Resin composition

Abstract

An object of the present invention is to provide a resin composition capable of suppressing unevenness generated on a cured substrate and obtaining a cured product having excellent dielectric properties and peel strength; a resin sheet containing the resin composition; a printed wiring board having an insulating layer formed using the resin composition, and a semiconductor device. A solution of the present invention is a resin composition containing (A) a compound containing an aromatic ester skeleton and an unsaturated bond and (B) a radically polymerizable compound, wherein when the non-volatile components in the resin composition are set to 100% by mass, the content of the component (A) is 0.1% by mass or more and 30% by mass or less.

Description

Technical Field

[0001] The present invention relates to a resin composition. Further, it relates to a resin sheet, a printed wiring board, and a semiconductor device obtained using the resin composition. Background Art

[0002] As a manufacturing technique for printed wiring boards, a manufacturing method based on a buildup method of alternately overlapping an insulating layer and a conductor layer is known.

[0003] As an insulating material for printed wiring boards that can be used in such insulating layers, for example, a resin composition is disclosed in Patent Document 1.

[0004] Prior Art Documents

[0005] Patent Documents

[0006] Patent Document 1: Japanese Unexamined Patent Application Publication No. 2019-6869. Summary of the Invention

[0007] Problems to be Solved by the Invention

[0008] In recent years, further improvement in dielectric properties such as the dielectric constant and the dissipation factor tangent of the insulating layer, and further improvement in the peel strength between the insulating layer and the conductor layer formed by plating have been required. In addition, when a resin sheet is laminated on a substrate having unevenness to form an insulating layer, the surface of the insulating layer on the side opposite to the substrate follows the unevenness of the substrate, and the flatness of the insulating layer decreases, sometimes causing unevenness (mura) on the cured substrate (unevenness on the surface of the insulating layer). When there is unevenness on the cured substrate, the composition of the insulating layer becomes uneven, which sometimes leads to poor wiring formability.

[0009] An object of the present invention is to provide a resin composition that can suppress unevenness generated on a cured substrate and can obtain a cured product having excellent dielectric properties and peel strength; a resin sheet containing the resin composition; a printed wiring board having an insulating layer formed using the resin composition, and a semiconductor device.

[0010] Means for Solving the Technical Problem

[0011] The present inventors diligently studied the above problems and found that: by containing a specified amount of (A) a compound containing an aromatic ester skeleton and an unsaturated bond, and (B) a radically polymerizable compound, the above problems can be solved, and thus the present invention was completed.

[0012] That is, the present invention includes the following,

[0013] [1] A resin composition containing the following component (A) and component (B),

[0014] (A) A compound containing an aromatic ester skeleton and an unsaturated bond,

[0015] (B) A radically polymerizable compound,

[0016] wherein, when the non-volatile components in the resin composition are set to 100% by mass, the content of component (A) is 0.1% by mass or more and 30% by mass or less;

[0017] [2] The resin composition according to [1], wherein component (A) is any one of the compounds represented by the following general formula (A-1) and the compound represented by the following general formula (A-2),

[0018] [Chemical formula 1]

[0019]

[0020] (In general formula (A-1), Ar 11 each independently represents a monovalent aromatic hydrocarbon group optionally having a substituent, Ar 12 each independently represents a divalent aromatic hydrocarbon group optionally having a substituent, Ar 13 each independently represents a divalent aromatic hydrocarbon group optionally having a substituent, a divalent aliphatic hydrocarbon group optionally having a substituent, an oxygen atom, a sulfur atom, or a divalent group composed of a combination thereof, and n represents an integer from 0 to 10.)

[0021] [Chemical formula 2]

[0022]

[0023] (In general formula (A-2), Ar 21 represents an m-valent aromatic hydrocarbon group optionally having a substituent, Ar 22 each independently represents a monovalent aromatic hydrocarbon group optionally having a substituent, and m represents an integer of 2 or 3.)

[0024] [3] The resin composition according to [1] or [2], which further contains (C) an inorganic filler;

[0025] [4] The resin composition according to [3], wherein, when the non-volatile components in the resin composition are set to 100% by mass, the content of component (C) is 50% by mass or more;

[0026] [5] The resin composition according to any one of [1] to [4], which further contains (D) a thermoplastic resin;

[0027] [6] The resin composition according to any one of [1] to [5], which further contains (E) a thermosetting resin;

[0028] [7] The resin composition according to any one of [1] to [6], wherein the component (B) contains any one compound of: a maleimide-based free-radical polymerizable compound containing a maleimide group, and a vinylphenyl-based free-radical polymerizable compound containing a vinylphenyl group;

[0029] [8] The resin composition according to any one of [1] to [7], which is used for forming an insulating layer;

[0030] [9] The resin composition according to any one of [1] to [8], which is used for forming an insulating layer, and the insulating layer is an insulating layer for forming a conductor layer;

[0031]

[10] A resin sheet, which comprises:

[0032] a support, and

[0033] a resin composition layer provided on the support and containing the resin composition according to any one of [1] to [9];

[0034]

[11] A printed wiring board, which comprises an insulating layer formed of a cured product of the resin composition according to any one of [1] to [9];

[0035]

[12] A semiconductor device, which comprises the printed wiring board described in

[11] .

[0036] Effects of the Invention

[0037] According to the present invention, there can be provided a resin composition capable of suppressing unevenness generated on a cured substrate and obtaining a cured product having excellent dielectric properties, peel strength, and elongation at break; a resin sheet containing the resin composition; a printed wiring board having an insulating layer formed using the resin composition, and a semiconductor device. Description of the Drawings

[0038] Figure 1 is a schematic side view showing an example of two test tubes used in the determination of the liquid state, semi-solid state, and solid state of a thermosetting resin. Detailed Description of the Invention

[0039] Hereinafter, the present invention will be described in detail by preferred embodiments of the present invention. However, the present invention is not limited to the following embodiments and examples, and can be arbitrarily modified and implemented within the scope not exceeding the claims of the present invention and their equivalent ranges.

[0040] [Resin Composition]

[0041] The resin composition of the present invention is a resin composition containing (A) a compound having an aromatic ester skeleton and an unsaturated bond, and (B) a radically polymerizable compound. When the non-volatile components in the resin composition are set to 100% by mass, the content of component (A) is 0.1% by mass or more and 30% by mass or less. In the present invention, by containing a specified amount of component (A) and further containing component (B), unevenness generated on the cured substrate can be suppressed, and a cured product having excellent dielectric properties and peel strength can be obtained. In addition, a cured product having excellent elongation at break can usually be obtained.

[0042] In the resin composition, any component may be further contained in combination with components (A) to (B). Examples of the optional component include (C) an inorganic filler, (D) a thermoplastic resin, (E) a thermosetting resin, (F) a curing accelerator, and (G) other additives. Hereinafter, each component contained in the resin composition will be described in detail.

[0043] <(A) Compound having an aromatic ester skeleton and an unsaturated bond>

[0044] In the resin composition, as component (A), a compound having an aromatic ester skeleton and an unsaturated bond is contained. By containing component (A) in the resin composition, unevenness generated on the cured substrate can be suppressed, and a cured product having excellent dielectric properties can be obtained. Component (A) may be used alone or in combination of two or more.

[0045] Regarding the content of component (A), from the viewpoint of suppressing unevenness generated on the cured substrate and obtaining a cured product having excellent dielectric properties, when the non-volatile components in the resin composition are set to 100% by mass, the content of component (A) is 0.1% by mass or more, preferably 1% by mass or more, more preferably 3% by mass or more, the content of component (A) is 30% by mass or less, preferably 28% by mass or less, and still more preferably 25% by mass or less.

[0046] (A) Component has an aromatic ester skeleton. The aromatic ester skeleton means a skeleton having an ester bond and an aromatic ring bonded to one or both ends of the ester bond. Among them, it is preferable to have aromatic rings at both ends of the ester bond. Examples of the group having such a skeleton include arylcarbonyloxy, aryloxycarbonyl, arylidenecarbonyloxy, arylidenyloxycarbonyl, arylcarbonyl-oxyarylene, aryloxycarbonylarylene, arylidenecarbonyloxyarylene, and arylidenyloxycarbonylarylene. In addition, the number of carbon atoms of the group having such a skeleton is preferably 7 to 20, more preferably 7 to 15, and still more preferably 7 to 11. The aryl group such as an aryl group and an arylene group may have a substituent.

[0047] As the aryl group, preferably an aryl group having 6 to 30 carbon atoms, more preferably an aryl group having 6 to 20 carbon atoms, and even more preferably an aryl group having 6 to 10 carbon atoms. Examples of such aryl groups include groups obtained by removing one hydrogen atom from monocyclic aromatic compounds such as phenyl, furyl, pyrrolyl, thienyl, imidazolyl, pyrazolyl, oxazolyl, isoxazolyl, thiazolyl, isothiazolyl, pyridyl, pyrimidinyl, pyridazinyl, pyrazinyl, triazinyl, etc.; groups obtained by removing one hydrogen atom from polycyclic aromatic compounds such as naphthyl, anthryl, phenalenyl, phenanthryl, quinolinyl, isoquinolinyl, quinazolinyl, phthalazinyl, pteridinyl, coumarinyl, indolyl, benzimidazolyl, benzofuryl, acridinyl, etc.

[0048] As the arylene group, preferably an arylene group having 6 to 30 carbon atoms, more preferably an arylene group having 6 to 20 carbon atoms, and even more preferably an arylene group having 6 to 10 carbon atoms. Examples of such arylene groups include, for example, phenylene, naphthylene, anthrylene, biphenylene (-C 6 H 4 -C 6 H 4 -), etc.

[0049] (A) component contains an unsaturated bond. The unsaturated bond is preferably a carbon-carbon unsaturated bond. As the unsaturated bond, preferably in the form of a substituent having at least one unsaturated bond. Examples of the unsaturated bond include unsaturated hydrocarbon groups such as alkenyl groups having 2 to 30 carbon atoms and alkynyl groups having 2 to 30 carbon atoms. For the unsaturated bond, preferably in the form of a substituent of an aryl group at the terminal, and more preferably in the form of substituents of aryl groups at both terminals.

[0050] Examples of the alkenyl group having 2 to 30 carbon atoms include vinyl, allyl, propenyl, isopropenyl, 1-propenyl, 1-butenyl, 2-butenyl, 3-butenyl, 1-hexenyl, 2-hexenyl, 3-hexenyl, 4-hexenyl, 5-hexenyl, 1-octenyl, 2-octenyl, 1-undecenyl, 1-pentadecenyl, 3-pentadecenyl, 7-pentadecenyl, 1-octadecenyl, 2-octadecenyl, cyclopentenyl, cyclohexenyl, cyclooctenyl, 1,3-butadienyl, 1,4-butadienyl, 1,3-hexadienyl, 2,5-hexadienyl, 4,7-pentadecadienyl, 1,3,5-hexatriene, 1,4,7-pentadecatriene, etc.

[0051] Examples of the alkynyl group having 2 to 30 carbon atoms include ethynyl, propynyl, 1-butynyl, 2-butynyl, 3-butynyl, 3-pentynyl, 4-pentynyl, 1,3-butadiynyl, etc.

[0052] Among these groups, as the unsaturated bond, an alkenyl group having 2 to 30 carbon atoms is preferable, an alkenyl group having 2 to 10 carbon atoms is more preferable, an alkenyl group having 2 to 5 carbon atoms is further preferable, and allyl group, isopropenyl group, 1-propenyl group are further more preferable, and allyl group is particularly preferable.

[0053] Component (A) may have any one of an aryl group, an aliphatic hydrocarbon group, an oxygen atom, a sulfur atom, and a group formed by combining them in addition to the aromatic ester skeleton. The term "aryl group" means a hydrocarbon group containing an aromatic ring, and the aromatic ring may be any of a monocyclic ring, a polycyclic ring, and a heterocyclic ring.

[0054] As the aryl group, a divalent aryl group is preferable, an arylene group or an arylalkyl group is more preferable, and an arylene group is further preferable. As the arylene group, an arylene group having 6 to 30 carbon atoms is preferable, an arylene group having 6 to 20 carbon atoms is more preferable, and an arylene group having 6 to 10 carbon atoms is further preferable. Examples of such an arylene group include a phenylene group, a naphthylene group, an anthrylene group, a biphenylene group, etc. As the arylalkyl group, an arylalkyl group having 7 to 30 carbon atoms is preferable, an arylalkyl group having 7 to 20 carbon atoms is more preferable, and an arylalkyl group having 7 to 15 carbon atoms is further preferable. Among them, a phenylene group is preferable.

[0055] As the aliphatic hydrocarbon group, a divalent aliphatic hydrocarbon group is preferable, a divalent saturated aliphatic hydrocarbon group is more preferable, and an alkylene group or a cycloalkylene group is further preferable. As the alkylene group, an alkylene group having 1 to 10 carbon atoms is preferable, an alkylene group having 1 to 6 carbon atoms is more preferable, and an alkylene group having 1 to 3 carbon atoms is further preferable. Examples of the alkylene group include a methylene group, an ethylene group, a propylene group, 1-methylmethylene group, 1,1-dimethylmethylene group, 1-methylethylene group, 1,1-dimethylethylene group, 1,2-dimethylethylene group, a butylene group, 1-methylpropylene group, 2-methylpropylene group, a pentylene group, a hexylene group, etc.

[0056] As the cycloalkylene group, a cycloalkylene group having 3 to 20 carbon atoms is preferable, a cycloalkylene group having 3 to 15 carbon atoms is more preferable, and a cycloalkylene group having 5 to 10 carbon atoms is further preferable. Examples of the cycloalkylene group include a cyclopropylene group, a cyclobutylene group, a cyclopentylene group, a cyclohexylene group, a cyclopentylene group, a cycloheptylene group, a cycloalkylene group represented by the following formulas (a) to (d), etc. In the formulas (a) to (d), "*" represents a connecting bond.

[0057] [Chemical formula 3]

[0058]

[0059] The aromatic ester skeleton, aryl group, aliphatic hydrocarbon group, and unsaturated hydrocarbon group may each optionally have a substituent. Examples of the substituent include an unsaturated hydrocarbon group, an alkyl group having 1 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, a halogen atom, etc. The substituent may be contained alone or in combination of two or more.

[0060] Examples of the alkyl group having 1 to 10 carbon atoms include methyl, ethyl, propyl, isopropyl, n-butyl, isobutyl, sec-butyl, tert-butyl, n-pentyl, isopentyl, tert-pentyl, neopentyl, 1,2-dimethylpropyl, n-hexyl, isohexyl, n-nonyl, cyclopropyl, cyclobutyl, cyclopentyl, cyclohexyl, cycloheptyl, cyclooctyl, cyclononyl.

[0061] The alkoxy group having 1 to 10 carbon atoms is not particularly limited, and examples thereof include methoxy, ethoxy, propoxy, isopropoxy, butoxy, pentyloxy, hexyloxy, 2-ethylhexyloxy, octyloxy, nonyloxy, etc.

[0062] Examples of the halogen atom include fluorine atom, chlorine atom, bromine atom, iodine atom, etc. The above-mentioned substituent may further have a substituent (hereinafter sometimes referred to as "secondary substituent"). The unsaturated hydrocarbon group is as described above. As the secondary substituent, unless otherwise specified, the same groups as the above-mentioned substituents can be used.

[0063] Component (A) is preferably any one of the compounds represented by the following general formula (A-1) and the compounds represented by the following general formula (A-2);

[0064] [Chemical formula 4]

[0065]

[0066] (In the general formula (A-1), Ar 11 each independently represents a monovalent aryl group optionally having a substituent, Ar 12 each independently represents a divalent aryl group optionally having a substituent, Ar 13 each independently represents a divalent aryl group optionally having a substituent, a divalent aliphatic hydrocarbon group optionally having a substituent, an oxygen atom, a sulfur atom, or a divalent group composed of a combination thereof. n represents an integer of 0 to 10.)

[0067] [Chemical formula 5]

[0068]

[0069] (In the general formula (A-2), Ar 21 represents an m-valent aryl group optionally having a substituent, Ar 22 each independently represents a monovalent aryl group optionally having a substituent. m represents an integer of 2 or 3.).

[0070] In the general formula (A-1), Ar 11 each independently represents a monovalent aryl group which may optionally have a substituent. Examples of the monovalent aryl group include groups obtained by removing one hydrogen atom from a monocyclic aromatic compound such as phenyl, furyl, pyrrolyl, thienyl, imidazolyl, pyrazolyl, oxazolyl, isoxazolyl, thiazolyl, isothiazolyl, pyridyl, pyrimidinyl, pyridazinyl, pyrazinyl, triazinyl, etc.; groups obtained by removing one hydrogen atom from a polycyclic aromatic compound such as naphthyl, anthryl, phenalenyl, phenanthryl, quinolinyl, isoquinolinyl, quinazolinyl, phthalazinyl, pteridinyl, coumarinyl, indolyl, benzimidazolyl, benzofuryl, acridinyl, etc. Among them, from the viewpoint of significantly obtaining the effects of the present invention, phenyl is preferably used. Ar 11 The monovalent aryl group represented may optionally have a substituent. The substituents are the same as those which the aromatic ester skeleton may optionally have. Among them, Ar 11 preferably has a substituent containing an unsaturated bond.

[0071] In the general formula (A-1), Ar 12 each independently represents a divalent aryl group which may optionally have a substituent. Examples of the divalent aryl group include arylene, arylalkylene, etc., and arylene is preferably used. As the arylene, an arylene having 6 to 30 carbon atoms is preferably used, an arylene having 6 to 20 carbon atoms is more preferably used, and an arylene having 6 to 10 carbon atoms is further preferably used. Examples of such arylene include phenylene, naphthylene, anthrylene, biphenylene, etc. As the arylalkylene, an arylalkylene having 7 to 30 carbon atoms is preferably used, an arylalkylene having 7 to 20 carbon atoms is more preferably used, and an arylalkylene having 7 to 15 carbon atoms is further preferably used. Among them, phenylene is preferably used.

[0072] Ar 12 The divalent aryl group represented may optionally have a substituent. The substituents are the same as those which the aromatic ester skeleton may optionally have.

[0073] In the general formula (A-1), Ar 13 each independently represents a divalent aryl group which may optionally have a substituent, a divalent aliphatic hydrocarbon group which may optionally have a substituent, an oxygen atom, a sulfur atom, or a divalent group composed of a combination thereof, and a divalent group composed of a combination thereof is preferably used. As the divalent aryl group, it is the same as the divalent aryl group represented by Ar 12

[0074] As the divalent aliphatic hydrocarbon group, a divalent saturated aliphatic hydrocarbon group is more preferably used, and alkylene and cycloalkylene are preferably used, and cycloalkylene is more preferably used.

[0075] ​As the alkylene group, an alkylene group having 1 to 10 carbon atoms is preferable, an alkylene group having 1 to 6 carbon atoms is more preferable, and an alkylene group having 1 to 3 carbon atoms is further preferable. Examples of the alkylene group include methylene, ethylene, propylene, 1-methylmethylene, 1,1-dimethylmethylene, 1-methylethylene, 1,1-dimethylethylene, 1,2-dimethylethylene, butylene, 1-methylpropylene, 2-methylpropylene, pentylene, hexylene, and the like.

[0076] As the cycloalkylene group, a cycloalkylene group having 3 to 20 carbon atoms is preferable, a cycloalkylene group having 3 to 15 carbon atoms is more preferable, and a cycloalkylene group having 5 to 10 carbon atoms is further preferable. Examples of the cycloalkylene group include cyclopropylene, cyclobutylene, cyclopentylene, cyclohexylene, cyclopentylene, cycloheptylene, and the cycloalkylene groups represented by the above formulas (a) to (d), and preferably the cycloalkylene group represented by formula (c).

[0077] As the divalent group formed by combining them, a divalent group formed by combining an optionally substituted divalent aryl group and an optionally substituted divalent aliphatic hydrocarbon group is preferable, and a divalent group formed by alternately combining a plurality of optionally substituted divalent aryl groups and a plurality of optionally substituted divalent aliphatic hydrocarbon groups is more preferable. Specific examples of the above divalent group include the following divalent groups (A1) to (A8). In the formulas, a1 to a8 represent integers from 0 to 10, preferably integers from 0 to 5. "*" represents a linking bond, and the wavy line represents a structure obtained by reacting an aromatic compound, an acyl halide of an aromatic compound, or an esterified product of an aromatic compound used in the synthesis of component (A);

[0078] [Chemical formula 6]

[0079]

[0080] [Chemical formula 7]

[0081]

[0082] Ar 13 The represented divalent aryl group and divalent aliphatic hydrocarbon group may optionally have a substituent. The substituent is the same as the substituent that the aromatic ester skeleton may optionally have.

[0083] In the general formula (A-1), n represents an integer from 0 to 10, preferably an integer from 0 to 5, and more preferably an integer from 0 to 3. It should be noted that when the compound represented by the general formula (A-1) is an oligomer or a polymer, n represents its average value.

[0084] In the general formula (A-2), Ar 21represents an m-valent aryl group which may optionally have substituents. As the m-valent aryl group, an m-valent aryl group having 6 to 30 carbon atoms is preferred, an m-valent aryl group having 6 to 20 carbon atoms is more preferred, and an m-valent aryl group having 6 to 10 carbon atoms is even more preferred. Ar 21 The m-valent aryl group represented may optionally have substituents. As the substituents, they are the same as the substituents which the aromatic ester skeleton may optionally have.

[0085] In the general formula (A-2), Ar 22 each independently represents a monovalent aryl group which may optionally have substituents. Ar 22 is the same as the aryl group represented by Ar 11 in the general formula (A-1). Ar 22 The monovalent aryl group represented may optionally have substituents. As the substituents, they are the same as the substituents which the aromatic ester skeleton may optionally have.

[0086] In the general formula (A-2), m represents an integer of 2 or 3, preferably 2.

[0087] As specific examples of the component (A), the following compounds can be cited. In addition, as specific examples of the component (A), the compounds described in paragraphs 0068 to 0071 of International Publication No. 2018 / 235424 and paragraphs 0113 to 0115 of International Publication No. 2018 / 235425 can be cited. However, the component (A) is not limited to these specific examples. In the formula, s represents an integer of 0 or more, and r represents an integer of 1 to 10;

[0088] [Chemical formula 8]

[0089]

[0090] As the component (A), a compound synthesized by a known method can be used. The synthesis of the component (A) can be carried out, for example, by the methods described in International Publication No. 2018 / 235424 or International Publication No. 2018 / 235425.

[0091] From the viewpoint of significantly obtaining the effects of the present invention, the weight average molecular weight of the component (A) is preferably 150 or more, more preferably 200 or more, even more preferably 250 or more, preferably 3000 or less, more preferably 2000 or less, and even more preferably 1500 or less. The weight average molecular weight of the component (A) is the weight average molecular weight in terms of polystyrene measured by gel permeation chromatography (GPC) method.

[0092] From the viewpoint of significantly obtaining the effects of the present invention, the unsaturated bond equivalent of the component (A) is preferably 50 g / eq or more, more preferably 100 g / eq or more, still more preferably 150 g / eq or more, preferably 2000 g / eq or less, more preferably 1000 g / eq or less, and still more preferably 500 g / eq or less. The unsaturated bond equivalent is the mass of the component (A) containing 1 equivalent of unsaturated bonds.

[0093] <(B) Free-radical polymerizable compound>

[0094] The resin composition contains a (B) free-radical polymerizable compound as the component (B). Among them, in the component (B), substances belonging to the component (A) are excluded. By containing the component (B) in the resin composition, unevenness generated on the cured substrate can be suppressed, and a cured product having excellent dielectric properties and peel strength can be obtained. The component (B) can be used alone or in combination of two or more.

[0095] As the component (B), a compound that generates free radicals by heat or light and has a function of curing the component (A), that is, a compound having at least any one group in the free-radical polymerizable unsaturated group, can be used. As such a compound, it is preferably at least one selected from maleimide-based free-radical polymerizable compounds containing a maleimide group, vinylphenyl-based free-radical polymerizable compounds containing a vinylphenyl group, (meth)acrylic acid-based free-radical polymerizable compounds, allyl-based free-radical polymerizable compounds, butadiene-based free-radical polymerizable compounds, and benzocyclobutene-based free-radical polymerizable compounds, more preferably at least any one of maleimide-based free-radical polymerizable compounds, vinylphenyl-based free-radical polymerizable compounds, (meth)acrylic acid-based free-radical polymerizable compounds, and benzocyclobutene-based free-radical polymerizable compounds, and still more preferably any one of maleimide-based free-radical polymerizable compounds, vinylphenyl-based free-radical polymerizable compounds, and benzocyclobutene-based free-radical polymerizable compounds.

[0096] (B) The component may have a free-radical polymerizable unsaturated group. As the free-radical polymerizable unsaturated group, for example, a group having an ethylenic double bond that exhibits curability by irradiation with active energy rays can be mentioned. As such a group, for example, vinyl, allyl, vinylphenyl, acryloyl, and methacryloyl, maleimide group, fumaroyl group, maleoyl group can be mentioned, and it is preferably at least one selected from allyl, vinylphenyl, acryloyl, and methacryloyl.

[0097] As the component (B), it is preferably provided with 1 or more free-radical polymerizable unsaturated groups, and more preferably provided with 2 or more free-radical polymerizable unsaturated groups. There is no particular limitation on the upper limit, and it can be set to 10 or less, etc.

[0098] The maleimide-based free-radical polymerizable compound is a compound containing a maleimide group represented by the following formula (B-1) in the molecule. The maleimide-based free-radical polymerizable compound is a solid maleimide-based free-radical polymerizable compound, and a liquid or semi-solid maleimide-based free-radical polymerizable compound;

[0099] [Chemical formula 9]

[0100]

[0101] Here, the determination of liquid, semi-solid, and solid states can be carried out according to the "Method for Confirming Liquid State" in Appendix 2 of the Ministry of Home Affairs Order No. 1 of 1989 (regarding tests and properties of dangerous goods). The specific determination method is as follows.

[0102] (1) Equipment

[0103] Constant temperature water bath:

[0104] Use a constant temperature water bath equipped with a stirrer, a heater, a thermometer, an automatic temperature controller (a device capable of controlling the temperature within ±0.1 °C), and with a depth of 150 mm or more;

[0105] It should be noted that in the determination of liquid, semi-solid, and solid states, a combination of a low-temperature constant temperature water bath (model BU300) manufactured by Yamato Scientific Co., Ltd. and an immersion type constant temperature device Thermomate (model BF500) is used. Add approximately 22 liters of tap water to the low-temperature constant temperature water bath (model BU300), connect the power supply of the Thermomate (model BF500) assembled therein, set it to the set temperature (20 °C or 60 °C), and the water temperature can be finely adjusted to the set temperature ±0.1 °C with the Thermomate (model BF500). However, as long as it is a device that can perform the same adjustment, it can be used.

[0106] Test tube:

[0107] As the test tube, as Figure 1As shown in the figure, the following liquid determination test tube 10a and temperature measurement test tube 10b are used. The liquid determination test tube 10a is a flat-bottomed cylindrical transparent glass test tube with an inner diameter of 30 mm and a height of 120 mm. At the height positions of 55 mm and 85 mm from the bottom of the tube, marking lines 11A and 12B are respectively marked, and the mouth of the test tube is sealed with a rubber stopper 13a; the temperature measurement test tube 10b is a test tube with the same size as the liquid determination test tube 10a and marked with marking lines in the same way, and the mouth of the test tube is sealed with a rubber stopper 13b with a hole for inserting and supporting a thermometer in the center, and a thermometer 14 is inserted into the rubber stopper 13b. Hereinafter, the marking line at a height of 55 mm from the bottom of the tube is called the "A line", and the marking line at a height of 85 mm from the bottom of the tube is called the "B line".

[0108] As the thermometer 14, a thermometer for measuring the freezing point (SOP - 58 scale range 0 - 100 °C) specified in JIS B7410 (1982) "Glass Thermometer for Petroleum Tests" is used, but any thermometer that can measure the temperature range of 0 - 100 °C is acceptable.

[0109] (2) Experimental implementation steps

[0110] In Figure 1 (a) the liquid determination test tube 10a shown and Figure 1 (b) the temperature measurement test tube 10b shown, the samples placed at a temperature of 60 ± 5 °C under atmospheric pressure for more than 24 hours are respectively added to the 11A line. In a low-temperature constant temperature water bath, the two test tubes 10a and 10b are set upright and left standing with the 12B line below the water surface. The thermometer is set with its lower end 30 mm below the 11A line;

[0111] After the sample temperature reaches the set temperature ±0.1 °C, maintain this state for 10 minutes. After 10 minutes, take out the liquid judgment test tube 10a from the low-temperature constant temperature water bath, immediately lay it horizontally on a horizontal test bench, and use a stopwatch to measure the time for the front end of the liquid level in the test tube to move from the 11A line to the 12B line, and record this time.

[0112] Similarly, for the samples placed at a temperature of 20 ± 5 °C under atmospheric pressure for more than 24 hours, the test is also carried out in the same way as in the case of being placed at a temperature of 60 ± 5 °C under atmospheric pressure for more than 24 hours. Use a stopwatch to measure the time for the front end of the liquid level in the test tube to move from the 11A line to the 12B line, and record this time.

[0113] If the time measured at 20 °C is within 90 seconds, it is judged as liquid;

[0114] If the time measured at 20 °C exceeds 90 seconds and the time measured at 60 °C is within 90 seconds, it is judged as semi-solid;

[0115] When the time measured at 60°C exceeds 90 seconds, it is determined to be in a solid state.

[0116] From the viewpoint of significantly obtaining the desired effects of the present invention, the number of maleimide groups per molecule of the solid maleimide-based free-radical polymerizable compound is preferably 1 or more, more preferably 2 or more, still more preferably 3 or more, preferably 10 or less, more preferably 6 or less, and particularly preferably 3 or less.

[0117] From the viewpoint of significantly obtaining the desired effects of the present invention, the solid maleimide-based free-radical polymerizable compound preferably has either an aliphatic hydrocarbon group or an aromatic hydrocarbon group, and more preferably has both an aliphatic hydrocarbon group and an aromatic hydrocarbon group.

[0118] As the aliphatic hydrocarbon group, a divalent aliphatic hydrocarbon group is preferred, a divalent saturated aliphatic hydrocarbon group is more preferred, and an alkylene group is still more preferred. As the alkylene group, an alkylene group having 1 to 10 carbon atoms is preferred, an alkylene group having 1 to 6 carbon atoms is more preferred, an alkylene group having 1 to 3 carbon atoms is still more preferred, and a methylene group is particularly preferred.

[0119] As the aromatic hydrocarbon group, a monovalent and divalent aromatic hydrocarbon group is preferred, an aryl group and an arylene group are more preferred. As the arylene group, an arylene group having 6 to 30 carbon atoms is preferred, an arylene group having 6 to 20 carbon atoms is more preferred, and an arylene group having 6 to 10 carbon atoms is still more preferred. Examples of such arylene groups include, for example, phenylene, naphthylene, anthrylene, aralkyl, biphenylene, and biphenylaralkyl. Among them, phenylene, aralkyl, biphenylene, and biphenylaralkyl are preferred, and phenylene, aralkyl, and biphenylene are more preferred. As the aryl group, an aryl group having 6 to 30 carbon atoms is preferred, an aryl group having 6 to 20 carbon atoms is more preferred, and an aryl group having 6 to 10 carbon atoms is still more preferred, and a phenyl group is particularly preferred.

[0120] In the solid maleimide-based free-radical polymerizable compound, from the viewpoint of significantly obtaining the desired effects of the present invention, the nitrogen atom of the maleimide group is preferably directly bonded to a monovalent or divalent aromatic hydrocarbon group. Here, "directly" means that there is no other group between the nitrogen atom of the maleimide group and the aromatic hydrocarbon group.

[0121] The solid maleimide compound is preferably, for example, a structure represented by the following formula (B-a);

[0122] [Chemical formula 10]

[0123]

[0124] [In the formula, R c each independently represents a substituent; X cEach independently represents a single bond, alkylene, alkenylene, -O-, -CO-, -S-, -SO-, -SO 2 -, -CONH-, -NHCO-, -COO-, or -OCO- (preferably a single bond or alkylene); Z c Each independently represents an optionally substituted non-aromatic ring or an optionally substituted aromatic ring (preferably an optionally substituted aromatic ring, particularly preferably an optionally substituted benzene ring); s represents an integer of 1 or more (preferably an integer of 1 to 100, more preferably an integer of 1 to 50, still more preferably an integer of 1 to 20); t each independently represents 0 or an integer of 1 or more; u each independently represents an integer of 0 to 2 (preferably 0).] The maleimide compound represented, particularly preferably the maleimide compounds represented by formulas (B-a-1) to (B-a-4).

[0125] [Chemical Formula 11]

[0126]

[0127] [In the formula, R c1 , R c2 and R c3 Each independently represents an alkyl group; X c1 and X c2 Each independently represents a single bond or alkylene; s represents an integer of 1 or more (preferably an integer of 1 to 100, more preferably an integer of 1 to 50, still more preferably an integer of 1 to 20); t' represents an integer of 1 to 5; u1, u2, and u3 each independently represent an integer of 0 to 2 (preferably 0).]. It should be noted that for the s unit, t unit, t' unit, u unit, u1 unit, u2 unit, and u3 unit, each unit can be the same or different from each other.

[0128] In addition, as another embodiment, the solid maleimide-based radically polymerizable compound is preferably, for example, a structure represented by the following formula (B-2);

[0129] [Chemical Formula 12]

[0130]

[0131] In formula (B-2), R 31 and R 36 represent maleimide groups, R 32 , R 33 , R 34 and R 35 Each independently represents a hydrogen atom, an alkyl group, or an aryl group, and D each independently represents a divalent aromatic group. m1 and m2 each independently represent an integer of 1 to 10, and a represents an integer of 1 to 100.

[0132] R in formula (B-2) 32 , R 33 , R 34 , and R 35 each independently represent a hydrogen atom, an alkyl group, or an aryl group, preferably a hydrogen atom.

[0133] As the alkyl group, preferably an alkyl group having 1 to 10 carbon atoms, more preferably an alkyl group having 1 to 6 carbon atoms, and still more preferably an alkyl group having 1 to 3 carbon atoms. The alkyl group may be linear, branched, or cyclic. Examples of such alkyl groups include methyl, ethyl, propyl, butyl, pentyl, hexyl, isopropyl, etc.

[0134] The aryl group is preferably an aryl group having 6 to 20 carbon atoms, more preferably an aryl group having 6 to 15 carbon atoms, and still more preferably an aryl group having 6 to 10 carbon atoms. The aryl group may be monocyclic or polycyclic. Examples of such aryl groups include phenyl, naphthyl, anthryl, etc.

[0135] The alkyl group and the aryl group may optionally have substituents. As the substituents, there is no particular limitation, and examples thereof include a halogen atom, -OH, -O-C 1-6 alkyl group, -N(C 1-10 alkyl group) 2 , C 1-10 alkyl group, C 6-10 aryl group, -NH 2 , -CN, -C(O)O-C 1-10 alkyl group, -COOH, -C(O)H, -NO 2 , etc. Here, the term "C p-q " (p and q are positive integers satisfying p < q) means that the number of carbon atoms of the organic group described immediately after this term is p to q. For example, an expression such as "C 1-10 alkyl group" means an alkyl group having 1 to 10 carbon atoms. These substituents may combine with each other to form a ring, and the ring structure also includes a spiro ring and a fused ring.

[0136] The above-mentioned substituents may further have substituents (hereinafter sometimes referred to as "secondary substituents"). As the secondary substituents, the same groups as the above-mentioned substituents may be used as long as there is no particular description.

[0137] D in formula (B-2) represents a divalent aromatic group. Examples of the divalent aromatic group include phenylene, naphthylene, anthrylene, aralkyl, biphenylene, biphenylaralkyl, etc. Among them, preferably biphenylene and biphenylaralkyl, and more preferably biphenylene. The divalent aromatic group may optionally have substituents. As the substituents, they are the same as the substituents that the alkyl group represented by R 32 in formula (B-2) may optionally have.

[0138] m1 and m2 each independently represent an integer of 1 to 10, preferably 1 to 6, more preferably 1 to 3, still more preferably 1 to 2, and even more preferably 1.

[0139] a represents an integer of 1 to 100, preferably 1 to 50, more preferably 1 to 20, and still more preferably 1 to 5.

[0140] As the solid maleimide-based free-radical polymerizable compound, a resin represented by the formula (B-3) is preferred;

[0141] [Chemical Formula 13]

[0142]

[0143] In the formula (B-3), R 37 and R 38 represent maleimide groups. a1 represents an integer of 1 to 100.

[0144] a1 is the same as a in the formula (B-2), and the preferred ranges are also the same.

[0145] The weight-average molecular weight (Mw) of the solid maleimide-based free-radical polymerizable compound is preferably 150 to 5000, more preferably 300 to 2500.

[0146] The functional group equivalent of the maleimide group of the maleimide-based free-radical polymerizable compound is preferably 50 g / eq. to 2000 g / eq., more preferably 100 g / eq. to 1000 g / eq., still more preferably 150 g / eq. to 500 g / eq., and particularly preferably 200 g / eq. to 300 g / eq.

[0147] Commercially available products can be used as the solid maleimide-based free-radical polymerizable compound. Examples of commercially available products include "MIR-3000-70MT" manufactured by Nippon Kayaku Co., Ltd.; "BMI-50P" manufactured by K-I Chemical Co., Ltd.; "BMI-1000", "BMI-1000H", "BMI-1100", "BMI-1100H", "BMI-4000", "BMI-5100" manufactured by Daiwa Kasei Kogyo Co., Ltd.; "BMI-4,4'-BPE", "BMI-70" manufactured by K-I Chemical Co., Ltd.; "BMI-80" manufactured by K-I Chemical Co., Ltd., etc.

[0148] The liquid or semi-solid maleimide-based free-radical polymerizable compound is a compound having at least 1 maleimide group in the molecule.

[0149] The liquid or semi-solid maleimide-based free-radical polymerizable compound preferably contains at least one of an alkyl group having 5 or more carbon atoms and an alkylene group having 5 or more carbon atoms.

[0150] The alkyl group having 5 or more carbon atoms preferably has 6 or more carbon atoms, more preferably 8 or more carbon atoms, preferably 50 or less carbon atoms, more preferably 45 or less carbon atoms, and even more preferably 40 or less carbon atoms. The alkyl group may be linear, branched, or cyclic, and is preferably linear. Examples of such an alkyl group include a pentyl group, a hexyl group, a heptyl group, an octyl group, a nonyl group, and a decyl group. The alkyl group having 5 or more carbon atoms may be present in the form of a substituent of an alkylene group having 5 or more carbon atoms.

[0151] The alkylene group having 5 or more carbon atoms preferably has 6 or more carbon atoms, more preferably 8 or more carbon atoms, preferably 50 or less carbon atoms, more preferably 45 or less carbon atoms, and even more preferably 40 or less carbon atoms. The alkylene group may be linear, branched, or cyclic, and is preferably linear. Here, the cyclic alkylene group is a concept including "the case of being formed only by a cyclic alkylene group" and "the case of containing both a linear alkylene group and a cyclic alkylene group". Examples of such an alkylene group include a pentylene group, a hexylene group, a heptylene group, an octylene group, a nonylene group, a decylene group, an undecylene group, a dodecylene group, a tridecylene group, a heptadecylene group, a hexatriacontylene group, a group having an octylene-cyclohexylene structure, a group having an octylene-cyclohexylene-octylene structure, and a group having a propylene-cyclohexylene-octylene structure.

[0152] From the viewpoint of significantly obtaining the effects of the present invention, the liquid or semi-solid maleimide-based free-radical polymerizable compound preferably contains both an alkyl group having 5 or more carbon atoms and an alkylene group having 5 or more carbon atoms.

[0153] The alkyl group having 5 or more carbon atoms and the alkylene group having 5 or more carbon atoms may combine with each other to form a ring, and the ring structure also includes a spiro ring and a fused ring. Examples of the ring formed by combining with each other include a cyclohexane ring.

[0154] The alkyl group having 5 or more carbon atoms and the alkylene group having 5 or more carbon atoms preferably do not have a substituent, but may optionally have a substituent. The substituent is the same as the substituent that the aromatic ester skeleton in the component (A) may optionally have.

[0155] In the liquid or semi-solid maleimide-based free-radical polymerizable compound, the alkyl group having 5 or more carbon atoms and the alkylene group having 5 or more carbon atoms are preferably directly bonded to the nitrogen atom of the maleimide group.

[0156] The number of maleimide groups per molecule of the liquid or semi-solid maleimide-based free-radical polymerizable compound may be 1, preferably 2 or more, preferably 10 or less, more preferably 6 or less, and particularly preferably 3 or less. By using a liquid or semi-solid maleimide-based free-radical polymerizable compound having 2 or more maleimide groups per molecule, the effects of the present invention can be obtained significantly.

[0157] The liquid or semi-solid maleimide-based free-radical polymerizable compound is preferably represented by the following general formula (B-4);

[0158] [Chemical formula 14]

[0159]

[0160] In the general formula (B-4), M represents an alkylene group having 5 or more carbon atoms which may optionally have a substituent, and L represents a single bond or a divalent linking group.

[0161] M represents an alkylene group having 5 or more carbon atoms which may optionally have a substituent. The alkylene group of M is the same as the alkylene group having 5 or more carbon atoms described above. As the substituent of M, it is the same as the substituent which the aromatic ester skeleton in the component (A) may optionally have, and the substituent is preferably an alkyl group having 5 or more carbon atoms.

[0162] L represents a single bond or a divalent linking group. As the divalent linking group, an alkylene group, an alkenylene group, an alkynylene group, an arylene group, -C(=O)-, -C(=O)-O-, -NR 0 -(R 0 is a hydrogen atom, an alkyl group having 1 to 3 carbon atoms), an oxygen atom, a sulfur atom, C(=O)NR 0 -, a divalent group derived from phthalimide, a divalent group derived from pyromellitic diimide, and a group formed by combining two or more of these divalent groups, etc. The alkylene group, alkenylene group, alkynylene group, arylene group, divalent group derived from phthalimide, divalent group derived from pyromellitic diimide, and the group formed by combining two or more divalent groups may have an alkyl group having 5 or more carbon atoms as a substituent. The divalent group derived from phthalimide represents a divalent group derived from phthalimide, specifically a group represented by the general formula (B-5). The divalent group derived from pyromellitic diimide represents a divalent group derived from pyromellitic diimide, specifically a group represented by the general formula (B-6). In the formula, “*” represents a connecting bond;

[0163] [Chemical formula 15]

[0164]

[0165] The alkylene group as the divalent linking group in L is preferably an alkylene group having 1 to 50 carbon atoms, more preferably an alkylene group having 1 to 45 carbon atoms, and particularly preferably an alkylene group having 1 to 40 carbon atoms. The alkylene group can be any of linear, branched, and cyclic. Examples of such alkylene groups include methyl ethylene, cyclohexylene, pentylene, hexylene, heptylene, octylene, nonylene, decylene, undecylene, dodecylene, tridecylene, heptadecylene, hexatriacontylene, a group having an octylene-cyclohexylene structure, a group having an octylene-cyclohexylene-octylene structure, a group having a propylene-cyclohexylene-octylene structure, and the like.

[0166] The alkenylene group as the divalent linking group in L is preferably an alkenylene group having 2 to 20 carbon atoms, more preferably an alkenylene group having 2 to 15 carbon atoms, and particularly preferably an alkenylene group having 2 to 10 carbon atoms. The alkenylene group can be any of linear, branched, and cyclic. Examples of such alkenylene groups include methyl vinyl, cyclohexenylene, pentenylene, hexenylene, heptenylene, octenylene, and the like.

[0167] The alkynylene group as the divalent linking group in L is preferably an alkynylene group having 2 to 20 carbon atoms, more preferably an alkynylene group having 2 to 15 carbon atoms, and particularly preferably an alkynylene group having 2 to 10 carbon atoms. The alkynylene group can be any of linear, branched, and cyclic. Examples of such alkynylene groups include methyl ethynyl, cyclohexynylene, pentynylene, hexynylene, heptynylene, octynylene, and the like.

[0168] The arylene group as the divalent linking group in L is preferably an arylene group having 6 to 24 carbon atoms, more preferably an arylene group having 6 to 18 carbon atoms, still more preferably an arylene group having 6 to 14 carbon atoms, and still more preferably an arylene group having 6 to 10 carbon atoms. Examples of arylene groups include phenylene, naphthylene, anthrylene, and the like.

[0169] The alkylene group, alkenylene group, alkynylene group, and arylene group as the divalent linking group in L may optionally have a substituent. The substituent is the same as the substituent that the aromatic ester skeleton in the component (A) may optionally have, and is preferably an alkyl group having 5 or more carbon atoms.

[0170] Examples of the group composed of two or more divalent groups in L include: a divalent group composed of an alkylene group, a divalent group derived from phthalimide, and an oxygen atom; a divalent group composed of a divalent group derived from phthalimide, an oxygen atom, an arylene group, and an alkylene group; a divalent group composed of an alkylene group and a divalent group derived from pyromellitimide, etc. The group composed of two or more divalent groups can form a ring such as a condensed ring through the combination of the respective groups. In addition, the group composed of two or more divalent groups can be a repeating unit with a repeating unit number of 1 to 10.

[0171] Among them, as L in the general formula (B-4), preferably an oxygen atom, an optionally substituted arylene group having 6 to 24 carbon atoms, an optionally substituted alkylene group having 1 to 50 carbon atoms, an alkyl group having 5 or more carbon atoms, a divalent group derived from phthalimide, a divalent group derived from pyromellitimide, or a divalent group composed of two or more of these groups. Among them, as L, more preferably: an alkylene group; a divalent group having a structure of alkylene-divalent group derived from phthalimide-oxygen atom-divalent group derived from phthalimide; a divalent group having a structure of alkylene-divalent group derived from phthalimide-oxygen atom-arylene group-alkylene group-arylene group-oxygen atom-divalent group derived from phthalimide; a divalent group having a structure of alkylene-divalent group derived from pyromellitimide.

[0172] The liquid or semi-solid maleimide-based radically polymerizable compound represented by the general formula (B-4) is preferably represented by the general formula (B-7);

[0173] [Chemical formula 16]

[0174]

[0175] In the general formula (B-7), M 1 each independently represents an optionally substituted alkylene group having 5 or more carbon atoms, and Z each independently represents an optionally substituted alkylene group having 5 or more carbon atoms or an optionally substituted divalent group having an aromatic ring. t represents an integer of 1 to 10.

[0176] M 1 each independently represents an optionally substituted alkylene group having 5 or more carbon atoms. M 1 is the same as M in the general formula (B-4).

[0177] Z each independently represents an optionally substituted alkylene group having 5 or more carbon atoms or an optionally substituted divalent group having an aromatic ring. As the alkylene group in Z, it can be any of linear, branched, or cyclic, preferably cyclic, that is, an optionally substituted cyclic alkylene group having 5 or more carbon atoms. The number of carbon atoms of the alkylene group is preferably 6 or more, more preferably 8 or more, preferably 50 or less, more preferably 45 or less, and still more preferably 40 or less. Examples of such alkylene groups include groups having an octylene-cyclohexylene structure, groups having an octylene-cyclohexylene-octylene structure, groups having a propylene-cyclohexylene-octylene structure, and the like.

[0178] Examples of the aromatic ring in the divalent group having an aromatic ring represented by Z include a benzene ring, a naphthalene ring, an anthracene ring, a phthalimide ring, a pyromellitimide ring, an aromatic heterocycle, etc., preferably a benzene ring, a phthalimide ring, a pyromellitimide ring. That is, as the divalent group having an aromatic ring, it is preferably an optionally substituted divalent group having a benzene ring, an optionally substituted divalent group having a phthalimide ring, or an optionally substituted divalent group having a pyromellitimide ring. Examples of the divalent group having an aromatic ring include: a group composed of a divalent group derived from phthalimide and an oxygen atom; a group composed of a divalent group derived from phthalimide, an oxygen atom, an arylene group, and an alkylene group; a group composed of an alkylene group and a divalent group derived from pyromellitimide; a divalent group derived from pyromellitimide; a group composed of a divalent group derived from phthalimide and an alkylene group, etc. The above arylene group and alkylene group are the same as the arylene group and alkylene group in the divalent linking group represented by L in the general formula (B-4).

[0179] The alkylene group and the divalent group having an aromatic ring represented by Z are optionally substituted. The substituents are the same as the substituents that the aromatic ester skeleton in the component (A) optionally has.

[0180] Specific examples of the group represented by Z include the following groups. In the formula, “*” represents a connecting bond;

[0181] [Chemical formula 15]

[0182]

[0183] [Chemical formula 16]

[0184]

[0185] The maleimide-based radically polymerizable compound represented by the general formula (B-4) is preferably any one of the liquid or semi-solid maleimide-based radically polymerizable compounds represented by the general formula (B-8) and the liquid or semi-solid maleimide-based radically polymerizable compounds represented by the general formula (B-9);

[0186] [Chemical formula 17]

[0187]

[0188] In the general formula (B-8), M 2 and M 3 each independently represents an alkylene group having 5 or more carbon atoms which may optionally have a substituent, and R 40 each independently represents an oxygen atom, an arylene group, an alkylene group, or a divalent group formed by combining two or more of these groups. t1 represents an integer of 1 to 10;

[0189] In the general formula (B-9), M 4 , M 6 and M 7 each independently represents an alkylene group having 5 or more carbon atoms which may optionally have a substituent, M 5 each independently represents a divalent group having an aromatic ring which may optionally have a substituent, and R 41 and R 42 each independently represents an alkyl group having 5 or more carbon atoms. t2 represents an integer of 0 to 10, and u1 and u2 each independently represent an integer of 0 to 4.

[0190] M 2 and M 3 each independently represents an alkylene group having 5 or more carbon atoms which may optionally have a substituent. M 2 and M 3 are the same as the alkylene group having 5 or more carbon atoms represented by M in the general formula (B-4), and are preferably hexatriacontylene.

[0191] R 40 each independently represents an oxygen atom, an arylene group, an alkylene group, or a group formed by combining two or more of these divalent groups. The arylene group and the alkylene group are the same as the arylene group and the alkylene group in the divalent linking group represented by L in the general formula (B-4). As R 40 , a group formed by combining two or more divalent groups or an oxygen atom is preferred.

[0192] As R 40The group composed of two or more divalent groups therein may be exemplified by the combination of an oxygen atom, an arylene group, and an alkylene group. Specific examples of the group composed of two or more divalent groups may be the following groups. In the formula, “*” represents a linking bond;

[0193] [Chemical formula 18]

[0194]

[0195] M 4 、M 6 and M 7 each independently represent an alkylene group having 5 or more carbon atoms which may optionally have a substituent. M 4 、M 6 and M 7 are the same as the alkylene group having 5 or more carbon atoms which may optionally have a substituent represented by M in the general formula (B-4), preferably a hexylene group, a heptylene group, an octylene group, a nonylene group, a decylene group, and more preferably an octylene group.

[0196] M 5 each independently represent a divalent group having an aromatic ring which may optionally have a substituent. M 5 is the same as the divalent group having an aromatic ring which may optionally have a substituent represented by Z in the general formula (B-7), preferably a group composed of a combination of an alkylene group and a divalent group derived from pyromellitimide; a group composed of a divalent group derived from phthalimide and an alkylene group, and more preferably a group composed of a combination of an alkylene group and a divalent group derived from pyromellitimide. The above arylene group and alkylene group are the same as the arylene group and alkylene group in the divalent linking group represented by L in the general formula (B-4).

[0197] As specific examples of the group represented by M 5 , for example, the following groups may be exemplified. In the formula, “*” represents a linking bond;

[0198] [Chemical formula 19]

[0199]

[0200] R 41 and R 42 each independently represent an alkyl group having 5 or more carbon atoms. R 41 and R 42 are the same as the above alkyl group having 5 or more carbon atoms, preferably a hexyl group, a heptyl group, an octyl group, a nonyl group, a decyl group, and more preferably a hexyl group, an octyl group.

[0201] u1 and u2 each independently represent an integer from 1 to 15, preferably an integer from 1 to 10.

[0202] Specific examples of the maleimide-based free-radical polymerizable compound in a liquid or semi-solid state include the following compounds (B1) to (B3). However, the maleimide-based free-radical polymerizable compound in a liquid or semi-solid state is not limited to these specific examples. In the formula, v represents an integer of 1 to 10;

[0203] [Chemical formula 20]

[0204]

[0205] [Chemical formula 21]

[0206]

[0207] Specific examples of the maleimide-based free-radical polymerizable compound in a liquid or semi-solid state include "BMI1500" (compound of formula (B1)), "BMI1700" (compound of formula (B2)), "BMI689" (compound of formula (B3)), etc. manufactured by DESIGNER MOLECULES.

[0208] From the viewpoint of significantly obtaining the desired effects of the present invention, the maleimide group equivalent of the maleimide-based free-radical polymerizable compound in a liquid or semi-solid state is preferably 50 g / eq. to 2000 g / eq., more preferably 100 g / eq. to 1000 g / eq., and still more preferably 150 g / eq. to 500 g / eq. The maleimide group equivalent is the mass of the maleimide-based free-radical polymerizable compound in a liquid or semi-solid state containing 1 equivalent of the maleimide group.

[0209] The vinylphenyl-based free-radical polymerizable compound is a free-radical polymerizable compound having a vinylphenyl group. The vinylphenyl-based free-radical polymerizable compound is preferably in a liquid or semi-solid state. The determination of the liquid or semi-solid state is as described above. Vinylphenyl refers to a group having the following structure;

[0210] [Chemical formula 22]

[0211]

[0212] (* represents a connecting bond).

[0213] From the viewpoint of obtaining a cured product with a low dielectric loss tangent, the vinylphenyl-based free-radical polymerizable compound preferably has two or more vinylphenyl groups per molecule.

[0214] From the viewpoint of obtaining a cured product with a low dielectric loss tangent, the vinylphenyl-based radically polymerizable compound preferably has a cyclic structure. As the cyclic structure, a divalent cyclic group is preferable. As the divalent cyclic group, either a cyclic group containing an alicyclic structure or a cyclic group containing an aromatic ring structure can be used. In addition, there may be a plurality of divalent cyclic groups.

[0215] From the viewpoint of significantly obtaining the desired effects of the present invention, the divalent cyclic group is preferably a 3-membered ring or more, more preferably a 4-membered ring or more, still more preferably a 5-membered ring or more, preferably a 20-membered ring or less, more preferably a 15-membered ring or less, and still more preferably a 10-membered ring or less. In addition, as the divalent cyclic group, it may be a monocyclic structure or a polycyclic structure.

[0216] The ring in the divalent cyclic group may be composed of a heteroatom in addition to carbon atoms to form the ring skeleton. Examples of the heteroatom include, for example, an oxygen atom, a sulfur atom, a nitrogen atom, etc., and an oxygen atom is preferable. The heteroatom may have 1 in the above-mentioned ring or may have 2 or more.

[0217] Specific examples of the divalent cyclic group include the following divalent groups (xii) or (xiii):

[0218] [Chemical formula 23]

[0219]

[0220] (In the divalent groups (xii) and (xiii), R 51 , R 52 , R 55 , R 56 , R 57 , R 61 and R 62 each independently represent a halogen atom, an alkyl group having 6 or less carbon atoms, or a phenyl group, and R 53 , R 54 , R 58 , R 59 and R 60 each independently represent a hydrogen atom, a halogen atom, an alkyl group having 6 or less carbon atoms, or a phenyl group).

[0221] Examples of the halogen atom include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom. Examples of the alkyl group having 6 or less carbon atoms include a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, a hexyl group, etc., and a methyl group is preferable. As R 51 , R 52 , R 55 , R 56 , R 57 , R 61 and R 62 , they preferably represent a methyl group. R53 , R 54 , R 58 , R 59 and R 60 is preferably a hydrogen atom or a methyl group.

[0222] In addition, for a divalent cyclic group, a plurality of divalent cyclic groups can be combined. As a specific example of the case where divalent cyclic groups are combined, a divalent cyclic group (divalent group (a)) represented by the following formula (B4) can be cited.

[0223] [Chemical formula 24]

[0224]

[0225] (In formula (B4), R 71 , R 72 , R 75 , R 76 , R 77 , R 81 , R 82 , R 85 and R 86 each independently represent a halogen atom, an alkyl group having 6 or less carbon atoms, or a phenyl group, and R 73 , R 74 , R 78 , R 79 , R 80 , R 83 and R 84 each independently represent a hydrogen atom, a halogen atom, an alkyl group having 6 or less carbon atoms, or a phenyl group. d1 and d2 represent integers from 0 to 300. However, the case where one of d1 and d2 is 0 is excluded.).

[0226] R 71 , R 72 , R 85 and R 86 are the same as R 51 in formula (xii). R 73 , R 74 , R 83 and R 84 are the same as R 53 in formula (xii). R 75 , R 76 , R 77 , R 81 and R 82 are the same as R 55 in formula (xiii). R 78 , R 79 and R 80 are the same as R 58 in formula (xiii).

[0227] d1 and d2 represent integers from 0 to 300, except when one of d1 and d2 is 0. As d1 and d2, it is preferable to represent integers from 1 to 100, more preferably integers from 1 to 50, and still more preferably integers from 1 to 10. d1 and d2 may be the same or different.

[0228] The divalent cyclic group optionally has a substituent. Examples of the substituent include a halogen atom, an alkyl group, an alkoxy group, an aryl group, an arylalkyl group, a silyl group, an acyl group, an acyloxy group, a carboxyl group, a sulfo group, a cyano group, a nitro group, a hydroxyl group, a mercapto group, an oxo group, etc., and an alkyl group is preferable.

[0229] Vinylphenyl may be directly bonded to the divalent cyclic group or may be bonded via a divalent linking group. Examples of the divalent linking group include an alkylene group, an alkenylene group, an arylene group, a heteroarylene group, -C(=O)O-, -O-, -NHC(=O)-, -NC(=O)N-, -NHC(=O)O-, -C(=O)-, -S-, -SO-, -NH-, etc., and a group formed by combining a plurality of these groups may also be used. As the alkylene group, an alkylene group having 1 to 10 carbon atoms is preferable, an alkylene group having 1 to 6 carbon atoms is more preferable, and an alkylene group having 1 to 5 carbon atoms or an alkylene group having 1 to 4 carbon atoms is still more preferable. The alkylene group may be linear, branched, or cyclic. Examples of such an alkylene group include a methylene group, an ethylene group, a propylene group, a butylene group, a pentylene group, a hexylene group, 1,1-dimethylethylene group, etc., and a methylene group, an ethylene group, and 1,1-dimethylethylene group are preferable. As the alkenylene group, an alkenylene group having 2 to 10 carbon atoms is preferable, an alkenylene group having 2 to 6 carbon atoms is more preferable, and an alkenylene group having 2 to 5 carbon atoms is still more preferable. As the arylene group and the heteroarylene group, an arylene group or a heteroarylene group having 6 to 20 carbon atoms is preferable, and an arylene group or a heteroarylene group having 6 to 10 carbon atoms is more preferable. As the divalent linking group, an alkylene group is preferable, and among them, a methylene group is preferable.

[0230] The vinylphenyl-based radically polymerizable compound is preferably a compound represented by the following formula (B-10);

[0231] [Chemical formula 25]

[0232]

[0233] (In the formula (B-10), R 91 and R 92 each independently represent a divalent linking group. Ring B1 represents a divalent cyclic group.).

[0234] R 91 and R 92Each independently represents a divalent linking group. As the divalent linking group, it is the same as the above-mentioned divalent linking group.

[0235] Ring B1 represents a divalent cyclic group. As ring B1, it is the same as the above-mentioned divalent cyclic group.

[0236] Ring B1 optionally has a substituent. As the substituent, it is the same as the substituent that the above-mentioned divalent cyclic group optionally has.

[0237] In another embodiment, the vinylphenyl-based radically polymerizable compound is preferably a compound having a repeating unit represented by formula (B-11) (the number of repeating units is preferably 2 to 200). This compound may also be a copolymer further having other styrene backbone units such as a styrene unit and an ethylstyrene unit. When having other styrene backbone units, the proportion of the repeating unit of formula (B-11) relative to all styrene backbone units is preferably 5 to 70 mol%;

[0238] [Chemical formula 26]

[0239]

[0240] [In the formula, R e5 , R e6 and R e7 each independently represents a hydrogen atom or a substituent (preferably a hydrogen atom).].

[0241] Hereinafter, specific examples of the vinylphenyl-based radically polymerizable compound are shown, but the present invention is not limited thereto;

[0242] [Chemical formula 27]

[0243]

[0244] (q1 is the same as d1 in formula (B4), and q2 is the same as d2 in formula (B4).).

[0245] The vinylphenyl-based radically polymerizable compound can be a commercially available product, and examples thereof include: "OPE-2St", "OPE-2St 1200", "OPE-2St 2200" (vinylbenzyl-modified polyphenylene ether) manufactured by Mitsubishi Gas Chemical Company; "ODV-XET-X03", "ODV-XET-X04", "ODV-XET-X05" (divinylbenzene polymer) manufactured by Nippon Steel Chemical Co., Ltd., etc. The vinylphenyl-based radically polymerizable compound can be used alone or in combination of two or more.

[0246] From the viewpoint of significantly obtaining the desired effects of the present invention, the number average molecular weight of the vinylphenyl-based free-radical polymerizable compound is preferably 3000 or less, more preferably 2500 or less, still more preferably 2000 or less, and 1500 or less. The lower limit is preferably 100 or more, more preferably 300 or more, still more preferably 500 or more, and 1000 or more. The number average molecular weight is the number average molecular weight in terms of polystyrene measured by gel permeation chromatography (GPC).

[0247] (Meth)acrylic acid-based free-radical polymerizable compounds are compounds containing acryloyl and methacryloyl and combinations thereof. As the (meth)acrylic acid-based free-radical polymerizable compound, from the viewpoint of significantly obtaining the desired effects of the present invention, it preferably has 2 or more (meth)acryloyl groups per molecule. The term "(meth)acryloyl" includes acryloyl and methacryloyl and combinations thereof. The (meth)acrylic acid-based free-radical polymerizable compound is preferably liquid or semi-solid. The determination of liquid or semi-solid is as described above.

[0248] From the viewpoint of significantly obtaining the desired effects of the present invention, the (meth)acrylic acid-based free-radical polymerizable compound preferably has a cyclic structure. As the cyclic structure, a divalent cyclic group is preferred. As the divalent cyclic group, it may be either a cyclic group containing an alicyclic structure or a cyclic group containing an aromatic ring structure. Among them, from the viewpoint of significantly obtaining the desired effects of the present invention, a cyclic group containing an alicyclic structure is preferred.

[0249] From the viewpoint of significantly obtaining the desired effects of the present invention, the divalent cyclic group is preferably a 3-membered ring or more, more preferably a 4-membered ring or more, still more preferably a 5-membered ring or more, preferably a 20-membered ring or less, more preferably a 15-membered ring or less, still more preferably a 10-membered ring or less. In addition, as the divalent cyclic group, it may be a monocyclic structure or a polycyclic structure.

[0250] The ring in the divalent cyclic group may be composed of a heteroatom in addition to carbon atoms to form the ring skeleton. As the heteroatom, for example, an oxygen atom, a sulfur atom, a nitrogen atom, etc. can be mentioned, and an oxygen atom is preferred. One heteroatom or two or more heteroatoms may be present in the aforementioned ring.

[0251] As specific examples of the divalent cyclic group, the following divalent groups (i) to (xi) can be mentioned. Among them, as the divalent cyclic group, (x) or (xi) is preferred;

[0252] [Chemical formula 28]

[0253]

[0254] The divalent cyclic group optionally has a substituent. Examples of such a substituent include, for example, a halogen atom, an alkyl group, an alkoxy group, an aryl group, an arylalkyl group, a silyl group, an acyl group, an acyloxy group, a carboxyl group, a sulfo group, a cyano group, a nitro group, a hydroxyl group, a mercapto group, an oxo group, etc., and an alkyl group is preferable.

[0255] (Meth)acryloyl may be directly bonded to the divalent cyclic group or may be bonded via a divalent linking group. Examples of the divalent linking group include, for example, an alkylene group, an alkenylene group, an arylene group, a heteroarylene group, -C(=O)O-, -O-, -NHC(=O)-, -NC(=O)N-, -NHC(=O)O-, -C(=O)-, -S-, -SO-, -NH-, etc., and a group formed by combining a plurality of these groups may also be used. As the alkylene group, an alkylene group having 1 to 10 carbon atoms is preferable, an alkylene group having 1 to 6 carbon atoms is more preferable, an alkylene group having 1 to 5 carbon atoms or an alkylene group having 1 to 4 carbon atoms is further preferable. The alkylene group may be any of linear, branched, and cyclic. Examples of such an alkylene group include, for example, a methylene group, an ethylene group, a propylene group, a butylene group, a pentylene group, a hexylene group, 1,1-dimethylethylene group, etc., and a methylene group, an ethylene group, 1,1-dimethylethylene group are preferable. As the alkenylene group, an alkenylene group having 2 to 10 carbon atoms is preferable, an alkenylene group having 2 to 6 carbon atoms is more preferable, and an alkenylene group having 2 to 5 carbon atoms is further preferable. As the arylene group and the heteroarylene group, an arylene group or a heteroarylene group having 6 to 20 carbon atoms is preferable, and an arylene group or a heteroarylene group having 6 to 10 carbon atoms is more preferable. As the divalent linking group, an alkylene group is preferable, and among them, a methylene group and 1,1-dimethylethylene group are preferable.

[0256] (Meth)acrylic radical polymerizable compound is preferably represented by the following formula (B-11);

[0257] [Chemical formula 29]

[0258]

[0259] (In formula (B-11), R 101 and R 104 each independently represent an acryloyl group or a methacryloyl group, and R 102 and R 103 each independently represent a divalent linking group. Ring B2 represents a divalent cyclic group.).

[0260] R 101 and R 104 each independently represent an acryloyl group or a methacryloyl group, and an acryloyl group is preferable.

[0261] R 102 and R 103Each independently represents a divalent linking group. As the divalent linking group, it is the same as the divalent linking group that can bind to a (meth)acryloyl group.

[0262] Ring B2 represents a divalent cyclic group. As ring B2, it is the same as the above-mentioned divalent cyclic group. Ring B2 optionally has a substituent. As the substituent, it is the same as the substituent that the above-mentioned divalent cyclic group optionally has.

[0263] As specific examples of the (meth)acrylic radical polymerizable compound, the following compounds can be cited, but the present invention is not limited thereto;

[0264] [Chemical formula 30]

[0265]

[0266] Commercially available products can be used as the (meth)acrylic radical polymerizable compound, and examples thereof include "A-DOG" manufactured by Shin-Nakamura Chemical Co., Ltd., "DCP-A" manufactured by Kyoeisha Chemical Co., Ltd., "NPDGA", "FM-400", "R-687", "THE-330", "PET-30", "DPHA" manufactured by Nippon Kayaku Co., Ltd., "NK Ester DCP" manufactured by Shin-Nakamura Chemical Co., Ltd., and the like.

[0267] From the viewpoint of significantly obtaining the desired effects of the present invention, the (meth)acryloyl equivalent of the (meth)acrylic radical polymerizable compound is preferably 30 g / eq. to 400 g / eq., more preferably 50 g / eq. to 300 g / eq., and still more preferably 75 g / eq. to 200 g / eq. The (meth)acryloyl equivalent is the mass of the (meth)acrylic radical polymerizable compound containing 1 equivalent of the (meth)acryloyl group.

[0268] The allyl radical polymerizable compound refers to a compound having at least 1 allyl group in the molecule. The allyl radical polymerizable compound is preferably liquid or semi-solid. The determination of liquid or semi-solid is as described above. The allyl radical polymerizable compound preferably has more than 1 allyl group per molecule, and more preferably has 2 or more allyl groups. The lower limit is not particularly limited, and is preferably set to 10 or less, and more preferably set to 5 or less.

[0269] In addition, from the viewpoint of significantly obtaining the desired effects of the present invention, the allyl radical polymerizable compound preferably has, in addition to the allyl group, any one of a benzoxazine ring, a phenol ring, an isocyanuric acid ring, an epoxy group, and a carboxylic acid derivative having a cyclic structure.

[0270] In the case of an allyl-based radically polymerizable compound having a benzoxazine ring, it is preferable that it is bonded to either the nitrogen atom of the benzoxazine ring or the benzene ring, and more preferably bonded to the nitrogen atom.

[0271] Examples of the allyl-based radically polymerizable compound having a phenol ring include a cresol resin containing an allyl group, a novolak-type phenol resin containing an allyl group, a cresol novolac resin containing an allyl group, and the like.

[0272] In the case of an allyl-based radically polymerizable compound having an isocyanuric acid structure, it is preferable that the nitrogen atom of the isocyanuric acid structure is directly bonded to the allyl group. Examples of the allyl-based radically polymerizable compound having an isocyanuric acid structure include allyl isocyanurate, diallyl isocyanurate, triallyl isocyanurate, and the like.

[0273] The allyl-based radically polymerizable compound having an epoxy group preferably contains two or more epoxy groups in one molecule. In addition, the allyl-based radically polymerizable compound having an epoxy group preferably has an aromatic structure. In the case of using two or more allyl-based radically polymerizable compounds having an epoxy group, it is more preferable that at least one has an aromatic structure. The aromatic structure refers to a chemical structure that is generally defined as aromatic and also includes polycyclic aromatics and aromatic heterocycles. The allyl-based radically polymerizable compound having an epoxy group preferably has a bisphenol structure. Examples of the bisphenol structure include bisphenol A type, bisphenol F type, bisphenol AF type, and the like.

[0274] As the allyl-based radically polymerizable compound having a "carboxylic acid derivative having a cyclic structure", an allyl carboxylate having a cyclic structure is preferable. The cyclic structure may be either a cyclic group containing an alicyclic structure or a cyclic group containing an aromatic ring structure. In addition, for the cyclic group, a ring skeleton can be formed using heteroatoms in addition to carbon atoms. Examples of the heteroatom include an oxygen atom, a sulfur atom, a nitrogen atom, etc., and a nitrogen atom is preferable. The heteroatom may have one or two or more in the above-mentioned ring.

[0275] Examples of the carboxylic acid having a cyclic structure include isocyanuric acid, biphenylcarboxylic acid, phthalic acid, cyclohexanedicarboxylic acid, and the like. Examples of the allyl-based radically polymerizable compound having a "carboxylic acid derivative having a cyclic structure" include allyl isocyanurate, diallyl isocyanurate, triallyl isocyanurate, diallyl biphenylcarboxylate, allyl biphenylcarboxylate, diallyl phthalate, diallyl isophthalate, diallyl terephthalate, allyl cyclohexanedicarboxylate, diallyl cyclohexanedicarboxylate, and the like.

[0276] Allyl-based free-radical polymerizable compounds can be commercially available products. Examples of commercially available products include "MEH-8000H" and "MEH-8005" (allyl-based free-radical polymerizable compounds having a phenol ring) manufactured by Meiwafosis Co., Ltd.; "RE-810NM" (allyl-based free-radical polymerizable compound having an epoxy group) manufactured by Nippon Kayaku Co., Ltd.; "ALP-d" (allyl-based free-radical polymerizable compound having a benzoxazine ring) manufactured by Shikoku Kasei Kogyo Co., Ltd.; "L-DAIC" (allyl-based free-radical polymerizable compound having an isocyanuric acid ring) manufactured by Shikoku Kasei Kogyo Co., Ltd.; "TAIC" (allyl-based free-radical polymerizable compound having an isocyanuric acid ring (triallyl isocyanurate)) manufactured by Nippon Kasei Co., Ltd.; "MDAC" (allyl-based free-radical polymerizable compound having a cyclohexanedicarboxylic acid derivative) manufactured by Osaka Soda Co., Ltd.; "DAD" (diallyl dibenzoate) manufactured by Nisshoku Techno Fine Chemical Co., Ltd.; "Daiso DAP monomer" (diallyl phthalate) manufactured by Osaka Soda Co., Ltd., and the like.

[0277] From the viewpoint of significantly obtaining the desired effects of the present invention, the allyl equivalent of the allyl-based free-radical polymerizable compound is preferably 20 g / eq. to 1000 g / eq., more preferably 50 g / eq. to 500 g / eq., and even more preferably 100 g / eq. to 300 g / eq. The allyl equivalent is the mass of the allyl-based free-radical polymerizable compound containing 1 equivalent of allyl.

[0278] The butadiene-based free-radical polymerizable compound refers to a compound having at least 1 butadiene skeleton in the molecule. The polybutadiene structure may be included in the main chain or in the side chain. It should be noted that the polybutadiene structure may be partially or completely hydrogenated. As the butadiene-based free-radical polymerizable compound, it is more preferably at least one resin selected from resins containing a hydrogenated polybutadiene skeleton, butadiene resins containing a hydroxyl group, butadiene resins containing a phenolic hydroxyl group, butadiene resins containing a carboxyl group, butadiene resins containing an acid anhydride group, butadiene resins containing an epoxy group, butadiene resins containing an isocyanate group, and butadiene resins containing a urethane group.

[0279] Specific examples of the butadiene-based free-radical polymerizable compound include "JP-100" manufactured by Nippon Soda Co., Ltd., "Ricon100", "Ricon150", "Ricon130MA8", "Ricon130MA13", "Ricon130MA20", "Ricon131MA5", "Ricon131MA10", "Ricon131MA17", "Ricon131MA20", "Ricon184MA6", etc. manufactured by CRAY VALLEY Co., Ltd.

[0280] The butadiene-based free-radical polymerizable compound is preferably liquid or semi-solid. The determination of liquid or semi-solid is as described above.

[0281] The benzocyclobutene-based free-radical polymerizable compound is a compound having a benzocyclobutene ring. The benzocyclobutene ring may be included in the main chain or in the side chain. Specific examples of the benzocyclobutene-based free-radical polymerizable compound include "CYCLOTENE 3022" manufactured by The Dow Chemical Company, etc.

[0282] Regarding the content of the component (B), from the viewpoints of suppressing unevenness generated on the cured substrate and obtaining a cured product having excellent dielectric properties, peel strength, and elongation at break, when the non-volatile components in the resin composition are set to 100% by mass, the content of the component (B) is preferably 1% by mass or more, more preferably 5% by mass or more, still more preferably 10% by mass or more, preferably 40% by mass or less, more preferably 35% by mass or less, and still more preferably 30% by mass or less.

[0283] When the content of the component (A) when the non-volatile components in the resin composition are set to 100% by mass is set as a, and the content of the component (B) when the non-volatile components in the resin composition are set to 100% by mass is set as b, a / b is preferably 0.05 or more, more preferably 0.1 or more, still more preferably 0.15 or more, preferably 3 or less, more preferably 2 or less, and still more preferably 1.5 or less. By adjusting a / b to be within the above range, the effects of the present invention can be significantly obtained.

[0284] <(C) Inorganic filler>

[0285] In the resin composition, in addition to containing the above components, as an optional component, an inorganic filler as the component (C) may also be contained.

[0286] As the material used as the inorganic filler, an inorganic compound is used. Examples of the material used as the inorganic filler include silica, alumina, glass, cordierite, silicon oxide, barium sulfate, barium carbonate, talc, clay, mica powder, zinc oxide, hydrotalcite, boehmite, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, magnesium oxide, boron nitride, aluminum nitride, manganese nitride, aluminum borate, strontium carbonate, strontium titanate, calcium titanate, magnesium titanate, bismuth titanate, titanium oxide, zirconium oxide, barium titanate, barium zirconate titanate, barium zirconate, calcium zirconate, zirconium phosphate, and zirconium phosphotungstate. Among them, silica is particularly preferred. Examples of silica include amorphous silica, fused silica, crystalline silica, synthetic silica, hollow silica, etc. In addition, as silica, spherical silica is preferably used. (C) The inorganic filler may be used alone or in combination of two or more.

[0287] Examples of commercially available products of the component (C) include "UFP-30" manufactured by Denka Co., Ltd.; "SP60-05" and "SP507-05" manufactured by Nippon Steel & Sumikin Materials Co., Ltd.; "YC100C", "YA050C", "YA050C-MJE", and "YA010C" manufactured by Admatechs Co., Ltd.; "Silfil(シルフィル)NSS-3N", "SilfilNSS-4N", and "Silfil NSS-5N" manufactured by Tokuyama Corporation; "SC2500SQ", "SO-C4", "SO-C2", and "SO-C1" manufactured by Admatechs Co., Ltd.; etc.

[0288] As the specific surface area of the component (C), it is preferably 1 m 2 / g or more, more preferably 2 m 2 / g or more, particularly preferably 3 m 2 / g or more. There is no particular limitation on the upper limit, and it is preferably 60 m 2 / g or less, 50 m 2 / g or less, or 40 m 2 / g or less. The specific surface area can be obtained by adsorbing nitrogen on the surface of the sample using a specific surface area measuring device (Macsorb HM-1210 manufactured by Mountech Co., Ltd.) according to the BET method and calculating the specific surface area by the BET multipoint method.

[0289] From the viewpoint of significantly obtaining the desired effects of the present invention, the average particle diameter of the component (C) is preferably 0.01 μm or more, more preferably 0.05 μm or more, particularly preferably 0.1 μm or more, preferably 5 μm or less, more preferably 2 μm or less, and further preferably 1 μm or less.

[0290] (C) The average particle diameter of the component can be measured by the laser diffraction scattering method based on the Mie scattering theory. Specifically, the particle diameter distribution of the inorganic filler can be made on a volume basis by a laser diffraction scattering type particle diameter distribution measuring device, and the median particle diameter thereof can be used as the average particle diameter for measurement. As the measurement sample, a sample obtained by weighing 100 mg of the inorganic filler and 10 g of methyl ethyl ketone into a test tube and dispersing them ultrasonically for 10 minutes can be used. For the measurement sample, a laser diffraction type particle diameter distribution measuring device can be used. The light source wavelengths used are set to blue and red, and the particle diameter distribution on a volume basis of the (C) component is measured in a flow cell manner, and the average particle diameter is calculated as the median particle diameter from the obtained particle diameter distribution. As the laser diffraction type particle diameter distribution measuring device, for example, "LA-960" manufactured by Horiba, Ltd. can be mentioned.

[0291] From the viewpoint of improving moisture resistance and dispersibility, it is preferable that the (C) component is treated with a surface treatment agent. As the surface treatment agent, for example, vinyl silane-based coupling agents, (meth)acrylic acid-based coupling agents, fluorine-containing silane coupling agents, amino silane-based coupling agents, epoxy group-containing silane coupling agents, mercapto silane-based coupling agents, silane-based coupling agents, alkoxysilanes, organosilazane compounds, titanate-based coupling agents, etc. can be mentioned. Among them, from the viewpoint of significantly obtaining the effects of the present invention, vinyl silane-based coupling agents, (meth)acrylic acid-based coupling agents, and amino silane-based coupling agents are preferable. In addition, the surface treatment agent can be used alone or two or more kinds can be used in any combination.

[0292] As commercially available products of the surface treatment agent, for example, "KBM1003" (vinyltriethoxysilane) manufactured by Shin-Etsu Chemical Co., Ltd., "KBM503" (3-methacryloxypropyltriethoxysilane) manufactured by Shin-Etsu Chemical Co., Ltd., "KBM403" (3-glycidoxypropyltrimethoxysilane) manufactured by Shin-Etsu Chemical Co., Ltd., "KBM803" (3-mercaptopropyltrimethoxysilane) manufactured by Shin-Etsu Chemical Co., Ltd., "KBE903" (3-aminopropyltriethoxysilane) manufactured by Shin-Etsu Chemical Co., Ltd., "KBM573" (N-phenyl-3-aminopropyltrimethoxysilane) manufactured by Shin-Etsu Chemical Co., Ltd., "SZ-31" (hexamethyldisilazane) manufactured by Shin-Etsu Chemical Co., Ltd., "KBM103" (phenyltrimethoxysilane) manufactured by Shin-Etsu Chemical Co., Ltd., "KBM-4803" (long-chain epoxy type silane coupling agent) manufactured by Shin-Etsu Chemical Co., Ltd., "KBM-7103" (3,3,3-trifluoropropyltrimethoxysilane) manufactured by Shin-Etsu Chemical Co., Ltd., etc. can be mentioned.

[0293] From the viewpoint of improving the dispersibility of the inorganic filler, the degree of surface treatment with the surface treatment agent is preferably within a specified range. Specifically, 100 parts by mass of the inorganic filler is preferably surface-treated with 0.2 to 5 parts by mass of the surface treatment agent, more preferably surface-treated with 0.2 to 3 parts by mass of the surface treatment agent, and still more preferably surface-treated with 0.3 to 2 parts by mass of the surface treatment agent.

[0294] The degree of surface treatment with the surface treatment agent can be evaluated by the carbon amount per unit surface area of the inorganic filler. From the viewpoint of improving the dispersibility of the inorganic filler, the carbon amount per unit surface area of the inorganic filler is preferably 0.02 mg / m 2 or more, more preferably 0.1 mg / m 2 or more, and still more preferably 0.2 mg / m 2 or more. On the other hand, from the viewpoint of suppressing an increase in the melt viscosity of the resin varnish and the melt viscosity in the sheet form, it is preferably 1 mg / m 2 or less, more preferably 0.8 mg / m 2 or less, and still more preferably 0.5 mg / m 2 or less.

[0295] The carbon amount per unit surface area of the inorganic filler can be measured after the surface-treated inorganic filler is washed with a solvent (e.g., methyl ethyl ketone (MEK)). Specifically, a sufficient amount of MEK as a solvent is added to the inorganic filler surface-treated with the surface treatment agent, and ultrasonic cleaning is performed at 25°C for 5 minutes. After removing the supernatant and drying the solid component, the carbon amount per unit surface area of the inorganic filler can be measured using a carbon analyzer. As the carbon analyzer, “EMIA-320V” manufactured by Horiba, Ltd. can be used.

[0296] From the viewpoint of reducing the dielectric properties, when the non-volatile component in the resin composition is 100% by mass, the content of the component (C) is preferably 50% by mass or more, more preferably 53% by mass or more, still more preferably 55% by mass or more, preferably 90% by mass or less, more preferably 80% by mass or less, and still more preferably 70% by mass or less.

[0297] <(D) Thermoplastic resin>

[0298] In the resin composition, in addition to containing the above components, as an optional component, a thermoplastic resin as component (D) may be contained. However, substances belonging to component (B) are excluded. By containing component (D) in the resin composition, the stress of the resin composition can be relaxed, and as a result, a cured product having excellent dielectric properties can be obtained. Component (D) can be used alone or two or more thereof can be used in combination.

[0299] From the viewpoint of obtaining a cured product having excellent dielectric properties, the weight-average molecular weight (Mn) of component (D) is preferably 5000 or more, more preferably 8000 or more, particularly preferably 10000 or more, preferably 100000 or less, more preferably 80000 or less, and particularly preferably 50000 or less. The weight-average molecular weight of component (D) is the weight-average molecular weight in terms of polystyrene measured by gel permeation chromatography (GPC) method.

[0300] As component (D), a component having a high molecular weight in terms of weight-average molecular weight can be used. As such a component, for example, thermoplastic resins such as polyimide resin, polycarbonate resin, phenoxy resin, polyvinyl acetal resin, polyolefin resin, polyamideimide resin, polyetherimide resin, polysulfone resin, polyethersulfone resin, polyetheretherketone resin, polystyrene resin, polyester resin, and bisphenol ether resin can be mentioned. Among them, as component (D), from the viewpoint of obtaining a cured product having excellent dielectric properties, it is preferably at least one selected from polyimide resin, polycarbonate resin, phenoxy resin, and bisphenol ether resin.

[0301] As the polyimide resin, a resin having an imide structure can be used. The polyimide resin generally contains a substance obtained by an imidization reaction of a diamine compound and an acid anhydride.

[0302] The diamine compound used for preparing the polyimide resin is not particularly limited, and examples thereof include aliphatic diamine compounds and aromatic diamine compounds.

[0303] As the aliphatic diamine compound, for example, linear aliphatic diamine compounds such as 1,2-ethylenediamine, 1,2-diaminopropane, 1,3-diaminopropane, 1,4-diaminobutane, 1,6-hexanediamine, 1,5-diaminopentane, and 1,10-diaminodecane; branched aliphatic diamine compounds such as 1,2-diamino-2-methylpropane, 2,3-diamino-2,3-butane, and 2-methyl-1,5-diaminopentane; alicyclic diamine compounds such as 1,3-bis(aminomethyl)cyclohexane, 1,4-bis(aminomethyl)cyclohexane, 1,4-diaminocyclohexane, and 4,4'-methylenebis(cyclohexylamine); and dimer acid type diamines (hereinafter also referred to as "dimer diamines"). The so-called dimer acid type diamine means that the two terminal carboxylic acid groups (-COOH) of the dimer acid are replaced by aminomethyl (-CH2 -NH 2 ) or amino group (-NH 2 )-substituted diamine compound. The dimer acid is a known compound obtained by dimerizing unsaturated fatty acids (preferably unsaturated fatty acids having 11 to 22 carbon atoms, particularly preferably unsaturated fatty acids having 18 carbon atoms), and its industrial manufacturing process has been roughly standardized in the industry.

[0304] Examples of the aromatic diamine compound include, for example, phenylenediamine compounds, naphthalenediamine compounds, diphenylamine compounds, and the like.

[0305] The so-called phenylenediamine compound refers to a compound formed by a benzene ring having two amino groups. Further, the benzene ring here may optionally have 1 to 3 substituents. The substituents here are not particularly limited. Specifically, examples of the phenylenediamine compound include 1,4-phenylenediamine, 1,2-phenylenediamine, 1,3-phenylenediamine, 2,4-diaminotoluene, 2,6-diaminotoluene, 3,5-diaminobiphenyl, 2,4,5,6-tetrafluoro-1,3-phenylenediamine, and the like.

[0306] The so-called naphthalenediamine compound refers to a compound formed by a naphthalene ring having two amino groups. Further, the naphthalene ring here may optionally have 1 to 3 substituents. The substituents here are not particularly limited. Specifically, examples of the naphthalenediamine compound include 1,5-diaminonaphthalene, 1,8-diaminonaphthalene, 2,6-diaminonaphthalene, 2,3-diaminonaphthalene, and the like.

[0307] The so-called diphenylamine compound refers to a compound containing two aniline structures in the molecule. Further, the two benzene rings in the two aniline structures may each further optionally have 1 to 3 substituents. The substituents here are not particularly limited. The two aniline structures in the diphenylamine compound may be directly bonded and / or bonded via one or two linker structures having 1 to 100 backbone atoms selected from carbon atoms, oxygen atoms, sulfur atoms, and nitrogen atoms. The diphenylamine compound also includes a compound in which the two aniline structures are bonded by two bonds.

[0308] Specific examples of the "linker structure" in the diphenylamine compound include -NHCO-, -CONH-, -OCO-, -COO-, -CH 2 -, -CH 2 CH 2 -, -CH 2 CH 2 CH 2 -, -CH 2 CH 2 CH 2 CH 2 -, -CH 2 CH2 CH 2 CH 2 CH 2 -, -CH(CH 3 )-, -C(CH 3 ) 2 -, -C(CF 3 ) 2 -, -CH=CH-, -O-, -S-, -CO-, -SO 2 -, -NH-, -Ph-, -Ph-Ph-, -C(CH 3 ) 2 -Ph-C(CH 3 ) 2 -, -O-Ph-O-, -O-Ph-Ph-O-, -O-Ph-SO 2 -Ph-O-, -O-Ph-C(CH 3 ) 2 -Ph-O-, -C(CH 3 ) 2 -Ph-C(CH 3 ) 2 -.

[0309] Examples also include

[0310] [Chemical Formula 31]

[0311] etc.

[0312] In this specification, "Ph" represents 1,4-phenylene, 1,3-phenylene or 1,2-phenylene.

[0313] In one embodiment, as the diphenylamine compound, specifically, 4,4'-diamino-2,2'-bis(trifluoromethyl)-1,1'-biphenyl, 3,4'-diaminodiphenyl ether, 4,4'-diaminodiphenyl ether, 3,3'-diaminodiphenyl sulfone, 4,4'-diaminodiphenyl sulfone, 4,4'-diaminodiphenyl sulfide, 4-aminobenzoic acid 4-aminophenyl ester, 1,3-bis(3-aminophenoxy)benzene, 1,3-bis(4-aminophenoxy)benzene, 1,4-bis(4-aminophenoxy)benzene, 2,2-bis(4-aminophenyl)propane, 4,4'-(hexafluoroisopropylidene)diphenylamine, 2,2-bis[4-(4-aminophenoxy)phenyl]propane, 2,2-bis[4-(4-aminophenoxy)phenyl]hexafluoropropane, α,α-bis[4-(4-aminophenoxy)phenyl]-1,3-diisopropylbenzene, α,α-bis[4-(4-aminophenoxy)phenyl]-1,4-diisopropylbenzene, 4,4'-(9-fluorenylidene)diphenylamine, 2,2-bis(3-methyl-4-aminophenyl)propane, 2,2-bis(3-methyl-4-aminophenyl)benzene, 4,4'-diamino-3,3'-dimethyl-1,1'-biphenyl, 4,4'-diamino-2,2'-dimethyl-1,1'-biphenyl, 9,9'-bis(3-methyl-4-aminophenyl)fluorene, 5-(4-aminophenoxy)-3-[4-(4-aminophenoxy)phenyl]-1,1,3-trimethylindane, etc. can be mentioned.

[0314] For the diamine compound, a commercially available diamine compound can be used, or a diamine compound synthesized by a known method can be used. The diamine compound can be used alone or in combination of two or more.

[0315] The acid anhydride used for preparing the polyimide resin is not particularly limited. In a preferred embodiment, there is an aromatic tetracarboxylic dianhydride. As the aromatic tetracarboxylic dianhydride, for example, pyromellitic dianhydride, naphthalenetetracarboxylic dianhydride, anthracenetetracarboxylic dianhydride, diphthalic dianhydride, etc. can be mentioned, and diphthalic dianhydride is preferably used.

[0316] Pyromellitic dianhydride means the dianhydride of benzene having 4 carboxyl groups. Further, the benzene ring here can arbitrarily have 1 to 3 substituents. Here, as the substituent, it is preferably selected from a halogen atom, a cyano group, and a group of -X 330 -R 330 (the same as the definition of the following formula (1D)). As pyromellitic dianhydride, specifically, pyromellitic dianhydride, 1,2,3,4-benzenetetracarboxylic dianhydride, etc. can be mentioned.

[0317] The so-called naphthalene tetracarboxylic dianhydride refers to the dianhydride of naphthalene having 4 carboxyl groups. Furthermore, the naphthalene ring here may optionally have 1 to 3 substituents. Here, as the substituent, it is preferably selected from a halogen atom, a cyano group, and -X 330 -R 330 (same as the definition in the following formula (1D)). Specifically, as the naphthalene tetracarboxylic dianhydride, 1,4,5,8-naphthalene tetracarboxylic dianhydride, 2,3,6,7-naphthalene tetracarboxylic dianhydride, etc. can be cited.

[0318] The so-called anthracene tetracarboxylic dianhydride refers to the dianhydride of anthracene having 4 carboxyl groups. Furthermore, the anthracene ring here may optionally have 1 to 3 substituents. Here, as the substituent, it is preferably selected from a halogen atom, a cyano group, and -X 330 -R 330 (same as the definition in the following formula (1D)). Specifically, as the anthracene tetracarboxylic dianhydride, 2,3,6,7-anthracene tetracarboxylic dianhydride, etc. can be cited.

[0319] The so-called bisphthalic dianhydride refers to a compound containing 2 phthalic anhydrides in the molecule. Furthermore, the 2 benzene rings in the 2 phthalic anhydrides may each optionally have 1 to 3 substituents. Here, as the substituent, it is preferably selected from a halogen atom, a cyano group, and -X 330 -R 330 (same as the definition in the following formula (1D)). The 2 phthalic anhydrides in the bisphthalic dianhydride may be directly bonded or bonded via a linking group structure having 1 to 100 backbone atoms selected from carbon atoms, oxygen atoms, sulfur atoms, and nitrogen atoms.

[0320] As the bisphthalic dianhydride, for example, the compound represented by the formula (1D) can be cited.

[0321] [Chemical formula 32]

[0322]

[0323] [In the formula,

[0324] R 201 and R 202 each independently represent a halogen atom, a cyano group, a nitro group, or -X 330 -R 330 ,

[0325] X 330 each independently represent a single bond, -NR 330 '-,-O-,-S-,-CO-,-SO 2 -,-NR 330 'CO-,-CONR 330 '-,-OCO-, or -COO-,

[0326] R 330 each independently represents a substituted or unsubstituted alkyl group, or a substituted or unsubstituted alkenyl group

[0327] R 330 ' each independently represents a hydrogen atom, a substituted or unsubstituted alkyl group, or a substituted or unsubstituted alkenyl group

[0328] Y 1 represents a single bond, or a linking group structure having 1 to 100 backbone atoms selected from carbon atoms, oxygen atoms, sulfur atoms, and nitrogen atoms

[0329] n10 and n11 each independently represent an integer from 0 to 3.

[0330] Y 1 preferably has a linking group structure having 1 to 100 backbone atoms selected from carbon atoms, oxygen atoms, sulfur atoms, and nitrogen atoms. n10 and n11 are preferably 0.

[0331] Y 1 in which the "linking group structure" has 1 to 100 backbone atoms selected from carbon atoms, oxygen atoms, sulfur atoms, and nitrogen atoms. The "linking group structure" is preferably -[A1-Ph] a10 -A1-[Ph-A1] b10 - [wherein, A1 each independently represents a single bond, -(substituted or unsubstituted alkylene)-, -O-, -S-, -CO-, -SO 2 -, -CONH-, -NHCO-, -COO-, or -OCO-, and a10 and b10 each independently represent an integer from 0 to 2 (preferably 0 or 1).] represents a divalent group.

[0332] Y 1 in which the "linking group structure", specifically, examples include -CH 2 -, -CH 2 CH 2 -, -CH 2 CH 2 CH 2 -, -CH 2 CH 2 CH 2 CH 2 -, -CH 2 CH 2 CH 2 CH 2 CH 2 -, -CH(CH 3 )-, -C(CH 3 ) 2 -, -O-, -CO-, -SO2 -, -Ph-, -O-Ph-O-, -O-Ph-SO 2 -Ph-O-, -O-Ph-C(CH 3 ) 2 -Ph-O- etc. In this specification, "Ph" represents 1,4-phenylene, 1,3-phenylene or 1,2-phenylene.

[0333] As the bisphthalic anhydride, specifically, 4,4'-oxybisphthalic anhydride, 3,3',4,4'-benzophenonetetracarboxylic dianhydride, 3,3',4,4'-diphenylethertetracarboxylic dianhydride, 3,3',4,4'-diphenylsulfonetetracarboxylic dianhydride, 3,3',4,4'-biphenyltetracarboxylic dianhydride, 2,2',3,3'-biphenyltetracarboxylic dianhydride, 2,3,3',4'-biphenyltetracarboxylic dianhydride, 2,3,3',4'-benzophenonetetracarboxylic dianhydride, 2,3,3',4'-diphenylethertetracarboxylic dianhydride, 2,3,3',4'-diphenylsulfonetetracarboxylic dianhydride, 2,2'-bis(3,4-dicarboxyphenoxyphenyl)sulfone dianhydride, methylene-4,4'-bisphthalic anhydride, 1,1-ethynylidene-4,4'-bisphthalic anhydride, 2,2-propylidene-4,4'-bisphthalic anhydride, 1,2-ethylene-4,4'-bisphthalic anhydride, 1,3-trimethylene-4,4'-bisphthalic anhydride, 1,4-tetramethylene-4,4'-bisphthalic anhydride, 1,5-pentamethylene-4,4'-bisphthalic anhydride, 1,3-bis(3,4-dicarboxyphenyl)benzene dianhydride, 1,4-bis(3,4-dicarboxyphenyl)benzene dianhydride, 1,3-bis(3,4-dicarboxyphenoxy)benzene dianhydride, 1,4-bis(3,4-dicarboxyphenoxy)benzene dianhydride, 2,2-bis(2,3-dicarboxyphenyl)propane dianhydride, 2,2-bis(3,4-dicarboxyphenyl)propane dianhydride, 4,4'-(4,4'-isopropylidenediphenoxy)bisphthalic anhydride, etc.

[0334] The acid anhydride can be a commercially available acid anhydride, or an acid anhydride synthesized by a known method or a method based thereon can also be used. The acid anhydride can be used alone or in combination of two or more.

[0335] The polyimide resin can be a commercially available product. As the commercially available product, "RIKACOAT SN20" and "RIKACOAT PN20" manufactured by Shin Nippon Rika Co., Ltd. can be mentioned.

[0336] Polycarbonate resin is a resin having a carbonate structure. Examples of such resins include: carbonate resins without reactive groups, carbonate resins containing hydroxyl groups, carbonate resins containing phenolic hydroxyl groups, carbonate resins containing carboxyl groups, carbonate resins containing acid anhydride groups, carbonate resins containing isocyanate groups, carbonate resins containing urethane groups, carbonate resins containing epoxy groups, and the like. Here, the reactive group refers to a functional group such as a hydroxyl group, a phenolic hydroxyl group, a carboxyl group, an acid anhydride group, an isocyanate group, a urethane group, and an epoxy group that can react with other components.

[0337] The carbonate resin can be a commercially available product. Examples of commercially available products include "FPC0220" and "FPC2136" manufactured by Mitsubishi Gas Chemical Company, "T6002" and "T6001" (polycarbonate diol) manufactured by Asahi Kasei Chemicals Corporation, "C-1090", "C-2090", and "C-3090" (polycarbonate diol) manufactured by Kuraray Co., Ltd., and the like.

[0338] Examples of the phenoxy resin include, for example, a phenoxy resin having one or more skeletons selected from a bisphenol A skeleton, a bisphenol F skeleton, a bisphenol S skeleton, a bisphenol acetophenone skeleton, a novolac skeleton, a biphenyl skeleton, a fluorene skeleton, a dicyclopentadiene skeleton, a norbornene skeleton, a naphthalene skeleton, an anthracene skeleton, an adamantane skeleton, a terpene skeleton, and a trimethylcyclohexane skeleton. The terminal of the phenoxy resin can be any functional group such as a phenolic hydroxyl group or an epoxy group. The phenoxy resin is preferably a phenoxy resin having a weight average molecular weight of 30,000 or more.

[0339] Specific examples of the phenoxy resin include "1256" and "4250" (both are phenoxy resins containing a bisphenol A skeleton) manufactured by Mitsubishi Chemical Corporation; "YX8100" (a phenoxy resin containing a bisphenol S skeleton) manufactured by Mitsubishi Chemical Corporation; "YX6954" (a phenoxy resin containing a bisphenol acetophenone skeleton) manufactured by Mitsubishi Chemical Corporation; "FX280" and "FX293" manufactured by Nippon Steel Chemical & Material Co., Ltd.; "YL7500BH30", "YX6954BH30", "YX7553", "YX7553BH30", "YL7769BH30", "YL6794", "YL7213", "YL7290", and "YL7482" manufactured by Mitsubishi Chemical Corporation, and the like.

[0340] A polyamideimide resin is a resin having an amideimide structure. For polyamideimide resins, from the viewpoint of compatibility with other components in the resin composition, it is preferably to use a polyamideimide resin having an alicyclic structure in the molecular structure, a polyamideimide resin having a siloxane structure described in Japanese Patent Laid-Open No. 05-112760, a polyamideimide resin having a sterically hindered branched structure, a polyamideimide resin using an asymmetric monomer as a raw material, a polyamideimide resin having a multi-branched structure, etc.

[0341] Among them, for polyamideimide resins, from the viewpoint of improving the compatibility and dispersibility of the resin varnish by having an isocyanuric acid ring structure, it is more preferable: (i) a polyamideimide resin having an isocyanuric acid ring structure in the molecular structure (that is, a polyamideimide resin having an "isocyanuric acid ring structure" and an "imide skeleton or amide skeleton"), (ii) a polyamideimide resin having an isocyanuric acid ring structure and an alicyclic structure in the molecular structure (that is, a polyamideimide resin having an "isocyanuric acid ring structure", an "alicyclic structure" and an "imide skeleton or amide skeleton"), (iii) a polyamideimide resin having a repeating unit containing an isocyanuric acid ring structure and an alicyclic structure (that is, a polyamideimide resin having a repeating unit containing an "isocyanuric acid ring structure", an "alicyclic structure" and an "imide skeleton or amide skeleton").

[0342] As a preferred embodiment of the polyamideimide resins of the above (i) to (iii), examples include: (1) a compound obtained by reacting a polyisocyanate compound containing an isocyanuric acid ring derived from an alicyclic diisocyanate with an acid anhydride of a polycarboxylic acid having 3 or more carboxyl groups, that is, a branched polyamideimide containing a carboxyl group (hereinafter sometimes referred to as this compound as "(Compound D-1)"), (2) a compound obtained by reacting a compound having 1 epoxy group and 1 or more radically polymerizable unsaturated groups with Compound (D-1), that is, a branched polymerizable polyamideimide containing a carboxyl group (hereinafter sometimes referred to as "Compound (D-2)"), or (3) a compound obtained by reacting a compound having 1 hydroxyl group and 1 or more radically polymerizable unsaturated groups with the residual isocyanate groups in the synthesis process of Compound (D-1), that is, a branched polymerizable polyamideimide containing a carboxyl group (hereinafter sometimes referred to as "Compound (D-3)"), etc.

[0343] As Compound (D-1), specifically, a compound represented by the following general formula (I) can be cited. It should be noted that the repeating unit in the compound represented by general formula (I) is set as repeating unit (I-1);

[0344] [Chemical formula 33]

[0345]

[0346] (wherein, w represents 0 to 15).

[0347] As the compound (D-2), a compound (II) having a structure (I-2) obtained by adding GMA (glycidyl methacrylate) to any part of the carboxyl group and / or terminal carboxyl group of the repeating unit (I-1) in the general formula (I) can be cited;

[0348] [Chemical formula 34]

[0349]

[0350] (wherein, R 40 represents the residue in the formula (I)).

[0351] Regarding the proportion of GMA modification of the carboxyl group, the range of adding GMA is preferably 0.3 mol% or more, more preferably 0.5 mol% or more, still more preferably 0.7 mol% or more, or 0.9 mol% or more, relative to the number of moles of the carboxyl group of the compound (D-1). The upper limit is preferably 50 mol% or less, more preferably 40 mol% or less, still more preferably 30 mol% or less, or 20 mol% or less.

[0352] As the compound (D-3), a compound (III) having a structure (I-3) can be cited, wherein the structure (I-3) is a structure formed by adding the hydroxyl group of pentaerythritol triacrylate to any part of the repeating unit (I-1) and / or the terminal imide group in the above formula (I) to form an isocyanate residue;

[0353] [Chemical formula 35]

[0354]

[0355] (wherein, R' represents the residue in the formula (I)).

[0356] The addition amount of pentaerythritol triacrylate is preferably 40 mol% or less, more preferably 38 mol% or less, still more preferably 35 mol% or less, relative to the number of moles (mol) of the isocyanate group of the polyisocyanate at the time of feeding. On the other hand, from the viewpoint of sufficiently obtaining the effect brought by the addition, the addition amount of pentaerythritol triacrylate is preferably 0.3 mol% or more, more preferably 3 mol% or more, still more preferably 5 mol% or more, relative to the number of moles of the isocyanate group of the polyisocyanate at the time of feeding.

[0357] The polyamideimide resin can be synthesized by various known methods. As a method for synthesizing the polyamideimide resin, for example, the description in paragraphs 0020 to 0030 of International Publication No. 2010 / 074197 can be referred to, and this content is incorporated into the present specification.

[0358] Commercially available products can be used as the polyamideimide resin. As commercially available products, for example, modified polyamideimides such as "UNIDIC V-8000" manufactured by DIC Corporation, "VYLOMAX HR11NN" and "VYLOMAX HR16NN" manufactured by Toyobo Co., Ltd., "KS9100" and "KS9300" (polyamideimide containing a polysiloxane skeleton) manufactured by Hitachi Chemical Co., Ltd., etc. can be cited.

[0359] As the polystyrene resin, any elastomer containing a repeating unit (styrene unit) having a structure obtained by polymerizing styrene can be used. In addition, the polystyrene resin may be a copolymer containing, in addition to the styrene unit, any repeating unit different from the aforementioned styrene unit, or a hydrogenated polystyrene resin.

[0360] As the arbitrary repeating unit, for example, a repeating unit having a structure obtained by polymerizing a conjugated diene (conjugated diene unit), a repeating unit having a structure obtained by hydrogenating the same (hydrogenated conjugated diene unit), etc. can be cited. As the conjugated diene, for example, aliphatic conjugated dienes such as butadiene, isoprene, 2,3-dimethylbutadiene, 1,3-pentadiene, 1,3-hexadiene; halogenated aliphatic conjugated dienes such as chloroprene, etc. can be cited. As the conjugated diene, from the viewpoint of significantly obtaining the effects of the present invention, an aliphatic conjugated diene is preferably used, and butadiene is more preferably used. The conjugated diene can be used alone or in combination of two or more. In addition, the polystyrene resin may be a random copolymer or a block copolymer.

[0361] As the polystyrene resin, for example, styrene-butadiene-styrene block copolymer (SBS), styrene-isoprene-styrene block copolymer (SIS), styrene-ethylene-butene-styrene block copolymer (SEBS), styrene-ethylene-propylene-styrene block copolymer (SEPS), styrene-ethylene-ethylene-propylene-styrene block copolymer (SEEPS), styrene-butadiene-butene-styrene block copolymer (SBBS), styrene-butadiene diblock copolymer, hydrogenated styrene-butadiene block copolymer, hydrogenated styrene-isoprene block copolymer, hydrogenated styrene-butadiene random copolymer, styrene-maleic anhydride copolymer, etc. can be cited. Among them, as the polystyrene resin, a styrene-maleic anhydride copolymer is preferably used.

[0362] As specific examples of the polystyrene resin, “EF-40” manufactured by CRAYVALLEY and “H1043” manufactured by Asahi Kasei Corporation can be cited.

[0363] For the polyester resin, from the viewpoint of compatibility with other components in the resin composition, it preferably has a fluorene structure in the molecular structure, and preferably has a structural unit derived from a diol and a structural unit derived from a dicarboxylic acid in addition to the fluorene structure.

[0364] As specific examples of the polyester resin, “OKP4HT” manufactured by Osaka Gas Chemical Co., Ltd. can be cited.

[0365] As specific examples of the polysulfone resin, polysulfones “P1700” and “P3500” manufactured by Solvay Advanced Polymers can be cited.

[0366] As the polyvinyl acetal resin, for example, a polyvinyl formal resin and a polyvinyl butyral resin can be cited, and a polyvinyl butyral resin is preferable. As specific examples of the polyvinyl acetal resin, the S-LECBH series, BX series (for example, BX-5Z), KS series (for example, KS-1), BL series, BM series, etc. manufactured by Sekisui Chemical Co., Ltd. can be cited.

[0367] As specific examples of the polyethersulfone resin, “PES5003P” manufactured by Sumitomo Chemical Co., Ltd. can be cited.

[0368] The bisphenol ether resin is a resin having a bisphenol ether structure. From the viewpoint of significantly obtaining the effects of the present invention, the bisphenol ether resin preferably contains a repeating unit represented by the following formula (D-a);

[0369] [Chemical formula 36]

[0370]

[0371] [In the formula, ring A represents a nitrogen-containing aromatic ring optionally having a substituent; rings B and C each independently represent an aromatic ring optionally having a substituent; X represents a single bond or a divalent non-aromatic group.].

[0372] Ring A represents an optionally substituted nitrogen-containing aromatic ring. An aromatic ring refers to a ring that follows Hückel's rule and has 4n + 2 (n is a natural number) electrons in the π-electron system on the ring. For the nitrogen-containing aromatic ring represented by Ring A, as ring-forming atoms, in addition to having carbon atoms, it has one or more (preferably two or more, particularly preferably two) nitrogen atoms, and may further have heteroatoms other than nitrogen atoms such as oxygen atoms and sulfur atoms. The nitrogen-containing aromatic ring represented by Ring A is preferably a 5- to 14-membered nitrogen-containing aromatic ring, more preferably a 5- to 10-membered nitrogen-containing aromatic ring, still more preferably a 5- or 6-membered nitrogen-containing aromatic ring, and particularly preferably a 6-membered nitrogen-containing aromatic ring. The nitrogen-containing aromatic ring represented by Ring A includes not only monocyclic aromatic rings and condensed rings formed by condensation of two or more monocyclic aromatic rings, but also condensed rings formed by condensation of one or more monocyclic non-aromatic rings on one or more monocyclic aromatic rings.

[0373] As preferred specific examples of the nitrogen-containing aromatic ring represented by Ring A, for example, monocyclic nitrogen-containing aromatic rings such as pyrrole ring, imidazole ring, pyrazole ring, 1,2,3-triazole ring, 1,2,4-triazole ring, tetrazole ring, pyridine ring, pyrazine ring, pyrimidine ring, pyridazine ring, 1,2,3-triazine ring, 1,2,4-triazine ring, 1,3,5-triazine ring; condensed rings of monocyclic nitrogen-containing aromatic rings such as indole ring, isoindole ring, benzimidazole ring, indazole ring, benzotriazole ring, quinoxaline ring, cinnoline ring, quinazoline ring, phthalazine ring and benzene ring; condensed rings of monocyclic nitrogen-containing aromatic rings such as pteridine ring, purine ring, 4-azaindole ring, 5-azaindole ring, 6-azaindole ring, 7-azaindole ring, 7-azaindazole ring, pyrazolo[1,5-a]pyrimidine ring, 1,8-naphthyridine ring, pyrido[3,2-d]pyrimidine ring, pyrido[4,3-d]pyrimidine ring, pyrido[3,4-b]pyrazine ring, pyrido[2,3-b]pyrazine ring, etc. are preferably monocyclic nitrogen-containing aromatic rings, more preferably 6-membered monocyclic nitrogen-containing aromatic rings, still more preferably pyrimidine ring or pyridazine ring, and particularly preferably pyrimidine ring.

[0374] The nitrogen-containing aromatic ring optionally has substituents. There is no particular limitation on the substituents, and examples thereof include monovalent substituents such as alkyl, alkenyl, aryl, alkyl-aryl (aryl substituted with one or more alkyl groups), aryl-aryl (aryl substituted with one or more aryl groups), aryl-alkyl (alkyl substituted with one or more aryl groups), alkyl-oxy, alkenyl-oxy, aryl-oxy, alkyl-carbonyl, alkenyl-carbonyl, aryl-carbonyl, alkyl-oxy-carbonyl, alkenyl-oxy-carbonyl, aryl-oxy-carbonyl, alkyl-carbonyl-oxy, alkenyl-carbonyl-oxy, aryl-carbonyl-oxy, etc. If substitution is possible, divalent substituents such as oxo group (=O) may also be included.

[0375] An alkyl (group) refers to a straight-chain, branched-chain, and / or cyclic monovalent aliphatic saturated hydrocarbon group. The alkyl (group) preferably has 1 to 14 carbon atoms, more preferably 1 to 10 carbon atoms, still more preferably 1 to 6 or 4 to 10 carbon atoms. An alkenyl (group) refers to a straight-chain, branched-chain, and / or cyclic monovalent aliphatic unsaturated hydrocarbon group having at least 1 carbon-carbon double bond. The alkenyl (group) preferably has 2 to 14 carbon atoms, more preferably 2 to 10 carbon atoms, still more preferably 2 to 6 or 4 to 10 carbon atoms. An aryl (group) refers to a monovalent aryl hydrocarbon group. The aryl (group) preferably has 6 to 14 carbon atoms.

[0376] Ring B and Ring C each independently represent an aromatic ring optionally having a substituent. The aromatic ring represented by Ring B or Ring C may be a carbocyclic ring having carbon atoms as ring-forming atoms, or may be a heterocyclic ring having heteroatoms such as oxygen atoms, nitrogen atoms, and sulfur atoms in addition to carbon atoms as ring-forming atoms. In one embodiment, it is preferably a carbocyclic ring. The aromatic ring represented by Ring B or Ring C is preferably an aromatic ring having 5 to 14 members, more preferably an aromatic ring having 5 to 10 members, still more preferably an aromatic ring having 5 or 6 members, and particularly preferably an aromatic ring having 6 members. The aromatic ring represented by Ring B or Ring C includes not only a monocyclic aromatic ring and a condensed ring formed by condensation of two or more monocyclic aromatic rings, but also a condensed ring formed by condensation of one or more monocyclic non-aromatic rings on one or more monocyclic aromatic rings.

[0377] As preferred specific examples of the aromatic ring represented by Ring B or Ring C, there may be mentioned monocyclic aromatic rings such as benzene ring, furan ring, thiophene ring, pyrrole ring, pyrazole ring, oxazole ring, isoxazole ring, thiazole ring, imidazole ring, pyridine ring, pyridazine ring, pyrimidine ring, pyrazine ring, etc.; condensed rings formed by condensation of two or more monocyclic aromatic rings such as naphthalene ring, anthracene ring, benzofuran ring, isobenzofuran ring, indole ring, isoindole ring, benzothiophene ring, benzimidazole ring, indazole ring, benzoxazole ring, benzisoxazole ring, benzothiazole ring, quinoline ring, isoquinoline ring, quinoxaline ring, acridine ring, quinazoline ring, cinnoline ring, phthalazine ring, etc.; condensed rings formed by condensation of one or more monocyclic non-aromatic rings on one or more monocyclic aromatic rings such as indane ring, fluorene ring, tetrahydronaphthalene ring, etc. It is preferably a monocyclic aromatic ring, more preferably a 6-membered monocyclic aromatic ring, and particularly preferably a benzene ring.

[0378] X is a single bond or a divalent non-aromatic hydrocarbon group. The divalent non-aromatic hydrocarbon group represented by X is a saturated or unsaturated straight-chain, branched-chain, and / or cyclic divalent non-aromatic hydrocarbon group. The divalent non-aromatic hydrocarbon group represented by X is, for example, a divalent non-aromatic hydrocarbon group having 1 to 100 carbon atoms, preferably 1 to 50 carbon atoms, more preferably 1 to 30 carbon atoms, still more preferably 1 to 20 carbon atoms.

[0379] X is preferably a divalent non-aromatic hydrocarbon group, more preferably a divalent group represented by formula (X1).

[0380] [Chemical formula 37]

[0381]

[0382] [In the formula, R 1 and R 2 each independently represents a hydrogen atom, an alkyl group or an alkenyl group, or R 1 and R 2 are bonded to each other to form a cycloalkane ring optionally having a group selected from an alkyl group and an alkenyl group, or a cycloalkene ring optionally having a group selected from an alkyl group and an alkenyl group; * represents a bonding site.];

[0383] More preferably, it is a divalent group represented by any one of formulas (X2-1) to (X2-3).

[0384] [Chemical formula 38]

[0385]

[0386] [In the formula, R 3 , R 4 and R 5 each independently represents an alkyl group; x represents an integer of 0 to 5 (preferably 1 to 5, more preferably 2 to 4); * represents a bonding site.];

[0387] Particularly preferably, it is a divalent group represented by formula (X2-1).

[0388] A cycloalkane ring refers to a cyclic aliphatic saturated hydrocarbon ring. The cycloalkane ring is preferably a cycloalkane ring having 3 to 8 carbon atoms, more preferably a cycloalkane ring having 5 or 6 carbon atoms. Examples of the cycloalkane ring include a cyclobutane ring, a cyclopentane ring, a cyclohexane ring, a cycloheptane ring, a cyclooctane ring, etc. A cycloalkene ring refers to a cyclic aliphatic unsaturated hydrocarbon ring having at least one carbon-carbon double bond. The cycloalkene ring is preferably a cycloalkene ring having 4 to 8 carbon atoms, more preferably a cycloalkene ring having 5 or 6 carbon atoms. Examples of the cycloalkene ring include a cyclobutene ring, a cyclopentene ring, a cyclohexene ring, a cycloheptene ring, a cyclooctene ring, a cyclopentadiene ring, a cyclohexadiene ring, etc.

[0389] The compound containing the repeating unit represented by formula (D-a) is preferably a compound containing the repeating unit represented by formula (1A) or (1B).

[0390] [Chemical formula 39]

[0391]

[0392] [In the formula, X 1 , X 2 , X 3 and X 4 each independently represents N, CH or CR a (preferably N or CH), and X1 , X 2 , X 3 and X 4 At least one (preferably at least two, particularly preferably two) of them is N; R a , R b and R c each independently represents a substituent (preferably an alkyl group, an alkenyl group, an aryl group, an alkyl-aryl group, an aryl-aryl group, or an aryl-alkyl group, more preferably an alkyl group, an alkenyl group or an aryl group, particularly preferably an aryl group); b and c each independently represent an integer from 0 to 3 (preferably 0); the other symbols have the same meanings as in formula (X1).];

[0393] Preferably, it is a compound containing a repeating unit represented by any one of formulas (1A-1) to (1B-3).

[0394] [Chemical formula 40]

[0395]

[0396] [In the formula, a represents an integer from 0 to 2 (preferably 0); the other symbols have the same meanings as in formula (1A), formula (1B) and formulas (X2-1) to (X2-3).] Particularly preferably, it is a compound containing a repeating unit represented by formula (1A-1).

[0397] In one embodiment, the compound containing a repeating unit represented by formula (D-a) may have reactive groups such as phenolic hydroxyl groups, thiol groups, amino groups, carboxyl groups, sulfo groups, etc., preferably may have phenolic hydroxyl groups. In one embodiment, the reactive groups preferably have two or more in one molecule.

[0398] In the compound containing a repeating unit represented by formula (D-a), the number of repeating units is preferably 5 or more, more preferably 10 or more, still more preferably 30 or more, particularly preferably 50 or more. The upper limit of the number of repeating units is not particularly limited, and for example, it may be 10000 or less, 5000 or less, 3000 or less, 2000 or less, 1000 or less, etc.

[0399] The glass transition temperature (Tg) of the compound containing a repeating unit represented by formula (D-a) is not particularly limited, preferably 100 to 300 °C, more preferably 150 to 250 °C.

[0400] The compound containing a repeating unit represented by formula (D-a) can be synthesized, for example, by the methods described in WO2019 / 054335 or WO2020 / 021827 or methods according thereto.

[0401] Regarding the content of the component (D), from the viewpoint of obtaining a cured product with excellent dielectric properties, when the non-volatile components in the resin composition are set to 100% by mass, the content of the above-mentioned component (D) is preferably 0.5% by mass or more, more preferably 1% by mass or more, still more preferably 1.5% by mass or more, preferably 10% by mass or less, more preferably 5% by mass or less, and still more preferably 3% by mass or less.

[0402] <(E) Thermosetting resin>

[0403] In the resin composition, in addition to containing the above components, as an optional component, a thermosetting resin may be further contained as the component (E). However, substances belonging to the component (A) and the component (B) are excluded. Examples of the (E) thermosetting resin include, for example, epoxy resins, phenol resins, naphthol resins, benzoxazine resins, active ester resins, cyanate ester resins, carbodiimide resins, amine resins, anhydride resins, etc. The component (E) may be used alone or two or more thereof may be used in any ratio in combination. Hereinafter, resins such as phenol resins, naphthol resins, benzoxazine resins, active ester resins, cyanate ester resins, carbodiimide resins, amine resins, and anhydride resins, which can react with epoxy resins to cure the resin composition, are sometimes collectively referred to as "curing agents".

[0404] Examples of the epoxy resin as the component (E) include, for example: bixylenol type epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, bisphenol AF type epoxy resin, dicyclopentadiene type epoxy resin, triphenol type epoxy resin, naphthol novolac type epoxy resin, phenol novolac type epoxy resin, tert-butyl-catechol type epoxy resin, naphthalene type epoxy resin, naphthol type epoxy resin, anthracene type epoxy resin, glycidylamine type epoxy resin, glycidyl ester type epoxy resin, cresol novolac type epoxy resin, biphenyl type epoxy resin, linear aliphatic epoxy resin, epoxy resin having a butadiene structure, alicyclic epoxy resin, heterocyclic type epoxy resin, epoxy resin containing a spiro ring, cyclohexane type epoxy resin, cyclohexanedimethanol type epoxy resin, naphthyl ether type epoxy resin, trimethylol type epoxy resin, tetraphenylethane type epoxy resin, etc. The epoxy resin may be used alone or two or more thereof may be used in combination.

[0405] In the resin composition, as the component (E), it is preferably an epoxy resin having two or more epoxy groups in one molecule. From the viewpoint of significantly obtaining the desired effects of the present invention, the proportion of the epoxy resin having two or more epoxy groups in one molecule is preferably 50% by mass or more, more preferably 60% by mass or more, and particularly preferably 70% by mass or more, based on 100% by mass of the non-volatile components of the component (E).

[0406] Epoxy resins include epoxy resins that are liquid at 20°C (hereinafter sometimes also referred to as "liquid epoxy resins") and epoxy resins that are solid at 20°C (hereinafter sometimes also referred to as "solid epoxy resins"). In the resin composition, as the component (E), it may contain only a liquid epoxy resin, only a solid epoxy resin, or a combination of a liquid epoxy resin and a solid epoxy resin.

[0407] As the liquid epoxy resin, it is preferably a liquid epoxy resin having two or more epoxy groups in one molecule.

[0408] As the liquid epoxy resin, it is preferably a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, a bisphenol AF type epoxy resin, a naphthalene type epoxy resin, a glycidyl ester type epoxy resin, a glycidyl amine type epoxy resin, a phenol novolac type epoxy resin, an alicyclic epoxy resin having an ester skeleton, a cyclohexane type epoxy resin, a cyclohexanedimethanol type epoxy resin, a glycidyl amine type epoxy resin, and an epoxy resin having a butadiene structure, and more preferably a bisphenol A type epoxy resin and a bisphenol F type epoxy resin.

[0409] As specific examples of the liquid epoxy resin, there can be mentioned "HP4032", "HP4032D", "HP4032SS" (naphthalene-type epoxy resin) manufactured by DIC Corporation; "828US", "jER828EL", "825", "EPIKOTE828EL" (bisphenol A-type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "jER807", "1750" (bisphenol F-type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "jER152" (phenol novolak-type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "630", "630LSD" (glycidylamine-type epoxy resin) manufactured by Nippon Steel Chemical Co., Ltd.; "ZX1059" (a mixture of bisphenol A-type epoxy resin and bisphenol F-type epoxy resin) manufactured by Nippon Steel Chemical Co., Ltd.; "EX-721" (glycidyl ester-type epoxy resin) manufactured by Nagase ChemteX Corporation; "Celloxide 2021P" (alicyclic epoxy resin having an ester skeleton) manufactured by Daicel Corporation; "PB-3600" (epoxy resin having a butadiene structure) manufactured by Daicel Corporation; "ZX1658", "ZX1658GS" (liquid 1,4-glycidylcyclohexane-type epoxy resin) manufactured by Nippon Steel Chemical Co., Ltd., etc. They can be used alone or in combination of two or more.

[0410] As the solid epoxy resin, it is preferably a solid epoxy resin having 3 or more epoxy groups in one molecule, and more preferably an aromatic solid epoxy resin having 3 or more epoxy groups in one molecule.

[0411] As the solid epoxy resin, it is preferably a xylenol-type epoxy resin, a naphthalene-type epoxy resin, a naphthalene-type tetrafunctional epoxy resin, a cresol novolak-type epoxy resin, a dicyclopentadiene-type epoxy resin, a triphenol-type epoxy resin, a naphthol-type epoxy resin, a biphenyl-type epoxy resin, a naphthyl ether-type epoxy resin, an anthracene-type epoxy resin, a bisphenol A-type epoxy resin, a bisphenol AF-type epoxy resin, a tetraphenylethane-type epoxy resin, and more preferably a naphthalene-type epoxy resin.

[0412] As the solid epoxy resin, naphthalene-type tetrafunctional epoxy resins, cresol novolac epoxy resins, dicyclopentadiene-type epoxy resins, triphenol-type epoxy resins, naphthol-type epoxy resins, biphenyl-type epoxy resins, naphthyl ether-type epoxy resins, anthracene-type epoxy resins, bisphenol A-type epoxy resins, and tetraphenylethane-type epoxy resins are preferred, and naphthalene-type tetrafunctional epoxy resins, naphthol-type epoxy resins, and biphenyl-type epoxy resins are more preferred. Specific examples of the solid epoxy resin include: "HP4032H" (naphthalene-type epoxy resin), "HP-4700", "HP-4710" (naphthalene-type tetrafunctional epoxy resin), "N-690" (cresol novolac epoxy resin), "N-695" (cresol novolac epoxy resin), "HP-7200", "HP-7200HH", "HP-7200H" (dicyclopentadiene-type epoxy resin), manufactured by DIC Corporation; "EXA-7311", "EXA-7311-G3", "EXA-7311-G4", "EXA-7311-G4S", "HP6000" (naphthyl ether-type epoxy resin) manufactured by DIC Corporation; "EPPN-502H" (triphenol-type epoxy resin), "NC7000L" (naphthol novolac epoxy resin), "NC3000H", "NC3000", "NC3000L", "NC3100" (biphenyl-type epoxy resin) manufactured by Nippon Kayaku Co., Ltd.; "ESN475V" (naphthalene-type epoxy resin), "ESN485" (naphthol novolac epoxy resin) manufactured by Nippon Steel Chemical & Material Co., Ltd.; "YX4000H", "YL6121" (biphenyl-type epoxy resin), "YX4000HK" (xylenol-type epoxy resin), "YX8800" (anthracene-type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "PG-100", "CG-500" manufactured by Osaka Gas Chemical Co., Ltd.; "YL7760" (bisphenol AF-type epoxy resin), "YL7800" (fluorene-type epoxy resin), "jER1010" (solid bisphenol A-type epoxy resin), "jER1031S" (tetraphenylethane-type epoxy resin), etc. manufactured by Mitsubishi Chemical Corporation. They can be used alone or in combination of two or more.

[0413] When the liquid epoxy resin and the solid epoxy resin are used in combination as the component (E), the ratio of their amounts (liquid epoxy resin: solid epoxy resin) is preferably 1:0.1 to 1:20, more preferably 1:0.3 to 1:15, and particularly preferably 1:0.5 to 1:10 by mass ratio. By setting the ratio of the amounts of the liquid epoxy resin and the solid epoxy resin within the above range, the effects desired in the present invention can be significantly obtained. Furthermore, when it is usually used in the form of an adhesive film, appropriate adhesiveness can be brought about. In addition, when it is usually used in the form of an adhesive film, sufficient flexibility can be obtained, and the workability is improved. Furthermore, a cured product having sufficient fracture strength can usually be obtained.

[0414] The epoxy equivalent of the epoxy resin as the (E) component is preferably 50 g / eq. to 5000 g / eq., more preferably 50 g / eq. to 3000 g / eq., still more preferably 80 g / eq. to 2000 g / eq., and even more preferably 110 g / eq. to 1000 g / eq. By being in this range, a cured body with sufficient crosslinking density of the cured product of the resin composition can be obtained. The epoxy equivalent is the mass of the epoxy resin containing 1 equivalent of epoxy groups. This epoxy equivalent can be measured according to JIS K7236.

[0415] From the viewpoint of significantly obtaining the desired effects of the present invention, the weight average molecular weight (Mw) of the epoxy resin as the (E) component is preferably 100 to 5000, more preferably 250 to 3000, and still more preferably 400 to 1500. The weight average molecular weight of the epoxy resin is the weight average molecular weight in terms of polystyrene measured by gel permeation chromatography (GPC) method.

[0416] From the viewpoint of obtaining a cured body showing good mechanical strength and insulation reliability, when the non-volatile components in the resin composition are set to 100% by mass, the content of the epoxy resin as the (E) component is preferably 5% by mass or more, more preferably 10% by mass or more, and still more preferably 15% by mass or more. From the viewpoint of significantly obtaining the desired effects of the present invention, the upper limit of the content of the epoxy resin is preferably 25% by mass or less, more preferably 20% by mass or less, and particularly preferably 15% by mass or less.

[0417] As the active ester resin as the (E) component, a resin having one or more active ester groups in one molecule can be used. Among them, as the active ester resin, preferably resins such as phenolic esters, thiophenolic esters, N-hydroxyamine esters, esters of heterocyclic hydroxy compounds, etc., which have two or more highly reactive ester groups in one molecule. This active ester resin is preferably a resin obtained by a condensation reaction of a carboxylic acid compound and / or a thiocarboxylic acid compound with a hydroxy compound and / or a thiol compound. In particular, from the viewpoint of improving heat resistance, preferably an active ester resin obtained from a carboxylic acid compound and a hydroxy compound, and more preferably an active ester resin obtained from a carboxylic acid compound and a phenol compound and / or a naphthol compound.

[0418] Examples of the carboxylic acid compound include benzoic acid, acetic acid, succinic acid, maleic acid, itaconic acid, phthalic acid, isophthalic acid, terephthalic acid, pyromellitic acid, etc.

[0419] Examples of the phenol compound or naphthol compound include hydroquinone, resorcinol, bisphenol A, bisphenol F, bisphenol S, phenolphthalin, methylated bisphenol A, methylated bisphenol F, methylated bisphenol S, phenol, o-cresol, m-cresol, p-cresol, catechol, α-naphthol, β-naphthol, 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 2,6-dihydroxynaphthalene, dihydroxybenzophenone, trihydroxybenzophenone, tetrahydroxybenzophenone, phloroglucinol, pyrogallol, dicyclopentadiene-type diphenol compound, phenol novolac resin, etc. Herein, the "dicyclopentadiene-type diphenol compound" refers to a diphenol compound obtained by condensing 2 molecules of phenol with 1 molecule of dicyclopentadiene.

[0420] Preferred specific examples of the active ester resin include: an active ester resin containing a dicyclopentadiene-type diphenol structure, an active ester resin containing a naphthalene structure, an active ester resin containing an acetylated product of phenol novolac, and an active ester resin containing a benzoylated product of phenol novolac. Among them, an active ester resin containing a naphthalene structure and an active ester resin containing a dicyclopentadiene-type diphenol structure are better. The "dicyclopentadiene-type diphenol structure" represents a divalent structural unit formed by phenylene-dicyclopentylene-phenylene.

[0421] Examples of commercially available products of the active ester resin include, for example, as the active ester resin containing a dicyclopentadiene-type diphenol structure, there are "EXB9451", "EXB9460", "EXB9460S", "HPC-8000-65T", "HPC-8000H-65TM", "EXB-8000L-65TM" (manufactured by DIC Corporation); as the active ester resin containing a naphthalene structure, there are "EXB9416-70BK", "EXB-8100L-65T", "EXB-8150L-65T", "EXB-8150-65T", "HPC-8150-60T", "HPC-8150-62T" (manufactured by DIC Corporation); as the active ester resin containing an acetylated product of phenol novolac, there is "DC808" (manufactured by Mitsubishi Chemical Corporation); as the active ester resin containing a benzoylated product of phenol novolac, there is "YLH1026" (manufactured by Mitsubishi Chemical Corporation); as the active ester resin that is an acetylated product of phenol novolac, there is "DC808" (manufactured by Mitsubishi Chemical Corporation); as the active ester resin that is a benzoylated product of phenol novolac, there are "YLH1026" (manufactured by Mitsubishi Chemical Corporation), "YLH1030" (manufactured by Mitsubishi Chemical Corporation), "YLH1048" (manufactured by Mitsubishi Chemical Corporation); "EXB-8500-65T" (manufactured by DIC Corporation); and so on.

[0422] From the viewpoints of heat resistance and water resistance, the phenol-based resin and naphthol-based resin as the component (E) are preferably resins having a novolac structure. Further, from the viewpoint of adhesion to the conductor layer, a nitrogen-containing phenol-based curing agent is preferable, and a phenol-based resin having a triazine skeleton is more preferable.

[0423] Specific examples of the phenol-based resin and naphthol-based resin include, for example, "MEH-7700", "MEH-7810", "MEH-7851" manufactured by Meiwafosis Co., Ltd.; "NHN", "CBN", "GPH" manufactured by Nippon Kayaku Co., Ltd.; "SN170", "SN180", "SN190", "SN475", "SN485", "SN495", "SN495V", "SN375", "SN395" manufactured by Nippon Steel Chemical & Material Co., Ltd.; "TD-2090", "LA-7052", "LA-7054", "LA-1356", "LA-3018-50P", "EXB-9500", etc. manufactured by DIC Corporation.

[0424] Specific examples of the benzoxazine-based resin as the component (b) include: "JBZ-OD100" (benzoxazine ring equivalent: 218), "JBZ-OP100D" (benzoxazine ring equivalent: 218), "ODA-BOZ" (benzoxazine ring equivalent: 218) manufactured by JFE Chemical Corporation; "P-d" (benzoxazine ring equivalent: 217), "F-a" (benzoxazine ring equivalent: 217) manufactured by Shikoku Kasei Kogyo Co., Ltd.; "HFB2006M" (benzoxazine ring equivalent: 432) manufactured by Showa Highpolymer Co., Ltd.

[0425] Examples of the cyanate ester resin as the component (E) include, for example, difunctional cyanate ester resins such as bisphenol A dicyanate, polyphenol cyanate, oligomeric (3-methylen-1,5-phenylene cyanate), 4,4'-methylenebis(2,6-dimethylphenyl cyanate), 4,4'-ethylenediphenyl dicyanate, hexafluorobisphenol A dicyanate, 2,2-bis(4-cyanatephenyl)propane, 1,1-bis(4-cyanatephenyl)methane, bis(4-cyanate-3,5-dimethylphenyl)methane, 1,3-bis(4-cyanatephenyl-1-(methylethylene))benzene, bis(4-cyanatephenyl) sulfide, and bis(4-cyanatephenyl) ether; polyfunctional cyanate ester resins derived from phenol novolac and cresol novolac; prepolymers obtained by partially triazine-forming these cyanate ester resins; and the like. Specific examples of the cyanate ester resin include "PT30", "PT30S", and "PT60" (phenol novolac type polyfunctional cyanate ester resins), "ULL-950S" (polyfunctional cyanate ester resin), "BA230", "BA230S75" (prepolymer obtained by forming a trimer by triazine-forming a part or all of bisphenol A dicyanate), etc. manufactured by Lonza Japan Co., Ltd.

[0426] Specific examples of the carbodiimide resin as the component (E) include CARBODILITE (registered trademark) V-03 (carbodiimide equivalent: 216), V-05 (carbodiimide equivalent: 216), V-07 (carbodiimide equivalent: 200); V-09 (carbodiimide equivalent: 200) manufactured by Nisshinbo Chemical Inc.; and Stabaxol (registered trademark) P (carbodiimide equivalent: 302) manufactured by Rhein Chemie.

[0427] As the amine-based resin as the component (E), resins having one or more amino groups in one molecule can be cited. Examples include aliphatic amines, polyether amines, alicyclic amines, aromatic amines, etc. Among them, from the viewpoint of achieving the desired effects of the present invention, aromatic amines are preferably used. The amine-based resin is preferably a primary amine or a secondary amine, and more preferably a primary amine. Specific examples of the amine-based resin include: 4,4'-methylenebis(2,6-dimethylaniline), diphenylsulfone diamine, 4,4'-diaminodiphenylmethane, 4,4'-diaminodiphenylsulfone, 3,3'-diaminodiphenylsulfone, m-phenylenediamine, m-xylylenediamine, diethyltoluenediamine, 4,4'-diaminodiphenyl ether, 3,3'-dimethyl-4,4'-diaminobiphenyl, 2,2'-dimethyl-4,4'-diaminobiphenyl, 3,3'-dihydroxybenzidine, 2,2-bis(3-amino-4-hydroxyphenyl)propane, 3,3-dimethyl-5,5-diethyl-4,4-diphenylmethanediamine, 2,2-bis(4-aminophenyl)propane, 2,2-bis(4-(4-aminophenoxy)phenyl)propane, 1,3-bis(3-aminophenoxy)benzene, 1,3-bis(4-aminophenoxy)benzene, 1,4-bis(4-aminophenoxy)benzene, 4,4'-bis(4-aminophenoxy)biphenyl, bis(4-(4-aminophenoxy)phenyl)sulfone, bis(4-(3-aminophenoxy)phenyl)sulfone, etc. Commercially available products of the amine-based resin can be used, and examples include "KAYABOND C-200S", "KAYABOND C-100", "KAYAHARD A-A", "KAYAHARD A-B", "KAYAHARD A-S" manufactured by Nippon Kayaku Co., Ltd., "Epicure(エピキュア)W" manufactured by Mitsubishi Chemical Corporation, etc.

[0428] As the acid anhydride-based resin as the component (E), resins having one or more acid anhydride groups in one molecule can be cited. Specific examples of the acid anhydride-based resin include: phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, methylnadic anhydride, hydrogenated methylnadic anhydride, trialkyltetrahydrophthalic anhydride, dodecenyl succinic anhydride, 5-(2,5-dioxotetrahydro-3-furanyl)-3-methyl-3-cyclohexene-1,2-dicarboxylic anhydride, trimellitic anhydride, pyromellitic anhydride, benzophenone tetracarboxylic dianhydride, biphenyltetracarboxylic dianhydride, naphthalenetetracarboxylic dianhydride, oxydiphthalic dianhydride, 3,3'-4,4'-diphenylsulfone tetracarboxylic dianhydride, 1,3,3a,4,5,9b-hexahydro-5-(tetrahydro-2,5-dioxo-3-furanyl)-naphtho[1,2-c]furan-1,3-dione, ethylene glycol bis(trimellitic anhydride ester), polymers such as styrene-maleic acid resin obtained by copolymerizing styrene and maleic acid, etc.

[0429] When an epoxy resin and a curing agent are contained as the (E) component, the amount ratio of the epoxy resin to all the curing agents is preferably in the range of 1:0.01 to 1:5, more preferably 1:0.3 to 1:3, and still more preferably 1:0.5 to 1:2, in terms of the ratio of [total number of epoxy groups of the epoxy resin]:[total number of reactive groups of the curing agent]. Here, the "number of epoxy groups of the epoxy resin" refers to the value obtained by summing up all the values obtained by dividing the mass of the non-volatile component of the epoxy resin present in the resin composition by the epoxy equivalent. In addition, the "number of active groups of the curing agent" refers to the value obtained by summing up all the values obtained by dividing the mass of the non-volatile component of the curing agent present in the resin composition by the active group equivalent. As the (E) component, by setting the amount ratio of the epoxy resin to the curing agent within the above range, a cured body with excellent flexibility can be obtained.

[0430] From the viewpoint of obtaining a cured body with excellent flexibility, the content of the curing agent as the (E) component is preferably 1% by mass or more, more preferably 3% by mass or more, still more preferably 5% by mass or more, preferably 20% by mass or less, more preferably 15% by mass or less, and still more preferably 10% by mass or less, based on 100% by mass of the non-volatile component in the resin composition.

[0431] From the viewpoint of obtaining a cured body with excellent flexibility, the content of the (E) component is preferably 5% by mass or more, more preferably 10% by mass or more, still more preferably 15% by mass or more, preferably 25% by mass or less, more preferably 20% by mass or less, and still more preferably 15% by mass or less, based on 100% by mass of the non-volatile component in the resin composition.

[0432] <(F) Curing Accelerator>

[0433] In the resin composition, in addition to containing the above components, as an optional component, a curing accelerator can be further contained as the (F) component. By containing the (F) component, the polymerization caused by heat can be further promoted.

[0434] Examples of the (F) component include epoxy resin curing accelerators such as phosphorus-based curing accelerators, amine-based curing accelerators, imidazole-based curing accelerators, guanidine-based curing accelerators, and metal-based curing accelerators; and thermal polymerization curing accelerators such as peroxide-based curing accelerators. The (F) component can be used alone or in combination of two or more.

[0435] Examples of the phosphorus-based curing accelerator include, for example: triphenylphosphine, phosphonium borate compound, tetraphenylphosphonium tetraphenylborate, n-butylphosphonium tetraphenylborate, tetrabutylphosphonium caprylate, (4-methylphenyl)triphenylphosphonium thiocyanate, tetraphenylphosphonium thiocyanate, butyltriphenylphosphonium thiocyanate, etc., and preferably triphenylphosphine, tetrabutylphosphonium caprylate.

[0436] As amine-based curing accelerators, for example, trialkylamines such as triethylamine and tributylamine, 4-dimethylaminopyridine, benzyldimethylamine, 2,4,6-tris(dimethylaminomethyl)phenol, 1,8-diazabicyclo[5.4.0]undecene, etc. are cited. Preferably, 4-dimethylaminopyridine and 1,8-diazabicyclo[5.4.0]undecene are used.

[0437] As imidazole-based curing accelerators, for example, 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-methylimidazole, 1-benzyl-2-phenylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazolium trimellitate, 1-cyanoethyl-2-phenylimidazolium trimellitate, 2,4-diamino-6-[2'-methylimidazolyl-(1')]-ethyl-s-triazine, 2,4-diamino-6-[2'-undecylimidazolyl-(1')]-ethyl-s-triazine, 2,4-diamino-6-[2'-ethyl-4'-methylimidazolyl-(1')]-ethyl-s-triazine, 2,4-diamino-6-[2'-methylimidazolyl-(1')]-ethyl-s-triazine isocyanuric acid adduct, 2-phenylimidazole isocyanuric acid adduct, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2,3-dihydro-1H-pyrrolo[1,2-a]benzimidazole, 1-dodecyl-2-methyl-3-benzylimidazolium chloride, 2-methylimidazoline, 2-phenylimidazoline and other imidazole compounds, and adducts of imidazole compounds and epoxy resins are cited. Preferably, 2-ethyl-4-methylimidazole and 1-benzyl-2-phenylimidazole are used.

[0438] As imidazole-based curing accelerators, commercially available products can be used, for example, "P200-H50" manufactured by Mitsubishi Chemical Corporation, etc.

[0439] Examples of guanidine-based curing accelerators include dicyandiamide, 1-methylguanidine, 1-ethylguanidine, 1-cyclohexylguanidine, 1-phenylguanidine, 1-(o-tolyl)guanidine, dimethylguanidine, diphenylguanidine, trimethylguanidine, tetramethylguanidine, pentamethylguanidine, 1,5,7-triazabicyclo[4.4.0]dec-5-ene, 7-methyl-1,5,7-triazabicyclo[4.4.0]dec-5-ene, 1-methylbiguanide, 1-ethylbiguanide, 1-n-butylbiguanide, 1-n-octadecylbiguanide, 1,1-dimethylbiguanide, 1,1-diethylbiguanide, 1-cyclohexylbiguanide, 1-allylbiguanide, 1-phenylbiguanide, 1-(o-tolyl)biguanide, etc. Preferably, dicyandiamide and 1,5,7-triazabicyclo[4.4.0]dec-5-ene are used.

[0440] Examples of metal-based curing accelerators include organometallic complexes or organometallic salts of metals such as cobalt, copper, zinc, iron, nickel, manganese, and tin. Specific examples of organometallic complexes include organocobalt complexes such as cobalt(II) acetylacetonate and cobalt(III) acetylacetonate, organocopper complexes such as copper(II) acetylacetonate, organozinc complexes such as zinc(II) acetylacetonate, organoiron complexes such as iron(III) acetylacetonate, organonickel complexes such as nickel(II) acetylacetonate, and organomanganese complexes such as manganese(II) acetylacetonate. Examples of organometallic salts include zinc octoate, tin octoate, zinc naphthenate, cobalt naphthenate, tin stearate, zinc stearate, etc.

[0441] Examples of peroxide-based curing accelerators include peroxides such as di-tert-butyl peroxide, tert-butyl cumyl peroxide, tert-butyl peracetate, α,α'-bis(tert-butylperoxy)diisopropylbenzene, tert-butyl lauryl peroxide, tert-butyl 2-ethylhexanoate peroxide, tert-butyl neodecanoate peroxide, and tert-butyl benzoate peroxide.

[0442] Examples of commercially available peroxide-based curing accelerators include "PERHEXYL D", "PERBUTYL C", "PERBUTYL A", "PERBUTYL P", "PERBUTYL L", "PERBUTYL O", "PERBUTYLND", "PERBUTYL Z", "PERCUMYL P", "PERCUMYL D", etc. manufactured by NOF Corporation.

[0443] From the viewpoint of significantly obtaining the desired effects of the present invention, when the non-volatile components in the resin composition are set to 100% by mass, the content of the component (F) is preferably 0.1% by mass or more, more preferably 0.2% by mass or more, still more preferably 0.3% by mass or more, preferably 1% by mass or less, more preferably 0.8% by mass or less, and still more preferably 0.5% by mass or less.

[0444] <(G) Other Additives>

[0445] In the resin composition, in addition to the above components, other additives may further be included as optional components. Examples of such additives include resin additives such as thickeners, defoamers, leveling agents, adhesion-imparting agents, etc. These additives may be used alone or in combination of two or more. Those skilled in the art can appropriately set their respective contents.

[0446] The method for preparing the resin composition of the present invention is not particularly limited, and examples thereof include: adding compounding components, adding a solvent as needed, and using a rotary mixer or the like for mixing / dispersing.

[0447] <Physical Properties and Uses of Resin Composition>

[0448] The resin composition contains a specified amount of component (A) and component (B). Thereby, unevenness generated on the cured substrate can be suppressed, and a cured product excellent in dielectric properties, peel strength, and elongation at break can be obtained. Generally, when the content of the inorganic filler increases, there is a tendency for unevenness to easily occur on the cured substrate. However, by combining and containing a specified amount of component (A) and component (B), even when the content of the inorganic filler is high, the occurrence of unevenness generated on the cured substrate can be suppressed. Further, a cured product excellent in dielectric properties, peel strength, and elongation at break can be obtained.

[0449] The resin composition exhibits the property of being able to suppress unevenness generated on the cured substrate. Specifically, after laminating a resin composition layer of a resin sheet on a glass cloth substrate epoxy resin double-sided copper-clad laminate with a copper foil thickness of 18 μm, it is thermally cured at 130 °C for 30 minutes and then at 170 °C for 30 minutes to form an insulating layer. Visually observe the insulating layer of the portion where the resin sheet is laminated, and observe the surface uniformity of the surface on the side opposite to the glass cloth substrate epoxy resin double-sided copper-clad laminate. At this time, generally, the portion closer to the inside than the portion 1 cm from the outer periphery of the portion where the resin sheet is laminated has a uniform surface. Preferably, the entire surface of the insulating layer on the side opposite to the laminate is a uniform surface. The detailed evaluation of the unevenness of the cured substrate can be measured according to the method described in the following examples.

[0450] The cured product obtained by thermally curing the resin composition at 130°C for 30 minutes and then at 170°C for 30 minutes exhibits excellent peel strength with the conductor layer (plated conductor layer) formed by plating. Therefore, the cured product can provide an insulating layer with excellent peel strength with the plated conductor layer. The peel strength is preferably 0.3 kgf / cm or more, more preferably 0.35 kgf / cm or more, and still more preferably 0.4 kgf / cm or more. The upper limit value of the peel strength can be set to 10 kgf / cm or less, etc. The measurement of the peel strength of the plated conductor layer can be carried out according to the method described in the following examples.

[0451] The cured product obtained by thermally curing the resin composition at 200°C for 90 minutes exhibits low dielectric constant characteristics. Therefore, the cured product can provide an insulating layer with a low dielectric constant. The dielectric constant is preferably 4 or less, more preferably 3.5 or less, and still more preferably 3 or less. The lower limit value of the dielectric constant can be set to 0.001 or more, etc. The measurement of the dielectric constant can be carried out according to the method described in the following examples.

[0452] The cured product obtained by thermally curing the resin composition at 200°C for 90 minutes exhibits low tangent of dielectric loss angle characteristics. Therefore, the cured product can provide an insulating layer with a low tangent of dielectric loss angle. The tangent of dielectric loss angle is preferably 0.005 or less, more preferably 0.004 or less, and still more preferably 0.003 or less. The lower limit value of the tangent of dielectric loss angle can be set to 0.0001 or more, etc. The measurement of the tangent of dielectric loss angle can be carried out according to the method described in the following examples.

[0453] The cured product obtained by thermally curing the resin composition at 200°C for 90 minutes exhibits high elongation at break characteristics due to its high toughness. Therefore, the above-mentioned cured product provides an insulating layer with a high elongation at break. As the elongation at break, it is preferably 0.5% or more, more preferably 0.8% or more, and still more preferably 1% or more. On the other hand, the upper limit value of the elongation at break is not particularly limited and can be set to 10% or less, etc. The evaluation of the above-mentioned elongation at break can be carried out according to the method described in the following examples.

[0454] The resin composition of the present invention can suppress the unevenness generated on the cured substrate and can provide an insulating layer with excellent dielectric properties, peel strength, and elongation at break. Therefore, the resin composition of the present invention can be suitably used as a resin composition for insulating applications. Specifically, it can be suitably used as: a resin composition for forming "the insulating layer for forming a conductor layer (the conductor layer is formed on the insulating layer and includes a rewiring layer)" (resin composition for forming an insulating layer for forming a conductor layer).

[0455] In addition, in the following multi-layer printed wiring board, it can be suitably used as: a resin composition for forming an insulating layer of a multi-layer printed wiring board (resin composition for forming an insulating layer of a multi-layer printed wiring board), a resin composition for forming an interlayer insulating layer of a printed wiring board (resin composition for forming an interlayer insulating layer of a printed wiring board).

[0456] In addition, for example, when manufacturing a semiconductor chip package through the following steps (1) to (6), the resin composition of the present invention can also be suitably used as: a resin composition for a rewiring formation layer for forming an insulating layer of a rewiring layer (resin composition for forming a rewiring formation layer); and a resin composition for sealing a semiconductor chip (resin composition for sealing a semiconductor chip). When manufacturing a semiconductor chip package, a rewiring layer can be further formed on the sealing layer;

[0457] (1) A step of laminating a temporary fixing film on a substrate,

[0458] (2) A step of temporarily fixing a semiconductor chip to the temporary fixing film,

[0459] (3) A step of forming a sealing layer on the semiconductor chip,

[0460] (4) A step of peeling the substrate and the temporary fixing film from the semiconductor chip,

[0461] (5) A step of forming a rewiring formation layer as an insulating layer on the surface of the semiconductor chip from which the substrate and the temporary fixing film have been peeled, and

[0462] (6) A step of forming a rewiring layer as a conductor layer on the rewiring formation layer.

[0463] [Resin sheet]

[0464] The resin sheet of the present invention includes a support and a resin composition layer formed of the resin composition of the present invention provided on the support.

[0465] From the viewpoints of thinning of the printed wiring board and that the cured product of the resin composition can provide a cured product with excellent insulation even as a thin film, the thickness of the resin composition layer is preferably 50 μm or less, more preferably 40 μm or less, and still more preferably 30 μm or less. The lower limit of the thickness of the resin composition layer is not particularly limited and can generally be set to 5 μm or more, etc.

[0466] Examples of the support include a film formed of a plastic material, a metal foil, and a release paper, and preferably a film formed of a plastic material and a metal foil.

[0467] When a film formed of a plastic material is used as the support, examples of the plastic material include poly(ethylene terephthalate) (hereinafter sometimes simply referred to as "PET"), poly(ethylene naphthalate) (hereinafter sometimes simply referred to as "PEN"), etc. polyesters, polycarbonate (hereinafter sometimes simply referred to as "PC"), acrylic polymers such as polymethyl methacrylate (PMMA), cyclic polyolefins, triacetyl cellulose (TAC), polyethersulfide (PES), polyether ketone, polyimide, etc. Among them, poly(ethylene terephthalate) and poly(ethylene naphthalate) are preferred, and inexpensive poly(ethylene terephthalate) is particularly preferred.

[0468] When a metal foil is used as the support, examples of the metal foil include copper foil, aluminum foil, etc., and copper foil is preferred. As the copper foil, a foil formed of single metal of copper can be used, or a foil formed of an alloy of copper and other metals (such as tin, chromium, silver, magnesium, nickel, zirconium, silicon, titanium, etc.) can be used.

[0469] For the support, a matte treatment, a corona treatment, an antistatic treatment can be performed on the surface joined to the resin composition layer.

[0470] In addition, as the support, a support with a release layer having a release layer on the surface joined to the resin composition layer can be used. Examples of the release agent for the release layer of the support with a release layer include one or more release agents selected from alkyd resins, polyolefin resins, polyurethane resins, and silicone resins. Commercially available products can be used for the support with a release layer, and examples include: "SK-1", "AL-5", "AL-7" manufactured by Lintec Corporation, "LUMIRROR T60" manufactured by Toray Industries, Inc., "Purex" manufactured by Teijin Limited, "Unipeel" manufactured by Unitika Ltd., etc., as PET films having a release layer mainly composed of an alkyd resin-based release agent.

[0471] The thickness of the support is not particularly limited, preferably in the range of 5 μm to 75 μm, more preferably in the range of 10 μm to 60 μm. It should be noted that when a support with a release layer is used, preferably the thickness of the entire support with a release layer is in the above range.

[0472] In one embodiment, the resin sheet may further contain other layers as needed. Examples of the other layers include a protective film selected according to the support provided on the surface of the resin composition layer that is not joined to the support (i.e., the surface opposite to the support). The thickness of the protective film is not particularly limited, for example, it is 1 μm to 40 μm. By laminating the protective film, it is possible to prevent attachment of garbage, etc. or formation of damage on the surface of the resin composition layer.

[0473] The resin sheet can be manufactured, for example, as follows: Prepare a resin varnish obtained by dissolving a resin composition in an organic solvent, coat the resin varnish on a support using a die coater or the like, and then dry it to form a resin composition layer.

[0474] Examples of the organic solvent include: ketones such as acetone, methyl ethyl ketone (MEK), and cyclohexanone; acetates such as ethyl acetate, butyl acetate, cellosolve acetate (cellosolve acetate), propylene glycol monomethyl ether acetate, and carbitol acetate; carbitols such as cellosolve and butyl carbitol; aromatic hydrocarbons such as toluene and xylene; amide solvents such as dimethylformamide, dimethylacetamide (DMAc), and N-methylpyrrolidone. The organic solvent can be used alone or in combination of two or more.

[0475] The drying can be carried out by known methods such as heating and hot air blowing. The drying conditions are not particularly limited, and the drying is carried out in such a way that the content of the organic solvent in the resin composition layer becomes 10% by mass or less, preferably 5% by mass or less. The drying conditions also vary depending on the boiling point of the organic solvent in the resin varnish. For example, in the case of using a resin varnish containing 30% to 60% by mass of the organic solvent, the resin composition layer can be formed by drying at 50°C to 150°C for 3 minutes to 10 minutes.

[0476] The resin sheet can be wound and stored in a roll. When the resin sheet has a protective film, it can be used by peeling off the protective film.

[0477] [Printed Wiring Board]

[0478] The printed wiring board of the present invention includes an insulating layer formed of a cured product of the resin composition of the present invention.

[0479] The printed wiring board can be manufactured, for example, by a method including the following steps (I) and (II) using the above resin sheet:

[0480] (I) A step of laminating on an inner layer substrate in such a manner that the resin composition layer of the resin sheet is joined to the inner layer substrate;

[0481] (II) A step of thermally curing the resin composition layer to form an insulating layer.

[0482] The "inner layer substrate" used in step (I) refers to a component that becomes a substrate of a printed wiring board, and examples thereof include a glass epoxy substrate, a metal substrate, a polyester substrate, a polyimide substrate, a BT resin substrate, a thermosetting polyphenylene ether substrate, and the like. In addition, the substrate may have a conductor layer on one or both sides thereof, and the conductor layer may be patterned. An inner layer substrate having a conductor layer (circuit) formed on one or both sides of a substrate is also referred to as an "inner layer circuit substrate". In addition, an intermediate product to be further formed with an insulating layer and / or a conductor layer when manufacturing a printed wiring board is also included in the "inner layer substrate" referred to in the present invention. In the case where the printed wiring board is a circuit board with built-in components, an inner layer substrate with built-in components can be used.

[0483] The lamination of the inner substrate and the resin sheet can be carried out, for example, by heat-pressing the resin sheet to the inner substrate from the support body side. As a component for heat-pressing the resin sheet to the inner substrate (hereinafter also referred to as "heat-pressing component"), for example, a heated metal plate (SUS end plate (mirror plate) etc.) or a metal roller (SUS roller) etc. can be cited. It should be noted that it is better not to press the heat-pressing component directly on the resin sheet, but to press it through an elastic material such as heat-resistant rubber so that the resin sheet fully follows the surface unevenness of the inner substrate.

[0484] The lamination of the inner substrate and the resin sheet can be implemented by vacuum lamination. In the vacuum lamination, the heating and pressing temperature is preferably 60°C to 160°C, more preferably 80°C to 140°C, the heating and pressing pressure is preferably 0.098MPa to 1.77MPa, more preferably 0.29MPa to 1.47MPa, and the heating and pressing time is preferably 20 seconds to 400 seconds, more preferably 30 seconds to 300 seconds. Lamination is preferably implemented under reduced pressure conditions of 26.7hPa or less.

[0485] Lamination can be performed by a commercially available vacuum laminator. Examples of the commercially available vacuum laminator include a vacuum pressure laminator manufactured by Meiki Mfg. Co., Ltd., a vacuum applicator manufactured by Nikko-Materials Co., Ltd., and a batch vacuum pressure laminator.

[0486] After lamination, the laminated resin sheet can be smoothed under normal pressure (atmospheric pressure), for example, by pressing the heating and pressing member from the support body side. The pressing conditions for the smoothing treatment can be the same as the heating and pressing conditions for the above-mentioned lamination. The smoothing treatment can be performed by a commercially available laminator. It should be noted that the lamination and smoothing treatment can be performed continuously using the above-mentioned commercially available vacuum laminator.

[0487] The support may be removed between step (I) and step (II), or may be removed after step (II).

[0488] In step (II), the resin composition layer is thermally cured to form an insulating layer. The thermal curing conditions of the resin composition layer are not particularly limited, and the conditions generally used when forming the insulating layer of a printed wiring board can be employed.

[0489] For example, the thermal curing conditions of the resin composition layer vary depending on the type of the resin composition and the like. The curing temperature is preferably 120°C to 240°C, more preferably 150°C to 220°C, and still more preferably 170°C to 210°C. The curing time is preferably 5 minutes to 120 minutes, more preferably 10 minutes to 100 minutes, and still more preferably 15 minutes to 100 minutes.

[0490] Before thermally curing the resin composition layer, the resin composition layer can be preheated at a temperature lower than the curing temperature. For example, before thermally curing the resin composition layer, the resin composition layer can be preheated at a temperature of 50°C or higher and lower than 120°C (preferably 60°C or higher and 115°C or lower, more preferably 70°C or higher and 110°C or lower) for 5 minutes or more (preferably 5 minutes to 150 minutes, more preferably 15 minutes to 120 minutes, and still more preferably 15 minutes to 100 minutes).

[0491] When manufacturing a printed wiring board, step (III) of opening holes in the insulating layer, step (IV) of roughening the insulating layer, and step (V) of forming a conductor layer can be further implemented. These steps (III) to (V) can be implemented according to various methods well-known to those skilled in the art used in the manufacture of printed wiring boards. It should be noted that when removing the support after step (II), the removal of the support can be implemented between step (II) and step (III), between step (III) and step (IV), or between step (IV) and step (V). Additionally, if necessary, steps (II) to (V) of forming the insulating layer and the conductor layer can be repeatedly implemented to form a multilayer wiring board.

[0492] Step (III) is a step of opening holes in the insulating layer, whereby holes such as vias and through-holes can be formed in the insulating layer. Step (III) can be implemented using, for example, a drill bit, laser, plasma, etc. according to the composition of the resin composition used for forming the insulating layer. The size and shape of the holes can be appropriately determined according to the design of the printed wiring board.

[0493] Process (IV) is a process of roughening the insulating layer. Generally, in this process (IV), the removal of smears is also carried out. The steps and conditions of the roughening treatment are not particularly limited, and known steps and conditions generally used when forming the insulating layer of a printed wiring board can be adopted. For example, the insulating layer can be roughened by sequentially performing a swelling treatment using a swelling liquid, a roughening treatment using an oxidant, and a neutralization treatment using a neutralizing liquid. The swelling liquid used in the roughening treatment is not particularly limited, and examples thereof include an alkali solution and a surfactant solution. Preferably, it is an alkali solution, and more preferably, it is a sodium hydroxide solution or a potassium hydroxide solution. As commercially available swelling liquids, for example, "Swelling Dip Securiganth P", "Swelling Dip Securiganth SBU", "Swelling Dip Securiganth P" manufactured by Atotech Japan Co., Ltd. can be cited. The swelling treatment using the swelling liquid is not particularly limited. For example, it can be carried out by immersing the insulating layer in the swelling liquid at 30°C to 90°C for 1 minute to 20 minutes. From the viewpoint of suppressing the swelling of the resin of the insulating layer to an appropriate level, it is preferable to immerse the insulating layer in the swelling liquid at 40°C to 80°C for 5 minutes to 15 minutes. The oxidant used in the roughening treatment is not particularly limited, and examples thereof include an alkaline permanganic acid solution obtained by dissolving potassium permanganate or sodium permanganate in an aqueous solution of sodium hydroxide. The roughening treatment using an oxidant such as an alkaline permanganic acid solution is preferably carried out by immersing the insulating layer in the oxidant solution heated to 60°C to 100°C for 10 minutes to 30 minutes. In addition, the concentration of the permanganate in the alkaline permanganic acid solution is preferably 5% by mass to 10% by mass. As commercially available oxidants, for example, alkaline permanganic acid solutions such as "Concentrate Compact CP" and "Dosing solution Securiganth P" manufactured by Atotech Japan Co., Ltd. can be cited. In addition, the neutralizing liquid used in the roughening treatment is preferably an acidic aqueous solution, and as a commercial product, for example, "Reduction solution Securiganth P" manufactured by Atotech Japan Co., Ltd. can be cited. The treatment using the neutralizing liquid can be carried out by immersing the treated surface that has undergone the roughening treatment using the oxidant in the neutralizing liquid at 30°C to 80°C for 1 minute to 30 minutes. From the viewpoint of operability and the like, preferably, the object that has undergone the roughening treatment using the oxidant is immersed in the neutralizing liquid at 40°C to 70°C for 5 minutes to 20 minutes.

[0494] In one embodiment, the arithmetic mean roughness (Ra) of the surface of the roughened insulating layer is preferably 300 nm or less, more preferably 250 nm or less, and still more preferably 200 nm or less. There is no particular limitation on the lower limit, preferably 30 nm or more, more preferably 40 nm or more, and still more preferably 50 nm or more. The arithmetic mean roughness (Ra) of the surface of the insulating layer can be measured using a non-contact surface roughness meter.

[0495] Process (V) is a process of forming a conductor layer, and a conductor layer is formed on the insulating layer. There is no particular limitation on the conductor material for the conductor layer. In a preferred embodiment, the conductor layer contains one or more metals selected from gold, platinum, palladium, silver, copper, aluminum, cobalt, chromium, zinc, nickel, titanium, tungsten, iron, tin, and indium. The conductor layer may be a single-metal layer or an alloy layer. Examples of the alloy layer include layers formed of alloys of two or more metals selected from the above metals (e.g., nickel-chromium alloy, copper-nickel alloy, and copper-titanium alloy). Among them, from the viewpoints of the versatility of conductor layer formation, cost, and ease of pattern formation, etc., a single-metal layer of chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver, or copper, or an alloy layer of nickel-chromium alloy, copper-nickel alloy, or copper-titanium alloy is preferred, a single-metal layer of chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver, or copper, or an alloy layer of nickel-chromium alloy is more preferred, and a single-metal layer of copper is still more preferred.

[0496] The conductor layer may have a single-layer structure or a multilayer structure obtained by laminating two or more single-metal layers or alloy layers formed of different metals or alloys. When the conductor layer has a multilayer structure, the layer in contact with the insulating layer is preferably a single-metal layer of chromium, zinc, or titanium, or an alloy layer of nickel-chromium alloy.

[0497] The thickness of the conductor layer depends on the design of the desired printed wiring board, but is generally 3 μm to 35 μm, preferably 5 μm to 30 μm.

[0498] In one embodiment, the conductor layer can be formed by plating. For example, plating can be performed on the surface of the insulating layer by a conventionally known technique such as semi-additive method or full-additive method to form a conductor layer having a desired wiring pattern. From the viewpoint of manufacturing simplicity, it is preferably formed by the semi-additive method. An example of forming a conductor layer by the semi-additive method is shown below.

[0499] First, a plating seed layer is formed on the surface of the insulating layer by electroless plating. Next, a mask pattern is formed on the formed plating seed layer so as to expose a part of the plating seed layer corresponding to the desired wiring pattern. After a metal layer is formed on the exposed plating seed layer by electroplating, the mask pattern is removed. Then, the unnecessary plating seed layer is removed by etching or the like, and a conductor layer having a desired wiring pattern can be formed.

[0500] [Semiconductor device]

[0501] The semiconductor device of the present invention includes the printed wiring board of the present invention. The semiconductor device of the present invention can be manufactured using the printed wiring board of the present invention.

[0502] Examples of the semiconductor device include various semiconductor devices for electrical products (such as computers, mobile phones, digital cameras, and televisions, etc.) and transportation means (such as motorcycles, automobiles, trams, ships, and aircraft, etc.).

[0503] The semiconductor device of the present invention can be manufactured by mounting components (semiconductor chips) at the conductive positions of the printed wiring board. The so-called "conductive position" refers to "the position in the printed wiring board that conducts electrical signals", and this part can be either the surface or the buried position. In addition, the semiconductor chip is not particularly limited as long as it is an electrical circuit element made of semiconductor.

[0504] The method of mounting the semiconductor chip when manufacturing the semiconductor device is not particularly limited as long as the semiconductor chip can function effectively. Specifically, examples include wire bonding mounting method, flip chip mounting method, mounting method based on Bump less Build-Up Layer (BBUL), mounting method based on anisotropic conductive film (ACF), mounting method based on non-conductive film (NCF), and so on. The so-called "mounting method based on Bump less Build-Up Layer (BBUL)" here refers to "the mounting method of directly burying the semiconductor chip into the recess of the printed wiring board and connecting the semiconductor chip to the wiring on the printed wiring board".

[0505] Examples

[0506] Hereinafter, the present invention will be described in more detail with reference to examples, but the present invention is not limited to these examples. It should be noted that in the following description, unless otherwise specified, "parts" and "%" refer to "parts by mass" and "mass%", respectively.

[0507] [Synthesis Example 1: Synthesis of Compound A (Compound A) Containing Aromatic Ester Skeleton and Unsaturated Bond]

[0508] 89 parts by mass of o-allylphenol, 110 parts by mass of dicyclopentadiene-phenol copolymer resin (softening point 85 °C, hydroxyl equivalent about 165 g / eq.), and 1000 parts by mass of toluene were charged into a reaction vessel, and the above components were dissolved while performing a reduced-pressure nitrogen substitution inside the vessel. Subsequently, 135 parts by mass of isophthaloyl chloride was charged and dissolved. Then, 0.5 g of tetrabutylammonium bromide was added, and while purging nitrogen inside the vessel, 309 g of 20% aqueous sodium hydroxide solution was added dropwise over 3 hours. At this time, the temperature inside the system was controlled below 60 °C. Then, the reaction was stirred for 1 hour. After the reaction was completed, the reaction product was separated into layers and the aqueous layer was removed. This operation was repeated until the pH of the aqueous layer became 7, and toluene, etc. were distilled off under heating and reduced pressure to obtain a compound A containing an aromatic ester skeleton and an unsaturated bond. When the unsaturated bond equivalent of the obtained compound A containing an aromatic ester skeleton and an unsaturated bond was calculated from the charging ratio, it was 428 g / eq. Compound A is represented by the following formula, s represents an integer of 0 or 1 or more, and the average value of r calculated from the charging ratio is 1. In addition, the wavy line is a structure obtained by the polyaddition reaction of isophthaloyl chloride and / or a reaction of a phenol polyaddition resin and o-allylphenol;

[0509] [Chemical formula 41]

[0510]

[0511] [Synthesis Example 2: Synthesis of compound B (Compound B) containing an aromatic ester skeleton and an unsaturated bond]

[0512] 201 parts by mass of o-allylphenol and 1000 parts by mass of toluene were charged into a reaction vessel, and the above components were dissolved while performing a reduced-pressure nitrogen substitution inside the vessel. Subsequently, 152 parts by mass of isophthaloyl chloride was charged and dissolved. While purging nitrogen inside the vessel, 309 g of 20% aqueous sodium hydroxide solution was added dropwise over 3 hours. At this time, the temperature inside the system was controlled below 60 °C. Then, the reaction was stirred for 1 hour. After the reaction was completed, the reaction product was separated into layers and the aqueous layer was removed. This operation was repeated until the pH of the aqueous layer became 7, and toluene, etc. were distilled off under heating and reduced pressure to obtain a compound B containing an aromatic ester skeleton and an unsaturated bond. When the unsaturated bond equivalent of the obtained compound B containing an aromatic ester skeleton and an unsaturated bond was calculated from the charging ratio, it was 199 g / eq. Compound B has a structure represented by the following formula;

[0513] [Chemical formula 42]

[0514]

[0515] [Synthesis Example 3: Synthesis of polyimide resin]

[0516] Prepare a 500 mL detachable flask equipped with a moisture quantitative receiver connected to a reflux condenser, a nitrogen inlet tube, and a stirrer. Add 20.3 g of 4,4'-oxybisphthalic anhydride (ODPA), 200 g of γ-butyrolactone, 20 g of toluene, and 29.6 g of 5-(4-aminophenoxy)-3-[4-(4-aminophenoxy)phenyl]-1,1,3-trimethylindane to the flask, and stir at 45 °C for 2 hours under a nitrogen stream to carry out the reaction. Then, heat up the reaction solution, and while maintaining it at about 160 °C, azeotropically remove the condensed water and toluene together under a nitrogen stream. Confirm "accumulation of a specified amount of water in the moisture quantitative receiver" and "no more water outflow is observed". After confirmation, further heat up the reaction solution and stir at 200 °C for 1 hour. Then, cool to obtain a polyimide solution (non-volatile component: 20% by mass) containing a polyimide resin having a 1,1,3-trimethylindane skeleton. The obtained polyimide resin has a repeating unit represented by the following formula (X1) and a repeating unit represented by the following formula (X2). In addition, the weight average molecular weight of the above polyimide resin is 12,000.

[0517] [Chemical formula 43]

[0518]

[0519] [Chemical formula 44]

[0520]

[0521] [Synthesis Example 4: Synthesis of Bisphenol Ether Resin]

[0522] Place 894.96 mmol of dichloropyrimidine, 900.00 mmol of 1,1-bis(4-hydroxyphenyl)-3,3,5-trimethylcyclohexane, 1.2 mol of potassium carbonate, and N-methyl-2-pyrrolidone (450 g) in a four-necked flask. After purging the inside of the flask with nitrogen, heat the contents of the flask at 130 °C for 6 hours, and remove the water generated during heating from the Dean-Stark tube at any time. After cooling the contents of the flask to room temperature, filter and separate the precipitated solid matter, add methanol to the filtrate, wash the precipitated solid matter with methanol, and dry these solid matters to obtain a bisphenol ether resin (weight average molecular weight (Mw); 87,000 (polystyrene conversion value)). 13 Perform 13C-NMR measurement on the obtained bisphenol ether resin to confirm the product. The bisphenol ether resin has a structure represented by the following formula;

[0523] [Chemical formula 45]

[0524]

[0525] [Synthesis Example 5: Synthesis of Maleimide Resin]

[0526] Prepare a MEK solution (non-volatile component: 70% by mass) of a maleimide compound synthesized by the method described in Synthesis Example 1 described in Japanese Invention Association Publication Technical Report (Invention Association Publication Technical Report) Publication No. 2020-500211. This maleimide compound has a structure represented by the following formula;

[0527] [Chemical Formula 46]

[0528]

[0529] When measuring the FD-MS spectrum of the maleimide compound, peaks of M + = 560, 718 and 876 were confirmed. These peaks correspond to the cases where n1 is 0, 1 and 2, respectively. In addition, when analyzing the maleimide compound by GPC and obtaining the value of the number-average molecular weight of the indane skeleton part, n1 = 1.47 and the molecular weight distribution (Mw / Mn) = 1.81. Further, in 100 area% of the total amount of the maleimide compound, the content ratio of the maleimide compound with an average repeating unit number n1 of 0 is 26.5 area%.

[0530] [Example 1. Preparation of Resin Composition 1]

[0531] While stirring, 10 parts of Compound A obtained in Synthesis Example 1 was heated and dissolved in 10 parts of toluene and 10 parts of MEK. After cooling the resulting solution to room temperature, 80 parts of a biphenyl aralkyl type maleimide resin ("MIR-3000-70MT" manufactured by Nippon Kayaku Co., Ltd., maleimide group equivalent: 275 g / eq., MEK / toluene mixed solution with a non-volatile component of 70%), 15 parts of a varnish containing 20% by mass of a polyimide resin obtained in Synthesis Example 3, 1 part of a curing accelerator ("PERHEXYL D" manufactured by NOF Corporation), and 130 parts of an inorganic filler (spherical silica ("SO-C2" manufactured by Admatechs Co., Ltd., average particle size 0.5 μm) surface-treated with an amine-based silane coupling agent ("KBM573" manufactured by Shin-Etsu Chemical Co., Ltd.)) were mixed and uniformly dispersed using a high-speed rotary mixer to obtain Resin Composition 1.

[0532] [Example 2. Preparation of Resin Composition 2]

[0533] In Example 1,

[0534] 1) Change the amount of Compound A from 10 parts to 50 parts,

[0535] 2) Change the amount of the biphenyl aralkyl type maleimide resin (manufactured by Nippon Kayaku Co., Ltd., "MIR-3000-70MT", maleimide group equivalent: 275 g / eq., MEK / toluene mixed solution with 70% non-volatile components) from 80 parts to 70 parts.

[0536] 3) Use 7 parts of liquid bismaleimide (manufactured by DESIGNER MOLECULES, Inc., "BMI689", maleimide group equivalent 345 g / eq.).

[0537] 4) Change 15 parts of the varnish containing 20% by mass of the polyimide resin obtained in Synthesis Example 3 to 12.5 parts of a polyamideimide resin (manufactured by DIC Corporation, "UNIDIC V-8000", weight average molecular weight 11,000, diethylene glycol monoethyl ether acetate solution with 40% non-volatile components).

[0538] Except for the above matters, operate in the same manner as in Example 1 to prepare Resin Composition 2.

[0539] [Example 3. Preparation of Resin Composition 3]

[0540] In Example 1,

[0541] 1) Change the amount of Compound A from 10 parts to 20 parts.

[0542] 2) Change 80 parts of the biphenyl aralkyl type maleimide resin (manufactured by Nippon Kayaku Co., Ltd., "MIR-3000-70MT", maleimide group equivalent: 275 g / eq., MEK / toluene mixed solution with 70% non-volatile components) to 60 parts of a low molecular weight polyphenylene ether-styrene resin (manufactured by Mitsubishi Gas Chemical Company, "OPE-2St 1200", toluene solution with 65% non-volatile components).

[0543] 3) Use 5 parts of a difunctional acrylate ((meth)acrylic acid-based free radical polymerizable compound, manufactured by Shin-Nakamura Chemical Co., Ltd., "NK Ester A-DOG", molecular weight 326).

[0544] 4) Change 15 parts of the varnish containing 20% by mass of the polyimide resin obtained in Synthesis Example 3 to 5 parts of a polycarbonate resin (manufactured by Mitsubishi Gas Chemical Company, "FPC2136", weight average molecular weight 30,000).

[0545] Except for the above matters, operate in the same manner as in Example 1 to prepare Resin Composition 3.

[0546] [Example 4. Preparation of Resin Composition 4]

[0547] In Example 1,

[0548] 1) Change the amount of the biphenyl aralkyl type maleimide resin (manufactured by Nippon Kayaku Co., Ltd., "MIR-3000-70MT", maleimide group equivalent: 275 g / eq., MEK / toluene mixed solution with 70% non-volatile components) from 80 parts to 40 parts.

[0549] 2) Change 15 parts of the varnish containing 20% by mass of the polyimide resin obtained in Synthesis Example 3 to 10 parts of a phenoxy resin (manufactured by Mitsubishi Chemical Corporation, "YX7553BH30", weight average molecular weight 35,000, 1:1 solution of MEK and cyclohexanone with 30% solid content).

[0550] 3) Use 10 parts of a naphthalene type epoxy resin (manufactured by DIC Corporation, "HP4032SS"), 10 parts of a carbodiimide resin (manufactured by Nisshinbo Chemical Inc., "V-03", active group equivalent approximately 216, toluene solution with 50% solid content), 20 parts of an active ester resin (manufactured by DIC Corporation, "HPC-8000-65T", active group equivalent 223, toluene solution with 65% solid content), and 1 part of a curing accelerator (4-dimethylaminopyridine (DMAP), MEK solution with 10% solid content).

[0551] Except for the above matters, operate in the same manner as in Example 1 to prepare Resin Composition 4.

[0552] [Example 5. Preparation of Resin Composition 5]

[0553] In Example 1, change 10 parts of Compound A obtained in Synthesis Example 1 to 10 parts of Compound B obtained in Synthesis Example 2. Except for the above matters, operate in the same manner as in Example 1 to prepare Resin Composition 5.

[0554] [Example 6. Preparation of Resin Composition 6]

[0555] In Example 3, change 20 parts of Compound A obtained in Synthesis Example 1 to 20 parts of Compound B obtained in Synthesis Example 2. Except for the above matters, operate in the same manner as in Example 3 to prepare Resin Composition 6.

[0556] [Example 7. Preparation of Resin Composition 7]

[0557] In Example 3, change 20 parts of Compound A obtained in Synthesis Example 1 to 50 parts of Compound B obtained in Synthesis Example 2. Except for the above matters, operate in the same manner as in Example 3 to prepare Resin Composition 7.

[0558] [Example 8. Preparation of Resin Composition 8]

[0559] In Example 4,

[0560] 1) Change 10 parts of compound A obtained in Synthesis Example 1 to 20 parts of compound B obtained in Synthesis Example 2.

[0561] 2) Change 40 parts of a biphenyl aralkyl type maleimide resin (manufactured by Nippon Kayaku Co., Ltd., "MIR-3000-70MT", maleimide group equivalent: 275 g / eq., MEK / toluene mixed solution with non-volatile content of 70%) to 30 parts of a low molecular weight polyphenylene ether-styrene resin (manufactured by Mitsubishi Gas Chemical Company, "OPE-2St 1200", toluene solution with non-volatile content of 65%);

[0562] Except for the above matters, operate in the same manner as in Example 4 to prepare resin composition 8.

[0563] [Comparative Example 1. Preparation of Comparative Resin Composition 1]

[0564] In Example 1, do not use 10 parts of compound A obtained in Synthesis Example 1. Except for the above matters, operate in the same manner as in Example 1 to prepare Comparative Resin Composition 1.

[0565] [Comparative Example 2. Preparation of Comparative Resin Composition 2]

[0566] In Example 1, change the amount of compound A obtained in Synthesis Example 1 from 10 parts to 85 parts. Except for the above matters, operate in the same manner as in Example 1 to prepare Comparative Resin Composition 2.

[0567] [Comparative Example 3. Preparation of Comparative Resin Composition 3]

[0568] In Example 6, change the amount of compound B obtained in Synthesis Example 2 from 20 parts to 85 parts. Except for the above matters, operate in the same manner as in Example 6 to prepare Comparative Resin Composition 3.

[0569] [Example 9. Preparation of Resin Composition 9]

[0570] In Example 1, change 15 parts of the polyimide resin of Synthesis Example 3 to 15 parts of a cyclohexanone solution with a non-volatile content of 20% of the bisphenol ether resin of Synthesis Example 4. Except for the above matters, operate in the same manner as in Example 1 to prepare Resin Composition 9.

[0571] [Example 10. Preparation of Resin Composition 10]

[0572] In Example 1, 80 parts of a biphenyl aralkyl type maleimide resin (manufactured by Nippon Kayaku Co., Ltd., "MIR-3000-70MT", maleimide group equivalent: 275 g / eq., MEK / toluene mixed solution with 70% non-volatile content) was changed to 80 parts of the maleimide resin of Synthesis Example 5 (MEK solution with 70% by mass non-volatile content). Except for the above matters, the operation was the same as in Example 1 to prepare Resin Composition 10.

[0573] [Example 11. Preparation of Resin Composition 11]

[0574] In Example 3, the amount of Compound A obtained in Synthesis Example 1 was changed from 20 parts to 50 parts, and 60 parts of a low molecular weight polyphenylene ether-styrene resin (manufactured by Mitsubishi Gas Chemical Company, "OPE-2St 1200", toluene solution with 65% non-volatile content) was changed to 67.7 parts of "ODV-XET-X04" (weight average molecular weight 3110, 65% by mass solution) manufactured by Nippon Steel Chemical & Material Co., Ltd., and a difunctional acrylate ((meth)acrylic acid-based free radical polymerizable compound, manufactured by Shin-Nakamura Chemical Co., Ltd., "NK Ester A-DOG", molecular weight 326) was not used. Except for the above matters, the operation was the same as in Example 3 to prepare Resin Composition 11.

[0575] [Example 12. Preparation of Resin Composition 12]

[0576] In Example 3, 60 parts of a low molecular weight polyphenylene ether-styrene resin (manufactured by Mitsubishi Gas Chemical Company, "OPE-2St 1200", toluene solution with 65% non-volatile content) was changed to 44 parts of a benzocyclobutene resin (manufactured by Dow Chemical Company, "CYCLOTENE3022"), and 5 parts of a polycarbonate resin (manufactured by Mitsubishi Gas Chemical Company, "FPC2136", weight average molecular weight 30000) was changed to 16.7 parts of a phenoxy resin (manufactured by Mitsubishi Chemical Corporation, "YX7553BH30", weight average molecular weight 35000, 1:1 solution of MEK and cyclohexanone with 30% by mass solid content). Except for the above matters, the operation was the same as in Example 3 to prepare Resin Composition 12.

[0577] [Example 13. Preparation of Resin Composition 13]

[0578] In Example 9, 10 parts of Compound A obtained in Synthesis Example 1 was changed to 10 parts of Compound B obtained in Synthesis Example 2. Except for the above matters, the operation was the same as in Example 9 to prepare Resin Composition 13.

[0579] [Example 14. Preparation of Resin Composition 14]

[0580] In Example 10, 10 parts of Compound A obtained in Synthesis Example 1 was changed to 10 parts of Compound B obtained in Synthesis Example 2. Except for the above matters, the operation was carried out in the same manner as in Example 10 to prepare Resin Composition 14.

[0581] [Example 15. Preparation of Resin Composition 15]

[0582] In Example 11, 50 parts of Compound A obtained in Synthesis Example 1 was changed to 20 parts of Compound B obtained in Synthesis Example 2. Except for the above matters, the operation was carried out in the same manner as in Example 11 to prepare Resin Composition 15.

[0583] [Example 16. Preparation of Resin Composition 16]

[0584] In Example 12, 20 parts of Compound A obtained in Synthesis Example 1 was changed to 50 parts of Compound B obtained in Synthesis Example 2. Except for the above matters, the operation was carried out in the same manner as in Example 12 to prepare Resin Composition 16.

[0585] [Production of Resin Sheet]

[0586] As a support, a polyethylene terephthalate film (Toray Industries, Inc.'s "LUMIRROR R80", thickness 38 μm, softening point 130 °C) that had been subjected to a release treatment with an alkyd resin-based release agent (Lintec Corporation's "AL-5") was prepared.

[0587] Resin Compositions 1 to 16 and Comparative Resin Compositions 1 to 3 were each uniformly coated on the support using a die coater so that the thickness of the dried resin composition layer would be 40 μm, and dried at 70 °C to 95 °C for 4 minutes, thereby forming a resin composition layer on the support. Then, the rough surface of a polypropylene film (Oji F-Tex Corporation's "ALPHAN MA-411", thickness 15 μm) as a protective film was adhered to the surface of the resin composition layer that was not joined to the support. Thus, a resin sheet having a support, a resin composition layer, and a protective film in that order was obtained.

[0588] [Evaluation of Nonuniformity of Cured Substrate and Measurement of Peel Strength of Plated Conductor Layer]

[0589] (1) Preparation of Inner Layer Substrate

[0590] Both sides of a glass cloth base epoxy resin double-sided copper-clad laminate (copper foil thickness 18 μm, substrate thickness 0.4 mm, Panasonic Corporation's "R1515A") having an inner layer circuit formed thereon were etched with a micro-etchant (MEC Corporation's "CZ8101") by 1 μm to roughen the copper surface.

[0591] (2) Lamination of Resin Sheet

[0592] The protective film was peeled off from the resin sheet to expose the resin composition layer. Using a batch vacuum compression laminator (manufactured by Nikko-Materials Co., Ltd., two-stage stacked laminator "CVP700"), it was laminated on both sides of the inner substrate in such a way that the resin composition layer was in contact with the inner substrate. The lamination was carried out as follows: After decompression for 30 seconds and adjusting the air pressure to 13 hPa or less, it was pressure-bonded for 30 seconds under the conditions of 120 °C and a pressure of 0.74 MPa. Then, hot pressing was carried out for 60 seconds under the conditions of 100 °C and a pressure of 0.5 MPa.

[0593] (3) Thermal curing of the resin composition layer

[0594] Then, the inner substrate laminated with the resin sheet was put into an oven at 130 °C and heated for 30 minutes, and then transferred to an oven at 170 °C and heated for 30 minutes to thermally cure the resin composition layer to form an insulating layer. Then, the support was peeled off to obtain a cured substrate A having an insulating layer, an inner substrate, and an insulating layer in sequence.

[0595] <Evaluation of non-uniformity of the cured substrate>

[0596] For both sides of the cured substrate A, the surface uniformity of the part laminated with the resin sheet (the surface on the side opposite to the laminated board) was observed visually and evaluated as follows:

[0597] ◎: No non-uniformity was observed at all, and it was a completely uniform surface;

[0598] 〇: Non-uniformity was observed only in the part 1 cm from the outer periphery of the part laminated with the resin sheet, and the part more inward than that was a completely uniform surface;

[0599] ×: Non-uniform parts were observed in the part more inward than 1 cm from the outer periphery of the part laminated with the resin sheet.

[0600] (4) Roughening treatment

[0601] On the cured substrate A, desmear treatment as a roughening treatment was carried out. As the desmear treatment, the following wet desmear treatment was implemented;

[0602] (Wet desmear treatment)

[0603] The cured substrate A was immersed in a swelling solution ("Swelling Dip Securiganth P" manufactured by Atotech Japan Co., Ltd., an aqueous solution of diethylene glycol monobutyl ether and sodium hydroxide) at 60°C for 5 minutes, then immersed in an oxidizing agent solution ("Concentrate Compact CP" manufactured by Atotech Japan Co., Ltd., an aqueous solution with a potassium permanganate concentration of approximately 6% and a sodium hydroxide concentration of approximately 4%) at 80°C for 15 minutes, and then immersed in a neutralizing solution ("Reduction solution SecuriganthP" manufactured by Atotech Japan Co., Ltd., an aqueous sulfuric acid solution) at 40°C for 5 minutes, and then dried at 80°C for 15 minutes.

[0604] (5) Formation of the conductor layer

[0605] According to the semi-additive method, a conductor layer was formed on the roughened surface of the insulating layer. That is, the substrate after roughening treatment was immersed in an electroless plating solution containing PdCl 2 at 40°C for 5 minutes, and then immersed in an electroless copper plating solution at 25°C for 20 minutes. Then, it was heated at 150°C for 30 minutes for annealing treatment, and then an anti-etching layer was formed, and patterning was performed by etching. Then, electrolytic copper sulfate plating was carried out to form a conductor layer with a thickness of 30 μm, and annealing treatment was carried out at 200°C for 60 minutes. The obtained substrate was designated as "evaluation substrate B".

[0606] <Measurement of the peel strength of the plated conductor layer>

[0607] The measurement of the peel strength between the insulating layer and the conductor layer was carried out according to Japanese Industrial Standard (JIS C6481). Specifically, a notch with a width of 10 mm and a length of 100 mm was formed on the conductor layer of evaluation substrate B, one end of it was peeled open, clamped with a fixture, and the load (kgf / cm) when tearing 35 mm vertically at a speed of 50 mm / minute at room temperature was measured, and the peel strength was calculated. A tensile testing machine ("AC-50C-SL" manufactured by TSE Co., Ltd.) was used in the measurement.

[0608] [Measurement of dielectric properties (dielectric constant, dissipation factor)]

[0609] The protective film was peeled off from the resin sheets produced in the examples and comparative examples, heated at 200°C for 90 minutes to thermally cure the resin composition layer, and then the support was peeled off. The obtained cured product was designated as "evaluation cured product C". The evaluation cured product C was cut into test pieces with a width of 2 mm and a length of 80 mm. For this test piece, using "HP8362B" manufactured by Agilent Technologies, the dielectric constant and dissipation factor were measured under the conditions of a measurement frequency of 5.8 GHz and a measurement temperature of 23°C by the resonant cavity perturbation method. The measurement was carried out for 3 test pieces, and the average value was calculated.

[0610] [Measurement of Elongation at Break]

[0611] For the cured product C for evaluation, in accordance with Japanese Industrial Standard (JIS K7127), a tensile test was conducted using a Tensilon universal testing machine ("RTC-1250A" manufactured by Orientec Corporation) to measure the elongation at break (%).

[0612] [Table 1]

[0613]

[0614] [Table 2]

[0615]

[0616] *In the table, "content of component (A)" represents the content of component (A) when the non-volatile components in the resin composition are set to 100% by mass, and "content of component (C)" represents the content of component (C) when the non-volatile components in the resin composition are set to 100% by mass.

[0617] It was confirmed that in Examples 1 to 16, even in the case of not containing components (C) to (F), although there were differences in degree, the results were the same as those of the above examples.

Claims

1. A resin composition, which is a resin composition containing the following component (A) and component (B), (A) A compound containing an aromatic ester skeleton and an unsaturated bond, (B) A radically polymerizable compound, wherein, (A) component is any one of the compounds represented by the following general formula (A-1) and the compound represented by the following general formula (A-2), In the general formula (A-1), Ar 11 each independently represents a monovalent aryl group optionally having a substituent, Ar 12 each independently represents a divalent aryl group optionally having a substituent, Ar 13 each independently represents a divalent aryl group optionally having a substituent, a divalent aliphatic hydrocarbon group optionally having a substituent, or a divalent group formed by combining them, and n represents an integer of 0 to 10, In the general formula (A-2), Ar 21 represents an m-valent aryl group which may optionally have substituents, and Ar 22 each independently represents a monovalent aryl group which may optionally have substituents, and m represents an integer of 2 or 3. When the non-volatile components in the resin composition are set to 100% by mass, the content of component (A) is 0.1% by mass or more and 30% by mass or less, (B) component is at least any one of a maleimide-based radically polymerizable compound containing a maleimide group, a vinylphenyl-based radically polymerizable compound containing a vinylphenyl group, a (meth)acrylic acid-based radically polymerizable compound, and a benzocyclobutene-based radically polymerizable compound, This (meth)acrylic acid-based radically polymerizable compound has a divalent cyclic group represented by the following formula (x), 2. The resin composition according to claim 1, wherein, When the non-volatile components in the resin composition are set to 100% by mass, the content of component (A) is 3% by mass or more.

3. The resin composition according to claim 1, wherein, When the non-volatile components in the resin composition are set to 100% by mass, the content of component (A) is 25% by mass or less.

4. The resin composition according to claim 1, which further contains (C) an inorganic filler.

5. The resin composition according to claim 4, wherein, When the non-volatile components in the resin composition are set to 100% by mass, the content of component (C) is 50% by mass or more.

6. The resin composition according to claim 4, wherein, When the non-volatile components in the resin composition are set to 100% by mass, the content of component (C) is 55% by mass or more.

7. The resin composition according to claim 4, wherein, When the non-volatile components in the resin composition are set to 100% by mass, the content of component (C) is 90% by mass or less.

8. The resin composition according to claim 4, wherein, When the non-volatile components in the resin composition are set to 100% by mass, the content of component (C) is 70% by mass or less.

9. The resin composition according to claim 1, which further contains (D) a thermoplastic resin.

10. The resin composition according to claim 9, wherein, When the non-volatile components in the resin composition are set to 100% by mass, the content of component (D) is 0.5% by mass or more.

11. The resin composition according to claim 9, wherein, When the non-volatile components in the resin composition are set to 100% by mass, the content of component (D) is 1.5% by mass or more.

12. The resin composition according to claim 9, wherein, When the non-volatile components in the resin composition are set to 100% by mass, the content of component (D) is 10% by mass or less.

13. The resin composition according to claim 9, wherein, When the non-volatile components in the resin composition are set to 100% by mass, the content of component (D) is 3% by mass or less.

14. The resin composition according to claim 1, which further contains (E) a thermosetting resin.

15. The resin composition according to claim 14, wherein when the non-volatile components in the resin composition are set to 100% by mass, the content of the component (E) is 5% by mass or more.

16. The resin composition according to claim 14, wherein when the non-volatile components in the resin composition are set to 100% by mass, the content of the component (E) is 15% by mass or more.

17. The resin composition according to claim 14, wherein when the non-volatile components in the resin composition are set to 100% by mass, the content of the component (E) is 25% by mass or less.

18. The resin composition according to claim 14, wherein when the non-volatile components in the resin composition are set to 100% by mass, the content of the component (E) is 15% by mass or less.

19. The resin composition according to claim 14, wherein the component (E) contains an epoxy resin.

20. The resin composition according to claim 14, wherein the component (E) contains a curing agent.

21. The resin composition according to claim 19, wherein when the non-volatile components in the resin composition are set to 100% by mass, the content of the epoxy resin is 5% by mass or more.

22. The resin composition according to claim 19, wherein when the non-volatile components in the resin composition are set to 100% by mass, the content of the epoxy resin is 15% by mass or more.

23. The resin composition according to claim 19, wherein when the non-volatile components in the resin composition are set to 100% by mass, the content of the epoxy resin is 25% by mass or less.

24. The resin composition according to claim 19, wherein when the non-volatile components in the resin composition are set to 100% by mass, the content of the epoxy resin is 15% by mass or less.

25. The resin composition according to claim 20, wherein when the non-volatile components in the resin composition are set to 100% by mass, the content of the curing agent is 1% by mass or more.

26. The resin composition according to claim 20, wherein when the non-volatile components in the resin composition are set to 100% by mass, the content of the curing agent is 5% by mass or more.

27. The resin composition according to claim 20, wherein when the non-volatile components in the resin composition are set to 100% by mass, the content of the curing agent is 20% by mass or less.

28. The resin composition according to claim 20, wherein when the non-volatile components in the resin composition are set to 100% by mass, the content of the curing agent is 10% by mass or less.

29. The resin composition according to claim 1, wherein the component (B) contains any one of a maleimide-based free-radical polymerizable compound containing a maleimide group and a vinylphenyl-based free-radical polymerizable compound containing a vinylphenyl group.

30. The resin composition according to claim 1, wherein when the non-volatile components in the resin composition are set to 100% by mass, the content of the component (B) is 1% by mass or more.

31. The resin composition according to claim 1, wherein, when the non-volatile components in the resin composition are set to 100% by mass, the content of component (B) is 10% by mass or more.

32. The resin composition according to claim 1, wherein, when the non-volatile components in the resin composition are set to 100% by mass, the content of component (B) is 40% by mass or less.

33. The resin composition according to claim 1, wherein, when the non-volatile components in the resin composition are set to 100% by mass, the content of component (B) is 30% by mass or less.

34. The resin composition according to claim 1, wherein, when the content of component (A) when the non-volatile components in the resin composition are set to 100% by mass is set as a, and the content of component (B) when the non-volatile components in the resin composition are set to 100% by mass is set as b, a / b is 0.05 or more and 3 or less.

35. The resin composition according to claim 1, wherein, when the content of component (A) when the non-volatile components in the resin composition are set to 100% by mass is set as a, and the content of component (B) when the non-volatile components in the resin composition are set to 100% by mass is set as b, a / b is 0.15 or more.

36. The resin composition according to claim 1, wherein, when the content of component (A) when the non-volatile components in the resin composition are set to 100% by mass is set as a, and the content of component (B) when the non-volatile components in the resin composition are set to 100% by mass is set as b, a / b is 1.5 or less.

37. The resin composition according to claim 1, which is used for forming an insulating layer.

38. The resin composition according to claim 1, which is used for forming an insulating layer, and the insulating layer is an insulating layer for forming a conductor layer.

39. A resin sheet, comprising: a support, and a resin composition layer provided on the support and containing the resin composition according to any one of claims 1 to 38.

40. A printed wiring board, comprising an insulating layer formed of a cured product of the resin composition according to any one of claims 1 to 38.

41. A semiconductor device, comprising the printed wiring board according to claim 40.

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