Heat sink for induction welding and method of forming heat sink

Abstract

The present invention relates to a heat sink for induction welding and a method for forming the heat sink. The heat sink for induction welding includes a plurality of tiles, wherein the tiles are non-conductive and have a thickness greater than about 25 mm. 2 / second thermal diffusion rate. Joints connect tiles together flexibly.

Description

Technical Field

[0001] The present disclosure relates to induction welding. More particularly, the present disclosure relates to induction welding of thermoplastic composites using a flexible heat sink and / or cooling to reduce the temperature away from the weld interface. Background Art

[0002] Induction welding can be used to fuse or join thermoplastic composite (TPC) parts together. TPC parts typically consist of thermoplastics reinforced with non-plastic materials, such as carbon fiber. TPC parts are highly resistant to damage, moisture and chemicals, and will not degrade in hot or humid conditions. Moreover, TPC parts can be remelted, providing benefits in repair and end-of-life recyclability compared to other alternatives, as well as reduced handling and storage costs.

[0003] Induction welding involves moving an induction coil along the weld line of the TPC part. The induction coil induces eddy currents in the inherently conductive carbon fibers disposed within the TPC part, which generate heat and melt the thermoplastic to melt the thermoplastic specifically at the weld interface. Compressing the TPC parts together creates a fused or welded joint. The weld joint created by induction welding is considered to be a single unit, so the two or more parts become one part.

[0004] Although induction welding is effective, the induction coil generates heat throughout the TPC part, not just at the weld joint. For example, the portion of the TPC part near the induction coil may heat up more than the weld joint. Therefore, there is a need in the art for a system and method for induction welding TPC parts that focuses heat at the weld joint. Summary of the invention

[0005] In one example, a heat sink for induction soldering is provided. The heat sink includes a plurality of tiles, wherein the tiles are non-conductive and have a thickness greater than about 25 mm. 2 / second thermal diffusion rate. The joints flexibly join the tiles together.

[0006] In another example, a method of forming a heat sink is provided. The method includes: spacing a plurality of tiles in a single layer with gaps between the tiles, wherein the tiles are electrically non-conductive and thermally conductive; and flexibly joining the tiles.

[0007] In another example, a method for forming a heat sink for induction soldering is provided. The method includes spacing a plurality of tiles in a single layer within a frame having a fixture, removing the fixture, and applying a flexible adhesive between the tiles.

[0008] The present apparatus, system and method are also referenced in the following items which are not to be confused with the technical solution.

[0009] (a) A heat sink for induction welding, the heat sink comprising:

[0010] A plurality of tiles, wherein the tiles are non-conductive and have a thickness greater than about 25 mm 2 / second thermal diffusivity; and

[0011] Joints, which connect tiles together flexibly.

[0012] (ii) The heat sink according to (i), wherein the tile is made of aluminum nitride.

[0013] (iii) The heat sink according to (i), wherein the tile is made of beryllium oxide.

[0014] (iv) The heat sink according to (i), wherein the tiles are arranged in a single layer.

[0015] (V) The heat sink according to (A), wherein the tiles define gaps therebetween, and the joints are disposed within the gaps.

[0016] (vi) The heat sink of (v), wherein the gap is between about 0.005 inches and about 0.1 inches.

[0017] (VII) The heat sink of (A), wherein the joint is comprised of silicone having a long-term degradation temperature greater than about 400 degrees Fahrenheit in a vacuum or in air.

[0018] (VIII) The heat sink according to (VII), wherein the silicone resin has an elongation between 12% and 670%.

[0019] (ix) The heat sink of (g) above, wherein the silicone has a tear strength between 31 lb / in and 190 lb / in.

[0020] (10) The heat sink of (1), wherein the tile has a thermal conductivity greater than about 75 W / mK.

[0021] (XI) The heat sink of (I), wherein the tile has a heat capacity greater than about 500 J / K / kg.

[0022] (XII) Using the radiator described in (A) to manufacture a part of an aircraft.

[0023] (XIII) A method for forming a heat sink, the method comprising:

[0024] spacing a plurality of tiles in a single layer with gaps between the tiles, wherein the tiles are electrically non-conductive and thermally conductive; and

[0025] The tiles are flexibly engaged.

[0026] (XIV) The method according to (XIII), wherein flexibly engaging the tiles comprises flexibly engaging the tiles using a mechanical hinge disposed within the gap.

[0027] (15) The method according to (13), wherein flexibly joining the tiles comprises flexibly joining the tiles using a flexible adhesive disposed within the gaps.

[0028] (16) The method according to (15), wherein flexibly joining the tile with the flexible adhesive comprises injecting the flexible adhesive into the gap.

[0029] (17) The method according to (15), further comprising curing the flexible adhesive.

[0030] (18) The method according to (13), wherein spacing the tiles includes spacing the tiles on a backing material.

[0031] (19) A method of forming a heat sink for induction welding, the method comprising:

[0032] placing a plurality of tiles at intervals in a single layer within a frame having a clamp;

[0033] remove the clamp; and

[0034] A flexible adhesive is applied between the tiles.

[0035] (20) The method according to (19), further comprising priming the tiles with a primer.

[0036] (21) The method of (20), wherein priming the tiles comprises priming the tiles with a silicone primer.

[0037] (22) The method according to (19), further comprising providing a plurality of electrically non-conductive and thermally conductive tiles before separating the plurality of tiles within the frame.

[0038] (23) The method according to (19), wherein spacing the tiles within the frame includes spacing the tiles on a backing material disposed below the frame.

[0039] (Twenty-four) The method of (Twenty-three), wherein spacing the tiles on the backing material includes adhering the tiles to the backing material.

[0040] (25) The method according to (24) further includes curing the flexible adhesive.

[0041] (26) The method according to (25), further comprising removing the backing material after curing the flexible adhesive.

[0042] (Twenty-seven) A method of induction welding a first carbon fiber thermoplastic composite (TPC) to a second carbon fiber thermoplastic composite (TPC) using an induction coil, the method comprising:

[0043] aligning the first TPC with the second TPC to form a welding interface region;

[0044] bending the heat sink to the surface of the first TPC between the solder interface area and the induction coil; and

[0045] The weld interface area is inductively heated using an induction coil.

[0046] (Twenty-eight) The method according to (Twenty-seven), wherein the heat sink is electrically non-conductive and thermally conductive.

[0047] (Twenty-nine) The method according to (Twenty-seven) also includes pressing the first TPC and the second TPC together at the welding interface area while inductively heating the welding interface area.

[0048] (30) The method according to (27), further comprising:

[0049] inserting the first TPC, the second TPC, and the heat sink into a vacuum bag; and

[0050] During or after induction heating of the weld interface region, the first TPC and the second TPC are consolidated by vacuum compression.

[0051] (31) The method according to (27) further includes welding the welding interface area along the welding line.

[0052] (32) The method according to (27) also includes using a second heat sink to absorb heat from the second TPC.

[0053] (33) The method according to (6), further comprising:

[0054] inserting the first TPC, the second TPC, the heat sink, and the second heat sink into the vacuum bag; and

[0055] The first TPC and the second TPC are compressed under vacuum.

[0056] (34) The method according to (32), further comprising:

[0057] inserting the first TPC, the second TPC, the heat sink, and the second heat sink into the vacuum bag; and

[0058] Fill the vacuum bag with inert gas.

[0059] (35) The method according to (27), further comprising adjusting the induction welding in real time based on sensor feedback.

[0060] (36) The method according to (27), further comprising:

[0061] inserting the first TPC and the second TPC between the first plate and the second plate; and

[0062] The first TPC and the second TPC are compressed between the first plate and the second plate while inductively heating the weld interface area.

[0063] (37) The method of (27), wherein bending the heat sink onto the surface of the first TPC includes conforming the heat sink to the surface of the first TPC.

[0064] (38) The method according to (27), further comprising cooling the second TPC using a cooler unit disposed adjacent to the second TPC.

[0065] (39) The method according to (27) further includes moving the welding interface area, the induction coil, or both to weld the welding interface area along a welding line.

[0066] (40) A system for induction welding a first thermoplastic composite (TPC) to a second thermoplastic composite (TPC), the system comprising:

[0067] a heat sink disposed on the first TPC, the heat sink having a plurality of tiles flexibly joined together by joints; and

[0068] An induction coil configured to induction weld the first TPC to the second TPC, the induction coil being disposed adjacent to the heat sink.

[0069] (41) The system according to (40), wherein the heat sink is disposed between the first TPC and the induction coil.

[0070] (42) The system according to (40) further includes a second heat sink disposed on the second TPC.

[0071] (43) The system according to (40) further includes a vacuum bag, wherein the heat sink, the first TPC and the second TPC are arranged in the vacuum bag.

[0072] (Forty-four) The system according to (Forty), further comprising a first plate and a second plate, and wherein the heat sink, the first TPC, and the second TPC are disposed between the first plate and the second plate.

[0073] (45) The system of (40), wherein the tile is non-conductive and has a thickness greater than about 25 mm. 2 / second thermal diffusivity.

[0074] (46) The system of (45), wherein the tiles are made of aluminum nitride.

[0075] (47) The system of (45), wherein the tiles are made of beryllium oxide.

[0076] (48) The system of (40) wherein the joint is comprised of silicone having a long-term decomposition temperature in a vacuum greater than approximately 400 degrees Fahrenheit.

[0077] (49) The system of (40) wherein the joint is a mechanical hinge integrally formed with or coupled to the tile.

[0078] (50) The system according to (40) further includes a tool arranged opposite to the induction coil, the tool having a cooler unit arranged inside the tool, and the cooler unit is adjacent to the second TPC.

[0079] (51) The system according to (40) further includes a bellows, which is arranged adjacent to the second TPC and is used to apply consolidation pressure to the second TPC.

[0080] (52) Using the system described in (40) to manufacture a part of an aircraft.

[0081] (Fifty-three) A method of induction welding a first carbon fiber thermoplastic composite (TPC) to a second carbon fiber thermoplastic composite (TPC) using an induction coil, the method comprising:

[0082] forming a welding interface region between the first TPC and the second TPC;

[0083] placing a flexible heat sink on the surface of the first TPC above the solder interface area;

[0084] Inductively heating the weld interface region using an induction coil;

[0085] compressing the first TPC and the second TPC together at the weld interface area; and

[0086] A flexible heat sink is used to dissipate heat from the surface of the first TPC.

[0087] (Fifty-four) A method of induction welding a first thermoplastic composite (TPC) to a second thermoplastic composite (TPC) using an induction coil, the method comprising:

[0088] forming a welding interface region between the first TPC and the second TPC;

[0089] cooling the first TPC with a cooling device prior to being heated by the induction coil; and

[0090] After cooling the first TPC, the weld interface area is inductively heated using an induction coil.

[0091] (Fifty-five) The method according to (Fifty-four), further comprising setting a target temperature, and wherein cooling the first TPC comprises cooling the first TPC to the target temperature.

[0092] (Fifty-six) The method according to (Fifty-five) also includes monitoring the actual temperature of the first TPC.

[0093] (Fifty-seven) The method according to (Fifty-six), wherein cooling the first TPC includes cooling the first TPC to a target temperature based on an actual temperature.

[0094] (Fifty-eight) The method according to (Fifty-six), wherein setting the target temperature comprises:

[0095] determining the location of the weld interface region relative to the induction coil; and

[0096] Set the target temperature based on the location of the weld interface area.

[0097] (59) The method of (56), wherein the target temperature is approximately -100 degrees Fahrenheit.

[0098] (60) The method according to (54) also includes compressing the first TPC and the second TPC together while induction heating the welding interface area.

[0099] (61) The method according to (54), further comprising:

[0100] inserting the first TPC and the second TPC into a vacuum bag; and

[0101] During or after induction heating of the weld interface region, vacuum is compressed from the first TPC to the second TPC.

[0102] (Sixty-two) The method according to (fifty-four) also includes welding the welding interface area along a welding line.

[0103] (Sixty-three) The method according to (Sixty-two), wherein the cooling device is coupled to the induction coil.

[0104] (Sixty-four) The method according to (fifty-four), further includes adjusting the induction heating in real time based on sensor feedback.

[0105] (Sixty-five) The method according to (fifty-four), further includes actively cooling the first TPC after inductively heating the welding interface area.

[0106] (Sixty-six) The method according to (Sixty-five), further includes using a second induction coil to inductively heat the first TPC after using the induction coil to inductively heat the welding interface area.

[0107] (Sixty-seven) The method according to (Sixty-six), further comprising:

[0108] After inductively heating the weld interface region using the induction coil, sensing a temperature of the weld interface region; and

[0109] The first TPC is cooled using a second cooling device or inductively heated using a second induction coil to control the cooling rate of the first TPC.

[0110] (68) A system for induction welding a first carbon fiber thermoplastic composite (TPC) to a second carbon fiber thermoplastic composite (TPC), the system comprising:

[0111] an induction coil disposed above the first TPC and movable in a first direction relative to the weld interface region to form a weld between the first TPC and the second TPC; and

[0112] A cooling device is disposed above the first TPC for cooling the first TPC, the cooling device being disposed adjacent to the induction coil in a first direction, and the cooling device being movable in the first direction together with the induction coil to cool the first TPC before forming a weld.

[0113] (Sixty-nine) The system according to (Sixty-eight), further comprising a vacuum bag, wherein the first TPC and the second TPC are disposed within the vacuum bag.

[0114] (Seventy) The system according to (Sixty-eight), further comprising a first plate and a second plate, and wherein the first TPC and the second TPC are disposed between the first plate and the second plate.

[0115] (71) The system of (68), wherein the cooling device is coupled to the induction coil at a fixed distance from the induction coil.

[0116] (72) The system according to (68), wherein the cooling device includes a plurality of nozzles connected to a coolant source.

[0117] (73) A system according to (72), wherein the coolant source includes CO2.

[0118] (74) The system according to (68) further includes a controller electronically connected to the induction coil and the cooling device, wherein the controller is configured to control the movement of the induction coil and the cooling device and the flow rate of the coolant from the cooling device.

[0119] (Seventy-five) The system according to (Seventy-four), further includes a sensor for sensing the temperature of the first TPC or the second TPC, and the sensor is electrically connected to the controller.

[0120] (Seventy-six) The system of (Seventy-five), wherein the controller controls the movement of the induction coil and the coolant device and the flow rate of the coolant based on feedback from the sensor to control the cooling rate of the first TPC.

[0121] (Seventy-seven) The system according to (Sixty-eight) further includes a second cooling device, which is arranged adjacent to the induction coil in a second direction opposite to the first direction, and the second cooling device is configured to cool the first TPC after induction heating of the welding interface area with the induction coil.

[0122] (Seventy-eight) The system of (Seventy-seven), wherein the second cooling device is coupled to the induction coil at a fixed distance from the induction coil.

[0123] (Seventy-nine) The system of (Seventy-eight) further includes a second induction coil disposed adjacent to the induction coil in the second direction, the second induction coil configured to heat the first TPC after induction heating the welding interface region with the induction coil.

[0124] (80) The system of (79), wherein the second induction coil is coupled to the induction coil at a fixed distance from the induction coil.

[0125] (81) An induction welding method using an induction coil, the method comprising:

[0126] forming a weld interface region between a first thermoplastic composite material (TPC) and a second thermoplastic composite material (TPC);

[0127] cooling the first TPC with a first cooling device prior to being heated by the induction coil;

[0128] After cooling the first TPC, induction welding the welding interface region with an induction coil; and

[0129] The first TPC is cooled using a second cooling device, or inductively heated using a second induction coil passing after the induction coil, to control the cooling rate of the weld interface region.

[0130] (82) A method of dissipating heat from a surface of a first thermoplastic composite material (TPC) being induction welded to a second thermoplastic composite material (TPC), the method comprising:

[0131] bending the heat sink during placement to conform to the surface of the first TPC;

[0132] Cooling radiator;

[0133] applying induction heat to a weld interface region between the first TPC and the second TPC; and

[0134] Heat is absorbed from the surface of the first TPC via the heat sink.

[0135] (83) The method according to (82), further includes applying induction heat to the weld interface area along the weld line.

[0136] (84) The method of (83), wherein cooling the heat sink includes moving a cooling device along the weld line to cool the heat sink before inductively heating the weld interface region.

[0137] (85) The method of (82), wherein bending the heat sink during placement includes aligning the heat sink with the weld interface area along the weld line.

[0138] (86) The method according to (82), further comprising bending the second heat sink to adapt to the surface of the second TPC during placement.

[0139] (87) The method of (86), wherein placing the second heat sink on the second TPC includes aligning the second heat sink with the welding interface area along the welding line.

[0140] (88) The method according to (86), further includes extracting heat from the surface of the second TPC via the second heat sink.

[0141] (89) The method of (82), wherein bending the heat sink comprises bending joints between a plurality of thermally conductive and electrically non-conductive tiles.

[0142] (90) The method according to (82), further comprising setting a target temperature, and wherein cooling the heat sink comprises cooling the heat sink to the target temperature.

[0143] (91) The method according to (90) also includes monitoring the actual temperature of the radiator.

[0144] (92) The method according to (91), wherein cooling the radiator includes cooling the radiator to a target temperature based on an actual temperature of the radiator.

[0145] (93) The method according to (90), wherein setting the target temperature comprises:

[0146] determining the position of the heat sink relative to the solder interface area and relative to the induction coil; and

[0147] Set the target temperature based on the location of the heat sink.

[0148] (94) The method of (90), wherein the target temperature is approximately -100 degrees Fahrenheit.

[0149] (95) The method according to (82) also includes compressing the first TPC and the second TPC together while induction heating the welding interface area.

[0150] (96) The method according to (82), further comprising:

[0151] inserting the first TPC and the second TPC into a vacuum bag; and

[0152] During or after induction heating of the weld interface region, vacuum is compressed from the first TPC to the second TPC.

[0153] (97) The method according to (82) also includes cooling the heat sink after inductively heating the welding interface area.

[0154] (98) The method according to (97), further includes using a second induction coil to inductively heat the first TPC after using the first induction coil to inductively heat the welding interface area.

[0155] (99) The method according to (98), further comprising:

[0156] After inductively heating the weld interface region using the first induction coil, sensing a temperature of the weld interface region; and

[0157] The cooling rate of the first TPC is controlled by using a second induction coil to cool the heat sink or inductively heat the first TPC.

[0158] (100) A system for induction welding a first thermoplastic composite (TPC) to a second thermoplastic composite (TPC), the system comprising:

[0159] a heat sink disposed on the first TPC, the heat sink having a plurality of tiles flexibly joined together by joints;

[0160] an induction coil disposed above the heat sink and movable in a first direction relative to the welding interface region to form a weld at the welding interface region between the first TPC and the second TPC; and

[0161] A cooling device is disposed above the heat sink to cool the heat sink, the cooling device is disposed adjacent to the induction coil in a first direction, and the cooling device is movable in the first direction to cool the heat sink before forming a weld.

[0162] (One hundred and one) The system according to (one hundred), further comprising a vacuum bag, wherein the first TPC, the second TPC, and the heat sink are disposed within the vacuum bag.

[0163] (One hundred and two) The system according to (one hundred and one) further includes a second heat sink disposed on the second TPC.

[0164] (103) The system according to (102), wherein the second heat sink is disposed within the vacuum bag.

[0165] (One hundred and four) The system according to (one hundred), further includes a tool arranged opposite to the induction coil, the tool having a cooler unit arranged inside the tool, the cooler unit being adjacent to the second TPC.

[0166] (One hundred and five) The system according to (one hundred), wherein the cooling device is connected to the induction coil at a fixed distance from the induction coil.

[0167] (One hundred and six) The system according to (one hundred), wherein the cooling device includes a plurality of nozzles connected to a coolant source.

[0168] (One hundred and seven) A system according to (one hundred and six), wherein the coolant source comprises CO2.

[0169] (One hundred and eight) The system according to (one hundred) further includes a controller in electronic communication with the induction coil and the cooling device, the controller being configured to control movement of the induction coil and the cooling device and a flow rate of a coolant from the cooling device.

[0170] (One hundred and nine) The system according to (one hundred and eight), further comprising a sensor for sensing the temperature of the radiator, wherein the sensor is electronically connected to the controller.

[0171] (One hundred and ten) The system of (one hundred and nine), wherein the controller controls the movement of the induction coil and the cooling device and the flow rate of the coolant based on feedback from the sensor to control the cooling rate of the first TPC.

[0172] (One hundred and eleven) The system according to (one hundred) further includes a second cooling device, which is arranged adjacent to the induction coil in a second direction opposite to the first direction, and the second cooling device is configured to cool the heat sink after the welding interface area is inductively heated by the induction coil.

[0173] (One hundred and twelve) The system according to (one hundred and eleven), wherein the second cooling device is coupled to the induction coil at a fixed distance from the induction coil.

[0174] (One hundred and thirteen) The system according to (one hundred and eleven), further includes a second induction coil arranged adjacent to the induction coil in the second direction, and the second induction coil is configured to heat the first TPC after induction heating the welding interface area by the induction coil.

[0175] (One hundred and fourteen) The system according to (one hundred and thirteen), wherein the second induction coil is coupled to the induction coil at a fixed distance from the induction coil.

[0176] (One hundred and fifteen) A method of dissipating heat from a surface of a first thermoplastic composite material (TPC) being induction welded to a second thermoplastic composite material (TPC), the method comprising:

[0177] bending the heat sink to conform to the surface of the first TPC;

[0178] Cooling the heat sink prior to induction heating;

[0179] applying induction heat to a weld interface region between the first TPC and the second TPC;

[0180] absorbing heat from a surface of the first TPC via a heat sink; and

[0181] Induction heating followed by cooling radiator.

[0182] The features, functions, and advantages that have been discussed can be achieved independently in various aspects or may be combined in yet other aspects, further details of which may be seen with reference to the following description and drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0183] The drawings described herein are for illustration purposes only and are not intended to limit the scope of the present disclosure in any way.

[0184] Figure 1Ais a perspective view of a system for induction welding according to an exemplary aspect;

[0185] Figure 1B is a perspective view of a variation of a system for induction welding according to an exemplary aspect;

[0186] Figure 2A According to the exemplary aspects Figure 1A An enlarged portion of the heat sink shown by arrow 2-2;

[0187] Figure 2B is a perspective view of a heat sink shown on an exemplary curved surface according to an exemplary aspect;

[0188] Figure 3 According to an exemplary aspect, a method for manufacturing Figure 2A A perspective view of a radiator manufacturing system for a radiator;

[0189] Figure 4 is a diagram showing the use of Figure 3 Radiator Manufacturing System Manufacturing Figure 2A An exemplary process flow chart of a method for providing a heat sink;

[0190] Figure 5A is an exemplary perspective view of a portion of a heat sink having a mechanical hinge according to an exemplary aspect;

[0191] Figure 5B According to an exemplary aspect, Figure 5A A cross section of the radiator observed in the direction of arrow 5A-5A;

[0192] Figure 6 According to an exemplary aspect, Figure 1A A partially enlarged cross-sectional view of the stack of the system observed in the direction of arrow 6-6;

[0193] Figure 7 is an exemplary process flow diagram illustrating an induction welding method according to an exemplary aspect;

[0194] Figure 8 According to an exemplary aspect, Figure 1A A partially enlarged cross-sectional view of another stack of the system observed in the direction of arrow 6-6;

[0195] Fig. 9 According to an exemplary aspect, Figure 1A A partially enlarged cross-sectional view of another stack of the system observed in the direction of arrow 6-6;

[0196] Fig.10 According to an exemplary aspect, Figure 1AA partially enlarged cross-sectional view of another stack of the system observed in the direction of arrow 6-6;

[0197] Fig.11 According to an exemplary aspect, Figure 1A A partially enlarged cross-sectional view of another stack of the system observed in the direction of arrow 6-6;

[0198] Fig.12 According to an exemplary aspect, Figure 1A A partially enlarged cross-sectional view of another stack of the system observed in the direction of arrow 6-6;

[0199] Fig.13 is an exemplary process flow chart for induction welding according to an exemplary aspect;

[0200] Fig.14 is another exemplary process flow chart of induction welding according to an exemplary aspect;

[0201] Fig.15 According to an exemplary aspect, Figure 1A A partially enlarged cross-sectional view of another stack of the system observed in the direction of arrow 6-6;

[0202] Fig.16 According to an exemplary aspect, Figure 1A A partially enlarged cross-sectional view of another stack of the system observed in the direction of arrow 6-6;

[0203] Fig.17 is an exemplary process flow chart for induction welding according to an exemplary aspect;

[0204] Fig.18 is another exemplary process flow chart of induction welding according to an exemplary aspect;

[0205] Fig.19 is a perspective view of another example of a heat sink with liquid cooling according to an exemplary aspect;

[0206] Fig. 20 is a diagram showing the use of Figure 3 The radiator manufacturing system has Fig.19 An exemplary process flow chart of a method for liquid cooling a heat sink;

[0207] Fig.21 According to an exemplary aspect, a method for manufacturing a Fig.19 A perspective view of a heat sink manufacturing system for a liquid cooled heat sink;

[0208] Fig. 22 is according to an exemplary aspect of using a heat sink having a liquid cooling along Figure 1AAn enlarged cross section of another stack of the system as viewed in the direction of arrow 6-6;

[0209] Fig.23 is a perspective view of another example of a heat sink with liquid cooling according to an exemplary aspect;

[0210] Fig.24 is a perspective view of another example of a heat sink with liquid cooling according to an exemplary aspect;

[0211] Fig.25 is a top view of another example of a heat sink for use during induction welding according to an exemplary aspect;

[0212] Fig.26 According to an exemplary aspect, Fig.25 A cross-sectional view of the radiator viewed in the direction of arrows 26-26;

[0213] Fig. 27 According to the exemplary aspects Fig.25 A cross-sectional view of a variation of the heat sink shown in ;

[0214] Fig.28 is used according to exemplary aspects Fig.25 A schematic diagram of an induction welding system for a heat sink is shown;

[0215] Fig.29 is used according to exemplary aspects Fig.25 A schematic diagram of an induction welding system for a heat sink is shown;

[0216] Fig.30 is a flow chart of the aircraft production and service methodology; and

[0217] Fig.31 It is a block diagram of an aircraft. DETAILED DESCRIPTION

[0218] The following description is merely exemplary in nature and is not intended to limit the present disclosure, application, or uses.

[0219] refer to Figure 1A, a schematic diagram of a system 10 for induction welding a first thermoplastic composite (TPC) 12 to a second TPC 14 is shown. As will be described below, the system 10 may be used in the context of aircraft manufacturing and service. For example, the system 10 may be used in the manufacture of components and subassemblies for aircraft, including interior manufacturing, sound insulation panels, system integration of aircraft, fuselage manufacturing, and routine maintenance and service of aircraft. However, the system 10 may be used in a variety of other industries, including the automotive, construction, sporting goods, and general transportation industries, to name a few examples. The first TPC 12 and the second TPC 14 are shown as flat panels. However, it should be understood that the first TPC 12 and the second TPC 14 may be contoured, curved, or otherwise non-planar without departing from the scope of the present disclosure, as described below. Figure 2A as described. In addition, the first TPC 12 and the second TPC 14 may be composed of various thermoplastics reinforced with various conductive materials. In one example, the thermoplastic is selected from a group consisting of semi-crystalline thermoplastics and amorphous thermoplastics. Semi-crystalline thermoplastics may include polyphenylene sulfide (PPS), polyetheretherketone (PEEK), polyetherketoneketone (PEKK), and polyarylketone (PAEK). Amorphous thermoplastics may include polyetherimide (PEI). Relative to conventional thermoplastics, semi-crystalline thermoplastics have high consolidation temperatures and good mechanical properties. Relative to conventional thermoplastics, amorphous thermoplastics exhibit gradual softening when heated, and the material has good elongation, toughness, and impact resistance. Semi-crystalline thermoplastics contain tightly folded chain (crystal) regions that are connected together and show a distinct melting point when heated when the crystalline regions begin to dissolve. When the polymer approaches its melting point, the lattice breaks and the molecules rotate and translate freely. During slow cooling, semicrystalline thermoplastics nucleate and grow crystalline regions, which provide increased strength, stiffness, solvent resistance, and temperature stability relative to the amorphous structure. If a semicrystalline thermoplastic is cooled too quickly, it may form an amorphous structure.

[0220] In another example, the conductive material includes carbon fibers. The carbon fibers may be oriented within the thermoplastic in various configurations (not shown), which in turn affect the degree of heating during induction welding. For example, the carbon fibers may be oriented in a crosshatch pattern at 0 and 90 degrees, + / - 45 degrees, or + / - 60 degrees, to name a few examples. The carbon fibers may be unidirectional or woven together. Each such configuration affects the degree of heating in the first TPC 12 and the second TPC 14 under a given magnetic field. It should be understood that although two TPC sections are shown, any number of stacked TPC sections may be employed.

[0221] The system 10 generally includes a tool base 16, an induction welder 18, and a heat sink 20. The tool base 16 supports the first TPC 12 and the second TPC 14 thereon. In the example provided, the tool base 16 is flat. However, it should be understood that the tool base 16 can have various other shapes to support the first TPC 12 and the second TPC 14.

[0222] The induction welder 18 is configured to inductively heat the first TPC 12 and the second TPC 14, and may take various forms without departing from the scope of the present disclosure. In the example provided, the induction welder 18 includes an induction coil 22 mounted to a robotic arm 24. The induction coil 22 may also be mounted to any other suitable robotic arm 24. In another aspect, the induction coil 22 may be fixed, and the first TPC 12 and the second TPC 14 move relative to the induction coil 22. Thus, the induction coil 22 may move relative to the first TPC 12 and the second TPC 14, and the first TPC 12 and the second TPC 14 may move relative to the induction coil 22. In another example, the induction coil 22 and the first TPC 12 and the second TPC 14 are both movable. The induction coil 22 generates a magnetic field 25 to induce eddy currents in the carbon fibers of the first TPC 12 and the second TPC 14. The robotic arm 24 moves the induction coil 22 along the welding line 26 in a first direction 26A. Thus, the weld line 26 is the area where the first TPC 12 and the second TPC 14 will be welded together. The weld line 26 can be straight or curved or any other pattern. The first roller 28A and the second roller 28B are arranged near the induction coil 22. The first roller 28A is arranged on the front side 22A of the induction coil 22. The second roller 28B is arranged on the back side 22B of the induction coil 22. The first roller 28A and the second roller 28B apply consolidation pressure to the first TPC 12 and the second TPC 14 during the induction welding process, as described below. In the example provided, the first roller 28A and the second roller 28B are connected to the induction coil 22, but it should be understood that the first roller 28A and the second roller 28B can be separated without departing from the scope of the present disclosure. The first roller 28A and the second roller 28B can be hinged to allow the first roller 28A and the second roller 28B to move on the contour surface while maintaining the consolidation pressure on the first TPC 12. In addition, when the induction coil 22 moves in the first direction 26A or the opposite direction, the consolidation pressure can be applied during or after the induction welding. In addition, other methods can be used to apply the consolidation pressure, as described below with reference to Figure 1B described.

[0223] The induction welder 18 is in electrical communication with a controller 30. The controller 30 is operable to control the amount of current provided to the induction coil 22, which in turn controls the magnetic field strength and thus controls the heating of the first TPC 12 and the second TPC 14. The controller 30 is also operable to control the movement of the robot arm 24 or the induction coil 22 relative to the welding line 26. The controller 30 is a non-universal electronic control device having a pre-programmed digital computer or processor 32, a memory or non-transitory computer readable medium 34 for storing data such as control logic, software applications, instructions, computer code, data, look-up tables, etc., and an input / output port 36. The non-transitory computer readable medium 34 includes any type of medium that can be accessed by a computer, such as a read-only memory (ROM), a random access memory (RAM), a hard drive, a compact disk (CD), a digital video disk (DVD), or any other type of memory. A "non-transitory" computer readable medium does not include a wired, wireless, optical, or other communication link that transmits transient electrical or other signals. Non-transitory computer readable media include media that can permanently store data as well as media that can store data and then be overwritten, such as rewritable optical disks or erasable storage devices. Computer code includes any type of program code, including source code, object code, and executable code. Processor 32 is configured to execute code or instructions.

[0224] The system 10 may further include a plurality of sensors 38 in electronic communication with the controller 30. The sensors 38 are configured to detect or sense conditions of the first TPC 12 and / or the second TPC 14 during induction welding in order to provide real-time feedback to the controller 30. For example, the sensors 38 may be infrared temperature sensors configured to detect the temperature of the first TPC 12 and / or the second TPC 14. Alternatively, or in addition, the sensors 38 may be electromagnetic field sensors configured to detect the magnetic field 25 generated by the induction coil 22. The sensors 38 may be used by the controller 30 for feedback control of the movement of the induction coil 22, as described below.

[0225] Figure 1B An alternative arrangement of system 10 in accordance with the principles of the present disclosure is shown. Figure 1B The arrangement shown is similar to Figure 1A In the illustrated arrangement, however, the first roller 28A and the second roller 28B have been removed, and the second TPC 14 is shown as having an "L" shaped cross section. Other possible cross sections of the second TPC 14 and / or the first TPC 12 include at least a "J", "I", "T", "Z", and / or a "hat" cross section. The consolidation pressure is provided by a bellows 39 disposed below the second TPC 14 along the weld line 26. The expansion of the bellows 39 to apply the consolidation pressure to the second TPC 14 can be controlled by the controller 30.

[0226] return Figure 1A The heat sink 20 is configured to absorb and dissipate heat from the first TPC 12. As described below, the heat sink 20 is disposed between the first TPC 12 and the induction coil 22. Figure 2A Shows Figure 1A An enlarged portion of the heat sink 20. Figure 2A , the heat sink 20 includes a plurality of tiles 40 connected by joints 42. The joints 42 are disposed between the tiles 40. The tiles 40 are made of a non-conductive and heat-conductive material. Figure 1A ), the tile 40 is not heated by the magnetic field 25 but absorbs heat from the first TPC 12. In one example, the thermal diffusivity of the tile 40 is greater than about 25 mm 2 / second, preferably greater than about 70 mm 2 / sec. In this case, the term "about" is known to those skilled in the art. Alternatively, the term "about" may be understood to mean plus or minus 5 mm. 2 / second. In another example, the tile 40 has a thermal conductivity greater than about 75 W / mK, preferably greater than about 150 W / mK. In this case, the term "about" is known to those skilled in the art. Alternatively, the term "about" may be understood to mean plus or minus 10 W / mK. In another example, the tile 40 has a heat capacity greater than about 500 J / K / kg and preferably greater than about 700 J / K / kg. In this case, the term "about" is known to those skilled in the art. Alternatively, the term "about" may be understood to mean plus or minus 50 J / K / kg. In one example, the tile 40 is composed of aluminum nitride. Aluminum nitride has low residual carbon in the material matrix to ensure that during the induction welding process of the first TPC 12, the induction coil 22 does not couple with the carbon in the tile 40 and inadvertently heat the tile 40. In another example, the tile 40 is composed of beryllium oxide. In another example, the tile 40 is composed of cubic boron nitride (c-BN) or hexagonal boron nitride (h-BN).

[0227] The joints 42 flexibly hold the tiles 40 together and provide flexibility to the heat sink 20, thereby allowing the heat sink 20 to conform to the contours of the first TPC 12. For example, Figure 2B The heat sink 20 is shown on the contoured surface 43 of the first TPC 12. In the example provided, the contoured surface 43 is curved. The heat sink 20 pivots at the joint 42 to maintain contact between the tile 40 and the contoured surface 43. The joint 42 may be formed by Figure 2A and Figure 2B The flexible adhesive 45 or Figure 5A Any one of the mechanical hinges 47 shown. Figure 2A, the flexible adhesive 45 provides flexibility to the heat sink 20 and does not melt during the heating of the tile 40 during induction welding. Preferably, a minimum amount of flexible adhesive 45 is used to hold the tile 40 together, thereby increasing the heat dissipation capacity of the heat sink 20. Therefore, in one example, the long-term degradation temperature of the flexible adhesive 45 in air is greater than about 570 degrees Fahrenheit. In this case, the term "about" is known to those skilled in the art. Alternatively, the term "approximately" may be understood to mean plus or minus 25 degrees Fahrenheit. In another example, the flexible adhesive 45 has an elongation between 120% and 670%. In another example, the flexible adhesive 45 has a tensile strength between 690psi and 1035psi. In another example, the flexible adhesive 45 has a tear strength between 31lb / in and 190lb / in (tube die B). Therefore, in one example, the flexible adhesive 45 is composed of silicone. An example of a suitable silicone is 3145 RTV from Dow Corning. However, other silicones may be used.

[0228] The tiles 40 are arranged in a single layer in a parquet or geometric pattern. Thus, each tile 40 defines a gap 44 therebetween, and the joints 42 are arranged within the gaps 44. The arrangement, size, and shape of the tiles 40 are configured to facilitate contact with the contoured surface 43 ( Figure 2B ) contour. In one example, the width 49 of the gap 44 is between about 0.005 inches and about 0.1 inches, preferably about 0.040 inches. In this context, the term "about" is known to those skilled in the art. Alternatively, the term "about" may be understood to mean plus or minus 0.005 inches. Although the tile 40 is illustrated as a square, which maximizes the surface area of ​​the tile 40 relative to the joint 42, the tile 40 may have a variety of other shapes without departing from the scope of the present disclosure. For example, the tile 40 may have straight or curved edges and have three or more sides to help accommodate the contour of the first TPC 12 and / or the shape of the weld. The heat sink 20 is sized to preferably cover at least the weld line 26 ( Figure 1A ), or as in this example, the entire first TPC 12 ( Figure 1A ).

[0229] Figure 3 A method for manufacturing a heat sink 20 ( Figure 2A) of a heat sink manufacturing system 50. The heat sink manufacturing system 50 includes a substrate 52 supporting a backing material 54. In one example, the backing material 54 is a double-sided tape adhered to the substrate 52. In another example, the backing material 54 is a glass cloth tape. In yet another example, the backing material 54 is a polytetrafluoroethylene-coated glass fiber sprayed with an adhesive having a glass cloth bottom layer. In this configuration, curing occurs on both sides of the backing material 54. A frame 56 with a clamp 58 is arranged on the backing material 54. In one aspect, the clamp 58 is composed of a single wire 59 woven together. The size of the clamp 58 is adjusted to create a gap 44 ( Figure 2A ). The frame 56 and the clamps 58 may be removed from the backing material 54.

[0230] Figure 4 Shown for use Figure 3 Radiator Manufacturing System 50 Created Figure 2A Flowchart of method 60 for heat sink 20 of the present invention. Method 60 begins at frame 60A, in which the tiles 40 may be primed with a primer before being arranged on the backing material 54. In one example, the primer is a silicone primer. At frame 60B, the tiles 40 are arranged into a pattern within the fixture 58. For example, the tiles 40 are placed on the backing material 54 between the fixtures 58. The backing material 54 holds the tiles 40 in place, while the fixtures 58 separate the tiles 40. Thus, the pattern is defined by the fixtures 58. In frame 60B, once the tiles 40 are placed, the frame 56 and the fixtures 58 are removed at frame 60C, leaving gaps 44 between the tiles 40.

[0231] Next, at block 60D, the tiles 40 are flexibly joined together with the joints 42. In the example provided, the joints 42 are applied within the gaps 44 between the tiles 40. The joints 42 are then preferably cured for a period of time at block 60E. Once cured, the assembled heat sink 20 can be removed from the backing material 54 at block 60F.

[0232] Figure 5A A portion of a heat sink 20 is shown that employs an example of a mechanical hinge 47 that flexibly connects tiles 40. A first tile 40A includes tabs 65 extending from a plurality of sides 66 of the first tile 40A. The tabs 65 may be integrally formed with or bonded to the first tile 40A. An adjacent second tile 40B includes a slot 67 disposed in a plurality of sides 68 of the second tile 40B. It should be understood that, as described above, the first tile 40A and the second tile 40B may have three or more sides without departing from the scope of the present disclosure. Reference Figure 5B, the first tile 40A is connected to the second tile 40B by inserting the tab 65 into the slot 67. The tab 65 and the slot 67 are configured to allow the first tile 40A to pivot relative to the second tile 40B. For example, the first tile 40A can pivot + / -θ degrees relative to the second tile 40B. In one example, the flexible adhesive 45 ( Figure 2A ) may be disposed within the mechanical hinge 47. The tiles 40A, 40B are arranged in a single layer to form a parquet pattern. Thus, by alternately connecting a plurality of first tiles 40A to a plurality of second tiles 40B, the heat sink 20 may be manufactured to any size or shape.

[0233] return Figure 1A The system 10 may further include a vacuum bag 70. The vacuum bag 70 is connected to a vacuum source 72. The vacuum source 72 is configured to apply a vacuum to the vacuum bag 70. The vacuum source 72 is preferably controlled by the controller 30. The first TPC 12, the second TPC 14, and the heat sink 20 are all arranged in the vacuum bag 70. By removing air from the vacuum bag 70, the joint 42 ( Figure 2A ) can withstand higher temperatures before degradation than in an air / oxygen environment. Alternatively, the vacuum source 72 may be replaced by a pump (not shown) that fills the vacuum bag 70 with an inert gas such as nitrogen. The inert gas replaces the air within the vacuum bag 70 and also allows the joints 42 ( Figure 2A ) of the flexible adhesive 45 is subjected to a higher temperature before degradation than in an air / oxygen environment. The vacuum bag 70 is also configured to apply consolidation pressure to the first TPC 12 and the second TPC 14 via vacuum compression.

[0234] Figure 6 1 shows a cross section of the stack, which shows a side view of the first TPC 12, the second TPC 14, the heat sink 20 and the vacuum bag 70 and the induction coil 22 on the tool base 16. The first TPC 12 is disposed on top of the second TPC 14. Along the weld line 26 ( Figure 1A) defines a welding interface area 74. The heat sink 20 is disposed on top of the first TPC 12 between the induction coil 22 and the first TPC 12. The distance between the induction coil 22 and the first TPC 12 is "d". In one example, the distance d is about 8 mm. The thickness "t" of the heat sink 20 is less than the distance d. In one example, the thickness t is about 4 mm. In another example, the heat sink 20 is cooled before being placed on the first TPC 12. The first roller 28A and the second roller 28B apply a consolidation pressure on the first TPC 12 through the vacuum bag 70 and the heat sink 20, thereby compressing the first TPC 12 to the second TPC 14. In one example, the first roller 28A and the second roller 28B hold the induction coil 22 at a height higher than the first TPC 12.

[0235] During induction welding, the controller 30 ( Figure 1A ) commands an electric current to pass through the induction coil 22 to generate a magnetic field 25. The magnetic field 25 heats the carbon fibers within the first TPC 12 and the second TPC 14. The first TPC 12 closer to the induction coil 22 is heated to a greater extent than that closer to the weld interface area 74. However, the heat sink 20 absorbs and dissipates heat within a portion 76 of the first TPC 12. The heat generated by the induction welder 18 is concentrated at the weld interface area 74. When the thermoplastic at the weld interface area 74 is heated to above the melting point or consolidation temperature of the material, the first roller 28A and the second roller 28B apply a consolidation pressure on the first TPC 12 to merge the first TPC 12 with the second TPC 14 at the weld interface area 74, thereby producing a uniform molten bond when cooled. In one example, the weld interface area 74 is heated to about 20 degrees above the consolidation temperature. The controller 30 then commands the robot arm 24 to move the first TPC 12 along the weld line 26 ( Figure 1A ) along the first direction 26A ( Figure 1A ) to partially weld the first TPC 12 to the second TPC 14. From the sensor 38 ( Figure 1A ) can be used to command different currents to flow to the induction coil 22, thereby adjusting the heating value in real time. The heat sink 20 also allows the first TPC 12 to cool at a rate that promotes crystallization of the semi-crystalline thermoplastic in the weld interface region 74 after induction welding, thereby increasing the amount of crystallization of the semi-crystalline thermoplastic. For example, during induction welding, the heat sink 20 absorbs heat in the tile 40. After induction welding, the heat absorbed in the tile 40 that is not dissipated into the atmosphere is absorbed back into the first TPC 12, thereby allowing the first TPC 12 to cool at a specific rate that increases the amount of crystallization. For example, the optimal cooling rate for PEEK is 0.2-20℉ / min, which will produce a crystalline content of 25-35%. The crystallization rate also depends on the specific annealing temperature, with the peak rate being approximately at the glass transition temperature (Tg ) and melting temperature (T m ) is the midpoint between .

[0236] refer to Figure 7 , and continue to refer to Figure 1A and Figure 6 , a flow chart of a method 80 for induction welding a first TPC 12 to a second TPC 14 using the system 10 is shown. The method 80 begins at box 81 by aligning the first TPC 12 with the second TPC 14 to form the welding interface area 74. Next, at box 82, the heat sink 20 is placed on the first TPC 12. As described above, the heat sink 20 preferably covers the welding interface area 74 at least along the welding line 26. Because the heat sink 20 is flexible, the heat sink 20 conforms to the surface contour of the first TPC 12, whether planar or non-planar, such as Figure 2B In the example provided, the first TPC 12, the second TPC 14, and the heat sink 20 are all placed within a vacuum bag 70. A vacuum source 72 can then apply a vacuum to the vacuum bag 70. The vacuum bag 70 applies a consolidation force of up to 1 atmosphere on the first TPC 12 and the second TPC 14. Alternatively, an inert gas can be pumped into the vacuum bag 70.

[0237] At block 83, the weld interface region 74 is inductively heated by the induction coil 22. At block 84, heat generated in the portion 76 of the first TPC 12 closest to the induction coil 22 is absorbed and dissipated by the heat sink 20, thereby cooling the portion 76 of the first TPC 12. At block 85, the first roller 28A and the second roller 28B apply a consolidation pressure on the first TPC 12 to merge the first TPC 12 with the second TPC 14 at the weld interface region 74, thereby producing a uniform molten bond upon cooling. It should be understood that blocks 83, 84, and 85 may occur simultaneously. In another example, the bellows 39 ( Figure 1B ) or other device may apply consolidation pressure on the second TPC 14. At box 86, the weld interface region 74 is induction welded along the weld line 26 by moving the induction coil 22 along the weld line 26 to partially weld the first TPC 12 to the second TPC 14. Alternatively, the weld interface region 74 may be moved relative to the induction coil 22. At box 87, feedback from the sensor 38 is used to adjust the induction welding process in real time. For example, the controller 30 may command different currents to the induction coil 22 to adjust the heat in real time, command the speed between the induction coil 22 and the weld interface region 74, and so on.

[0238] Figure 8A cross section of the stack of first TPC 12, second TPC 14, heat sink 20 and vacuum bag 70 on tool base 16 is shown with a side view of induction coil 22. However, a second heat sink 78 is included. Second heat sink 78 is substantially similar to heat sink 20.

[0239] The first TPC 12 is disposed on top of the second TPC 14. The heat sink 20 is disposed on top of the first TPC 12 between the induction coil 22 and the first TPC 12. The second heat sink 78 is disposed between the tool base 16 and the second TPC 14. In addition, the second heat sink 78 is disposed within the vacuum bag 70. As described above, during induction welding, it is desirable to concentrate heat at the welding interface area 74 and minimize heat in other areas of the first TPC 12 and the second TPC 14. However, during the induction welding process, heat is generated in the first TPC 12, the welding interface area 74, and the second TPC 14. The heat sink 20 absorbs and dissipates the heat generated in the portion 76 of the first TPC 12. The second heat sink 78 absorbs and dissipates the heat generated in the portion 88 of the second TPC 14 adjacent to the second heat sink 78. Therefore, the heat is concentrated along the welding interface area 74 instead of the portion 76 of the first TPC 12 and not the portion 88 of the second TPC 14.

[0240] Fig. 9 An enlarged cross-section of the system 10 is shown, which shows another example of a stack of the first TPC 12, the second TPC 14, the heat sink 20, and the vacuum bag 70 on the tool base 16. However, the tool base 16 includes a cooler unit 89 embedded therein. Alternatively, the cooler unit 89 may be disposed on a surface of the tool base 16 (not shown). The cooler unit 89 is connected to a coolant source 90. The cooler unit 89 may include piping within the tool base 16, and the coolant source 90 may include a fluid heat exchanger and a pump (not shown). The coolant source 90 is connected to the controller 30 ( Figure 1A ) are electrically connected.

[0241] The first TPC 12 is disposed on top of the second TPC 14. The heat sink 20 is disposed on top of the first TPC 12 between the induction coil 22 and the first TPC 12. The second TPC 14 is disposed adjacent to the cooler unit 89 within the tool base 16. As described above, during induction welding, it is desirable to concentrate heat in the welding interface region 74. The cooler unit 89 acts as a heat exchanger for a portion 88 of the second TPC 14 adjacent to the cooler unit 89 and reduces heat in the second TPC 14, while the heat sink 20 absorbs and dissipates heat in the first TPC 12. Therefore, heat is concentrated along the welding interface region 74, rather than the portion 76 of the first TPC 12 and not the portion 88 of the second TPC 14.

[0242] Fig.10 A cross section of the stack of first TPC 12, second TPC 14, heat sink 20 and second heat sink 78 on tool base 16 is shown in side view of induction coil 22. Vacuum bag 70 is replaced by first plate 91 and second plate 92.

[0243] The first TPC 12 is disposed on top of the second TPC 14. The heat sink 20 is disposed on top of the first TPC 12 between the induction coil 22 and the first TPC 12. The second heat sink 78 is adjacent to the second TPC 14. The first TPC 12, the second TPC 14, the heat sink 20, and the second heat sink 78 are all sandwiched between the first plate 91 and the second plate 92. The first plate 91 and the second plate 92 provide stability for the layup by preventing the first TPC 12, the second TPC 14, the heat sink 20, and the second heat sink 78 from moving relative to each other. As described above, the first roller 28A and the second roller 28B contact the first plate 91 and provide consolidation pressure during induction welding.

[0244] Fig.11 An enlarged partial cross-section of the system 10 is shown, which shows another example of the first TPC 12, the second TPC 14 and the vacuum bag 70 on the tool base 16 without using a heat sink. However, the induction welder 18 has a cooling device 93. The cooling device 93 is arranged in a first direction 26A ( Figure 1A ) is disposed adjacent to the induction coil 22. The cooling device 93 is connected to the induction coil 22 by a member 94 so as to fix the distance between the induction coil 22 and the cooling device 93. However, it should be understood that the cooling device 93 can be separated without departing from the scope of the present disclosure. The cooling device 93 includes a plurality of nozzles 96 configured to discharge a coolant. The cooling device 93 is connected to a coolant source 98 and a controller 30. In one example, the coolant used is CO2 gas. However, other coolants can be used. As described above, a radiator is not used in this example.

[0245] During induction welding, the cooling device 93 cools the first TPC 12 before the induction coil 22 by discharging coolant onto the first TPC 12. In one example, the cooling device 93 is configured to cool the first TPC 12 to approximately -100 degrees Fahrenheit. In this context, the term "about" is known to those skilled in the art. Alternatively, the term "about" may be understood to mean plus or minus 25 degrees Fahrenheit. Cooling the first TPC 12 creates a thermal gradient and maintains the temperature of the portion 76 of the first TPC 12 below the consolidation temperature during induction welding. The thermal gradient is the temperature difference at the portion 76 of the first TPC 12 adjacent to the induction coil 22 relative to the temperature at the weld interface region 74. The thermal gradient may be determined by the number of nozzles 96, the coolant flow rate from the nozzles 96, the distance from the cooling device 93 to the induction coil 22, and the strength of the magnetic field generated by the induction coil 22, as well as the thickness and carbon fiber orientation of the first TPC 12 and the second TPC 14. Additionally, the controller 30 may determine the thermal gradient based on the temperature from the sensor 38 ( Figure 1A ) to adjust the amount of cooling and heating in real time based on the feedback received.

[0246] Fig.12 The cross section of the stack of the first TPC 12, the second TPC 14, and the vacuum bag 70 on the tool base 16 without using a heat sink is shown in a side view of the induction coil 22. However, the induction welder 18 includes a second cooling device 100 and a second induction coil 102. The second cooling device 100 and the second induction coil 102 are both disposed in the first direction 26A ( Figure 1A ) is arranged adjacent to the induction coil 22 in the opposite direction of the cooling device 93. Therefore, the second cooling device 100 and the second induction coil 102 are arranged opposite to the cooling device 93. The second cooling device 100 and the second induction coil 102 are connected to the induction coil 22 by a member 104 so as to fix the distance between the induction coil 22 and the second cooling device 100 and the second induction coil 102. However, it should be understood that the second cooling device 100 and / or the second induction coil 102 can be separated without departing from the scope of the present disclosure. The second cooling device 100 includes a plurality of nozzles 106 configured to discharge a coolant. The second cooling device 100 is connected to a coolant source 98 and a controller 30. The second induction coil 102 is similar to the induction coil 22 and is controlled by the controller 30. As described above, a radiator is not used in this example.

[0247] During induction welding, as described above, the cooling device 93 cools the first TPC 12 before the induction coil 22 by discharging coolant onto the first TPC 12. Figure 1A) moves, the induction coil 22 melts the weld interface region 74, and the first TPC 12 is merged with the second TPC 14 under the consolidation pressure from the first roller 28A and the second roller 28B. In order to control the cooling of the weld interface region 74, the controller 30 uses the second cooling device 100 and the second induction coil 102 to heat and cool the merged weld interface region 74. By the controller 30 based on the sensor 38 ( Figure 1A ) to control the cooling and heating amounts in real time to control the cooling rate at the welding interface region 74. The cooling rate can be controlled to maximize the crystallization of the thermoplastic at the welding interface region 74, thereby increasing the strength.

[0248] refer to Fig.13 , and continue to refer to Figure 1A and Fig.11 , a flow chart of a method 110 for induction welding a first TPC 12 to a second TPC 14 using a system 10 with a cooling device 93 is shown. The method 110 begins at block 112 by aligning the first TPC 12 with the second TPC 14 to form a welding interface region 74. In the example provided, the first TPC 12 and the second TPC 14 are all placed within a vacuum bag 70. A vacuum may then be applied to the vacuum bag 70 by a vacuum source 72. Alternatively, an inert gas may be pumped into the vacuum bag 70.

[0249] Next, at box 114, the first TPC 12 is cooled using the cooling device 93. In one example, the controller 30 sets a target temperature at the weld interface region 74 or the portion 76 of the first TPC 12. Then, during the cooling by the cooling device 93, the controller 30 monitors the actual temperature at the weld interface region 74 or the portion 76 of the first TPC 12 using the sensor 38. The controller 30 then controls the amount of cooling provided by the cooling device 93 to match the actual temperature with the target temperature. The target temperature can be set using a lookup table or calculated using given specific factors to achieve a specific thermal gradient. For example, setting the target temperature can determine the position of the weld interface region 74 relative to the induction coil 22, and set the target temperature based on the position of the weld interface region 74. Other factors may include the number of nozzles 96, the coolant flow rate from the nozzles 96, the distance from the cooling device 93 to the induction coil 22, the strength of the magnetic field generated by the induction coil 22, the thickness of the first TPC 12 and the second TPC 14 and the carbon fiber orientation, and the speed at which the induction coil 22 moves relative to the welding interface area 74 or the speed at which the welding interface area 74 moves relative to the induction coil 22, or both. In another example, the target temperature is set to about -100 degrees Fahrenheit. In this case, the term "about" is known to those skilled in the art. Alternatively, the term "about" may be understood to mean plus or minus 25 degrees Fahrenheit.

[0250] At block 116, the weld interface region 74 is inductively heated by the induction coil 22. The thermal gradient created by first cooling the first TPC 12 maintains the temperature of the portion 76 of the first TPC 12 closest to the induction coil 22 below the consolidation temperature while allowing the temperature of the weld interface region 74 to exceed the consolidation temperature.

[0251] In block 118, the first roller 28A and the second roller 28B apply consolidation pressure on the first TPC 12 to merge the first TPC 12 with the second TPC 14 at the weld interface region 74, thereby producing a uniform fusion upon cooling. Figure 1B ) or other device may apply consolidation pressure on the second TPC 14. At box 120, the weld interface region 74 is induction welded along the weld line 26 by moving the induction coil 22 along the weld line 26 to weld the first TPC 12 portion to the second TPC 14. Alternatively, the weld interface region 74 may be moved relative to the induction coil 22. It should be understood that boxes 116, 118, and 120 may occur simultaneously. At box 122, feedback from the sensor 38 is used to adjust the induction welding process in real time. For example, the controller 30 may command different currents to the induction coil 22 to adjust the heat in real time, command the speed between the induction coil 22 and the weld interface region 74, and so on.

[0252] refer to Fig.14 , and continue to refer to Figure 1A and Fig.12 , a flow chart of a method 130 for induction welding a first TPC 12 to a second TPC 14 using a system 10 having a cooling device 93, a second cooling device 100, and a second induction coil 102 is shown. The method 130 begins at block 132 by aligning the first TPC 12 with the second TPC 14 to form a welding interface region 74. In the example provided, the first TPC 12 and the second TPC 14 are all placed within a vacuum bag 70. A vacuum may then be applied to the vacuum bag 70 by a vacuum source 72. Alternatively, an inert gas may be pumped into the vacuum bag 70.

[0253] Next, at box 134, the first TPC 12 is cooled using the cooling device 93. In one example, a target temperature is set by the controller 30 at the welding interface region 74 or the portion 76 of the first TPC 12. Then, during the cooling by the cooling device 93, the controller 30 uses the sensor 38 to monitor the actual temperature at the welding interface region 74 or the portion 76 of the first TPC 12. The controller 30 then controls the amount of cooling provided by the cooling device 93 to match the actual temperature with the target temperature. The target temperature can be set using a lookup table or calculated using given specific factors to achieve a specific thermal gradient. For example, setting the target temperature can determine the position of the welding interface region 74 relative to the induction coil 22, and set the target temperature based on the position of the welding interface region 74. Other factors may include the number of nozzles 96, the coolant flow rate from the nozzles 96, the distance from the cooling device 93 to the induction coil 22, the strength of the magnetic field generated by the induction coil 22, and the thickness of the first TPC 12 and the second TPC 14, as well as the orientation of the carbon fiber induction coil 22 and the speed of the induction coil 22 relative to the welding interface region 74. In another example, the target temperature is set to about -100 degrees Fahrenheit. In this case, the term "about" is known to those skilled in the art. Alternatively, the term "about" may be understood to mean plus or minus 25 degrees Fahrenheit.

[0254] At block 136, the weld interface region 74 is inductively heated by the induction coil 22. The thermal gradient created by first cooling the first TPC 12 maintains the temperature of the portion 76 of the first TPC 12 closest to the induction coil 22 below the consolidation temperature while allowing the temperature of the weld interface region 74 to exceed the consolidation temperature.

[0255] At block 138, the first roller 28A and the second roller 28B apply consolidation pressure on the first TPC 12 to merge the first TPC 12 with the second TPC 14 at the weld interface region 74, thereby producing a uniform molten bond upon cooling. Figure 1B) or other devices may apply consolidation pressure on the second TPC 14. At box 140, the weld interface region 74 is induction welded along the weld line 26 by moving the induction coil 22 along the weld line 26 to weld the first TPC 12 portion to the second TPC 14. Alternatively, the weld interface region 74 may be moved relative to the induction coil 22. It should be understood that boxes 136, 138 and 140 may occur simultaneously. At box 142, feedback from the sensor 38 is used to adjust the induction welding process in real time. For example, the controller 30 may command different currents to flow to the induction coil 22 to adjust the amount of heating in real time, command the speed between the induction coil 22 and the weld interface region 74, and so on. At box 144, the second cooling device 100 and / or the second induction coil 102 are used to control the cooling rate of the weld interface region 74. By the controller 30 based on the feedback from the sensor 38 ( Figure 1A ) receives feedback to control the amount of cooling and heating in real time to control the cooling rate at the weld interface region 74.

[0256] Fig.15 A cross section of the stack of the first TPC 12, the second TPC 14, and the vacuum bag 70 on the tool base 16 with the use of the heat sink 20 is shown with a side view of the induction coil 22 and the cooling device 93. In this example, the cooling device 93 cools the heat sink 20 instead of directly cooling the first TPC 12. Cooling the heat sink 20 increases the thermal gradient and allows the heat sink 20 to remove more heat from the first TPC 12 during induction than without cooling. In another example (not shown), a second heat sink 78 may be used in addition to the heat sink 20.

[0257] Fig.16 A cross section of the stack of the first TPC 12, the second TPC 14, and the vacuum bag 70 on the tool base 16 using the heat sink 20 is shown with a side view of the cooling device 93, the second cooling device 100, and the second induction coil 102. In this example, the second cooling device 100 cools the heat sink 20 instead of cooling the first TPC 12 directly after induction welding by the induction coil 22. The second induction coil 102 operates as previously described because the heat sink 20 is not electrically conductive. In another example (not shown), a second heat sink 78 may be used in addition to the heat sink 20.

[0258] refer to Fig.17 , and continue to refer to Figure 1A and 15 , a flow chart of a method 150 of induction soldering a first TPC 12 to a second TPC 14 using a system 10 having a cooling device 93 and a heat sink 20 is shown. The method 150 begins at block 152 by aligning the first TPC 12 with the second TPC 14 to form a soldering interface region 74.

[0259] Next, at block 154, the heat sink 20 is placed on the first TPC 12. As described above, the heat sink 20 preferably covers the solder interface region 74 at least along the solder line 26. Because the heat sink 20 is flexible, the heat sink 20 conforms to the surface contour of the first TPC 12, whether planar or non-planar, such as Figure 2B In the example provided, the first TPC 12, the second TPC 14, and the heat sink 20 are all placed within a vacuum bag 70. A vacuum may then be applied to the vacuum bag 70 via a vacuum source 72. An inert gas may be pumped into the vacuum bag 70.

[0260] At box 156, the cooling device 93 is used to cool the heat sink 20. In one example, the target temperature of the heat sink 20 is set by the controller 30. Then, during the cooling of the cooling device 93, the controller 30 uses the sensor 38 to monitor the actual temperature controller of the heat sink 20. Then, the controller 30 controls the amount of cooling provided by the cooling device 93 to match the actual temperature with the target temperature. The target temperature can be set using a lookup table, or the target temperature can be calculated using given specific factors to achieve a specific thermal gradient. For example, setting the target temperature can determine the position of the welding interface area 74 relative to the induction coil 22, and set the target temperature based on the position of the welding interface area 74. Other factors may include the number of nozzles 96, the coolant flow rate from the nozzles 96, the distance from the cooling device 93 to the induction coil 22, the strength of the magnetic field generated by the induction coil 22, and the thickness and carbon fiber orientation of the first TPC 12 and the second TPC 14. In another example, the target temperature is set to about -100 degrees Fahrenheit. In this case, the term "about" is known to those skilled in the art. Alternatively, the term "about" can be understood to mean plus or minus 25 degrees Fahrenheit.

[0261] At block 158, the weld interface region 74 is inductively heated by the induction coil 22. The heat sink 20, cooled at block 156, maintains the temperature of the portion 76 of the first TPC 12 closest to the induction coil 22 below the consolidation temperature while allowing the temperature of the weld interface region 74 to exceed the consolidation temperature.

[0262] At block 160, the first roller 28A and the second roller 28B apply consolidation pressure on the first TPC 12 to merge the first TPC 12 with the second TPC 14 at the weld interface region 74, thereby producing a uniform molten bond upon cooling. Figure 1B) or other device may apply consolidation pressure on the second TPC 14. At box 162, the weld interface area 74 is inductively welded along the weld line 26 by moving the induction coil 22 along the weld line 26 to weld the first TPC 12 portion to the second TPC 14. Alternatively, the weld interface area 74 may be moved relative to the induction coil 22. It should be understood that boxes 158, 160 and 162 may occur simultaneously. At box 164, feedback from the sensor 38 is used to adjust the induction welding process in real time. For example, the controller 30 may command different currents to flow to the induction coil 22 to adjust the heat in real time, command the speed between the induction coil 22 and the weld interface area 74, etc. Reference Fig.18 , and continue to refer to Figure 1A and Fig.16 , a flow chart of a method 170 for induction welding a first TPC 12 to a second TPC 14 using a system 10 having a heat sink 20, a cooling device 93, a second cooling device 100, and a second induction coil 102 is shown. The method 170 begins at box 172 by aligning the first TPC 12 with the second TPC 14 to form a welding interface region 74.

[0263] Next, at block 174, the heat sink 20 is placed on the first TPC 12. As described above, the heat sink 20 preferably covers the solder interface region 74 at least along the solder lines 26. Because the heat sink 20 is flexible, the heat sink 20 conforms to the surface contour of the first TPC 12, whether planar or non-planar, such as Figure 2B In the example provided, the first TPC 12, the second TPC 14, and the heat sink 20 are all placed within a vacuum bag 70. A vacuum may then be applied to the vacuum bag 70 via a vacuum source 72. Alternatively, an inert gas may be pumped into the vacuum bag 70.

[0264] At box 176, the cooling device 93 is used to cool the heat sink 20. In one example, the target temperature of the heat sink 20 is set by the controller 30. Then, during the cooling of the cooling device 93, the controller 30 uses the sensor 38 to monitor the actual temperature of the heat sink 20. Then, the controller 30 controls the amount of cooling provided by the cooling device 93 to match the actual temperature with the target temperature. The target temperature can be set using a lookup table, or the target temperature can be calculated using given specific factors to achieve a specific thermal gradient. For example, setting the target temperature can determine the position of the welding interface area 74 relative to the induction coil 22, and set the target temperature based on the position of the welding interface area 74. Other factors may include the number of nozzles 96, the coolant flow rate from the nozzles 96, the distance from the cooling device 93 to the induction coil 22, the strength of the magnetic field generated by the induction coil 22, and the thickness of the first TPC 12 and the second TPC 14, the carbon fiber orientation, and the movement speed of the induction coil 22 relative to the welding interface area 74. In another example, the target temperature is set to about -100 degrees Fahrenheit. In this case, the term "about" is known to those skilled in the art. Alternatively, the term "about" may be understood to mean plus or minus 25 degrees Fahrenheit.

[0265] At 178, the weld interface region 74 is inductively heated by the induction coil 22. The heat sink 20 cooled at block 176 maintains the temperature of the portion 76 of the first TPC 12 closest to the induction coil 22 below the consolidation temperature while allowing the temperature of the weld interface region 74 to exceed the consolidation temperature.

[0266] At block 179, the first roller 28A and the second roller 28B apply consolidation pressure on the first TPC 12 to merge the first TPC 12 with the second TPC 14 at the weld interface region 74, thereby producing a uniform molten bond upon cooling. Figure 1B ) or other devices may apply consolidation pressure on the second TPC 14. At box 180, the weld interface region 74 is induction welded along the weld line 26 by moving the induction coil 22 along the weld line 26 to weld the first TPC 12 portion to the second TPC 14. Alternatively, the weld interface region 74 may be moved relative to the induction coil 22. It should be understood that boxes 178, 179 and 180 may occur simultaneously. At box 182, feedback from the sensor 38 is used to adjust the induction welding process in real time. For example, the controller 30 may command different currents to flow to the induction coil 22 to adjust the amount of heating in real time, command the speed between the induction coil 22 and the weld interface region 74, and so on. At box 184, the second cooling device 100 and / or the second induction coil 102 are used to control the cooling rate of the weld interface region 74. By the controller 30 based on the feedback from the sensor 38 ( Figure 1A) The feedback received controls the amount of cooling and heating in real time to control the cooling rate at the weld interface area 74.

[0267] Fig.19 An alternative example of a heat sink 185 according to the principles of the present disclosure is shown. The heat sink 185 is configured to absorb and dissipate heat from the first TPC 12 and / or the second TPC 14. The heat sink 185 includes a plurality of tiles 186 flexibly connected by joints 187. The joints 187 are disposed between the tiles 186. The tiles 186 are substantially similar to the tiles 40, and the joints 187 are flexibly connected to the tiles 40. Figure 2A The joints 42 of the radiator 20 shown are substantially similar. However, the radiator 185 also includes a plurality of fluid channels 188 formed therethrough. The fluid channels 188 extend through each tile 186 and through each joint 187. Multiple groups of fluid channels 188 between adjacent tiles 186 and joints 187 are connected in series to form a plurality of fluid paths 188A passing through the radiator 185. The fluid paths 188A are preferably unidirectional and parallel to each other. However, the fluid paths 188A may have other configurations, such as non-parallel or offset. In the example provided, each tile 186 includes three fluid channels 188, however, it should be understood that any number of fluid channels 188 may be used. The dimensions of the fluid channels 188 are configured to allow coolant fluid to flow therethrough, as described below. In one example, the fluid channels 188 have a diameter of approximately 0.042 inches. In another example, the fluid channels 188 have a diameter of approximately 0.082 inches. On the one hand, a manifold 189 is connected to the radiator 185. Manifold 189 includes a port 190 that communicates with fluid passage 188 via a plurality of internal passages (not shown) to provide a single connection port for radiator 185 .

[0268] Fig. 20 Shown for use Figure 3 Flow chart of a method 200 for creating a heat sink 185 using a heat sink manufacturing system 50 of the present invention. The method 200 begins at block 202 where a fluid channel 188 is formed through each tile 186. In one example, the fluid channel 188 is drilled on the tile 186 using ultrasonic machining (not shown).

[0269] At block 204, if Fig.21As shown, a plurality of rods 205 are inserted into the fluid channel 188. The rods 205 may be coated with a release material to assist in the later removal of the rods 205. The rods 205 are sized to match the diameter of the fluid channel 188. Each rod 205 passes through a plurality of tiles 186 having aligned fluid channels 188. In frame 206, the tiles 186 are arranged in a pattern. For example, the tiles 186 are placed on the backing material 54 between the fixtures 58. When the fixtures 58 space the tiles 186 apart, the backing material 54 holds the tiles 186 in place. Thus, the pattern is defined by the fixtures 58. Before being arranged on the backing material 54, the tiles 186 may be primed with a primer. Preferably, the tiles 186 are arranged so that the fluid channels 188 are aligned with each other. It should be understood that frames 204 and 206 may be performed in any order without departing from the scope of the present disclosure.

[0270] At frame 208, the frame 56 and the clamp 58 are removed, thereby leaving gaps 44 between the tiles 186. Next, at frame 210, the tiles 40 are flexibly joined together with the flexible adhesive 45. The flexible adhesive 45 is applied within the gaps 44. The rods 205 prevent the flexible adhesive 45 from entering the fluid channels 188 formed in the tiles 186. In addition, the flexible adhesive 45 flows around the rods 205 to form the fluid channels 188 through the joints 187. The flexible adhesive 45 is then preferably cured over a period of time. Once cured, the rods 205 are removed from the fluid channels 188 at frame 212. The assembled heat sink 185 can be removed from the backing material 54.

[0271] Fig. 22 An enlarged partial cross-section of the system 10 is shown showing a stack of a first TPC 12, a second TPC 14, and a heat sink 185 on a tool base 16. The first TPC 12 is disposed on top of the second TPC 14. The heat sink 185 is disposed on top of the first TPC 12 between the induction coil 22 and the first TPC 12. The first roller 28A and the second roller 28B apply a consolidation pressure on the first TPC 12 through the heat sink 185 to compress the first TPC 12 onto the second TPC 14. The fluid path 188A of the heat sink 185 is connected to a pump 220 that supplies a coolant to the heat sink 185. The pump 220 is configured to pump a coolant, such as water or a high temperature transfer fluid, through the fluid path 188A of the heat sink 185. An example of a high temperature transfer fluid is Dynalene SF from Dynalene Corporation. In one example, the pump 220 is connected to the port 190 ( Fig.19 ).

[0272] During induction welding, the controller 30 ( Figure 1A) commands current through the induction coil 22 to generate the magnetic field 25. The magnetic field 25 heats the carbon fibers within the first TPC 12 and the second TPC 14. The portion 76 of the first TPC 12 closer to the induction coil 22 is heated to a greater extent than at the weld interface region 74. The coolant is pumped through the heat sink 185 by the pump 220. The heat generated in the first TPC 12 is absorbed by the heat sink 185 and dissipated into the coolant in the fluid path 188A. The coolant is pumped out of the heat sink 185, thereby dissipating the heat in the first TPC 12.

[0273] When the thermoplastic at the weld interface region 74 is heated to above the melting point or consolidation temperature of the material, the first roller 28A and the second roller 28B apply consolidation pressure on the first TPC 12 to merge the first TPC 12 with the second TPC 14 at the weld interface region 74, thereby producing a uniform molten bond when cooled. In one example, the weld interface region 74 is heated to about 20 degrees above the consolidation temperature.

[0274] Once heated, the coolant can be pumped back through the heat sink 185 to control the cooling rate of the weld interface region 74. In one example, the coolant is circulated back through the heat sink 185 at a temperature of approximately 400 degrees Fahrenheit after induction welding to control the cooling rate of the weld interface region 74. The input temperature and flow rate of the coolant through the heat sink 185, as well as the power provided to the induction coil 22, can be adjusted to control the cooling rate of the weld interface region 74.

[0275] Then, the controller 30 commands the robot arm 24 to move along the welding line 26 ( Figure 1A ) along the first direction 26A ( Figure 1A ) to partially weld the first TPC 12 to the second TPC 14. Alternatively, the weld interface region 74 is moved relative to the induction coil 22. Figure 1A ) feedback can be used to command different currents to the induction coil 22, thereby regulating the heat in real time.

[0276] Fig.23 Another example of a heat sink 250 according to the principles of the present disclosure is shown. The heat sink 250 is similar to Fig.19 Heat sink 185 is shown. However, fluid passage 188 is disposed within joint 187. Thus, fluid passage 188 is disposed between tiles 186 rather than through tiles 186. Tiles 186 are not drilled and therefore can withstand greater compressive forces than in heat sink 185. Fluid passage 188 is able to withstand consolidation pressures during induction welding without squeezing and shearing fluid passage 188.

[0277] Fig.24Another example of a heat sink 300 according to the principles of the present disclosure is shown. Heat sink 250 is similar to Fig.19 In the illustrated heat sink 185, however, the fluid channels 188 are oval in shape. Furthermore, only one fluid channel 188 is formed in each tile 186. The oval shape of the fluid channels 188 reduces pressure drop relative to the heat sink 185 and reduces any chance of restriction within the fluid channels 188. Additionally, the oval shape of the fluid channels 188 has increased heat transfer relative to the heat sink 185 due to the greater surface area of ​​the fluid channels 188. It should be understood that other shapes, including square or star shapes, may be employed without departing from the scope of the present disclosure.

[0278] Fig.25 4 is a top view of a portion of another example of a heat sink 400 according to the principles of the present disclosure. Heat sink 400 includes a plurality of tiles 402 connected by a backing 404. Tiles 402 are made of a non-conductive and thermally conductive material and are similar to tiles 40 ( Figure 2A ), the tile 402 is hexagonal rather than square. However, it should be understood that the tile 402 can have any number of sides and shapes without departing from the scope of the present disclosure. The tile 402 is fixed in place by the backing 404.

[0279] The backing 404 holds the tiles 402 together flexibly and provides flexibility to the heat sink 400, allowing the heat sink 400 to conform to curved surfaces (not shown). The tiles 402 are arranged in a single layer in a parquet or geometric pattern. Each tile 402 defines an air gap 406 therebetween. The air gap 406 is free of material. In one example, the width 407 of the air gap 406 is between about 0.005 inches and about 0.1 inches, preferably about 0.040 inches. In this context, the term "about" is known to those skilled in the art. Alternatively, the term "about" may be understood to mean plus or minus 0.005 inches. The air gap 406 allows for increased cooling of the tile 402 using airflow, as will be described below. The backing 404 is preferably a mesh composed of interlaced fibers 408, which are spaced apart from each other in a manner similar to that of the backing 404. Fig.25 Only some of them are shown in FIG. 4. Fibers 408 are non-conductive and do not melt during induction welding. Fibers 408 may be made of glass or oxide ceramics and may be embedded in silicone or other materials. In another example, backing 404 is made of fiberglass cloth or mesh impregnated with polytetrafluoroethylene (PTFE).

[0280] In one example, the heat sink 400 includes a tube 410 disposed along a longitudinal edge 412 of the heat sink 400. In one example, the tube 410 is bonded to the backing 404. In another example, the tube 410 is made of PTFE. In addition, or alternatively, the tube 410 may not be disposed in a portion of the heat sink 400 along the longitudinal edge 412 (e.g., a transverse edge, etc.). The tube 410 is connected to a pressurized gas source 414. The pressurized gas source 414 may include a fan, a pump, or a pressurized tank. The pressurized gas source 414 transmits a gas, such as air or cold CO2, through the tube 410. The tube 410 includes a hole 416 arranged therethrough. The hole 416 is aligned with the air gap 406 between the tiles 402. During induction welding, gas is provided by the pressurized gas source 414 and communicated through the tube 410 and the hole 416. The gas then passes through the air gap 406 and absorbs and dissipates the heat of the tile 402.

[0281] Fig.26 A partial cross section of heat sink 400 is shown. Tile 402 is adhered to backing 404 by adhesive 420. Adhesive 420 does not need to be flexible because backing 404 is flexible. Examples of suitable adhesives include silicone, PTFE, polybenzimidazole (PBI), high performance polyamide (HPPA), polyamide (PI), polyamide (PAI), polyketone, polysulfone derivative-a, fluoropolymer, polyetherimide (PEI), polybutylene terephthalate (PBT), polyphenylene sulfide, syndiotactic polystyrene, and polycyclohexane dimethyl terephthalate (PCT). Another example of a suitable adhesive is an epoxy resin, heat-cured two-component system with a liquid resin and a powder hardener. For example, the adhesive can be EPOXYLITE® 5403 or EPOXYLITE® 5302 registered to Elantas PDG, Inc. In another example, adhesive 420 can be a silicone pressure sensitive adhesive. In another example, the adhesive 420 is formed at the joint 42 ( Figure 2A ) is made of the same type of silicone used in Fig. 27 A cross section of another variation of a heat sink 450 is shown, in which a tile 402 is embedded within an adhesive 420. In this example, an air gap 406 is filled with adhesive 420.

[0282] Fig.28 and Fig.29 A partial cross-section of a system 500 for induction soldering a first TPC 12 to a second TPC 14 using a heat sink 400 is shown. The system 500 is similar to the system 10 ( Figure 1A) is operated in a similar manner. In the example provided, the first TPC 12 and the second TPC 14 are curved, so that the first TPC 12 defines a curved contact surface 502. The first TPC 12 and the second TPC 14 are supported by a curved tool base 504. The bellows 506 is induction welded through the curved tool base 504. Alternatively, a pneumatic cylinder or a mechanical actuator, such as a spring, a belt, or a lever, may be used to apply the consolidation pressure.

[0283] The heat sink 400 is disposed on the first TPC 12 between the induction coil 22 and the second TPC 14. The backing 404 is curved to allow the tile 402 to contact the curved contact surface 502. The contact between the tile 402 and the curved contact surface 502 maximizes heat transfer. In another example (not shown), the backing 404 is injected with PTFE, and the backing 404 contacts the curved contact surface 502. The PTFE causes the backing 404 to act as a release film and prevents the heat sink 400 from adhering to the first TPC 12 during induction welding.

[0284] The heat sink 400 is held in place by a heat sink holder 508. Alternatively, or in addition, a vacuum bag 70 ( Figure 1A ) can be used to keep the heat sink 400 in contact with the curved contact surface 502. For example, Fig.28 As shown, air gap 510 is formed opposite to welding interface region 74 only when backing 404 is bent. In this example, air flow is not used to help cool tile 402, and the heat sink can only accommodate curved surfaces in two dimensions (ie, x and y coordinates). In another example, in Fig.29 As shown in FIG. 4 , when the backing 404 is curved, an air gap 512 is also formed near the curved contact surface 502. In this example, air flow is used through the air gaps 510, 512 to help cool the tile 402. In addition, the heat sink 400 can accommodate curved surfaces in three dimensions (i.e., x, y, and z coordinates). Induction welding is used to Figure 1A Proceed in a similar manner as described.

[0285] The above-described systems 10 and 500, heat sinks 20, 185, 250, 300, and 400, and methods 60, 80, 110, 130, 150, and 170 all operate to control the inductive heating of the first TPC 12 and the second TPC 14 to concentrate the heat along the solder interface region 74. Thus, the temperature in the portion 76 of the first TPC 12 and the portion 88 of the second TPC 14 closest to the inductive coil 22 is prevented from exceeding the consolidation temperature.

[0286] Aspects of systems 10 and 500 and methods 60, 80, 110, 130, 150, and 170 may be implemented in Fig.30Aircraft manufacturing and service method 1000 is shown and Fig.31 1002 is employed in the context of an aircraft 1002 as shown. During pre-production, exemplary method 1000 may include specification and design 1004 of the aircraft 1002 and material procurement 1006. During production, component and subassembly manufacturing 1008 and system integration 1010 of the aircraft 1002 occurs. Thereafter, the aircraft 1002 may be certified and delivered 1012 before entering service 1014. While in service with a customer, the aircraft 1002 is scheduled for routine maintenance and service 1016 (which may also include modification, reconfiguration, refurbishment, etc.). Apparatus and methods embodied herein may be employed in any one or more appropriate stages of production and service described in method 1000 (e.g., specification and design 1004 , material procurement 1006 , component and subassembly manufacturing 1008 , system integration 1010 , certification and delivery 1012 , service 1014 , maintenance and service 1016 ) and / or in any appropriate component of aircraft 1002 (e.g., airframe 1018 , systems 1020 , interior 1022 , propulsion system 1024 , electrical system 1026 , hydraulic system 1028 , environmental system 1030 ).

[0287] Each process of the systems and methods described herein may be performed or executed by a system integrator, a third party, and / or an operator (e.g., a customer). For the purpose of description, a system integrator may include, but is not limited to, any number of aircraft manufacturers and major system subcontractors; a third party may include, but is not limited to, any number of vendors, subcontractors, and suppliers; an operator may be an airline, a leasing company, a military entity, a service organization, etc.

[0288] like Fig.31 As shown, an aircraft 1002 produced by exemplary method 1000 may include a fuselage 1018 having a plurality of systems 1020 and an interior 1022. Examples of systems 1020 include one or more of a propulsion system 1024, an electrical system 1026, a hydraulic system 1028, and an environmental system 1030. Any number of other systems may be included. Although an aviation example is shown, the principles of the present disclosure may be applied to other industries, such as the automotive industry.

[0289] The systems and methods described above may be employed in any one or more stages of the exemplary method 1000. For example, while the aircraft 1002 is in service, components or subassemblies corresponding to the component and subassembly manufacturing 1008 may be fabricated or manufactured in a manner similar to components or subassemblies produced while the aircraft 1002 is in service. Moreover, one or more apparatus aspects, method aspects, or combinations thereof may be utilized in the component and subassembly manufacturing 1008 and the system integration 1010, for example, by substantially speeding up the assembly of the aircraft 1002 or reducing the cost of the aircraft 1002. Similarly, one or more apparatus aspects, method aspects, or combinations thereof may be utilized while the aircraft 1002 is in service, such as, but not limited to, maintenance and service 1016. For example, the techniques and systems described herein may be utilized in the material procurement 1006, component and subassembly manufacturing 208, system integration 1010, service 1014, and / or maintenance and service 1016, and / or may be utilized in the airframe 1018 and / or interior 1022. These techniques and systems may even be used with systems 1020 including, for example, propulsion system 1024 , electrical system 1026 , hydraulic system 1028 , and / or environmental system 1030 .

[0290] The description of the present disclosure is merely exemplary in nature, and variations that do not depart from the gist of the present disclosure are intended to be within the scope of the present disclosure. Such variations should not be regarded as a departure from the spirit and scope of the present disclosure.

Claims

1. A heat sink (20) for induction welding, the heat sink (20) comprising: A plurality of tiles (40), wherein the tiles (40) are non-conductive and have a thickness greater than 25 mm 2 / second thermal diffusivity; and A joint (42) flexibly connects the tiles (40) together, wherein The first thermoplastic composite material (12) and the second thermoplastic composite material (14) are capable of moving relative to an induction coil (22); the first thermoplastic composite material (12) and the second thermoplastic composite material (14) are aligned to form a welding interface region (74); the induction coil (22) inductively heats the welding interface region (74); and the heat sink (20) is disposed on the first thermoplastic composite material (12) and between the first thermoplastic composite material (12) and the induction coil (22).

2. The heat sink (20) according to claim 1, wherein: The tile (40) is made of aluminum nitride.

3. The heat sink (20) according to claim 1, wherein: The tile (40) is made of beryllium oxide.

4. The heat sink (20) according to claim 1, wherein: The tiles (40) are arranged in a single layer.

5. The heat sink (20) according to claim 1, wherein: The tiles (40) define gaps (44) between the tiles (40), and the joints (42) are disposed within the gaps (44).

6. The heat sink (20) according to claim 1, wherein: The joint (42) is constructed of silicone having a long term degradation temperature greater than 400 degrees Fahrenheit in a vacuum or air.

7. The heat sink (20) according to claim 6, wherein: The silicone resin has an elongation between 12% and 670%.

8. The heat sink (20) according to claim 1, wherein: The tile (40) has a thermal conductivity greater than 75 W / mK.

9. The heat sink (20) according to claim 1, wherein: The tile (40) has a heat capacity greater than 500 J / K / kg.

10. A method (60) of forming a heat sink (20), the method comprising: spacing a plurality of tiles (40) in a single layer with gaps (44) between the tiles (40), wherein the tiles (40) are electrically non-conductive and thermally conductive; and flexibly connecting the tiles (40), wherein The first thermoplastic composite material (12) and the second thermoplastic composite material (14) are capable of moving relative to an induction coil (22); the first thermoplastic composite material (12) and the second thermoplastic composite material (14) are aligned to form a welding interface region (74); the induction coil (22) inductively heats the welding interface region (74); and the heat sink (20) is disposed on the first thermoplastic composite material (12) and between the first thermoplastic composite material (12) and the induction coil (22).

11. The method according to claim 10, wherein: Flexibly engaging the tile (40) includes flexibly engaging the tile (40) using a mechanical hinge (47) disposed within the gap (44).

12. The method according to claim 10, wherein: Flexibly engaging the tiles (40) includes flexibly engaging the tiles (40) using a flexible adhesive (45) disposed within the gaps (44).

13. The method according to claim 12, wherein: Flexibly engaging the tile (40) with the flexible adhesive (45) includes injecting the flexible adhesive (45) into the gap (44).

14. The method of claim 12, further comprising curing the flexible adhesive (45).

15. The method according to claim 10, wherein: Spacing the tiles (40) includes spacing the tiles (40) on a backing material (54).

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