Mounting base, RGB lamp bead, and mounting base manufacturing method

Abstract

The present invention discloses a mounting seat for mounting an RGB chip, comprising a substrate, a mounting portion for mounting the RGB chip being provided on the substrate, a metal enclosure being provided on the outer side of the mounting portion, and a filling gap being provided between the inner side of the metal enclosure and the outer side of the mounting portion. The filling gap between the inner side of the metal enclosure and the outer side of the mounting portion can be used to fill a colloid, and since the metal enclosure can be formed by processes such as electroplating, replacing the existing cup-shaped structure formed by injection molding, the metal enclosure can be made thinner, thereby reducing the overall thickness of the mounting seat, and the overall thickness of the RGB lamp beads can be reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of electrical components, and in particular to the technical field of RGB lamp beads. Background Art

[0002] The existing RGB lamp beads include a substrate, a cup-shaped structure is provided on the substrate, and the RGB chips (including red light chips, green light chips, and red light chips) are installed in the cup-shaped structure, and then filled with colloid. The existing RGB substrate and cup-shaped structure are usually integrally formed by injection molding, and the overall thickness of the RGB lamp beads is relatively large, which is difficult to meet the application scenarios of thin and light RGB lamp beads. Summary of the invention

[0003] In order to solve the above problems, the present invention aims to provide an RGB lamp bead structure to reduce the overall thickness of the RGB.

[0004] To achieve the above object, the present invention is implemented according to the following technical solutions:

[0005] A mounting seat for mounting an RGB chip comprises a substrate, wherein a mounting portion for mounting the RGB chip is provided on the substrate, a metal enclosure is provided around the outer side of the mounting portion, and a filling gap is provided between the inner side of the metal enclosure and the outer side of the mounting portion.

[0006] Preferably, a metal platform is provided on the inner side of the metal enclosure, and the height of the metal enclosure is greater than the height of the metal platform.

[0007] Preferably, a circuit connection portion for electrically connecting to the RGB chip is provided on the top surface of the metal stage.

[0008] Preferably, a chip overlapping portion is provided at one end of the metal platform away from the metal enclosure plate, and the mounting portion includes the chip overlapping portion.

[0009] Preferably, the metal enclosure includes a first enclosure group and a second enclosure group, the first enclosure group and the second enclosure group are respectively used to connect to the positive and negative electrodes of the RGB chip, a first partition gap is provided between the first enclosure group and the second enclosure group, a second partition gap is provided inside the first enclosure group and / or inside the second enclosure group, and the first partition gap and the second partition gap are both configured to connect the outer side of the metal enclosure and the filling gap at both ends.

[0010] Preferably, the second partition gap includes a first gap segment and a second gap segment, and an extension direction of the first gap segment and an extension direction of the second gap segment form an included angle.

[0011] An RGB lamp bead comprises the above-mentioned mounting base.

[0012] An RGB lamp bead comprises the above-mentioned mounting seat and an RGB chip, wherein the RGB chip is mounted on the mounting portion; and further comprises a filling layer, wherein the lower end of the filling layer is filled into the filling gap, and the lower end of the filling layer covers the metal platform.

[0013] Preferably, the outer side of the lower end of the filling layer abuts against the inner side of the metal enclosure.

[0014] A mounting seat manufacturing method is used to manufacture the above-mentioned mounting seat, comprising the following steps: electroplating the metal enclosure and the metal platform on the substrate to a first height; covering the top surface of the metal platform, and electroplating the metal enclosure to a second height.

[0015] The beneficial effects of the present invention are as follows: the filling gap between the inner side of the metal enclosure and the outer side of the mounting portion can be used to fill the colloid. Since the metal enclosure can be formed by processes such as electroplating, replacing the existing cup-shaped structure formed by injection molding, the metal enclosure can be made thinner, thereby reducing the overall thickness of the mounting base and the overall thickness of the RGB lamp beads. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying any creative work.

[0017] Figure 1 It is a top view of an embodiment of a mounting base and RGB lamp beads of the present invention (the filling layer is not shown).

[0018] Figure 2 It is a top view of another embodiment of the mounting base and RGB lamp beads of the present invention (the filling layer is not shown).

[0019] Figure 3 This is a top view of another embodiment of the mounting base and RGB lamp beads of the present invention (the filling layer is not shown).

[0020] Figure 4 Schematic diagram of the three-dimensional structure of the mounting base and RGB lamp beads of the present invention (corresponding to Figure 3 , the filling layer is not shown).

[0021] Figure 5 Schematic diagram of the three-dimensional structure of the mounting base and RGB lamp bead embodiment 3 of the present invention (corresponding to Figure 3 of the embodiment of the invention).

[0022] in:

[0023] 1-substrate, 2-metal enclosure, 3-filling gap, 21-metal platform, 22-line connection portion, 23-chip overlapping portion, 4-first partition gap, 5-second partition gap, 51-first gap section, 52-second gap section, 6-filling layer. DETAILED DESCRIPTION

[0024] In order to more clearly understand the above-mentioned objects, features and advantages of the present invention, the present invention is described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that, in the absence of conflict, the embodiments of the present application and the features in the embodiments can be combined with each other. In the following description, many specific details are set forth in order to fully understand the present invention, and the embodiments described are only a part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in the art without making creative work are within the scope of protection of the present invention.

[0025] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used in the specification of the present invention herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention.

[0026] Example 1

[0027] Reference Figures 1 to 5 This is an embodiment of the present invention, specifically: a mounting seat for mounting an RGB chip, comprising a substrate 1, a mounting portion for mounting the RGB chip is provided on the substrate 1, a metal enclosure 2 is provided around the outer side of the mounting portion, and a filling gap 3 is provided between the inner side of the metal enclosure 2 and the outer side of the mounting portion.

[0028] Example 2

[0029] Different from the embodiment 1, a metal platform 21 is provided inside the metal enclosure 2, and the height of the metal enclosure 2 is greater than the height of the metal platform 21. The height of the metal enclosure 2 refers to the distance from the highest point of the metal enclosure 2 to the substrate 1. The height of the metal enclosure 2 is greater than the height of the metal platform 21, and the structure with a height difference between the metal enclosure 2 and the metal platform 21 can be used to block the colloid when filling the colloid and form a more stable connection structure with the colloid.

[0030] Example 3

[0031] Different from Example 2, Figure 1 , Figure 3 , Figure 4As shown, a circuit connection portion 22 for electrically connecting to the RGB chip is provided on the top surface of the metal stage 21. The circuit connection portion 22 enables the RGB chip to be connected to the metal stage 21 and the metal enclosure 2 through the circuit. After the circuit is connected to the top surface of the metal stage 21, it can be covered by the filled colloid to avoid exposure of the connection and protect the strength of the connection.

[0032] Example 4

[0033] Different from Example 2, Figure 2 As shown, a chip overlap portion 23 is provided at one end of the metal platform 21 away from the metal enclosure 2, and the mounting portion includes the chip overlap portion 23. The chip overlap portion 23 provides different mounting forms for the RGB chip, and the chip overlap portion 23 enables the RGB chip to be overlapped at two ends on different chip overlap portions 23 respectively.

[0034] Example 5

[0035] Different from the embodiment 1, the metal enclosure 2 includes a first enclosure group and a second enclosure group, the first enclosure group and the second enclosure group are respectively used to connect with the positive electrode and the negative electrode of the RGB chip, a first partition gap 4 is provided between the first enclosure group and the second enclosure group, a second partition gap 5 is provided inside the first enclosure group and / or inside the second enclosure group, and the first partition gap 4 and the second partition gap 5 are both configured to connect the outer side of the metal enclosure 2 and the filling gap 3 at both ends. The first partition gap 4 enables the positive electrode and the negative electrode of the RGB chip to work independently, and the second partition gap 5 enables the inside of the positive electrode and / or the negative electrode of the RGB chip to be divided into several independently working parts; at the same time, the first partition gap 4 and the second partition gap 5 can be used to guide the colloid to flow outward during filling, so that the mounting seat can be used to evenly fill the colloid.

[0036] As a further preferred embodiment, Figure 3 , Figure 4 As shown, the second partition gap 5 includes a first gap section 51 and a second gap section 52, and the extension direction of the first gap section 51 and the extension direction of the second gap section 52 have an included angle. The extension direction of the first gap section 51 and the extension direction of the second gap section 52 have an included angle, which can reduce the possibility of the colloid flowing out along the second partition gap 5 during filling.

[0037] Example 6

[0038] Reference Figures 1 to 5 This is an embodiment of the present invention, specifically: an RGB lamp bead, including the above-mentioned mounting seat, and also including an RGB chip, the RGB chip is mounted on the mounting portion; and also includes a filling layer 6, the lower end of the filling layer 6 is filled into the filling gap 3, and the lower end of the filling layer 6 covers the metal platform 21. The filling layer 6 covers the metal platform 21, and the connection with the metal enclosure 2 and the metal platform 21 is more stable.

[0039] As a further preferred embodiment, the outer side of the lower end of the filling layer 6 abuts against the inner side of the metal shroud 2, further increasing the connection stability between the filling layer 6, the metal shroud 2 and the metal platform 21.

[0040] Embodiment 7

[0041] Referring to Figures 3 to 5 , this is an embodiment of the present invention. Specifically: an RGB light-emitting diode (LED) chip, comprising a mounting base for mounting an RGB chip, the RGB chip including a red light-emitting chip, a green light-emitting chip, and a blue light-emitting chip. The mounting base includes a substrate 1, and a mounting portion for mounting the RGB chip is provided on the substrate 1. The mounting portion is, for example, Figure 3 , Figure 4 the pedestal structure below the RGB chip in the figure, which is arranged in an isolated island shape and arranged in a "pin" shape side by side. A metal shroud 2 is provided around the outside of the mounting portion. The metal shroud 2 includes a first shroud group and a second shroud group. The first shroud group and the second shroud group are respectively used to connect to the positive and negative electrodes of the RGB chip. A first partition gap 4 is provided between the first shroud group and the second shroud group, with a total of two, which are respectively provided at both ends of the first shroud group; second partition gaps 5 are provided inside the first shroud group and inside the second shroud group, and two second partition gaps 5 are provided inside both the first shroud group and the second shroud group. The second partition gap 5 is divided into two types. Among them, the second partition gap 5 inside the first shroud group is linear; the second partition gap 5 inside the second shroud group is bent, that is, it includes a first gap segment 51 and a second gap segment 52. The extending direction of the first gap segment 51 and the extending direction of the second gap segment 52 have a 90-degree angle. A third gap segment is further provided outside the second gap segment 52 in the figure, and a 90-degree angle is provided between the extending direction of the second gap segment 52 and the extending direction of the third gap segment, further reducing the possibility of the filling layer 6 overflowing during filling. Both the first partition gap 4 and the second partition gap 5 are set to be connected to the outside of the metal shroud 2 and the filling gap 3 at both ends respectively. A filling gap 3 is provided between the inner side of the metal shroud 2 and the outside of the mounting portion, and the filling gap 3 can be set to extend in the height direction to the RGB chip.

[0042] A metal platform 21 is provided on the inner side of the metal shroud 2, and the height of the metal shroud 2 is greater than the height of the metal platform 21. A total of six metal platforms 21 are provided, corresponding to the six sections divided by the first shroud group and the second shroud group respectively. The metal shroud 2 and the metal platform 21 can be integrally formed by an electroplating process.

[0043] The RGB LED chip further includes an RGB chip mounted on the mounting portion; it further includes a filling layer 6. The lower end of the filling layer 6 is filled into the filling gap 3, the lower end of the filling layer 6 covers the metal platform 21, and the outer side of the lower end of the filling layer 6 abuts against the inner side of the metal shroud 2.

[0044] Example 8

[0045] A mounting seat manufacturing method is used to manufacture the above-mentioned mounting seat, comprising the following steps: electroplating a metal enclosure 2 and a metal platform 21 on a substrate 1 to a first height; covering the top surface of the metal platform 21, and electroplating the metal enclosure 2 to a second height.

[0046] The above description is only a preferred embodiment of the present invention and does not limit the present invention in any form. Therefore, any modification, equivalent change and modification made to the above embodiment based on the technical essence of the present invention without departing from the technical solution of the present invention shall still fall within the scope of the technical solution of the present invention.

Claims

1. A mounting base for mounting an RGB chip, characterized in that: It comprises a substrate, a mounting portion for mounting an RGB chip is provided on the substrate, a metal enclosure is provided on the outer side of the mounting portion, and a filling gap is provided between the inner side of the metal enclosure and the outer side of the mounting portion; A metal platform is provided on the inner side of the metal enclosure, and the height of the metal enclosure is greater than the height of the metal platform; The metal enclosure includes a first enclosure group and a second enclosure group, the first enclosure group and the second enclosure group are respectively used to connect to the positive electrode and the negative electrode of the RGB chip, a first partition gap is provided between the first enclosure group and the second enclosure group, a second partition gap is provided inside the first enclosure group and / or inside the second enclosure group, and the first partition gap and the second partition gap are both configured to respectively connect the outer side of the metal enclosure and the filling gap at both ends; The second partition gap includes a first gap segment and a second gap segment, and an extension direction of the first gap segment and an extension direction of the second gap segment form an included angle.

2. The mounting seat according to claim 1, characterized in that: A circuit connection portion for electrically connecting to the RGB chip is provided on the top surface of the metal platform.

3. The mounting seat according to claim 1, characterized in that: A chip overlapping portion is provided at one end of the metal platform away from the metal enclosure plate, and the mounting portion includes the chip overlapping portion.

4. An RGB lamp bead, characterized in that: Comprising the mounting seat described in claim 1.

5. An RGB lamp bead, characterized in that: It includes the mounting seat according to any one of claims 1 to 3, and also includes an RGB chip, wherein the RGB chip is mounted on the mounting portion; and also includes a filling layer, wherein the lower end of the filling layer is filled into the filling gap, and the lower end of the filling layer covers the metal platform.

6. The RGB lamp bead according to claim 5, characterized in that: The outer side of the lower end of the filling layer abuts against the inner side of the metal enclosure plate.

7. A method for manufacturing a mounting seat, used for manufacturing the mounting seat according to any one of claims 1 to 3, characterized in that: The method comprises the following steps: electroplating the metal enclosure plate and the metal stage to a first height on the substrate; and covering the top surface of the metal stage and electroplating the metal enclosure plate to a second height.

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