Metal surface mount solid state relay structure

Abstract

The present invention discloses a metal surface-mount solid-state relay structure, comprising a metal housing component encapsulating a power output component, a connection component, and an input drive component. The metal housing component comprises a housing base, a cover plate, and left and right electrode rod groups. The cover plate fits over the housing base cavity and is welded to the housing base via a fusion welding process. The left and right electrode rod groups are led out from the left and right sides of the housing base, respectively. The lead-out holes between each electrode rod in the left and right electrode rod groups and the housing base are sealed using a glass sintering process. Each electrode rod group includes electrode rods I and II, which are equidistantly spaced front and rear, with their lead-out ends offset at high and low positions. The surface-mounted ends of each electrode rod I and II are lower than the bottom of the housing base. The present invention has excellent temperature adaptability, good processing performance, and good sealing performance. Its installation method meets surface mounting requirements and is suitable for automated production.

Description

Technical Field

[0001] The invention relates to an electronic control component, in particular to a metal surface mounted solid relay structure. Background Art

[0002] The main materials for solid-state relay housings are metal, ceramic and plastic.

[0003] Metal materials are mainly used for the casings of military solid-state relays, and the installation method is designed to be direct plug-in or with additional mounting ears; ceramic materials are mostly used for the casings of military and industrial solid-state relays, and the installation method can be designed to be direct plug-in or surface mount; plastic materials are mostly used for the casings of industrial or commercial solid-state relays, and the installation method can be designed to be direct plug-in or surface mount.

[0004] The above design has the following shortcomings:

[0005] 1. The metal shell is installed by direct plug-in or with additional mounting ears. On the one hand, it takes up too much space, which is not conducive to the miniaturization design of the system; on the other hand, it is difficult to achieve automated welding, and the production efficiency is low.

[0006] 2. Ceramic materials are usually combined with metal materials to make relay housings, but due to the complex processing technology and high processing difficulty, it is not conducive to the heat dissipation of high-power devices, so it is rarely used.

[0007] 3. Plastic materials have poor temperature adaptability and cannot meet sealing requirements, and are rarely used in the military field. Summary of the Invention

[0008] In view of the shortcomings of the prior art, the technical problem to be solved by the present invention is to propose a metal surface mount solid state relay structure that can meet the surface mount process.

[0009] The metal surface mount solid state relay structure that can solve the above technical problems includes a metal housing component (which performs insulation and sealing functions) that encapsulates the power output component, connection component, and input drive component. The difference is:

[0010] 1. The metal shell component includes a shell base, a cover plate, and left and right electrode rod groups. The cover plate covers the shell base cavity and is welded to the shell base through a fusion welding process. The left and right electrode rod groups are respectively led out from the left and right sides of the shell base. The lead-out holes between each electrode rod in the left and right electrode rod groups and the shell base are sealed using a glass sintering process.

[0011] 2 Each electrode rod group includes electrode rods I and II which are equidistantly spaced in the front and rear and whose lead ends are staggered high and low. The lead ends of each electrode rod I are at a high position at the same height, and the lead ends of each electrode rod II are at a low position at the same height. The surface-mounted ends of each electrode rod I and each electrode rod II are lower than the bottom of the shell seat.

[0012] One structure of the power output component includes a substrate II and a power field effect transistor. The substrate II is a double-sided ceramic copper-clad plate welded to the bottom of one side of the seat cavity of the shell seat through the lower copper surface. The power field effect transistor is welded to the upper copper surface of the double-sided ceramic copper-clad plate, and the lead ends of each electrode rod II on the same side are welded to the upper copper surface of the double-sided ceramic copper-clad plate.

[0013] A structure of the connecting component includes a substrate I and guide plates I, guide plates II, guide plates III, and guide plates IV. The substrate I is a double-sided ceramic copper-clad strip welded to the bottom of the other side of the seat cavity of the shell seat through the lower copper surface. The lead ends of each electrode rod II on the same side are welded to the upper copper surface of the double-sided ceramic copper-clad strip. The guide plates III that are aligned one by one with each electrode rod on the same side are vertically welded to the upper copper surface of the double-sided ceramic copper-clad strip and respectively welded to the corresponding electrode rods. The guide plates IV that are aligned one by one with each electrode rod I on the same side are vertically welded to the upper copper surface of the double-sided ceramic copper-clad board. The guide plates I that are aligned with each electrode rod II on the same side are horizontally arranged on the power field-effect tube. One end of each guide plate I is welded to the power field-effect tube, and the other end of each guide plate I is welded to the aligned electrode rod II. The guide plates II that are aligned with each guide plate IV are welded to the upper copper surface of the double-sided ceramic copper-clad board.

[0014] The input drive component includes an input drive circuit and a printed board. The surface-mount electrical components in the input drive circuit are welded on the printed board. The printed board is supported and installed by guide plates III and IV, and guide plates II, III and IV are all connected to the input drive circuit.

[0015] For military applications, the insulation performance between the housing and the electrode rods is at least 1000MΩ (500Vd.c.), and the sealing performance inside the housing is at least 1×10 -9 Pa·m 3 / s.

[0016] Beneficial effects of the present invention:

[0017] 1. In the metal surface-mounted solid relay structure of the present invention, the metal shell base has good temperature adaptability and good processing performance.

[0018] 2. In the structure of the present invention, the input drive component is supported by a guide plate, which has high reliability.

[0019] 3. In the structure of the present invention, each electrode rod I is not subject to the gravity of the input drive component, which is conducive to maintaining the sealing performance of the glass sintering.

[0020] 4. In the structure of the present invention, the installation method meets the requirements of surface mounting and is suitable for automated production. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is a front view of an embodiment of the present invention.

[0022] Figure 2 for Figure 1 Top view of an embodiment.

[0023] Figure 3 for Figure 1 Side view of an embodiment.

[0024] Figure 4 for Figure 1 Internal structure diagram of an implementation method.

[0025] Figure 5 for Figure 4 Top view of the (excluding input drive components).

[0026] Figure number identification: 1. Shell base; 1-1. Lead-out hole; 2. Electrode rod I; 3. Electrode rod II; 4. Cover plate; 5. Base plate II; 6. Power field effect tube; 7. Base plate I; 8. Guide plate I; 9. Guide plate II; 10. Guide plate III; 11. Guide plate IV; 12. Printed circuit board; 13. Electrical components. DETAILED DESCRIPTION

[0027] The technical solution of the present invention will be further described below with reference to the embodiments shown in the accompanying drawings.

[0028] The metal surface-mount solid relay structure of the present invention includes a metal housing component that encapsulates a power output component, a connecting component, and an input drive component. The power output component is configured to conduct the drain-source electrode after receiving a gate-source turn-on voltage, thereby conducting the output end of the solid relay. The connecting component is configured to carry the input drive component and connect the input drive component to the power output component. The input drive component is configured to receive a control signal and output a gate-source turn-on voltage.

[0029] The metal shell component includes a metal die-cast shell base 1, a thin cover plate 4 and left and right electrode rod groups. The cover plate 4 is sealed on the upper opening of the shell base 1 and is welded to the shell base through a fusion welding process. Eight lead-out holes 1-1 with equal spacing in the front and rear directions and high and low staggered positions are symmetrically opened on the left and right sides of the shell base 1 (the spacing distance is equal to the staggered height). Among the eight lead-out holes 1-1 on each side, four lead-out holes 1-1 are at a low position at the same height, and four lead-out holes 1-1 are at a high position at the same height; each electrode rod group includes a pair of lead-out holes 1-1 located at the four low-position lead-out holes 1 -1 Z-shaped electrode rod II3 and Z-shaped electrode rod I2 located at four high-position lead-out holes 1-1, the horizontal upper end (lead-out end) of each electrode rod coaxially extends into the corresponding lead-out hole 1-1 and the gap between the lead-out hole 1-1 and the electrode rod is sealed using a glass sintering process. The bottom of the horizontal lower end of each electrode rod is approximately lower than the bottom of the shell base 1 to ensure that the electrode rod and the printed circuit board pad can be tightly attached when the solid-state relay is installed; the left and right electrode rods I2 serve as the input negative terminal and output negative terminal of the solid-state relay, and the left and right electrode rods II3 serve as the input positive terminal and output positive terminal of the solid-state relay. Figure 1 、 Figure 2 、 Figure 3 shown.

[0030] The power output component includes a substrate II 5 and a power field effect tube 6. The substrate II 5 is a double-sided ceramic copper clad plate. The double-sided ceramic copper clad plate is placed at the bottom right of the seat cavity of the shell seat 1. The double-sided ceramic copper clad plate is welded to the bottom of the seat cavity through the lower copper surface. The upper copper surface of the double-sided ceramic copper clad plate is flush with the bottom of the lead-out end of the four electrode rods II 3 in the right electrode rod group. The four electrode rods II 3 are overlapped on the right part of the upper copper surface of the double-sided ceramic copper clad plate and welded together. The power field effect tube 6 is placed on the upper copper surface of the double-sided ceramic copper clad plate and welded to it. Figure 4 、 Figure 5 shown.

[0031] The connecting components include a substrate I7 ​​and guide pieces I8, guide pieces II9, guide pieces III10, and guide pieces IV11. The substrate I7 ​​is a double-sided ceramic copper-clad strip. The front and rear double-sided ceramic copper-clad strips are placed at the bottom left of the seat cavity of the shell seat 1. The double-sided ceramic copper-clad strips are welded to the bottom of the seat cavity through the lower copper surface. The upper copper surface of the double-sided ceramic copper-clad strips is flush with the bottom of the lead-out ends of the four electrode rods II3 in the left electrode rod group. The four electrode rods II3 are overlapped on the upper copper surface of the double-sided ceramic copper-clad strips and welded together with them; eight vertical guide pieces III10 (respectively corresponding to the eight electrode rods in the left electrode rod group) are welded to the upper copper surface of the double-sided ceramic copper-clad strips, and the eight guide pieces III10 are respectively welded to the corresponding electrode rods; four vertical guide pieces IV11 (respectively corresponding to the eight electrode rods in the right electrode rod group) are welded to the upper copper surface of the double-sided ceramic copper-clad strips. Four electrode rods I2) are welded to the right side of the upper copper surface of the double-sided ceramic copper-clad laminate, four guide plates IV11 are respectively welded to the corresponding electrode rods I2, four horizontal L-shaped guide plates I8 (respectively corresponding to the four guide plates IV11) are placed on the power field effect transistor 6, one end of each guide plate I8 is welded to the source of the power field effect transistor 6, and the other end of each guide plate I8 is welded to the corresponding guide plate IV11; four vertical guide plates II9 (respectively corresponding to the four electrode rods II3 in the right electrode rod group) are welded to the left side of the upper copper surface of the double-sided ceramic copper-clad laminate, and each guide plate II9 is ​​connected to the gate of the power field effect transistor 6 through the upper copper surface of the double-sided ceramic copper-clad laminate; the pattern of the upper copper surface of the double-sided ceramic copper-clad laminate is designed according to the welding position of the power field effect transistor 6 and the guide plates II9 and IV11, as shown in FIG. Figure 4 、 Figure 5 shown.

[0032] The input drive component includes an input drive circuit and a printed circuit board 12. The surface-mounted electrical components 13 in the input drive circuit are welded on the printed circuit board 12. The printed circuit board 12 is supported and mounted on the guide plate III 10 and the guide plate IV 11. The upper ends of the guide plates III 10 and IV 11 pass through the printed circuit board 12 and are welded to the input drive circuit. The guide plates IV 11 lead the negative end of the gate start voltage to the source of the power field effect tube 6. The upper ends of the four guide plates II 9 also pass through the printed circuit board 12 and are welded to the input drive circuit to lead the positive end of the gate start voltage to the gate of the power field effect tube 6. Figure 4 、 Figure 5 shown.

Claims

1. A metal surface-mount solid-state relay structure, comprising a metal housing component encapsulating a power output component, a connection component, and an input drive component, characterized in that: The metal shell component includes a shell base (1), a cover plate (4) and left and right electrode rod groups, wherein the cover plate (4) covers the seat cavity of the shell base (1) and is welded to the shell base (1) through a fusion welding process, and the left and right electrode rod groups are respectively led out from the left and right sides of the shell base (1), and the lead-out holes (1-1) are sealed between each electrode rod in the left and right electrode rod groups and the shell base (1) by a glass sintering process; each electrode rod group includes electrode rods I (2) and electrode rods II (3) which are arranged at equal intervals in front and back and have lead-out ends that are staggered high and low, the lead-out ends of each electrode rod I (2) are at a high position at the same height, the lead-out ends of each electrode rod II (3) are at a low position at the same height, and the surface-mounted ends of each electrode rod I (2) and each electrode rod II (3) are lower than the bottom of the shell base (1); The power output component includes a substrate II (5) and a power field effect tube (6), wherein the substrate II (5) is a double-sided ceramic copper-clad plate welded to the bottom of one side of the seat cavity of the shell seat (1) through the lower copper surface, the power field effect tube (6) is welded to the upper copper surface of the double-sided ceramic copper-clad plate, and the lead ends of each electrode rod II (3) on the same side are welded to the upper copper surface of the double-sided ceramic copper-clad plate; The connecting component includes a base plate I (7) and a guide plate I (8), a guide plate II (9), a guide plate III (10), and a guide plate IV (11). The base plate I (7) is a double-sided ceramic copper-clad strip welded to the bottom of the other side of the seat cavity of the shell seat (1) through the lower copper surface. The lead ends of each electrode rod II (3) on the same side are welded to the upper copper surface of the double-sided ceramic copper-clad strip. The guide plates III (10) aligned with each electrode rod on the same side are welded to the upper copper surface of the double-sided ceramic copper-clad strip and are welded respectively. On the corresponding electrode rods, the guide pieces IV (11) aligned with the electrode rods on the same side are welded on the upper copper surface of the double-sided ceramic copper clad plate, and the guide pieces I (8) aligned with the electrode rods II (3) on the same side are arranged horizontally, one end of each guide piece I (8) is welded to the power field effect tube (6), and the other end of each guide piece I (8) is welded to the aligned electrode rod II (3), and the guide pieces II (9) aligned with the guide pieces IV (11) are welded vertically on the upper copper surface of the double-sided ceramic copper clad plate at equal intervals; The input drive component includes an input drive circuit and a printed circuit board (12). Each surface-mounted electrical component (13) in the input drive circuit is welded on the printed circuit board (12). The printed circuit board (12) is supported and installed by the guide plate III (10) and the guide plate IV (11). The guide plate II (9), the guide plate III (10), and the guide plate IV (11) are all connected to the input drive circuit.

2. The metal surface mount solid state relay structure according to claim 1, characterized in that: The insulation performance between the shell base (1) and each electrode rod is at least 1000MΩ, and the sealing performance inside the shell base (1) is at least 1×10 -9 Pa·m 3 / s.

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