A circuit board stack-up structure production equipment

Abstract

This invention relates to the field of circuit board manufacturing equipment, and more particularly to a circuit board laminate manufacturing equipment, comprising a sandwich structure lamination device, a prepreg loading device, an inner layer board loading device, a stacking device, a first transfer device, a second transfer device, a third transfer device, and a final stacking table. The sandwich structure lamination device is used to laminate copper foil and a mirror plate into a sandwich structure. The first transfer device is used to transfer the sandwich structure from the sandwich structure lamination device to the final stacking table. The second transfer device is used to transfer the inner layer board from the inner layer board loading device to the stacking table of the stacking device. The prepreg loading device is used to transfer the prepreg to the stacking table. The stacking device is used to laminate the prepreg and the inner layer board into a prepreg-inner layer board-prepreg structure. The third transfer device is used to transfer the prepreg-inner layer board-prepreg structure to the final stacking table. This equipment can improve the production efficiency of circuit board laminate structures.

Description

Technical Field

[0001] This invention relates to the field of circuit board manufacturing equipment, and more particularly to a circuit board laminate structure manufacturing equipment. Background Technology

[0002] The required structure for a finished circuit board is copper foil-prepreg-inner layer board-prepreg-copper foil. Therefore, a large number of layers are required during production. In order to separate the required structures of the two circuit boards, a mirror plate is added between the copper foils. The copper foil-mirror plate-copper foil structure is called a sandwich structure.

[0003] Therefore, during circuit board production, a cyclic stacked structure of copper foil-mirror plate-copper foil-prepreg-inner layer board-prepreg-copper foil-mirror plate-copper foil is formed, which is also known as a sandwich structure-prepreg-inner layer board-prepreg-sandwich structure. Subsequently, the structure between the two mirror plates is the structure required for the finished circuit board.

[0004] However, existing equipment cannot fully perform the aforementioned layering process. Summary of the Invention

[0005] The purpose of this invention is to provide a circuit board stacking structure production equipment, which aims to solve the problem that existing equipment cannot completely complete the above-mentioned stacking.

[0006] To achieve the above objectives, the present invention provides a circuit board stacking structure production equipment, comprising a sandwich structure stacking device, a prepreg loading device, an inner layer board loading device, a stacking device, a first transfer device, a second transfer device, a third transfer device, and a final stacking table; the sandwich structure stacking device is used to stack copper foil and a mirror plate into a sandwich structure; the first transfer device is used to transfer the sandwich structure from the sandwich structure stacking device to the final stacking table; the second transfer device is used to transfer the inner layer board from the inner layer board loading device to the stacking table of the stacking device; the prepreg loading device is used to transfer the prepreg to the stacking table; the stacking device is used to stack the prepreg and the inner layer board into a prepreg-inner layer board-prepreg structure; the third transfer device is used to transfer the prepreg-inner layer board-prepreg structure to the final stacking table; during production, the sandwich structure and the prepreg-inner layer board-prepreg structure are stacked sequentially in the final stacking table.

[0007] Further, the sandwich structure stacking device includes a first copper foil storage frame, a second copper foil storage frame, a mirror plate feeding device, a material discharging device, a first copper foil transfer device, a second copper foil transfer device, and a mirror plate transfer device; the material discharging device has a receiving position and a discharging position; the mirror plate feeding device is used to feed the mirror plate and position the received mirror plate; the first copper foil transfer device is used to transfer the copper foil from the first copper foil storage frame to above the mirror plate of the mirror plate feeding device; the second copper foil transfer device is used to transfer the copper foil from the second copper foil storage frame to the receiving position of the material discharging device; the mirror plate transfer device is used to transfer the stacked structure of copper foil and mirror plate from the mirror plate feeding device to above the copper foil of the material discharging device; the material discharging device delivers the sandwich structure from the receiving position to the discharging position.

[0008] Furthermore, the prepreg feeding device includes a prepreg storage frame, a pick-and-place mechanism, and an air suction nozzle and a pressure bar disposed on the prepreg storage frame; the pick-and-place mechanism is adapted to move above the prepreg storage frame and pick up the prepreg from the storage frame, the pick-and-place mechanism is provided with a flanging mechanism, the flanging mechanism is used to fold the edge portion of the picked-up prepreg upwards, the air suction nozzle is adapted to suck air from bottom to top into the folded edge portion of the prepreg to separate the adhered prepreg, the pressure bar is adapted to press down the separated prepreg located below; the pick-and-place mechanism delivers the separated prepreg to the stacking table.

[0009] Furthermore, the pick-and-place mechanism includes a mounting frame, a fixed frame, a flanging frame, a flanging drive mechanism, and multiple suction cups. The fixed frame is fixed to the mounting frame, the flanging frame is rotatably connected to the fixed frame, the multiple suction cups are distributed and installed on the fixed frame and the flanging frame, and the flanging drive mechanism is connected between the fixed frame and the flanging frame to drive the flanging frame to rotate relative to the fixed frame.

[0010] Furthermore, the circuit board stacking structure production equipment includes two sets of prepreg feeding devices arranged one above the other; the stacking device includes a lifting mechanism for driving the stacking platform to rise and fall. When the stacking platform moves to a low position, the prepreg feeding device located below can place the prepreg on the stacking platform; when the stacking platform moves to a high position, the prepreg feeding device located above can place the prepreg on the stacking platform.

[0011] Furthermore, the suction nozzle is installed in the semi-cured sheet storage frame via a telescopic mechanism. The telescopic mechanism is inclined, and the suction nozzle can move to an extended position and a retracted position. When the suction nozzle is in the extended position, the suction nozzle is close to the semi-cured sheet. When the suction nozzle is in the retracted position, the suction nozzle is away from the semi-cured sheet and can avoid the semi-cured sheet.

[0012] Furthermore, the pressure rod is installed in the prepreg storage frame via a bidirectional drive mechanism. The bidirectional drive mechanism is used to drive the pressure rod to move longitudinally and vertically. The pressure rod can move to an extended position and a retracted position. When the pressure rod is in the extended position, it can press down on the prepreg. When the pressure rod is in the retracted position, it can avoid the prepreg.

[0013] Furthermore, the inner layer plate feeding device includes a feeding conveying mechanism, a flipping mechanism, and a discharging conveying mechanism connected in sequence. The inner layer plate is adapted to be conveyed by the feeding conveying mechanism, the flipping mechanism, and the discharging conveying mechanism in sequence. The flipping mechanism is capable of flipping the inner layer plate. The second transfer device is capable of picking up the inner layer plate from the discharging conveying mechanism.

[0014] Furthermore, the flipping mechanism includes a support frame, a flipping frame, and two sets of conveying rollers. The flipping frame is rotatably connected to the support frame, and the two sets of conveying rollers are installed parallel to each other on the flipping frame, forming a conveying channel between the two sets of conveying rollers.

[0015] Furthermore, a correction device is provided between the inner layer board loading device and the stacking device. The correction device includes a support, a storage platform, a correction mechanism, and a steering mechanism. The correction mechanism is used to correct the inner layer board placed on the storage platform. The steering mechanism is connected between the support and the storage platform to allow the storage platform to rotate horizontally relative to the support. The second transfer device can transfer the inner layer board from the inner layer board loading device to the correction device and then to the stacking device.

[0016] The circuit board stacking structure production equipment provided by this invention, when in use, achieves the cyclic stacking of copper foil-mirror plate-copper foil-prepreg-inner layer board-prepreg-copper foil-mirror plate-copper foil through the cooperation of various devices, thereby improving the production efficiency of circuit board stacking structure. Attached Figure Description

[0017] Figure 1 This is a three-dimensional structural diagram of the circuit board stacking structure production equipment of the present invention;

[0018] Figure 2 This is a top view of the circuit board stacking structure production equipment of the present invention;

[0019] Figure 3 This is a front view of the circuit board stacking structure production equipment of the present invention;

[0020] Figure 4 This is a three-dimensional structural diagram of a sandwich-structured stacked device;

[0021] Figure 5 This is a three-dimensional structural diagram of the prepreg feeding device and the stacking device.

[0022] Figure 6 This is a partial three-dimensional structural diagram of the pick-and-place mechanism;

[0023] Figure 7 This is a schematic diagram of the three-dimensional structure of the prepreg storage frame;

[0024] Figure 8 yes Figure 7 A magnified view of a portion at point A;

[0025] Figure 9 This is a three-dimensional structural diagram of the inner layer plate loading device;

[0026] Figure 10 This is a three-dimensional structural diagram of the flipping mechanism;

[0027] Figure 11 This is a partial three-dimensional structural diagram of the flipping mechanism;

[0028] Figure 12 This is a three-dimensional structural diagram of the calibration device.

[0029] [Explanation of Labels in the Attached Image]

[0030] 1-Sandwich structure stacking device, 11-First copper foil storage frame, 12-Second copper foil storage frame, 13-Mirror plate feeding device, 14-Material discharging device, 15-First copper foil transfer device, 16-Second copper foil transfer device, 17-Mirror plate transfer device;

[0031] 2-Prepreg feeding device, 21-Prepreg storage box, 22-Pick-and-place mechanism, 221-Mounting frame, 222-Fixing frame, 223-Flanging frame, 224-Flanging drive mechanism, 225-Suction cup, 226-Sliding drive mechanism, 227-Slide seat, 23-Suction nozzle, 231-Telescopic mechanism, 24-Pressure rod, 241-Bidirectional drive mechanism, 25-Prepreg correction mechanism;

[0032] 3-Inner layer plate loading device, 31-Feeding conveyor mechanism, 32-Tilting mechanism, 321-Support frame, 322-Tilting frame, 323-Conveying roller group, 33-Discharge conveyor mechanism;

[0033] 4-Stacking device, 41-Stacking platform, 42-Lifting mechanism;

[0034] 5-First transfer device;

[0035] 6-Second transfer device;

[0036] 7-Correction device, 71-Support, 72-Storage platform, 73-Correction mechanism, 74-Steering mechanism, 75-Lifting frame;

[0037] 8-Third transfer device;

[0038] 9-Main stacking platform, 91-First temporary platform, 92-Second temporary platform. Detailed Implementation

[0039] The present invention will be described in detail below with reference to specific embodiments.

[0040] In this invention, when directional terms appear, they are used for ease of description and simplification, not to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and should not be construed as limiting the specific scope of protection of this invention. In this invention, unless otherwise explicitly specified and limited, when terms such as "set in," "connected," or "linked" appear, these terms should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can also refer to a mechanical connection; they can refer to a direct connection or a connection through an intermediate medium; they can refer to the internal connection of two elements. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances. In this invention, unless otherwise specified and limited, when terms such as "above" or "below" the second feature, it can include direct contact between the first and second features, or it can include contact between the first and second features not being direct contact but through another feature between them. Furthermore, when the first feature is "above" the second feature, it includes the first feature being directly above or diagonally above the second feature, or simply indicates that the height of the first feature is higher than the height of the second feature; when the first feature is "below" the second feature, it includes the first feature being directly below or diagonally below the second feature, or simply indicates that the height of the first feature is lower than the height of the second feature.

[0041] This invention provides a circuit board stack-up structure production equipment, such as... Figures 1 to 12As shown, it includes a sandwich structure stacking device 1, a prepreg feeding device 2, an inner layer board feeding device 3, a stacking device 4, a first transfer device 5, a second transfer device 6, a third transfer device 8, and a total stacking table 9. The sandwich structure stacking device 1 is used to stack copper foil and mirror plate into a sandwich structure. The first transfer device 5 is used to transfer the sandwich structure from the sandwich structure stacking device 1 to the total stacking table 9. The second transfer device 6 is used to transfer the inner layer board from the inner layer board feeding device 3 to the stacking table 41 of the stacking device 4. The prepreg feeding device 2 is used to transfer the prepreg to the stacking table 41. The stacking device 4 is used to stack the prepreg and the inner layer board into a prepreg-inner layer board-prepreg structure. The third transfer device 8 is used to transfer the prepreg-inner layer board-prepreg structure to the total stacking table 9. During production, the sandwich structure and the prepreg-inner layer board-prepreg structure are stacked sequentially in the total stacking table 9.

[0042] Based on the above structure, when this type of circuit board stacking structure production equipment is used, the cooperation of various devices can realize the cyclic stacking of copper foil-mirror plate-copper foil-prepreg-inner layer board-prepreg-copper foil-mirror plate-copper foil, thereby improving the production efficiency of the circuit board stacking structure.

[0043] In this embodiment, the sandwich structure stacking device 1 includes a first copper foil storage frame 11, a second copper foil storage frame 12, a mirror plate feeding device 13, a material discharging device 14, a first copper foil transfer device 15, a second copper foil transfer device 16, and a mirror plate transfer device 17. The material discharging device 14 has a receiving position and a discharging position. The mirror plate feeding device 13 is used to feed the mirror plate and position the received mirror plate. The first copper foil transfer device 15 is used to transfer the copper foil from the first copper foil storage frame 11 to above the mirror plate of the mirror plate feeding device 13. The second copper foil transfer device 16 is used to transfer the copper foil from the second copper foil storage frame 12 to the receiving position of the material discharging device 14. The mirror plate transfer device 17 is used to transfer the stacked structure of copper foil and mirror plate from the mirror plate feeding device 13 to above the copper foil of the material discharging device 14. The material discharging device 14 delivers the sandwich structure from the receiving position to the discharging position.

[0044] With the above structural setup, the following actions can be achieved: feeding the mirror plate, after the mirror plate is in place, placing the first layer of copper foil on top of the mirror plate, and then placing the stacked structure of copper foil and mirror plate on top of another layer of copper foil to form a copper foil sandwich structure, and then sending out the sandwich structure.

[0045] In this embodiment, the prepreg feeding device 2 includes a prepreg storage frame 21, a pick-and-place mechanism 22, and a suction nozzle 23 and a pressure rod 24 disposed on the prepreg storage frame 21. The pick-and-place mechanism 22 is adapted to move above the prepreg storage frame 21 and pick up the prepreg from the prepreg storage frame 21. The pick-and-place mechanism 22 is provided with a flanging mechanism, which is used to fold the edge portion of the picked-up prepreg upwards. The suction nozzle 23 is adapted to suck air from bottom to top into the folded edge portion of the prepreg to separate the adhered prepreg. The pressure rod 24 is adapted to press down the separated prepreg located below. The pick-and-place mechanism 22 delivers the separated prepreg to the stacking table 41.

[0046] Based on the above structure, the pick-and-place mechanism 22 picks up the prepreg and folds the edges of the prepreg to make it easier to separate prepregs that are stuck together. Then, the suction nozzle 23 sucks air towards the folded edges. Through the suction, the pick-and-place mechanism 22 holds the topmost prepreg, and the suction nozzle 23 pulls the lower prepregs downward, creating a gap between the lower and top prepregs. The pressure rod 24 is inserted into the gap and presses down the lower prepreg, thus separating the topmost and bottom prepregs. The pick-and-place mechanism 22 moves away to remove the individual prepreg from the stack of prepregs.

[0047] In this embodiment, the pick-and-place mechanism 22 includes a mounting frame 221, a fixed frame 222, a flanging frame 223, a flanging drive mechanism 224, and multiple suction cups 225. The fixed frame 222 is fixed to the mounting frame 221, the flanging frame 223 is rotatably connected to the fixed frame 222, and the multiple suction cups 225 are distributed and installed on the fixed frame 222 and the flanging frame 223. The flanging drive mechanism 224 is connected between the fixed frame 222 and the flanging frame 223 and drives the flanging frame 223 to rotate relative to the fixed frame 222. This structure enables the pick-up of the prepreg and the flanging of the prepreg. The flanging drive mechanism 224 is preferably a telescopic cylinder, such as a pneumatic cylinder or a hydraulic cylinder, which drives the flanging frame 223 to rotate relative to the fixed frame 222 by extending and retracting the telescopic cylinder. Preferably, the device further includes a slide 227, which is mounted on the prepreg storage frame 21 via a sliding drive mechanism 226. The slide 227 is also equipped with a lifting mechanism, and the mounting frame 221 is mounted on the movable end of the lifting mechanism. This structure enables the mounting frame 221 to lift, slide, and transfer the prepreg. More preferably, a prepreg correction mechanism 25 is provided between the prepreg storage frame 21 and the stacking device 4. The picking and placing mechanism 22 can place the prepreg in the prepreg correction mechanism 25 to correct the orientation and position of the prepreg before sending it to the stacking device 4.

[0048] In this embodiment, the circuit board stacking structure production equipment includes two sets of prepreg feeding devices 2 arranged one above the other; the stacking device 4 includes a lifting mechanism 42 for driving the stacking platform 41 to rise and fall. When the stacking platform 41 moves to a low position, the prepreg feeding device 2 located below can place the prepreg on the stacking platform 41; when the stacking platform 41 moves to a high position, the prepreg feeding device 2 located above can place the prepreg on the stacking platform 41.

[0049] Based on the above structure, the stacking platform 41 first lowers to a low position, and the prepreg feeding device 2 located below transfers the prepreg from the prepreg storage box 21 to the stacking platform 41. Then, the second transfer device 6 places the inner layer board on top of the lower prepreg. After that, the stacking platform 41 rises to a high position, and the prepreg feeding device 2 located above transfers the prepreg from the prepreg storage box 21 to the stacking platform 41. The prepreg is placed on top of the inner layer board, thus completing the work of placing two layers of prepreg on the front and back of the inner layer board.

[0050] In this embodiment, the suction nozzle 23 is mounted on the prepreg storage frame 21 via a telescopic mechanism 231. The telescopic mechanism 231 is inclined, allowing the suction nozzle 23 to move to both an extended and retracted position. When the suction nozzle 23 is in the extended position, it is close to the prepreg; when it is in the retracted position, it is away from the prepreg and can avoid it. Based on this structure, it is possible to prevent the pick-and-place mechanism 22 from hitting the suction nozzle 23 when picking up the prepreg, and when the suction nozzle 23 needs to pick up the prepreg, it extends and approaches the prepreg.

[0051] In this embodiment, the pressure rod 24 is mounted on the prepreg storage frame 21 via a bidirectional drive mechanism 241. The bidirectional drive mechanism 241 drives the pressure rod 24 to move longitudinally and vertically, allowing it to move to both extended and retracted positions. When the pressure rod 24 is in the extended position, it presses down on the prepreg; when it is in the retracted position, it avoids the prepreg. Based on this structure, when the pick-and-place mechanism 22 picks up the prepreg, the pressure rod 24 can prevent it from obstructing the prepreg's rise. When it is necessary to press down on the prepreg, the pressure rod 24 can move above the lower prepreg and then extend into it. Furthermore, the pressure rod 24 is designed to move vertically. After rising, the pressure rod 24 enters the gap between the prepregs, resulting in a high success rate. After entering the gap, the pressure rod 24 descends, pressing down on the prepreg.

[0052] In this embodiment, the inner layer board feeding device 3 includes a feeding conveying mechanism 31, a flipping mechanism 32, and a discharging conveying mechanism 33 connected in sequence. The inner layer board is adapted to be conveyed sequentially by the feeding conveying mechanism 31, the flipping mechanism 32, and the discharging conveying mechanism 33. The flipping mechanism 32 can flip the inner layer board. The second transfer device 6 can pick up the inner layer board from the discharging conveying mechanism 33. Based on the above structure, the flipping mechanism 32 can flip the inner layer board to adapt to different production needs.

[0053] In this embodiment, the flipping mechanism 32 includes a support frame 321, a flipping frame 322, and two sets of conveyor rollers 323. The flipping frame 322 is rotatably connected to the support frame 321, and the two sets of conveyor rollers 323 are installed parallel to each other on the flipping frame 322, forming a conveying channel between the two sets of conveyor rollers 323. The inner layer board enters the conveying channel for conveying. When the inner layer board needs to be flipped, the conveyor rollers 323 stop rotating, the inner layer board stays on the flipping mechanism 32, and the flipping frame 322 rotates 180 degrees to flip the inner layer board. After flipping, the inner layer board is sent out. When the inner layer board does not need to be flipped, the conveyor rollers 323 do not stop rotating, and the inner layer board can pass directly through the flipping mechanism 32.

[0054] In this embodiment, a correction device 7 is provided between the inner layer board loading device 3 and the stacking device 4. The correction device 7 includes a support 71, a storage platform 72, a correction mechanism 73, and a turning mechanism 74. The correction mechanism 73 is used to correct the inner layer board placed on the storage platform 72. The turning mechanism 74 is connected between the support 71 and the storage platform 72 to allow the storage platform 72 to rotate horizontally relative to the support 71. The second transfer device 6 can transfer the inner layer board from the inner layer board loading device 3 to the correction device 7 and then to the stacking device 4. Based on the above structure, the inner layer board is corrected by the correction device 7 before being sent to the stacking device 4, which improves the stacking quality. Preferably, a lifting frame 75 is also provided on the support 71. The lifting frame 75 is used to drive the storage platform 72 to rise and fall. After the storage platform 72 is raised, it can avoid the correction mechanism 73, so that when the turning mechanism 74 drives the storage platform 72 to turn, it avoids colliding with the correction mechanism 73.

[0055] In this embodiment, as Figures 1 to 3As shown, a first temporary storage platform 91 and a second temporary storage platform 92 are provided on both sides of the main stacking platform 9. The first temporary storage platform 91 is used to temporarily store the sandwich structure, and the second temporary storage platform 92 is used to temporarily store the prepreg-inner layer-prepreg structure. The first transfer device 5 is configured as a double-head linkage, the second transfer device 6 is configured as a three-head linkage, and the third transfer device 8 is configured as a single-head. The first head of the first transfer device 5 transfers the sandwich structure from the structure stacking device 1 to the first temporary storage platform 91, and simultaneously, the second head of the first transfer device 5 transfers the sandwich structure from the first temporary storage platform 91 to the main stacking platform 9. The first head of the second transfer device 6 transfers the inner layer board from the inner layer board loading device 3 to the correction device 7, and simultaneously, the second head of the second transfer device 6 transfers the inner layer board from the correction device 7 to the stacking device 4, and simultaneously, the third head of the second transfer device 6 transfers the prepreg-inner layer-prepreg structure from the stacking device 4 to the second temporary storage platform 92. The third transfer device 8 transfers the prepreg-inner layer-prepreg structure from the second temporary storage platform 92 to the main stacking platform 9. The above actions complete the orderly and efficient transfer of various materials. Once the timing is set, the materials can be stacked accurately.

[0056] The circuit board stacking structure production equipment provided by this invention, when in use, achieves the cyclic stacking of copper foil-mirror plate-copper foil-prepreg-inner layer board-prepreg-copper foil-mirror plate-copper foil through the cooperation of various devices, thereby improving the production efficiency of circuit board stacking structure.

[0057] Where there is no conflict, the above embodiments and features can be combined with each other.

[0058] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit the scope of protection of the present invention. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the essence and scope of the technical solutions of the present invention.

Claims

1. A circuit board stack-up structure production equipment, characterized in that: It includes a sandwich structure stacking device (1), a prepreg feeding device (2), an inner layer board feeding device (3), a stacking device (4), a first transfer device (5), a second transfer device (6), a third transfer device (8), and a total stacking platform (9); The sandwich structure stacking device (1) is used to stack copper foil and mirror plate into a sandwich structure; The first transfer device (5) is used to transfer the sandwich structure from the sandwich structure stacking device (1) to the total stacking stage (9); The second transfer device (6) is used to transfer the inner layer board from the inner layer board loading device (3) to the stacking table (41) of the stacking device (4); The prepreg feeding device (2) is used to transfer the prepreg to the stacking table (41); the prepreg feeding device (2) includes a prepreg storage frame (21), a pick-and-place mechanism (22), and a suction nozzle (23) and a pressure rod (24) disposed on the prepreg storage frame (21); the pick-and-place mechanism (22) is adapted to move above the prepreg storage frame (21) and pick up the prepreg from the storage frame, the pick-and-place mechanism (22) is provided with a flanging mechanism, the flanging mechanism is used to fold the edge portion of the picked-up prepreg upwards; the suction nozzle (23) is adapted to suck air from bottom to top onto the folded edge portion of the prepreg to separate the adhered prepreg, the pressure rod (24) is adapted to press down the separated prepreg located below; the pick-and-place mechanism (22) sends the separated prepreg to the stacking table (41); the suction nozzle ( 23) The semi-cured sheet storage frame (21) is installed via a telescopic mechanism (231), which is inclined. The suction nozzle (23) can move to the extended position and the retracted position. When the suction nozzle (23) is in the extended position, it is close to the semi-cured sheet. When the suction nozzle (23) is in the retracted position, it is far away from the semi-cured sheet and can avoid it. The pressure rod (24) is installed in the semi-cured sheet storage frame (21) via a bidirectional drive mechanism (241), which drives the pressure rod (24) to move longitudinally and vertically. The pressure rod (24) can move to the extended position and the retracted position. When the pressure rod (24) is in the extended position, it can press down on the semi-cured sheet. When the pressure rod (24) is in the retracted position, it can avoid the semi-cured sheet. The stacking device (4) is used to stack the prepreg and the inner layer plate into a prepreg-inner layer plate-prepreg structure; The third transfer device (8) is used to transfer the prepreg-inner layer-prepreg structure to the overall stacking platform (9); During production, the sandwich structure and the prepreg-inner plate-prepreg structure are stacked sequentially in the total stacking platform (9).

2. The circuit board stack-up structure production equipment according to claim 1, characterized in that: The sandwich structure stacking device (1) includes a first copper foil storage frame (11), a second copper foil storage frame (12), a mirror plate feeding device (13), a material discharging device (14), a first copper foil transfer device (15), a second copper foil transfer device (16), and a mirror plate transfer device (17). The material delivery device (14) has a receiving position and a discharging position; The mirror plate feeding device (13) is used to feed the mirror plate and position the delivered mirror plate; The first copper foil transfer device (15) is used to transfer copper foil from the first copper foil storage frame (11) to the top of the mirror plate of the mirror plate feeding device (13); The second copper foil transfer device (16) is used to transfer copper foil from the second copper foil storage box (12) to the receiving position of the material delivery device (14); The mirror plate transfer device (17) is used to transfer the laminated structure of copper foil and mirror plate from the mirror plate feeding device (13) to the top of the copper foil of the material discharging device (14); The material delivery device (14) delivers the sandwich structure from the receiving position to the discharging position.

3. The circuit board stack-up structure production equipment according to claim 2, characterized in that: The pick-and-place mechanism (22) includes a mounting frame (221), a fixing frame (222), a flanging frame (223), a flanging drive mechanism (224), and a plurality of suction cups (225). The fixing frame (222) is fixed to the mounting frame (221), and the flanging frame (223) is rotatably connected to the fixing frame (222). The plurality of suction cups (225) are distributed and installed on the fixing frame (222) and the flanging frame (223). The flanging drive mechanism (224) is connected between the fixing frame (222) and the flanging frame (223) and drives the flanging frame (223) to rotate relative to the fixing frame (222).

4. The circuit board stack-up structure production equipment according to claim 3, characterized in that: The circuit board stacked structure production equipment includes two sets of prepreg feeding devices (2) arranged one above the other; The stacking device (4) includes a lifting mechanism (42) for driving the stacking platform (41) to rise and fall. When the stacking platform (41) moves to a low position, the prepreg feeding device (2) located below can place the prepreg on the stacking platform (41); when the stacking platform (41) moves to a high position, the prepreg feeding device (2) located above can place the prepreg on the stacking platform (41).

5. The circuit board stack-up structure production equipment according to claim 1, characterized in that: The inner layer plate feeding device (3) includes a feeding conveying mechanism (31), a flipping mechanism (32) and a discharging conveying mechanism (33) connected in sequence. The inner layer plate is adapted to be conveyed by the feeding conveying mechanism (31), the flipping mechanism (32) and the discharging conveying mechanism (33) in sequence. The flipping mechanism (32) is capable of flipping the inner layer plate. The second transfer device (6) is capable of picking up the inner layer plate from the discharge conveyor (33).

6. The circuit board stack-up structure production equipment according to claim 5, characterized in that: The flipping mechanism (32) includes a support frame (321), a flipping frame (322), and two sets of conveying rollers (323). The flipping frame (322) is rotatably connected to the support frame (321), and the two sets of conveying rollers (323) are installed parallel to each other on the flipping frame (322), forming a conveying channel between the two sets of conveying rollers (323).

7. The circuit board stack-up structure production equipment according to claim 5 or 6, characterized in that: A correction device (7) is provided between the inner layer board loading device (3) and the stacking device (4). The correction device (7) includes a support (71), a storage platform (72), a correction mechanism (73), and a turning mechanism (74). The correction mechanism (73) is used to correct the inner layer board placed on the storage platform (72). The turning mechanism (74) is connected between the support (71) and the storage platform (72) to make the storage platform (72) rotate horizontally relative to the support (71). The second transfer device (6) can transfer the inner layer board from the inner layer board loading device (3) to the correction device (7) and then to the stacking device (4).

Images