Radiating components, radiators and air conditioners

Abstract

This application relates to the field of chip heat dissipation technology and discloses a heat dissipation component comprising: a first working fluid flow path; a through hole extending through the heat dissipation component and disposed away from the first working fluid flow path; and a heat dissipation reinforcement member connected to the edge of the through hole. The heat dissipation component provided in this application has excellent heat dissipation performance. This application also provides a radiator and air conditioner incorporating the aforementioned heat dissipation component.

Description

Technical Field

[0001] The present application relates to the technical field of chip heat dissipation, for example, to a heat dissipation component, a radiator and an air conditioner. Background Art

[0002] The chips in an air conditioner's outdoor unit generate a significant amount of heat during operation. If this heat cannot be dissipated promptly, the chip's temperature will continue to rise, affecting its normal operation and even the air conditioner's operational stability and lifespan. In the prior art, heat sinks, such as finned heat sinks, are often used to dissipate this heat.

[0003] During the process of implementing the embodiments of the present disclosure, it was found that at least the following problems exist in the related art: the existing radiator has a poor heat dissipation effect. Summary of the Invention

[0004] In order to provide a basic understanding of some aspects of the disclosed embodiments, a brief summary is given below. The summary is not an extensive review, nor is it intended to identify key / critical elements or delineate the scope of protection of these embodiments, but rather serves as a prelude to the detailed description that follows.

[0005] The embodiments of the present disclosure provide a heat dissipation component, a radiator, and an air conditioner to solve the technical problem of poor heat dissipation effect of the radiator.

[0006] In some embodiments, the heat dissipation component includes: a first working fluid flow path; a through hole that passes through the heat dissipation component and is arranged to avoid the first working fluid flow path; and a heat dissipation reinforcement member connected to an edge of the through hole.

[0007] In some embodiments, the radiator includes: the aforementioned heat dissipation component, an evaporation end provided with a second working fluid flow path; and a connecting pipe configured to connect the first working fluid flow path and the second working fluid flow path.

[0008] In some embodiments, the air conditioner includes the aforementioned radiator.

[0009] The heat dissipation component provided by the embodiments of the present disclosure can achieve the following technical effects:

[0010] The heat dissipation component provided in the embodiment of the present disclosure is provided with a through hole penetrating the heat dissipation component, and a heat dissipation reinforcement is provided at the edge of the through hole. The provision of the heat dissipation reinforcement can better utilize the airflow of natural wind and wind generated by the fan to dissipate heat, thereby improving the heat dissipation effect of the heat dissipation component.

[0011] The above general description and the following description are exemplary and explanatory only and are not intended to limit the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] One or more embodiments are exemplarily described by corresponding drawings. These exemplary descriptions and drawings do not limit the embodiments. Elements with the same reference numerals in the drawings are shown as similar elements. The drawings do not constitute a scale limitation. In addition,

[0013] Figure 1 is a schematic structural diagram of a heat dissipation component provided by an embodiment of the present disclosure;

[0014] Figure 2 is a partial structural diagram of a heat dissipation component provided by an embodiment of the present disclosure;

[0015] Figure 3 is a structural schematic diagram of a radiator provided by an embodiment of the present disclosure;

[0016] Figure 4 is a schematic structural diagram of an evaporation end provided in an embodiment of the present disclosure;

[0017] Figure 5 It is a structural diagram of an air-conditioning outdoor unit provided in an embodiment of the present disclosure.

[0018] Reference numerals:

[0019] 1: heat dissipation component; 11: first working fluid flow path; 111: first flow path; 112: second flow path; 113: third flow path; 114: inclined connecting flow path; 12: through hole; 121: first edge of the through hole; 122: second edge of the through hole; 13: heat dissipation reinforcement member; 131: first heat dissipation reinforcement member; 132: second heat dissipation reinforcement member; 14: first external port; 15: second external port; 2: evaporation end; 21: airflow heat dissipation part; 211: working fluid channel; 22: phase change heat dissipation part; 221: second working fluid flow path; 222: fin; 223: through hole; 3: first connecting pipeline; 4: second connecting pipeline; 5: chip; 6: fan; 7: fan bracket. DETAILED DESCRIPTION

[0020] In order to be able to understand the features and technical content of the embodiments of the present disclosure in more detail, the implementation of the embodiments of the present disclosure is described in detail below in conjunction with the accompanying drawings. The accompanying drawings are for reference only and are not used to limit the embodiments of the present disclosure. In the following technical description, for the sake of convenience of explanation, a full understanding of the disclosed embodiments is provided through multiple details. However, one or more embodiments can still be implemented without these details. In other cases, to simplify the drawings, well-known structures and devices can be simplified for display.

[0021] Herein, the terms "first", "second", etc. are only used to distinguish one element from another, without requiring or implying any actual relationship or order between these elements. In fact, the first element can also be called the second element, and vice versa. Moreover, the terms "comprise", "include" or any other variants thereof are intended to cover non-exclusive inclusion, so that the structure, device or equipment including a series of elements includes not only those elements, but also other elements not explicitly listed, or also include elements inherent to such structure, device or equipment. In the absence of further restrictions, the elements defined by the sentence "comprise a..." do not exclude the presence of other identical elements in the structure, device or equipment including the elements. The various embodiments are described in a progressive manner herein, and each embodiment focuses on the differences from other embodiments. The same and similar parts between the various embodiments can be referred to each other.

[0022] The terms "longitudinal", "transverse", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like in this document indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing this document and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on this application. In the description of this document, unless otherwise specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense. For example, they can be mechanical or electrical connections, or they can be internal connections between two elements. They can be directly connected or indirectly connected through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to specific circumstances.

[0023] The embodiment of the present disclosure provides a heat dissipation component including: a first working fluid flow path; a through hole penetrating the heat dissipation component and arranged to avoid the first working fluid flow path; and a heat dissipation reinforcement member connected to an edge of the through hole.

[0024] like Figure 1 and Figure 2As shown, the heat dissipation component 1 provided in the embodiment of the present disclosure is provided with a through hole 12 that passes through the heat dissipation component 1, and a heat dissipation reinforcement member 13 is provided at the edge of the through hole 12. The provision of the heat dissipation reinforcement member 13 can better utilize the airflow of natural wind and wind generated by the fan to dissipate heat, thereby improving the heat dissipation effect of the heat dissipation component 1. For example, the heat dissipation component currently provided in the fan compartment of the air-conditioning outdoor unit is usually provided parallel to the top shell of the air-conditioning outdoor unit. When the airflow generated by the rotation of the fan flows through the heat dissipation component, only a small part of the airflow flows through the sheet-like heat dissipation component, resulting in poor heat dissipation effect of the heat dissipation component. The heat dissipation component 1 provided in the embodiment of the present disclosure is provided with a heat dissipation reinforcement member 13. The provision of the heat dissipation reinforcement member 13 can better utilize the airflow generated by the fan, increase the contact area with the airflow, and improve the heat dissipation effect of the heat dissipation component 1.

[0025] Optionally, the through hole 12 may not be a new external component, but may be obtained by penetrating or cutting the heat dissipation component 1. The first working fluid flow path 11 and the through hole 12 are arranged in a way that avoids each other. This means that the portion of the heat dissipation component 1 where the first working fluid flow path 11 is arranged is not provided with the through hole 12, and the first working fluid flow path 11 is not provided at the location where the through hole 12 is provided. That is, the location where the first working fluid flow path 11 is provided on the heat dissipation component 1 does not overlap with the location where the through hole 12 is provided.

[0026] The heat dissipation reinforcement 13 is arranged at the edge of the through hole 12 and is connected to the edge of the through hole 12. Optionally, the heat dissipation reinforcement 13 and the through hole 12 are integrally formed. Optionally, the heat dissipation reinforcement 13 can be obtained by cutting the heat dissipation component 1 and folding the cut part along the cutting line, thereby obtaining the through hole 12 and the heat dissipation reinforcement 13 at the same time. The thickness of the heat dissipation component 1 is limited. When the heat dissipation reinforcement 13 is connected to the edge of the through hole 12 by welding or other connection methods, the area of the connection part is limited, which is not conducive to the connection of the heat dissipation reinforcement 13 to the edge of the through hole 12, and the connection is not firm. In the embodiment of the present disclosure, the heat dissipation reinforcement 13 and the through hole 12 are integrally formed. The through hole 12 and the heat dissipation reinforcement 13 connected to the edge of the through hole 12 can be obtained by cutting, folding and other steps, without the need for welding and other operations. Moreover, the connection between the heat dissipation reinforcement 13 and the through hole 12 is firm, and the heat dissipation reinforcement 13 is not prone to falling off.

[0027] Optionally, the number of through holes 12 can be one or more, such as 1, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, etc. Optionally, the shape of the through hole 12 can be circular, elliptical, polygonal, or irregular. The embodiment of the present disclosure does not impose too many restrictions on the area of the through hole 12.

[0028] In some embodiments, the through hole 12 includes a first edge 121 and a second edge 122 oppositely disposed, the first edge 121 is connected to the first heat dissipation reinforcement member 13, and the second edge 122 is connected to the second heat dissipation reinforcement member 13, thereby improving the heat dissipation effect of the heat dissipation component 1.

[0029] Optionally, when the through-hole 12 has opposing first and second edges 121, 122, such as when the through-hole 12 is rectangular or oblong, the opposing first and second edges 121, 122 are each connected to a heat dissipation reinforcement member 13. Optionally, the first and second heat dissipation reinforcement members 131, 132 can be arranged in a "double window" configuration. For example, the surface of the heat dissipation member 1 can be cut in an I-shaped pattern and folded along the cut line to obtain the "double window" configuration of the first and second heat dissipation reinforcement members 131, 132.

[0030] The first and second edges 121, 122, which are positioned opposite each other, are each connected to a heat dissipation reinforcement member 13, which can better utilize the airflow generated by the fan's rotation. Optionally, the first heat dissipation reinforcement member 131 is perpendicular to the plane in which the through-hole 12 is located, or the second heat dissipation reinforcement member 132 is perpendicular to the plane in which the through-hole 12 is located, or the first heat dissipation reinforcement member 131 and the second heat dissipation reinforcement member 132 are parallel. The first heat dissipation reinforcement member 131 or the second heat dissipation reinforcement member 132, which is positioned perpendicular to the through-hole 12, can better utilize the airflow generated by the fan's rotation, increase the contact area with the airflow, and improve the heat dissipation effect of the radiator.

[0031] In some embodiments, the area of the heat dissipation reinforcement member 13 is the same as the area of the through hole 12 .

[0032] Optionally, the heat dissipation reinforcement member 13 can be obtained by cutting, folding, and the like, and the area of the heat dissipation reinforcement member 13 is the same as the area of the through hole 12. Optionally, during the preparation of the heat dissipation component 1, the folding along the cutting line can be omitted so that the heat dissipation reinforcement member 13 overlaps the through hole 12. In this way, the heat dissipation component 1 can remain in a flat shape, facilitating transportation of the heat dissipation component 1 and facilitating protection of the heat dissipation reinforcement member 13 during transportation.

[0033] The heat dissipation component 1 provided by the embodiment of the present disclosure can have the through hole 12 obtained by folding the heat dissipation reinforcement 13. The heat dissipation component 1 that is not folded and in which the heat dissipation reinforcement 13 and the through hole 12 overlap is also within the protection scope of the present application.

[0034] In some embodiments, the first working fluid flow path 11 includes at least a first flow path 111 and a second flow path 112 , and one or more inclined connecting flow paths 114 are provided between the first flow path 111 and the second flow path 112 .

[0035] The first flow path 111 and the second flow path 112 are interconnected, and an inclined connecting flow path 114 is provided between the first flow path 111 and the second flow path 112. The inclined connecting flow path 114 herein can be understood as meaning that the angle between the inclined connecting flow path 114 and the first flow path 111 is an acute angle or an obtuse angle, or that the angle between the inclined connecting flow path 114 and the second flow path 112 is an acute angle or an obtuse angle, or that the angles between the inclined connecting flow path 114 and the first flow path 111 and the second flow path 112 are not right angles. Optionally, the first flow path 111 and the second flow path 112 are parallel. The provision of the inclined connecting flow path 114 between the first flow path 111 and the second flow path 112 reduces the circulation flow resistance of the working medium in the first working medium flow path 11.

[0036] In some embodiments, the first working medium flow path 11 further includes a third flow path 113 disposed around the through hole 12 , and the first flow path 111 , the second flow path 112 , and the third flow path 113 are interconnected.

[0037] The heat dissipation reinforcement 13 dissipates heat for the working medium in the first working medium flow path 11. The third flow path 113 arranged around the through hole 12 is at a shorter distance from the heat dissipation reinforcement 13, which can improve the heat dissipation of the working medium in the first working medium flow path 11. Optionally, the third flow path is in a square shape, such as Figure 1 shown.

[0038] In some embodiments, the third flow path 113 is provided with a first external connection port 14 , the first flow path 111 or the second flow path 112 is provided with a second external connection port 15 , and the first external connection port 14 and the second external connection port 15 are provided on the same side of the heat dissipation component 1 .

[0039] The two external ports of the first working medium flow path 11 are arranged on the same side of the heat dissipation component 1 , which increases the length of the path of the first working medium flow path 11 and improves the heat exchange capacity of the heat dissipation component 1 .

[0040] In some embodiments, the heat dissipation component 1 is an inflation-type temperature distribution plate.

[0041] Optionally, the inflatable heat spreader is made of aluminum. Optionally, the inflatable heat spreader is formed by laminating two layers of aluminum plates, and is provided with a first working medium flow path 11 therein for the circulation of the working medium. It has strong heat transfer capability, high thermal conductivity efficiency, good heat dissipation capability, and is lightweight, facilitating installation of the heat dissipation component 1 in the air conditioner outdoor unit.

[0042] The embodiment of the present disclosure also provides a radiator, comprising: any of the aforementioned heat dissipation components, an evaporation end provided with a second working fluid flow path; and a connecting pipe configured to connect the first working fluid flow path and the second working fluid flow path.

[0043] like Figure 3As shown, the radiator provided by the embodiment of the present disclosure includes the aforementioned heat dissipation component 1, an evaporation end 2, and a connecting pipe. The heat dissipation component 1 can serve as the condensation end of the radiator. The connecting pipe can include a first connecting pipe 3 and a second connecting pipe 4.

[0044] The heat dissipation method for the heat dissipation element using the radiator provided by the embodiment of the present disclosure can be: the evaporation end 2 receives heat from the heat dissipation element, and part of the heat is dissipated through the air cooling effect of the fan or natural wind. The undissipated heat is absorbed by the working medium in the second working medium flow path. After being heated, the working medium quickly vaporizes and takes away the heat, and enters the first working medium flow path of the condensation end 1 through the first connecting pipe 3. The condensation end 1 can simultaneously perform air cooling and natural convection. The gaseous working medium in the first working medium flow path dissipates heat through the condensation end 1, and after reducing the temperature, it becomes liquid. The liquid working medium flows back to the second working medium flow path of the evaporation end 2 through the second connecting pipe 4, and then performs the next cycle of absorbing heat and becoming gaseous. It can be seen that when the radiator provided by the embodiment of the present disclosure is used to dissipate heat from the heat dissipation element, the heat dissipation element can be dissipated simultaneously through the evaporation end 2 and the condensation end 1, thereby improving the heat dissipation capacity of the radiator, effectively dissipating the heat generated by the heat dissipation element, ensuring the smooth operation of the heat dissipation element, and thus ensuring the reliability of the air conditioner operation.

[0045] In the radiator provided in the embodiment of the present disclosure, the first working fluid flow path, the second working fluid flow path, the first connecting pipe 3, and the second connecting pipe 4 constitute a working fluid circuit, and the working fluid circuit is filled with a phase-changing working fluid. Optionally, the radiator provided in the embodiment of the present disclosure can be prepared through preparation processes such as welding, vacuuming, and pouring working fluid. This embodiment does not impose specific restrictions on the type of working fluid. For example, it can be a fluid that can undergo phase change, such as a refrigerant. This embodiment does not impose specific restrictions on the filling amount of the working fluid in the working fluid circuit.

[0046] Optionally, the first connecting pipe 3 is made of metal, and similarly, the second connecting pipe 4 is made of metal.

[0047] The embodiment of the present disclosure also provides an evaporation end heat dissipation component, which may also be called an evaporation end.

[0048] An embodiment of the present disclosure provides an evaporation end heat dissipation component, including a base, which includes: an airflow heat dissipation portion, which is configured to dissipate heat based on the airflow flowing through it; and a phase change heat dissipation portion, which is provided with a working fluid flow path that can flow a working fluid and is configured to perform phase change heat dissipation based on the working fluid flow path.

[0049] like Figure 4As shown, the evaporation end 2 provided in the embodiment of the present disclosure includes both an airflow heat dissipation portion 21 and a phase change heat dissipation portion 22, wherein the airflow heat dissipation portion 21 is configured to dissipate heat from the heat dissipation element based on the gas flowing through the airflow heat dissipation portion 21, for example, the convective gas generated by the natural wind or the wind from the fan flowing through the airflow heat dissipation portion 21 is used to dissipate heat from the heat dissipation element; the phase change heat dissipation portion 22 is provided with a second working fluid flow path 221 capable of circulating a working fluid, and is configured to perform phase change heat dissipation based on the second working fluid flow path 221. The working fluid flowing through the second working fluid flow path 221 can be a phase change working fluid, such as the refrigerant of an air conditioner, etc., and the heat generated by the heat dissipation element is taken away by the flowing working fluid. Optionally, the second working fluid flow path 221 is provided on a portion of the substrate of the evaporation end to obtain the phase change heat dissipation portion 22, and the remaining portion of the substrate without the working fluid flow path is the airflow heat dissipation portion 21.

[0050] Optionally, the heat dissipation method of the phase change heat dissipation part 22 provided in the embodiment of the present disclosure is: the phase change heat dissipation part 22 receives the heat of the component to be dissipated by direct contact, and the working fluid flows in from one end of the second working fluid flow path 221 in the phase change heat dissipation part 22, undergoes phase change in the process of flowing through the entire second working fluid flow path 221, and absorbs heat. In this process, the working fluid changes from liquid to gas, and flows out from the other end of the second working fluid flow path 221, taking away the heat.

[0051] The base of the evaporation end 2 provided in the embodiment of the present disclosure includes an airflow heat dissipation portion 21 and a phase change heat dissipation portion 22 with two heat dissipation capabilities. The two heat dissipation portions have different heat dissipation capabilities and can provide targeted heat dissipation for heat sources with different heat generation in the heat dissipation element. For example, the heat dissipation element includes a first chip group with high heat generation and a second chip group with low heat generation. The first chip group is brought into thermal contact with the phase change heat dissipation portion 22, and the phase change heat dissipation portion 22 is used to dissipate heat from the chips in the first chip group. The second chip group is brought into thermal contact with the airflow heat dissipation portion 21, and the airflow heat dissipation portion 21 is used to dissipate heat from the chips in the second chip group. The high and low heat generation here are obtained by comparison with each other, and there is no specific limitation on the number of chips in the first chip group and the second chip group. The number of chips in the first chip group can be one or more, and similarly, the number of chips in the second chip group can be one or more.

[0052] In the substrate of the evaporation end 2 provided in the embodiment of the present disclosure, there is no specific restriction on the proportions occupied by the airflow heat dissipation portion 21 and the phase change heat dissipation portion 22 on the substrate. For example, the airflow heat dissipation portion 21 occupies 1 / 4-3 / 4 of the volume of the substrate, and the phase change heat dissipation portion 22 occupies 1 / 4-3 / 4 of the volume of the substrate. Optionally, the airflow heat dissipation portion 21 occupies 1 / 3 of the volume of the substrate, and the phase change heat dissipation portion 22 occupies 2 / 3 of the volume of the substrate. Optionally, the airflow heat dissipation portion 21 occupies 1 / 2 of the volume of the substrate, and the phase change heat dissipation portion 22 also occupies 1 / 2 of the volume of the substrate. The disclosed embodiments do not impose any specific restrictions on the positions of the airflow heat dissipation portion 21 and the phase-change heat dissipation portion 22 on the substrate. Optionally, the airflow heat dissipation portion 21 is disposed on one portion of the substrate, and the phase-change heat dissipation portion 22 is disposed on another portion of the substrate. Optionally, the airflow heat dissipation portion 21 includes two portions, one at each end of the substrate, and the phase-change heat dissipation portion 22 is disposed in the middle portion of the substrate. Optionally, the airflow heat dissipation portion 21 is disposed in the middle portion of the substrate, and the phase-change heat dissipation portion 22 includes two portions, one at each end of the substrate. Specifically, the positions can be determined based on the positions of chips with different heat generation capabilities and the size of the substrate.

[0053] This embodiment does not impose any specific restrictions on the shape or inner diameter of the second working fluid flow path 221 in the phase-change heat dissipation portion 22. For example, the second working fluid flow path 221 can be linear, and the inner diameter of the second working fluid flow path 221 can be set according to the thickness of the substrate. For example, the inner diameter of the second working fluid flow path 221 can be 4 / 5 or 3 / 4 of the substrate thickness. This disclosed embodiment does not impose any specific restrictions on the number of second working fluid flow paths 221. For example, the number can be any number between 2 and 20, such as 2, 4, 5, 6, 7, 8, 10, 12, 13, 15, 17, 20, etc.

[0054] In some embodiments, the second working medium flow path 221 may be a heat pipe disposed inside the substrate.

[0055] In some embodiments, the second working medium flow path 221 is disposed throughout the phase-change heat dissipation portion 22 .

[0056] The second working fluid flow path 221 is formed by penetrating the substrate, that is, the second working fluid flow path 221 is integrally formed with the substrate, thereby improving the thermal conductivity between the working fluid in the second working fluid flow path 221 and the substrate, and improving the heat dissipation capacity of the evaporation end 2. The "penetrating" here can be understood in contrast to "embedded", for example, the heat pipe is embedded in the substrate.

[0057] In some embodiments, the airflow heat dissipation portion 21 and the phase change heat dissipation portion 22 are integrally formed.

[0058] The "integrated molding" here can be understood as that the airflow heat dissipation part 21 and the phase change heat dissipation part 22 are integrated. For example, the part where the heat pipe is embedded or the second working fluid flow path 221 passes through is the phase change heat dissipation part 22 of the base body, and the remaining part where the heat pipe is not embedded or the working fluid flow path passes through is the airflow heat dissipation part 21 of the base body. The airflow heat dissipation part 21 and the phase change heat dissipation part 22 are integrally molded, which simplifies the preparation process of the evaporation end 2 and improves the heat dissipation capacity of the heat dissipation element. Usually, multiple chips with different functions are soldered on the same electronic control board. The airflow heat dissipation part 21 and the phase change heat dissipation part 22 are integrally molded, and heat can be transferred between the two heat dissipation parts. When one of the heat dissipation parts is subjected to a large amount of heat, it can be transferred to the other heat dissipation part for heat dissipation. For example, when the phase change heat dissipation part 22 is subjected to a large amount of heat and there is no time to dissipate the heat in time, the airflow heat dissipation part 21 and the phase change heat dissipation part 22 are integrally molded, and part of the heat can be transferred to the airflow heat dissipation part 21 for heat dissipation.

[0059] like Figure 4 As shown, in some embodiments, the base is stepped, and the steps include adjacent low-steps and high-steps; wherein the airflow heat dissipation portion 21 constitutes the low-step, and the phase change heat dissipation portion 22 constitutes the high-step.

[0060] When multiple chips are installed on the same electronic control board, the thicknesses of the chips may vary, or some chips may have special requirements. For example, some chips cannot come into direct thermal contact with the evaporator 2 and require a certain safety distance from the evaporator 2. The substrate provided in the disclosed embodiment is stepped, with two sections of different heights, to dissipate heat from chips of varying thicknesses. Alternatively, a certain safety distance can be established between the substrate of the evaporator 2 and a specific chip, which may be the aforementioned chip that cannot come into direct contact with the evaporator 2.

[0061] Optionally, the steps include adjacent low-level steps and high-level steps, wherein the airflow heat dissipation portion 21 constitutes the low-level step and the phase change heat dissipation portion 22 constitutes the high-level step. The low-level step here can be understood as a portion of the substrate with a smaller thickness, and the high-level step can be understood as a portion of the substrate with a larger thickness. Using the substrate portion with a smaller thickness as the airflow heat dissipation portion 21 is beneficial to heat dissipation, and using the substrate portion with a larger thickness as the phase change heat dissipation portion 22 is beneficial to the setting of the second working fluid flow path 221 in the substrate, which can increase the thickness and number of the second working fluid flow path 221. For example, the second working fluid flow path 221 in the phase change heat dissipation portion 22 can be provided with two or more layers, thereby increasing the number of the second working fluid flow paths 221 and improving the heat dissipation capacity of the phase change heat dissipation portion 22. Optionally, the thickness of the phase change heat dissipation part is 8-15mm, for example, 8mm, 9mm, 10mm, 11mm, 12mm, 13mm, 14mm, 15mm, and the thickness of the airflow heat dissipation part is 3-7mm, for example, 3mm, 4mm, 5mm, 6mm, 7mm.

[0062] In some embodiments, the airflow heat dissipation portion 21 is provided with a working medium channel 211 , and the working medium channel 211 is connected to the second working medium flow path 221 .

[0063] The airflow heat dissipation portion 21 is provided with a working fluid channel 211 connected to the second working fluid flow path 221. The working fluid in the second working fluid flow path 221 can flow into or out of the base through the working fluid channel 211. The working fluid channel 211 here can directly serve as a pipeline for the flow of the working fluid. In this case, the inner diameter of the working fluid channel 211 can be the same as the inner diameter of the second working fluid flow path 221 in the phase change heat dissipation portion, or the working fluid channel 211 can be perpendicular to the second working fluid flow path 221, or the working fluid channel 211 can form an acute or obtuse angle with the second working fluid flow path 221. The working fluid channel 211 can also serve as a dredging channel for the connecting pipeline, used to accommodate the connecting pipeline. The working fluid channel 211 here is connected to the second working fluid flow path 221. The working fluid channel 211 and the second working fluid flow path 221 can be directly connected, or, when there are multiple second working fluid flow paths 221, the multiple second working fluid flow paths 221 have a converging flow path, and the working fluid channel 211 and the converging flow path of the second working fluid flow path 221 are directly connected.

[0064] In some embodiments, the working fluid channel includes a first working fluid channel and a second working fluid channel; wherein the first working fluid channel is connected to one end of the second working fluid flow path 221 , and the second working fluid channel is connected to the other end of the second working fluid flow path 221 .

[0065] Typically, the working fluid in the second working fluid flow path 221 needs to circulate within the second working fluid flow path 221 to maximize the heat dissipation capacity of the phase change heat dissipation unit. This "circulation" requires that the second working fluid flow path 221 have two ports, an inlet and an outlet for the working fluid. When the working fluid channel 211 includes a first working fluid channel and a second working fluid channel, the first working fluid channel can be connected to one end of the second working fluid flow path 221, such as the inlet end, and the second working fluid channel can be connected to the other end of the second working fluid flow path 221, such as the outlet end, to improve the circulation flow of the working fluid.

[0066] like Figure 4 As shown, in some embodiments, the working medium channel 211 is a groove, and the groove is configured to accommodate a connecting pipe connecting the working medium flow path.

[0067] When the working fluid channel 211 is used to accommodate the connecting pipe connecting the working fluid flow path, and the base of the evaporation end 2 is stepped, the airflow heat dissipation portion 21 constitutes a low-step, and the thickness of the airflow heat dissipation portion 21 is relatively small, the working fluid channel 211 of the airflow heat dissipation portion 21 can be set to a groove shape. At this time, part of the connecting pipe is located in the groove, and part of the connecting pipe is exposed to the outside of the base. At this time, the connecting pipe can be accommodated and the connecting pipe exposed to the outside can be in contact with the electric control board to bear the force of the electric control board, so that part of the electric control board will not be suspended in the air.

[0068] In some embodiments, the groove has a semicircular cross-section.

[0069] Optionally, the size of the groove is limited to the size of the outer surface of the communicating pipe to be accommodated. When the outer surface of the communicating pipe is circular, the cross-sectional shape of the groove is semicircular, which can better fit the communicating pipe. Figure 4 shown.

[0070] Optionally, when the number of the second working fluid flow paths 221 of the phase change heat dissipation portion 22 of the base is two or more, the phase change heat dissipation portion 22 is provided with a confluence portion or a confluence piece for converging two or more second working fluid flow paths 221, and the working fluid channel 211 is connected to the confluence portion or the confluence piece.

[0071] Optional, such as Figure 4As shown, one or more fins 222 are further provided on the substrate of the evaporation end. Optionally, the substrate and the fins are integrally formed. Optionally, the thickness of the fin is 1.0-2.0 mm, for example, 1.0 mm, 1.1 mm, 1.2 mm, 1.3 mm, 1.4 mm, 1.5 mm, 1.6 mm, 1.7 mm, 1.8 mm, 1.9 mm, or 2.0 mm. Optionally, the height of the fin is 30-50 mm, for example, 30 mm, 32 mm, 34 mm, 36 mm, 38 mm, 40 mm, 42 mm, 44 mm, 46 mm, 48 mm, or 50 mm. The height of the fin refers to the end of the fin that directly contacts the substrate as the connecting end, and the end of the fin that does not contact the substrate as the free end. The height of the fin is the length from the connecting end to the free end, or the vertical distance between the connecting end and the free end.

[0072] Optionally, the base of the evaporation end is provided with a connection hole 223, such as Figure 4 As shown. Optionally, the number of connection holes is one or more. For example, the number of connection holes 223 is the same as the number of chips to be cooled. Optionally, the connection holes 223 are arranged to avoid the second working fluid flow path 221, or the connection holes 223 are arranged to avoid the fins 222. Optionally, the connection holes 223 are internally threaded holes.

[0073] The embodiment of the present disclosure also provides an air conditioner including the aforementioned radiator.

[0074] The air conditioner includes an indoor unit and an outdoor unit. Figure 5 As shown, the installation position of the radiator in the air conditioner outdoor unit can be: the evaporation end 2 of the radiator contacts the chip 5, obtains the heat of the chip 5 by direct contact, and then dissipates the heat.

[0075] Optionally, the condensing end 1 can be installed on the fan bracket 7 of the air-conditioning outdoor unit. Compared with the existing installation on the side of the fan 6, the installation position provided by this embodiment has a larger space in the air-conditioning outdoor unit, which increases the heat dissipation area of the radiator. In addition, the airflow above the fan 6 flows more smoothly, further improving the heat dissipation capacity of the condensing end 2.

Claims

1. A radiator, characterized in that: Including heat dissipation components, evaporation end and connecting pipes, The heat dissipation component includes: a first working fluid flow path; a through hole, penetrating the heat dissipation component and arranged to avoid the first working medium flow path; a heat dissipation reinforcement member connected to the edge of the through hole, The first working medium flow path includes at least a first flow path and a second flow path, the first flow path is parallel to the second flow path, one or more inclined connecting flow paths are provided between the first flow path and the second flow path, the angle between the inclined connecting flow path and the first flow path is an acute angle, and the angle between the inclined connecting flow path and the second flow path is an obtuse angle, the first working medium flow path also includes a third flow path provided around the through hole, the first flow path, the second flow path and the third flow path are interconnected, the third flow path is provided with a first external port, the second flow path is provided with a second external port, and the first external port and the second external port are provided on the same side of the heat dissipation component, The evaporation end is provided with a second working medium flow path, and the evaporation end includes an airflow heat dissipation part and a phase change heat dissipation part. The phase change heat dissipation part is provided with a second working medium flow path. The heat dissipation element includes a first chip group with high heat generation and a second chip group with low heat generation. The first chip group is in thermal contact with the phase change heat dissipation part, and the second chip group is in thermal contact with the airflow heat dissipation part. The airflow heat dissipation part is provided with a working medium channel. The working medium channel is a groove. The groove is configured to accommodate a connecting pipe connecting the working medium flow path. The airflow heat dissipation part occupies 1 / 4-3 / 4 of the volume of the substrate, and the phase change heat dissipation part occupies 1 / 4-3 / 4 of the volume of the substrate. The connecting pipe connects the first working fluid flow path and the second working fluid flow path, The condensing end is installed on the fan bracket of the air conditioner outdoor unit.

2. The radiator according to claim 1, characterized in that The through hole includes a first edge and a second edge that are oppositely arranged. The first edge is connected to a first heat dissipation reinforcement member, and the second edge is connected to a second heat dissipation reinforcement member.

3. The radiator according to claim 1, wherein: The area of the heat dissipation reinforcement member is the same as the area of the through hole.

4. The radiator according to any one of claims 1 to 3, characterized in that: The heat dissipation component is an inflation-type temperature equalizing plate.

5. An air conditioner, characterized in that: The heat sink comprises the heat sink according to any one of claims 1 to 4.

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