Radiating components, radiators and air conditioners

Abstract

The present application relates to the field of chip heat dissipation technology and discloses a heat dissipation component comprising a base, the base comprising: an airflow heat dissipation portion configured to dissipate heat based on the airflow flowing therethrough; and a phase change heat dissipation portion, provided with a working fluid flow path capable of circulating a working fluid, configured to dissipate heat based on phase change in the working fluid flow path. The base of the heat dissipation component provided in the present application includes both an airflow heat dissipation portion and a phase change heat dissipation portion, both of which have different heat dissipation capabilities, and can provide targeted heat dissipation for chips with different heat generation, thereby improving the heat dissipation effect of the heat dissipation component. The present application also discloses a radiator and an air conditioner comprising the aforementioned heat dissipation component.

Description

Technical Field

[0001] The present application relates to the technical field of chip heat dissipation, for example, to a heat dissipation component, a radiator and an air conditioner. Background Art

[0002] The chips in an air conditioner's outdoor unit generate a significant amount of heat during operation. If this heat cannot be dissipated promptly, the chip's temperature will continue to rise, affecting its normal operation and even the air conditioner's operational stability and lifespan. Currently, heat sinks, such as finned heat sinks, are often used to dissipate the heat generated by chips in air conditioner outdoor units.

[0003] During the process of implementing the embodiments of the present disclosure, it was found that at least the following problems exist in the related art: the heat dissipation effect of the current radiator is not good. Summary of the Invention

[0004] In order to provide a basic understanding of some aspects of the disclosed embodiments, a brief summary is given below. The summary is not an extensive review, nor is it intended to identify key / critical elements or delineate the scope of protection of these embodiments, but rather serves as a prelude to the detailed description that follows.

[0005] The embodiments of the present disclosure provide a heat dissipation component, a radiator, and an air conditioner to solve the technical problem of poor heat dissipation effect of the radiator.

[0006] In some embodiments, the heat dissipation component includes a base, which includes: an airflow heat dissipation portion, which is configured to dissipate heat based on the airflow flowing through it; and a phase change heat dissipation portion, which is provided with a working fluid flow path that can flow a working fluid and is configured to perform phase change heat dissipation based on the working fluid flow path.

[0007] In some embodiments, the radiator includes the aforementioned heat dissipation component, which is provided with a first working fluid flow path; a condensation end, which is provided with a second working fluid flow path; and a connecting pipe, which is configured to connect the first working fluid flow path and the second working fluid flow path.

[0008] In some embodiments, the air conditioner includes the aforementioned radiator.

[0009] The heat dissipation component, radiator, and air conditioner provided by the embodiments of the present disclosure can achieve the following technical effects:

[0010] When a device requires multiple chips for control, different chips generate different amounts of heat. For example, the electronic control board of an air conditioner outdoor unit is equipped with multiple chips, among which the frequency conversion module chip generates more heat and has a higher heat flux density.

[0011] During the implementation of the disclosed embodiments, it was found that the existing heat sink had poor heat dissipation effect, partly because it could not centrally dissipate heat for chips with high heat flux density, resulting in local overheating of the electronic control board and affecting the heat dissipation effect.

[0012] The heat dissipation component provided in the embodiments of the present disclosure includes a base, on which are disposed an airflow heat dissipation portion and a phase change heat dissipation portion. The phase change heat dissipation portion is provided with a working fluid flow path for phase change heat dissipation, which has a strong heat dissipation capability and can dissipate heat from chips with high heat generation, thereby improving the heat dissipation capability for high-density heat flows. The airflow heat dissipation portion can dissipate heat from chips with low heat generation based on the flow of gas. The heat dissipation component provided in the embodiments of the present disclosure has different heat dissipation capabilities in different parts, which can provide targeted concentrated heat dissipation for chips with high heat generation while also taking into account the heat dissipation of chips with low heat generation, thereby improving the heat dissipation effect.

[0013] The above general description and the following description are exemplary and explanatory only and are not intended to limit the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] One or more embodiments are exemplarily described by corresponding drawings. These exemplary descriptions and drawings do not limit the embodiments. Elements with the same reference numerals in the drawings are shown as similar elements. The drawings do not constitute a scale limitation. In addition,

[0015] Figure 1 is a schematic structural diagram of a heat dissipation component provided by an embodiment of the present disclosure;

[0016] Figure 2 is a structural schematic diagram of a radiator provided by an embodiment of the present disclosure;

[0017] Figure 3 It is a structural diagram of an air-conditioning outdoor unit provided in an embodiment of the present disclosure.

[0018] Reference numerals:

[0019] 1: heat dissipation component; 11: airflow heat dissipation part; 111: working fluid channel; 12: phase change heat dissipation part; 121: working fluid flow path; 122: fin; 123: through hole; 2: condensation end; 3: first connecting pipe; 4: second connecting pipe; 5: chip; 6: fan; 7: fan bracket. DETAILED DESCRIPTION

[0020] In order to be able to understand the features and technical content of the embodiments of the present disclosure in more detail, the implementation of the embodiments of the present disclosure is described in detail below in conjunction with the accompanying drawings. The accompanying drawings are for reference only and are not used to limit the embodiments of the present disclosure. In the following technical description, for the sake of convenience of explanation, a full understanding of the disclosed embodiments is provided through multiple details. However, one or more embodiments can still be implemented without these details. In other cases, to simplify the drawings, well-known structures and devices can be simplified for display.

[0021] Herein, the terms "first", "second", etc. are only used to distinguish one element from another, without requiring or implying any actual relationship or order between these elements. In fact, the first element can also be called the second element, and vice versa. Moreover, the terms "comprise", "include" or any other variants thereof are intended to cover non-exclusive inclusion, so that the structure, device or equipment including a series of elements includes not only those elements, but also other elements not explicitly listed, or also include elements inherent to such structure, device or equipment. In the absence of further restrictions, the elements defined by the sentence "comprise a..." do not exclude the presence of other identical elements in the structure, device or equipment including the elements. The various embodiments are described in a progressive manner herein, and each embodiment focuses on the differences from other embodiments. The same and similar parts between the various embodiments can be referred to each other.

[0022] The terms "longitudinal", "transverse", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like in this document indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing this document and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on this application. In the description of this document, unless otherwise specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense. For example, they can be mechanical or electrical connections, or they can be internal connections between two elements. They can be directly connected or indirectly connected through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to specific circumstances.

[0023] An embodiment of the present disclosure provides a heat dissipation component, including a base, which includes: an airflow heat dissipation portion, which is configured to dissipate heat based on the airflow flowing through it; and a phase change heat dissipation portion, which is provided with a working fluid flow path that can flow a working fluid and is configured to perform phase change heat dissipation based on the working fluid flow path.

[0024] like Figure 1As shown, the heat dissipation component 1 provided by the embodiment of the present disclosure includes both an airflow heat dissipation portion 11 and a phase change heat dissipation portion 12, wherein the airflow heat dissipation portion 11 is configured to dissipate heat from the heat dissipation element based on the gas flowing through the airflow heat dissipation portion 11, for example, the convection gas generated by the natural wind or the wind from the fan flowing through the airflow heat dissipation portion 11 is used to dissipate heat from the heat dissipation element; the phase change heat dissipation portion 2 is provided with a working fluid flow path 121 capable of circulating a working fluid, and is configured to perform phase change heat dissipation based on the working fluid flow path 121. The working fluid flowing through the working fluid flow path 121 can be a phase change working fluid, such as the refrigerant of an air conditioner, etc., and the heat generated by the heat dissipation element is taken away by the flowing working fluid. Optionally, the working fluid flow path 121 is provided on a portion of the base of the heat dissipation component 1 to obtain the phase change heat dissipation portion 12, and the remaining portion of the base without the working fluid flow path is the airflow heat dissipation portion 11.

[0025] Optionally, the heat dissipation method of the phase change heat dissipation part 12 provided in the embodiment of the present disclosure is: the phase change heat dissipation part 12 receives the heat of the component to be dissipated by direct contact, and the working fluid flows in from one end of the working fluid flow path 121 in the phase change heat dissipation part 12, undergoes phase change in the process of flowing through the entire working fluid flow path 121, and absorbs heat. In this process, the working fluid changes from liquid to gas and flows out from the other end of the working fluid flow path 121, taking away the heat.

[0026] The base of the heat dissipation component 1 provided in the embodiment of the present disclosure includes an airflow heat dissipation portion 11 and a phase change heat dissipation portion 12 with two heat dissipation capabilities. The heat dissipation capabilities of these two heat dissipation portions are different, and they can perform targeted heat dissipation on heat sources with different heat generation in the heat dissipation element. For example, the heat dissipation element includes a first chip group with high heat generation and a second chip group with low heat generation. The first chip group is brought into thermal contact with the phase change heat dissipation portion 12, and the phase change heat dissipation portion 12 is used to dissipate heat from the chips in the first chip group. The second chip group is brought into thermal contact with the airflow heat dissipation portion 11, and the airflow heat dissipation portion 11 is used to dissipate heat from the chips in the second chip group. The high and low heat generation here are obtained by comparison with each other, and there is no specific limitation on the number of chips in the first chip group and the second chip group. The number of chips in the first chip group can be one or more, and similarly, the number of chips in the second chip group can be one or more.

[0027] In the base of the heat dissipation component 1 provided in the embodiment of the present disclosure, there is no specific restriction on the proportions occupied by the airflow heat dissipation portion 11 and the phase change heat dissipation portion 12 on the base. For example, the airflow heat dissipation portion 11 occupies 1 / 4-3 / 4 of the volume of the base, and the phase change heat dissipation portion 12 occupies 1 / 4-3 / 4 of the volume of the base. Optionally, the airflow heat dissipation portion 11 occupies 1 / 3 of the volume of the base, and the phase change heat dissipation portion 12 occupies 2 / 3 of the volume of the base. Optionally, the airflow heat dissipation portion 11 occupies 1 / 2 of the volume of the base, and the phase change heat dissipation portion 12 also occupies 1 / 2 of the volume of the base. The disclosed embodiments do not impose any specific restrictions on the positions of the airflow heat dissipation portion 11 and the phase-change heat dissipation portion 12 on the substrate. Optionally, the airflow heat dissipation portion 11 is disposed on one portion of the substrate, and the phase-change heat dissipation portion 12 is disposed on another portion of the substrate. Optionally, the airflow heat dissipation portion 11 includes two portions, one at each end of the substrate, and the phase-change heat dissipation portion 12 is disposed in the middle portion of the substrate. Optionally, the airflow heat dissipation portion 11 is disposed in the middle portion of the substrate, and the phase-change heat dissipation portion 12 includes two portions, one at each end of the substrate. Specifically, the positions can be determined based on the positions of chips with different heat generation capabilities and the size of the substrate.

[0028] This embodiment does not impose any specific restrictions on the shape and inner diameter of the working fluid flow path 121 in the phase change heat dissipation portion 12. For example, the working fluid flow path 121 can be linear, and the inner diameter of the working fluid flow path 121 can be set according to the thickness of the substrate. For example, the inner diameter of the working fluid flow path 121 can be 4 / 5 or 3 / 4 of the substrate thickness. This disclosed embodiment does not impose any specific restrictions on the number of working fluid flow paths 121. For example, it can be any number between 2 and 20, such as 2, 4, 5, 6, 7, 8, 10, 12, 13, 15, 17, 20, etc.

[0029] In some embodiments, the working medium flow path 121 may be a heat pipe disposed inside the substrate.

[0030] In some embodiments, the working medium flow path 121 is disposed throughout the phase change heat dissipation portion 12 .

[0031] The working fluid flow path 121 is formed by penetrating the substrate, that is, the working fluid flow path 121 and the substrate are integrally formed, which improves the thermal conductivity of the working fluid in the working fluid flow path 121 and the substrate, and improves the heat dissipation capacity of the heat dissipation component 1. The "penetrating" here can be understood in contrast to "embedded", for example, the heat pipe is embedded in the substrate.

[0032] In some embodiments, the airflow heat dissipation portion 11 and the phase change heat dissipation portion 12 are integrally formed.

[0033] The "integrated molding" here can be understood as that the airflow heat dissipation part 11 and the phase change heat dissipation part 12 are integrated. For example, the part inlaid with the heat pipe or penetrated by the working fluid flow path 121 is the phase change heat dissipation part 12 of the substrate, and the remaining part without the heat pipe inlaid or penetrated by the working fluid flow path is the airflow heat dissipation part 11 of the substrate. The airflow heat dissipation part 11 and the phase change heat dissipation part 12 are integrally molded, which simplifies the preparation process of the heat dissipation component 1 and improves the heat dissipation capacity of the heat dissipation element. Usually, multiple chips with different functions are soldered on the same electronic control board. The airflow heat dissipation part 11 and the phase change heat dissipation part 12 are integrally molded, and heat can be transferred between the two heat dissipation parts. When one of the heat dissipation parts is subjected to a large amount of heat, it can be transferred to the other heat dissipation part for heat dissipation. For example, when the phase change heat dissipation part 12 is subjected to a large amount of heat and there is no time to dissipate the heat in time, the airflow heat dissipation part 11 and the phase change heat dissipation part 12 are integrally molded, and part of the heat can be transferred to the airflow heat dissipation part 11 for heat dissipation.

[0034] like Figure 1 As shown, in some embodiments, the base is stepped, and the steps include adjacent low-steps and high-steps; wherein the airflow heat dissipation portion 11 constitutes the low-step, and the phase change heat dissipation portion 12 constitutes the high-step.

[0035] When multiple chips are installed on the same electronic control board, the thickness of the chips may vary, or some chips may have special requirements. For example, some chips cannot directly conduct heat with the heat dissipation component 1 and need to be set at a certain safety distance from the heat dissipation component 1. The base provided in the embodiment of the present disclosure is stepped, with two parts of different heights, which can be suitable for cooling chips of different thicknesses. Alternatively, a certain safety distance can be set between the base of the heat dissipation component 1 and a specific chip. In this case, the specific chip can be the aforementioned chip that cannot directly contact the heat dissipation component 1.

[0036] Optionally, the steps include adjacent low-level steps and high-level steps, wherein the airflow heat dissipation portion 11 constitutes the low-level step and the phase change heat dissipation portion 12 constitutes the high-level step. The low-level step here can be understood as a portion of the substrate with a smaller thickness, and the high-level step can be understood as a portion of the substrate with a larger thickness. Using the substrate portion with a smaller thickness as the airflow heat dissipation portion 11 is beneficial to heat dissipation, and using the substrate portion with a larger thickness as the phase change heat dissipation portion 12 is beneficial to the setting of the working fluid flow path 121 in the substrate, which can increase the thickness and number of the working fluid flow path 121. For example, the working fluid flow path 121 in the phase change heat dissipation portion 12 can be set in two or more layers, which increases the number of the working fluid flow paths 121 and improves the heat dissipation capacity of the phase change heat dissipation portion 12. Optionally, the thickness of the phase change heat dissipation part is 8-15mm, for example, 8mm, 9mm, 10mm, 11mm, 12mm, 13mm, 14mm, 15mm, and the thickness of the airflow heat dissipation part is 3-7mm, for example, 3mm, 4mm, 5mm, 6mm, 7mm.

[0037] In some embodiments, the airflow heat dissipation portion 11 is provided with a working medium channel 111 , and the working medium channel 111 is connected to the working medium flow path 121 .

[0038] The airflow heat dissipation portion 11 is provided with a working fluid channel 111 connected to the working fluid flow path 121. The working fluid in the working fluid flow path 121 can flow into or out of the base through the working fluid channel 111. The working fluid channel 111 here can directly serve as a pipeline for the flow of the working fluid. In this case, the inner diameter of the working fluid channel 111 can be the same as the inner diameter of the working fluid flow path 121 in the phase change heat dissipation portion, or the working fluid channel 111 can be perpendicular to the working fluid flow path 121, or the working fluid channel 121 can form an acute or obtuse angle with the working fluid flow path 111. The working fluid channel 111 can also serve as a dredging channel for the connecting pipeline, used to accommodate the connecting pipeline. The working fluid channel 111 is connected to the working fluid flow path 121 here. The working fluid channel 111 and the working fluid flow path 121 can be directly connected, or, when there are multiple working fluid flow paths 121, the multiple working fluid flow paths 121 have a converging flow path, and the working fluid channel 111 and the converging flow path of the working fluid flow path 121 are directly connected.

[0039] In some embodiments, the working fluid channel includes a first working fluid channel and a second working fluid channel; wherein the first working fluid channel is connected to one end of the working fluid flow path 121 , and the second working fluid channel is connected to the other end of the working fluid flow path 121 .

[0040] Typically, the working fluid in working fluid flow path 121 needs to circulate within working fluid flow path 121 to maximize the heat dissipation capacity of the phase change heat dissipation unit. This "circulation" requires that working fluid flow path 121 have two ports: an inlet and an outlet for the working fluid. When working fluid channel 111 includes a first working fluid channel and a second working fluid channel, the first working fluid channel can be connected to one end of working fluid flow path 121, such as the inlet, and the second working fluid channel can be connected to the other end of working fluid flow path 121, such as the outlet, to improve the circulation flow of the working fluid.

[0041] like Figure 1 As shown, in some embodiments, the working medium channel 111 is a groove, and the groove is configured to accommodate a connecting pipe connecting the working medium flow path.

[0042] When the working fluid channel 111 is used to accommodate a connecting pipe connecting the working fluid flow path, and the base of the heat dissipation component 1 is stepped, the airflow heat dissipation portion 11 constitutes a low-step, and the thickness of the airflow heat dissipation portion 11 is relatively small, the working fluid channel 111 of the airflow heat dissipation portion 11 can be set to a groove shape. At this time, part of the connecting pipe is located in the groove, and part of the connecting pipe is exposed to the outside of the base. At this time, the connecting pipe can be accommodated and the connecting pipe exposed to the outside can be in contact with the electric control board to bear the force of the electric control board, so that part of the electric control board will not be suspended in the air.

[0043] In some embodiments, the groove has a semicircular cross-section.

[0044] Optionally, the size of the groove is limited to the size of the outer surface of the communicating pipe to be accommodated. When the outer surface of the communicating pipe is circular, the cross-sectional shape of the groove is semicircular, which can better fit the communicating pipe. Figure 1 shown.

[0045] Optionally, when the number of working fluid paths 121 of the phase change heat dissipation portion 12 of the base is two or more, the phase change heat dissipation portion 12 is provided with a confluence portion or confluence piece for converging two or more working fluid paths 121, and the working fluid channel 111 is connected to the confluence portion or confluence piece.

[0046] Optional, such as Figure 1 As shown, one or more fins 122 are further provided on the base of the heat dissipation component 1. Optionally, the base and the fins are integrally formed. Optionally, the thickness of the fin is 1.0-2.0 mm, for example, 1.0 mm, 1.1 mm, 1.2 mm, 1.3 mm, 1.4 mm, 1.5 mm, 1.6 mm, 1.7 mm, 1.8 mm, 1.9 mm, 2.0 mm. Optionally, the height of the fin is 30-50 mm, for example, 30 mm, 32 mm, 34 mm, 36 mm, 38 mm, 40 mm, 42 mm, 44 mm, 46 mm, 48 mm, 50 mm. The height of the fin refers to the end of the fin that is in direct contact with the base as the connecting end, and the end of the fin that is not in contact with the base as the free end. The height of the fin is the length from the connecting end to the free end, or the vertical distance between the connecting end and the free end.

[0047] Optionally, the base of the heat dissipation component 1 is provided with a connection hole 123, such as Figure 1 As shown. Optionally, the number of connection holes is one or more. For example, the number of connection holes 123 is the same as the number of chips to be cooled. Optionally, the connection holes 123 are arranged to avoid the working fluid flow path 121, or the connection holes 123 are arranged to avoid the fins 122. Optionally, the connection holes 123 are internally threaded holes.

[0048] The embodiment of the present disclosure also provides a radiator, including: the aforementioned heat dissipation component, provided with a first working fluid flow path; a condensation end, provided with a second working fluid flow path; and a connecting pipe, configured to connect the first working fluid flow path and the second working fluid flow path.

[0049] like Figure 2As shown, the radiator provided in the embodiment of the present disclosure includes the aforementioned heat dissipation component 1, a condensation end 2, and a connecting pipe. The heat dissipation component 1 can serve as the evaporation end of the radiator, and the working fluid flow path 121 within the phase change heat dissipation portion 12 of the base of the heat dissipation component 1 is the first working fluid flow path. The connecting pipe can include a first connecting pipe 3 and a second connecting pipe 4.

[0050] The heat dissipation method of the heat dissipation element using the radiator provided in the embodiment of the present disclosure can be: the heat dissipation component 1 acts as an evaporating end, receives heat from the heat dissipation element, and dissipates part of the heat through the air cooling effect of the fan or natural wind, such as the heat of the airflow heat dissipation part 11 and part of the heat of the phase change heat dissipation part 12. The heat not dissipated by the phase change heat dissipation part 12 is absorbed by the working fluid in the first working fluid flow path. After being heated, the working fluid quickly vaporizes and takes away the heat, and enters the second working fluid flow path of the condensation end 2 through the first connecting pipe 3. The condensation end 2 can simultaneously perform air cooling and natural convection. The gaseous working fluid in the second working fluid flow path dissipates the heat through the condensation end 2, and after lowering the temperature, it becomes liquid. The liquid working fluid flows back to the first working fluid flow path of the heat dissipation component 1 through the second connecting pipe 4, and performs the next cycle of absorbing heat and becoming gaseous. It can be seen that when the radiator provided by the embodiment of the present disclosure is used to dissipate heat from the heat dissipation element, the heat dissipation element can be dissipated simultaneously through the heat dissipation component 1 and the condensation end 2, thereby improving the heat dissipation capacity of the radiator, effectively dissipating the heat generated by the heat dissipation element, ensuring the smooth operation of the heat dissipation element, and further ensuring the reliability of the air conditioner operation.

[0051] In the radiator provided in the embodiment of the present disclosure, the first working fluid flow path, the second working fluid flow path, the first connecting pipe 3, and the second connecting pipe 4 constitute a working fluid circuit, and the working fluid circuit is filled with a phase-changing working fluid. Optionally, the radiator provided in the embodiment of the present disclosure can be prepared through preparation processes such as welding, vacuuming, and pouring working fluid. This embodiment does not impose specific restrictions on the type of working fluid. For example, it can be a fluid that can undergo phase change, such as a refrigerant. This embodiment does not impose specific restrictions on the filling amount of the working fluid in the working fluid circuit.

[0052] Optionally, the first connecting pipe 3 is made of metal, and similarly, the second connecting pipe 4 is made of metal.

[0053] Optionally, condensing end 2 may be a temperature-averaging plate, such as an inflatable type, formed by laminating two layers of aluminum plates and internally providing a second interconnected working fluid flow path. Condensing end 2, equipped with a second working fluid pipeline, functions as both a working fluid pipeline and a heat sink, enabling both natural convection and air cooling, and exhibiting advantages such as high heat transfer capacity, high thermal conductivity, and light weight.

[0054] The embodiment of the present disclosure also provides an air conditioner including the aforementioned radiator.

[0055] The air conditioner includes an indoor unit and an outdoor unit. Figure 3 As shown, the installation position of the radiator in the air conditioner outdoor unit can be: the heat dissipation component 1 of the radiator contacts the chip 5, obtains the heat of the chip 5 by direct contact, and then dissipates the heat.

[0056] Optionally, the condensing end 2 can be installed on the fan bracket 7 of the air-conditioning outdoor unit. Compared with the existing installation on the side of the fan 6, the installation position provided by this embodiment has a larger space in the air-conditioning outdoor unit, which increases the heat dissipation area of the radiator. In addition, the airflow above the fan 6 flows more smoothly, further improving the heat dissipation capacity of the condensing end 2.

Claims

1. A radiator, characterized in that: include: The heat dissipation component is provided with a first working medium flow path; The condensing end is provided with a second working medium flow path and is installed on the fan bracket of the air conditioner outdoor unit; A connecting pipeline is configured to connect the first working fluid flow path and the second working fluid flow path, The heat dissipation component includes a base, and the base includes: The airflow heat dissipation part is configured to dissipate heat based on the airflow flowing through it, and uses the convection gas generated by the natural wind or the wind of the fan flowing through the airflow heat dissipation part to dissipate heat from the heat dissipation element; The phase-change heat dissipation portion is provided with a working fluid flow path capable of flowing a working fluid, and is configured to perform phase-change heat dissipation based on the working fluid flow path. The inner diameter of the working fluid flow path is 4 / 5 or 3 / 4 of the thickness of the substrate. The heat dissipation element includes a first chip group with high heat generation and a second chip group with low heat generation. The first chip group is brought into thermal contact with the phase-change heat dissipation portion, and the phase-change heat dissipation portion is used to dissipate heat from the chips in the first chip group. The second chip group is brought into thermal contact with the airflow heat dissipation portion, and the airflow heat dissipation portion is used to dissipate heat from the chips in the second chip group. The airflow heat dissipation part occupies 1 / 4-3 / 4 of the volume of the base, and the phase change heat dissipation part occupies 1 / 4-3 / 4 of the volume of the base. The airflow heat dissipation part is provided with a working fluid channel, and the working fluid channel is connected to the working fluid flow path. The working fluid channel includes a first working fluid channel and a second working fluid channel, wherein the first working fluid channel is connected to the inlet end of the working fluid flow path, and the second working fluid channel is connected to the outlet end of the working fluid flow path. The working fluid channel is used to accommodate a connecting pipe connecting the working fluid flow path. The base of the heat dissipation component is stepped, the airflow heat dissipation part constitutes a low-order step, and the phase change heat dissipation part constitutes a high-order step, and the working fluid channel is groove-shaped, part of the connecting pipe is arranged in the groove, and part of the connecting pipe is exposed to the outside of the base.

2. The radiator according to claim 1, characterized in that The working medium flow path is arranged to penetrate inside the phase change heat dissipation part.

3. The radiator according to claim 1, wherein: The airflow heat dissipation portion and the phase change heat dissipation portion are integrally formed.

4. The radiator according to claim 1, wherein The cross section of the groove is semicircular.

5. An air conditioner, characterized in that: The heat sink comprises the heat sink according to any one of claims 1 to 4.

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