Ball distribution device and ball planting system

Abstract

The present invention discloses a ball distribution device and a ball planting system, wherein the ball distribution device includes a fixed solder ball mechanism and a scraper mechanism for scraping off the solder balls, and a swing mechanism for swinging the fixed solder ball mechanism left and right to throw away the excess solder balls from the fixed solder ball mechanism. When in use, the scraper mechanism moves on the surface of the fixed solder ball mechanism, and the solder balls in the solder ball cavity in the scraper mechanism are moved to the fixed grooves distributed on the surface of the fixed solder ball mechanism for adsorption and fixation, and then the fixed solder ball mechanism is swung left and right by the swing mechanism, so that some solder balls on the edge of the fixed groove can leave, and at the same time, the excess solder balls are taken away from the surface of the fixed solder ball mechanism in cooperation with the scraper mechanism. Since the solder balls interact with each other through the scraper mechanism and the swing mechanism during the ball distribution process, the excess solder balls on the surface of the fixed solder ball mechanism are reduced, and at the same time, the scraper mechanism is prevented from damaging the shape of the solder balls during the movement process. The ball distribution efficiency and quality are improved, and the influence on the subsequent ball distribution is avoided.

Description

Technical Field

[0001] The present invention relates to the field of ball planting technology, and in particular to a ball distribution device and a ball planting system. Background Art

[0002] The existing solder ball distribution device usually uses a cylinder push-pull rotating ball plate, and a scraper is arranged on the ball plate to clean the excess solder balls.

[0003] Due to the defects of the cylinder drive, the cylinder speed cannot be adjusted, which easily leads to the phenomenon of solder ball throwing. In addition, the ball plate is fixed and the mold cannot be quickly switched according to the product. At the same time, the scraper is also prone to ball cutting. Summary of the invention

[0004] The main technical problem solved by the present invention is to provide a ball distribution device and a ball planting system, wherein the ball distribution device can avoid the chance of damaging the shape of the solder balls during the ball distribution process, thereby improving the ball distribution efficiency and ball distribution quality.

[0005] In order to solve the above problems, the present invention provides a ball distribution device, which includes a solder ball fixing mechanism for fixing solder balls, a scraper mechanism for scraping off excess solder balls on the surface of the solder ball fixing mechanism, and a swinging mechanism for swinging the solder ball fixing mechanism left and right to throw excess solder balls away from the solder ball fixing mechanism.

[0006] Furthermore, the solder ball fixing mechanism includes a ball plate having a groove for accommodating the solder ball on one side, a cavity provided on the other side of the ball plate for fixing the solder ball, and a vacuum component for generating negative pressure in the cavity. The groove is provided with a through hole connected to the cavity. When the cavity generates negative pressure, suction is generated in the groove to fix the solder ball.

[0007] Furthermore, the vacuum assembly includes a vacuum pump and a pipeline connected to the cavity.

[0008] Furthermore, the swing mechanism includes a swing shaft matched with a bearing frame arranged on the base and a swing driving component driving the swing shaft to swing left and right, and the swing shaft is fixed to the solder ball fixing mechanism.

[0009] Furthermore, the swing drive assembly includes a servo motor, a driving wheel connected to the rotating shaft of the servo motor, and a driven wheel that rotates synchronously with the driving wheel through a belt.

[0010] Furthermore, the scraper mechanism includes a scraper seat that slides with the upper surface of the ball plate and a scraper driving assembly that drives the scraper seat to move horizontally left and right, wherein the scraper seat is provided with a scraper, and a gap is provided between the scraper and the surface of the ball plate, and the gap is not larger than the diameter of the arranged ball and is not smaller than the height of the part of the solder ball exposed on the upper surface of the ball plate when the solder ball is located in the groove.

[0011] Furthermore, the scraper drive assembly includes a scraper motor and a driving gear arranged on the rotating shaft of the scraper motor, and the driving gear is meshed with a rack arranged on the scraper seat for transmission.

[0012] Furthermore, the left-right swing angle of the solder ball fixing mechanism is 40 degrees.

[0013] Furthermore, the ball distribution device also includes a positioning mechanism for keeping the solder ball fixing mechanism horizontal and stable.

[0014] Furthermore, the positioning mechanism includes positioning blocks located on both sides of the swing shaft and at the same horizontal height and a positioning cylinder driving the two positioning blocks to move synchronously toward or away from each other, and a guide assembly is provided between each positioning block and the base.

[0015] Furthermore, the ball distribution device also includes a position fine-tuning mechanism for horizontally adjusting the position of the solder ball fixing mechanism.

[0016] Furthermore, the position fine-tuning mechanism includes a screw micrometer arranged in the adjustment moving direction for measuring the adjustment distance and a fixing mechanism for fixing the solder ball fixing mechanism after the position is adjusted.

[0017] Further, the fixing mechanism comprises a bracket fixed to the base and a pressure rod rotatably connected to the bracket, the pressure rod is movably connected to the arc-shaped connecting rod, the other end of the arc-shaped connecting rod is connected to the push rod, and the pressure rod is provided with a pressure block in contact with the outer edge of the arc-shaped connecting rod, and the force direction when the push rod is fixed to the base is not on the same line as the force point between the pressure block and the arc-shaped connecting rod, the movably connected point between the pressure rod and the arc-shaped connecting rod, and the rotation point between the pressure rod and the bracket.

[0018] The present invention also provides a ball distribution system, which includes a ball distribution device, which includes a tin ball fixing mechanism for fixing tin balls, a scraper mechanism for scraping off excess tin balls on the surface of the tin ball fixing mechanism, and a swinging mechanism for swinging the tin ball fixing mechanism left and right to throw excess tin balls away from the tin ball fixing mechanism.

[0019] Furthermore, the solder ball fixing mechanism includes a ball plate having a groove for accommodating the solder ball on one side, a cavity provided on the other side of the ball plate for fixing the solder ball, and a vacuum component for generating negative pressure in the cavity. The groove is provided with a through hole connected to the cavity. When the cavity generates negative pressure, suction is generated in the groove to fix the solder ball.

[0020] Furthermore, the vacuum assembly includes a vacuum pump and a pipeline connected to the cavity.

[0021] Furthermore, the swing mechanism includes a swing shaft matched with a bearing frame arranged on the base and a swing driving component driving the swing shaft to swing left and right, and the swing shaft is fixed to the solder ball fixing mechanism.

[0022] Furthermore, the swing drive assembly includes a servo motor, a driving wheel connected to the rotating shaft of the servo motor, and a driven wheel that rotates synchronously with the driving wheel through a belt.

[0023] Furthermore, the scraper mechanism includes a scraper seat that slides with the upper surface of the ball plate and a scraper driving assembly that drives the scraper seat to move horizontally left and right, wherein the scraper seat is provided with a scraper, and a gap is provided between the scraper and the surface of the ball plate, and the gap is not larger than the diameter of the arranged ball and is not smaller than the height of the part of the solder ball exposed on the upper surface of the ball plate when the solder ball is located in the groove.

[0024] Furthermore, the scraper drive assembly includes a scraper motor and a driving gear arranged on the rotating shaft of the scraper motor, and the driving gear is meshed with a rack arranged on the scraper seat for transmission.

[0025] Furthermore, the left-right swing angle of the solder ball fixing mechanism is 40 degrees.

[0026] Furthermore, the ball distribution device also includes a positioning mechanism for keeping the solder ball fixing mechanism horizontal and stable.

[0027] Furthermore, the positioning mechanism includes positioning blocks located on both sides of the swing shaft and at the same horizontal height and a positioning cylinder driving the two positioning blocks to move synchronously toward or away from each other, and a guide assembly is provided between each positioning block and the base.

[0028] Furthermore, the ball distribution device also includes a position fine-tuning mechanism for horizontally adjusting the position of the solder ball fixing mechanism.

[0029] Furthermore, the position fine-tuning mechanism includes a screw micrometer arranged in the adjustment moving direction for measuring the adjustment distance and a fixing mechanism for fixing the solder ball fixing mechanism after the position is adjusted.

[0030] Further, the fixing mechanism comprises a bracket fixed to the base and a pressure rod rotatably connected to the bracket, the pressure rod is movably connected to the arc-shaped connecting rod, the other end of the arc-shaped connecting rod is connected to the push rod, and the pressure rod is provided with a pressure block in contact with the outer edge of the arc-shaped connecting rod, and the force direction when the push rod is fixed to the base is not on the same line as the force point between the pressure block and the arc-shaped connecting rod, the movably connected point between the pressure rod and the arc-shaped connecting rod, and the rotation point between the pressure rod and the bracket.

[0031] The present invention provides a ball distribution device and a ball planting system, wherein the ball distribution device includes a fixed solder ball mechanism for fixing solder balls, a scraper mechanism for scraping off excess solder balls on the surface of the fixed solder ball mechanism, and a swing mechanism for swinging the fixed solder ball mechanism left and right to throw excess solder balls away from the fixed solder ball mechanism. When in use, the scraper mechanism moves on the surface of the fixed solder ball mechanism, and the solder balls in the solder ball cavity in the scraper mechanism are moved to the fixed grooves distributed on the surface of the fixed solder ball mechanism for adsorption and fixation, and then the fixed solder ball mechanism is swung left and right by the swing mechanism, so that some solder balls on the edge of the fixed groove can leave, and at the same time, the excess solder balls are taken away from the surface of the fixed solder ball mechanism in cooperation with the scraper mechanism. Because during the ball distribution process, the solder balls interact with each other through the scraper mechanism and the swing mechanism, the excess solder balls on the surface of the fixed solder ball mechanism are reduced, and at the same time, the scraper mechanism is prevented from damaging the shape of the solder balls during movement. The ball distribution efficiency and quality are improved, and the impact on subsequent ball distribution is avoided. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings in the description only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0033] Figure 1 It is a schematic structural diagram of an embodiment of a ball distribution device of the present invention.

[0034] Figure 2 It is a schematic diagram of the exploded structure of the ball distribution device embodiment of the present invention.

[0035] Figure 3 It is a schematic diagram of the exploded structure of the ball distribution device embodiment of the present invention.

[0036] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0037] The claims of the present invention are further described in detail below in conjunction with specific embodiments and drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments proposed by ordinary technicians in this field before making creative work also fall within the scope of protection of the present invention.

[0038] It should be understood that, in the description of the embodiments of the present invention, all directional indication terms, such as "up", "down", "left", "right", "front", "back", etc., indicate the orientation or position relationship based on the orientation, position relationship shown in the drawings or the orientation or position relationship in which the invented product is usually placed when in use, which is only for the convenience of simplifying the description of the present invention, and does not expressly or imply that the device, element or component referred to must have a specific orientation and a specific orientation structure, and should not be understood as a limitation on the present invention. It is only used to explain the relative position relationship, movement, etc. between the components shown in the drawings. When the specific posture changes, the directional indication may also change accordingly.

[0039] In addition, ordinal numbers such as "first" and "second" in the present invention are only used for the purpose of distinction, and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. The features defined as "first" and "second" can explicitly or implicitly indicate at least one of the technical features. In the description of the present invention, "multiple" means at least two, that is, two or more, unless otherwise clearly defined; "at least one" means one or one and more.

[0040] In the present invention, unless otherwise clearly stipulated and limited, the terms such as "installation", "setting", "connection", "fixation" and "screw-on" should be understood in a broad sense. For example, the positional relationship between components can be relatively fixed, or the components can be physically fixedly connected; they can be detachably connected or integrated; they can be mechanically connected or electrically connected; they can be directly connected or indirectly connected through an intermediate medium or component; they can be internally connected between two elements or interact with each other. Unless otherwise clearly defined in the specification, other interpretations may not achieve the corresponding functions or effects. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0041] The controller and control circuit that may be involved in the present invention are conventional control technologies or units of those skilled in the art. For example, the control circuit of the controller can be realized by ordinary technicians in the field using existing technologies, such as simple programming. The power supply also uses the existing technology in the field, and the main technical point of the present invention is to improve the mechanical device, so the present invention will not describe the specific circuit control relationship and circuit connection in detail.

[0042] like Figure 1 - Figure 3 As shown, this ball distribution device embodiment.

[0043] The ball distribution device includes: a solder ball fixing mechanism 2 for fixing solder balls, a scraper mechanism 8 for scraping off excess solder balls on the surface of the solder ball fixing mechanism 2, and a swing mechanism 3 for swinging the solder ball fixing mechanism 2 left and right to throw excess solder balls away from the solder ball fixing mechanism.

[0044] Specifically, the scraper mechanism 8 is provided with a ball suction box 7 for placing solder balls. The solder ball fixing mechanism 2 includes a ball plate 22 having a solder ball receiving groove 221 on one side and a ball plate bracket 20 having a cavity 21 tightly fixed to the other side of the ball plate 20 for fixing the solder balls, and a vacuum component (not marked in the drawings) for generating negative pressure in the cavity 21. The groove 221 is provided with a through hole (not marked in the drawings) communicating with the cavity 21. When the cavity 21 generates negative pressure through the vacuum component, suction force for fixing the solder balls is generated in the groove 221. The vacuum component includes a vacuum pump (not marked in the drawings) and a pipe (not marked in the drawings) connected to the cavity 21.

[0045] The swing mechanism includes a swing shaft 52 matched with a bearing frame 51 provided on the base 1 and a swing drive assembly 3 driving the swing shaft 52 to swing left and right. The swing shaft 52 is fixed to the solder ball fixing mechanism 2, that is, to the ball plate 20 on the solder ball fixing mechanism 2. The swing drive assembly 3 includes a servo motor 31, a driving wheel 33 connected to the servo motor shaft, and a driven wheel 34 that rotates synchronously with the driving wheel 33 through a belt 32, and the driven wheel is connected to the swing shaft 52. When working, the swing shaft 52 swings left and right at an angle of 40 degrees, that is, at an angle of 40 degrees to the left and right perpendicular to the horizontal plane, so that it can not only ensure that there is one solder ball in the groove 221, but also ensure that when there are two or more solder balls in the groove 221 in a horizontal state, the unstable and unbalanced solder ball will leave the groove 221 after tilting, thereby ensuring that there can be only one solder ball in each groove 221.

[0046] The scraper mechanism 8 includes a scraper seat 80 that is slidably matched with the upper surface of the ball plate 22 and a scraper driving assembly that drives the scraper seat 80 to move horizontally left and right, wherein the scraper seat 80 is provided with a scraper 81, and a gap is provided between the scraper 81 and the surface of the ball plate 22, and the gap is not greater than the diameter of the ball to be laid, and is not less than the height of the part of the solder ball exposed on the upper surface of the ball plate when it is located in the groove. Under normal circumstances, the groove 221 can only accommodate one solder ball, but under certain circumstances, two solder balls may appear in one groove 221 during the ball laying process. In this case, the scraper 81 can avoid the deformation of the solder balls. When this situation occurs, in the process of laying the balls, the swing mechanism cooperates, and the ball plate 20 swings left and right at a certain angle. Due to the tilt of the ball plate 20, two solder balls cannot be balanced in one groove 221 and automatically leave the groove 221. At the same time, the scraper 81 can ensure that other excess solder balls on the surface of the ball plate 22 are scraped off the surface of the ball plate 22.

[0047] The scraper drive assembly includes a scraper motor 61 fixed to the ball plate bracket 20 and a driving gear 63 arranged on the rotating shaft of the scraper motor 61, and the driving gear 63 is meshed with a rack 62 arranged on the scraper seat 80 for transmission. The scraper seat 80 is provided with a solder ball storage chamber 82 for storing solder balls. When the solder balls are placed and the scraper is working, the solder balls are located in the solder ball storage chamber 82. When the solder balls in the solder ball storage chamber 82 are missing, the solder balls are released to the storage chamber 8 through the ball suction box 7. When working, the servo motor 31 drives the swing drive assembly 3 to make the fixed solder ball mechanism 2 fixed to the swing shaft 52 swing left and right, and the scraper mechanism 8 slidably connected to the ball plate bracket 20 on the fixed solder ball mechanism 2 swings synchronously. Since there are solder balls in the solder ball storage chamber 82 on the scraper mechanism 8, due to the action of gravity during the rotation process, the solder balls roll from one side of the surface of the ball plate 22 to the other side, so as to fall into the grooves 221 distributed on the surface of the ball plate 22, so as to achieve the distribution of the balls. Since there may be a situation in which there are two or more solder balls in a groove 221 during the ball distribution process, at this time, there are two or more solder balls in a groove 221 in an unstable equilibrium state, so the swing mechanism is swung left and right once or multiple times to move the solder balls in the unstable equilibrium state out of the groove 221, and at the same time, the scraper mechanism 8 is used to scrape the excess solder balls off the ball plate 22 to complete a ball distribution process.

[0048] Since the ball distribution device can avoid damaging the shape of the solder balls during the ball distribution process, the ball distribution efficiency and quality can be improved.

[0049] As needed, a guide assembly is provided between the scraper mechanism 8 and the ball plate bracket 20, and the guide assembly includes a slide groove and a guide rail cooperating with the slide groove. The slide groove and the guide rail adopt the technology and are appropriately arranged on the ball plate bracket 20 and the scraper seat 80 to ensure that they can move smoothly horizontally left and right when driven by the scraper motor 61.

[0050] As required, a left and right rotation limit mechanism is provided between the swing shaft 52 and the bearing frame 51 , and a rotation position sensor 53 may also be used, which is connected to the controller of the servo motor 31 to control the rotation angle of the swing shaft 52 .

[0051] Since the ball plate 22 needs to be in a horizontal state after the balls are placed, it is convenient to take the balls later. However, the ball plate 22 needs to swing left and right during the ball placement process. Due to the matching accuracy between the mechanism structures and the wear during use, it is impossible to ensure that the ball plate 22 needs to be in a horizontal state after the balls are placed. Therefore, the ball placement device also includes a positioning mechanism 4 that keeps the fixed solder ball mechanism horizontal and stable. The positioning mechanism 4 includes positioning blocks 43 located on both sides of the swing shaft 52 and at the same horizontal height and a positioning cylinder 41 that drives the two positioning blocks 43 to move synchronously toward or in the opposite direction. A guide assembly is provided between each positioning block 43 and the base 1. The guide assembly includes a guide rail 42 and a slider that cooperates with the guide rail (not shown in the figure). Since the positioning blocks 43 have the same height and are located on the same plane, during positioning, the two positioning blocks 43 are synchronously moved toward the swing shaft 52 by the positioning cylinder 41, so that the two positioning blocks 43 are respectively supported by the bottom of the ball plate bracket 20, thereby ensuring that the ball plate on the ball plate bracket 20 is in a horizontal state.

[0052] Since the size of the solder balls is determined according to the actual product during ball placement, and different sizes of solder balls cause differences in the position of the solder plate, while the position of the ball taking mechanism is relatively fixed, there may be deviations between the two. Therefore, in order to better meet the needs of the ball taking mechanism and the arrangement of solder balls of different sizes, the ball placement device also includes a position fine-tuning mechanism for horizontally adjusting the position of the fixed solder ball mechanism, and the position fine-tuning mechanism includes a screw micrometer 91 set in the adjustment moving direction for measuring the adjustment distance and a fixing mechanism 92 for fixing the fixed solder ball mechanism after the adjustment position. Since the base 1 is rigidly connected to the fixed solder ball mechanism, that is, the fixing mechanism 92 is used to fix the base 1 after each adjustment.

[0053] The fixing mechanism 92 comprises a fixed bracket 920 fixed to a base (not shown in the attachment) and a pressure rod 922 whose arc-shaped fixed end is rotatably connected to the fixed bracket 920, an operating end 9221 of the pressure rod 922 is rotatably connected to one end of an arc-shaped connecting rod 923, and the other end of the arc-shaped connecting rod 923 is movably connected to a push rod 921, and a pressure block 924 is provided on the pressure rod 992 which cooperates with the outer side of the arc-shaped connecting rod 923, and the force direction when the push rod is fixed to the base is not on the same line as the force point of the pressure block and the arc-shaped connecting rod, the movably connected point of the pressure rod and the arc-shaped connecting rod, and the rotation point of the pressure rod and the bracket.

[0054] Specifically, the fixed end 9220 of the pressure rod 922 is set to be arc-shaped, and a first rotating shaft (not marked in the drawings) is provided at the connection between the pressure rod 992 and the fixed bracket 920, a second rotating shaft (not marked in the drawings) is provided at the connection between the pressure rod 992 and the arc-shaped connecting rod 923, and a third rotating shaft is provided at the connection between the top rod 921 and the arc-shaped connecting rod 923, wherein the second rotating shaft is located at the arc-shaped part of the fixed end, and the second rotating shaft, the first rotating shaft and the pressure block 924 are not on the same straight line, while the second rotating shaft, the first rotating shaft and the third rotating shaft are on the same straight line.

[0055] When in use, the moving distance is adjusted by adjusting the screw micrometer 91, and then the position is fixed by the fixed mechanism 92. Due to the special structure of the fixing mechanism 92, when the pressing block 924 on the pressing rod 922 cooperates with the arc connecting rod 923, there will be no looseness without external force, thereby improving the stability and reliability of the fixation.

[0056] The present invention also provides an embodiment of a ball distribution system.

[0057] The ball distribution system includes a ball distribution device, which includes a fixed solder ball mechanism for fixing solder balls, a scraper mechanism for scraping off excess solder balls on the surface of the fixed solder ball mechanism, a swing mechanism for swinging the fixed solder ball mechanism left and right to throw excess solder balls away from the fixed solder ball mechanism, and a control module that can coordinate the actions of the scraper mechanism, the fixed solder ball mechanism and the swing mechanism.

[0058] Specifically, the ball distribution device adopts the above embodiment. The control module package is implemented by a conventional controller in the art, and the controller contains control instructions commonly used by those skilled in the art. Other structures and functions refer to the above embodiment and will not be described in detail.

[0059] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, a person skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents, and these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A ball distribution device, characterized in that: It includes a tin ball fixing mechanism for fixing tin balls and a scraper mechanism for scraping off excess tin balls on the surface of the tin ball fixing mechanism, and a swinging mechanism for swinging the tin ball fixing mechanism left and right to throw excess tin balls away from the tin ball fixing mechanism. The tin ball fixing mechanism includes a ball plate with a groove for storing tin balls on one side and a ball plate bracket with a cavity tightly fixed to the other side of the ball plate for fixing tin balls, and a vacuum component for generating negative pressure in the cavity, the groove is provided with a through hole connected to the cavity, and when the cavity generates negative pressure, suction is generated in the groove to fix the tin balls; the scraper mechanism includes a scraper seat slidably matched with the upper surface of the ball plate, a driving component for driving the scraper seat to move horizontally left and right, and a scraper driving component; the swinging mechanism includes a swing shaft matched with a bearing frame provided on the base and a swing driving component for driving the swing shaft to swing left and right, and the swing shaft is fixed to the tin ball fixing mechanism.

2. The ball distribution device according to claim 1, characterized in that: The vacuum assembly includes a vacuum pump and a pipeline connected to the cavity.

3. The ball distribution device according to claim 1, characterized in that: The swing drive assembly includes a servo motor, a driving wheel connected to the rotating shaft of the servo motor, and a driven wheel that rotates synchronously with the driving wheel through a belt.

4. The ball distribution device according to claim 1, characterized in that: The scraper seat is provided with a scraper, and a gap is provided between the scraper and the surface of the ball plate. The gap is not larger than the diameter of the arranged balls and is not smaller than the height of the solder ball exposed on the upper surface of the ball plate when the solder ball is located in the groove.

5. The ball distribution device according to claim 4, characterized in that: The scraper drive assembly comprises a scraper motor and a driving gear arranged on the rotating shaft of the scraper motor. The driving gear is meshed with a rack arranged on the scraper seat for transmission.

6. The ball distribution device according to claim 1, characterized in that: The left-right swing angle of the solder ball fixing mechanism is 40 degrees.

7. The ball distribution device according to claim 1, characterized in that: The ball distribution device also includes a positioning mechanism for keeping the solder ball fixing mechanism horizontal and stable.

8. The ball distribution device according to claim 7, characterized in that: The positioning mechanism comprises positioning blocks located on both sides of the swing shaft and at the same level and a positioning cylinder driving the two positioning blocks to move synchronously towards or in the opposite direction. A guide assembly is provided between each positioning block and the base.

9. The ball distribution device according to claim 1, characterized in that: The ball distribution device also includes a position fine-tuning mechanism for horizontally adjusting the position of the solder ball fixing mechanism.

10. The ball distribution device according to claim 9, characterized in that: The position fine-tuning mechanism comprises a screw micrometer arranged in the adjustment moving direction for measuring the adjustment distance and a fixing mechanism for fixing the solder ball fixing mechanism after the position is adjusted.

11. The ball distribution device according to claim 10, characterized in that: The fixing mechanism is connected to a bracket fixed to the base and a pressure rod whose arc-shaped fixed end is rotatably connected to the fixed bracket. The operating end of the pressure rod is rotatably connected to one end of the arc-shaped connecting rod, and the other end of the arc-shaped connecting rod is movably connected to the push rod. The pressure rod is provided with a pressure block that cooperates with the outer side of the arc-shaped connecting rod, and the force direction when the push rod is fixed to the base is not on the same line as the force point of the pressure block and the arc-shaped connecting rod, the movably connected point of the pressure rod and the arc-shaped connecting rod, and the rotation point of the pressure rod and the bracket.

12. A bulb planting system, comprising a bulb placing device, characterized in that: The ball distribution device comprises the ball distribution device described in any one of claims 1-11.

Images