Chip testing device

Abstract

The present invention provides a chip testing device for performing electrical performance testing on a chip to be tested, comprising: a test printed circuit board, comprising a front side and a back side arranged relatively to each other, the front side being fixed with a chip test socket, the chip test socket being used to insert the chip to be tested; and a support structure, the support structure being fixed and connected to the back side of the test printed circuit board, and being used to support the chip test socket from the back side. The present invention solves the problem of over-standard warping of the test printed circuit board through the support structure, reduces its influence on the test results, and avoids machine time loss and production delay.

Description

Technical Field

[0001] The present invention relates to the field of chip testing, and in particular to a chip testing device. Background Art

[0002] When testing the electrical performance of a chip on a printed circuit board, the chip to be tested needs to be automatically placed into a chip test socket on the printed circuit board by a robot. The chip test socket usually adopts a pogo pin test socket. The process of placing the chip to be tested into the chip test socket is to place each pin of the chip into the corresponding pogo pin. When each pin is placed into the pogo pin, the pressure on the pogo pin is about 30g, for example. The number of pins of the chip to be tested may be thousands, so when these thousands of pins are placed into the pogo pins, the total pressure on all the pogo pins can reach tens of kilograms. These weights will act on the test socket of the printed circuit board.

[0003] During the high-frequency and high-pressure chip testing process, it is very easy to cause the test printed circuit board to exceed the standard warpage (the allowable warpage standard is generally less than 5%). In other words, the warpage of the test printed circuit board exceeds 5%, which affects the chip test results on the test printed circuit board, and then causes the chip test to be unable to continue. The test printed circuit board needs to be repaired or replaced, resulting in machine time loss and production delays. Summary of the invention

[0004] The object of the present invention is to provide a chip testing device to solve the problem of over-standard warping of a printed circuit board, thereby reducing its influence on the test result and avoiding machine time loss and production delay.

[0005] In order to solve the above problems, the present invention provides a chip testing device for performing electrical performance testing on a chip to be tested, comprising:

[0006] A test printed circuit board comprises a front side and a back side which are arranged opposite to each other, wherein a chip test socket is fixed on the front side, and the chip test socket is used to insert the chip to be tested;

[0007] A support structure is fixed and connected to the back side of the test printed circuit board and is used for supporting the chip test socket from the back side.

[0008] Optionally, the support structure comprises a support plate, a surface of the support plate facing the test printed circuit board is provided with a plurality of support columns with adjustable positions, and the support columns are used to support the chip test socket on the test printed circuit board.

[0009] Furthermore, at least four supporting columns with adjustable positions are arranged on the surface of the support plate facing the test printed circuit board.

[0010] Furthermore, the plurality of supporting posts are supported around the chip test socket in a lattice shape.

[0011] Furthermore, the supporting column is an iron supporting column.

[0012] Furthermore, the support plate has a plurality of strong magnets, the strong magnets are embedded in the support plate, and the support plate exposes the strong magnets toward the surface of the test printed circuit board.

[0013] Furthermore, one end of the supporting column is adsorbed on the strong magnet stone through the strong magnetism of the strong magnet stone, and the other end of the supporting column supports the back side of the test printed circuit board, and one strong magnet stone adsorbs at least one strong magnet stone.

[0014] Furthermore, the number of the strong magnets is greater than the number of the supporting columns.

[0015] Furthermore, the test printed circuit board has a plurality of first through holes, which penetrate the front and back sides of the test printed circuit board along the thickness direction of the test printed circuit board, and are evenly arranged at the edge of the test printed circuit board.

[0016] Furthermore, the support plate has a plurality of second through holes, the second through holes penetrate the support plate along the thickness direction of the support plate, and the plurality of second through holes are evenly arranged at the edge of the support structure.

[0017] Further, the number of the second through holes is the same as the number of the first through holes, and the first through holes and the second through holes are arranged opposite to each other.

[0018] Furthermore, the support structure also includes a fastening member, which is used to connect and fix the support plate and the test printed circuit board.

[0019] Furthermore, the number of the tightening members is the same as the number of the first through holes.

[0020] Furthermore, each of the fastening members passes through a first through hole and a second through hole directly opposite to the first through hole, so as to connect and fix the test printed circuit board to the support plate.

[0021] Compared with the prior art, the present invention has the following beneficial effects:

[0022] The present invention provides a chip testing device for performing electrical performance testing on a chip to be tested, comprising: a test printed circuit board, comprising a front side and a back side arranged relatively to each other, the front side being fixed with a chip test socket, the chip test socket being used to insert the chip to be tested; and a support structure, the support structure being fixed and connected to the back side of the test printed circuit board, and being used to support the chip test socket from the back side. The present invention solves the problem of over-standard warping of the test printed circuit board through the support structure, reduces its influence on the test results, and avoids machine time loss and production delay. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 The figure is a schematic structural diagram of a chip testing device according to an embodiment of the present invention.

[0024] Description of reference numerals:

[0025] 10-test printed circuit board 10; 10a-front side 10a; 10b-back side 10b; 11-chip test socket; 12-first through hole;

[0026] 20-support structure; 21-support plate; 22-second through hole; 23-tightening member; 231-bolt; 24-support column; 25-strong magnet stone. DETAILED DESCRIPTION

[0027] A chip testing device of the present invention will be described in further detail below. The present invention will be described in more detail below with reference to the accompanying drawings, in which preferred embodiments of the present invention are shown. It should be understood that those skilled in the art can modify the present invention described herein and still achieve the beneficial effects of the present invention. Therefore, the following description should be understood as being widely known to those skilled in the art and not as a limitation of the present invention.

[0028] For the sake of clarity, not all features of the actual embodiments are described. In the following description, well-known functions and structures are not described in detail because they would clutter the invention with unnecessary detail. It should be recognized that in the development of any actual embodiment, a large number of implementation details must be made to achieve the developer's specific goals, such as changing from one embodiment to another according to the limitations of the relevant system or the relevant business. In addition, it should be recognized that such development work may be complex and time-consuming, but it is just a routine task for those skilled in the art.

[0029] In order to make the purpose and features of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are further described below in conjunction with the accompanying drawings. It should be noted that the accompanying drawings are all in a very simplified form and use inaccurate ratios, which are only used to conveniently and clearly assist in explaining the purpose of the embodiments of the present invention.

[0030] Figure 1 FIG. 1 is a schematic diagram of the structure of a chip testing device according to the present embodiment. Figure 1 As shown, this embodiment provides a chip testing device, which is used to perform electrical performance testing on a chip to be tested, wherein the chip to be tested includes a plurality of pins.

[0031] The chip testing device includes a test printed circuit board 10, and the shape of the test printed circuit board 10 is, for example, square. The test printed circuit board 10 includes a front side 10a and a back side 10b that are arranged opposite to each other, and the front side 10a can be inserted with the chip to be tested, and the back side 10b is provided with precision components. The test printed circuit board 10 has a chip test socket 11, and the chip test socket 11 is fixed on the front side 10a. Specifically, the chip test socket 11 is welded on the front side 10a.

[0032] The chip test socket 11 is, for example, a pogo pin test socket, which has a plurality of pogo pins, and the number of pogo pins is the same as the number of pins of the chip to be tested. When testing the electrical performance of the chip to be tested, the chip to be tested needs to be inserted into the chip test socket 11, and specifically, each pin of the chip to be tested needs to be inserted into the pogo pin corresponding to the chip test socket 11.

[0033] The test printed circuit board 10 has a plurality of first through holes 12, and the plurality of first through holes 12 penetrate the front side 10a and the back side 10b of the test printed circuit board along the thickness direction of the test printed circuit board 10. The plurality of first through holes 12 are evenly arranged at the edge of the test printed circuit board 10. Preferably, the test printed circuit board 10 has four first through holes 12, and the four first through holes 12 are respectively arranged at the edge of each side of the square test printed circuit board 10, and the connecting line of the first through holes 12 on two opposite sides is parallel to the other two sides. Preferably, the four first through holes 12 are located at the center of the side where they are located.

[0034] The chip testing device also includes a manipulator (not shown in the figure), which can take the chip to be tested and insert the chip to be tested into the chip test socket 11. During this process, the manipulator generates downward pressure on the chip test socket 11 through the chip to be tested, and the total pressure is, for example, the product of the number of pins of the chip to be tested and the downward pressure required for each pin to be inserted into the chip test socket 11. This downward pressure can easily cause excessive warping of the test printed circuit board 10 during hundreds or thousands of insertions.

[0035] In order to solve the problem of excessive warping of the test printed circuit board 10, the chip testing device also includes a support structure 20, which is fixed to the back side 10b of the test printed circuit board 10, and the support structure 20 is used to support the chip test socket 11 on the front side 10a of the test printed circuit board to offset the downward pressure generated when the chip to be tested is inserted into the chip test socket 11.

[0036] The support structure 20 includes a support plate 21. The shape of the support plate 21 is preferably the same as that of the test printed circuit board 10, for example, both are square. Of course, the shape can also be changed according to actual conditions. The support plate 21 is fixed and connected to the back side 10b of the test printed circuit board.

[0037] The support plate 21 has a plurality of second through holes 22, and the second through holes 22 penetrate the support plate 21 along the thickness direction of the support plate 21. The plurality of second through holes 22 are evenly arranged at the edge of the support structure 20, the number of the second through holes 22 is the same as the number of the first through holes 12, and the first through holes 12 and the second through holes 22 are arranged opposite to each other.

[0038] In this embodiment, the support structure 20 includes a fastening member 23, and the fastening member 23 is used to connect and fix the support plate 21 and the test printed circuit board 10. The number of the fastening members 23 is the same as the number of the first through holes 12. In this embodiment, the number of the fastening members 23 is 4.

[0039] Each of the fastening members 23 passes through a first through hole 12 and a second through hole 22 directly opposite to the first through hole 12 to connect and fix the test printed circuit board 10 to the support plate 21. For example, one of the fastening members includes a bolt 231 and two nuts (not shown in the figure), wherein the bolt 231 is cylindrical in shape and has two ends, both ends of the bolt 231 have external threads, and the area between the two ends of the bolt 231 does not have external threads, and the length of the area between the two ends of the bolt 231 is greater than the height of the precision components arranged on the back side 10b, so as to limit the distance between the test printed circuit board 10 and the support plate 21. Preferably, the diameter of the area between the two ends of the bolt 231 is larger than the diameter of the two ends, so that the length of the area between the two ends of the bolt 231 is used as the distance between the test printed circuit board 10 and the support plate 21. Both of the two nuts have internal threads matching the external threads, so that the two nuts can be threadedly connected to the two ends of the bolt 231.

[0040] In this embodiment, one end of a bolt 231 passes through a first through hole 12 from the back side 10b of the test printed circuit board, and is locked on the front side 10a of the test printed circuit board by a nut. The other end of the bolt 231 passes through a second through hole 22 opposite to the first through hole 12 from the support plate 21 toward the surface of the test printed circuit board 10, and is locked on the surface of the support plate 21 facing away from the test printed circuit board 10 by another nut, thereby connecting and fixing the test printed circuit board 10 to the support plate 21.

[0041] A plurality of support columns 24 with adjustable positions are provided on the surface of the support plate 21 facing the test printed circuit board 10. Specifically, at least four support columns 24 with adjustable positions are provided on the surface of the support plate 21 facing the test printed circuit board 10. The support column 24 is, for example, columnar, and its height is the distance between the test printed circuit board 10 and the support plate 21, so that one end of the support column 24 is located on the support plate 21, and the other end is located on the back side 10b of the test printed circuit board 10, so that the support column 24 can support the test printed circuit board 10. Since the support column 24 can be adjusted in position, the support column 24 can avoid the precision components on the back side 10b of the test printed circuit board 10 and directly support the test printed circuit board 10. Furthermore, the plurality of supporting pillars 24 are supported in a matrix on the back side 10b of the test printed circuit board 10. Preferably, the plurality of supporting pillars 24 are supported in a matrix around the chip test socket 11 to effectively support the chip test socket 11 and offset the downward pressure exerted by the manipulator on the chip test socket 11 through the chip to be tested when the chip to be tested is inserted into the chip test socket 11, thereby solving the problem of over-standard warping of the test printed circuit board, reducing its impact on the test results, and avoiding machine time losses and production delays.

[0042] In this embodiment, the supporting column 24 is a supporting iron column, and the supporting plate 21 has a plurality of strong magnets 25, which are embedded in the supporting plate 21, and the supporting plate 21 exposes the strong magnets 25 toward the back side 10b of the test printed circuit board. One end of the supporting column 24 is tightly adsorbed on the strong magnet 25 by the strong magnetism of the strong magnet 25, and the other end supports the back side 10b of the test printed circuit board, and one strong magnet 25 can adsorb at least one strong magnet 25. The number of the strong magnet stones 25 is greater than the number of the supporting columns 24, so that when the back side 10b of the test printed circuit board directly above some of the strong magnet stones 25 has precision components, a sufficient number (for example, at least 3) of supporting columns 24 can be set on the remaining strong magnet stones 25 to support the chip test socket 11; the supporting columns 24 can also be set by selecting strong magnet stones 25 at different positions according to actual needs, so as to effectively support the periphery of the chip test socket 11.

[0043] In summary, the present invention provides a chip testing device for performing electrical performance testing on a chip to be tested, comprising: a test printed circuit board, comprising a front side and a back side arranged relatively to each other, the front side being fixed with a chip test socket, the chip test socket being used to insert the chip to be tested; a support structure, the support structure being fixed and connected to the back side of the test printed circuit board, and being used to support the chip test socket from the back side. The present invention solves the problem of over-standard warping of the test printed circuit board through the support structure, reduces its influence on the test results, and avoids machine time loss and production delay.

[0044] In addition, it should be noted that, unless otherwise specified or indicated, the terms "first" and "second" in the specification are only used to distinguish the various components, elements, steps, etc. in the specification, and are not used to indicate the logical relationship or sequential relationship between the various components, elements, steps, etc.

[0045] It is to be understood that, although the present invention has been disclosed as a preferred embodiment, the above embodiment is not intended to limit the present invention. For any person skilled in the art, without departing from the scope of the technical solution of the present invention, the technical content disclosed above can be used to make many possible changes and modifications to the technical solution of the present invention, or modified into equivalent embodiments of equivalent changes. Therefore, any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the present invention without departing from the content of the technical solution of the present invention still falls within the scope of protection of the technical solution of the present invention.

Claims

1. A chip testing device, used to perform electrical performance testing on a chip to be tested, characterized in that: include: A test printed circuit board comprises a front side and a back side which are arranged opposite to each other, wherein a chip test socket is fixed on the front side, and the chip test socket is used to insert the chip to be tested; A support structure, the support structure is fixed and connected to the back side of the test printed circuit board, and is used to support the chip test socket from the back side; Wherein, the support structure comprises a support plate and a fastening member, the fastening member connects and fixes the support plate and the test printed circuit board, a plurality of support columns with adjustable positions are arranged on the surface of the support plate facing the test printed circuit board, the support columns are support iron columns, the support plate has a plurality of strong magnets, the strong magnets are embedded on the support plate, and the surface of the support plate facing the test printed circuit board exposes the strong magnets; The supporting column is used to support the chip test socket on the test printed circuit board to offset the downward pressure exerted by the manipulator on the chip test socket through the chip to be tested when the chip to be tested is inserted into the chip test socket. One end of the supporting column is located on the support plate and is adsorbed on the strong magnet stone through the strong magnetism of the strong magnet stone. The other end is located on the back side of the test printed circuit board, and one strong magnet stone adsorbs at least one strong magnet stone, and the number of the strong magnet stones is greater than the number of the supporting columns.

2. The chip testing device according to claim 1, characterized in that: At least four supporting columns with adjustable positions are arranged on the surface of the support plate facing the test printed circuit board.

3. The chip testing device according to claim 2, characterized in that: A plurality of the supporting pillars are supported around the chip test socket in a lattice shape.

4. The chip testing device according to any one of claims 1 to 3, characterized in that: The test printed circuit board has a plurality of first through holes, which penetrate the front and back sides of the test printed circuit board along the thickness direction of the test printed circuit board, and are evenly arranged at the edge of the test printed circuit board.

5. The chip testing device according to claim 4, characterized in that: The support plate has a plurality of second through holes, and the second through holes penetrate the support plate along the thickness direction of the support plate. The plurality of second through holes are evenly arranged at the edge of the support structure.

6. The chip testing device according to claim 5, characterized in that: The number of the second through holes is the same as the number of the first through holes, and the first through holes are arranged opposite to the second through holes.

7. The chip testing device according to claim 6, characterized in that: The number of the tightening members is the same as the number of the first through holes.

8. The chip testing device according to claim 7, characterized in that: Each of the fastening members passes through a first through hole and a second through hole directly opposite to the first through hole, so as to connect and fix the test printed circuit board to the support plate.

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