A rotating target for high energy microfocus X-rays
By introducing rotating targets and beam spot measurement components into high-energy X-ray conversion targets, the problem of difficult to measure and control the size of electron beam spots is solved, and the production of high-energy microfocus X-rays is realized, and image resolution and detection accuracy are improved.
Patent Information
- Application Number
- CN202011319588.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2020-11-23
- Publication Date
- 2025-04-15
- Estimated Expiration
- 2040-11-23
AI Technical Summary
Existing high-energy X-ray conversion targets cannot achieve accurate measurement and control of the size of electron beam spots, resulting in the inability to effectively generate high-energy microfocus X-rays.
A device including a rotating target and a beam spot measurement assembly is designed to disperse electron beam energy through the rotating target and utilize a beam spot measurement assembly, including a beam spot measurement target, a measurement assembly and a vertical moving assembly, to accurately measure and adjust the electron beam spot size.
Accurate measurement and control of the size of electron beam spots is achieved, ensuring the ability to generate high-energy microfocus X-rays, avoiding the problem of target melting and without the need to replace expensive materials.
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Figure CN112333908B_ABST
Abstract
Description
Technical Field
[0001] The invention belongs to the technical field of radiation devices, and in particular relates to a rotating target for high-energy micro-focus X-rays. Background Art
[0002] Computed Tomography (CT) is recognized as the best detection method and is widely used in non-destructive testing, reverse engineering, material organization analysis and other fields. CT is an imaging technology that obtains cross-sectional information of an object by performing radiographic imaging at different angles on the object through filtered back projection technology. CT technology can use different particle beams, such as X-rays, gamma rays, neutrons, etc. The high-energy industrial CT system uses a MeV-class accelerator as an X-ray source with strong penetrating ability, which is particularly suitable for the detection of large equipment. The device that generates X-rays by high-energy (energy 1~9MeV) micro-focus (diameter 0.05~0.4mm) high peak power electron beam target is a device with a small focus size and high energy of the X-ray source. It can not only meet the requirements of the penetration ability of large equipment or metal components, but also improve the resolution of the image, which is conducive to the detection of small defects. However, existing X-ray conversion targets have the following technical problems: when a high-power, high-energy electron beam is focused to a relatively small size, the local instantaneous power on the X-ray conversion target is too high, which will cause the melting of the conversion target material; to obtain a relatively small electron beam size, a focusing magnet is needed to focus the electron beam on the X-ray conversion target. During the debugging process, the electron beam size at the target point needs to be accurately measured, and existing high-energy X-ray conversion targets cannot achieve this function.
[0003] Therefore, the prior art needs to be further developed and improved. Summary of the invention
[0004] In view of the various deficiencies of the prior art and in order to solve the above problems, a rotating target for high-energy micro-focus X-rays is now proposed. The present invention provides the following technical solutions:
[0005] A rotating target for high-energy micro-focus X-rays comprises a rotating target for dispersing electron beam target energy and a beam spot measurement assembly for measuring the size of the electron beam spot. The rotating target and the beam spot measurement assembly can both move relatively so that the electron beam forms a beam spot at the same position of the rotating target and the beam spot measurement assembly.
[0006] Furthermore, the beam spot measurement assembly includes a beam spot measurement target for forming a beam spot, a measurement assembly for measuring the size of the beam spot, and a vertical movement assembly for limiting the position of the beam spot measurement target, and the beam spot measurement target and the measurement assembly are fixed below the vertical movement assembly.
[0007] Furthermore, the vertical moving component is a vertical locking cylinder, and the end of the telescopic rod of the vertical locking cylinder is fixedly connected with a beam spot measurement target.
[0008] Furthermore, the vertical moving component is a manual rod with a limiting sleeve, the limiting sleeve is clamped onto the manual rod when the manual rod is lifted, and the end of the manual rod is fixedly connected to a beam spot measurement target.
[0009] Furthermore, the measuring component includes a reflector and an imaging camera, the reflector forms an angle of 45 degrees with the beam spot measurement target, the imaging camera forms an angle of 45 degrees with the reflector, and the imaging camera is perpendicular to the beam spot measurement target.
[0010] Furthermore, the beam spot measurement target is a YAG target.
[0011] Furthermore, the rotating target includes a target plate bombarded by an electron beam to generate X-rays, a horizontal moving component for moving the target plate back and forth, and a rotating component for rotating the target plate. The center of the target plate is fixed on the output shaft of the rotating component, and the rotating component is fixed on the horizontal moving component.
[0012] Furthermore, the horizontal moving component is a horizontal locking cylinder, and the end of the telescopic rod of the horizontal locking cylinder is fixedly connected with a rotating component.
[0013] Furthermore, the horizontal moving component is a slider and a slide rail with a limit block.
[0014] Furthermore, the target disk is a high atomic number target.
[0015] Beneficial effects:
[0016] The present application provides a rotatable target disk to disperse the energy of the electron beam bombarding the target disk, and sets a beam spot measurement target and a moving mechanism before target shooting to ensure that the beam spot distribution size of the electron beam hitting the rotating target can be accurately measured and controlled, thereby achieving the purpose of generating high-energy microfocus X-rays. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1 It is a schematic diagram of the main internal structure and extreme position of a rotating target for high-energy micro-focus X-rays in a specific embodiment of the present invention;
[0018] Figure 2 It is a schematic diagram of the internal structure of a rotating target for high-energy micro-focus X-rays in a specific embodiment of the present invention from the right side;
[0019] Figure 3 It is a schematic diagram of a rotating target beam spot measurement state for high-energy micro-focus X-rays in a specific embodiment of the present invention;
[0020] Figure 4 This is a schematic diagram of a rotating target shooting state for high-energy micro-focus X-rays in a specific embodiment of the present invention;
[0021] Figure 5 is a schematic diagram of the measurement state of the measurement component in a specific embodiment of the present invention;
[0022] In the attached figure: 1. horizontal moving component; 2. rotating component; 3. target plate; 4. vertical moving component; 5. beam spot measurement component; 6. vacuum chamber; 7. electron beam; 8. beam spot measurement target; 9. reflector; 10. imaging camera. DETAILED DESCRIPTION
[0023] In order to enable those skilled in the art to better understand the technical solution of the present invention, the technical solution of the present invention is clearly and completely described below in conjunction with the accompanying drawings of the present invention. Based on the embodiments in this application, other similar embodiments obtained by ordinary technicians in this field without making creative work should all fall within the scope of protection of this application. In addition, the directional words mentioned in the following embodiments, such as "up", "down", "left", "right", etc., are only reference to the directions of the accompanying drawings. Therefore, the directional words used are used to illustrate rather than limit the invention.
[0024] like Figure 1-4 As shown, a rotating target for high-energy micro-focus X-rays includes a rotating target for dispersing the energy of electron beams for targeting and a beam spot measuring component 5 for measuring the size of the electron beam spot. Both the rotating target and the beam spot measuring component 5 can move relatively, so that the electron beam forms a beam spot at the same position of the rotating target and the beam spot measuring component 5. Since high-energy micro-focus X-rays require the electron beam to hit the target as concentratedly as possible, it is necessary for the target material to be able to withstand local instantaneous high-power bombardment, and ordinary target materials are very easy to melt under instantaneous high-power bombardment conditions. This problem can be well avoided by rotating the target disk 3, and there is no need to replace expensive alternative materials. The target materials used in daily use can well adapt to the focused bombardment of high-power and high-energy electron beams. Therefore, it is necessary to add a rotating mechanism to rotate the target disk 3 on the basis of the original target disk 3. However, since the target disk 3 is constantly rotating, it is impossible to know the size of the electron beam spot bombarding the rotating target disk 3, and the size of the beam spot is directly related to the size of the generated X-ray focus. Therefore, it is necessary to add a set of beam spot measurement components 5 that can detect and adjust the beam spot size, so that the beam spot size can be dynamically controlled in real time by adjusting the electron beam emission device.
[0025] Furthermore, the beam spot measurement component 5 includes a beam spot measurement target 8 for forming a beam spot, a measurement component for measuring the size of the beam spot, and a vertical moving component 4 for limiting the position of the beam spot measurement target 8, and the beam spot measurement target 8 and the measurement component are fixed below the vertical moving component 4. The beam spot measurement target 8 and the measurement component are both fixed below the vertical moving component 4, ensuring that the up and down movement of the vertical moving component 4 simultaneously drives the up and down movement of the beam spot measurement target 8 and the measurement component, and the positions of the beam spot measurement target 8 and the measurement component are relatively fixed, so as to facilitate the calculation of the converted beam spot size, and facilitate the simultaneous removal of the beam center before target shooting, so as to avoid affecting the target shooting process of the electron beam.
[0026] Furthermore, the vertical moving assembly 4 is a vertical locking cylinder, and the end of the telescopic rod of the vertical locking cylinder is fixedly connected with a beam spot measurement target 8. The telescopic length of the cylinder is fixed, so as to ensure that the movement path of the connected beam spot measurement target 8 is fixed, and the telescopic range of the vertical locking cylinder just allows the beam spot measurement target 8 to move between the upper and lower extreme positions of the vacuum chamber 6, and the beam spot measurement target 8 will not collide with the inner wall of the vacuum chamber 6 due to exceeding the extreme position. At the same time, due to the locking effect, after the extreme position is in place, it can be ensured that the beam spot measurement target 8 will not be offset during the measurement process or the target plate 3, thereby not affecting the detection process and the target process.
[0027] Furthermore, the vertical moving assembly 4 is a manual rod with a limited position sleeve, the limited position sleeve is clamped on the manual rod when the manual rod is lifted, and the end of the manual rod is fixedly connected with a beam spot measurement target 8. Without the influence of the limited position sleeve, when the manual rod is pressed down to the limit position, it is the limit position of the downward movement of the beam spot measurement target 8 fixed at the end of the vertical moving assembly 4, and when the manual rod is slowly pulled up until the top of the beam spot measurement target 8 is connected to the top of the inner wall of the vacuum chamber 6, it is the limit position of the upward movement. At this time, the manual rod is clamped from the outside with a limited position sleeve to prevent it from falling and affecting the target shooting of the electron beam.
[0028] Furthermore, the measuring assembly includes a reflector 9 and an imaging camera 10, the reflector 9 and the beam spot measurement target 8 are at an angle of 45 degrees, the imaging camera 10 and the reflector 9 are at an angle of 45 degrees, and the imaging camera 10 is perpendicular to the beam spot measurement target 8. The electron beam hits the beam spot measurement target 8, and is irradiated onto the 45-degree reflector 9 through the beam spot measurement target 8, and the 45-degree reflector 9 is then reflected and projected onto the imaging camera 10, and is reflected twice at 45 degrees by the reflector 9, so that the horizontal beam spot is projected into the lens set vertically upward, and then led out through the signal line for easy observation.
[0029] Furthermore, the beam spot measurement target 8 is a YAG target. The YAG target is a commonly used target material, which is simple and easy to obtain. When the electron beam hits the YAG target, a fluorescent reaction will be generated, so that the beam spot size can be indirectly measured by measuring the size of the fluorescent spot.
[0030] Furthermore, the rotating target includes a target plate 3 bombarded by an electron beam to generate X-rays, a horizontal moving component 1 for moving the target plate 3 back and forth, and a rotating component 2 for rotating the target plate 3. The bull's eye of the target plate 3 is fixed on the output shaft of the rotating component 2, and the rotating component 2 is fixed on the horizontal moving component 1. By moving the horizontal moving component 1, the rotating component 2 disposed on the horizontal moving component 1 is driven to move horizontally. The end of the output shaft of the rotating component 2 is fixedly connected to the central axis of the target plate 3. Therefore, the horizontal movement of the rotating component 2 directly drives the horizontal movement of the target plate 3, thereby realizing the mutual movement and yielding between the target plate 3 and the beam spot measurement target 8.
[0031] Furthermore, the horizontal moving component 1 is a horizontal locking cylinder, and the end of the telescopic rod of the horizontal locking cylinder is fixedly connected to the rotating component 2. The telescopic length of the cylinder is fixed, so as to ensure that the forward and backward movement path of the target plate 3 connected to the end of the output shaft of the rotating component 2 is fixed, and the telescopic range of the horizontal locking cylinder is just enough to make the target plate 3 move between the two extreme positions of the vacuum chamber 6, and the situation that the target plate 3 collides with the inner wall of the vacuum chamber 6 due to exceeding the extreme position will not occur. At the same time, due to the locking effect, after the extreme position is in place, it can be ensured that the target plate 3 will not be offset during the rotation process.
[0032] Furthermore, the horizontal moving component 1 is a slider and a slide rail with a limit block. The rotating component 2 is fixed on the slider, and the slider can only move back and forth along the axis direction of the output shaft of the rotating component 2 on the slide rail, and limit blocks are set at both ends of the slide rail, so that the target plate 3 connected to the end of the output shaft of the rotating component 2 can only move between two limit positions in the vacuum chamber 6, and the target plate 3 will not collide with the inner wall of the vacuum chamber 6 due to exceeding the limit position.
[0033] Furthermore, the target disk 3 is a high atomic number target. The target disk 3 can be made of high atomic number materials such as tungsten, tantalum, gold, etc., and has a disc-shaped structure. During the rotation process, the electron beam bombards the target disk 3 near the periphery to generate X-rays.
[0034] The target disk 3, the beam spot measurement target 8 and the measurement assembly are all arranged in the same vacuum chamber 6 to ensure that the beam of the electron beam 7 is not deflected by external forces. First, the vertical moving assembly 4 drives the beam spot measurement target 8 to do lifting and lowering movements. When the beam spot measurement target 8 is lifted, it will not interfere with the horizontal movement of the target disk 3. When the target disk 3 moves away from the incident port of the electron beam 7, the vertical moving assembly 4 drops to the limit position, driving the beam spot measurement target 8 to reach the center of the beam. The electron beam 7 hits the beam spot measurement target 8 vertically. The beam measurement target generally uses a YAG target. The electron beam 7 generates fluorescence when it hits the YAG target. A mirror is used for 45° reflection behind the beam spot measurement target 8 to reflect the light spot generated by the electron beam 7 to the charge coupled device (CCD) camera, and then the size of the light spot can be measured through the display of the CCD camera, such as Figure 5 As shown. The transmission directions of the YAG target and the electron beam 7 are 90 degrees, so that the spot size of the electron beam 7 on the YAG target is strictly equal to the size of the electron beam 7. After being reflected by the 45-degree reflector 9, the size of the spot image on the CCD is also equal to the size of the electron beam 7, so that the size of the electron beam 7 can be accurately measured. After the beam spot size reaches the use requirements, the beam spot measurement target 8 is lifted. The horizontal moving component 1 is interconnected with the rotating component 2 and the target disk 3, and drives the rotating component 2 and the target disk 3 to move horizontally. When the beam spot measurement target 8 is lifted, the horizontal moving target disk 3 is moved to the extreme position close to the beam flow. At this time, the position of the target disk 3 and the beam spot measurement target 8 when it descends coincide, that is, the position where the YAG target forms the light spot is the same as the position where the target disk 3 forms the beam spot, but the two will not be in this position at the same time. At this time, the real size of the beam spot bombarded on the target disk 3 is the same as the size of the beam spot measured by the measurement target. The above method can accurately measure and control the beam spot size of the electron beam 7 on the target disk 3 to achieve the purpose of micro focus. In this way, the beam spot of the electron beam 7 generated by the electron source can be dynamically adjusted.
[0035] The present invention has been described in detail above. The above description is only a preferred embodiment of the present invention and should not limit the scope of implementation of the present invention. That is, all equivalent changes and modifications made within the scope of this application should still fall within the scope of the present invention.
Claims
1. A rotating target for high energy microfocus X-rays, characterized in that: It includes a rotating target for dispersing the energy of electron beam target shooting and a beam spot measurement component for measuring the size of the electron beam spot. The rotating target and the beam spot measurement component can both move relatively to form a beam spot of the electron beam at the same position of the rotating target and the beam spot measurement component. The beam spot measurement component includes a beam spot measurement target for forming the beam spot, a measurement component for measuring the size of the beam spot, and a vertical movement component for limiting the position of the beam spot measurement target. The beam spot measurement target and the measurement component are fixed below the vertical movement component, and the positions of the beam spot measurement target and the measurement component are relatively fixed.
2. A rotating target for high energy microfocus X-rays according to claim 1, characterized in that: The vertical moving component is a vertical locking cylinder, and the end of the telescopic rod of the vertical locking cylinder is fixedly connected with a beam spot measurement target.
3. A rotating target for high energy microfocus X-rays according to claim 1, characterized in that: The vertical moving component is a manual rod with a limiting sleeve, the limiting sleeve is clamped onto the manual rod when the manual rod is lifted, and a beam spot measurement target is fixedly connected to the end of the manual rod.
4. A rotating target for high energy microfocus X-rays according to claim 1, characterized in that: The measuring component comprises a reflector and an imaging camera. The reflector forms an angle of 45 degrees with the beam spot measurement target. The imaging camera forms an angle of 45 degrees with the reflector. The imaging camera is perpendicular to the beam spot measurement target.
5. The rotating target for high energy microfocus X-rays according to claim 1, characterized in that: The beam spot measurement target is a YAG target.
6. The rotating target for high energy microfocus X-rays according to claim 1, characterized in that: The rotating target comprises a target plate bombarded by an electron beam to generate X-rays, a horizontal moving assembly for moving the target plate back and forth, and a rotating assembly for rotating the target plate. The bull's eye of the target plate is fixed on an output shaft of the rotating assembly, and the rotating assembly is fixed on the horizontal moving assembly.
7. A rotating target for high energy microfocus X-rays according to claim 6, characterized in that: The horizontal moving component is a horizontal locking cylinder, and the end of the telescopic rod of the horizontal locking cylinder is fixedly connected with a rotating component.
8. A rotating target for high energy microfocus X-rays according to claim 6, characterized in that: The horizontal moving components are sliding blocks and sliding rails with limit blocks.
9. A rotating target for high energy microfocus X-rays according to claim 6, characterized in that: The target disk is a high atomic number target.
Citation Information
Patent Citations
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