A method and system for simulating the thermal resistance of LEDs in a module

Abstract

The present invention provides a method and system for simulating the thermal resistance test of LEDs in a module, including: detecting the actual working current of the module, the actual soldering foot temperature of the target LED, and the actual ambient temperature of the target LED; intercepting the target LED and the PCB board where the target LED is located, and placing the target LED and the PCB board into a thermal resistance test device; setting the temperature of the thermal resistance test device to be consistent with the actual ambient temperature, and setting the test current of the thermal resistance test device to be consistent with the actual working current; when the temperature of the thermal resistance test device is stable, detecting the current soldering foot temperature of the target LED; when the current soldering foot temperature is consistent with the actual soldering foot temperature, controlling the thermal resistance test device to test the thermal resistance of the target LED. The present invention uses the soldering foot temperature and the ambient temperature to be equivalent, and tests the thermal resistance of the target LED under this condition.

Description

Technical Field

[0001] The present invention relates to the technical field of LED performance testing, and in particular to a method and system for simulating thermal resistance testing of LEDs in a module. Background Art

[0002] With the development of science and technology and the increasing shortage of energy, the research on semiconductor lighting has made great progress. Semiconductor products have many advantages and development potentials such as low power consumption, long service life and short response time, and have shown a trend of gradually replacing traditional lighting products. LED is a key device in semiconductor lighting. As the power is getting higher and higher, the dissipated power of high-power LEDs will cause the junction temperature of the LED chip PN junction to rise, which will significantly affect the luminosity, chromaticity and electrical parameters of the LED, and may even cause the device to fail. Therefore, in the application of LED complete machines and modules, such as TV modules, LEDs with small thermal resistance and low junction temperature will be given priority. At the same time, complete machine module manufacturers are not only concerned with the thermal resistance and junction temperature measurement of a single LED, but also pay more attention to the actual thermal resistance of the internal light bar LED in the complete machine or module state, so as to provide strong support for the module reliability design.

[0003] The traditional method for testing the thermal resistance of LEDs is to use the T3ster device, place the LED in a constant temperature chamber, calculate the thermal parameter K coefficient by adjusting the voltage obtained by the test at different temperatures, and then increase and decrease the temperature to obtain the cooling curve. The cooling curve is subjected to the structure function by the T3ster device, and the thermal resistance of the LED is obtained by differentiating the structure function and integrating the structure function.

[0004] However, this test method can only test the thermal resistance of a single LED, because the TV module cannot be placed in the T3ster constant temperature chamber, and the temperature cannot be quickly raised or lowered to obtain a cooling curve. Therefore, the thermal resistance of the LED in the module state cannot be tested.

[0005] Therefore, the prior art has defects and needs to be improved and developed. Summary of the invention

[0006] The technical problem to be solved by the present invention is that, in view of the above-mentioned defects of the prior art, a method and system for simulating the thermal resistance test of LEDs in a module is provided, aiming to solve the problem in the prior art that the thermal resistance of LEDs cannot be tested in the module state when measuring the thermal resistance of LEDs.

[0007] The technical solution adopted by the present invention to solve the technical problem is as follows:

[0008] A method for simulating thermal resistance testing of LEDs in a module, comprising:

[0009] Detect the actual working current of the module, the actual soldering foot temperature of the target LED, and the actual ambient temperature of the target LED;

[0010] Cut off the target LED and the PCB board where the target LED is located, and put the target LED and the PCB board into a thermal resistance testing device;

[0011] Setting the temperature of the thermal resistance testing device to be consistent with the actual ambient temperature, and setting the test current of the thermal resistance testing device to be consistent with the actual operating current;

[0012] When the temperature of the thermal resistance test equipment is stable, the current soldering foot temperature of the target LED is detected;

[0013] When the current soldering foot temperature is consistent with the actual soldering foot temperature, the thermal resistance testing device is controlled to test the thermal resistance of the target LED.

[0014] Furthermore, the step of detecting the actual working current of the module, the actual soldering foot temperature of the target LED, and the actual ambient temperature of the target LED specifically includes:

[0015] Detect the actual working current of the module;

[0016] After the module is burned in for a predetermined time, the actual solder pin temperature of the LEDs in the module is detected, and the target LED with the highest actual solder pin temperature is determined;

[0017] The actual ambient temperature of the target LED is detected.

[0018] Furthermore, the step of intercepting the target LED and the PCB board where the target LED is located, and placing the target LED and the PCB board into a thermal resistance testing device specifically includes:

[0019] Cut off the target LED and the PCB board where the target LED is located according to the standard size range, and record the size parameters of the PCB board;

[0020] The target LED and PCB board are placed in a thermal resistance test device.

[0021] Furthermore, when the temperature of the thermal resistance testing device is stable, the step of detecting the current soldering foot temperature of the target LED specifically includes:

[0022] When the temperature of the thermal resistance test equipment is stable, record the current solder pin temperature of the target LED;

[0023] If the current soldering foot temperature is inconsistent with the actual soldering foot temperature, the size of the PCB board is adjusted until the current soldering foot temperature is consistent with the actual soldering foot temperature.

[0024] Further, if the current soldering foot temperature is inconsistent with the actual soldering foot temperature, the step of adjusting the size of the PCB board until the current soldering foot temperature is consistent with the actual soldering foot temperature specifically includes:

[0025] If the current soldering foot temperature is inconsistent with the actual soldering foot temperature, determining the magnitude relationship between the current soldering foot temperature and the actual soldering foot temperature;

[0026] If the current soldering foot temperature is lower than the actual soldering foot temperature, the size of the PCB board is reduced until the current soldering foot temperature is consistent with the actual soldering foot temperature.

[0027] Further, if the current soldering foot temperature is inconsistent with the actual soldering foot temperature, the step of determining the magnitude relationship between the current soldering foot temperature and the actual soldering foot temperature further includes:

[0028] If the current soldering foot temperature is greater than the actual soldering foot temperature, the size of the PCB board is increased until the current soldering foot temperature is consistent with the actual soldering foot temperature.

[0029] Further, when the current soldering foot temperature is consistent with the actual soldering foot temperature, the step of controlling the thermal resistance testing device to test the thermal resistance of the target LED specifically includes:

[0030] When the current solder foot temperature is consistent with the actual solder foot temperature, controlling the thermal resistance test equipment to test the K coefficient and the temperature drop curve of the target LED under the final PCB board size;

[0031] The structure function is extracted from the cooling curve, and the integral structure and the differential structure are performed, and the thermal resistance of the target LED is automatically analyzed from the structure function.

[0032] Further, when the current solder foot temperature is consistent with the actual solder foot temperature, after the step of controlling the thermal resistance testing device to test the thermal resistance of the target LED, the step further includes:

[0033] After testing the thermal resistance of the target LED, a thermal resistance value of the target LED is obtained;

[0034] The thermal resistance value of the target LED is compared with a standard thermal resistance value range to obtain a comparison result.

[0035] Further, after testing the thermal resistance of the target LED, the step of obtaining the thermal resistance value of the target LED further includes:

[0036] According to the actual working current, the actual solder foot temperature of the target LED and the actual ambient temperature of the target LED, the theoretical thermal resistance value of the target LED is calculated using a known theoretical calculation formula;

[0037] The thermal resistance value of the target LED is compared with the theoretical thermal resistance value.

[0038] The present invention also provides a LED thermal resistance simulation test system in a module, which includes:

[0039] Current tester, used to detect the actual working current of the module after connecting to the module;

[0040] A temperature tester is used to connect to the PCB board where the LED in the module is located, and detect the actual solder foot temperature of the target LED and the actual ambient temperature of the target LED;

[0041] A thermal resistance testing device connected to the temperature tester is used to place the intercepted target LED and the PCB board where the target LED is located, and to test the thermal resistance of the target LED when the temperature is the actual ambient temperature, the current is the actual working current, and the current solder foot temperature is consistent with the actual solder foot temperature.

[0042] The present invention provides a method and system for simulating the thermal resistance test of LEDs in a module, comprising: detecting the actual working current of the module, the actual soldering foot temperature of a target LED, and the actual ambient temperature of the target LED; intercepting the target LED and the PCB board where the target LED is located, and placing the target LED and the PCB board into a thermal resistance test device; setting the temperature of the thermal resistance test device to be consistent with the actual ambient temperature, and setting the test current of the thermal resistance test device to be consistent with the actual working current; when the temperature of the thermal resistance test device is stable, detecting the current soldering foot temperature of the target LED; when the current soldering foot temperature is consistent with the actual soldering foot temperature, controlling the thermal resistance test device to test the thermal resistance of the target LED. The present invention utilizes the equivalence of soldering foot temperature and ambient temperature, so that the actual ambient temperature and the actual soldering foot temperature of the target LED in the module state are the same as the ambient temperature and the soldering foot temperature in the thermal resistance test device, thereby testing the thermal resistance of the target LED. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] Figure 1 It is a flow chart of a preferred embodiment of the LED thermal resistance simulation test method in the module of the present invention.

[0044] Figure 2 It is a schematic diagram of the connection of LEDs in a module in a preferred embodiment of the LED thermal resistance simulation test method in the module of the present invention.

[0045] Figure 3 It is a schematic diagram of the structure of the target LED in the constant temperature chamber in a preferred embodiment of the LED thermal resistance simulation test method in the module of the present invention.

[0046] Figure 4 In a preferred embodiment of the LED thermal resistance simulation test method in the module of the present invention, the transient temperature curve corresponding to the L1 and L2 dimensions is obtained by using the K coefficient and the condensation curve.

[0047] Figure 5 In the preferred embodiment of the LED thermal resistance simulation test method in the module of the present invention, the thermal resistance corresponding to the dimensions L1 and L2 is obtained by substituting the structure function.

[0048] Figure 6 It is a functional principle block diagram of a preferred embodiment of the LED thermal resistance simulation test system in the module of the present invention. DETAILED DESCRIPTION

[0049] In order to make the purpose, technical solution and advantages of the present invention clearer and more specific, the present invention is further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0050] At present, the most common method for measuring thermal resistance of LEDs in the industry is the electrical parameter method, using the T3ster device. T3Ster is based on the advanced JEDEC'Static Method' test method (JESD51-1). By changing the input power of electronic devices, the device produces temperature changes. However, the device can only measure the thermal resistance of LEDs in small modules with a scale of about 30MM or less, and cannot measure the thermal resistance of LEDs in the state of a whole machine or module. In other words, there is currently no method in the industry to test the thermal resistance of internal light strip LEDs in the state of a module or a whole machine. The test method used in the present invention is based on the principle of the electrical parameter method, and at the same time uses the "solder foot temperature, ambient temperature" equivalent method, which can truly simulate the thermal resistance of the module or the internal light strip LED of the whole machine, and has good scientific research reference value and high practical value.

[0051] See also Figure 1 , Figure 1 FIG. 1 is a flow chart of a method for simulating the thermal resistance of LEDs in a module of the present invention. Figure 1 As shown, the LED thermal resistance simulation test method in the module according to the embodiment of the present invention includes the following steps:

[0052] S100, detecting the actual working current of the module, the actual soldering foot temperature of the target LED, and the actual ambient temperature of the target LED.

[0053] In one implementation, step S100 specifically includes:

[0054] S110, detecting the actual working current of the module.

[0055] Specifically, a current tester is provided, and the current tester is connected to the module via a connecting line, and the actual working current IF of the module is tested by the current tester.

[0056] S120, after the module is burned in for a predetermined time, the actual soldering foot temperatures of the LEDs in the module are detected, and a target LED having the highest actual soldering foot temperature is determined.

[0057] Specifically, a temperature tester is provided, and the temperature tester is connected to the LED light bar inside the module through a connecting line. The present invention selects the LED with the highest temperature rise in the module as the target LED. Generally, when selecting, since the developer will perform a temperature test on the internal LED after the module is produced, the LED with the highest temperature rise in the module can be directly known. Of course, after the predetermined burn-in time, the connecting line of the temperature tester can be connected to the soldering feet of multiple LEDs to test the soldering feet temperature of multiple LEDs, and then the LED with the highest soldering foot temperature is selected as the target LED.

[0058] The LED with the highest temperature rise is usually located near the power board. In addition, after 2 hours of burn-in, the actual solder foot temperature Tc1 of the target LED with the highest temperature rise can be tested.

[0059] S130: Detect the actual ambient temperature of the target LED.

[0060] Specifically, Figure 2 As shown, probe 1 tests the actual soldering foot temperature of the target LED 41 , and probe 2 is placed near the target LED 41 to test the ambient temperature Ta1 of the target LED 41 in the module.

[0061] The step S100 is followed by: S200, intercepting the target LED and the PCB board where the target LED is located, and placing the target LED and the PCB board into a thermal resistance testing device.

[0062] In one implementation, step S200 specifically includes:

[0063] S210, intercepting the target LED and the PCB board where the target LED is located according to the standard size range, and recording the size parameters of the PCB board;

[0064] S220, placing the target LED and PCB board into a thermal resistance testing device.

[0065] Specifically, the thermal resistance test equipment is a T3ster thermal resistance tester, which has a constant temperature bath. Cut off the PCB board of the target LED and record the length as L1. Of course, the width of the PCB board can also be recorded. The standard size range refers to the empirical value range to improve the accuracy of the interception and improve the test efficiency. Dig holes on the copper foil of the PCB board and solder the wires, including the connecting wires for testing the temperature rise and thermal resistance, such as Figure 3 As shown, the target LED 41 and the PCB board 42 are placed in the constant temperature chamber 31 of the T3ster thermal resistance tester.

[0066] The step S200 is followed by: S300, setting the temperature of the thermal resistance testing device to be consistent with the actual ambient temperature, and setting the test current of the thermal resistance testing device to be consistent with the actual working current.

[0067] Specifically, the temperature of the thermostat of the thermal resistance test equipment is set to Ta2, and Ta1=Ta2; at the same time, the test current is set to IF. After the temperature stabilizes, the temperature rise of the target LED with a length of L1 is recorded as Tc2.

[0068] The step S300 is followed by: S400, when the temperature of the thermal resistance testing device is stable, detecting the current soldering foot temperature of the target LED.

[0069] In one implementation, step S400 specifically includes:

[0070] S410, when the temperature of the thermal resistance test device is stable, record the current soldering foot temperature of the target LED;

[0071] S420: If the current soldering foot temperature is inconsistent with the actual soldering foot temperature, adjust the size of the PCB board until the current soldering foot temperature is consistent with the actual soldering foot temperature.

[0072] That is to say, the present invention utilizes the equivalence of "solder pin temperature and ambient temperature" and designs corresponding PCB specifications so that the solder pin temperature and ambient temperature of the target LED measured by the T3ster thermal resistance tester are equivalent to the LED solder pin and ambient temperature in the actual module or complete machine state, and the thermal resistance measured by the target LED is equivalent to the LED thermal resistance in the module or complete machine state. Among them, the target LED module being tested and the original light bar LED of the complete machine / module have the same ambient temperature, LED specifications, heat dissipation material, drive current and the same solder pin temperature. Therefore, the thermal resistance of the target LED is equivalent to the thermal resistance of the original light bar LED in the original complete machine / module.

[0073] Furthermore, the step S420 specifically includes:

[0074] S421, if the current soldering foot temperature is inconsistent with the actual soldering foot temperature, determining the magnitude relationship between the current soldering foot temperature and the actual soldering foot temperature;

[0075] S422a. If the current solder foot temperature is lower than the actual solder foot temperature, reduce the size of the PCB board until the current solder foot temperature is consistent with the actual solder foot temperature.

[0076] That is to say, if Tc1 is greater than Tc2, the size of the PCB board will continue to be reduced until Tc1 = Tc2. Reducing the PCB board means continuing to cut the PCB board. Generally, according to the empirical value, the PCB board is first cut into a size slightly larger than the empirical value to facilitate subsequent cutting to prevent the size of the PCB board from being too small.

[0077] Furthermore, after step S421, the following steps are further included:

[0078] S422b. If the current solder foot temperature is greater than the actual solder foot temperature, increase the size of the PCB board until the current solder foot temperature is consistent with the actual solder foot temperature.

[0079] That is, if Tc1<Tc2, the size of the PCB board is increased until Tc1=Tc2. The method of increasing the size of the PCB board is generally to replace the target LED and PCB board with a larger PCB board with the same material and other parameters.

[0080] The step S400 is followed by: S500, when the current soldering foot temperature is consistent with the actual soldering foot temperature, controlling the thermal resistance testing device to test the thermal resistance of the target LED.

[0081] In one implementation, step S500 specifically includes:

[0082] S510, when the current solder foot temperature is consistent with the actual solder foot temperature, controlling the thermal resistance test equipment to test the K coefficient and the temperature drop curve of the target LED under the final PCB board size;

[0083] S520, extracting a structure function from the cooling curve, performing integral structure and differential structure analysis, and automatically analyzing the thermal resistance of the target LED from the structure function.

[0084] That is to say, when Ta1=Ta2, Tc1=Tc2 is satisfied, the K coefficient and cooling curve of the target LED under the PCB length (L2) are tested, and then the structure function is extracted from the cooling curve, and the integral structure and differential structure are performed to automatically analyze the thermal resistance of the LED from the structure function, such as Figure 4 and Figure 5 shown.

[0085] Specifically, the process of testing the thermal resistance of LED by T3ster thermal resistance tester is as follows: placing the sample, testing the voltage at different temperatures (the linear curve is the K coefficient), testing the cooling curve, the curve structure function, integrating and differentiating the curve, and knowing the thermal resistance at different positions from the curve. Among them, the K coefficient means that under low current, the voltage and temperature are linearly related, and the linear relationship formula is: K = △T / △V, Rth = △T / P = (K*△V) / P. The cooling curve means that under low current, the LED PN junction hardly generates heat and the voltage is high; under high current, the LED PN temperature is approximately equal to Tj. The structure function refers to the calculation theory unique to the T3ster thermal resistance tester. By analyzing the structure function, the thermal resistance of different layers of the LED can be obtained. The integral and differential curve refers to the converted more intuitive curve diagram, which is convenient for confirming the thermal resistance of each layer. The process of testing the thermal resistance of LED by T3ster thermal resistance tester is a prior art and will not be repeated here.

[0086] In one implementation, after step S500, the following steps are further performed:

[0087] S610, after testing the thermal resistance of the target LED, obtaining the thermal resistance value of the target LED;

[0088] S620: Compare the thermal resistance value of the target LED with a standard thermal resistance value range to obtain a comparison result.

[0089] That is to say, testing the thermal resistance of the target LED is to simulate the thermal resistance of the LED in a module (such as a TV module). The module has a standard thermal resistance value range. The thermal resistance value of the target LED is compared with the standard thermal resistance value range to obtain a comparison result, thereby confirming whether the distribution of LED heat meets the range requirements.

[0090] In a further implementation, the step S500 further includes:

[0091] S710, calculating the theoretical thermal resistance value of the target LED using a known theoretical calculation formula according to the actual working current, the actual solder foot temperature of the target LED, and the actual ambient temperature of the target LED;

[0092] S720: Compare the thermal resistance value of the target LED with the theoretical thermal resistance value.

[0093] Specifically, the theoretical calculation formula is: Rth = (Tj-Tc) / P;

[0094] Among them, Tj is the junction temperature of the LED to be tested when the temperature is stable, that is, the temperature of the LED internal chip; Tc is the solder foot temperature in a stable environment; P is the power dissipated by the LED to be tested in the heat conduction channel; Rth is the thermal resistance between the PN junction of the LED to be tested and the specified reference point (point C). In addition, the value of Tj is obtained during the test of Rth.

[0095] The present invention is tested and verified according to the above method in 32-inch, 43-inch, 50-inch, 55-inch and 65-inch TV modules, and the obtained LED thermal resistance is basically consistent with the LED thermal resistance calculated by the above theoretical calculation formula. Therefore, the above test method can be used to simulate the thermal resistance of the LED in the TV module state to confirm whether the design meets the requirements.

[0096] That is to say, the traditional LED thermal resistance test needs to be fixed in the T3ster constant temperature chamber, and the cooling curve needs to be tested, so the thermal resistance of the LED in the module state cannot be tested. The present invention uses the "solder foot temperature, ambient temperature" equivalence, and changes the PCB size of the LED to achieve the same ambient temperature Ta1 and LED solder foot temperature Tc1 in the module state and the ambient temperature Ta2 and LED solder foot temperature Tc2 in the T3ster constant temperature chamber, thereby simulating the thermal resistance of the light strip LED inside the module, thereby confirming whether the heat distribution of the LED meets the requirements and whether the design is standardized, thereby improving the accuracy, scientificity and reliability of the module whole machine LED life evaluation method.

[0097] The present invention also discloses a LED thermal resistance simulation test system in a module, please refer to Figure 6 ,include:

[0098] The current tester 10 is used to detect the actual working current of the module 40 after being connected to the module 40; the details are as described above;

[0099] The temperature tester 20 is used to connect to the PCB board where the LED in the module 40 is located, and detect the actual soldering foot temperature of the target LED 41 and the actual ambient temperature of the target LED 41; the details are as described above;

[0100] A thermal resistance testing device 30 connected to the temperature tester 20 is used to place the intercepted target LED 41 and the PCB board where the target LED 41 is located, and to test the thermal resistance of the target LED 41 when the temperature is the actual ambient temperature, the current is the actual working current, and the current solder foot temperature is consistent with the actual solder foot temperature; as described above.

[0101] In summary, the present invention discloses a method and system for simulating thermal resistance testing of LEDs in a module, including: detecting the actual working current of the module, the actual soldering foot temperature of the target LED, and the actual ambient temperature of the target LED; intercepting the target LED and the PCB board where the target LED is located, and placing the target LED and the PCB board into a thermal resistance testing device; setting the temperature of the thermal resistance testing device to be consistent with the actual ambient temperature, and setting the test current of the thermal resistance testing device to be consistent with the actual working current; when the temperature of the thermal resistance testing device is stable, detecting the current soldering foot temperature of the target LED; when the current soldering foot temperature is consistent with the actual soldering foot temperature, controlling the thermal resistance testing device to test the thermal resistance of the target LED. The present invention utilizes the equivalence of soldering foot temperature and ambient temperature, so that the actual ambient temperature and the actual soldering foot temperature of the target LED in the module state are the same as the ambient temperature and the soldering foot temperature in the thermal resistance testing device, thereby testing the thermal resistance of the target LED.

[0102] It should be understood that the application of the present invention is not limited to the above examples. For ordinary technicians in this field, improvements or changes can be made based on the above description. All these improvements and changes should fall within the scope of protection of the claims attached to the present invention.

Claims

1. A method for simulating the thermal resistance of LEDs in a module, characterized in that: include: Detect the actual working current of the module, the actual soldering foot temperature of the target LED, and the actual ambient temperature of the target LED; Cut off the target LED and the PCB board where the target LED is located, and put the target LED and the PCB board into a thermal resistance testing device; Setting the temperature of the thermal resistance testing device to be consistent with the actual ambient temperature, and setting the test current of the thermal resistance testing device to be consistent with the actual operating current; When the temperature of the thermal resistance test equipment is stable, the current soldering foot temperature of the target LED is detected; When the current soldering foot temperature is consistent with the actual soldering foot temperature, controlling the thermal resistance testing device to test the thermal resistance of the target LED; The steps of detecting the actual working current of the module, the actual soldering foot temperature of the target LED, and the actual ambient temperature of the target LED specifically include: Detect the actual working current of the module; After the module is burned in for a predetermined time, the actual solder pin temperature of the LEDs in the module is detected, and the target LED with the highest actual solder pin temperature is determined; Detecting the actual ambient temperature of the target LED; When the temperature of the thermal resistance test device is stable, the step of detecting the current soldering foot temperature of the target LED specifically includes: When the temperature of the thermal resistance test equipment is stable, record the current solder pin temperature of the target LED; If the current soldering foot temperature is inconsistent with the actual soldering foot temperature, adjusting the size of the PCB board until the current soldering foot temperature is consistent with the actual soldering foot temperature; By using the solder foot temperature and ambient temperature equivalence, by adjusting the PCB size, the solder foot temperature and ambient temperature of the target LED measured by the thermal resistance test equipment are adjusted to be consistent with the LED solder foot and ambient temperature in the actual module or complete machine state, and the thermal resistance measured by the target LED is equivalent to the LED thermal resistance in the module or complete machine state; The step of intercepting the target LED and the PCB board where the target LED is located, and placing the target LED and the PCB board into the thermal resistance testing equipment specifically includes: Cut off the target LED and the PCB board where the target LED is located according to the standard size range, and record the size parameters of the PCB board; Put the target LED and PCB board into a thermal resistance test device; If the current soldering foot temperature is inconsistent with the actual soldering foot temperature, the step of adjusting the size of the PCB board until the current soldering foot temperature is consistent with the actual soldering foot temperature specifically includes: If the current soldering foot temperature is inconsistent with the actual soldering foot temperature, determining the magnitude relationship between the current soldering foot temperature and the actual soldering foot temperature; If the current soldering foot temperature is lower than the actual soldering foot temperature, reducing the size of the PCB board until the current soldering foot temperature is consistent with the actual soldering foot temperature; If the current soldering foot temperature is inconsistent with the actual soldering foot temperature, the step of determining the magnitude relationship between the current soldering foot temperature and the actual soldering foot temperature further includes: If the current soldering foot temperature is greater than the actual soldering foot temperature, increasing the size of the PCB board until the current soldering foot temperature is consistent with the actual soldering foot temperature; When the current solder foot temperature is consistent with the actual solder foot temperature, the step of controlling the thermal resistance testing device to test the thermal resistance of the target LED specifically includes: When the current solder foot temperature is consistent with the actual solder foot temperature, controlling the thermal resistance test equipment to test the K coefficient and the temperature drop curve of the target LED under the final PCB board size; Extracting the structure function of the cooling curve, performing integral structure and differential structure, and automatically analyzing the thermal resistance of the target LED from the structure function; After the preset burn-in time, connect the connection wires of the temperature tester to the soldering feet of multiple LEDs, test the soldering feet temperatures of multiple LEDs, and select the LED with the highest soldering foot temperature as the target LED.

2. The LED thermal resistance simulation test method in a module according to claim 1, characterized in that: When the current solder foot temperature is consistent with the actual solder foot temperature, after the step of controlling the thermal resistance testing device to test the thermal resistance of the target LED, the step further includes: After testing the thermal resistance of the target LED, a thermal resistance value of the target LED is obtained; The thermal resistance value of the target LED is compared with a standard thermal resistance value range to obtain a comparison result.

3. The LED thermal resistance simulation test method in a module according to claim 2, characterized in that: After testing the thermal resistance of the target LED, the step of obtaining the thermal resistance value of the target LED further includes: According to the actual working current, the actual solder foot temperature of the target LED and the actual ambient temperature of the target LED, the theoretical thermal resistance value of the target LED is calculated using a known theoretical calculation formula; The thermal resistance value of the target LED is compared with the theoretical thermal resistance value.

4. A LED thermal resistance simulation test system in a module, characterized in that: include: Current tester, used to detect the actual working current of the module after connecting to the module; A temperature tester is used to connect to the PCB board where the LED in the module is located, and detect the actual solder foot temperature of the target LED and the actual ambient temperature of the target LED; A thermal resistance test device connected to the temperature tester, the thermal resistance test device is used to place the intercepted target LED and the PCB board where the target LED is located, and to test the thermal resistance of the target LED when the temperature is the actual ambient temperature, the current is the actual working current, and the current solder foot temperature is consistent with the actual solder foot temperature; Detect the actual working current of the module, and after the module is burned in for a predetermined time, detect the actual soldering foot temperature of the LED in the module, and determine the target LED with the highest actual soldering foot temperature; Detecting the actual ambient temperature of the target LED; When the temperature of the thermal resistance test device is stable, the current soldering foot temperature of the target LED is recorded; if the current soldering foot temperature is inconsistent with the actual soldering foot temperature, the size of the PCB board is adjusted until the current soldering foot temperature is consistent with the actual soldering foot temperature; By using the solder foot temperature and ambient temperature equivalence, by adjusting the PCB size, the solder foot temperature and ambient temperature of the target LED measured by the thermal resistance test equipment are adjusted to be consistent with the LED solder foot and ambient temperature in the actual module or complete machine state, and the thermal resistance measured by the target LED is equivalent to the LED thermal resistance in the module or complete machine state; The thermal resistance test device is used to place the intercepted target LED and the PCB board where the target LED is located, specifically comprising: intercepting the target LED and the PCB board where the target LED is located according to the standard size range, and recording the size parameters of the PCB board; placing the target LED and the PCB board into the thermal resistance test device; If the current soldering foot temperature is inconsistent with the actual soldering foot temperature, adjusting the size of the PCB board until the current soldering foot temperature is consistent with the actual soldering foot temperature, specifically including: if the current soldering foot temperature is inconsistent with the actual soldering foot temperature, determining the size relationship between the current soldering foot temperature and the actual soldering foot temperature; if the current soldering foot temperature is less than the actual soldering foot temperature, reducing the size of the PCB board until the current soldering foot temperature is consistent with the actual soldering foot temperature; If the current soldering foot temperature is inconsistent with the actual soldering foot temperature, then after determining the magnitude relationship between the current soldering foot temperature and the actual soldering foot temperature, the method further includes: if the current soldering foot temperature is greater than the actual soldering foot temperature, increasing the size of the PCB board until the current soldering foot temperature is consistent with the actual soldering foot temperature; When the current solder foot temperature is consistent with the actual solder foot temperature, controlling the thermal resistance test device to test the thermal resistance of the target LED, specifically including: when the current solder foot temperature is consistent with the actual solder foot temperature, controlling the thermal resistance test device to test the K coefficient and the cooling curve of the target LED under the final PCB board size; extracting the structure function of the cooling curve, performing integral structure and differential structure, and automatically analyzing the thermal resistance of the target LED from the structure function; After the preset burn-in time, connect the connection wires of the temperature tester to the soldering feet of multiple LEDs, test the soldering feet temperatures of multiple LEDs, and select the LED with the highest soldering foot temperature as the target LED.

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