed on the fixed seat, and a linear screw connected to the output shaft of the rotating motor through a coupling; the engraving mechanism is installed on the three-dimensional positioning mechanism and is operated by the three-dimensional positioning mechanism. XYZ three-dimensional movement, the role of the three-dimensional positioning mechanism is specifically reflected in that the three-dimensional sensor transmits the current height of the substrate to the PLC controller, and the PLC controller controls the lifting cylinder to work and corrects the basic height of the substrate; the LC controller reads the preset software program according to the thumbnail to control the X-axis linear motor, the Y-axis linear motor, the rotary motor, and the laser to work, and the PLC controller controls the lifting cylinder to lift according to the preset software program, thereby completing the real-time height focusing of the substrate; the laser is fixed on the bracket, and the laser is respectively fixed on the top of each bracket, and the expansion mirrors of the lasers on the same side are arranged relatively; the three-dimensional positioning mechanism is installed on the Y-axis linear slide rails on both sides through the Y-axis linear slider, and the laser emitted by the laser falls into the substrate from the engraving mechanism after multiple refractions to engrave the substrate.

2. The multi-laser head engraving device according to claim 1, characterized in that: The conveying track mechanism includes opposed pulley fixing plates, a plurality of pulleys fixed on the inner side of the pulley fixing plates and arranged in parallel and connected by belts, a conveying motor fixed on the outer side of the pulley fixing plates and having an output shaft key-connected to the pulley, and sensors fixed on the inner side of the pulley fixing plates and respectively located at the feed end and the discharge end.

3. The multi-laser head engraving device according to claim 1, characterized in that: The engraving mechanism is slidably installed on the Z-direction lifting rail through a Z-direction slider fixed on the bottom surface of the connecting plate. A nut seat is also fixed on the bottom surface of the connecting plate. A nut fixed in the center of the nut seat is sleeved on a linear screw rod. The engraving mechanism as a whole moves up and down along the Z-direction lifting rail under the action of a rotating motor. Refraction columns for refracting laser output by the laser are convexly provided on the side walls of the X-direction crossbeam at both ends.

4. The multi-laser head engraving device according to claim 3, characterized in that: The engraving mechanism includes a galvanometer fixed on a connecting plate, a spectrometer installed on the side of the galvanometer, a camera installed vertically above the spectrometer, a field mirror installed below the galvanometer, a smoke processor fixed below the field mirror, and a light source installed below the smoke processor. A three-dimensional sensor is also installed on the side of the smoke processor. The laser emits laser light, which is refracted by a refraction column and then input into the spectrometer. The spectrometer transmits the light in a straight line to the galvanometer, and the light is reflected to the field mirror through the X and Y movements in the galvanometer. The field mirror transmits the light through the smoke processor and then through the light source to engrave the substrate.

5. The multi-laser head engraving device according to claim 1, characterized in that: The control module is a PLC controller, which is connected to the feed sensor, the discharge sensor, the camera, and the three-dimensional sensor. The PLC controller is connected to the X-axis linear motor, the Y-axis linear motor, the rotary motor, the first positioning cylinder, the second positioning cylinder, the lifting cylinder, and the laser.

6. An engraving method according to the multi-laser head engraving device according to any one of claims 1 to 5, characterized in that: The specific steps include: ⑴ The staff presets the engraving operation program and substrate quality calculation program into the PLC controller; ⑵The substrate enters the track conveying mechanism from the feed end under the action of the belts on both sides; ⑶ After the feed sensor senses the substrate entering, it transmits a signal to the PLC controller, and the PLC controller controls the second positioning cylinder to rise to block the substrate from moving toward the discharge end, and then the first positioning cylinder rises, and the first positioning cylinder and the second positioning cylinder clamp the substrate to achieve positioning of the substrate; (4) The lifting cylinder rises, and the vacuum adsorption base rises until it contacts the bottom surface of the substrate, and the substrate is vacuum adsorbed to achieve flatness adsorption of the substrate; ⑸ The camera takes a thumbnail scan of the substrate and transmits a signal to the PLC controller. The 3D sensor transmits a signal of the current height of the substrate to the PLC controller. The PLC controller controls the lifting cylinder to perform basic height correction on the substrate. (6) The PLC controller reads the preset software program according to the thumbnail to control the X-axis linear motor, Y-axis linear motor, rotary motor, and laser to work. The PLC controller controls the lifting cylinder to lift according to the preset software program, thereby completing the real-time height focus of the substrate; ⑺The laser emits laser, which is refracted by the refraction column and then input into the spectrometer. The spectrometer transmits the light in a straight line to the galvanometer. After the X and Y movements in the galvanometer are reflected to the field mirror, the field mirror transmits the light through the smoke and dust processor and then through the light source to engrave the substrate. The smoke and dust processor absorbs the smoke and dust generated during the engraving process; ⑻ The camera moves three-dimensionally with the engraving mechanism to shoot the substrate, and outputs the image features of the substrate to the PLC controller. The PLC controller calculates the substrate quality according to the preset software and outputs it to the next process; ⑼After the engraving program is completed, the PLC controller controls the laser to stop working, and the PLC controller controls the three The positioning mechanism is reset, the first positioning cylinder, the second positioning cylinder, and the lifting cylinder are reset, and the substrate is on both sides. The material is transported to the discharging end by the belt; ⑽When the discharge sensor senses that the substrate has left the conveyor track mechanism, a new substrate enters the conveyor track mechanism from the feed end to start engraving the next substrate.

Citation Information

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