Industrial high temperature resistant release film

Abstract

The invention discloses an industrial high temperature resistant release film, which comprises a release layer, a microsphere layer, an adhesive layer, a support layer and a pressure sensitive adhesive layer from top to bottom, wherein the thickness of the release layer is 1 μm to 3 μm, the thickness of the microsphere layer is 150 μm to 200 μm, the thickness of the adhesive layer is 50 μm to 100 μm, the thickness of the support layer is 250 μm to 450 μm, and the thickness of the pressure sensitive adhesive layer is 80 μm to 120 μm. The invention can achieve low maintenance cost through the above design.

Description

Technical Field

[0001] The invention relates to the technical field of release films, and in particular to an industrial high-temperature resistant release film. Background Art

[0002] In the production process of coating and printing industry, several intermediate transition rollers are generally used to play the role of support and anti-sticking. At present, the intermediate transition rollers on the market are generally Teflon rollers. Due to the high cost of Teflon rollers, the repair cost of Teflon rollers after damage is high, so it is necessary to make improvements. Summary of the invention

[0003] The invention aims at the defects of high maintenance cost in the prior art and provides a new industrial high temperature resistant release film.

[0004] In order to solve the above technical problems, the present invention is implemented by the following technical solutions:

[0005] An industrial high temperature resistant release film comprises, from top to bottom, a release layer, a microsphere layer, an adhesive layer, a support layer, and a pressure sensitive adhesive layer, wherein the release layer has a thickness of 1 μm to 3 μm, the microsphere layer has a thickness of 150 μm to 200 μm, the adhesive layer has a thickness of 50 μm to 100 μm, the support layer has a thickness of 250 μm to 450 μm, and the pressure sensitive adhesive layer has a thickness of 80 μm to 120 μm. The preparation method thereof is as follows:

[0006] A-1. Take adhesive, catalyst A, curing agent A, and toluene A, and mix them in a weight ratio of 1: 0.012-0.018: 0.1-0.3: 25-45 to obtain a coating mixture A, and then take a carrier A with a release surface, and coat the coating mixture A on the release surface of the carrier A with a coating gap of 250 μm-350 μm. After coating, place it in an oven at 50° C. to 100° C. and dry it for 2.5 minutes to 3.5 minutes to obtain a transfer film A;

[0007] A-2, taking a support layer and a transfer film A, laminating the coating mixture A on one side of the transfer film A and one side of the support layer through an intermediate laminating roller, peeling off the carrier A, thereby preparing an adhesive layer on the support layer;

[0008] A-3. Take microspheres and silane coupling agent, perform surface pretreatment on the microspheres with the silane coupling agent, add the microspheres to a bead implanting device with a circulation device after the surface pretreatment, and then implant the microspheres into the adhesive layer, and then dry them in an oven at a temperature of 110° C. to 150° C. for 3 to 4 minutes, and then remove the surface beads with a dust removal device to obtain a semi-finished release film A with a microsphere layer, and place the semi-finished release film A in an oven at a temperature of 50° C. to 60° C. for maturation for not less than 48 hours;

[0009] A-4. Take a release agent, a catalyst B, a curing agent B, and a solvent, and compound them in a weight ratio of 1: 0.015-0.02: 0.1-0.2: 0.2-0.4 to obtain a release mixture, and then apply the release mixture to the surface of the microsphere layer in the semi-finished release film A by a micro-concave coating device, and then dry it in an oven at a temperature of 80° C. to 150° C. for 3 minutes to 4 minutes, and then cool it to obtain a semi-finished release film B with a release layer;

[0010] A-5. Take a pressure-sensitive adhesive, a catalyst C, a curing agent C, and toluene B, and compound them in a weight ratio of 1: 0.01-0.012: 0.12-0.15: 25-45 to obtain a coating mixture B, then take a carrier B with a release surface, and coat the coating mixture B on the release surface of the carrier B with a coating gap of 350 μm-400 μm. After coating, place it in an oven at a temperature of 90° C. to 150° C. and dry it for 5 minutes to 8 minutes to obtain a transfer film B;

[0011] A-6. Take the semi-finished release film B and the transfer film B, and compound the coating mixture B on one side of the transfer film B with the other side of the support layer through an intermediate compounding roller, and then cool the mixture to obtain a semi-finished release film C with a pressure-sensitive adhesive layer;

[0012] A-7. After the semi-finished release film C is aged in an oven at a temperature of 50° C. to 60° C. for not less than 72 hours, the carrier B is peeled off to obtain an industrial high temperature resistant release film.

[0013] The release film of the above structure has a longer service life. In step A-1, the coating mixture A is coated on the surface of the carrier A and dried in an oven at 50°C to 100°C for 2.5 minutes to 3.5 minutes. In this state, the coating mixture A is only semi-dry and semi-cross-linked, which is more conducive to the next process of the coating mixture A. In step A-2, the coating mixture A has no fluidity in the semi-dry state, and the formed adhesive layer is directly transferred to the surface of the support layer, thereby avoiding the glue seepage caused by the direct coating process of the coating mixture A. In step A-3, the microspheres treated with silane coupling agent are more conducive to the adhesion between the adhesive layer and the microspheres. The use of a bead implanting device is more conducive to the mass production of products and increasing the uniformity of microsphere implantation. The use of a dust suction device can remove the floating beads on the surface. It is placed in an oven at a temperature of 50°C to 60°C for maturation for not less than 48 hours, which is more conducive to the maturation of the adhesive layer and improves the adhesion between the microspheres and the adhesive layer. In step A-4, after coating with the release mixture, it is more conducive to the attachment to the microspheres. At the same time, the release mixture is coated with a micro-concave coating device. Since the surface of the microspheres is a bowl-shaped structure, after micro-concave processing, a release layer with the same bowl-shaped structure can be effectively formed on the surface of the microspheres. In addition, drying in an oven at a temperature of 80°C to 150°C for 3 minutes to 4 minutes is more conducive to the curing of the release layer. In step A-5, the surface of the carrier B is easy to coat, high temperature resistant, and non-penetrating. The transfer process is used to make the coating thickness of the coating mixture B easier to control. In addition, drying in an oven at a temperature of 90°C to 150°C for 5 minutes to 8 minutes is used, which is more conducive to the full cross-linking and curing of the coating mixture A. In step A-6, by compounding the coating mixture B on one side of the transfer film B and the other side of the support layer, it is more conducive to the bonding of the coating mixture B with the support layer. In step A-7, the semi-finished release film C is aged in an oven at a temperature of 50° C. to 60° C. for no less than 72 hours to make the semi-finished release film C more stable. In addition, the carrier B can be directly peeled off to make the use of the release film easier.

[0014] Preferably, in the above-mentioned industrial high temperature resistant release film, in steps A-1 and A-5, the carrier A and the carrier B are both PET fluorine release films.

[0015] The use of PET fluorine release film makes coating smoother during the production process.

[0016] Preferably, in the above-mentioned industrial high temperature resistant release film, the PET fluorine release film has a thickness of 25 μm to 75 μm and a release force of 5 g / inch to 20 g / inch.

[0017] The thickness of the PET fluorine release film is 25μm to 75μm, and the release force is 5g / inch to 20g / inch, which improves the high temperature resistance and tensile properties of the coating mixture A and the coating mixture B after coating and drying. At the same time, the range of the release force is more conducive to the coating mixture A and the coating mixture B being smoothly transferred to the surface of the support layer after coating to form a film.

[0018] Preferably, in the above-mentioned industrial high temperature resistant release film, the microspheres in step A-3 are glass microspheres or zirconium microspheres.

[0019] The microspheres are glass microspheres or zirconium microspheres, which have better hardness, better high temperature resistance and lower cost.

[0020] Preferably, in the above-mentioned industrial high temperature resistant release film, the particle size of the microspheres is 150 μm to 200 μm, and the particle size distribution of the microspheres is D90 ≥ 85 μm.

[0021] The particle size of the microspheres is 150μm to 200μm, and the particle size distribution is D90≥85μm, which is more conducive to the final product surface having a distinct bowl-shaped structure, while reducing the contact area, improving anti-stickiness, and being more conducive to the operation of bead implantation.

[0022] Preferably, in the above-mentioned industrial high temperature resistant release film, the adhesive in step A-1 is a silicone rubber adhesive.

[0023] The use of organic silicone rubber adhesives allows for better adhesion between the adhesive layer and the support layer and the microspheres treated with a silane coupling agent. At the same time, since organic silicone rubber adhesives have good high temperature resistance, they have better flexibility after film formation, making them easier to attach to the roller surface during use.

[0024] Preferably, in the above-mentioned industrial high temperature resistant release film, the support layer is aramid flame retardant cloth.

[0025] The support layer is made of aramid flame-retardant cloth, which makes the support layer have better high temperature resistance and flame retardancy, and also improves the tear resistance.

[0026] Preferably, in the above-mentioned industrial high temperature resistant release film, the release force of the release layer is not greater than 20 g / inch.

[0027] The release force of the release layer is no more than 20g / inch, making the transfer of the release layer more complete.

[0028] Preferably, in the above-mentioned industrial high temperature resistant release film, the pressure sensitive adhesive in step A-5 is a silicone pressure sensitive adhesive.

[0029] The pressure-sensitive adhesive is a silicone pressure-sensitive adhesive, which has better high temperature resistance and the viscosity can be adjusted according to needs.

[0030] Preferably, in the above-mentioned industrial high temperature resistant release film, in steps A-1, A-4 and A-5, the catalyst A, the catalyst B and the catalyst C are all platinum catalysts.

[0031] The use of platinum catalyst has better catalytic effect on adhesives, release agents and pressure-sensitive adhesives.

[0032] Preferably, in the above-mentioned industrial high temperature resistant release film, in the steps A-1, A-4 and A-5, the curing agent A, the curing agent B and the curing agent C are all aliphatic diisocyanates.

[0033] By using aliphatic diisocyanate to crosslink the curing agent, the flexibility of the coating and the adhesion between other layers are better.

[0034] Preferably, in the above-mentioned industrial high temperature resistant release film, in step A-4, the solvent is butanone or ethyl acetate.

[0035] When using butanone or ethyl acetate, the solvent evaporates quickly, making the film easier to dry and having better solubility in the release agent. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 It is a structural schematic diagram of the present invention. DETAILED DESCRIPTION

[0037] The following is combined with Figure 1 The present invention is further described in detail with specific embodiments, but they are not intended to limit the present invention:

[0038] Example 1

[0039] An industrial high temperature resistant release film comprises, from top to bottom, a release layer 1, a microsphere layer 2, an adhesive layer 3, a support layer 4, and a pressure sensitive adhesive layer 5. The release layer 1 has a thickness of 1 μm, the microsphere layer 2 has a thickness of 150 μm, the adhesive layer 3 has a thickness of 50 μm, the support layer 4 has a thickness of 250 μm, and the pressure sensitive adhesive layer 5 has a thickness of 80 μm. The preparation method thereof is as follows:

[0040] A-1. Take adhesive, catalyst A, curing agent A, and toluene A, mix them in a weight ratio of 1:0.012:0.1:25 to obtain a coating mixture A, then take a carrier A with a release surface, and coat the coating mixture A on the release surface of the carrier A with a coating gap of 250 μm. After coating, place it in an oven at 50° C. and dry it for 2.5 minutes to obtain a transfer film A;

[0041] A-2, taking the support layer 4 and the transfer film A, laminating the coating mixture A on one side of the transfer film A and one side of the support layer 4 through an intermediate laminating roller, peeling off the carrier A, thereby preparing an adhesive layer 3 on the support layer 4;

[0042] A-3. Take microspheres 21 and a silane coupling agent, perform surface pretreatment on the microspheres 21 with the silane coupling agent, add the microspheres 21 to a bead implanting device with a circulation device after the surface pretreatment, implant the microspheres 21 onto the adhesive layer 3, dry them in an oven at 110° C. for 3 minutes, remove the surface beads with a dust collecting device, and obtain a semi-finished release film A with a microsphere layer 2. Place the semi-finished release film A in an oven at 50° C. for maturation for not less than 48 hours;

[0043] A-4. Take a release agent, a catalyst B, a curing agent B, and a solvent, and compound them in a weight ratio of 1:0.015:0.1:0.2 to obtain a release mixture, and then apply the release mixture to the surface of the microsphere layer 2 in the semi-finished release film A by a micro-concave coating device, and then dry it in an oven at a temperature of 80° C. for 3 minutes, and then cool it to obtain a semi-finished release film B with a release layer 1;

[0044] A-5. Take a pressure-sensitive adhesive, a catalyst C, a curing agent C, and toluene B, and compound them in a weight ratio of 1:0.01:0.12:25 to obtain a coating mixture B, then take a carrier B with a release surface, and coat the coating mixture B on the release surface of the carrier B with a coating gap of 350 μm. After coating, place it in an oven at a temperature of 90° C. and dry it for 5 minutes to obtain a transfer film B;

[0045] A-6. Take the semi-finished release film B and the transfer film B, and compound the coating mixture B on one side of the transfer film B and the other side of the support layer 4 through an intermediate compounding roller, and then cool the mixture to obtain a semi-finished release film C with a pressure-sensitive adhesive layer 5;

[0046] A-7. After the semi-finished release film C is aged in an oven at 50° C. for not less than 72 hours, the carrier B is peeled off to obtain an industrial high temperature resistant release film.

[0047] Preferably, in steps A-1 and A-5, the carrier A and the carrier B are both PET fluorine release films.

[0048] Preferably, the PET fluorine release film has a thickness of 25 μm and a release force of 5 g / inch.

[0049] Preferably, the microspheres 21 in step A-3 are glass microspheres or zirconium microspheres.

[0050] Preferably, the particle size of the microsphere 21 is 150 μm, and the particle size distribution of the microsphere 21 is D90 ≥ 85 μm.

[0051] Preferably, the adhesive in step A-1 is a silicone rubber adhesive.

[0052] Preferably, the support layer 4 is aramid flame-retardant cloth.

[0053] Preferably, the release force of the release layer 1 is no greater than 20 g / inch.

[0054] Preferably, the pressure-sensitive adhesive in step A-5 is a silicone pressure-sensitive adhesive.

[0055] Preferably, in steps A-1, A-4 and A-5, the catalyst A, the catalyst B and the catalyst C are all platinum catalysts.

[0056] Preferably, in steps A-1, A-4 and A-5, the curing agent A, the curing agent B and the curing agent C are all aliphatic diisocyanates.

[0057] Preferably, in step A-4, the solvent is butanone or ethyl acetate.

[0058] Example 2

[0059] An industrial high temperature resistant release film comprises, from top to bottom, a release layer 1, a microsphere layer 2, an adhesive layer 3, a support layer 4, and a pressure sensitive adhesive layer 5, wherein the release layer 1 has a thickness of 3 μm, the microsphere layer 2 has a thickness of 200 μm, the adhesive layer 3 has a thickness of 100 μm, the support layer 4 has a thickness of 450 μm, and the pressure sensitive adhesive layer 5 has a thickness of 120 μm. The preparation method thereof is as follows:

[0060] A-1. Take adhesive, catalyst A, curing agent A, and toluene A, and mix them in a weight ratio of 1:0.018:0.3:45 to obtain a coating mixture A, and then take a carrier A with a release surface, and coat the coating mixture A on the release surface of the carrier A with a coating gap of 350 μm. After coating, place it in an oven at 100° C. and dry it for 3.5 minutes to obtain a transfer film A;

[0061] A-2, taking the support layer 4 and the transfer film A, laminating the coating mixture A on one side of the transfer film A and one side of the support layer 4 through an intermediate laminating roller, peeling off the carrier A, thereby preparing an adhesive layer 3 on the support layer 4;

[0062] A-3. Take microspheres 21 and a silane coupling agent, perform surface pretreatment on the microspheres 21 with the silane coupling agent, add the microspheres 21 to a bead implanting device with a circulation device after the surface pretreatment, and then implant the microspheres 21 onto the adhesive layer 3, and then dry them in an oven at 150° C. for 4 minutes, and then remove the surface beads with a dust removal device to obtain a semi-finished release film A with a microsphere layer 2, and place the semi-finished release film A in an oven at 60° C. for maturation for not less than 48 hours;

[0063] A-4. Take a release agent, a catalyst B, a curing agent B, and a solvent, and compound them in a weight ratio of 1:0.02:0.2:0.4 to obtain a release mixture, and then apply the release mixture to the surface of the microsphere layer 2 in the semi-finished release film A by a micro-concave coating device, and then dry it in an oven at a temperature of 150° C. for 4 minutes, and then cool it to obtain a semi-finished release film B with a release layer 1;

[0064] A-5. Take a pressure-sensitive adhesive, a catalyst C, a curing agent C, and toluene B, and compound them in a weight ratio of 1:0.012:0.15:45 to obtain a coating mixture B, then take a carrier B with a release surface, and coat the coating mixture B on the release surface of the carrier B with a coating gap of 400 μm. After coating, place it in an oven at a temperature of 150° C. and dry it for 8 minutes to obtain a transfer film B;

[0065] A-6. Take the semi-finished release film B and the transfer film B, and compound the coating mixture B on one side of the transfer film B and the other side of the support layer 4 through an intermediate compounding roller, and then cool the mixture to obtain a semi-finished release film C with a pressure-sensitive adhesive layer 5;

[0066] A-7. After the semi-finished release film C is aged in an oven at 60° C. for not less than 72 hours, the carrier B is peeled off to obtain an industrial high temperature resistant release film.

[0067] Preferably, in steps A-1 and A-5, the carrier A and the carrier B are both PET fluorine release films.

[0068] Preferably, the PET fluorine release film has a thickness of 75 μm and a release force of 20 g / inch.

[0069] Preferably, the microspheres 21 in step A-3 are glass microspheres or zirconium microspheres.

[0070] Preferably, the particle size of the microsphere 21 is 200 μm, and the particle size distribution of the microsphere 21 is D90 ≥ 85 μm.

[0071] Preferably, the adhesive in step A-1 is a silicone rubber adhesive.

[0072] Preferably, the support layer 4 is aramid flame-retardant cloth.

[0073] Preferably, the release force of the release layer 1 is no greater than 20 g / inch.

[0074] Preferably, the pressure-sensitive adhesive in step A-5 is a silicone pressure-sensitive adhesive.

[0075] Preferably, in steps A-1, A-4 and A-5, the catalyst A, the catalyst B and the catalyst C are all platinum catalysts.

[0076] Preferably, in steps A-1, A-4 and A-5, the curing agent A, the curing agent B and the curing agent C are all aliphatic diisocyanates.

[0077] Preferably, in step A-4, the solvent is butanone or ethyl acetate.

[0078] Example 3

[0079] An industrial high temperature resistant release film comprises, from top to bottom, a release layer 1, a microsphere layer 2, an adhesive layer 3, a support layer 4, and a pressure sensitive adhesive layer 5, wherein the release layer 1 has a thickness of 2 μm, the microsphere layer 2 has a thickness of 175 μm, the adhesive layer 3 has a thickness of 75 μm, the support layer 4 has a thickness of 350 μm, and the pressure sensitive adhesive layer 5 has a thickness of 100 μm. The preparation method thereof is as follows:

[0080] A-1. Take adhesive, catalyst A, curing agent A, and toluene A, and mix them in a weight ratio of 1:0.15:0.2:35 to obtain a coating mixture A. Then take a carrier A with a release surface, and coat the coating mixture A on the release surface of the carrier A with a coating gap of 300 μm. After coating, place the coating in an oven at 75° C. for 3 minutes to obtain a transfer film A.

[0081] A-2, taking the support layer 4 and the transfer film A, laminating the coating mixture A on one side of the transfer film A and one side of the support layer 4 through an intermediate laminating roller, peeling off the carrier A, thereby preparing an adhesive layer 3 on the support layer 4;

[0082] A-3. Take microspheres 21 and a silane coupling agent, perform surface pretreatment on the microspheres 21 with the silane coupling agent, add the microspheres 21 to a bead implanting device with a circulation device after the surface pretreatment, and then implant the microspheres 21 onto the adhesive layer 3, and then dry them in an oven at 130° C. for 3.5 minutes, and then remove the surface beads with a dust removal device to obtain a semi-finished release film A with a microsphere layer 2, and place the semi-finished release film A in an oven at 55° C. for maturation for not less than 48 hours;

[0083] A-4. Take a release agent, a catalyst B, a curing agent B, and a solvent, and compound them in a weight ratio of 1:0.0175:0.15:0.3 to obtain a release mixture, and then apply the release mixture to the surface of the microsphere layer 2 in the semi-finished release film A by a micro-concave coating device, and then dry it in an oven at a temperature of 115° C. for 3.5 minutes, and then cool it to obtain a semi-finished release film B with a release layer 1;

[0084] A-5. Take a pressure-sensitive adhesive, a catalyst C, a curing agent C, and toluene B, and compound them in a weight ratio of 1:0.011:0.135:35 to obtain a coating mixture B, then take a carrier B with a release surface, and coat the coating mixture B on the release surface of the carrier B with a coating gap of 375 μm. After coating, place it in an oven at a temperature of 120° C. and dry it for 6.5 minutes to obtain a transfer film B;

[0085] A-6. Take the semi-finished release film B and the transfer film B, and compound the coating mixture B on one side of the transfer film B and the other side of the support layer 4 through an intermediate compounding roller, and then cool the mixture to obtain a semi-finished release film C with a pressure-sensitive adhesive layer 5;

[0086] A-7. After the semi-finished release film C is aged in an oven at 55° C. for not less than 72 hours, the carrier B is peeled off to obtain an industrial high temperature resistant release film.

[0087] Preferably, in steps A-1 and A-5, the carrier A and the carrier B are both PET fluorine release films.

[0088] Preferably, the PET fluorine release film has a thickness of 50 μm and a release force of 12.5 g / inch.

[0089] Preferably, the microspheres 21 in step A-3 are glass microspheres or zirconium microspheres.

[0090] Preferably, the particle size of the microsphere 21 is 175 μm, and the particle size distribution of the microsphere 21 is D90 ≥ 85 μm.

[0091] Preferably, the adhesive in step A-1 is a silicone rubber adhesive.

[0092] Preferably, the support layer 4 is aramid flame-retardant cloth.

[0093] Preferably, the release force of the release layer 1 is no greater than 20 g / inch.

[0094] Preferably, the pressure-sensitive adhesive in step A-5 is a silicone pressure-sensitive adhesive.

[0095] Preferably, in steps A-1, A-4 and A-5, the catalyst A, the catalyst B and the catalyst C are all platinum catalysts.

[0096] Preferably, in steps A-1, A-4 and A-5, the curing agent A, the curing agent B and the curing agent C are all aliphatic diisocyanates.

[0097] Preferably, in step A-4, the solvent is butanone or ethyl acetate.

[0098] Example 4

[0099] The industrial tape made of the industrial high temperature resistant release film obtained in the above embodiments and the existing tesa 4863 industrial tape were taken as a comparative example to test the steel plate adhesion, surface release force and high temperature resistance. The test method is as follows:

[0100] 1. Steel plate adhesion test: tesa 4863 industrial tape and the industrial tapes made in each embodiment were cut into samples with a width of 2.54 cm, respectively, and then attached to the surface of a standard steel plate. After curing for 24 hours, the 180-degree peel strength of the samples was tested.

[0101] 2. Surface release force test: The surface release force of tesa 4863 industrial tape and the industrial tapes prepared in various embodiments were tested in accordance with the provisions of HG / T 4139-2010.

[0102] 3. High temperature resistance test: The tesa 4863 industrial tape and the industrial tapes made in each embodiment were cut into a size of 10cmx10cm, and placed in three environments of 150℃, 180℃, and 250℃ for 4 hours and then the surface conditions were observed. The tesa 4863 industrial tape did not change color in an environment of 150℃, slightly yellowed in an environment of 180℃, and obviously yellowed in an environment of 250℃. The industrial tapes made in each embodiment did not change color in the three environments of 150℃, 180℃, and 250℃.

[0103] The performance parameters of the industrial tape made of the industrial high temperature resistant release film obtained in each embodiment of the present invention and the comparative example are shown in Table 1:

[0104] Table 1

[0105]

[0106]

[0107] In conclusion, the above is only a preferred embodiment of the present invention, and all equivalent changes and modifications made within the scope of the patent application of the present invention should fall within the scope of the present invention.

Claims

1. An industrial high temperature resistant release film, characterized in that: The invention comprises, from top to bottom, a release layer (1), a microsphere layer (2), an adhesive layer (3), a support layer (4), and a pressure-sensitive adhesive layer (5), wherein the release layer (1) has a thickness of 1 μm to 3 μm, the microsphere layer (2) has a thickness of 150 μm to 200 μm, the adhesive layer (3) has a thickness of 50 μm to 100 μm, the support layer (4) has a thickness of 250 μm to 450 μm, and the pressure-sensitive adhesive layer (5) has a thickness of 80 μm to 120 μm. The preparation method thereof is as follows: A-1. Take adhesive, catalyst A, curing agent A, and toluene A, and mix them in a weight ratio of 1: 0.012-0.018: 0.1-0.3: 25-45 to obtain a coating mixture A, and then take a carrier A with a release surface, and coat the coating mixture A on the release surface of the carrier A with a coating gap of 250 μm-350 μm. After coating, place it in an oven at 50° C. to 100° C. and dry it for 2.5 minutes to 3.5 minutes to obtain a transfer film A; A-2, taking a support layer (4) and a transfer film A, laminating the coating mixture A on one side of the transfer film A and one side of the support layer (4) through an intermediate laminating roller, peeling off the carrier A, thereby obtaining an adhesive layer (3) on the support layer (4); A-3. Take microspheres (21) and a silane coupling agent, perform surface pretreatment on the microspheres (21) with the silane coupling agent, add the microspheres (21) to a bead implanting device with a circulation device after the surface pretreatment, implant the microspheres (21) onto the adhesive layer (3), dry them in an oven at a temperature of 110° C. to 150° C. for 3 to 4 minutes, remove the floating beads on the surface with a dust collecting device, and obtain a semi-finished release film A with a microsphere layer (2), and place the semi-finished release film A in an oven at a temperature of 50° C. to 60° C. for maturation for not less than 48 hours; A-4, taking a release agent, a catalyst B, a curing agent B, and a solvent, and compounding them in a weight ratio of 1:0.015-0.02:0.1-0.2:0.2-0.4 to obtain a release mixture, and then coating the release mixture on the surface of the microsphere layer (2) in the semi-finished release film A by a micro-concave coating device, and then drying it in an oven at a temperature of 80° C. to 150° C. for 3 minutes to 4 minutes, and then cooling it to obtain a semi-finished release film B with a release layer (1); A-5. Take a pressure-sensitive adhesive, a catalyst C, a curing agent C, and toluene B, and compound them in a weight ratio of 1: 0.01-0.012: 0.12-0.15: 25-45 to obtain a coating mixture B, then take a carrier B with a release surface, and coat the coating mixture B on the release surface of the carrier B with a coating gap of 350 μm-400 μm. After coating, place it in an oven at a temperature of 90° C. to 150° C. and dry it for 5 minutes to 8 minutes to obtain a transfer film B; A-6, taking the semi-finished release film B and the transfer film B, laminating the coating mixture B on one side of the transfer film B and the other side of the support layer (4) through an intermediate laminating roller, and then cooling to obtain a semi-finished release film C with a pressure-sensitive adhesive layer (5); A-7. Take the semi-finished release film C and age it in an oven at a temperature of 50° C. to 60° C. for not less than 72 hours, then peel off the carrier B to obtain an industrial high temperature resistant release film; In steps A-1 and A-5, the carrier A and the carrier B are both PET fluorine release films, the thickness of the PET fluorine release film is 25μm to 75μm, and the release force is 5g / inch to 20g / inch; the microspheres (21) in step A-3 are glass microspheres or zirconium microspheres, the particle size of the microspheres (21) is 150μm to 200μm, and the particle size distribution of the microspheres (21) is D90≥85μm; the adhesive in step A-1 is an organic silicone rubber adhesive; the support layer (4) is aramid flame retardant cloth; the pressure-sensitive adhesive in step A-5 is an organic silicone pressure-sensitive adhesive; in steps A-1, A-4, and A-5, the curing agent A, the curing agent B, and the curing agent C are all aliphatic diisocyanates.

2. The industrial high temperature resistant release film according to claim 1, characterized in that: The release force of the release layer (1) is no greater than 20 g / inch.

3. The industrial high temperature resistant release film according to claim 1, characterized in that: In the steps A-1, A-4 and A-5, the catalyst A, the catalyst B and the catalyst C are all platinum catalysts.

4. The industrial high temperature resistant release film according to claim 1, characterized in that: In the step A-4, the solvent is butanone or ethyl acetate.

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