An LED device

Abstract

This application discloses an LED device, comprising a substrate, an LED chip, a first white-wall colloid, a first encapsulating colloid, a second encapsulating colloid, and a second white-wall colloid; the silicone in the first encapsulating colloid and the second encapsulating colloid is silicone with a moisture sensitivity level of one; the second encapsulating colloid is connected to the upper surface of the substrate, and the LED chip, the first white-wall colloid, and the first encapsulating colloid are located in a cavity formed by the second encapsulating colloid and the substrate; the second white-wall colloid is located on the side of the second encapsulating colloid. It can be seen that in this application, the second encapsulating colloid covers the LED chip, the first white-wall colloid, and the first encapsulating colloid, improving airtightness. The second white-wall colloid not only increases light reflectivity but also secures the second encapsulating colloid; the silicone in the first encapsulating colloid and the second encapsulating colloid is silicone with a moisture sensitivity level of one, effectively blocking moisture, improving the airtightness of the LED device, and extending its life.

Description

Technical Field

[0001] The present application relates to the field of LED technology, and in particular to an LED device. Background Art

[0002] LED (Light Emitting Diode) is a new type of solid-state cold light source with the characteristics of high energy efficiency, low voltage, simple structure, small size, light weight and fast response speed.

[0003] At present, the cross-sectional view of LED before packaging and the top view after packaging are respectively as follows: Figure 1 、 Figure 2 As shown, an LED chip 2 is placed on a substrate 1. White glue 8 is applied to the sides of the LED chip 2. Encapsulating glue 9 is applied to the upper surfaces of the LED chip 2 and white glue 8. Encapsulating glue 9 is a mixture of phosphor and ordinary silicone, which has poor sealing properties. When LEDs are used in high-humidity environments, moisture can gradually seep into the silicone. In severe cases, this can cause the encapsulating glue to fall off, shortening the LED's lifespan.

[0004] Therefore, how to improve the airtightness of LED devices and extend their service life should be a technical problem that needs to be urgently solved by those skilled in the art. Summary of the Invention

[0005] The purpose of this application is to provide an LED device to improve the airtightness of the LED device and extend the life of the LED.

[0006] To solve the above technical problems, the present application provides an LED device, comprising a substrate, an LED chip, a first white wall colloid, a first encapsulation colloid, a second encapsulation colloid, and a second white wall colloid; the silicone in the first encapsulation colloid and the second encapsulation colloid is silicone with a moisture sensitivity level of level one;

[0007] The second encapsulation colloid is connected to the upper surface of the substrate, and the LED chip, the first white wall colloid, and the first encapsulation colloid are located in a cavity formed by the second encapsulation colloid and the substrate; the second white wall colloid is located on the side of the second encapsulation colloid.

[0008] Optionally, also include:

[0009] A transparent protective cover is located in the cavity, and the LED chip, the first white wall colloid, and the first packaging colloid are located in the transparent protective cover.

[0010] Optionally, the transparent protective cover is a glass protective cover or a resin protective cover.

[0011] Optionally, the substrate is a ceramic substrate.

[0012] Optionally, the substrate is an alumina ceramic substrate or an aluminum nitride ceramic substrate.

[0013] Optionally, the first white wall colloid and the second white wall colloid are any of the following colloids:

[0014] Titanium dioxide colloid, zirconium dioxide colloid, zinc oxide colloid, barium sulfate colloid.

[0015] Optionally, the cross-sectional shape of the second encapsulating colloid and the transparent protective cover is rectangular, semicircular, or semi-elliptical.

[0016] Optionally, there are multiple LED chips.

[0017] An LED device provided in the present application includes a substrate, an LED chip, a first white-wall colloid, a first encapsulating colloid, a second encapsulating colloid, and a second white-wall colloid; the silicone in the first encapsulating colloid and the second encapsulating colloid is silicone with a moisture sensitivity level of one; the second encapsulating colloid is connected to the upper surface of the substrate, and the LED chip, the first white-wall colloid, and the first encapsulating colloid are located in a cavity formed by the second encapsulating colloid and the substrate; the second white-wall colloid is located on the side of the second encapsulating colloid.

[0018] It can be seen that the LED device of the present application is provided with two encapsulation colloids, a first encapsulation colloid and a second encapsulation colloid. The second encapsulation colloid covers the LED chip, the first white wall colloid, and the first encapsulation colloid, that is, the LED device is encapsulated twice, thereby improving the airtightness of the LED device. The second white wall colloid located on the side of the second encapsulation colloid can not only increase the reflectivity of light, but also fix the second encapsulation colloid; in addition, the silicone in the first encapsulation colloid and the second encapsulation colloid is a silicone with a moisture sensitivity level of one, which effectively blocks moisture, so that the humidity sensitivity level of the LED device reaches one, thereby improving the airtightness of the LED device, preventing the LED chip from being corroded by moisture, and extending the life of the LED device. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the present application or the technical solutions of the prior art, the following is a brief introduction to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0020] Figure 1 It is a cross-sectional schematic diagram of an LED device before packaging in the prior art;

[0021] Figure 2This is a top view of a packaged LED device in the prior art;

[0022] Figure 3 A cross-sectional view of an LED device provided in an embodiment of the present application;

[0023] Figure 4 A top view of an LED device provided in an embodiment of the present application;

[0024] Figure 5 A cross-sectional view of another LED device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0025] In order to enable those skilled in the art to better understand the present application, the present application is further described in detail below in conjunction with the accompanying drawings and specific embodiments. Obviously, the embodiments described are only a part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making any creative efforts are within the scope of protection of the present application.

[0026] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0027] As mentioned in the background technology section, LEDs are currently packaged using standard silicone sealant, which has poor sealing properties. When LEDs are used in high-humidity environments, moisture can gradually seep into the silicone sealant, potentially causing it to dislodge and ultimately shorten the LED's lifespan.

[0028] In view of this, the present application provides an LED device, please refer to Figure 3 and Figure 4 , Figure 3 A cross-sectional view of an LED device provided in an embodiment of the present application; Figure 4 A top view of an LED device provided in an embodiment of the present application includes:

[0029] Substrate 1, LED chip 2, first white wall colloid 3, first encapsulating colloid 4, second encapsulating colloid 6, second white wall colloid 5; the silicone in the first encapsulating colloid 4 and the second encapsulating colloid 6 is silicone with a moisture sensitivity level of level 1;

[0030] The second encapsulation colloid 6 is connected to the upper surface of the substrate 1, and the LED chip 2, the first white wall colloid 3, and the first encapsulation colloid 4 are located in the cavity formed by the second encapsulation colloid 6 and the substrate 1; the second white wall colloid 5 is located on the side of the second encapsulation colloid 6.

[0031] The first white wall glue 3 is located on the side of the LED chip 2, and the first packaging glue 4 is located on the surface of the LED chip 2 and the first white wall glue 3. That is, the positions of the first white wall glue 3 and the first packaging glue 4 are consistent with those in the existing LED device.

[0032] The first encapsulation colloid 4 and the second encapsulation colloid 6 are both a mixture of phosphor and silicone with a moisture sensitivity level of one. The silicone with a moisture sensitivity level of one is a highly airtight silicone purchased directly on the market. For the proportion of various material components included, please refer to the relevant technology.

[0033] The LED chip 2 is flip-chip mounted on the substrate 1. The present application does not specifically limit the type of the LED chip 2. For example, it can be an ultraviolet LED chip 2 or an infrared LED chip 2, depending on the situation. The number of the LED chips 2 can be one or more.

[0034] Optionally, the substrate 1 is a ceramic substrate 1. The present application does not specifically limit the type of the ceramic substrate 1, which depends on the circumstances. For example, the substrate 1 is an alumina ceramic substrate 1 or an aluminum nitride ceramic substrate 1.

[0035] The first and second white wall colloids 3 and 5 are any of titanium dioxide colloid, zirconium dioxide colloid, zinc oxide colloid, and barium sulfate colloid. The first and second white wall colloids 3 and 5 have high reflectivity, reducing side light emission and light spillage from the LED device. Furthermore, the second white wall colloid 5 also serves to secure the second encapsulating colloid 6.

[0036] The LED device of the present application is provided with two encapsulating colloids, a first encapsulating colloid 4 and a second encapsulating colloid 6. The second encapsulating colloid 6 covers the LED chip 2, the first white wall colloid 3, and the first encapsulating colloid 4, that is, the LED device is encapsulated twice, thereby improving the airtightness of the LED device. The second white wall colloid 5 located on the side of the second encapsulating colloid 6 can not only increase the reflectivity of light, but also fix the second encapsulating colloid 6. In addition, the silicone in the first encapsulating colloid 4 and the second encapsulating colloid 6 is silicone with a moisture sensitivity level of one, which effectively blocks moisture, so that the humidity sensitivity level of the LED device reaches one, thereby improving the airtightness of the LED device, preventing the LED chip 2 from being corroded by moisture, and extending the life of the LED device.

[0037] Please refer to Figure 5Based on the above embodiment, in one embodiment of the present application, the LED device further includes:

[0038] A transparent protective cover 7 is located in the cavity, and the LED chip 2 , the first white wall colloid 3 , and the first packaging colloid 4 are located in the transparent protective cover 7 .

[0039] The transparent protective cover 7 is not specifically limited in the present application. In order to further ensure that the LED device can withstand higher temperatures during the manufacturing process, a transparent and high-temperature resistant protective cover is preferably used, such as a glass protective cover or a resin protective cover.

[0040] It should be noted that the shape of the transparent protective cover 7 is not specifically limited in this application. Generally, the shape of the transparent protective cover 7 is the same as that of the second encapsulating body 6, but the size is different. Optionally, the cross-sectional shape of the second encapsulating body 6 and the transparent protective cover 7 is rectangular, semicircular, or semi-elliptical. Of course, the cross-sectional shape of the second encapsulating body 6 and the transparent protective cover 7 can also be set to any other regular or irregular shape as needed.

[0041] The transparent protective cover 7 can further protect the LED chip 2, so that the humidity sensitivity level of the LED device reaches level one, greatly preventing the LED chip 2 from being corroded by moisture, and further extending the service life of the LED device.

[0042] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on its differences from the other embodiments. Reference can be made to the descriptions of the identical or similar parts between the various embodiments. For the devices disclosed in the embodiments, since they correspond to the methods disclosed in the embodiments, the descriptions are relatively simple, and the relevant parts can be referred to the descriptions of the methods.

[0043] The above is a detailed introduction to the LED device provided by this application. This article uses specific examples to illustrate the principles and implementation methods of this application. The description of the above examples is only intended to help understand the method and core concept of this application. It should be noted that for ordinary technicians in this technical field, various improvements and modifications can be made to this application without departing from the principles of this application. Such improvements and modifications also fall within the scope of protection of the claims of this application.

Claims

1. An LED device, characterized in that: The device comprises a substrate, an LED chip, a first white wall colloid, a first encapsulating colloid, a second encapsulating colloid, and a second white wall colloid; the silicone in the first encapsulating colloid and the second encapsulating colloid is silicone with a moisture sensitivity level of Class 1; the LED chip is arranged on the substrate in a flip-chip manner; the first encapsulating colloid and the second encapsulating colloid are both a mixture of phosphor and silicone with a moisture sensitivity level of Class 1; there are multiple LED chips; The second encapsulant is connected to the upper surface of the substrate, and the LED chip, the first white-walled colloid, and the first encapsulant are located in a cavity formed by the second encapsulant and the substrate; the second white-walled colloid is located on the side of the second encapsulant; the first white-walled colloid is located on the side of each of the LED chips; and the first encapsulant is located on the surface of the LED chip and the first white-walled colloid. A transparent protective cover is located in the cavity, the transparent protective cover is located on the inner side of the second encapsulation body and is connected to the upper surface of the substrate, the inner side of the second encapsulation body is the side of the second encapsulation body facing the substrate, and the LED chip, the first white wall colloid, and the first encapsulation colloid are located in the cavity formed by the transparent protective cover and the substrate.

2. The LED device according to claim 1, wherein The transparent protective cover is a glass protective cover or a resin protective cover.

3. The LED device according to claim 1, wherein The substrate is a ceramic substrate.

4. The LED device according to claim 3, wherein The substrate is an alumina ceramic substrate or an aluminum nitride ceramic substrate.

5. The LED device according to claim 1, wherein The first white wall colloid and the second white wall colloid are any of the following colloids: Titanium dioxide colloid, zirconium dioxide colloid, zinc oxide colloid, barium sulfate colloid.

6. The LED device according to claim 1, wherein The cross-sectional shape of the second encapsulating colloid and the transparent protective cover is rectangular, semicircular or semi-elliptical.

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