Substrate-mask in-situ holding device for high-density patterning processing

Abstract

The present application relates to a substrate-mask in-situ holding device for high-density patterning processing, comprising a vacuum connection table, a base, a substrate holder and a mask holder, wherein the vacuum connection table is provided with a first quick-release socket and an air port; the upper end surface of the base is provided with a first boss and a first air hole, the base is connected to the upper end surface of the vacuum connection table, and the first air hole is connected to the air port; the substrate holder is provided with a holding groove, a connecting hole and a fastening assembly; the mask holder is provided with a hollow hole and a cantilever, the upper end surface of the cantilever is provided with a second quick-release socket, and the lower end surface is provided with a second air hole. With such a configuration, the device has a simple structure and is easy to operate. After the alignment operation, the substrate and the mask can be kept fixed, which is conducive to the efficient preparation of thin film devices with high-density array structures and the rapid transfer of samples between various processes of thin film device preparation.

Description

Technical Field

[0001] The present application relates to the technical field of preparation of non-silicon-based thin film devices, and more specifically, to an in-situ holding device for a substrate-mask template for high-density patterning processing. Background Art

[0002] In recent years, as human society has entered the 5G era, semiconductor and communication devices have developed in the direction of high integration, miniaturization, and lightweight; the preparation of non-silicon-based thin film devices with high-density array structures and the development of materials and device micro-nano integration technologies will lead a new round of industrial revolution. At present, the development of non-silicon-based thin film device preparation technology lags behind, which seriously restricts the further miniaturization evolution of non-silicon-based devices. Among them, how to achieve high-density and high-precision integrated processing of material patterns in devices with high quality and efficiency is the key to the preparation of micro non-silicon-based thin film devices. At present, high-precision preparation methods such as magnetron sputtering, thermal evaporation, and molecular beam epitaxy are used for the preparation of non-silicon-based thin film devices.

[0003] The preparation process of thin film devices with high-density array structures specifically involves the alignment, bonding, transfer and thin film preparation process of the device substrate and the mask used for array pattern preparation. This process determines the quality and efficiency of the preparation of high-density array micro devices. These processes themselves and the conversion process between processes involve the mutual fastening and relative position maintenance of the device substrate and the mask. There is an urgent need for a device to fix the substrate and the mask to match the various processes in the high-density array structure thin film preparation process. The required device must meet the following requirements: 1. Widely applicable to various thin film preparation processes; 2. Does not affect or change the conditions for thin film preparation; 3. Simple and convenient to use and execute; 4. Low cost; 5. Solve the problem of mask warping due to being fixed by a clamp.

[0004] In the patent with application number CN202010701252.2, a special alignment device is designed for the alignment and bonding of the substrate (substrate) and the mask plate, which realizes the rapid alignment of the substrate and the mask plate. In order to achieve efficient preparation of high-density array structure thin film devices, in addition to alignment, it is still necessary to solve the problem of rapid transfer and fixed retention of samples between various processes in the preparation of thin film devices. Therefore, a device is also needed to match the alignment process and thin film growth process in the preparation of high-density array structure thin film devices, while providing fixation and support for the substrate-mask plate in the entire device preparation process. Summary of the invention

[0005] In order to overcome the problems existing in the related art at least to a certain extent, the purpose of the present application is to provide a substrate-mask in-situ holding device for high-density patterning processing, which can facilitate the efficient preparation of high-density array structure thin film devices and enable the sample to be kept fixed and quickly transferred between various processes of thin film device preparation. The many technical effects that can be produced by the preferred technical solutions among the many technical solutions provided in the present application are described in detail below.

[0006] The present application provides a substrate-mask in-situ holding device for high-density patterning processing, comprising:

[0007] A vacuum connection platform, wherein the vacuum connection platform is provided with a first quick socket for connecting to a vacuum pump and an air port located on an upper end surface and connected to the first quick socket;

[0008] A base, wherein the upper end surface of the base is provided with a first boss and a first air hole located on the first boss and penetrating the base, the base is connected to the upper end surface of the vacuum connection table, and the first air hole is communicated with the air port;

[0009] A substrate holder is provided with a holding groove located on the upper end surface and for the substrate to be embedded, a connecting hole located at the bottom of the holding groove and for the substrate holder to penetrate and for the first boss to be embedded, and a fastening component located at the outer periphery of the holding groove for fixing the substrate and the mask;

[0010] The mask plate holder is provided with a hollow hole passing through the mask plate holder and a cantilever located in the middle of the hollow hole, the upper end surface of the cantilever is provided with a second quick socket for connecting to a vacuum pump, and the lower end surface is provided with a second air hole connected to the second quick socket for adsorbing the mask plate.

[0011] Preferably, the upper end surface of the vacuum connection table is provided with a second boss, the lower end surface of the base is provided with a connection socket for the second boss to be embedded and connected, and the first air hole runs through the connection socket.

[0012] Preferably, a first vacuum groove is provided on the upper end surface of the first boss, and a plurality of first air holes are provided and distributed in the first vacuum groove.

[0013] Preferably, a frame-shaped connecting bracket is further included, the mask plate holder is located in the middle of the connecting bracket, and a plurality of connecting rods extending toward the connecting bracket are provided, and the connecting bracket is provided with a slot for the connecting rods to be embedded.

[0014] Preferably, two cantilevers are symmetrically arranged, and a first end of the cantilever is fixed to the mask holder, and a second end is located in the middle of the hollow hole and is provided with the second quick connector and the second air hole.

[0015] Preferably, a second vacuum groove is provided on the lower end surface of the second end of the cantilever, and a plurality of second air holes are provided and distributed in the second vacuum groove.

[0016] Preferably, the fastening assembly comprises a fastening plate and a fastening screw, a plurality of fastening screw holes are formed on the outer circumference of the retaining groove, and the fastening screws penetrate the fastening plate and are screwed into the fastening screw holes.

[0017] Preferably, the fastening sheet is configured as a rigid sheet or an elastic sheet.

[0018] Preferably, a sample tray is further included, wherein the upper end surface of the sample tray is provided with a plurality of bearing grooves for the substrate holder to be embedded, the bottom of the bearing groove is provided with bearing holes for exposing the substrate and the mask, and the outer periphery of the bearing groove is provided with spring fixing plates for fixing the substrate holder.

[0019] Preferably, the depth of the bearing groove is consistent with the thickness of the substrate holder.

[0020] The technical solution provided by this application may have the following beneficial effects:

[0021] When in use, assemble the substrate holder onto the base, connect the base to the vacuum connecting platform so that the first air hole and the air port are connected, and fix the vacuum connecting platform to the lower movable platform; place the substrate into the retaining groove of the substrate holder; use the adsorption effect formed by the vacuum air path at the first air hole position to adsorb and fix the substrate into the retaining groove of the substrate holder; place the mask plate onto the lower end of the mask plate holder; use the adsorption effect formed by the vacuum air path at the second air hole position to adsorb and fix the mask plate onto the mask plate holder; realize the alignment operation by manipulating the upper movable platform and the lower movable platform, lower the mask plate holder so that the mask plate and the substrate are in close contact with each other; fasten the substrate and the mask plate to the upper end surface of the substrate holder by the fastening assembly; release the base and the mask plate holder from the vacuum clamping state by turning off the vacuum pump; remove the substrate holder to realize the in-situ retention and storage of the substrate-mask plate. After the alignment operation is completed, the substrate-mask can be directly placed together with the substrate holder into a matching tray suitable for various thin film preparation devices for thin film preparation, without the need for additional fixation. It is suitable for various sample libraries or load-lock devices without affecting the placement of samples, which can greatly improve the preparation efficiency of the device. With such a configuration, the device has a simple structure and is easy to operate. After the alignment operation, the substrate and mask can be kept fixed, which is conducive to the efficient preparation of high-density array structure thin film devices and the rapid transfer of samples between various processes in the preparation of thin film devices.

[0022] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0024] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0025] Figure 1 is an exploded view of a substrate-mask in-situ holding device for high-density patterning processing according to some exemplary embodiments;

[0026] Figure 2 is a structural diagram of a sample tray according to some exemplary embodiments;

[0027] Figure 3 is a top view of a vacuum connection table according to some exemplary embodiments;

[0028] Figure 4 is a front view of a vacuum connection table according to some exemplary embodiments;

[0029] Figure 5 is a top view of a base according to some exemplary embodiments;

[0030] Figure 6 is a bottom view of a base according to some exemplary embodiments;

[0031] Figure 7 is a perspective view of a substrate holder according to some exemplary embodiments;

[0032] Figure 8 is a diagram showing an installation structure for holding a substrate and a mask on a substrate holder according to some exemplary embodiments;

[0033] Fig. 9 is a top view of a mask holder according to some exemplary embodiments;

[0034] Fig.10 is a bottom view of a mask holder according to some exemplary embodiments;

[0035] Fig.11is a structural diagram showing that the fastening sheet is a rigid sheet according to some exemplary embodiments;

[0036] Fig.12 is a structural diagram showing that the fastening sheet is an elastic sheet according to some exemplary embodiments.

[0037] In the figure: 1. vacuum connection platform; 11. first quick socket; 12. air port; 13. air groove; 14. second boss; 2. base; 21. first boss; 22. first air hole; 23. first vacuum groove; 24. connection socket; 3. substrate holder; 31. holding groove; 32. connection hole; 33. fastening screw hole; 34. fastening sheet; 35. fastening screw; 4. mask holder; 41. cantilever; 42. connecting rod; 43. second quick socket; 44. second air hole; 45. second vacuum groove; 5. connection bracket; 51. card slot; 6. sample tray; 61. bearing groove; 62. bearing hole. DETAILED DESCRIPTION

[0038] Here, exemplary embodiments will be described in detail, and examples thereof are shown in the accompanying drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. Instead, they are only examples of devices or methods consistent with some aspects of the present application.

[0039] To make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be described in detail below. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other implementation methods obtained by ordinary technicians in this field without creative work belong to the scope of protection of the present invention.

[0040] The following is an explanation of the embodiments with reference to the accompanying drawings. In addition, the embodiments shown below do not limit the invention described in the claims. In addition, the entire contents of the configurations shown in the following embodiments are not limited to the solutions required as the invention described in the claims.

[0041] refer to Figure 1-Figure 12 This specific embodiment provides a substrate-mask in-situ holding device for high-density patterning processing, including a vacuum connection platform 1, a base 2, a substrate holder 3 and a mask holder 4.

[0042] The vacuum connection platform 1 is used to be connected to the lower moving platform, and the lower moving platform drives the vacuum connection platform 1 to achieve displacement. A first quick-connection port 11 and an air port 12 are provided on the vacuum connection platform 1. The first quick-connection port 11 is used to connect to a vacuum pump, and the air port 12 is located on the upper end surface of the vacuum connection platform 1 and is connected to the first quick-connection port 11, so that vacuum adsorption can be formed at the position of the air port 12 through the access of the vacuum pump. Specifically, the vacuum connection platform 1 is set to a disc shape, the first quick-connection port 11 is set on one side of the vacuum connection platform 1, the air port 12 is located in the middle of the upper end surface of the vacuum connection platform 1, and is connected to the first quick-connection port 11 through the air path inside the vacuum connection platform 1.

[0043] In order to facilitate the connection between the vacuum connection platform 1 and the lower moving platform, a countersunk hole is provided on the upper end surface of the vacuum connection platform 1 . There are multiple countersunk holes surrounding the outer periphery of the air port 12 .

[0044] The middle part of the upper end surface of the base 2 protrudes upward to form a first boss 21, and a first air hole 22 is provided on the upper end surface of the first boss 21. The first air hole 22 extends downward and passes through the base 2, and the base 2 is connected to the upper end surface of the vacuum connecting platform 1 so that the first air hole 22 and the air port 12 are connected. When the vacuum connecting platform 1 is connected to a vacuum pump, the position of the first air hole 22 at the first boss 21 can provide a vacuum adsorption and fixing effect on the substrate.

[0045] The substrate holder 3 is provided with a holding groove 31, a connecting hole 32 and a fastening assembly, wherein the holding groove 31 is provided on the upper end surface of the substrate holder 3 for the substrate to be embedded; the connecting hole 32 is opened at the bottom of the holding groove 31 and passes through the substrate holder 3, and the size and shape of the connecting hole 32 and the first boss 21 are consistent, so that the first boss 21 extends into the connecting hole 32, so that the upper end surface of the first boss 21 is coplanar with the bottom of the holding groove 31, and at the same time, the substrate holder 3 is nested in the upper end surface of the base 2, thereby realizing the fixation of the base 2 and the substrate holder 3; the fastening assembly is provided in plurality and distributed on the outer periphery of the holding groove 31, and is used to fix the aligned substrate and mask plate, so that the aligned substrate and mask plate are retained on the substrate holder 3 for easy picking and operation.

[0046] In order to ensure the stability of the connection between the base 2 and the substrate holder 3 , the first boss 21 and the connection hole 32 are both configured as rectangles, which can prevent the substrate holder 3 from rotating relative to the base 2 .

[0047] Moreover, the modular design of the vacuum connection table 1, the base 2 and the substrate holder 3 enables portable adaptation and transfer of the substrate and the mask between the alignment process and the thin film preparation process.

[0048] It should be noted that the substrate holder 3 can be designed to have different sizes to match the base 2, so as to provide support for substrates of different sizes; the substrate holder 3 can be made of a variety of metal or alloy materials to adapt to different thin film preparation processes; the substrate holder 3 and the base 2 jointly provide support for the substrate during the alignment operation, and after the alignment operation is completed, the substrate holder 3 can be separated from the base 2 to independently provide support for the substrate and the mask, and it itself does not contain a vacuum air circuit or other complex structures.

[0049] The mask plate holder 4 is provided with a hollow hole and a cantilever 41, wherein the mask plate holder 4 is plate-shaped and is provided with a hollow hole in the middle area, the hollow hole can be larger than the substrate and the mask plate, so that the substrate and the mask plate can be exposed through the hollow hole, and then the substrate and the mask plate can be conveniently fixed on the substrate holder 3 through the fastening assembly; the cantilever 41 extends in the middle of the hollow hole, specifically, the first end of the cantilever 41 is arranged on the mask plate holder 4, and the second end extends from the edge of the hollow hole to the middle, so that a hollow area is formed around the cantilever 41, and at the same time, it is beneficial to observe the aligned substrate and mask plate through the CCD microscope imaging system during the alignment operation.

[0050] The upper end surface of the cantilever 41 is provided with a second quick-connector 43 for connecting to a vacuum pump. Here, the upper end surface of the cantilever 41 is provided with a screw hole, and the second quick-connector 43 is screwed into the screw hole; the lower end surface of the cantilever 41 is provided with a second air hole 44, and the second air hole 44 is connected to the second quick-connector 43. When the second quick-connector 43 is connected to the vacuum pump, a vacuum adsorption force can be formed at the position of the second air hole 44, thereby adsorbing and fixing the mask.

[0051] Of course, in order to facilitate the alignment operation, the mask holder 4 also needs to be fixed on the upper moving platform, and the substrate on the substrate holder 3 and the mask on the mask holder 4 can be aligned by moving the upper moving platform and the lower moving platform.

[0052] When in use, the substrate holder 3 is assembled onto the base 2, the base 2 is connected to the vacuum connecting platform 1 so that the first air hole 22 and the air port 12 are connected, and the vacuum connecting platform 1 is fixed to the lower moving platform; the substrate is placed in the holding groove 31 of the substrate holder 3, and the substrate is adsorbed and fixed to the holding groove 31 of the substrate holder 3 through the adsorption effect formed by the vacuum air path at the position of the first air hole 22; the mask plate is placed at the lower end of the mask plate holder 4, and the mask plate is adsorbed and fixed to the mask plate holder 4 through the adsorption effect formed by the vacuum air path at the position of the second air hole 44; the alignment operation is realized by manipulating the upper moving platform and the lower moving platform, the mask plate holder is lowered so that the mask plate and the substrate are closely attached to each other, and the substrate and the mask plate are fastened and installed on the upper end surface of the substrate holder 3 through the fastening assembly; the base 2 and the mask plate holder 4 are released from the vacuum clamping state by turning off the vacuum pump, and the substrate holder 3 is removed to realize the in-situ holding and storage of the substrate-mask plate. After completing the alignment operation, the substrate-mask template can be directly placed together with the substrate holder 3 into a matching tray suitable for various thin film preparation devices for thin film preparation. No additional fixation is required. It is suitable for various sample libraries or load-lock devices without affecting the placement of samples, which can greatly improve the preparation efficiency of the device.

[0053] With such an arrangement, the device has a simple structure and is easy to operate. After the alignment operation, the substrate and the mask can be kept fixed, which is conducive to the efficient preparation of high-density array structure thin film devices and the rapid transfer of samples between various processes in the preparation of thin film devices.

[0054] In this embodiment, the upper end surface of the vacuum connection table 1 is provided with a second boss 14, and correspondingly, a connection socket 24 is provided on the lower end surface of the base 2. The second boss 14 and the connection socket 24 are consistent in size and shape, so that the second boss 14 is embedded and fixed in the connection socket 24, so that the base 2 can be quickly plugged in and out of the vacuum connection table 1, and bases 2 of different sizes can be easily replaced, thereby providing support and vacuum adsorption for substrates of different sizes. Specifically, the second boss 14 and the connection socket 24 can be set to a cylindrical shape. Here, the positions of the connection socket 24 and the first boss 21 correspond, so that the first air hole 22 runs through the interior of the connection socket 24, and an air groove 13 is provided on the upper end surface of the second boss 14, and a plurality of air ports 12 are provided in the air groove 13, which facilitates the communication between the first air hole 22 and the air port 12.

[0055] In order to provide a relatively uniform vacuum adsorption force, a first vacuum groove 23 is provided on the upper end surface of the first boss 21, and a plurality of first air holes 22 are provided and distributed in the first vacuum groove 23, so that when the substrate is adsorbed, the substrate is adsorbed through the first vacuum groove 23, so that the plurality of first air holes 22 are subjected to uniform and stable force. Here, the first vacuum groove 23 is in an X-shape, which helps to strengthen the adsorption effect on the substrate.

[0056] In some embodiments, the substrate-mask plate in-situ holding device for high-density patterning processing further includes a frame-shaped connecting bracket 5, the mask plate holder 4 is located in the middle of the connecting bracket 5, and is provided with a plurality of connecting rods 42 extending toward the connecting bracket 5, and the connecting bracket 5 is provided with a card slot 51 for the connecting rod 42 to be embedded, and the connecting rod 42 is fixed in the card slot 51, thereby achieving the fixation of the mask plate holder 4 and the connecting bracket 5. Specifically, the connecting bracket 5 has four square grooves formed on the lower surface and four through circular holes aligned with the center of the grooves, the mask plate holder 4 is provided with four connecting rods 42, and can be fixed in the square grooves on the lower surface of the connecting bracket 5 by screws; at the same time, the connecting bracket 5 also has a through circular hole formed on one side for connecting and fixing with the upper moving platform.

[0057] The mask plate holder 4 has two symmetrical cantilevers 41, and the first end of the cantilever 41 is fixed to the mask plate holder 4, and the second end is located in the middle of the hollow hole and is provided with a second quick plug 43 and a second air hole 44, so that the middle hollow hole of the mask plate holder 4 is I-shaped. In this way, the adsorption effect on the mask plate can be enhanced through the two symmetrical groups of second air holes 44. At the same time, the I-shaped hollow hole simplifies the vacuum adsorption and fixation of the hollow metal mask plate during the alignment process and the fixation operation with the substrate.

[0058] The mask holder 4 is a square frame cross-shaped part, and four connecting rods 42 are located at the four vertices of the mask holder 4 and extend outward in the diagonal direction. In addition, two cantilevers 41 are arranged at the vertices of the mask holder 4 and extend toward the middle in the diagonal direction, so that the structure is stable, symmetrical, and easy to process.

[0059] In order to provide a more uniform vacuum adsorption force, a second vacuum groove 45 is provided on the lower end surface of the second end of the cantilever 41, and a plurality of second air holes 44 are provided and distributed in the second vacuum groove 45. In this way, when the mask is adsorbed, the mask is adsorbed through the second vacuum groove 45, so that the force on the plurality of second air holes 44 is uniform and stable.

[0060] In some embodiments, the fastening assembly includes a fastening plate 34 and a fastening screw 35. A plurality of fastening screw holes 33 are provided on the periphery of the retaining groove 31. A hole is provided at one end of the fastening plate 34 for the fastening screw 35 to pass through. When in use, the fastening screw 35 passes through the fastening plate 34 and is tightened in the fastening screw hole 33 so that one end of the fastening plate 34 is located at the position of the fastening screw hole 33 and the other end extends to the position of the retaining groove 31, thereby pressing the substrate and the mask plate against each other through the fastening plate 34. The structure is simple, convenient and reliable.

[0061] Among them, Figure 11-12 As shown, the fastening sheet 34 is set as a rigid sheet or an elastic sheet. A suitable fastening sheet 34 can be selected according to different rigid or flexible substrates, and can be widely applied to various rigid and flexible substrate materials; and by distributing the fastening sheet 34 as an elastic sheet and a rigid sheet, the warping during the fixing process of the metal mask template is suppressed.

[0062] It should be noted that the substrate holder 3 is provided with a plurality of fastening screw holes 33 , and a suitable number of fastening plates 34 can be selected according to substrates of different rigidity or flexibility.

[0063] In some embodiments, the substrate-mask plate in-situ holding device for high-density patterning processing further includes a sample tray 6, and the upper end surface of the sample tray 6 is provided with a plurality of bearing grooves 61 for the substrate holder 3 to be embedded, wherein the substrate holder 3 has a side with the holding groove 31 facing the bearing groove 61, and the bottom of the bearing groove 61 is provided with a bearing hole 62, and the bearing hole 62 can expose the holding groove 31 and the fastening component of the substrate holder 3, so that the part of the substrate-mask plate where the film needs to be prepared is completely exposed, which is convenient for preparation. In addition, a spring fixing sheet is installed on the upper end surface of the sample tray 6, so that the substrate holder 3 can be fixed after being embedded in the sample tray 6.

[0064] The depth of the bearing groove 61 is consistent with the thickness of the substrate mask, so that after the substrate holder 3 is embedded in the sample tray 6 , it will not block the sample and affect its heating.

[0065] It should be noted that the thickness of the substrate holder 3 is 1-2 mm, which can match the sample tray 6 of various thin film preparation devices; the substrate holder 3 is a frame with a hole in the middle. When it is assembled on the sample tray 6 for thin film preparation, it can allow the heat source to directly heat the substrate through thermal radiation, thereby improving the heating condition of the substrate.

[0066] The substrate-mask in-situ holding device for high-density patterning processing will be specifically described below in conjunction with the above embodiments.

[0067] The modular design of the vacuum connection table 1, the base 2 and the substrate holder 3 realizes the portable adaptation and transfer of the substrate and the mask between the alignment process and the thin film preparation process;

[0068] The I-shaped hollow hole in the middle of the mask holder 4 simplifies the vacuum adsorption fixation of the hollow metal mask during the alignment process and the fixation operation with the substrate;

[0069] By distributing the fastening sheets 34 as elastic sheets and rigid sheets, the warping of the metal mask during the fixing process is suppressed.

[0070] It should be noted that the terms "first", "second" and the like described herein are not intended to limit a specific order, but are merely used to distinguish between components or functions. The terms "horizontal", "vertical", "upper", "lower", "left" and "right" described herein are used when the substrate-mask in-situ holding device for high-density patterning is in a state such as Figure 1 What it refers to when it is in the placed state.

[0071] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed by the present invention, which should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

[0072] It is to be understood that the same or similar parts in the above embodiments can refer to each other, and the contents not described in detail in some embodiments can refer to the same or similar contents in other embodiments. The multiple schemes provided in this application include their own basic schemes, which are independent of each other and do not restrict each other, but they can also be combined with each other without conflict to achieve multiple effects together.

[0073] Although the embodiments of the present application have been shown and described above, it is to be understood that the above embodiments are exemplary and are not to be construed as limitations on the present application. A person skilled in the art may change, modify, replace and modify the above embodiments within the scope of the present application.

Claims

1. A substrate-mask in-situ holding device for high-density patterning processing, characterized in that: Included are: A vacuum connection platform (1), the vacuum connection platform (1) being provided with a first quick-connection port (11) for connecting to a vacuum pump and an air port (12) located on an upper end surface and communicating with the first quick-connection port (11); A base (2), the upper end surface of the base (2) being provided with a first boss (21) and a first air hole (22) located on the first boss (21) and penetrating the base (2), the base (2) being connected to the upper end surface of the vacuum connection platform (1), and the first air hole (22) being in communication with the air port (12); A substrate holder (3) is provided with a holding groove (31) located on the upper end surface and for the substrate to be embedded, a connecting hole (32) located at the bottom of the holding groove (31) and for the substrate holder (3) to pass through and for the first boss (21) to be embedded, and a fastening component located on the periphery of the holding groove (31) for fixing the substrate and the mask; A mask plate holder (4) is provided with a hollow hole penetrating the mask plate holder (4) and a cantilever (41) located in the middle of the hollow hole, the upper end surface of the cantilever (41) being provided with a second quick-connection (43) for connecting to a vacuum pump, and the lower end surface being provided with a second air hole (44) connected to the second quick-connection (43) for adsorbing the mask plate.

2. The substrate-mask in-situ holding device for high-density patterning processing according to claim 1, characterized in that: The upper end surface of the vacuum connection platform (1) is provided with a second boss (14), the lower end surface of the base (2) is provided with a connection socket (24) for the second boss (14) to be embedded and connected, and the first air hole (22) runs through the connection socket (24).

3. The substrate-mask in-situ holding device for high-density patterning processing according to claim 1, characterized in that: The upper end surface of the first boss (21) is provided with a first vacuum groove (23), and a plurality of first air holes (22) are provided and distributed in the first vacuum groove (23).

4. The substrate-mask in-situ holding device for high-density patterning processing according to claim 1, characterized in that: It also comprises a frame-shaped connecting bracket (5), the mask plate holder (4) is located in the middle of the connecting bracket (5), and is provided with a plurality of connecting rods (42) extending towards the connecting bracket (5), and the connecting bracket (5) is provided with a slot (51) for the connecting rods (42) to be embedded.

5. The substrate-mask in-situ holding device for high-density patterning processing according to claim 1, characterized in that: Two cantilevers (41) are symmetrically arranged, and the first end of the cantilever (41) is fixed to the mask plate holder (4), and the second end is located in the middle of the hollow hole and is provided with the second quick plug (43) and the second air hole (44).

6. The substrate-mask in-situ holding device for high-density patterning processing according to claim 5, characterized in that: A second vacuum groove (45) is provided on the lower end surface of the second end of the cantilever (41), and a plurality of second air holes (44) are provided and distributed in the second vacuum groove (45).

7. The substrate-mask in-situ holding device for high-density patterning processing according to claim 1, characterized in that: The fastening assembly comprises a fastening plate (34) and a fastening screw (35); a plurality of fastening screw holes (33) are provided on the outer periphery of the retaining groove (31); the fastening screw (35) passes through the fastening plate (34) and is screwed into the fastening screw hole (33).

8. The substrate-mask in-situ holding device for high-density patterning processing according to claim 7, characterized in that: The fastening sheet (34) is configured as a rigid sheet or an elastic sheet.

9. The substrate-mask in-situ holding device for high-density patterning processing according to claim 1, characterized in that: It also comprises a sample tray (6), wherein the upper end surface of the sample tray (6) is provided with a plurality of bearing grooves (61) for the substrate holder (3) to be embedded, the bottom of the bearing groove (61) is provided with bearing holes (62) for exposing the substrate and the mask, and the outer periphery of the bearing groove (61) is provided with a spring fixing sheet for fixing the substrate holder (3).

10. The substrate-mask in-situ holding device for high-density patterning processing according to claim 9, characterized in that: The depth of the bearing groove (61) is consistent with the thickness of the substrate holder (3).

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