Conductive connector and method of making same

Abstract

The application provides a conductive connector, which comprises at least two conductive layers, an inner adhesive film layer is arranged between any two adjacent conductive layers, a protruding part is arranged on the surface of the conductive layer facing the inner adhesive film layer, and the protruding parts on the opposite surfaces of any two adjacent conductive layers protrude into the inner adhesive film layer between the two conductive layers and are connected with each other. Compared with the prior art, the conductive connector has the advantages of simple manufacturing process, low production cost, good conductive performance and the like. In addition, the application also provides a manufacturing method of the conductive connector, which has the advantages of simple operation and easy implementation.

Description

Technical Field

[0001] This invention relates to the field of electronic component packaging technology, and in particular to a conductive connector and its manufacturing method. Background Technology

[0002] As electronic products develop towards miniaturization and high integration, the packaging technology of electronic components and the manufacturing technology of printed circuit boards place increasingly stringent requirements on interconnect materials. Traditional interconnect materials can no longer meet the needs of the environment and technology.

[0003] Conductive adhesive is an adhesive that exhibits a certain degree of conductivity after curing or drying. As an emerging electronic material, it has become an ideal and more competitive alternative to traditional Sn-Pb solder. However, during use, it has been found that conductive adhesive not only suffers from poor conductivity but also exhibits unstable connection performance.

[0004] To address the aforementioned issues, the industry has proposed a flexible connector comprising a first conductive layer, an insulating layer, and a second conductive layer stacked sequentially. The first and second conductive layers are connected and conductive through conductive holes in the insulating layer. Thus, an electrical connection is achieved between electronic components and the circuit board via the first conductive layer, conductive holes, and second conductive layer. However, the fabrication process of this flexible connector is complex, requiring significant time and labor costs. To achieve electrical connection between the first and second conductive layers, the fabrication process first requires forming connection holes on the flexible copper-clad laminate using methods such as mechanical drilling, laser drilling, or stamping. Then, the connection holes need to be metallized to form conductive vias.

[0005] Therefore, it is necessary to design an interconnect structure that has good conductivity, stable connection performance, simple manufacturing process, and low cost. Summary of the Invention

[0006] To address the aforementioned technical problems, this invention provides a conductive connector and its manufacturing method. This conductive connector is used for mounting and connecting circuit boards and has advantages such as simple manufacturing process, low production cost, and good conductivity.

[0007] Based on this, the present invention provides a conductive connector comprising at least two conductive layers, an inner adhesive film layer between any two adjacent conductive layers, a protrusion on the surface of each conductive layer facing the inner adhesive film layer, and the protrusions on opposite sides of any two adjacent conductive layers protruding into the inner adhesive film layer between the two conductive layers and connecting to each other.

[0008] As a preferred embodiment, the protrusion has a regular or irregular three-dimensional geometric shape.

[0009] As a preferred embodiment, the protrusion is shaped as a pointed angle, an inverted cone, a granular shape, a dendritic shape, a columnar shape, or a block shape.

[0010] As a preferred embodiment, the protrusion is made of one or more of the following materials: copper, nickel, tin, lead, chromium, molybdenum, zinc, gold, and silver.

[0011] As a preferred embodiment, the height of the protrusion ranges from 0.2 to 30 μm.

[0012] As a preferred embodiment, the protrusions located on the same side surface of the conductive layer are provided as two or more, and the two or more protrusions are distributed continuously or discontinuously, with each protrusion having the same or different shape and the same or different size.

[0013] As a preferred embodiment, the thickness of the conductive layer ranges from 1 to 18 μm.

[0014] As a preferred embodiment, the surface of the conductive layer is either rough or smooth.

[0015] As a preferred embodiment, the inner adhesive film layer is made of thermosetting adhesive or thermoplastic adhesive.

[0016] As a preferred embodiment, the conductive layer located on the outermost side of the conductive connector is referred to as the outer conductive layer, and the surface of the outer conductive layer facing away from the inner adhesive film layer is also provided with the protrusion.

[0017] As a preferred embodiment, the outer conductive layer is further provided on the side facing away from the inner adhesive film layer, and the protrusions on the surface of the outer conductive layer facing away from the inner adhesive film layer are either hidden inside the outer adhesive film layer or penetrate the outer adhesive film layer and exposed.

[0018] As a preferred embodiment, the protrusions on the surface of the outer conductive layer facing away from the inner adhesive film layer are hidden within the outer adhesive film layer, and the thickness of the outer adhesive film layer is less than the average height of the protrusions themselves.

[0019] As a preferred embodiment, the outer adhesive film layer is made of pressure-sensitive adhesive, thermosetting adhesive, or thermoplastic adhesive.

[0020] This invention also provides a method for manufacturing a conductive connector, comprising the following steps:

[0021] A protrusion is formed on the outer surface of a thin copper layer that can be peeled off copper foil;

[0022] An inner adhesive film layer is formed on a thin copper layer that forms raised portions of a peelable copper foil;

[0023] Take any two peelable copper foils, and denote them as the first peelable copper foil and the second peelable copper foil respectively. Press the first peelable copper foil and the second peelable copper foil together with thin copper layers facing each other until they are pressed together. At this time, an inner adhesive film layer is formed between the two peelable copper foils, which is denoteed as the first inner adhesive film layer. The protrusions on the outer surface of the thin copper layer of the first peelable copper foil and the protrusions on the outer surface of the thin copper layer of the second peelable copper foil protrude into the first inner adhesive film layer and are connected to each other.

[0024] The carrier layer of the first peelable copper foil and the carrier layer of the second peelable copper foil are peeled off respectively.

[0025] In the above-described method for manufacturing a conductive connector, after removing the carrier layer of the first peelable copper foil and the carrier layer of the second peelable copper foil, the method further includes the following steps:

[0026] A protrusion is formed on the surface of the thin copper layer of the second peelable copper foil opposite to the surface of the first inner adhesive film layer;

[0027] Take another piece of peelable copper foil, which is designated as the third peelable copper foil. Press the thin copper layer of the third peelable copper foil and the thin copper layer of the second peelable copper foil together until they are pressed together. At this time, an inner adhesive film layer is formed between the thin copper layer of the third peelable copper foil and the thin copper layer of the second peelable copper foil, which is designated as the second inner adhesive film layer. The protrusions on the surface of the thin copper layer of the second peelable copper foil facing away from the first inner adhesive film layer and the protrusions on the outer surface of the thin copper layer of the third peelable copper foil protrude into the second inner adhesive film layer and are connected to each other.

[0028] Remove the carrier layer of the third peelable copper foil;

[0029] As needed, continue pressing new peelable copper foil following the steps described above.

[0030] In the above-described method for manufacturing a conductive connector, after removing the carrier layer of the outermost peelable copper foil of the conductive connector, the method further includes the following steps:

[0031] A protrusion is formed on the surface of the thin copper layer on the outermost side of the conductive connector, opposite to the inner adhesive film layer.

[0032] In the above-mentioned method for manufacturing a conductive connector, after forming a protrusion on the surface of the outermost thin copper layer facing away from the inner adhesive film layer, the method further includes the following steps:

[0033] An outer adhesive film layer is formed on the side of the thin copper layer located on the outermost side of the conductive connector, opposite to the inner adhesive film layer.

[0034] In the above-mentioned method for manufacturing conductive connectors, the step of forming the inner adhesive film layer or the outer adhesive film layer includes:

[0035] An inner or outer adhesive film layer is coated on a release film, and then the inner or outer adhesive film layer is pressed and transferred onto the surface of a thin copper layer through the release film.

[0036] Alternatively, an inner or outer adhesive film layer can be directly coated onto the surface of a thin copper layer.

[0037] In the above-mentioned method for manufacturing conductive connectors, one or more of the following methods are used: electroplating, chemical plating, physical vapor deposition, and chemical vapor deposition to form protrusions on the surface of a thin copper layer.

[0038] In the above-described method for manufacturing a conductive connector, the carrier layer includes a peelable layer, a barrier layer, and a main body layer, and the thin copper layer, the peelable layer, the barrier layer, and the main body layer are stacked sequentially, or the thin copper layer, the barrier layer, the peelable layer, and the main body layer are stacked sequentially.

[0039] Implementing the embodiments of the present invention has the following beneficial effects:

[0040] On the one hand, compared with traditional soldering and bonding, the conductive connector provided in this embodiment of the invention can achieve circuit conduction between two circuit boards or between a circuit board and a grounding metal plate by clamping it between two circuit boards or between a circuit board and a grounding metal plate, and connecting the two outermost conductive layers to the two circuit boards or the circuit board and the grounding metal plate respectively. This not only enables repeated disassembly and assembly of the circuit boards, facilitating circuit board maintenance and reducing the manufacturing cost of electronic products, but also ensures the installation reliability of the circuit boards while achieving electrical connection.

[0041] On the other hand, compared with existing flexible connectors, the conductive connector provided by this invention has no conductive holes. During manufacturing, there is no need for drilling or hole metallization; simply pressing two conductive layers together makes manufacturing more convenient, faster, and less costly. Furthermore, since the electrical connection between the two conductive layers is achieved through protrusions within the inner adhesive film layer, the conductive connector provided by this invention has better conductivity and more stable connection performance. Moreover, because the inner adhesive film layer has a certain degree of elasticity and deformation resistance, it acts as a buffer, thus the conductive connector provided by this invention is less prone to deformation during repeated assembly and disassembly, ensuring the reliability of the electrical connection between two circuit boards or between a circuit board and a grounding metal plate.

[0042] The present invention also provides a method for manufacturing the above-mentioned conductive connector, which has the advantages of simple operation and easy implementation. Attached Figure Description

[0043] Figure 1 This is a cross-sectional schematic diagram of a conductive connector with a flat conductive layer according to Embodiment 1 of the present invention.

[0044] Figure 2 yes Figure 1 A magnified view of region I in the middle;

[0045] Figure 3 yes Figure 1 Enlarged view of region II;

[0046] Figure 4 This is one of the cross-sectional images of a portion of the conductive connector according to Embodiment 1 of the present invention under a scanning electron microscope;

[0047] Figure 5 This is a cross-sectional schematic diagram of a conductive connector employing three conductive layers according to Embodiment 1 of the present invention;

[0048] Figure 6 This is a second cross-sectional view of a portion of the conductive connector of Embodiment 1 of the present invention under a scanning electron microscope;

[0049] Figure 7 This is the third cross-sectional view of a portion of the conductive connector of Embodiment 1 of the present invention under a scanning electron microscope;

[0050] Figure 8 This is the fourth cross-sectional view of a portion of the conductive connector of Embodiment 1 of the present invention under a scanning electron microscope;

[0051] Figure 9 This is a cross-sectional schematic diagram of a conductive connector with a rough conductive layer surface according to Embodiment 1 of the present invention.

[0052] Figure 10 yes Figure 9 A magnified view of region III;

[0053] Figure 11 yes Figure 9 A magnified view of region IV in the middle;

[0054] Figure 12 This is a cross-sectional schematic diagram of a conductive connector with an outer adhesive film layer according to Embodiment 1 of the present invention;

[0055] Figure 13 This is a cross-sectional schematic diagram of a conductive connector employing a double conductive layer according to Embodiment 1 of the present invention.

[0056] Explanation of reference numerals in the attached figures:

[0057] 1. Conductive layer; 1a. First conductive layer; 1b. Second conductive layer; 101. Outer conductive layer; 102. Inner conductive layer; 11. Protrusion; 11a. First protrusion; 11b. Second protrusion; 11c. Third protrusion; 11d. Fourth protrusion; 2. Inner adhesive film layer; 3. Outer adhesive film layer; 3a. First outer adhesive film layer; 3b. Second outer adhesive film layer. Detailed Implementation

[0058] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0059] Example 1

[0060] like Figures 1 to 4 As shown, this embodiment of the invention provides a conductive connector, mainly comprising at least two conductive layers 1, with an inner adhesive layer 2 disposed between any two adjacent conductive layers 1. A protrusion 11 is provided on the surface of the conductive layer 1 facing the inner adhesive layer 2, and the protrusions 11 on opposite side surfaces of any two adjacent conductive layers 1 protrude into the inner adhesive layer 2 between the two conductive layers 1 and are interconnected. Based on the above structure, the conductive connector provided by this embodiment of the invention has the following beneficial effects:

[0061] On the one hand, compared with traditional soldering and bonding, the conductive connector provided in this embodiment of the invention can achieve circuit conduction between two circuit boards or between a circuit board and a grounding metal plate by clamping it between two circuit boards or between a circuit board and a grounding metal plate, and connecting the two outermost conductive layers 1 to the two circuit boards or the circuit board and the grounding metal plate respectively. This not only enables repeated disassembly and assembly of the circuit boards, facilitating circuit board maintenance and reducing the manufacturing cost of electronic products, but also ensures the installation reliability of the circuit boards while achieving electrical connection.

[0062] On the other hand, compared with existing flexible connectors, the conductive connector provided by the present invention has no conductive holes. During manufacturing, there is no need for drilling and hole metallization. It can be made simply by pressing the two conductive layers 1 together, which makes the manufacturing process more convenient and faster, and the cost is also lower. Furthermore, since the two conductive layers 1 are electrically connected through the protrusions 11 protruding into the inner adhesive layer 2, the conductive connector provided by the present invention has better conductivity and more stable connection performance. Moreover, since the inner adhesive layer 2 has a certain degree of elasticity and deformation resistance, it can play a buffering role. Therefore, the conductive connector provided by the present invention is not easily deformed during repeated disassembly and assembly, ensuring the reliability of the electrical connection between two circuit boards or between a circuit board and a grounding metal plate.

[0063] Optionally, such as Figure 1 as well as Figures 5 to 8As shown, the outermost conductive layer 1 of the conductive connector is designated as the outer conductive layer 101, and the outer conductive layer 101 generally has two layers; the remaining conductive layers 1 are designated as the inner conductive layers 102, and all the inner conductive layers 102 are located between the two outer conductive layers 101. In order to further improve the conductivity of the conductive connector, the surface of the outer conductive layer 101 facing away from the inner adhesive layer 2 is also provided with a protrusion 11. Based on this, when the conductive connector provided in this embodiment of the invention is clamped between the circuit board and the grounding metal plate, the protrusion 11 on the surface of the outer conductive layer 101 facing away from the inner adhesive layer 2 can ensure that the conductive layer 1 and the grounding layer or grounding metal plate of the circuit board form a more effective electrical connection. Thus, the conductive connector provided in this embodiment of the invention can effectively discharge the static charge accumulated on the circuit board, avoiding the accumulation of static charge on the circuit board to form an interference source and affect the signal transmission.

[0064] Specifically, such as Figures 1 to 8 As shown, the protrusions 11 are regular or irregular three-dimensional geometric shapes, such as pointed, inverted cone, granular, dendritic, columnar, or blocky shapes. Furthermore, there are two or more protrusions 11 located on the same side surface of the conductive layer 1. The shape of each protrusion 11 can be the same or different, and the size of each protrusion 11 can also be the same or different. That is, the shape of two or more protrusions 11 can be one or more of the following: pointed, inverted cone, granular, dendritic, columnar, or blocky. The sizes of two or more protrusions 11 with the same shape may not be identical. In addition, two or more protrusions 11 can be distributed continuously or discontinuously. For example, when two or more protrusions 11 are pointed and continuously distributed, they can form a regular, periodic tooth-like three-dimensional pattern, or an irregular, disordered tooth-like three-dimensional pattern. Of course, this is just one example; other combinations of shapes mentioned above are also within the scope of protection of this application and will not be listed here.

[0065] Optionally, such as Figures 1 to 3 As shown, the thickness T of the conductive layer 1 is preferably in the range of 1 to 18 μm, and the height h1 of the protrusion 11 is preferably in the range of 0.2 to 30 μm.

[0066] Optionally, such as Figure 1 as well as Figures 9 to 11As shown, the two sides of the conductive layer 1 can be either flat or rough. It should be noted that the flat and rough surfaces referred to here are the surfaces of the conductive layer 1 where the protrusions 11 are located, i.e., the reference surfaces where the protrusions 11 are located, not the plane formed by two or more protrusions 11. When the surface of the conductive layer 1 is rough, it includes valleys and peaks. The protrusions 11 are distributed in both valleys and peaks, and the sum of the height H1 of any peak and the range h1 of the height of the protrusion 11 located on that peak is 0.2 to 30 μm. Of course, the two sides of each conductive layer 1 can be different; that is, one side may be flat and the other side may be rough, and each conductive layer 1 can also be different.

[0067] Optionally, such as Figure 12 As shown, an outer adhesive layer 3 is also provided on the side of the outer conductive layer 101 facing away from the inner adhesive layer 2. The protrusions 11 on the surface of the outer conductive layer 101 facing away from the inner adhesive layer 2 are either hidden within the outer adhesive layer 3 or penetrate the outer adhesive layer 3 and are exposed. In this embodiment, the protrusions 11 on the surface of the outer conductive layer 101 facing away from the inner adhesive layer 2 are hidden within the outer adhesive layer 3, and the thickness of the outer adhesive layer 3 is less than the average height of the protrusions 11. Like the inner adhesive layer 2, the outer adhesive layer 3 also has a certain degree of elasticity and resistance to deformation, which can act as a buffer. Therefore, when the conductive connector is clamped between two circuit boards or between a circuit board and a grounding metal plate, thanks to the elastic force of the outer adhesive layer 3 and the inner adhesive layer 2, a more reliable electrical connection will be formed between the protrusions 11 on the surface of the outer conductive layer 101 facing away from the inner adhesive layer 2 and the circuit board or grounding metal plate.

[0068] Optionally, the conductive layer 1 is preferably made of copper, and the protrusion 11 is preferably made of one or more of copper, nickel, lead, chromium, molybdenum, zinc, tin, gold, and silver. That is, the protrusion 11 can be a single component, namely one of copper, nickel, tin, lead, chromium, molybdenum, zinc, gold, and silver, or it can be made primarily of one of copper, nickel, tin, lead, chromium, molybdenum, zinc, gold, and silver, and then formed on the surface of the main body using one or more methods such as electroplating, electroless plating, physical vapor deposition, and chemical vapor deposition, thereby forming a composite material protrusion 11. In this embodiment, the protrusion 11 is preferably a composite material with copper as the main body and one or more of nickel, tin, lead, chromium, molybdenum, zinc, gold, and silver formed on the copper surface. This is because a protrusion 11 made solely of copper is easily oxidized or worn, while the nickel, tin, gold, and silver formed on the copper surface can improve the corrosion resistance and wear resistance of the protrusion 11, thereby extending the service life of the conductive connector.

[0069] Optionally, to prevent the two adjacent conductive layers 1 from separating, the inner adhesive layer 2 is preferably made of a thermosetting or thermoplastic adhesive with good stability, such as thermoplastic polyimide, modified thermoplastic polyimide, acrylic, modified acrylic, epoxy resin, modified epoxy resin, etc. Unlike the inner adhesive layer 2, depending on the actual application of the conductive connector, the outer adhesive layer 3 can be made of either a repeatedly peelable pressure-sensitive adhesive, such as acrylic, silicone, or polyurethane pressure-sensitive adhesives, or a thermosetting or thermoplastic adhesive with good stability. Furthermore, when both the outer adhesive layer 3 and the inner adhesive layer 2 are made of thermosetting or thermoplastic adhesives, they can be different.

[0070] To make the features and beneficial effects of the conductive connector provided in the embodiments of the present invention more easily understood, the following will be described in conjunction with the accompanying drawings. Figure 13 The conductive connector employing a double conductive layer 1 is described in further detail.

[0071] like Figure 13 As shown, the conductive connector includes a first conductive layer 1a, an inner adhesive film layer 2, and a second conductive layer 1b stacked sequentially. Clearly, the first conductive layer 1a and the second conductive layer 1b constitute the outer conductive layer 101 of the conductive connector, which lacks an inner conductive layer 102. The two sides of the first conductive layer 1a are respectively provided with a first protrusion 11a and a second protrusion 11b, and the two sides of the second conductive layer 1b are respectively provided with a third protrusion 11c and a fourth protrusion 11d. The surface of the first conductive layer 1a containing the first protrusion 11a faces the surface of the second conductive layer 1b containing the third protrusion 11c, while the surface of the first conductive layer 1a containing the second protrusion 11b faces away from the surface of the second conductive layer 1b containing the fourth protrusion 11d. Furthermore, the first protrusion 11a and the third protrusion 11c protrude into the inner adhesive film layer 2 and are interconnected. Based on this, an electrical connection is established between the first conductive layer 1a and the second conductive layer 1b through the first protrusion 11a and the third protrusion 11c.

[0072] Furthermore, such as Figure 13 As shown, a first outer adhesive film layer 3a is provided on the surface of the first conductive layer 1a where the second protrusion 11b is located, and the second protrusion 11b is hidden within the first outer adhesive film layer 3a; similarly, a second outer adhesive film layer 3b is provided on the surface of the second conductive layer 1b where the fourth protrusion 11d is located, and the fourth protrusion 11d is hidden within the second outer adhesive film layer 3b. Thus, when the conductive connector is clamped between two circuit boards or between a circuit board and a grounding metal plate, the static charge on the circuit board on the same side as the first conductive layer 1a is sequentially conducted through the second protrusion 11b, the first conductive layer 1a, the first protrusion 11c, the second conductive layer 1b, and the fourth protrusion 11d to the circuit board or grounding metal plate on the same side as the second conductive layer 1b, thereby achieving the transfer of static charge.

[0073] Example 2

[0074] This invention provides a method for manufacturing the above-mentioned conductive connector, comprising the following steps:

[0075] Step 1: Form a protrusion on the outer surface of the thin copper layer of the peelable copper foil;

[0076] Step 2: Form an inner adhesive film layer on the thin copper layer that forms the raised portion of the peelable copper foil;

[0077] Step 3: Take any two peelable copper foils, and designate them as the first peelable copper foil and the second peelable copper foil respectively. Press the first peelable copper foil and the second peelable copper foil together with thin copper layers facing each other until they are pressed together. At this time, an inner adhesive film layer is formed between the two peelable copper foils, which is designated as the first inner adhesive film layer. The protrusions on the outer surface of the thin copper layer of the first peelable copper foil and the protrusions on the outer surface of the thin copper layer of the second peelable copper foil protrude into the first inner adhesive film layer and are connected to each other.

[0078] Step four: peel off the carrier layer of the first peelable copper foil and the carrier layer of the second peelable copper foil respectively. The thin copper layer of the first peelable copper foil is referred to as the first thin copper layer, and the thin copper layer of the second peelable copper foil is referred to as the second thin copper layer. Thus, the first thin copper layer, the first inner adhesive film layer, and the second thin copper layer are stacked in sequence to form the simplest conductive connector (i.e., only two thin copper layers are provided).

[0079] To obtain a more complex conductive connector (i.e., with at least three thin copper layers), the following steps are required after step four above:

[0080] Step 5: Form a protrusion on the surface of the second thin copper layer that faces away from the first inner adhesive film layer;

[0081] Step 6: Take another piece of peelable copper foil and designate it as the third peelable copper foil. Press the thin copper layer of the third peelable copper foil with the second thin copper layer until they are pressed together. At this time, an inner adhesive film layer is formed between the thin copper layer of the third peelable copper foil and the second thin copper layer. This inner adhesive film layer is designated as the second inner adhesive film layer. The protrusions on the surface of the second thin copper layer facing away from the first inner adhesive film layer and the protrusions on the outer surface of the thin copper layer of the third peelable copper foil protrude into the second inner adhesive film layer and are connected to each other.

[0082] Step 7: Peel off the carrier layer of the third peelable copper foil and denote the thin copper layer of the third peelable copper foil as the third thin copper layer. At this point, the first thin copper layer, the first inner adhesive film layer, the second thin copper layer, the second inner adhesive film layer and the third thin copper layer are stacked in sequence to form a conductive connector with three thin copper layers.

[0083] Step 8: As needed, refer to steps 5 to 7 to continue pressing new peelable copper foil until the desired conductive connector is obtained.

[0084] Optionally, to further improve the conductivity of the conductive connector, after stripping the carrier layer of the outermost peelable copper foil of the conductive connector, the following steps can be performed:

[0085] A protrusion is formed on the surface of the thin copper layer on the outermost side of the conductive connector, opposite to the inner adhesive film layer.

[0086] Alternatively, to obtain a conductive connector with an outer adhesive film layer, the following steps can be performed after the previous step:

[0087] An outer adhesive film layer is formed on the side of the thin copper layer located on the outermost side of the conductive connector, opposite to the inner adhesive film layer.

[0088] In the above manufacturing method, the specific steps for forming the inner or outer adhesive film layer include:

[0089] First, an inner adhesive film layer or an outer adhesive film layer is coated on the release film. Then, the inner adhesive film layer or the outer adhesive film layer is pressed and transferred onto the surface of the thin copper layer through the release film.

[0090] Alternatively, an inner or outer adhesive film layer can be directly coated onto the surface of a thin copper layer.

[0091] In the above manufacturing methods, one or more of the following methods are used to form protrusions on the surface of a thin copper layer: electroplating, electroless plating, physical vapor deposition, and chemical vapor deposition.

[0092] Furthermore, the carrier layer of the peelable copper foil includes a peelable layer, a barrier layer, and a main body layer. The thin copper layer, the peelable layer, the barrier layer, and the main body layer are stacked sequentially, or the thin copper layer, the barrier layer, the peelable layer, and the main body layer are stacked sequentially. The main body layer can be an organic thin film layer or a metal thin film layer, such as a copper layer.

[0093] Finally, it should be noted that the thin copper layer in this embodiment is the same as the conductive layer in Embodiment 1.

[0094] In summary, the present invention provides a conductive connector comprising at least two conductive layers 1, with an inner adhesive layer 2 disposed between any two adjacent conductive layers 1. A protrusion 11 is provided on the surface of the conductive layer 1 facing the inner adhesive layer 2, and the protrusions 11 on opposite side surfaces of any two adjacent conductive layers 1 protrude into and are interconnected within the inner adhesive layer 2 between the two conductive layers 1. Compared with the prior art, this conductive connector has advantages such as simple manufacturing process, low production cost, and good conductivity.

[0095] In addition, the present invention also provides a method for manufacturing the above-mentioned conductive connector, which has the advantages of simple operation and easy implementation.

[0096] It should be understood that the terms "first," "second," etc., are used in this invention to describe various types of information, but these terms are not limited to them; they are only used to distinguish information of the same type from one another. For example, without departing from the scope of this invention, "first" information may also be referred to as "second" information, and similarly, "second" information may also be referred to as "first" information.

[0097] The above description represents the preferred embodiments of the present invention. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principles of the present invention, and these improvements and modifications are also considered to be within the scope of protection of the present invention.

Claims

1. A conductive connector, characterized in that, The device comprises at least two conductive layers, the surfaces of which are rough or smooth. An inner adhesive film layer is provided between any two adjacent conductive layers. Each conductive layer has protrusions on its surface facing the inner adhesive film layer. These protrusions are regular or irregular three-dimensional geometric shapes. The protrusions on opposite sides of any two adjacent conductive layers protrude into the inner adhesive film layer between them. These protrusions on opposite sides of any two adjacent conductive layers are interconnected within the inner adhesive film layer, thereby forming an electrical connection between the two conductive layers through the connections between the protrusions protruding into the inner adhesive film layer. The conductive layer located on the outermost side of the conductive connector is referred to as the outer conductive layer, and the surface of the outer conductive layer facing away from the inner adhesive film layer is also provided with the protrusion; The outer conductive layer is further provided with an outer adhesive film layer on the side opposite to the inner adhesive film layer, and the protrusion on the surface of the outer conductive layer opposite to the inner adhesive film layer is hidden in the outer adhesive film layer. The thickness of the outer adhesive film layer is less than the average value of the height of the protrusion itself.

2. The conductive connector according to claim 1, characterized in that, The protrusions can be angular, conical, granular, dendritic, columnar, or blocky.

3. The conductive connector according to claim 1, characterized in that, The material of the protrusion is one or more of the following: copper, nickel, tin, lead, chromium, molybdenum, zinc, gold, and silver.

4. The conductive connector according to claim 1, characterized in that, The height of the protrusion ranges from 0.2 to 30 μm.

5. The conductive connector according to claim 1, characterized in that, The protrusions located on the same side surface of the conductive layer are set to be two or more, and the two or more protrusions are distributed continuously or discontinuously. The shapes of the protrusions are the same or different, and the sizes of the protrusions are the same or different.

6. The conductive connector according to claim 1, characterized in that, The thickness of the conductive layer ranges from 1 to 18 μm.

7. The conductive connector according to claim 1, characterized in that, The inner adhesive film layer is made of thermosetting adhesive or thermoplastic adhesive.

8. The conductive connector according to claim 1, characterized in that, The outer adhesive film layer is made of pressure-sensitive adhesive.

9. The conductive connector according to claim 1, characterized in that, The outer adhesive film layer is made of thermosetting adhesive or thermoplastic adhesive.

10. A method for manufacturing a conductive connector, characterized in that, Includes the following steps: A protrusion is formed on the outer surface of a thin copper layer that can be peeled off copper foil; An inner adhesive film layer is formed on a thin copper layer that forms raised portions of a peelable copper foil; Take any two peelable copper foils, and denote them as the first peelable copper foil and the second peelable copper foil respectively. Press the first peelable copper foil and the second peelable copper foil together with thin copper layers facing each other until they are pressed together. At this time, an inner adhesive film layer is formed between the two peelable copper foils, which is referred to as the first inner adhesive film layer. The protrusions on the outer surface of the thin copper layer of the first peelable copper foil and the protrusions on the outer surface of the thin copper layer of the second peelable copper foil protrude into the first inner adhesive film layer, and the protrusions on the outer surface of the thin copper layer of the first peelable copper foil and the protrusions on the outer surface of the thin copper layer of the second peelable copper foil are connected to each other in the first inner adhesive film layer. The carrier layer of the first peelable copper foil and the carrier layer of the second peelable copper foil are peeled off respectively. After peeling off the carrier layer of the peelable copper foil on the outermost side of the conductive connector, a protrusion is formed on the surface of the thin copper layer on the outermost side of the conductive connector, facing away from the inner adhesive film layer. An outer adhesive film layer is formed on the side of the thin copper layer located on the outermost side of the conductive connector, opposite to the inner adhesive film layer. The thickness of the outer adhesive film layer is less than the average height of the protrusion itself.

11. The method for manufacturing a conductive connector according to claim 10, characterized in that, After stripping the carrier layer of the first peelable copper foil and the carrier layer of the second peelable copper foil, and before stripping the carrier layer of the outermost peelable copper foil of the conductive connector, the following steps are also included: A protrusion is formed on the surface of the thin copper layer of the second peelable copper foil opposite to the surface of the first inner adhesive film layer; Take another piece of peelable copper foil, and designate it as the third peelable copper foil. Press the thin copper layer of the third peelable copper foil and the thin copper layer of the second peelable copper foil together until they are pressed together. At this time, an inner adhesive film layer is formed between the thin copper layer of the third peelable copper foil and the thin copper layer of the second peelable copper foil, and designate it as the second inner adhesive film layer. The protrusions on the surface of the thin copper layer of the second peelable copper foil facing away from the first inner adhesive film layer and the protrusions on the outer surface of the thin copper layer of the third peelable copper foil protrude into the second inner adhesive film layer, and the protrusions on the surface of the thin copper layer of the second peelable copper foil facing away from the first inner adhesive film layer and the protrusions on the outer surface of the thin copper layer of the third peelable copper foil are connected to each other in the second inner adhesive film layer. Remove the carrier layer of the third peelable copper foil; As needed, continue pressing new peelable copper foil following the steps above.

12. The method for manufacturing a conductive connector according to any one of claims 10 or 11, characterized in that, The steps for forming the inner or outer adhesive film layer include: An inner or outer adhesive film layer is coated on a release film, and then the inner or outer adhesive film layer is pressed and transferred onto the surface of a thin copper layer through the release film. Alternatively, an inner or outer adhesive film layer can be directly coated onto the surface of a thin copper layer.

13. The method for manufacturing a conductive connector according to claim 10, characterized in that, One or more of the following methods are used to form protrusions on the surface of a thin copper layer: electroplating, electroless plating, physical vapor deposition, and chemical vapor deposition.

14. The method for manufacturing a conductive connector according to any one of claims 10 or 11, characterized in that, The carrier layer includes a peelable layer, a barrier layer, and a main body layer, and the thin copper layer, the peelable layer, the barrier layer, and the main body layer are stacked sequentially, or the thin copper layer, the barrier layer, the peelable layer, and the main body layer are stacked sequentially.

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